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bq500211A
SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
bq500211A 5-V, WPC1.1-Compliant Wireless Power Transmitter Manager
Not Recommended for New Designs
1 Features
3 Description
•
•
The bq500211A is a second generation digital
wireless power controller that integrates all functions
required to control wireless power transfer to a single
WPC compliant receiver. It is WPC1.1 compliant and
designed for 5-V systems as either a WPC type A5
transmitter with a magnetic positioning guide or as a
WPC type A11 transmitter without the magnetic
guide. The bq500211A pings the surrounding
environment for WPC compliant devices to be
powered, safely engages the device, receives packet
communication from the powered device and
manages the power transfer. To maximize flexibility in
wireless power applications, Dynamic Power
Limiting™ (DPL) is featured on the bq500211A. DPL
enhances user experience by seamlessly optimizing
the usage of power available from limited input
supplies. The bq500211A supports both Foreign
Object Detection (FOD) and Parasitic Metal Object
Detection (PMOD) by continuously monitoring the
efficiency of the established power transfer,
protecting from power lost due to metal objects
misplaced in the wireless power transfer bath. Should
any abnormal condition develop during power
transfer, the bq500211A handles it and provides
indicator outputs. Comprehensive status and fault
monitoring features enable a robust system design.
1
•
•
•
•
•
Intelligent Control of Wireless Power Transfer
5-V Operation Conforms to Wireless Power
Consortium (WPC) Type A5 and Type A11
Transmitter Specifications
WPC1.1 Compliant, Including Foreign Object
Detection (FOD)
Enhanced Parasitic Metal Detection (PMOD)
Assures Safety
Dynamic Power Limiting™ for USB and Limited
Source Operation
Digital Demodulation Reduces Components
LED Indication of Charging State and Fault Status
2 Applications
•
•
WPC 1.1 Compliant Wireless Chargers For:
– Qi-Certified Smart Phones and other
Handhelds
– Hermetically Sealed Devices and Tools
– Cars and Other Vehicles
– Tabletop Charge Surfaces
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging Solutions
The bq500211A is available in a 48-pin, 7 mm x 7
mm QFN package and operates over a temperature
range from –40°C to 110°C.
Device Information(1)
PART NUMBER
bq500211A
PACKAGE
VQFN (48)
BODY SIZE (NOM)
7.00 mm × 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Diagram
Transmitter
Efficiency vs System Output Power
Receiver
80
Power
Power
Stage
Rectification
Voltage
Conditioning
Communication
BQ500211 A
Controller
Feedback
bq51013
70
Load
60
Efficiency (%)
AC-DC
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0 2.5 3.0 3.5
Output Power (W)
4.0
4.5
5.0
G000
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Not Recommended for New Designs
bq500211A
SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
5
5
5
6
7
Absolute Maximum Ratings ......................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics Curves .................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
8
Application and Implementation ........................ 16
9
Layout ................................................................... 21
8.1 Typical Application ................................................. 16
9.1 Layout Guidelines ................................................... 21
10 Device and Documentation Support ................. 22
10.1
10.2
10.3
10.4
10.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
22
22
11 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
Changes from Revision A (September 2013) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
•
Device status is now NRND. ................................................................................................................................................. 1
Changes from Original (December 2012) to Revision A
Page
•
Changed pinout diagram, pin names FOD and PMOD pin SWAP. ....................................................................................... 3
•
Changed bq500211A Typical Low-Cost Application Diagram, VSENSE is pulled to GND...................................................... 20
2
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SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
5 Pin Configuration and Functions
COMM_A+
COMM_B-
I_SENSE
AIN7
GND
37
36
V_SENSE
48 47 46 45 44 43 42 41 40 39 38
REFIN
COMM_A-
COMM_B+
RESERVED
RESERVED
LED_MODE
RGZ Package
48-Pin VQFN
Top View
GND
AIN5
1
T_SENSE
2
35
BPCAP
AIN3
3
34
V33A
LoPWR
4
33
V33D
RESET
5
32
GND
SLEEP
6
31
RESERVED
bq500211A
MSP_RST/LED_A
7
30
RESERVED
MSP_MISO/LED_B
8
29
RESERVED
MSP_TEST
9
28
RESERVED
PMB_CLK
10
27
RESERVED
PMB_DATA
11
26
MSP_TDO/PROG
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
DOUT_TX
DOUT_RX
PMB_CTRL
PMB_CTRL
MSP_CLK
FOD
PMOD
DOUT_2B
DPWM_B
MSP_SYNC
25
12
13 14 15 16 17 18 19 20 21 22 23 24
DPWM_A
Pin Functions
PIN
NAME
AIN3
AIN5
NO.
3
1
I/O
DESCRIPTION
I
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding.
I
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding.
