BQ500215RGCR

Product Folder Order Now Support & Community Tools & Software Technical Documents bq500215 SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 bq500215 WPC v1.2 Compliant Wireless Power Transmitter Manager With Proprietary 10-W Power Delivery 1 Features • 1 • • • • • • • Qi-Certified WPC v1.2 Solution for 5-W Operation and Proprietary 10-W Charging Capability With TI bq51025 Wireless Power Receiver – Proprietary Authentication Protocol With TI bq51025 Receiver – Faster Charging Time – Compatible With Standard 5-W WPC Receivers 12-V Input, Fixed Frequency, Rail Voltage Control Architecture Conforms to Wireless Power Consortium (WPC) A29 Transmitter Type Specification Enhanced Foreign Objection Detection (FOD) Implementation With FOD Ping that Detects Metal Objects Prior to Power Transfer Low Standby Power During Idle and 'Charge Complete' 10 Configurable LED Modes Indicate Charging State and Fault Status Digital Demodulation Reduces Components and Simplifies Circuitry The bq500215 is a dedicated wireless power digital controller that integrates the logic functions required to control wireless power transfer to a single WPCcompliant receiver. The bq500215 complies with the WPC v1.2 standard for power delivery up to 5 W and uses a proprietary bidirectional communication protocol to allow charging at up to 10 W with the bq51025 wireless power receiver. The bq500215 is an intelligent device that periodically pings the surrounding environment for available devices to be powered, detects if a foreign metal object is present on the charging pad, monitors all communication from the device being wirelessly powered, and adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500215 also manages the fault conditions associated with the power transfer and controls the operating mode status indicator. The bq500215 uses a rail voltage control scheme instead of the traditional frequency control to adjust the amount of power delivered to the receiver. PART NUMBER WPC v1.2 Wireless Chargers: – Qi-Certified Smart Phones, Tablets, and Other Handhelds – Point-of-Sale Devices – Custom Wireless Power Applications Simplified Diagram 12 V Supply 3 Description Device Information(1) 2 Applications • See www.ti.com/wirelesspower for More Information on TI's Wireless Charging Solutions PACKAGE bq500215 VQFN (64) BODY SIZE (NOM) 9.00 mm × 9.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Efficiency vs System Output Power With bq51025 Receiver Vin 100% 90% 3.3 V DCDC 80% 70% bq500215 Wireless Power Controller Efficiency Variable Vout DCDC Full-Bridge Power Stage Coil Assembly 60% 50% 40% 30% VOUT = 10V VOUT = 7V VOUT = 5V 20% TX Copyright © 2017, Texas Instruments Incorporated 10% 0 0 1 2 3 4 5 6 Output Power (W) 7 8 9 10 D001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq500215 SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 6 6.1 6.2 6.3 6.4 6.5 6.6 6 6 6 6 7 8 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 7.1 Overview ................................................................... 9 7.2 Functional Block Diagram ......................................... 9 7.3 Feature Description................................................. 10 7.4 Device Functional Modes........................................ 15 8 Application and Implementation ........................ 18 8.1 Application Information............................................ 18 8.2 Typical Application .................................................. 18 9 Power Supply Recommendations...................... 21 10 Layout................................................................... 21 10.1 Layout Guidelines ................................................. 21 10.2 Layout Example .................................................... 21 11 Device and Documentation Support ................. 27 11.1 11.2 11.3 11.4 11.5 11.6 Device Support...................................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 27 27 27 27 27 27 12 Mechanical, Packaging, and Orderable Information ........................................................... 27 4 Revision History Changes from Revision A (November 2014) to Revision B Page • Changed From: WPC v1.1 To: WPC v1.2 throughout the document ................................................................................... 1 • Changed pin 65 to Thermal Pad in the Pin Functions table................................................................................................... 