Table of Contents
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User’s Guide
BQ77216 Evaluation Module
Willy Massoth
ABSTRACT
The BQ77216EVM evaluation module (EVM) is a complete evaluation system for the BQ77216, a 3-cell to 16cell Li-Ion battery protection integrated circuit. The EVM consists of a BQ77216 circuit module which is used for
simple evaluation of the BQ77216 protection function. The circuit module includes one BQ77216 integrated
circuit (IC), thermistor, and all other onboard components necessary to signal the condition from overcharge,
overdischarge, and overtemperature in a 16-series cell Li-Ion or Li-Polymer battery pack. The circuit module
connects directly across the cells in a battery, or can be connected with a power supply and the included cell
simulator resistors.
space
Table of Contents
1 Features...................................................................................................................................................................................3
1.1 Kit Contents........................................................................................................................................................................3
1.2 Ordering Information.......................................................................................................................................................... 3
1.3 BQ77216 Circuit Module Performance Specification Summary.........................................................................................3
1.4 Required Equipment.......................................................................................................................................................... 3
2 BQ77216 EVM Getting Started Guide....................................................................................................................................4
2.1 Before You Begin............................................................................................................................................................... 4
2.2 Warnings and Cautions...................................................................................................................................................... 4
2.3 Quick Start..........................................................................................................................................................................4
3 BQ77216 Circuit Module Use.................................................................................................................................................6
3.1 Cell Simulator.....................................................................................................................................................................6
3.2 Reducing the Cell Count.................................................................................................................................................... 6
3.3 Connecting Cells................................................................................................................................................................ 6
3.4 Hardware Configuration..................................................................................................................................................... 7
4 BQ77216EVM Circuit Module Physical Construction..........................................................................................................8
4.1 Board Layout......................................................................................................................................................................8
4.2 Bill of Materials.................................................................................................................................................................12
4.3 Schematics.......................................................................................................................................................................13
5 Related Documents from Texas Instruments.....................................................................................................................16
6 Revision History................................................................................................................................................................... 16
List of Figures
Figure 2-1. EVM Connection for Basic Operation........................................................................................................................5
Figure 4-1. Top Silk Screen......................................................................................................................................................... 8
Figure 4-2. Top Assembly............................................................................................................................................................ 9
Figure 4-3. Top Layer...................................................................................................................................................................9
Figure 4-4. Bottom Layer........................................................................................................................................................... 10
Figure 4-5. Bottom Silk Screen..................................................................................................................................................10
Figure 4-6. Bottom Assembly.....................................................................................................................................................11
Figure 4-7. Schematic Diagram................................................................................................................................................. 14
Figure 4-8. Cell Simulator.......................................................................................................................................................... 15
List of Tables
Table 1-1. Ordering Information................................................................................................................................................... 3
Table 1-2. Performance Specification Summary..........................................................................................................................3
Table 3-1. Reducing Cell Count................................................................................................................................................... 6
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Trademarks
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Table 4-1. BQ77216 Circuit Module Bill of Materials................................................................................................................. 12
Trademarks
All trademarks are the property of their respective owners.
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Features
1 Features
•
•
•
Complete evaluation system for the BQ77216 3-cell to 16-cell Li-Ion and Phosphate battery protector
Populated circuit module for 16-cell configuration for quick setup
Resistor cell simulator for quick setup with only a power supply
1.1 Kit Contents
•
BQ77216 circuit module
1.2 Ordering Information
For complete ordering information, refer to the product folder at www.ti.com/tool/BQ77216EVM.
Table 1-1. Ordering Information
EVM Part Number
Chemistry
Configuration
Capacity
BQ77216EVM
Li-Ion
16 cells
Any
Note
Capacity is shown as Any since the board does not control current as delivered. If using available
component patterns monitor board currents and temperatures to operate within the limits of the
components and laboratory environment. Refer to the physical construction section for board details.
1.3 BQ77216 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the BQ77216 circuit module in its default 16-cell
series FET configuration.
Typical voltage depends on the number of cells configured. The board does not control current. If populating
additional components limit currents to appropriate levels.