45
I
BPCAP
35
—
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.
BUZ_AC
23
O
AC Buzzer Output. Outputs a 400-ms, 4-kHz AC pulse when charging begins.
O
DC Buzzer Output. Outputs a 400-ms DC pulse when charging begins. This could also be
connected to an LED via 470-Ω resistor.
AIN7
BUZ_DC
24
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding.
COMM_A+
37
I
Digital demodulation non-inverting input A, connect parallel to input B+.
COMM_A-
38
I
Digital demodulation inverting input A, connect parallel to input B-.
COMM_B+
39
I
Digital demodulation non-inverting input B, connect parallel to input A+.
COMM_B-
40
I
Digital demodulation inverting input B, connect parallel to input A-.
DOUT_RX
22
I
Leave this pin open.
DOUT_TX
21
I
Leave this pin open.
DOUT_2B
15
O
Optional Logic Output 2B. Leave this pin open.
O
PWM Output A, controls one half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
DPWM_A
12
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Pin Functions (continued)
PIN
NAME
DPWM_B
EPAD
NO.
13
49
17
FOD
I/O
DESCRIPTION
O
PWM Output B, controls other half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
-
Flood with copper GND plane and stitch vias to PCB internal GND plane.
O
FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
controls the FOD threshold resistor read at startup.
GND
32
—
GND.
GND
36
—
GND.
GND
47
—
GND.
42
I
Transmitter input current, used for efficiency calculations. Use 20-mΩ sense resistor and
A=50 gain current sense amplifier.
44
I
Input to select from 4 LED modes.
I
Dynamic Power Limiting™ (DPL) control pin. To set power mode to 500 mA, pull to GND.
For full-power operation pull to 3.3-V supply.
I
Input to program foreign and parasitic metal object detection threshold
I_SENSE
LED_MODE
LoPWR
LOSS_THR
MSP_CLK
MSP_MISO/LED_B
MSP_RST/LED_A
4
43
18
8
7
I/O
Used for boot loading the MSP430 low power supervisor. If MSP430 is not used, leave this
pin floating.
I
MSP – TMS, SPI-MISO, LED-B -- If external MSP430 is not used, connect to an LED via
470-Ω resistor for status indication.
I
MSP – Reset, LED-A -- If external MSP430 is not used, connect to an LED via 470-Ω
resistor for status indication.
MSP_SYNC
14
O
MSP SPI_SYNC, if external MSP430 is not used, leave this pin open.
MSP_TDO/PROG
26
I/O
MSP-TDO, MSP430 programmed indication.
MSP_TEST
9
I
MSP_MOSI/LPWR_EN
25
I/O
Low standby power supervisor enable. If low power is not needed, connect this to GND.
O
PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
controls the PMOD threshold resistor read at startup.
16
PMOD
MSP – Test, If external MSP430 is not used, leave this pin open.
PMB_CLK
10
I/O
10-kΩ pull-up resistor to 3.3-V supply.
PMB_DATA
11
I/O
10-kΩ pull-up resistor to 3.3-V supply.
RESERVED
19
O
Reserved, leave this pin open.
RESERVED
20
I
Reserved, connect to GND.
RESERVED
48
I
External Reference Voltage Input. Connect this input to GND.
RESERVED
27
I/O
Reserved, leave this pin open.
RESERVED
28
I/O
Reserved, leave this pin open.
RESERVED
29
I/O
Reserved, leave this pin open.
RESERVED
30
I/O
Reserved, leave this pin open.
RESERVED
31
I/O
Reserved, connect 10-kΩ pull-down resistor to GND.
RESERVED
41
O
Reserved, leave this pin open.
RESET
5
I
Device reset. Use a 10-kΩ to 100-kΩ pull-up resistor to the 3.3-V supply.
SLEEP
6
O
Low-power mode output. Starts low-power ping cycle.
I
Sensor Input. Device shuts down when below 1 V. If not used, keep above 1 V by
connecting to the 3.3-V supply.
T_SENSE
V_SENSE
V33A
V33D
4
2
46
I
Transmitter input voltage, used for efficiency calculations. Use 76.8-kΩ to 10-kΩ divider to
minimize quiescent current.
