BQ77908AEVM-001

User's Guide SLUU854 – February 2012 bq77908AEVM Evaluation Module The bq77908AEVM-001 evaluation module (EVM) is a complete evaluation system for the bq77908A, a 4-series to 8-series cell Li-Ion battery protection integrated circuit. The EVM consists of a bq77908A circuit module and a resistor cell simulator module, which can be used for simple evaluation of the bq77908A functions. The circuit module includes one bq77908A integrated circuit (IC), sense resistor, power FETs and all other onboard components necessary to protect the cells from overcharge, overdischarge, short circuit, and overcurrent discharge in a 8-series cell Li-Ion or Li-Polymer battery pack. The circuit module connects directly across the cells in a battery. With a compatible interface board and Windows®-based PC software, the user can view the bq77908A registers and program the IC configuration and protection limits. 1 2 3 4 5 6 7 Contents Features ...................................................................................................................... 3 1.1 Kit Contents ......................................................................................................... 3 1.2 Required Equipment ............................................................................................... 3 bq77908A Circuit Module and Interfaces ................................................................................ 3 2.1 Circuit Module Connections ...................................................................................... 3 2.2 Signal Descriptions ................................................................................................ 4 bq77908AEVM Hardware Connection and Operation ................................................................. 5 3.1 Initial Considerations .............................................................................................. 5 3.2 Connecting the Cell Simulator .................................................................................... 6 3.3 Simulated Battery Connection .................................................................................... 6 3.4 Pack Connections .................................................................................................. 6 3.5 Basic Operation .................................................................................................... 7 3.6 Cell Connections ................................................................................................... 8 Software Installation ........................................................................................................ 8 4.1 System Requirements ............................................................................................. 8 4.2 Interface Adapter ................................................................................................... 8 4.3 Installing the bq77908GUI or bq77910GUI Evaluation Software .......................................... 10 Software Operation ........................................................................................................ 10 5.1 Menu Commands ................................................................................................. 12 5.2 Working With Register Values .................................................................................. 14 5.3 Status Section ..................................................................................................... 16 5.4 Basic Operation With Software ................................................................................. 17 5.5 Operation With Other Interfaces or Hosts ..................................................................... 17 Related Documents From Texas Instruments ......................................................................... 18 bq77908AEVM Circuit Description and Configuration ................................................................ 18 7.1 Battery Voltage Clamp ........................................................................................... 18 7.2 Device Power ..................................................................................................... 18 7.3 Cell Monitor Inputs and Configuration ......................................................................... 18 7.4 Ground Connection ............................................................................................... 20 7.5 Current Sense Connections ..................................................................................... 20 7.6 Filter Capacitors .................................................................................................. 20 7.7 FET Circuits ....................................................................................................... 21 7.8 Detection Sensing ................................................................................................ 21 7.9 Output Protection Components ................................................................................. 21 Windows, Microsoft are registered trademarks of Microsoft Corporation. Aardvark is a trademark of Total Phase, Inc. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 1 www.ti.com 8 7.10 Reserved Pins .................................................................................................... 7.11 Flag Outputs ...................................................................................................... 7.12 Thermal Sensor ................................................................................................... 7.13 ZEDE ............................................................................................................... 