Table 1-2. Performance Specification Summary
Specification
Min
Typ
Max
Input voltage BATT+ with respect to BATT–
5
–
71
V
Continuous current
0
-
1
A
20
25
30
°C
Operating temperature range
Unit
1.4 Required Equipment
The following equipment is required to operate the BQ77216 EVM in a simple demonstration:
•
•
•
DC power supply, 0–71 V at 1 A
DC voltmeter
Test leads to connect equipment
Additional equipment may be desired to operate the BQ77216 with a more extensive demonstration.
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BQ77216 EVM Getting Started Guide
2 BQ77216 EVM Getting Started Guide
2.1 Before You Begin
The following warnings and cautions are noted for the safety of anyone using or working close to the BQ77216
EVM. Observe all safety precautions.
2.2 Warnings and Cautions
Warning
The BQ77216EVM is not rated as a high voltage EVM, has smaller clearances
than normally used on high voltage boards and does not have an isolation
boundary. If you apply high voltage to this board, all terminals should be
considered high voltage. Electric shock is possible when connecting the board to
live wire. The board should be handled with care by a professional. For safety, use
of isolated test equipment with overvoltage and overcurrent protection is highly
recommended.
Caution
Do not leave the EVM powered when unattended.
!
CAUTION
The BQ77216 does not limit performance to the ratings of the EVM. Set equipment appropriately to
limit voltage and current for safe operation.
CAUTION
The circuit module has signal traces, components, and component leads on the bottom of the board.
This may result in exposed voltages, hot surfaces or sharp edges. Do not reach under the board
during operation.
CAUTION
The circuit module may be damaged by over temperature. To avoid damage, monitor the
temperature during evaluation and provide cooling, as needed, for your system environment. Do not
operate beyond the current and voltage limits in the Sepcification Table.
CAUTION
Some power supplies can be damaged by application of external voltages. If using more than 1
power supply, check your equipment requirements and use blocking diodes or other isolation
techniques, as needed, to prevent damage to your equipment.
CAUTION
Connections for rated current must be made at the terminal block. Test points are not rated for the
board current.
2.3 Quick Start
The BQ77216 is configured for cell count by the connections on the board. By default the board is set up for 16
cells and this quick start is for all 16 cells. When fewer cells are used, refer to Section 3 and adjust the supply
voltage appropriately.
These steps describe quick connection of the BQ77216 EVM to demonstrate operation of the protector function
the EVM. For more detailed descriptions, refer to other sections of the user guide.
Refer to Figure 2-1 for the following steps.
1. Install the cell simulator shunts.
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2. Connect a 0-V DC power supply capable of 250 mA minimum between the “BAT-” and "BAT+" terminals and
adjust to approximately 45 V.
3. Connect a meter to a VSS test point and monitor the COUT or DOUT test points, or the corresponding
signals at J4 terminals 4 or 5.
4. Observe that both the COUT (J4 pin 4) and DOUT (J4 pin 5) are low, approximately 0 V.
5. Remove the cell simulator shunt for cell 2, J6 pins 17 and 18.
6. Observe the COUT and DOUT signals are low.
7. Install the cell 2 cell simulator shunt at J6 pins 17 and 18.
8. Adjust the supply voltage to approximately 71 V. Observe the COUT transitions to approximately 7 V after 4
seconds. Confirm DOUT remains low if desired.
9. Adjust the supply voltage to approximately 31 V. Observe DOUT is approximately 7 V after 4 seconds as the
part transitions to UV mode. Observe COUT is low if desired.
10.Make other adjustments as desired for evaluation. See other sections of this user guide for details of
operation.
11. When complete with this quick start demonstration, turn off the power supply.
Refer to other sections of this user guide for additional details.
DC Power Supply
+ -
Connect as
needed for
evaluation
DMM
+ -
Figure 2-1. EVM Connection for Basic Operation
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BQ77216 Circuit Module Use
3 BQ77216 Circuit Module Use
The BQ77216 circuit module contains the BQ77216 IC and related circuitry to demonstrate the features of the
IC. The board does not control current, the COUT and DOUT signals pass through 100 ohm resistors and are
available on the J4 connector. COUT and DOUT are also used to control the gate of N-channel FETs, the open
drain outputs are also available on J4. A thermistor provides temperature sensing on the board. Other
components provide support for the IC and connections to the board. Basic operation is described in the
BQ77216 EVM Getting Started Guide section. For details of the circuit, refer to the BQ77216EVM Circuit Module
Physical Construction section.
