BQ51003EVM-764

User's Guide SLUUAU8 – November 2013 bq51003-764 Evaluation Module (WCSP Package) The bq51003EVM-764 (EVM) wireless power receiver evaluation kit from TI is a high-performance, easyto-use development kit for the design of wireless power solutions. The EVM helps designers to evaluate the operation and performance of the bq51003, 5-V power supply for wireless power transfer. The bq51003 devices provide AC/DC power conversion and regulation while integrating the digital control required to comply with the Qi-communication protocol. The kit speeds up the development of end-use applications. 1 2 3 4 5 6 7 Contents Considerations with this EVM ............................................................................................. 2 Modifications ................................................................................................................. 2 Recommended Operation Condition ..................................................................................... 2 Equipment and EVM setup ................................................................................................ 3 4.1 Schematic ........................................................................................................... 3 4.2 Connector and Test Point Descriptions ......................................................................... 3 4.3 Jumpers and Switches ............................................................................................ 4 4.4 Test Point Descriptions ............................................................................................ 4 4.5 Pin Description of the IC .......................................................................................... 5 Test Procedure .............................................................................................................. 6 5.1 Definition ............................................................................................................ 6 5.2 Recommended Test Equipment ................................................................................. 6 5.3 Equipment Setup ................................................................................................... 7 5.4 Procedure ........................................................................................................... 8 Test Results ................................................................................................................. 9 6.1 Load Step ........................................................................................................... 9 6.2 Load Dump ........................................................................................................ 10 6.3 Start-Up ............................................................................................................ 11 6.4 Efficiency .......................................................................................................... 11 6.5 Thermal Performance ............................................................................................ 12 Layout and Bill of Material ................................................................................................ 13 7.1 Layout .............................................................................................................. 13 7.2 Bill of Materials (BOM) ........................................................................................... 16 List of Figures 1 HPA764 Schematic ......................................................................................................... 2 Test Set Up .................................................................................................................. 