34
—
Analog 3.3-V Supply. This pin can be derived from V33D supply, decouple with 10-Ω resistor
and additional bypass capacitors
33
—
Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
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SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
Voltage applied at V33D to GND
–0.3
3.6
Voltage applied at V33A to GND
–0.3
3.6
–0.3
3.6
–40
150
Voltage applied to any pin
(2)
Storage temperature,TSTG
(1)
(2)
UNIT
V
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX
V
Supply voltage during operation, V33D, V33A
3.0
TA
Operating free-air temperature range
–40
TJ
Junction temperature
3.3
UNIT
3.6
110
110
V
°C
6.3 Thermal Information
bq500211A
THERMAL METRIC (1)
RGZ (VQFN)
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
28.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
14.2
°C/W
RθJB
Junction-to-board thermal resistance
5.4
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
5.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.4 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V33A = 3.3 V
8
15
V33D = 3.3 V
44
55
V33D = V33A = 3.3 V
52
60
3.3
3.6
4
4.6
UNIT
SUPPLY CURRENT
IV33A
IV33D
Supply current
ITOTAL
mA
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
V33FB
3.3-V linear regulator feedback
IV33FB
Series pass base drive
Beta
Series NPN pass device
Emitter of NPN transistor
3.25
VIN = 12 V; current into V33FB pin
10
V
mA
40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V33Slew
V33 slew rate
V33 slew rate between 2.3 V and 2.9 V,
V33A = V33D
0.25
V
V/ms
DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_BVCM
Common mode voltage each pin
COMM+,
COMM-
–0.15
Modulation voltage digital resolution
REA
Input impedance
Ground reference
0.5
IOFFSET
Input offset current
1-kΩ source impedance
–5
1.631
1
1.5
V
mV
3
MΩ
5
µA
0.36
V
ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE
VADDR_OPEN
Voltage indicating open pin
LED_MODE open
VADDR_SHORT
Voltage indicating pin shorted to GND
LED_MODE shorted to ground
VADC_RANGE
Measurement range for voltage monitoring
ALL ANALOG INPUTS
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3 V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
2.37
0
–2.5
2.5
2.5
100
8
mV
nA
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS
DGND1
+ 0.25
VOL
Low-level output voltage
IOL = 6 mA , V33D = 3 V
VOH
High-level output voltage
IOH = -6 mA , V33D = 3 V
VIH
High-level input voltage
V33D = 3V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high source current
4
IOL(MAX)
Output low sink current
4
V33D
– 0.6V
2.1
V
3.6
1.4
mA
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D Pin
tRESET
Pulse width needed for reset
RESET pin
fSW
Switching Frequency
tdetect
Time to detect presence of device requesting
power
tretention
Retention of configuration parameters
6
2.3
112
TJ = 25°C
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2.4
2
100
V
µs
205
kHz
0.5
s
Years
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SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
6.5 Typical Characteristics Curves
60
80
70
60
40
Efficiency (%)
Supply Current (mA)
50
30
20
50
40
30
20
10
0
1.7
CSD17308Q2
CSD16301Q2
10
1.9
2.1
2.3
2.5
2.7
Input Voltage (V)
2.9
3.1
3.3
0
0
G000
Figure 1. bq500211A Supply Current vs. VCC Voltage
0.1
0.2
0.3
0.4 0.5 0.6 0.7
Output Current (A)
0.8
0.9
1
G000
Figure 2. System Efficiency Using Alternate MOSFETs
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7 Detailed Description
7.1 Overview
7.1.1 Fundamentals
The principle of wireless power transfer is simply an open cored transformer consisting of primary and secondary
coils and associated electronics. The primary coil and electronics are also referred to as the transmitter, and the
secondary side the receiver. The transmitter coil and electronics are typically built into a charger pad. The
receiver coil and electronics are typically built into a portable device, such as a cell-phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage, current flows, it is rectified and power
can be transferred quite effectively to a load - wirelessly. Power transfer can be managed via any of various
familiar closed-loop control schemes.
7.1.2 Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, go to www.wirelesspowerconsortium.com.
7.1.3 Power Transfer
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils, the better the coupling, but the practical distance is set to be less than 5
mm (as defined within the WPC Specification) to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. For WPC compatibility, the
transmitter coils and capacitance are specified and the resonant frequency point is fixed at 100 kHz. Power
transfer is regulated by changing the operating frequency between 112 kHz to 205 kHz. The higher the
frequency, the further from resonance and the lower the power. Duty cycle remains constant at 50% throughout
the power band and is reduced only once 205 kHz is reached.
The WPC standard describes the dimension and materials of the coils. It also has information on tuning the coils
to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
7.1.4 Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter side
electronics and the frequency of its coil drive output is adjusted to close the regulation loop. The bq500211A
features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 3 shows the
resistive modulation approach, where a resistor is periodically added to the load and also shows the resulting
change in resonant curve which causes the amplitude change in the transmitter voltage indicated by the two
operating points at the same frequency. Figure 4 shows the capacitive modulation approach, where a capacitor
is periodically added to the load and also shows the resulting amplitude change in the transmitter voltage.
