www.ti.com
Table of Contents
User’s Guide
BQ77207 Evaluation Module
ABSTRACT
The BQ77207EVM evaluation module (EVM) is a complete evaluation system for the BQ77207, a 3-series to
7-series cell Li-Ion battery protection integrated circuit. The EVM consists of a BQ77207 circuit module which
is used for simple evaluation of the BQ77207 protection function. The circuit module includes one BQ77207
integrated circuit (IC), thermistor, and all other onboard components necessary to signal the condition from
overcharge, overdischarge, and overtemperature in a 7-series cell Li-Ion or Li-Polymer battery pack. The circuit
module connects directly across the cells in a battery, or can be connected with a power supply and the included
cell simulator resistors.
space
Table of Contents
1 Features...................................................................................................................................................................................3
1.1 Kit Contents........................................................................................................................................................................3
1.2 Ordering Information.......................................................................................................................................................... 3
1.3 BQ77207 Circuit Module Performance Specification Summary.........................................................................................3
1.4 Required Equipment.......................................................................................................................................................... 3
2 BQ77207 EVM Getting Started Guide....................................................................................................................................4
2.1 Before You Begin............................................................................................................................................................... 4
2.2 Warnings and Cautions...................................................................................................................................................... 4
2.3 Quick Start..........................................................................................................................................................................4
3 BQ77207 Circuit Module Use.................................................................................................................................................6
3.1 Cell Simulator.....................................................................................................................................................................6
3.2 Reducing the Cell Count.................................................................................................................................................... 6
3.3 Connecting Cells................................................................................................................................................................ 6
3.4 Hardware Configuration..................................................................................................................................................... 7
4 BQ77207EVM Circuit Module Physical Construction..........................................................................................................8
4.1 Board Layout......................................................................................................................................................................8
4.2 Bill of Materials.................................................................................................................................................................10
4.3 Schematics....................................................................................................................................................................... 11
5 Related Documents from Texas Instruments.....................................................................................................................13
6 Revision History................................................................................................................................................................... 13
List of Figures
Figure 2-1. EVM Connection for Basic Operation........................................................................................................................5
Figure 4-1. Top Silk Screen......................................................................................................................................................... 8
Figure 4-2. Top Assembly............................................................................................................................................................ 8
Figure 4-3. Top Layer...................................................................................................................................................................8
Figure 4-4. Bottom Layer............................................................................................................................................................. 9
Figure 4-5. Bottom Silk Screen....................................................................................................................................................9
Figure 4-6. Bottom Assembly...................................................................................................................................................... 9
Figure 4-7. Schematic Diagram................................................................................................................................................. 11
Figure 4-8. Cell Simulator.......................................................................................................................................................... 12
List of Tables
Table 1-1. Ordering Information................................................................................................................................................... 3
Table 1-2. Performance Specification Summary..........................................................................................................................3
Table 3-1. Reducing Cell Count................................................................................................................................................... 6
Table 4-1. BQ77207 Circuit Module Bill of Materials................................................................................................................. 10
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
1
Trademarks
www.ti.com
Trademarks
All trademarks are the property of their respective owners.
2
BQ77207 Evaluation Module
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
Features
1 Features
•
•
•
Complete evaluation system for the BQ77207 3-series to 7-series cell Li-Ion and Phosphate battery protector
Populated circuit module for 7-cell configuration for quick setup
Resistor cell simulator for quick setup with only a power supply
1.1 Kit Contents
•
BQ77207 circuit module
1.2 Ordering Information
For complete ordering information, refer to the product folder at www.ti.com/tool/BQ77207EVM.
Table 1-1. Ordering Information
EVM Part Number
Chemistry
Configuration
Capacity
BQ77207EVM
Li-Ion
7 cells
Any
Note
Capacity is shown as Any since the board does not control current. If making additional connections
monitor board currents and temperatures to operate within the limits of the components and laboratory
environment. Refer to the physical construction section for board details.
1.3 BQ77207 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the BQ77207 circuit module in its default 7-series cell
configuration.
Typical voltage depends on the number of cells configured. The board does not control current. If populating
additional components limit currents to appropriate levels.
Table 1-2. Performance Specification Summary
Specification
Min
Typ
Max
Input voltage BATT+ with respect to BATT–
5
–
35
V
Continuous current
0
-
1
A
20
25
30
°C
Operating temperature range
Unit
1.4 Required Equipment
The following equipment is required to operate the BQ77207 EVM in a simple demonstration:
•
•
•
DC power supply, 0 V to 32 V at 250 mA
DC voltmeter
Test leads to connect equipment
Additional equipment may be desired to operate the BQ77207 with a more extensive demonstration.