7 3 Load Step, 0 mA to 500 mA .............................................................................................. Load Dump, 500 mA to 0 mA ........................................................................................... Start-Up .................................................................................................................... Efficiency for the bq51003 Versus IOUT ................................................................................. Thermal Image ............................................................................................................. bq51003EVM-764 Layout Example .................................................................................... bq51003EVM-764 Top Assembly ...................................................................................... bq51003EVM-764 Top Layer ........................................................................................... bq51003EVM-764 Bottom Copper Layer .............................................................................. 9 4 5 6 7 8 9 10 11 3 10 11 11 12 13 14 14 15 bqTESLA is a trademark of Texas Instruments, Inc.. SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 1 Considerations with this EVM 12 www.ti.com bq51003EVM-764 Bottom Assembly ................................................................................... 15 List of Tables 1 1 bq51003EVM-764 Electrical Performance Specifications ............................................................. 2 2 Pin Description .............................................................................................................. 5 3 bq51003EVM-764 Bill of Materials ..................................................................................... 16 Considerations with this EVM The bq51003EVM-764 evaluation module (HPA764-006) demonstrates the receiver portion of the bqTESLA™ wireless power system. This receiver EVM is a complete receiver-side solution that produces 5-V output at up to a 500-mA load (2.5 W). • The bqTESLA receiver is used in any number of low-power battery portable devices such as a power supply to a direct battery charger. With contact-free charging capability, no connections to the device are needed. • Output voltage of 5 V up to 500-mA charge current • External adapter switchover • Low-profile, external pick-up coil • Frame is configured to provide correct receiver to transmitter spacing • Room above coil for testing with battery, key for tuning • Option to adjust the max output current using variable resistor R16 2 Modifications Refer to the datasheet when changing components (SLUSBC8). To aid in such customization of the EVM, the board was designed with devices having 0603 or larger footprints. A real implementation likely occupies less total board space and smaller coil. Note that changing components can improve or degrade EVM performance. 3 Recommended Operation Condition Table 1 provides a summary of the bq51003EVM-764 performance specifications. All specifications are given for an ambient temperature of 25°C. Table 1. bq51003EVM-764 Electrical Performance Specifications Parameter 2 Test Condition MAX UNIT 10 V 20 V Voltage at V-rectified 550 mA Current limit programming range 550 mA 205 kHz VIN Input voltage range Typical Vrect Voltage at TP12 Vadapter Adapter input voltage OVP Input overvoltage protection IOUT Output current range VOUT Output voltage ILOAD = 700 mA Fs Switching frequency Efficiency AC-AC efficiency MIN TYP 4 4 5 5 110 76 bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated V % SLUUAU8 – November 2013 Submit Documentation Feedback Equipment and EVM setup www.ti.com 4 Equipment and EVM setup 4.1 Schematic The bq51003EVM-764 schematic is illustrated in Figure 1. 1 1 1 1 1 Figure 1. HPA764 Schematic 4.2 Connector and Test Point Descriptions The connection points are described in the following paragraphs. 4.2.1 J1 – AD External Adapter Input, J2-GND Power can be provided to simulate an external adapter applied to the receiver in this bq51003EVM-764 (HPA764-006). 4.2.2 J3 – Output Voltage, J4-GND Output voltage is 5 V in wireless power mode up to 500 mA. 4.2.3 J5 – TS and Return Connector External connection for temperature sense resistor, see the datasheet for additional information. 4.2.4 J6 – Programming Connector This connector is populated and is only useful at the factory level for programming the IC. SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 3 Equipment and EVM setup 4.3 www.ti.com Jumpers and Switches The control jumpers are described in the following paragraphs. 