3.1 Cell Simulator
The EVM includes a resistive cell simulator made up of 499-Ω series resistors. The taps of the resistor network
are connected to the cell inputs using shunts on the J5 and J6 headers. BAT- is always connected to the resistor
divider network. Install a shunt on the top cell location to connect the BAT+ to the resistor divider to provide
simulated voltages for the other cell inputs. With the top shunt installed the resistor divider is connected and
shunts on the lower cell positions will connect the inputs to the simulated voltages. With the top shunt removed
all lower inputs with installed shunts are pulled to VSS. There is no indication of the cell simulator connection,
the user must be aware of the shunt installation. The 499-Ω resistors provide a load of 2 mA per volt on each
cell.
3.2 Reducing the Cell Count
The BQ77216 cell count is reduced by shorting unused cells, normally from the top down but cells between the
top and bottom may be shorted. The inputs are usually shorted at the IC as shown in the data sheet. The bottom
cell must be used for proper operation. Power for the IC comes from the BAT+ terminal so it must be connected
when using the EVM. While not recommended the inputs of the EVM can typically be shorted at the terminal
block for quick evaluation. For the best transient environment and to match the data sheet example, short the
VCx pins at the capacitor and remove the unused input resistor. When using the cell simulator, shorting the
unused cell at the terminal block is still required to eliminate the simulated cell voltage. Shorting the cell inputs at
the terminal block screw terminals is also suggested since it should be apparent if the board is re-used for a
different cell count. While different connections are possible, Table 3-1 shows configuration recommendations for
14 cells.
Table 3-1. Reducing Cell Count
Unused Cell
(Numbered from Bottom
Cell 1)
Short Cell Input
Terminals
Input Resistor to
Remove
Replace Capacitor
with 0 ohm
IC Inputs Shorted
Cell 16
BAT+ to CELL15
Cell 15
CELL15 to CELL14
R2
C2
VC16 to VC15
R3
C3
VC15 to VC14
3.3 Connecting Cells
The EVM is constructed with a single connection to the top and bottom of the cell stack. Cell voltage for these
cells is sensed on the board. The board is not configured to control current into or out of the cells.
The cell simulator provides resistors between the cell inputs. When the cell simulator shunts are installed, these
resistors will load the cells and divide the voltage to any unconnected inputs as cells are connected. The shunts
must be removed or the cells will be discharged by the constant drain of the cell simulator resistors.
BAT- is the reference voltage for the IC and should be connected first. After BAT- cells may be connected in any
order. Cell connection from the bottom up minimizes the voltage step size applied to the board. Recommended
connection sequence for the EVM when connecting cells is bottom up:
1. Connect BAT–
2. Connect cells bottom up; CELL1, CELL2, CELL3 ...
3. Be sure the cell simulator shunts are removed
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3.4 Hardware Configuration
3.4.1 Unused Components
The EVM contains several component patterns which are not used. Components could be populated to divide
the voltage to the J4 output connector or limit the voltage to the signal FETs. Adjustments to installed resistors
may be needed to divide voltages. If using these patterns for evaluation monitor the temperature of the board
and limit current as needed. See the schematic in Figure 4-7.
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BQ77216EVM Circuit Module Physical Construction
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4 BQ77216EVM Circuit Module Physical Construction
This section contains the PCB layout, bill of materials, and schematic of the BQ77216EVM circuit module.
The BQ77216EVM consists of one circuit module assembly, BMS038.
4.1 Board Layout
The BQ77216EVM circuit module is a 3.0-inch × 3.6-inch 2-layer circuit card assembly. It is designed for easy
assembly with cell connections on the left edge to a terminal block. Output terminals are on the right edge using
a header. The EVM layout and construction allows easy understanding of the connections and access to the test
points for evaluation.
See additional information in the configuration and operation sections of this document. Figure 4-1 to Figure 4-6
show the board layout.
