BQ501210RGCT

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents bq501210 SLUSCF5C – APRIL 2016 – REVISED JULY 2016 bq501210 WPC v1.2 Wireless Power Transmitter Manager with 15-W Power Delivery 1 Features 3 Description • The bq501210 is a Wireless Power Consortium (WPC) v1.2 compliant wireless power digital controller that integrates the logic functions required to wirelessly transfer power to a WPC-compliant receiver with the capability of delivering up to 15 W. The bq501210 is an intelligent device that periodically pings the surrounding environment for available devices to be powered, detects if a foreign metal object is present on the charging pad, monitors all communication from the device being wirelessly powered, and adjusts power applied to the transmitter coil per feedback received from the powered device. The bq501210 also manages the fault conditions associated with the power transfer and controls the operating mode status indicator. The bq501210 uses a rail voltage control scheme instead of the traditional frequency control to adjust the amount of power delivered to the receiver. 1 • • • • • • • • Qi-Certified Wireless Power Consortium (WPC) v1.2 Solution for 15-W Operation – Faster Charging Time – Backward Compatible With Existing 5-W WPC Receivers 12-V to 19-V Input, Fixed Frequency, Rail Voltage Control Architecture – 15 V to 19 V can achieve 15 W – 9 V and 12 V capable for HVDCP – Dynamic Power Limiting (DPL) Allows Operation From Weak Supplies Conforms to WPC MP-A5 Transmitter Type Specification Enhanced Foreign Objection Detection (FOD) Implementation With FOD Ping that Detects Metal Objects Prior to Power Transfer Low Standby Power During Idle and 'Charge Complete' Bi-directional Communication Digital Demodulation Reduces Components and Simplifies Circuitry Support Fast Charge Operation with Compatible Receivers 10 Configurable LED Modes Indicate Charging State and Fault Status WPC v1.2 Wireless Chargers: – Smart Phones, Tablets, and Other Handhelds – Point-of-Sale Devices – Custom Wireless Power Applications space Transmitter Solution Simplified Diagram 19-V Supply Fast Charge support provides more power for compatible receiver devices. See www.ti.com/wirelesspower for more information on TI's Wireless Charging Solutions Device Information(1) PART NUMBER 2 Applications • Through negotiation with a High Voltage Dedicated Charging Port (HVDCP) adapter, the bq501210 provides power between the WPC low power capability of 5 W, and the medium power specifications of 15 W. PACKAGE bq501210 VQFN (64) BODY SIZE (NOM) 9.00 mm × 9.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. System Efficiency With Typical WPC 15-W Receiver Vin 100% 90% 3.3-V DCDC 80% Variable Vout DCDC bq501210 Wireless Power Controller 70% Vrail Efficiency HVDCP Adapter Full-Bridge Power Stage 60% 50% 40% 30% Coil Assembly TX 20% 10% 0 0 Copyright © 2016, Texas Instruments Incorporated 2 4 6 8 10 Output Power (W) 12 14 16 D001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq501210 SLUSCF5C – APRIL 2016 – REVISED JULY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison ............................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 7 7.1 7.2 7.3 7.4 7.5 7.6 7 7 7 7 8 9 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 10 8.1 Overview ................................................................. 10 8.2 Functional Block Diagram ....................................... 10 8.3 Feature Description................................................. 11 8.4 Device Functional Modes........................................ 16 9 Application and Implementation ........................ 19 9.1 Application Information............................................ 19 9.2 Typical Application .................................................. 19 10 Power Supply Recommendations ..................... 22 11 Layout................................................................... 22 11.1 Layout Guidelines ................................................. 22 11.2 Layout Example .................................................... 22 12 Device and Documentation Support ................. 28 12.1 12.2 12.3 12.4 12.5 12.6 Device Support...................................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 28 28 28 28 28 28 13 Mechanical, Packaging, and Orderable Information ........................................................... 28 4 Revision History Changes from Revision B (July 2016) to Revision C Page • Changed Features From: Qi-Compatible Wireless Power Consortium To: Qi-Certified Wireless Power Consortium .......... 1 • Changed "WPC-compatible" To: "WPC-compliant" in the Description................................................................................... 