8
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Overview (continued)
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Comm
Fsw
a)
F, kHz
b)
Figure 3. Receiver Resistive Modulation Circuit
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Comm
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 4. Receiver Capacitive Modulation Circuit
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7.2 Functional Block Diagram
bq500211 A
LED Control /
Low Power
Supervisor
Interface
COMM_A+ 37
COMM_A- 38
MSP430_RST/LED_A
8
MSP430_MISO/LED_B
9
MSP430_TEST
14 MSP430_SYNC
18 MSP430_CLK
Digital
Demodulation
COMM_B+ 39
7
25 MSP430_MOSI/LPWR _EN
26 MSP430_TDO /PROG
COMM_B- 40
12 DPWM-A
Controller
PWM
13 DPWM-B
V_Sense 46
I_Sense 42
T_Sense
2
LoPWR
4
12-bit
ADC
23 BUZ_AC
Buzzer
Control
24 BUZ_DC
Low
Power
Control
LED_MODE 44
11 PMB_DATA
I2C
10 PMB_CLK
TEMP_INT
6
5
SLEEP RESET
7.3 Feature Description
7.3.1 Dynamic Power Limiting™
Dynamic Power Limiting™ (DPL) allows operation from a 5-V supply with limited current capability (such as a
USB port). There are two modes of operation selected via an input pin. In the dynamic mode, when the input
voltage is observed drooping, the output power is limited to reduce the load and provides margin relative to the
supply’s capability. The second mode, or constant current mode, is designed specifically for operation from a
500-mA capable USB port, it restricts the output such that the input current remains below the 500-mA limit.
NOTE
Pin 4 must always be terminated, else erratic behavior may result.
Anytime the DPL control loop is regulating the operating point of the transmitter, the LED will indicate that DPL is
active. The LED color and flashing pattern are determined by the LED Table. If the receiver sends a Control
Error Packet (CEP) with a negative value, (for example, to reduce power to the load), the WPTX in DPL mode
will respond to this CEP via the normal WPC control loop.
NOTE
Depending on LED_MODE selected, the power limit indication may be either solid amber
(green + red) or solid red.
10
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Feature Description (continued)
7.3.2 Option Select Pin
Two pins (pin 43 and pin 44) on the bq500211A are allocated to program the Loss Threshold and the LED mode
of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting
voltage measured in order to identify the value of the attached programming resistor. The values of the operating
parameters set by these pins are determined using Table 2. For LED_MODE, the selected bin determines the
LED behavior based on Table 1; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal
object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section). Table 1.
bq500411 A
LED_MODE
Resistors
to set
options
44
LOSS_THR 43
To 12-bit ADC
Figure 5. Option Select Pin Programming
7.3.3 LED Indication Modes
The bq500211A can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor
(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune
or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.
The resistor in Figure 5 connected to pin 44 and GND selects the desired LED indication scheme in Table 1.
Table 1. LED Modes
Operational States
LED
CONTROL
OPTION
LED
SELECTION
RESISTOR
X
< 36.5 kΩ
DESCRIPTION
STANDBY
POWER
TRANSFER
CHARGE
COMPLETE
FAULT
DYNAMIC
POWER
LIMITING™
-
-
-
-
-
LED1, green
Off
Blink slow
On
Off
Blink slow
LED2, red
Off
Off
Off
On
Blink slow
LED1, green
On
Blink slow
On
Off
Blink slow
LED2, red
On
Off
Off
On
Blink slow
LED1, green
Off
Off
On
Off
Off
LED2, red
Off
On
Off
Blink slow
On
LED1, green
Off
On
Off
Off
Off
LED2, red
Off
Off
Off
On
Blink slow
-
-
-
-
-
-
LED
LED1, green
Reserved, do not use
LED2, red
1
2
3
4
42.2 kΩ
48.7 kΩ
56.2 kΩ
64.9 kΩ
> 75 kΩ
Choice number 1
Choice number 2
Choice number 3
Choice number 4
Reserved, all LED off
7.3.4 Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
The bq500211A is WPC1.1 compliant and supports both enhanced PMOD and the new FOD features by
continuously monitoring the input voltage and current to calculate input power. Combining input power, known
losses, and the value of power reported by the RX device being charged, the bq500211A can estimate how
much power is unaccounted for and presumed lost due to metal objects placed in the wireless power transfer
path. If this unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power
transfer is halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the
receiver being charged.
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Feature Description (continued)
PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0
Specification. The user has the flexibility to adjust the LOSS_THR resistor to suit the application. Should issues
with compliance or interoperability arise, the PMOD feature can be selectively disabled as explained below.
The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore
more accurate. Where the WPC1.0 specification merely requires the Rectified Power packet, the WPC1.1
specification additionally uses the Received Power packet which more accurately tracks power used by the
receiver.