Figure 4-1. Top Silk Screen
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Figure 4-2. Top Assembly
Figure 4-3. Top Layer
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Figure 4-4. Bottom Layer
Figure 4-5. Bottom Silk Screen
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Figure 4-6. Bottom Assembly
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4.2 Bill of Materials
The bill of materials for the circuit module is shown in Table 4-1. Substitute parts may be used in the manufacturing of the assembly.
Table 4-1. BQ77216 Circuit Module Bill of Materials
Designator
Quantity
!PCB1
Value
1
PartNumber
Manufacturer
Description
BMS038
Any
Printed Circuit Board
PackageReference
C1
1
0.1uF
GCJ188R72A104KA01D
MuRata
CAP, CERM, 0.1 uF, 100
V,+/- 10%, X7R, AECQ200 Grade 1, 0603
C2, C3, C4, C5, C6, C7,
C8, C9, C10, C11, C12,
C13, C14, C15, C16, C17
16
0.1uF
885012206095
Wurth Elektronik
CAP, CERM, 0.1 uF, 50 V,
603
+/- 10%, X7R, 0603
H1, H2, H3, H4
4
SJ-5303 (CLEAR)
3M
Bumpon, Hemisphere,
0.44 X 0.20, Clear
Transparent Bumpon
J1, J3
2
OSTTE060161
On Shore Technology
TERM BLOCK 3.5MM
VERT 6POS PCB
HDR6
J2
1
OSTTE050161
On Shore Technology
TERM BLOCK 3.5MM
VERT 5POS PCB
HDR5
J4
1
PEC05SAAN
Sullins Connector
Solutions
Header, 2.54mm, 5x1,
Tin, TH
Header, 2.54mm, 5x1, TH
J5
1
PEC06DAAN
Sullins Connector
Solutions
Header, 100mil, 6x2, Tin,
TH
Header, 6x2, 100mil, Tin
J6
1
PEC10DAAN
Sullins Connector
Solutions
Header, 2.54mm, 10x2,
Tin, TH
Header, 10x2, 2.54mm,
TH
Q1, Q2
2
100V
FDT86113LZ
Fairchild Semiconductor
MOSFET, N-CH, 100 V,
3.3 A, SOT-223
SOT-223
R1
1
300
CRCW0603300RJNEA
Vishay-Dale
RES, 300, 5%, 0.1 W,
603
AEC-Q200 Grade 0, 0603
R2, R3, R4, R5, R6, R7,
R8, R9, R10, R11, R12,
R14, R15, R17, R20, R21
16
1.0k
CRCW06031K00JNEA
Vishay-Dale
RES, 1.0 k, 5%, 0.1 W,
603
AEC-Q200 Grade 0, 0603
R13, R16, R18, R19
4
100
CRCW0603100RJNEA
Vishay-Dale
RES, 100, 5%, 0.1 W,
603
AEC-Q200 Grade 0, 0603
R26, R27, R28, R29,
R30, R31, R32, R33,
R34, R35, R36, R37,
R38, R39, R40, R41
16
499
ERJ-8ENF4990V
Panasonic
RES, 499, 1%, 0.25 W,
1206
AEC-Q200 Grade 0, 1206
RT1
1
10k
103AT-2
SEMITEC Corporation
Thermistor NTC, 10.0k
Disc, 5x8.4 mm
ohm, 1%, Disc, 5x8.4 mm
12
BQ77216 Evaluation Module
603
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Table 4-1. BQ77216 Circuit Module Bill of Materials (continued)
Designator
Quantity
SH-J1, SH-J2, SH-J3,
SH-J4, SH-J5, SH-J6,
SH-J7, SH-J8, SH-J9,
SH-J10, SH-J11, SH-J12,
SH-J13, SH-J14, SH-J15,
SH-J16
16
TP7, TP8, TP9, TP10
4
U1
Value
PartNumber
Manufacturer
Description
PackageReference
1x2
SNT-100-BK-G
Samtec
Shunt, 100mil, Gold
plated, Black
Shunt
5006
Keystone
Test Point, Compact,
Black, TH
Black Compact Testpoint
Texas Instruments
Voltage and Temperature
Protection for 3-Series to
TSSOP24
16-Series Cell Li-Ion
Batteries with Internal
Delay Timer
1
BQ7721602PWR
4.3 Schematics
Figure 4-7 and Figure 4-8 illustrate the schematics.