5 • Moved the Storage temperature range to the Absolute Maximum Ratings table .................................................................. 6 • Changed Handling Ratings To: ESD Ratings......................................................................................................................... 6 Changes from Original (October 2014) to Revision A • 2 Page Updated device status to production data .............................................................................................................................. 1 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 bq500215 www.ti.com SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 5 Pin Configuration and Functions AGND3 V_SENSE PWR_UP LED_MODE LOSS_THR I_SENSE V33FB Unused Unused V_RAIL± V_RAIL+ COMM_B± COMM_B+ COMM_A- COMM_A+ AGND 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RGC Package 64 Pin (VQFN) (Top View) PEAK_DET 1 48 AGND2 T_SENSE 2 47 BPCAP SNOOZE_CAP 3 46 V33A Unused 4 45 V33D Unused 5 44 V33DIO Unused 6 43 DGND V33DIO 7 42 Reserved DGND 8 41 Reserved RESET 9 40 Reserved Reserved 10 39 Reserved SLEEP 11 38 Reserved LED-A 12 37 Reserved LED-B 13 36 Reserved SNOOZE 14 35 Reserved Reserved 15 34 Reserved Reserved 16 33 Reserved 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PWM-A PWM-B FP_RES FP_DECAY PWM_RAIL FOD_CAL FOD PMOD LED-C DGND Unused Unused Unused SNOOZE_CHG BUZZ-AC BUZ-DC Thermal Pad Not to scale Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 3 bq500215 SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 www.ti.com Pin Functions PIN NAME NO. I/O DESCRIPTION PEAK_DET 1 I Input from peak detect circuit T_SENSE 2 I Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply connecting to 3.3V supply SNOOZE_CAP 3 I Indicates wake from SNOOZE (short) or SLEEP (long) Unused 4 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. Unused 5 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. Unused 6 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. V33DIO 7 — 3.3-V IO power supply DGND 8 — GND RESET 9 I Reserved 10 — Reserved, leave this pin open SLEEP 11 O Force SLEEP (5 s low power). Connected to 5-s interval circuit LED-A 12 O Connect to an LED with a 470-Ω resistor for status indication. LED-B 13 O Connect to an LED with a 470-Ω resistor for status indication. SNOOZE 14 O Force SNOOZE (500 ms low power) Reserved 15 I Reserved, connect to GND Reserved 16 I/O Reserved, connect to GND PWM-A 17 O PWM output A, controls one half of the full bridge in a phase-shifted full bridge. Switching dead times must be externally generated. PWM-B 18 O PWM output B, controls other half of the full bridge in a phase-shifted full bridge. Switching dead times must be externally generated. FP_RES 19 O Output to select the FOD ping calibration threshold FP_DECAY 20 O Output to select the FOD ping calibration threshold PWM_RAIL 21 O PWM control signal for full bridge rail voltage FOD_CAL 22 O Output to select the FOD calibration FOD 23 O Output to select the foreign object detection (FOD) threshold PMOD 24 O Output to select the PMOD threshold LED-C 25 O Connect to an LED with a 470-Ω resistor for status indication. DGND 26 — GND Unused 27 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. Unused 28 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. Unused 29 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. SNOOZE_CH G 30 O SNOOZE capacitor charging source. Connected to capacitor BUZZ-AC 31 O AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins BUZ-DC 32 O DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to an LED with a 470-Ω resistor. Reserved 33 — Reserved, leave this pin open Reserved 34 — Reserved, leave this pin open Reserved 35 — Reserved, leave this pin open Reserved 36 — Reserved, leave this pin open Reserved 37 — Reserved, leave this pin open Reserved 38 — Reserved, leave this pin open Reserved 39 — Reserved, leave this pin open Reserved 40 — Reserved, connect to 10-kΩ resistor to GND Reserved 41 — Reserved, leave this pin open Reserved 42 — Reserved, leave this pin open DGND 43 — GND 4 Device reset. Use 10- to 100-kΩ pullup resistor to 3.3-V supply Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 bq500215 www.ti.com SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 Pin Functions (continued) PIN NAME NO. I/O DESCRIPTION