4.3.1 JP1 – EN1 Enable 1 Not populated in this EVM (HPA764-006). 4.3.2 JP2 – EN2 Enable 2 Enable signal input that allows the system to assert wireless charging. If EN2 is set to low, wireless charging is enabled unless AD voltage > 3.6 V. If EN2 is set to High, AD mode disabled, wireless charging always enabled. Used when OTG plus wireless charging is active. 4.3.3 JP3 – TS Enable or Disable This jumper enables the TS adjustment feature using R3. The disable position sets voltage at the TS pin to a safe value. The default shorting jumper setting is disabled. 4.3.4 JP4 – Pull-Up to Out or Vz EN2 pull-up can be powered from OUT or RECT. Vz is derived from RECT through a resistor and Zener diode D2. 4.3.5 JP5 – Termination This jumper along with R14 and R13 are not installed. 4.3.6 JP6 – ILIM Fix or ADJ Max output current is set by ILIM pin. In the FIX position, the current is set to a fixed value. In the ADJ position the current is set by R16. 4.4 Test Point Descriptions The test points are described in the following paragraphs. 4.4.1 TP1 – AD-EN This push-pull driver for the external PFET connects the adapter and the output from the bq51003. 4.4.2 TP2 – AC Input 2 This is the test point for measuring AC voltage applied to the EVM from the receiver coil. 4.4.3 TP3 – COM2 Communication 2 Drive Communication driver signal, open-drain output connected to communication capacitor. 4.4.4 TP4 – AC Input 1 This is the test point for measuring AC voltage applied to the EVM from the receiver coil. 4.4.5 TP5 – CLMP 1 Overvoltage clamp driver signal, open-drain output is connected to OVP capacitor. 4.4.6 TP6 – CLMP 2 Overvoltage clamp drive signal, open-drain output is connected to OVP capacitor. 4 bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated SLUUAU8 – November 2013 Submit Documentation Feedback Equipment and EVM setup www.ti.com 4.4.7 TP7 – OUT Output Voltage This test point is the output voltage. 4.4.8 TP8 – Boot-1 Boot Capacitor This bootstrap capacitor 1 drive connects to the integrated circuit (IC). 4.4.9 TP9 – Boot-2 Boot Capacitor This bootstrap capacitor 2 drive connects to the IC. 4.4.10 TP10 – CHG Charge This output signal indicates that the output current is being delivered to OUT, the open-drain output. 4.4.11 TP11 – AC1 IC input This is the AC input to the IC from series capacitors. 4.4.12 TP12 – Rectified Voltage The input AC voltage is rectified into unregulated DC voltage; additional capacitance is used to filter the voltage before the regulator. 4.4.13 TP13, TP14, TP15 – GND These are the ground test points. 4.4.14 TP16 – TS Temp Sensor This is the connection point for external thermistor; see the data sheet for additional information. 4.4.15 TP17 – FET Open Detection (FOD) Input for rectified power measurement, pin F2 of the IC. 4.4.16 TP18– ILIM Programming pin for over current limit, pin G1 of the IC. 4.5 Pin Description of the IC Table 2. Pin Description PIN Number (WCSP) SLUUAU8 – November 2013 Submit Documentation Feedback bq51003 A1, A2, A3, A4 PGND B1, B2 AC2, AC2 B3, B4 AC1, AC1 C1 BOOT2 C2, C3 RECT C4 BOOT1 D1, D2, D3, D4 OUT E1 COM2 E2 CLMP2 E3 CLMP1 E4 COM1 F1 TS/CTRL bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 5 Test Procedure www.ti.com Table 2. Pin Description (continued) 5 PIN Number (WCSP) bq51003 F2 FOD F3 AD-EN F4 CHG G1 ILIM G2 EN2 G3 EN1 G4 AD Test Procedure This procedure describes test configuration of the bq51003 evaluation board (HPA764-006) for bench evaluation. 5.1 Definition The following naming conventions are used: VXXX : External voltage supply name (VADP, VBT, VSBT) LOADW: External load name (LOADR, LOADI) V(TPyy): Voltage at internal test point TPyy. For example, V(TP02) means the voltage at TP02. V(Jxx): Voltage at header Jxx V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test point which is marked as ACDET. V(XXX, YYY): Voltage across point XXX and YYY. I(JXX(YYY)): Current going out from the YYY terminal of header XX. Jxx(BBB): Terminal or pin BBB of header xx. JPx ON: Internal jumper Jxx terminals are shorted. JPx OFF : Internal jumper Jxx terminals are open. JPx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted. Assembly drawings have location for jumpers, test points, and individual components. 