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BQ77216EVM Circuit Module Physical Construction
Input
71V 1A max
J1
16P
15P
14P
13P
12P
11P
1
1
2
2
3
3
4
4
5
5
6
6
TP1
BAT+
R1
300
VDD
16P
R2
C2
0.1uF
R3
VSS
1.0k
C3
0.1uF
R4
1.0k
13P
C4
0.1uF
R5
1.0k
12P
C5
0.1uF
R6
1.0k
11P
J2
9P
8P
7P
6P
1
2
2
3
3
4
5
C6
0.1uF
R7
1.0k
1
10P
C7
0.1uF
R8
1.0k
9P
C8
0.1uF
R9
8P
C9
0.1uF
R10
5
1.0k
7P
6P
5P
4P
3P
2P
1P
1N
C11
0.1uF
R12
1.0k
1
1
2
2
3
3
4
4
5P
C12
0.1uF
R14
1.0k
4P
C13
0.1uF
R15
1.0k
5
5
6
6
3P
C14
0.1uF
R17
1.0k
2P
C15
0.1uF
R20
1.0k
1P
C16
0.1uF
R21
TP6
2
C10
0.1uF
R11
1.0k
J3
1.0k
C17
0.1uF
BAT-
VC16
3
VC15
4
VC14
5
VC13
6
VC12
7
VC11
8
VC10
9
VC9
10
VC8
11
VC7
12
VC6
13
VC5
14
VC4
17
VC3
18
VC2
19
VC1
20
VSS
NT1
Net-Tie
TP7
TP8
VSS
TP9
TP10
VSS
VSS
VSS
VSS
VSS
TP3
TS
U1
1.0k
4
TP2
VDD
C1
0.1uF
1.0k
15P
14P
10P
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VDD
DOUT
COUT
V16
TS
23
DOUT
22
COUT
24
TS
TP4
COUT
TP5
DOUT
V15
RT1
V14
R13
DO
100
V13
V12
R16
VSS
100
V11
V10
R18
100
V9
R19
100
J4
CO
DO
CO
DFETD
CFETD
GND
DFETD
CFETD
Q1
1
V8
VSS
V7
Q2
1
V6
V5
D1
V4
V3
V2
NC
NC
NC
V1
VSS
13V
1
15
16
R22
1.0M
D2
R23
1.0M
R24
1.0M
R25
1.0M
13V
VSS
VSS
21
BQ7721602PWR
VSS
VSS
VSS
VSS
Figure 4-7. Schematic Diagram
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BQ77216EVM Circuit Module Physical Construction
R26
499
R27
499
R28
499
R29
499
J5
16P
15P
14P
13P
12P
11P
1
3
5
7
9
11
2
4
6
8
10
12
R30
499
R31
499
R32
499
R33
499
R34
499
R35
499
Cell Simulator - Populate
shunts to use cell simulator
if not connecting a battery.
R36
499
R37
499
J6
10P
9P
8P
7P
6P
5P
4P
3P
2P
1P
1
3
5
7
9
11
13
15
17
19
R38
499
2
4
6
8
10
12
14
16
18
20
R39
499
R40
499
R41
499
BAT-
Figure 4-8. Cell Simulator
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15
Related Documents from Texas Instruments
www.ti.com
5 Related Documents from Texas Instruments
•
Texas Instruments, BQ77216 Voltage and Temperature Protection for 2 to 16-Series Cell Li-Ion Batt w/ Int
Delay Timer data sheet
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (August 2020) to Revision A (November 2020)
Page
• Changed cell simulator component value and current. Changed reference designators throughout document
for revision A of board.........................................................................................................................................6
• Changed board size, layers................................................................................................................................ 8
• Changed component and ref des in Bill of Materials........................................................................................ 12
• Changed schematics........................................................................................................................................ 13
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STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
2
www.ti.com
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
3
www.ti.com
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
4
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
5
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
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