V33DIO 44 — 3.3-V IO power supply V33D 45 — Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as possible. V33A 46 — Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor and additional bypass capacitors. BPCAP 47 — Connect to 1uF bypass capacitors to 3.3V supply and GND AGND2 48 — GND AGND 49 — GND COMM_A+ 50 I Digital demodulation non-inverting input A. Connect parallel to input B+ COMM_A- 51 I Digital demodulation inverting input A. Connect parallel to input B– COMM_B+ 52 I Digital demodulation non-inverting input B. Connect parallel to input A+ COMM_B– 53 I Digital demodulation inverting input B. Connect parallel to input A– V_RAIL+ 54 I Feedback for full bridge rail voltage control + V_RAIL– 55 I Feedback for full bridge rail voltage control – Unused 56 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. Unused 57 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. V33FB 58 I Reserved, leave this pin open I_SENSE 59 I Full bridge input current sense LOSS_THR 60 I Input for FOD/PMOD calibration and configuration LED_MODE 61 I LED mode select PWR_UP 62 I First power-up indicator (pull high if unused) V_SENSE 63 I Transmitter rail voltage sense AGND3 64 — GND — Flood with copper GND plane and stitch vias to PCB internal GND plane. Thermal Pad Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 5 bq500215 SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature (unless otherwise noted) MIN MAX Voltage applied at V33D to DGND –0.3 3.6 Voltage applied at V33A to AGND –0.3 3.6 Voltage applied to any pin (2) –0.3 3.6 Storage temperature range, Tstg –40 150 (1) (2) UNIT V °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to GND. 6.2 ESD Ratings Electrostatic discharge V(ESD) (1) (2) VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±7500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX 3.3 3.6 V Supply voltage during operation, V33D, V33A 3.0 TA Operating free-air temperature range –40 TJ Junction temperature 85 125 UNIT V °C 6.4 Thermal Information THERMAL METRIC (1) bq500215 RGC (64 pins) RθJA Junction-to-ambient thermal resistance 29.5 RθJC(top) Junction-to-case (top) thermal resistance 15.1 RθJB Junction-to-board thermal resistance 8.4 ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 8.3 RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2 (1) 6 UNIT °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 bq500215 www.ti.com SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX V33A = 3.3 V 8 15 V33D = 3.3 V 44 55 V33D = V33A = 3.3 V 52 70 UNIT SUPPLY CURRENT IV33A IV33D Supply current ITotal mA EXTERNALLY SUPPLIED 3.3 V POWER V33D Digital 3.3-V power TA = 25°C 3 3.6 V33A Analog 3.3-V power TA = 25°C 3 3.6 V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 and 2.9 V, V33A = V33D 0.25 V V/ms DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_BVCM Common mode voltage each pin –0.15 COMM+, COMM– Modulation voltage digital resolution REA Input Impedance Ground reference 0.5 IOFFSET Input offset current 1-kΩ source impedance –5 1.631 1 1.5 V mV 3 MΩ 5 µA 0.36 V ANALOG INPUTS: V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR VADC_OPEN Voltage indicating open pin LED_MODE, LOSS_THR open VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, LOSS_THR shorted to ground VADC_RANGE Measurement range for voltage monitoring All analog inputs INL ADC integral nonlinearity Ilkg Input leakage current 3 V applied to pin RIN Input impedance Ground reference CIN Input capacitance 2.37 0 2.5 –2.5 2.5 100 8 mV nA MΩ 10 pF DIGITAL INPUTS/OUTPUTS VOL Low-level output voltage IOL = 6 mA , V33D = 3 V VOH High-level output voltage IOH = –6 mA , V33D = 3 V DGND1 + 0.25 VIH High-level input voltage V33D = 3 V VIL Low-level input voltage V33D = 3.5 V IOH(MAX) Output high-source current 4 IOL(MAX) Output low-sink current 4 V33D – 0.6 V 2.1 3.6 V 1.4 mA SYSTEM PERFORMANCE VRESET Voltage where device comes out of reset V33D pin tRESET Pulse duration needed for reset RESET pin ƒSW Switching frequency (wireless power transfer) tdetect Time to detect presence of device requesting power 2.4 2 V µs 130 kHz 0.5 s PWM RAIL ƒSW_RAIL Switching frequency 520 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 kHz 7 bq500215 SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 www.ti.com 6.6 Typical Characteristics CH1 = PWM-A CH2 = PWM-B CH1 = RX communication signal CH2 = TX coil voltage Figure 1. Typical PWM-A and PWM-B