7.14 Programming Interface .......................................................................................... bq77908A Circuit Module Physical Construction ...................................................................... 8.1 Main Board ........................................................................................................ 8.2 Resistor Cell Simulator .......................................................................................... 22 22 22 22 22 23 23 32 List of Figures 25 ........................................................................................................... Successfully Updated TI USB Interface Adapter ....................................................................... EVM Connection for Communication and Programming ............................................................. GUI With Communication Established .................................................................................. Communication Selection Window ...................................................................................... Commands Without Communication Established ..................................................................... Register Section ........................................................................................................... Status Section.............................................................................................................. Polling Status With Undervoltage Condition ........................................................................... Top Silkscreen ............................................................................................................. Top Assembly .............................................................................................................. Top Layer ................................................................................................................... Layer 2 ...................................................................................................................... Layer 3 ...................................................................................................................... Bottom Layer ............................................................................................................... Bottom Silkscreen ......................................................................................................... Bottom Assembly .......................................................................................................... Schematic Diagram, Sheet 1 of 2 ....................................................................................... Schematic Diagram, Sheet 2 of 2 ....................................................................................... Resistor Simulator Top Silkscreen ...................................................................................... Resistor Simulator Top Layer ............................................................................................ Resistor Simulator Bottom Layer ........................................................................................ Resistor Simulator Top Assembly ....................................................................................... Resistor Simulator Bottom Assembly ................................................................................... Resistor Simulator Schematic Diagram ................................................................................ 1 Ordering Information ........................................................................................................ 3 2 Cell Connections ............................................................................................................ 4 3 PACK Connections ......................................................................................................... 4 4 Programming Interface Connections ..................................................................................... 4 5 Test Header Signals ........................................................................................................ 5 6 Control and Status Connections .......................................................................................... 5 7 Adapter Cable Pinout ..................................................................................................... 10 8 Status Section Indicator Colors .......................................................................................... 16 9 Cell Count Component Configuration ................................................................................... 19 10 bq77908A Circuit Module Bill of Materials ............................................................................. 27 11 Performance Specification Summary ................................................................................... 32 12 Resistor Simulator Bill of Materials ...................................................................................... 36 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Basic EVM Setup 7 9 11 12 13 13 14 16 17 23 24 24 25 25 26 26 27 30 31 32 33 34 35 36 38 List of Tables 2 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback Features www.ti.com 1 Features • • • • • • 1.1 Complete evaluation system for the bq77908A 4-series to 8-series cell Li-Ion or Li-Polymer battery protector Populated circuit module for 8-cell, parallel FET configuration for quick setup – Pads for components for configuration of additional cell counts and series FETs Power connections available on terminal blocks or banana jacks Control and status signals available on terminal blocks Resistor cell simulator for quick setup with only a power supply Personal computer software available for configuration Kit Contents • • • bq77908A circuit module Resistor cell simulator Set of support documentation Table 1. Ordering Information EVM Part Number Chemistry Configuration Capacity bq77908AEVM-001 Li-Ion 8 cells Any NOTE: Although capacity Table 1 is show as Any, practical limits of the physical construction of the module typically limit the operation of the EVM to a 1P or 2P battery construction. See Section 8 for board details. 