5.2 Recommended Test Equipment The following equipment is needed to complete this test procedure. 5.2.1 Power Supplies A power supply capable of supplying 19 V at 1 A is required for testing procedures. 5.2.2 Loads A resistive load or electronic load set to 10 Ω at 500 mA and 5 kΩ at 1 mA, power rating should be 5 W. 5.2.3 Meters Two DC voltmeters and two DC ammeters are required. 5.2.4 bqTesla Transmitter The transmitter HPA689 or equivalent is used for final test. 6 bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated SLUUAU8 – November 2013 Submit Documentation Feedback Test Procedure www.ti.com 5.3 Equipment Setup 5.3.1 Test Set Up The final assembly is tested using a bqTesla transmitter provided (HPA689). Input voltage to the transmitter is set to 19 VDC, ±200 mV with current limit of 1 A and connected to J1 and J2. Set power supply to OFF. Place UUT on the transmitter coil. The unit under test (UUT) is placed in the center of HPA689 TX coil. Other bqTesla transmitter base units are also acceptable for this test. A VOUT A PS VIN V Wireless Transmitter bq51003EVM HPA764-006 V Load GND GND Figure 2. Test Set Up 5.3.2 Load The load is connected between J3 OUT and J4 GND of the UUT. A DC ammeter is connected between UUT and Load. Set the load for 10 Ω/500 mA. 5.3.3 Jumper Settings JP1: EN1/TERM and Low shorted JP2: EN2 and Low shorted JP3: TS and DIS shorted JP4: Pullup and Vz shorted JP5: Open JP6: ILIM and ADJ shorted 5.3.4 Meters • • • • 5.3.5 Connect ammeter to measure 19-V input current to transmitter. Connect voltmeter to monitor input voltage at J1 and J2 of TX unit. On UUT, a voltmeter is used to measure output voltage at TP7 with ground at J4. Connect ammeter to measure load current. R3 Set Up Connect ohmmeter across J5. Connect shorting jumper JP3 from TS to EN. Adjust R3 for a 10 kΩ, ±200Ω reading on the ohmmeter 5.3.6 R16 Set Up Connect ohm meter between JP6 ADJ and J2 (GND). Adjust R16 to 600 Ω, ±20-Ω reading on the ohmmeter. SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 7 Test Procedure 5.4 Procedure 5.4.1 • • • • • • • 5.4.2 • • • • • • • Operation (1-mA Load) Turn ON transmitter power supply (19 V) Transmitter: Verify LED D2 is ON UUT: Adjust load current to 1mA, ±200 µA Put the receiver EVM on the transmitter coil and align them correctly After 5 seconds verify that: 1. Transmitter: Status LED D5 is flashing green for approximately 1 second 2. The transmitter beeps 3. Transmitter: LED D2 still ON 4. Receiver: LED D1 is ON UUT: Verify that Vout is 4.9 V to 5.1 V (between J3 or TP7 and J4) UUT: Verify that rectified voltage should be 6.9 V to 7.6 V (between TP12 and TP13) (Note: a modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading, use lower value or base line) Efficiency Test (1-mA Load) • Verify the input current to TX is less than 60 mA, with the input voltage at 19 VDC • Turn OFF Transmitter Power Supply (19) 5.4.5 • • • • 8 Turn ON Operation and Operation at 500-mA Load Turn ON transmitter power supply (19 V) Transmitter: Verify LED D2 is ON UUT: Adjust load current to 500 mA, ±50mA Put the receiver EVM on the Transmitter coil and align them correctly After 5 seconds, verify that: 1. Transmitter: Status LED D5 should be green flashing for approximately 1 second 2. The transmitter beeps 3. Transmitter: LED D2 still ON 4. Receiver: LED D1 is ON UUT: Verify that Vout is 4.9 V to 5.1 V (between TP7 and J4) UUT: Verify that the rectified voltage is 5 V to 5.3 V (between TP12 and TP13) (Note: a modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading, use lower value or base line) Efficiency Test (500-mA Load) • Verify the input current to TX is less than 260 mA, with input voltage at 19 VDC • Turn OFF Transmitter Power Supply (19) 5.4.3 5.4.4 www.ti.com Adapter Test (500-mA Load) Connect 6-V, ±200-mV power supply with current limit set to 1.0 A to J1 and return to J2 on the HPA764-006 receiver. Adjust load current to 500 mA, ±50 mA Turn on power supply Verify that: 1. UUT: TP7 