1 • Changed "WPC compatible" To: "WPC compliant" in the Overview .................................................................................... 10 • Changed "WPC compatible" To: "WPC compliant" in the Application Information .............................................................. 19 Changes from Revision A (June 2016) to Revision B Page • Changed Features From: Qi-Certified Wireless Power Consortium To: Qi-Compatible Wireless Power Consortium........... 1 • Deleted "Qi-Certified" in the Applications list.......................................................................................................................... 1 • Changed "WPC-compliant" To: "WPC-compatible" in the Description................................................................................... 1 • Changed "WPC compliant" To: "WPC compatible" in the Overview .................................................................................... 10 • Changed "WPC compliant" To: "WPC compatible" in the Application Information .............................................................. 19 Changes from Original (April 2016) to Revision A • 2 Page Changed from Product Preview To Production ..................................................................................................................... 1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq501210 bq501210 www.ti.com SLUSCF5C – APRIL 2016 – REVISED JULY 2016 5 Device Comparison DEVICE FUNCTION SYSTEM VIN PROTOCOL MAXIMUM DELIVERED POWER NOTE bq500212A Wireless Power Transmitter Manager 5V WPC v1.1 5W 1 Coil bq500215 Wireless Power Transmitter Manager 12 V WPC v1.1 10 W 1 Coil, 5 W or 10 W operation bq500412 Wireless Power Transmitter Manager 5 V, 12 V WPC v1.1 5W 1, 2 or 3 Coils bq500414Q Wireless Power Transmitter Manager 12 V WPC v1.1 5W 1, 2 or 3 Coils, Automotive bq500511 bq50002 Wireless Power Transmitter Controller Wireless Power Transmitter Analog Front End 5V WPC v1.1 5W 1 Coil bq501210 Wireless Power Transmitter Manager 12 V – 19 V WPC v1.2 15 W 1 Coil Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq501210 3 bq501210 SLUSCF5C – APRIL 2016 – REVISED JULY 2016 www.ti.com 6 Pin Configuration and Functions 4 AGND3 V_SENSE PWR_UP LED_MODE CAL_INPUT Reserved V33FB COMM_C– COMM_C+ V_RAIL– V_RAIL+ COMM_B– COMM_B+ COMM_A- COMM_A+ AGND 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RGC Package 64-Pin VQFN Top View PEAK_DET 1 48 AGND2 Reserved 2 47 BPCAP V_IN 3 46 V33A T_SENSE 4 45 V33D I_SENSE 5 44 V33DIO Unused 6 43 DGND V33DIO 7 42 D+HI DGND 8 41 RX_PROP RESET 9 40 Reserved Thermal Pad 30 31 32 BUZZ_AC BUZZ_DC TX_COMM Unused 33 29 16 Unused DATA 28 DPING_DISABLE Reserved 34 27 15 Reserved CLK 26 D+LO DGND 35 25 14 LED-C SNOOZE 24 Reserved PMOD 36 23 13 FOD LED-B 22 Reserved FOD_CAL 37 21 12 PWM_RAIL LED-A 20 Reserved FP_OFFSET 38 19 11 FP_GAIN D-LO 18 Reserved PWM-B 39 17 10 PWM-A Reserved Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq501210 bq501210 www.ti.com SLUSCF5C – APRIL 2016 – REVISED JULY 2016 Pin Functions PIN NAME NO. I/O DESCRIPTION PEAK_DET 1 I Reserved 2 — Input from peak detect circuit V_IN 3 I Transmitter Input Voltage Sense T_SENSE 4 I Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply connecting to 3.3-V supply I_SENSE 5 I Full bridge input current sense Unused 6, 29, 30 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. V33DIO 7, 44 — 3.3-V IO power supply DGND 8, 26, 43 — GND RESET 9 I Reserved 10 — This pin must be left open. D-LO 11 O HVDCP interface LED-A 12 O Connect to an LED with a 470-Ω resistor for status indication. LED-B 13 O Connect to an LED with a 470-Ω resistor for status indication. SNOOZE 14 O Force SNOOZE (500 ms low power) CLK 15 I I2C interface, Clock DATA 16 I/O I2C interface, Data PWM-A 17 O PWM output A, controls one half of the full bridge in a phase-shifted full bridge. Switching dead times must be externally generated. PWM-B 18 O PWM output B, controls other half of the full bridge in a phase-shifted full bridge. Switching dead times must be externally generated. FP_GAIN 19 O Output to select the FOD ping calibration gain FP_OFFSET 20 O Output to select the FOD ping calibration offset PWM_RAIL 21 O PWM control signal for full bridge rail voltage FOD_CAL 22 O Output to select the FOD calibration FOD 23 O Output to select the foreign object detection (FOD) threshold PMOD 24 O Output to select the PMOD threshold LED-C 25 O Connect to an LED with a 470-Ω resistor for status indication. Reserved 27, 28 — This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. BUZZ_AC 31 O AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins BUZZ_DC 32 O DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to