1.2 Required Equipment The following equipment is required to operate the bq77908AEVM in a simple demonstration. • DC power supply, 0-V to 34-V at 0.5 A • DC voltmeter or oscilloscope, • DC power supply, ~3 V at .1 A or an approximately 15-kΩ, 1/4-W resistor • Test leads to connect equipment The following equipment is required to operate the bq77908AEVM with a more extensive demonstration. • TI USB-TO-GPIO interface adapter • Computer with USB port and compatible Windows 32-bit operating system • Electronic load • Additional power supplies • TI bq77910GUI Evaluation Software (see Section 4). 2 bq77908A Circuit Module and Interfaces The bq77908A circuit module contains the bq77908A IC and related circuitry to demonstrate the features of the IC. A FET with heatsink is provided for the high-current discharge path. A lower current FET is provided for the charge path. A thermistor provides temperature sensing for the device. Other components provide support for the IC and connections to the board. 2.1 Circuit Module Connections Connections are provided for the following interfaces: • Direct cell connections • PACK connections SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 3 bq77908A Circuit Module and Interfaces • 2.2 www.ti.com Programming interface Signal Descriptions Signals available on the EVM are described in this section. For details on the location and connector types, see Section 8. High current signals can be connected at either the terminal block or banana jack. Refer to the physical construction section for identification. Cell connections are described in Table 2. The default board assembly supports only 5 cells, so the upper cell connections are not used. CELL0 and CELL5 are connected to the high current paths on the board through 0-Ω resistors. This allows operation of the resistive cell simulator without external connections. If the onboard resistors are removed, connections must be made off the board. See Section 8 for resistor identification. Cell connection sequence is described in Section 3.6. Table 2. Cell Connections Reference Designator Pin Number Signal J13, J15 All BATT– Negative electrode of first (bottom) cell, high-current connection 6 CELL0 Negative electrode of first (bottom) cell, optional separate monitor connection to cell 5 CELL1 Positive electrode of first (bottom) cell 4 CELL2 Positive electrode of second cell 3 CELL3 Positive electrode of third cell 2 CELL4 Positive electrode of fourth cell 1 CELL5 Positive electrode of fifth cell, 5 CELL6 Positive electrode of sixth cell 4 CELL7 Positive electrode of seventh cell 3 CELL8 Positive electrode of eighth cell, optional separate monitor connection to cell 2 NC9 Unused connection 1 NC10 Unused connection All PACK+ J5 J4 J10, J11 Description Most positive cell output, high-current connection, shared with PACK+ Load connections are described in Table 3. Table 3. PACK Connections Reference Designator Pin Number Signal J10, J11 All PACK+ Positive output of evaluation board, shared with the battery high-current connection J12, J14 All DSG– Negative output of evaluation board for discharge J16, J17 All CHG– Negative input to evaluation board for charge Description Programming signals are described in Table 4. J3 signals are 3.3-V logic level. Table 4. Programming Interface Connections Reference Designator Pin Number Signal 1, 2, 5, 7, 8 J3 J2 4 Description Not used 3 PGM 4 ZD Control signal for EEPROM programming voltage. Control signal for device ZEDE 6 GND Signal reference for the IC 9 ECLK Serial interface clock connection 10 EDATA Serial interface data connection 1 14V Regulated 14-V input for IC programming 2 GND Signal reference for the IC SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated bq77908AEVM Hardware Connection and Operation www.ti.com Test header or pattern signals are described in Table 5. Table 5. Test Header Signals Reference Designator J1 J6 J8 Usage Pin Number Signal 1 Battery feed 2 BAT 1 VREG IC regulator output 2 ZEDE IC zero delay test point and input pin, also connected to J3 3 PD Pulldown resistor for strong pulldown of ZEDE if required 1 TS IC temperature sense pin 2 GND Signal reference for the IC Default: shunt installed for normal operation. Remove shunt for U1 supply current measurement Default: no shunt. Install shunt to hold ZEDE high Not populated. Alternate test point or remote thermistor connection Description Power feed to 100-Ω shunt resistor Output of 100-Ω shunt resistor to IC BAT pin Control and status signals are provided on terminal blocks. These signals are described in Table 6. Table 6. Control and Status Connections Reference Designator J7 J9 3 Pin Number Signal 1 TS 2 GND 1 CHGCTL Description IC TS signal through a resistor Signal reference for the IC Control signal for charger detection, connects through a resistor to the IC CHGST pin 2 DSGFLAG Diode and resistor isolated DSG signal 3 CHGFLAG Diode and resistor isolated CHG signal bq77908AEVM Hardware Connection and Operation This section describes the connection of the circuit module and EVM and simple operation in its default configuration. 