As the default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting
point is 400 mW (selected by a 56.2-kΩ resistor on the LOSS_THR option pin 43). That value has been
empirically determined using standard WPC disc, ring and foil FOD test objects. Some tuning might be required
in the final system as every system will be different. This tuning is best done by trial and error, use the set
resistor values given in the table to increase or decrease the loss threshold and retry the system with the
standard test objects. The ultimate goal of the FOD feature is safety, to protect misplaced metal objects from
becoming hot. Reducing the loss threshold and making the system too sensitive will lead to false trips and a bad
user experience. Find the balance which best suits the application.
If the application requires disabling one or the other or setting separate PMOD and FOD thresholds, a setting
resistor of appropriate value can be connected directly from the LOSS_THR (pin43) to the FOD (pin16) or PMOD
(pin17) pins, as needed. These pins are then read at power up and the correct respective values are set. To
selectively disable PMOD, for example, only the chosen FOD resistor value would be connected between
LOSS_THR (pin43) and FOD (pin 16) and PMOD (pin17) would left open.
Resistors of 1% tolerance must be used for proper detection of the desired bin.
Table 2. Option Select Bins
BIN NUMBER
RESISTANCE (kΩ)
LOSS THRESHOLD
(mW)
0
237
Feature Disabled
7.3.5 Shut Down via External Thermal Sensor or Trigger
Typical applications of the bq500211A will not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not only limited to thermal shutdown. The key parameter is the 1.0 V
threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shutdown.
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500211A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To implement this feature follow these steps:
1) Consult the NTC datasheet and find the resistence vs temperature curve.
12
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2) Determine the actual temperature where the NTC will be placed by using a thermal probe.
3) Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
4) Use the following formula to determine the upper leg resistor (R_Setpoint):
R _ Setpoint = 2.3 ´ R _ NTC
(1)
The system will restore normal operation after approximately five minutes or if the receiver is removed. If the
feature is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
3V3_VCC
Optional
Temperature
Sensor
R_Setpoint
T_SENSE
NTC
2
AGND
AGND
Figure 6. Negative Temperature Coefficient (NTC) Application
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7.3.6 Fault Handling and Indication
The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long
the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the
condition or fault.
Table 3. Fault Handling and Indication
CONDITION
DURATION
(before retry)
EPT-00
Immediate
Unknown
EPT-01
5 seconds
Charge complete
EPT-02
Infinite
Internal fault
EPT-03
5 minutes
Over temperature
EPT-04
Immediate
Over voltage
EPT-05
Immediate
Over current
EPT-06
Infinite
Battery failure
EPT-07
Not applicable
Reconfiguration
EPT-08
Immediate
No response
OVP (over voltage)
Immediate
OC (over current)
1 minute
NTC (external sensor)
5 minutes
PMOD/FOD warning
12 seconds
PMOD/FOD
5 minutes
HANDLING
10 seconds LED only,
2 seconds LED +
buzzer
7.3.7 Power Transfer Start Signal
The bq500211A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. If not used, these pins can be left open.
7.3.8 Power-On Reset
The bq500211A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
7.3.9 External Reset, RESET Pin
The bq500211A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
7.3.10 Trickle Charge and CS100
The WPC specification provides an End-of-Power Transfer message (EPT–01) to indicate charge complete.
Upon receipt of the charge complete message, the bq500211A will change the LED indication to solid green LED
output and halt power transfer for 5 seconds.
In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode
to top off the battery. There are several information packets in the WPC specification related to the levels of
battery charge (Charge Status). The bq500211A uses these commands to enable top-off charging. The
bq500211A changes the LED indication to reflect charge complete when a Charge Status message is 100%
received, but unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The
mobile device can use a CS100 packet to enable trickle charge mode.
If the reported charge status drops below 90% normal, charging indication will be resumed.
14
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7.3.11 Current Monitoring Requirements
The bq500211A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be
provided in the design.
Current monitoring is optional however, it is used for the foreign metal protection features and over current
protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant.
Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This
would enable a forward migration path to future WPC1.1 compatibility.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current
shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature
stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed.
7.3.12 Overcurrent Protection
The bq500211A has an integrated current protection feature which monitors the input current reported by the
current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power
transfer is halted for one minute.
If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE
input pin to the bq500410A (pin 42) should be grounded.
NOTE
Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor
circuit or by connecting to ground.
7.3.13 MSP430G2001 Low Power Supervisor
This is an optional low-power feature. By adding the MSP430G2001, the entire bq500211A is periodically shut
down to conserve power, yet all relevant states are recalled and all running LED status indicators remain on.
7.3.13.1 MSP430 Low Power Supervisor Details
Since the bq500211A needs an external low-power mode to significantly reduce power consumption, one way of
positively achieving that goal is to remove its supply and completely shut it down. In doing so, however, the
bq500211A goes through a reset and any data in memory would be lost. Important information regarding charge
state, fault condition and operating mode would be cleared. The MSP430G2001 maintains the LED indication
and stores previous charge state during the bq500211A reset period.