VOUT is 5.5 V to 6 V 2. Transmitter: Status LED D5 is off bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated SLUUAU8 – November 2013 Submit Documentation Feedback Test Results www.ti.com 6 Test Results 6.1 Load Step The procedure for load step is as follows: • Set up the test bench as described in Section 5. • Power TX with 19 V. • Provide a load step from no load (high impedance) to 10 Ω or 500 mA (if using current source load). • Monitor load current, rectifier voltage, and output voltage as shown in Figure 3. Figure 3. Load Step, 0 mA to 500 mA SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 9 Test Results 6.2 www.ti.com Load Dump The procedure for load dump is as follows: • Set up the test bench as described in Section 5. • Power TX with 19 V • Provide a load dump from 10 Ω or 500 mA (if using a current source load) to no load (high impedance). • Monitor load current, rectifier voltage, and output voltage as shown in Figure 4. Figure 4. Load Dump, 500 mA to 0 mA 10 bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated SLUUAU8 – November 2013 Submit Documentation Feedback Test Results www.ti.com 6.3 Start-Up These procedures demonstrates start-up: • Set up the test bench as described in Section 5. • Power TX with 19 V • Trigger scope sweep on TP2 AC IN Figure 5. Start-Up 6.4 Efficiency Figure 6 shows the efficiency data for the wireless power receiver, bq51003. The efficiency data are measured from 50-mA to 500-mA load. 100 90 Efficiency (%) 80 70 60 50 40 30 20 10 0 100 200 300 400 500 IOUT (mA) C001 Figure 6. Efficiency for the bq51003 Versus IOUT SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 11 Test Results 6.5 www.ti.com Thermal Performance This section shows a thermal image of the bq51003EVM-764 (see Figure 7). A 5.0-V output is used at a 500-mA load. There is no air flow and the ambient temperature is 25°C. The peak temperature of the IC, 37°C, is well below the maximum recommended operating condition listed in the data sheet. Figure 7. Thermal Image 12 bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated SLUUAU8 – November 2013 Submit Documentation Feedback Layout and Bill of Material www.ti.com 7 Layout and Bill of Material 7.1 Layout 7.1.1 Printed-Circuit Board Layout Guideline The primary concerns when laying out a custom receiver PCB are: • AC1 and AC2 trace resistance • OUT trace resistance • RECT trace resistance • GND connection • Copper weight ≥ 2 oz For a 500-mA load-current application, the current rating for each net is as follows: • AC1 = AC2 = 500 mA • BOOT1 = BOOT2 = 10 mA • RECT = 500 mA • OUT = 500 mA • COM1 = COM2 = 300 mA • CLAMP1 = CLAMP2 = 500 mA • ILIM = 10 mA • AD = AD_EN = TS-CTRL = EN1 = EN2 = TERM = FOD = 1 mA • CHG = 10 mA It is also recommended to have the following capacitance on RECT and OUT: • RECT ≥ ±10 μF • OUT ≥ 1 μF It is always a good practice to place high-frequency bypass capacitors of 0.1 μF next to RECT and OUT. Figure 8 illustrates an example of a WCSP layout: Figure 8. bq51003EVM-764 Layout Example SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 13 Layout and Bill of Material 7.1.2 www.ti.com Layout Figure 9 through Figure 12 illustrate the PCB layouts for the bq51003EVM-764. Figure 9. bq51003EVM-764 Top Assembly Figure 10. bq51003EVM-764 Top Layer 14 bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated SLUUAU8 – November 2013 Submit Documentation Feedback Layout and Bill of Material www.ti.com Figure 11. bq51003EVM-764 Bottom Copper Layer Figure 12. bq51003EVM-764 Bottom Assembly SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 15 Layout and Bill of Material 7.2 www.ti.com Bill of Materials (BOM) The bq51003EVM-764 bill of materials is shown in Table 3. Table 3. bq51003EVM-764 Bill of Materials Count RefDes Value Description Size Part Number MFR 1 C1 68nF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 1 C2 68nF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 1 C3 47nF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 1 C4 1800pF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 1 C5 100pF Capacitor, Ceramic, 50V, C0G, 5% 0603 std std 4 C6, C16, C18, C19 