3.1 Initial Considerations Boards are tested after assembly with a basic functional test. This test may not check every connection on the board. Boards must be checked for function in the user’s environment before relying on the safety features of the board. Operation of the board with test equipment before connecting cells is recommended and described in this document. The default configuration of the board is 8 cells with parallel FETs. Modifying the EVM for different cell counts or FET configuration requires solder connections. It is recommended that the users familiarize themselves with operation of the board in the default configuration before modifying the board, and check the operation of the board with test equipment after any modification. Configuration of the board is described in Section 7. Be sure to observe the cautions and warnings in this document. A variety of connections are provided on the EVM. The manufacturer's rating for the terminal blocks for Pack and Battery connections is 32 A nominal. Parallel connections are provided for high-current operation. The banana jacks are rated at 15 A. Safety agency ratings may be lower than the manufacturer ratings; limit currents to appropriate values for your evaluation. Cell monitor terminal blocks and the control signal terminal blocks are rated at lower currents and must not be used for high-current paths. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 5 bq77908AEVM Hardware Connection and Operation www.ti.com A communication interface is not required for basic operation; it must be connected to the computer and EVM circuit module only after proper installation of software. The software along with an appropriate communication interface allows setting the programmable safety limits of the device and checking the status after fault detection. Installation of the software and its use are described in Section 4 and Section 5, respectively. 3.2 Connecting the Cell Simulator The cell simulator consists of headers to mate the board and ten 200-Ω resistors to divide the battery voltage between the inputs. Only 8 of these resistors are used for the bq77908A EVM. Power is provided through the Cell0 and Cell8 connections on the terminal block headers. Various test points are provided on the board. See Section 8 for additional details. • Be certain no power is applied to the board. • Unplug the screw terminal blocks from J4 and J5 of the EVM, and save these for later use. • Plug the cell simulator board onto J4 and J5. Support may be required on the bottom of the EVM while the connectors are pressed together firmly. CAUTION Do not connect or remove the cell simulator board while power is applied to the EVM. The resistor pulldown or pullup from intermittent connections over-stresses the device inputs. 3.3 Simulated Battery Connection Connect a power supply between BATT– (negative) and PACK+ (positive). This power supply connects to the resistor cell simulator through default connections on the bq77908A circuit module. 3.4 Pack Connections A load or charger is connected to the pack terminals using the terminal blocks provided. It is recommended that the load or charger be connected with the current switched off to prevent arcing or transients during connection of the wires to the terminal blocks. Charger detection is required for the bq77908A with a signal at the CHGST pin. Charger detection can be provided by connecting a resistor from the CHGCTL terminal of the board to the PACK supply, or with a logic level voltage supply for evaluation. An external resistor is required due to the low resistance pulldown on the board. The selected resistor must keep the CHGST voltage above the VCHG_DET1 data sheet threshold over the entire evaluation voltage range while limiting the power in the 1-kΩ pulldown resistor to 1/16 W or less. A 15-kΩ, 1/4-W resistor is typically suitable for the default configuration; a smaller value may be required for low voltage or if the configuration is changed. WARNING The CHGCTL must not be tied to the power supply without the external resistor because the 1-kΩ resistor on the board becomes very hot and may damage the board. Although designed for 30-A operation, the board may not dissipate enough power to operate without exceeding all component ratings. The user must monitor the temperature of the board and components during evaluation and provide cooling air and/or heatsinks as required for operation. The thermal sensor on the board may not respond to protect the FETs from damaging temperatures due to its location and possible thermal gradients on the board. 6 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Hardware Connection and Operation www.ti.com CAUTION The bq77908A circuit module may be damaged by overtemperature. To avoid damage, monitor the temperature during evaluation, and provide cooling as needed for your system environment. WARNING The bq77908A circuit module may become hot during operation due to dissipation of heat. Avoid contact with the board. Follow all applicable safety procedures applicable to your laboratory. CAUTION Some power supplies can be damaged by application of external voltages. If using more than one power supply, check your equipment requirements, and use blocking diodes or other isolation techniques as needed to prevent damage to your equipment. The connection of the EVM looks similar to Figure 1. ~ 15k ohm Resistor Cell Simulator “Charger” supply + + Load - “Battery” supply + Figure 1. Basic EVM Setup 3.5 Basic Operation The following steps are suggested for basic operation of a default EVM with the cell simulator and the default configuration in EEPROM. 1. Confirm that the cell simulator board is installed on the EVM. 2. Connect a power supply between the BATT– (negative) and PACK+ (positive) terminals. 3. Connect a 15-kΩ, 1/4-W resistor to the CHGCTL terminal of the board. 4. Set the bench supply to approximately 29 V. 5. Connect a disabled load between the DSG– (negative) and PACK+ (positive) terminals. 6. Wake up the part by momentarily connecting the 15-kΩ resistor to the bench supply positive. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 7 Software Installation www.ti.com 7. Monitor the CHG and DSG test points using a meter or oscilloscope as desired. 