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
3
BQ77207 EVM Getting Started Guide
www.ti.com
2 BQ77207 EVM Getting Started Guide
2.1 Before You Begin
The following warnings and cautions are noted for the safety of anyone using or working close to the
BQ77207EVM. Observe all safety precautions.
2.2 Warnings and Cautions
CAUTION
The BQ77207 does not limit performance to the ratings of the EVM. Set equipment appropriately to
limit voltage and current for safe operation.
CAUTION
The circuit module has signal traces, components, and component leads on the bottom of the board.
This may result in exposed voltages, warm surfaces, or sharp edges. Do not reach under the board
during operation.
2.3 Quick Start
The BQ77207 installed on the board will output DOUT and/or COUT high during faults as described in the
BQ77207 data sheet.
The BQ77207 is configured for cell count by the connections on the board. By default the board is set up for
seven cells and this quick start is for all seven cells. When fewer cells are used, refer to Section 3 and adjust the
supply voltage appropriately.
These steps describe quick connection of the BQ77207 EVM to demonstrate operation of the protector function
of the EVM. For more detailed descriptions, refer to other sections of the user guide.
Refer to Figure 2-1 for the following steps:
1. Install the cell simulator shunts on J4 and the power supply shunt on J3.
2. Connect a 0-V DC power supply capable of approximately 250 mA between the “BAT-” and "BAT+" terminals
and adjust to approximately 22 V.
3. Connect a meter to a VSS test point and monitor the COUT or DOUT test points, or the corresponding
signals at J2 terminals 2 or 3.
4. With nominal conditions observe that both COUT (J2 pin 2) and DOUT (J2 pin 3) are low, approximately 0 V.
5. Demonstrate an open-wire condition:
a. Remove the cell simulator shunt for cell 2, J4 pins 11 and 12.
b. Observe the COUT and DOUT signals go to approximately 7 V after 4.5 seconds.
c. Install the cell 2 cell simulator shunt at J4 pins 11 and 12.
6. Demonstrate an overvoltage condition:
a. Adjust the supply voltage to approximately 32 V.
b. Observe the COUT transitions to approximately 7 V after 1 second.
c. Confirm DOUT is low if desired.
d. Adjust the supply voltage to approximately 22 V.
7. Demonstrate an undervoltage condition:
a. Adjust the supply voltage to approximately 12 V.
b. Observe DOUT transitions to approximately 7 V after 1 second.
c. Observe COUT is low if desired.
d. Adjust the supply voltage to approximately 22 V.
8. Make other adjustments as desired for evaluation. See other sections of this user guide for details of
operation.
9. When complete with this quick start demonstration, turn off the power supply.
Refer to other sections of this user guide for additional details.
4
BQ77207 Evaluation Module
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
BQ77207 EVM Getting Started Guide
Connect as
needed for
evaluation
DC Power Supply
+ -
DMM
+ -
Figure 2-1. EVM Connection for Basic Operation
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
5
BQ77207 Circuit Module Use
www.ti.com
3 BQ77207 Circuit Module Use
The BQ77207 circuit module contains the BQ77207 IC and related circuitry to demonstrate the features of
the IC. The board does not control current, the COUT and DOUT signals pass directly to the J2 connector.
J2 has no current limit or ESD protection on the signals, provide any necessary protection during evaluation
external to the EVM. J3 provides a method to separate the supply feed from the input terminal block to measure
current or to apply a voltage for customer test mode. A thermistor provides temperature sensing on the board.
Other components provide support for the IC and connections to the board. Basic operation is described in the
BQ77207 EVM Getting Started Guide section. For details of the circuit, refer to the BQ77207EVM Circuit Module
Physical Construction section.
3.1 Cell Simulator
The EVM includes a resistive cell simulator made up of 499-Ω series resistors. The taps of the resistor network
are connected to the cell inputs using shunts on the J4 header. BAT- is always connected to the resistor divider
network. Install a shunt on the top cell location to connect BAT+ to the resistor divider to provide simulated
voltages for the other cell inputs. With the top shunt installed the resistor divider is connected and shunts on the
lower cell positions connect the inputs to the simulated voltages. With the top shunt removed all lower inputs
with installed shunts are pulled to VSS. There is no indication of the cell simulator connection, the user must be
aware of the shunt installation. The 499-Ω resistors provide a load of 2 mA per volt on each cell.