0.1uF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 3 C7, C17, C20 1.0uF Capacitor, Ceramic, 50V, X5R, 10% 0805 std std 2 C8, C13 22nF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 2 C9, C12 0.47uF Capacitor, Ceramic, 25V, X5R, 10% 0603 std std 2 C10, C11 0.01uF Capacitor, Ceramic, 50V, X7R, 10% 0603 std std 2 C14, C15 10uF Capacitor, Ceramic, 25V, X5R, 10% 1206 std std 1 D1 LTST-C190GKT Diode, LED, Green, 2.1-V, 20-mA, 6-mcd 0603 LTST-C190GKT Lite On 1 D2 5.1V Diode, Zener, 5.1V, 300mW SOD-523 BZT52C5V1T-7 Diodes, Inc. 5 J1, J2, J3, J4, J5 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins 1 J6 N2510-6002-RB Connector, Male Straight 2x5 pin, 100mil spacing, 4 Wall 0.338 x 0.788 inch N2510-6002-RB 3M 4 JP2, JP3, JP4, JP6 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins 1 JP1 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins 0 JP5 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins 1 Q1 CSD75205W1015 MOSFET, Dual PChan, -20V, 1.2A, 190 milliOhm CSP 1x1.5mm CSD75205W1015 TI 0 R1 Open Resistor, Chip, 1/16W, 1% 0603 DNI DNI 1 R2 196 Resistor, Chip, 1/16W, 1% 0603 std std 1 R3 200k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-204LF Bourns 1 R4 412 Resistor, Chip, 1/16W, 1% 0603 RC0603FR-07412RL Yageo America 0 R5 Open Resistor, Chip, 1/16W, 1% 0603 DNI DNI 0 R6, R12 Open Resistor, Metal Film, 1/4 watt, ± 1% 1206 CRCW120624R0FKEA Vishay 1 R7 1.50K Resistor, Chip, 1/16W, 1% 0603 std std 1 R8, R9 200 Resistor, Chip, 1/16W, 1% 0603 std std 1 R10 499 Resistor, Chip, 1/16W, 1% 0603 std std 1 R11 10.0k Resistor, Chip, 1/16W, 1% 0603 std std 0 R14 1.0k Resistor, Chip, 1/16W, 1% 0603 DNI DNI 1 R15 1.0K Resistor, Chip, 1/16W, 1% 0603 RC0603FR-071KL Yageo Corporation 0 R13 20k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-203LF Bourns 1 R16 5k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-502LF Bourns 1 R17 20K Resistor, Chip, 1/16W, 1% 0603 ERJ-3EKF3092V Panasonic Electronic Components 16 bq51003-764 Evaluation Module (WCSP Package) SLUUAU8 – November 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Layout and Bill of Material www.ti.com Table 3. bq51003EVM-764 Bill of Materials (continued) Count RefDes Value Description Size Part Number MFR 15 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP16, TP17, TP18 5000 Test Point, Red, Thru Hole Color Keyed 0.100 x 0.100 inch 5000 Keystone 3 TP13, TP14, TP15 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone 1 U1 bq51003YFP IC, Wirless Secondary-Side Power Controller DSBGA bq51003YFP TI 5 -- Shunt, 100-mil, Black See note 8 929950-00 3M 1 -- PCB, 2.1" x 2.1" x 0.031" HPA764 Any 1 -- Case Modified Polycase LP-11B with 4 screws--See note 7 J-6838A Polycase 1 -- Coil, RX with Attractor IWAS-4832FF-50, WR-48325015M2-G, 760308201 Vishay, TDK, Wyrth 1 1 Tape segment, Low Static Polyimide Film - See note 6. 1.5" x 2.3" 5419-1 1/2" 3M Thermal Label See note 9 THT-53-423-3 Brady Label Label Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed. 2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. 3. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. 5. Tape "Coil, RX" into bottom of case, centered, coil side down, lead wires passing through milled groove. 6. Used to secure RX coil to case. Cut tape section from 36 yard roll identified in part number field. 7. Install PCB in Case using screws provided with case 8. Install Shunts on: spaceJP6: between ILIM and FIX spaceJP5: (Only for HPA764-002) between two ends spaceJP4: between Pull-up and Vz spaceJP3: between TS and DIS spaceJP2: between EN2 and LOW spaceJP1: (Only for HPA764-001, 003, 005, & 006) between EN1/TERM and LOW 9. Install label on back of PCB near J6 on the top edge of the PCB after final wash (box). Text shall be 8 pt font or lower. Text shall be per Assembly Labels Table. The ref designators should not be hidden by the label. Assembly Labels Table Assembly Number Text HPA764-006 bq51003EVM-764 SLUUAU8 – November 2013 Submit Documentation Feedback bq51003-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 17 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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