8. Enable the load with a nominal 0.2-A or other current within the capability of the supply. 9. Increase the bench supply voltage to approximately 34 V, and observe that the CHG test point goes low. 10. Reduce the voltage to approximately 29 V, and observe that the CHG test point returns high. 11. Decrease the voltage to approximately 20 V, and observe that the DSG test point goes low and the load current drops. The device shuts down after 9 seconds at low voltage. 12. Remove the load, and connect the CHGCTL resistor to the supply to simulate a charger. 13. Increase the supply voltage to approximately 29 V, and observe that the DSG test point goes high, and if the load is re-connected, that current flows again. 3.6 Cell Connections For initial evaluation, it is suggested power supplies be used for cell simulation to observe the behavior of the device. An isolated power supply with a resistor connected across its terminals may be connected to test points on the resistor simulator to vary the voltage above or below the voltage of the other cells, or a similar configuration may be used. The smaller the resistor value, the more current is required from the battery simulator power supply and the smaller the influence on the voltages if cell balancing is operated. Whether power supplies or cells are used, inductance in the high-current path must be minimized. Inductance in this path can cause inductive transients at the board when the load current is stopped or the bq77908A opens the discharge FET with current flow. Use heavy-gauge wires for the high-current connections; minimize inductances by keeping leads close together. When connecting cells to the EVM, the user must use care not to exceed the absolute maximum ratings of the device. The bq77908A is designed with open-cell (wire) detection; however, fixturing must not pull unconnected signals up or down. Signal reference (VSS) for the part is from the BATT– terminal of the EVM, and this lowest potential must be connected first. Cells must be connected in sequence from lowest to highest voltage as described in the data sheet. When terminating the cells to the removable terminal blocks prior to connection to the EVM, the following steps are recommended: 1. Be sure the charger and any load is disconnected (CHGCTL is open). 2. Connect the cell stack negative high-current terminal to the EVM BATT– terminal. 3. Connect the lower cell group to the J5 connector. 4. Connect the upper cell group to the J4 connector. 5. Connect the cell stack positive high-current terminal to the EVM PACK+ terminal. 6. When removing cells, remove any charger and CHGCTL connection, then disconnect in the reverse order. 4 Software Installation This section describes how to install the software for the bq77908AEVM-001. The BQ77908-10-GUI SW supports the bq77908A, and is described in this document as bq77908A evaluation software. 4.1 System Requirements The bq77908A evaluation software requires a 32-bit version of Windows XP, Windows Vista, or Windows 7. The computer must also have Microsoft® .NET framework version 2.0 or higher installed. Examples in this document are from Windows XP. 4.2 Interface Adapter The bq77908A evaluation software supports either the TI USB-TO-GPIO adapter (TI USB Interface Adapter) or the Total Phase Aardvark™ to provide communication with the EVM board from the computer. The Total Phase Aardvark must be selected if desired. The EVM connector supports the TI USB Interface Adapter; a special cable must be constructed if you wish to use the Aardvark. 8 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback Software Installation www.ti.com 4.2.1 TI USB Interface Adapter The TI USB Interface Adapter is the default option for the bq77908A evaluation software. Its pinout is compatible with the bq77908AEVM board J3 connector. The TI USB Interface Adapter http://focus.ti.com/docs/toolsw/folders/print/usb-to-gpio.html is actually a separate EVM from Texas Instruments, and its default firmware is not compatible with the bq77908A. If the firmware has already been updated to version 2.0.19 to work with other BMS-HCE products, additional update is not required. If required, update the firmware using the following steps. 1. Obtain the USB-to-GPIO EVM Firmware Loader from http://focus.ti.com/docs/toolsw/folders/print/usb2gpio-loader-sw.html, or search from power.ti.com 2. Download, extract, and run the installer 3. Installation requires the Microsoft .NET connection software. If a suitable version is not found on the system by the installer, the user is prompted to obtain and install .NET. 4. Connect the TI USB Interface Adapter to the computer with the USB cable. The green LED illuminates. 5. Run the program, typically from Start → Run → Texas Instruments → USB-TO-GPIO Firmware Loader. 6. Detailed instructions are provided in the Readme.txt file. CAUTION Do not disconnect the USB cable to the Interface Adapter during firmware update. Loss of power may leave the adapter with corrupt firmware and be unable to further update the firmware. 7. If you want to be able to return to the original configuration, back up the installed firmware before update. 8. Load and update to the 2.0.19 version using the instructions provided. 9. If an error occurs, do not unplug the adapter. Re-try loading, load a different firmware, or re-start the software and repeat until a load is successful. 