3.2 Reducing the Cell Count
The BQ77207 cell count is reduced by shorting unused cells, normally from the top down but cells between the
top and bottom may be shorted. The inputs are usually shorted at the IC as shown in the data sheet. The bottom
cell must be used for proper operation. Power for the IC comes from the BAT+ terminal so it must be connected
when using the EVM. While not recommended the inputs of the EVM can typically be shorted at the terminal
block for quick evaluation. For the best transient environment and to match the data sheet example, short the
VCx pins at the capacitor and remove the unused input resistor. When using the cell simulator, shorting the
unused cell at the terminal block is still required to eliminate the simulated cell voltage. Shorting the cell inputs
at the terminal block screw terminals is also suggested since it should be apparent if the board is reused for a
different cell count. While different connections are possible, Table 3-1 shows configuration recommendations for
five cells.
Table 3-1. Reducing Cell Count
Unused Cell
(Numbered from Bottom
Cell 1)
Short Cell Input
Terminals
Input Resistor to
Remove
Replace Capacitor with
0Ω
IC Inputs Shorted
Cell 7
BAT+ to CELL6
R2
C2
VC7 to VC6
Cell 6
CELL6 to CELL5
R3
C3
VC6 to VC5
3.3 Connecting Cells
The EVM is constructed with a single connection to the top and bottom of the cell stack. Cell voltage for these
cells is sensed on the board. The board is not configured to control current into or out of the cells.
The cell simulator provides resistors between the cell inputs. When the cell simulator shunts are installed, these
resistors will load the cells and divide the voltage to any unconnected inputs as cells are connected. The shunts
must be removed or the cells will be discharged by the constant drain of the cell simulator resistors.
BAT- is the reference voltage for the IC and should be connected first. After BAT-, cells may be connected
in any order. Cell connection from the bottom up minimizes the voltage step size applied to the board. The
recommended connection sequence for the EVM when connecting cells is bottom up:
1. Connect BAT–
2. Connect cells bottom up; CELL1, CELL2, CELL3 ...
3. Ensure the cell simulator shunts are removed
6
BQ77207 Evaluation Module
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
BQ77207 Circuit Module Use
3.4 Hardware Configuration
3.4.1 Unused Components
The EVM contains a few component patterns which are not used. RT1 is installed as the thermistor. If RT1 is
removed, an alternate may be installed at the R9 pattern or a through-hole thermistor may be installed at RT2.
With an appropriate part a suitable PTC could be installed at either pattern. See the schematic in Figure 4-7.
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
7
BQ77207EVM Circuit Module Physical Construction
www.ti.com
4 BQ77207EVM Circuit Module Physical Construction
This section contains the PCB layout, bill of materials, and schematic of the BQ77207EVM circuit module.
The BQ77207EVM consists of one circuit module assembly, BMS055.
4.1 Board Layout
The BQ77207EVM circuit module is a 2.2-inch × 2.2-inch 2-layer circuit card assembly. It is designed for easy
assembly with cell connections on the left edge to a terminal block. Output terminals are on the right edge using
a header. The EVM layout and construction allows easy understanding of the connections and access to the test
points for evaluation.
See additional information in the configuration and operation sections of this document. Figure 4-1 to Figure 4-6
show the board layout.
Figure 4-1. Top Silk Screen
Figure 4-2. Top Assembly
Figure 4-3. Top Layer
8
BQ77207 Evaluation Module
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
BQ77207EVM Circuit Module Physical Construction
Figure 4-4. Bottom Layer
Figure 4-5. Bottom Silk Screen
Figure 4-6. Bottom Assembly
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
9
BQ77207EVM Circuit Module Physical Construction
www.ti.com
4.2 Bill of Materials
The bill of materials for the circuit module is shown in Table 4-1. Substitute parts may be used in the manufacturing of the assembly.