Signals Figure 2. TX Coil and RX Communication Signals With RX No Load CH1 = RX communication signal CH2 = TX coil voltage Figure 3. TX Coil and RX Communication Signals With Rx 10-W Load 8 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 bq500215 www.ti.com SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 7 Detailed Description 7.1 Overview The principle of wireless power transfer is simply an open-cored transformer consisting of a transmitter and receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and electronics are typically built into a portable device, such as a cell phone. When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is driven. The flux is coupled into the secondary coil, which induces a voltage and current flows. The secondary voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be managed through any of the various closedloop control schemes. After power is applied and the device comes out of reset, it can automatically begin the process of detecting and powering a receiver. The bq500215 sends a ping to detect the presence of a receiver on the pad. After a receiver is detected, the bq500215 attempts to establish communication and begin power transfer. If the transmitter detects the bq51025 receiver through its proprietary authentication protocol, the transmitter allows 10W operation. If a standard 5-W WPC compliant receiver is detected, the transmitter allows 5-W of delivered power as per WPC specification. The bq500215 controls a full-bridge power stage to drive the primary coil. It regulates the power being delivered to the receiver by modulating the supply voltage of the power stage while operating at a constant frequency. The full bridge power stage allows for higher power delivery for a given supply voltage. 7.2 Functional Block Diagram SNOOZE_CAP SNOOZE_CHG bq500215 SLEEP LED_A LED Control/ Low Power Interface COMM_A+ LED_B SNOOZE COMM_A- LED_C Digital Demodulation PMOD COMM_B+ FOD COMM_B- PWM-A PWM Controller PWM-B PEAK_DET PWM_RAIL PWR_UP VRAIL Control V_SENSE I_SENSE VRAIL+ VRAIL- 12-bit ADC BUZ_AC Buzzer Control T_SENSE BUZ_DC LOSS_THR POR LED_MODE RESET Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 9 bq500215 SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 www.ti.com 7.3 Feature Description 7.3.1 A29 Coil Specification The bq500215 controller supports A29 TX coil type. The coil and matching capacitor specification for A29 transmitter has been established by the WPC Standard. This is fixed and cannot be changed on the transmitter side. For a current list of coil vendors, see bqTESLA Transmitter Coil Vendors, SLUA649. 7.3.2 Option Select Pins There are two option select pins (pin 60, LOSS_THR, and pin 61, LED_MODE) on the bq500215 and five selector outputs (pins 19, 20, 22, 23, and 24) used to read multiple voltage thresholds . All the pin voltages will be read by bq500215 at power-up. • Pin 60 is used to program the loss threshold and calibrate the FOD algorithms. • Pin 61 is used to select the LED mode of the device. • Pins 19, 20, 22, 23, and 24 are used to sequentially bias the five programming resistors shown in Figure 4. At power-up, a bias current is applied to pins LED_MODE and LOSS_THR, and the resulting voltage is measured to identify the value of the attached programming resistor. For LED_MODE, the selected bin determines the LED behavior based on Table 1. For the LOSS_THR, the selected bin sets a threshold based on Table 2. See FOD and Parasitic Metal Object Detect (PMOD) Calibration for more information. To 12-bit ADC FOD PMOD 60 FOD_CAL LOSS_THR 61 FP_DECAY Resistors to set options FP_RES LED_MODE 19 20 22 23 24 Figure 4. Pin 60 LOSS_THR and Pin 61 LED_MODE Connections 10 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: bq500215 bq500215 www.ti.com SLUSBZ1B – OCTOBER 2014 – REVISED MARCH 2017 Feature Description (continued) 7.3.3 LED Modes The bq500215 can directly drive three LED outputs (pin 12, pin 13, and pin 25) through a simple current limit resistor (typically 470 Ω), based on the mode selected. The three current limit resistors can be individually adjusted to tune or match the brightness of the LEDs. Do not exceed the maximum output current rating of the device. The selection resistor, connected between pin 61 and GND, selects one of the desired LED indication schemes presented in Table 1. Table 1. LED Modes LED CONTROL OPTION LED SELECTION RESISTOR X