The LEDs indicators are now driven by the MSP430G2001, do not exceed the pin output current drive limit.
Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected
making it possible to achieve Energy Star rating.
The user does not need to program the MSP430G2001, an off-the-shelf part and any of the available packages
can be used as long as the connections are correct. The required MSP430G2001 firmware is embedded in the
bq500211A and is boot loaded at first power up, similar to a field update. The MSP430G2001 code cannot be
modified by the user.
NOTE
The user cannot program the MSP430G2001 in this system.
7.3.14 All Unused Pins
All unused pins can be left open unless otherwise indicated. Pins 1, 3, 45 can be tied to GND and flooded with
copper to improve ground shielding. Please refer to the pin definition table for further explanations.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Typical Application
The application schematic for the transmitter with reduced standby power is shown in Figure 7.
CAUTION
Please check the bq500211A product page for the most up-to-date application
schematic and list of materials package before starting a new design.
16
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Product Folder Links: bq500211A
R11
10K
R10
76k8
VIN
AGND
C4
4.7nF
50V
AGND
C24
4.7nF
50V
IN
R37
10K0
3V3_VCC
5 Vin
D1
500mA
Full
COMM+
COMM-
MSP_CLK
MSP_RST
MSP_MISO
MSP_TEST
I_SENSE
DPL
3V3_VCC
R25
10K
3V3_VCC
AGND
R4
470R
BLUE_LED
AGND
C6
4.7uF
10V
R15
10.0k
R26
37
38
39
40
18
21
22
6
7
8
9
46
45
42
4
3
2
1
5
41
48
C1
1.0uF
16V
3V3_VCC
U1
AGND
COMM_A+
COMM_ACOMM_B+
COMM_B-
MSP_CLK
DOUT_TX
DOUT_RX
SLEEP
MSP_RST/LED_A
MSP_MISO/LED_B
MSP_TEST
V_SENSE
AD_7
I_SENSE
LOPWR
AD_3
T_SENSE
AD_5
RESET
EN
C3
1.0uF
16V
C5
4.7uF
10V
DPWM_A
DPWM_B
MSP_SYNC
DOUT_2B
FOD
PMOD
RESERVED
RESERVED
PMB_DATA
PMB_CLK
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
3V3_ADC
LED_MODE
LOSS_THR
GND
VIN
4
UGATE 1
LGATE
R23
42K2
AGND
MSP_RDY
MSP_MOSI
R20
10K0
R35 10R
MSP_SYNC
5
AGND
3V3_ADC
R13
10R
AGND
AGND
R31
10K0
COMM-
COMM+
R34
0R
R3
10R
AGND
C28
4.7uF
10V
0.1uF
50V
DPWM-1B
R33
10K0
C29
AGND
C7
4.7uF
10V
R36
10K0
R32
10K0
3V3_VCC
TPS28225D
GND
R8
10K0
C20
1.0uF
16V
GND
VDD
R9
10R
PWM
BOOT 2
7 EN/PG U6
PH 8
3
6
AGND
C2
4.7uF
10V
3V3_VCC
AGND AGND
R40
44
43
26
25
24
23
12
13
14
15
16
17
20
19
11
10
35
31
30
29
28
27
AGND
C9
0.1uF
50V
NC
OUT
MSP_TDO/PROG
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
GND
U5
TLV71333
DPWM-1A
GND-TIE
C22
4.7uF
C43
4.7uF
10V
AGND
RESERVED
RESERVED
AGND
Q6
BSS138
523K
IN
GND
Optional Temp Sensor
NTC
GND
GND
47
DC Jack or USB
33
GND
36
VIN
34
V33A
V33D
EPAD
49
Product Folder Links: bq500211A
32
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R19
10R
R29
10R
DPWM-1A
GND
Q2
Q1
R7
20m
AGND
R5
10K
R6
100K
C18
4.7nF
50V
COIL
GND
AGND
C14
33pF
50V
12K1
R14
3V3_VCC
C11
100nF
C10
100nF
C19
100nF
C16
100nF
C27
22uF
25V
GND
C25
22uF
25V
GND
AGND
D3
BAT54SW
Q4
Q3
C26
0.1uF
50V
4 +
3
2
U7
AGND
5 -
6
AGND
INA199A1
1
C8
0.01uF
50V
C30
0.1uF
50V
R22
1K0
I_SENSE
MSP_RDY
MSP_MOSI
MSP_CLK
MSP_MISO
MSP_TEST
MSP_SYNC
AGND
C23
0.1uF
50V
VIN
R2
0R
R1
10R
50V
0.1uF
R24
R38
EN
U2
10K0
10K0
NC
OUT
3
6
GND
D5
GND
VIN
C13
0.1uF
50V
DPWM-1B
AGND
R27
470R
1
2
3
4
5
6
7
MSP430G2001
9
P1.7
8
P1.6
14
P1.4
P1.5
50V
GND
13
XIN
12
XOUT
11
TEST
10
RST
U4
4.7uF
10V
0.01uF
VCC
P1.0
P1.1
P1.2
P1.3
C12
C17
AGND
R12
10K0
AGND
AGND
R16
47K0
Low Power Supervisor
GND
R28
470R
R18
10K0
4
EN/PG 7
PWM
VDD
TPS28225D
LGATE
U3
5
8 PH
2 BOOT
TLV71333
GND
IN
C15
1 UGATE
Current Sensing is Optional but Provides Roadmap to WPC1.1
1R R21
3V3_VCC
G
C21
1.0nF
16V
Q7
BSS138
MSP_RST
3V3_VCC
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BUZ
R17
1R
R
VIN
Not Recommended for New Designs
SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
bq500211A
Typical Application (continued)
Figure 7. bq500211A Typical Low-Standby Power Application Diagram
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Typical Application (continued)
8.1.1 Detailed Design Procedure
8.1.1.1 Coils and Matching Capacitors
The coil and matching capacitor selection for the transmitter has been established by WPC standard. This is
fixed and cannot be changed on the transmitter side.