Table 4-1. BQ77207 Circuit Module Bill of Materials
Designator
Quantity
!PCB1
Value
1
Part Number
Manufacturer
Description
Package Reference
BMS055
Any
Printed Circuit Board
603
GCJ188R72A104KA01D
MuRata
C1
1
0.1uF
CAP, CERM, 0.1 uF, 100
V,+/- 10%, X7R, AECQ200 Grade 1, 0603
C2, C3, C4, C5, C6, C7,
C8
7
0.1uF
CAP, CERM, 0.1 uF, 50 V, 603
+/- 10%, X7R, 0603
8.85012E+11
Wurth Elektronik
H1, H2, H3, H4
4
Bumpon, Hemisphere,
0.44 X 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1
1
Terminal Block, 8x1,
3.5mm, TH
8x1 Terminal Block
OSTTE080161
On-Shore Technology
J2
1
Header, 100mil, 3x1, Tin,
TH
Header, 3 PIN, 100mil,
Tin
PEC03SAAN
Sullins Connector
Solutions
J3
1
Header, 100mil, 2x1, Tin,
TH
Header, 2 PIN, 100mil,
Tin
PEC02SAAN
Sullins Connector
Solutions
J4
1
Header, 100mil, 7x2, Tin,
TH
Header, 7x2, 100mil, Tin
PEC07DAAN
Sullins Connector
Solutions
R1
1
300
RES, 300, 5%, 0.1 W,
603
AEC-Q200 Grade 0, 0603
CRCW0603300RJNEA
Vishay-Dale
R2, R3, R4, R5, R6, R7,
R8
7
1.0k
RES, 1.0 k, 5%, 0.1 W,
603
AEC-Q200 Grade 0, 0603
CRCW06031K00JNEA
Vishay-Dale
R10, R11, R12, R13,
R14, R15, R16
7
499
RES, 499, 1%, 0.25 W,
1206
AEC-Q200 Grade 0, 1206
ERJ-8ENF4990V
Panasonic
RT1
1
10k
Thermistor NTC, 10.0k
ohm, 1%, 0402
402
NCP15XH103F03RC
MuRata
SH-J1, SH-J2, SH-J3,
SH-J4, SH-J5, SH-J6,
SH-J7, SH-J8
8
1x2
Shunt, 100mil, Gold
plated, Black
Shunt
SNT-100-BK-G
Samtec
TP1
1
Test Point, Multipurpose,
Red, TH
Red Multipurpose
Testpoint
5010
Keystone
TP6, TP7, TP8, TP9,
TP10
5
Test Point, Multipurpose,
Black, TH
Black Multipurpose
Testpoint
5011
Keystone
10
BQ77207 Evaluation Module
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
BQ77207EVM Circuit Module Physical Construction
Table 4-1. BQ77207 Circuit Module Bill of Materials (continued)
Designator
Quantity
Value
Part Number
Manufacturer
Description
Package Reference
U1
1
Voltage and Temperature WSON12
Protection for 3-Series
to 7-Series Cell Li-Ion
Batteries with Internal
Delay Timer
BQ7720700DSSR
Texas Instruments
FID1, FID2, FID3
0
Fiducial mark. There is
nothing to buy or mount.
N/A
N/A
N/A
R9
0
1kΩ
THERMISTOR PTC 1K
OHM 5% 0402
402
PRF15AR102RB6RC
Murata
RT2
0
10k
Thermistor NTC, 10.0k
Disc, 5x8.4 mm
ohm, 1%, Disc, 5x8.4 mm
103AT-2
SEMITEC Corporation
4.3 Schematics
Figure 4-7 and Figure 4-8 illustrate the schematics.
J3
TP1
BAT+
POWER
TP2
R1
J1
BAT+
6P
5P
VDD
300
1
2
3
4
5
6
7
8
7P
R2
C1
0.1uF
1.0k
6P
C2
0.1uF
R3
VSS
1.0k
5P
C3
0.1uF
R4
1.0k
4P
C4
0.1uF
R5
1.0k
3P
C5
0.1uF
R6
C6
0.1uF
R7
1.0k
1P
1
C7
0.1uF
R8
TP6
1.0k
C8
0.1uF
BAT-
VC7
2
3
VC5
4
VC4
5
VC3
6
VC2
7
TP7
TP8
VSS
TP9
VSS
VC1
TP10
VSS
VSS
8
VDD
DOUT
COUT
V7
TS
11
DOUT
10
COUT
12
TS
TP4
COUT
TP5
DOUT
V6
R9
V5
V4
RT1
10k
t°
VC6
VSS
NT1
Net-Tie
TP3
TS
U1
1.0k
2P
t°
Input
35V 1A max
RT2
J2
3
2
1
V3
V2
EP
V1
VSS
13
VSS
VSS
VSS
DOUT
COUT
GND
9
BQ7720700DSSR
VSS
VSS
VSS
VSS
VSS
VSS
VSS
Figure 4-7. Schematic Diagram
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
11
BQ77207EVM Circuit Module Physical Construction
www.ti.com
R10
499
Cell Simulator - Populate
shunts to use cell simulator
if not connecting a battery.
R11
499
R12
499
R13
499
J4
7P
6P
5P
4P
3P
2P
1P
1
3
5
7
9
11
13
2
4
6
8
10
12
14
R14
499
R15
499
R16
499
BAT-
Figure 4-8. Cell Simulator
12
BQ77207 Evaluation Module
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
Related Documents from Texas Instruments
5 Related Documents from Texas Instruments
•
Texas Instruments, BQ77207 Voltage and Temperature Protection for 3-Series to 7-Series Cell Li-Ion Batt w/
Int Delay Timer data sheet
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
October 2021
*
Initial Release
SLUUCI0 – OCTOBER 2021
Submit Document Feedback
BQ77207 Evaluation Module
Copyright © 2021 Texas Instruments Incorporated
13
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