an LED with a 470-Ω resistor. TX_COMM 33 O Debug only. This pin echoes all TX_COMM DPING_DISABLE 34 I Disable periodic ping backup D+LO 35 O HVDCP interface Reserved 36, 37, 38, 39 — These pins must be left open. Reserved 40 — Reserved, connect to 10-kΩ resistor to GND RX_PROP 41 O Indicates RX proprietary packet received D+HI 42 O HVDCP interface V33D 45 — Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as possible. V33A 46 — Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor and additional bypass capacitors. BPCAP 47 — Connect to 1uF bypass capacitors to 3.3-V supply and GND AGND2 48 — GND AGND 49 — GND This pin must be connected to GND. Device reset. Use 10- to 100-kΩ pullup resistor to 3.3-V supply Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq501210 5 bq501210 SLUSCF5C – APRIL 2016 – REVISED JULY 2016 www.ti.com Pin Functions (continued) PIN NAME NO. I/O DESCRIPTION COMM_A+ 50 I Digital demodulation non-inverting input A. Connect parallel to input B+ COMM_A- 51 I Digital demodulation inverting input A. Connect parallel to input B– COMM_B+ 52 I Digital demodulation non-inverting input B. Connect parallel to input A+ COMM_B– 53 I Digital demodulation inverting input B. Connect parallel to input A– V_RAIL+ 54 I Feedback for full bridge rail voltage control + V_RAIL– 55 I Feedback for full bridge rail voltage control – COMM_C+ 56 I Digital demodulation non-inverting input C. Connect parallel to input A+ COMM_C– 57 I Digital demodulation inverting input C. Connect parallel to input A– V33FB 58 I Reserved, leave this pin open Reserved 59 — CAL_INPUT 60 I Input for FOD configuration LED_MODE 61 I LED mode select PWR_UP 62 I First power-up indicator (pull high if unused) V_SENSE 63 I Transmitter rail voltage sense AGND3 64 — GND PAD -- — Flood with copper GND plane and stitch vias to PCB internal GND plane 6 This pin must be connected to GND. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq501210 bq501210 www.ti.com SLUSCF5C – APRIL 2016 – REVISED JULY 2016 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature (unless otherwise noted) MIN MAX Voltage applied at V33D to DGND –0.3 3.8 Voltage applied at V33A to AGND –0.3 3.8 Voltage applied to any pin (2) –0.3 3.8 Storage temperature, Tstg –40 150 (1) (2) UNIT V °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to GND. 7.2 ESD Ratings MAX V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) UNIT ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) V ±750 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 TA Operating free-air temperature range –40 TJ Junction temperature UNIT V 85 °C 125 7.4 Thermal Information THERMAL METRIC (1) bq501210 RGC (VQFN) UNIT 64 Pins RθJA Junction-to-ambient thermal resistance 29.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15.1 °C/W RθJB Junction-to-board thermal resistance 8.4 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 8.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq501210 7 bq501210 SLUSCF5C – APRIL 2016 – REVISED JULY 2016 www.ti.com 7.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX V33A = 3.3 V 8 15 V33D = 3.3 V 44 55 V33D = V33A = 3.3 V 52 70 UNIT SUPPLY CURRENT IV33A IV33D Supply current ITotal mA EXTERNALLY SUPPLIED 3.3 V POWER V33D Digital 3.3-V power TA = 25°C 3 3.6 V33A Analog 3.3-V power TA = 25°C 3 3.6 V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 and 2.9 V, V33A = V33D 0.25 V V/ms DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A–, COMM_B+, COMM_B–, COMM_C+, COMM_C– VCM Common mode voltage each pin –0.15 COMM+, COMM– Modulation voltage digital resolution REA Input Impedance Ground reference 0.5 IOFFSET Input offset current 1-kΩ source impedance –5 1.631 1 1.5 V mV 3 MΩ 5 µA ANALOG INPUTS: V_SENSE, I_SENSE, T_SENSE, LED_MODE, CAL_INPUT, V_IN VADC_OPEN Voltage indicating open pin LED_MODE, CAL_INPUT open VADC_SHOR Voltage indicating pin shorted to GND LED_MODE, CAL_INPUT shorted to ground All analog inputs E Measurement range for voltage monitoring INL ADC integral nonlinearity Ilkg Input leakage current 3 V applied to pin RIN Input impedance Ground reference CIN Input capacitance T VADC_RANG 2.37 0.36 0 V 2.5 –2.5 2.5 100 8 mV nA MΩ 10 pF DIGITAL INPUTS/OUTPUTS DGND1 + 0.25 VOL Low-level output voltage IOL = 6 mA , V33D = 3 V VOH High-level output voltage IOH = –6 mA , V33D = 3 V VIH High-level input voltage V33D = 3 V VIL Low-level input voltage V33D = 3.5 V IOH(MAX) Output high-source current 4 IOL(MAX) Output low-sink current 4 V33D – 0.6 V V 2.1 3.6 1.4 mA SYSTEM PERFORMANCE VRESET Voltage where device comes out of reset V33D pin tRESET Pulse duration needed for reset RESET pin Switching frequency (wireless power transfer) ƒSW 2.4 System input power at startup 2 µs >6V 130