An up to date list of available and compatible A5 and A11 transmitter coils can be found here (SLUA649):
Capacitor selection is critical to proper system operation. A total capacitance value of 400 nF is required in the
resonant tank. This is the WPC system compatibility requirement, not a guideline, and must be followed.
NOTE
A total capacitance value of 400 nF/50 V (C0G dielectric type or equivalent) is required in
the resonant tank to achieve a 100-kHz resonance frequency.
The capacitors chosen must be rated for at least 50 V and must be of high quality C0G dielectric or equivalent.
These are typically available in a 5% tolerance. The use of X7R types or below is not recommended if WPC
compliance is required because critical WPC certification testing, such as the minimum modulation requirement,
might fail.
A 400-nF capacitor is not a standard value and therefore several must be combined in parallel. The designer can
combine a (4 nF x 100 nF) or a (180 nF + 220 nF) along with other combinations depending on market
availability. All capacitors must be of high quality C0G type or equivalent and not mixed with lesser dielectric
types.
8.1.1.2 Input Regulator
The bq500211A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down
from the 5-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with
respect to cost or efficiency.
For highest efficiency use a low-cost buck regulator, TPS62237, which on account of a 3-MHz switching
frequency, can use a 0805 size chip inductor. This results in a very attractive combination, high performance,
small size, ease of use and low cost.
8.1.1.3 Power Train
The bq500211A drives a phase-shifted full bridge. This is essentially twin half bridges and the choice of driver
devices is quite simple, a pair of TPS28225 synchronous MOSFET drivers are used with four CSD17308Q2
NexFETs. Other combinations work and system performance with regards to efficiency and EMI emissions vary.
Any alternate MOSFETs chosen must be fully saturated at 5-V gate drive and be sure to pay attention whether or
not to use gate resistors; some tuning might be required.
8.1.1.4 Low Power Supervisor
Power reduction is achieved by periodically disabling the bq500211A while LED and housekeeping control
functions are continued by U4 – the low-cost, low quiescent current microcontroller MSP430G2001. When U4 is
present in the circuit (which is set by a pull-up resistor on bq500211A pin 25), the bq500211A at first power-up
boots the MSP430G2001 with the necessary firmware and the two chips operate in tandem. During standby
operation, the bq500211A periodically issues a SLEEP command, Q12 pulls the RESET pin low, therefore
reducing its power consumption. Meanwhile, the MSP430G2001 maintains the LED indication and stores
previous charge state during this bq500211A reset period. This bq500211A reset period is set by the RC time
constant network of R26, C22 (see Figure 7). WPC compliance mandates receive detection within 500 ms, the
power transmitter controller, bq500211A, awakes every 400 ms to produce an analog ping and check if a valid
device is present. Increasing this time constant, therefore is not advised; shortening could result in faster
detection time with some decrease in efficiency.
18
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Typical Application (continued)
8.1.1.5 Disabling Low Power Supervisor Mode
For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for the application
schematic.
NOTE
Current sense shunt and amplifier circuitry are optional. The circuitry is needed to enable
Foreign Object Detection (FOD) and a forward migration path to WPC1.1 compliance.
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19
3V3_VCC
R25
10K
3V3_VCC
5 Vin
IN
COMM+
COMM-
3.3V
AGND
37
38
39
40
18
21
22
6
7
8
9
46
45
42
4
3
2
1
5
C1
1.0uF
16V
3V3_VCC
U1
AGND
COMM_A+
COMM_ACOMM_B+
COMM_B-
MSP_CLK
DOUT_TX
DOUT_RX
SLEEP
MSP_RST/LED_A
MSP_MISO/LED_B
MSP_TEST
V_SENSE
AD_7
I_SENSE
LOPWR
AD_3
T_SENSE
AD_5
RESET
RESERVED
RESERVED
AGND
41
48
C43
4.7uF
10V
AGND
GND-TIE
C3
1.0uF
16V
DPWM_A
DPWM_B
MSP_SYNC
DOUT_2B
FOD
PMOD
RESERVED
RESERVED
PMB_DATA
PMB_CLK
LED_MODE
LOSS_THR
44
43
26
25
24
23
12
13
14
15
16
17
20
19
11
10
35
31
30
29
28
27
AGND
NC
OUT
C5
4.7uF
10V
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
3V3_ADC
EN
U3
TLV71333
GND
IN
MSP_TDO/PROG
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
GND
GND
47
C6
4.7uF
10V
33
GND
36
DC Jack or USB
34
V33A
V33D
EPAD
Product Folder Links: bq500211A
GND
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49
20
32
VIN
R8
10K0
C20
1.0uF
16V
DPWM-1A
AGND
C2
4.7uF
10V
3V3_VCC
GND
AGND
10K0
R12
R35 10R
AGND
R36
10K0
R32
10K0
3V3_VCC
C9
0.1uF
50V
VIN
R9
10R
U6
8
LGATE 5
PH
BOOT 2
UGATE 1
AGND
R31
10K0
TPS28225D
R13
10R
DPWM-1B
R33
10K0
GND
EN/PG
PWM
VDD
4 GND
7
3
6
AGND
C7
4.7uF
10V
3V3_ADC
0.1uF
50V
DPWM-1A
C29
COMM-
COMM+
R34
0R
R3
10R
GND
VIN
R19
10R
R29
10R
Q2
Q1
AGND
R5
10K
R6
100K
C18
4.7nF
50V
C11
100nF
C10
100nF
C19
100nF
C16
100nF
AGND
C14
33pF
50V
12.1K
R14
3V3_VCC
TANK
GND
COIL
C27
22uF
25V
GND
AGND
D3
BAT54SW
Q4
Q3
R2
0R
R1
10R
50V
0.1uF
C15
PH
U2
7
3
6
GND 4
EN/PG
PWM
VDD
TPS28225D
5 LGATE
8
2 BOOT
1 UGATE
GND
GND
VIN
C13
0.1uF
50V
DPWM-1B
Not Recommended for New Designs
bq500211A
SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
www.ti.com
Typical Application (continued)
Figure 8. bq500211A Typical Low-Cost Application Diagram
Copyright © 2012–2016, Texas Instruments Incorporated
Not Recommended for New Designs
bq500211A
www.ti.com
SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
9 Layout
9.1 Layout Guidelines
A good PCB layout is critical to proper system operation and due care should be taken. There are many
references on proper PCB layout techniques.
Generally speaking, the system layout will require a 4-layer PCB layout, although a 2-layer PCB layout can be
achieved. A proven and recommended approach to the layer stack-up has been:
• Layer 1, component placement and as much ground plane as possible.
• Layer 2, clean ground.
• Layer 3, finish routing.
• Layer 4, clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500211A GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500211A. A good GND reference is necessary for proper bq500211A operation,
such as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds.
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
Typically a single chip controller solution with integrated power FET and synchronous rectifier will be used. To
create a tight loop, pull in the buck inductor and power loop as close as possible. Likewise, the power-train, fullbridge components should be pulled together as tight as possible. See the bq500211AEVM-045, bqTESLA
Wireless Power TX EVM User's Guide (SLVU536) for layout examples.
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Copyright © 2012–2016, Texas Instruments Incorporated
Product Folder Links: bq500211A
21
Not Recommended for New Designs
bq500211A
SLUSBB1B – DECEMBER 2012 – REVISED JUNE 2016
www.ti.com
10 Device and Documentation Support
10.1 Documentation Support
10.1.1 Related Documentation
•
•
•
•
•
Building a Wireless Power Transmitter, SLUA635
Technology, Wireless Power Consortium. http://www.wirelesspowerconsortium.com/
An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill.
BQ500210 DatasheetSLUSAL8
BQ51013 DatasheetSLVSAT9
10.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.3 Trademarks
Dynamic Power Limiting, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
22
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Copyright © 2012–2016, Texas Instruments Incorporated
Product Folder Links: bq500211A
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
BQ500211ARGZR
NRND
VQFN
RGZ
48
2500
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 110
BQ500211A
BQ500211ARGZT
NRND
VQFN
RGZ
48
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 110
BQ500211A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of