10. After successful update, the window appears as is shown in Figure 2 11. After update, exit the program. Figure 2. Successfully Updated TI USB Interface Adapter SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 9 Software Operation 4.2.2 www.ti.com Aardvark Adapter Although the Total Phase Aardvark adapter can physically mate to the EVM J3 connector, the pinout is incompatible. A special interface cable must be constructed to use the Aardvark. Refer to the schematics and Table 7 below for information. CAUTION Do not connect the Aardvark to the EVM without a properly constructed cable. Damage may result to the EVM and/or Aardvark. Table 7. Adapter Cable Pinout IC Pin Name or Description 4.3 USB-TO-GPIO (Mates to J3) Aardvark Pin Signal Pin Signal VSS – signal reference 6 GND 2 GND SCLK 9 SCL 1 SCL SDATA 10 SDA 3 SDA ZEDE – communication enable 4 GPIO4 5 MISO/GPIO Programming voltage control signal for EEPROM 3 GPIO5 7 SCLK/GPIO Installing the bq77908GUI or bq77910GUI Evaluation Software Get the latest software version in the bq77908 and bq77910 GUI Evaluation Software tool folder:http://www.ti.com/tool/bq77908-10-gui-sw, or search from power.ti.com. Check periodically for software updates. Use the following steps to install the bq77908A Evaluation Software: 1. Copy the archive file to a directory of your choice; extract and run the bq77910 Setup.msi installer. 2. Follow the instructions, and make selections as required on the setup windows, selecting next as required. 3. On the last window, select "close" to complete the bq77910 software installation. 5 Software Operation This section describes connection of the communication interface to the EVM and operation of the software. Although the software will run without connection to a powered device, it is recommended to have the device on when starting the software. Figure 3 shows connections for operation with the GUI software. 10 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback Software Operation www.ti.com USB Interface Adapter PC USB “Programming” supply + (14V) ~ 15k ohm Resistor Cell Simulator “Charger” supply + + Load - “Battery” supply + Figure 3. EVM Connection for Communication and Programming To connect the computer to the GUI and start the software, use the following steps: 1. Connect the TI USB interface adapter to the computer. 2. Connect the 10-pin connector from the interface adapter to the EVM J3. CAUTION The communication interface is not isolated on the EVM. Be sure no ground potential exists between the computer and the EVM. Also be aware that the computer is referenced to the battery-potential of the EVM. 3. 4. 5. 6. Remove any shunt installed on J6 so that the interface can control ZEDE. Connect the battery power supply to the EVM, and adjust to approximately 29 Vdc. Wake the bq77908A by connecting CHGCTL high. Start the software, typically using Start → All Programs → Texas Instruments → bq77908A Evaluation. When started, the software looks for the communication interface and the device. When communication is established with the device, the main window appears as shown in Figure 4. The software copies the EEPROM to the volatile registers. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 11 Software Operation www.ti.com Figure 4. GUI With Communication Established Other than the menu selections, the software window has three sections. In the bottom border is a status section. The middle section is a register section. The top section has a selection for the device used and a status area useful for checking the device status when a fault is detected. Details are described in following sections. 5.1 5.1.1 Menu Commands Help Menu The Help → About menu selection displays version information about the program. 5.1.2 Setup Menu The Setup → Communication selection allows selection of either the USB Interface Adapter or the Aardvark. Default is the TI USB Interface Adapter, and this window is not needed. Selecting the Save and Exit button checks for the adapter. If the selected adapter is not present, a communications error window appears. Selecting OK in the window returns to the Communication Selection window. To exit without having the selected adapter connected, use the close window tool (red X button). Selection of an adapter other than the two shown is not supported. 12 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback Software Operation www.ti.com Figure 5. Communication Selection Window 5.1.3 Commands Menu Most commands are only available after communication is established with the device. Figure 6 shows the command window when communication is not yet established. Figure 6. Commands Without Communication Established The communication status in the bottom border of the window shows the adapter in use and the device communication status. If the software is started and the adapter is not found, a Communication Error message box is displayed. Selecting OK on the box displays the main window. If the device is not recognized, a Device Not Found box is displayed. Selecting OK to this box also displays the main window. The communication fault is displayed in the status area of the window. Communication can be re-tried by selecting the menu command Commands → Find Target. Once communication is established with the part, the Find Target command is no longer available. The other commands relate to the register section. The register section is shown in Figure 7. Two sets of registers are displayed: the right section can display the EEPROM settings, and the left side can display the volatile registers waiting to be programmed in the EEPROM. When the software is first started, all values are shown as zero. When the software is started and connects to the device, it will copy the EEPROM values to the volatile registers. The software does not know if power has been removed from the part and will continue to display the values, even though the device may have different values. Registers should be read before use. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 13 Software Operation www.ti.com Figure 7. Register Section The Read Volatile Registers command reads the values from the registers in the part and displays them in the GUI window. When a part is first powered, these are typically zero. When connecting to a powered part, they likely contain residual values. The Read EEPROM Registers command reads the EEPROM values from the device and displays them in the EEPROM registers section of the window for viewing. This is a viewing operation, and data manipulation is not allowed in the displayed EEPROM data. The Read All Registers command reads both the volatile and EEPROM registers from the device and displays the values. The Copy EEPROM to Volatile command copies the EEPROM register values to the corresponding volatile registers and displays both in the GUI. This is a good starting point for making incremental changes to the device settings. The Verify Volatile Registers command checks whether the volatile registers match the contents of the device. This can be useful as a check before programming the EEPROM. The Program EEPROM command writes the volatile register values 5.1.4 File Menu The Load Registers from File command reads a properly formatted file and fills the volatile register section with the values. This is useful for loading a device with a saved configuration. A windows navigation tool allows selection of the file. Whereas files can be edited, it is recommended to load files saved by the software, and if any editing is performed on the file, check all values before programming the device. The Save Registers to File command creates a file. A windows navigation tool allows selection of the location and file name. Files have the .cfg extension. The Exit command exits the program. 5.2 Working With Register Values When the software initially connects to a device it will copy that device's EEPROM to its volatile registers and display those results. Since the device does not know if power has been lost to the device, the register display may be stale. If the device has been changed or power cycled to the part, the registers should always be read before making changes. If a file is loaded with values matching the displayed values, the software will not know the data is different from the part. Reading the registers or copying EEPROM values to the volatile registers is recommended before any change. 14 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback Software Operation www.ti.com EEPROM values are displayed but are not directly editable in either the device or the GUI. Changes are made to a volatile register set by changing the volatile register value which is written to the volatile register in the device and later written to the device EEPROM by the programming process. Changes in the volatile registers do not affect operation of the device until written into the EEPROM. The software does not know the difference between the bq77908A and bq77910A. The user must select the device connected with the selection buttons in the top section of the window. Selecting the bq77908A will add some limit checking for the SYS_CFG CNF field to avoid programming an invalid configuration into the device. Attempting to program an invalid configuration with the bq77908A selected will display an error box and will not program the part. The devlce selection also changes the device name in saved configuration files. Values in the Volatile Registers section can be typically be changed in three ways: • Loading a register file • Changing a check box or drop-down selection • Entering a data value in the box corresponding to the register name The SYS_CFG register bits are displayed as selection boxes; these are green for a value 0 and orange for a value 1. The following steps describe changing a device EEPROM setting on the EVM using the GUI with a connected adapter: 1. Power the EVM (device) with the battery supply, and wake it up with charger detection. 2. Maintain a logic high on the CHGCTL pin of the EVM (CHGST device pin). 3. Copy the EEPROM values to the volatile registers with the Copy EEPROM to Volatile command. 4. Edit the values in the Volatile Registers section as desired. 5. Provide a 14 V ±0.5 V at approximately 0.1-A programming voltage at the EVM J2 connector. 6. Select the Program EEPROM command. 7. After a short delay, a programming complete status window appears. Select OK in this window. 8. Disconnect the programming voltage from the EVM J2 connector. Programming the EEPROM from a file uses a similar sequence. This can be useful in evaluation when replacing a device or duplicating a design on a small number of boards. The following steps describe programming a device EEPROM on the EVM from a saved configuration file using the GUI with a connected adapter: 1. Power the EVM (device), and wake it up with charger detection. 2. Maintain a logic high on the CHGCTL pin of the EVM (CHGST device pin). 3. Copy the EEPROM values to the volatile registers with the Copy EEPROM to Volatile command if the software is not restarted for each device. 4. Select the File → Load Register File command, navigate to, and open the desired file. 5. Provide a 14 V ±0.5 V at approximately 0.1-A programming voltage at the EVM J2 connector. 6. Select the Program EEPROM command. 7. After a short delay, a programming complete status window appears. Select OK in this window. 8. Disconnect the programming voltage from the EVM J2 connector. After programming, it may be necessary to clear fault status because programming requires communication with the device and that requires setting ZEDE high. ZEDE high may make the part respond to noise. SCC is typically the lowest value threshold in the device and is common after programming or other communication with the part, depending on the device settings and operating environment. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 15 Software Operation www.ti.com CAUTION Although the software may be useful for producing a small number of boards, it is not intended as a production programming tool. Accidental manipulation of the registers when the file is loaded and when the programming command is sent is not prohibited. During programming, the software checks that the device volatile registers match the values shown. If they do not match, an error message is displayed. Continuing with programming when the values do not match will unexpectedly alter the configuration of the device. If the error is displayed, it is recommended to read the volatile registers to examine the contents, correct any communication error, and re-start the software or device as needed for proper programming. 5.3 Status Section The status section of the GUI is shown in Figure 8. This section allows the user to display internal status registers of the devices fault condition. This data is not part of normal operation of the device and is not shown in the data sheet. Accessing the data is disruptive to the device; however, it can be beneficial in evaluation. Figure 8. Status Section The status is read by selecting the Polling Enable button on the left side of the status section. This periodically sets ZEDE high to the device, reads the status registers, and returns ZEDE low. The polling period can be selected with the drop-down box next to the button. The button function and label change to Disable. The button label indicates the action of the next button actuation. A consequence of polling is that a pending fault delay is terminated by the status read. Polling is typically independent of any system change, and a fault may be recorded as soon as the poll occurs. This may lead to unexpected results in evaluation. The following text describes a couple examples which can occur: • The user has selected a 2-second undervoltage delay and wants to observe the timing on a scope. The user leaves polling active and decreases the device voltage. The poll occurs just after the voltage drops, and the zero delay causes the fault to be registered. The FETs turn off and the user thinks the delay setting is not working. This situation occurred because the poll set ZEDE high and terminated the undervoltage delay. • The user is polling status to watch faults. CHGST is tied high to prevent the part from shutting down due to undervoltage. The user begins switching currents and is surprised when a SCC fault occurs. Observing the sense resistor voltage, the user does not see a charge current. This situation occurred because the poll set zero delay and eliminated noise filtering on the current. The SCCT is typically a low and thus most sensitive to any noise; having CHGST high prevents recovery from the fault. The values display in several colors. See Table 8. Table 8. Status Section Indicator Colors Color Gray Bright green Bright red Dark green or dark red 16 Meaning Status is not read Device is polling and status is normal with connected device, or adapter is not connected Device is polling and status is fault Device is not polling and value is residual from last poll SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated Software Operation www.ti.com Figure 9 shows a typical status display polling with undervoltage. Figure 9. Polling Status With Undervoltage Condition Another use of the status section is to determine the reason the part has turned off the FETs. For example, if during test the EVM has turned off the FETs but the VREG is still on, the interface might be connected and the status polled to see what fault the device identifies. 5.4 Basic Operation With Software The following steps are suggested for exercising more of the device features using the EVM in its default 8-cell configuration and EEPROM settings. The board is connected as shown in Figure 3. Remember that timing as described in Section 5.3 will be incorrect. 1. Install the software. 2. Connect the USB Interface Adapter to the computer with the USB cable. 3. Remove the screw terminal blocks from J4 and J5, and save for later use. Connect the cell simulator board to the bq77908A main board J4 and J5. Support the under side of the EVM board as the connectors are pressed together. CAUTION Do not connect or remove the resistive cell simulator from the board with power applied. The resistor pulldown or pullup from intermittent connections over-stresses the device inputs. 4. Connect the 10-pin ribbon cable from the USB Interface Adapter to the EVM J3. 5. Connect an isolated power supply negative to BATT– and positive to PACK+. Adjust the voltage to approximately 29 V. 6. Connect an approximate 15-kΩ resistor from the power supply positive to the CHGCTL terminal. This wakes up the part; leave the resistor connected. 7. Start the software. 8. Connect a disabled load to the pack terminals. 9. Select the Polling Enable button in the software window. 10. Observe that the status values are bright green. 11. Set a current on the load within the capability of the supply and board. 12. Decrease the power supply voltage to approximately 20 V. Observe that using the load current stops, and the UV status indicator turns red. 13. Increase the supply voltage to approximately 29 V. Observe that the UV indicator turns green. 14. Load current may not resume until the load is disabled or disconnected. 15. Increase the supply voltage to approximately 34 V. Observe that the OV status indicator turns red. 16. Decrease the power supply voltage to approximately 29 V. Observe that the OV indicator turns green. 17. Disable polling. 18. Disable the load 19. Set the supply to 0 V, and turn off equipment. 5.5 Operation With Other Interfaces or Hosts The bq77910 GUI software does not support other interfaces. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 17 Related Documents From Texas Instruments www.ti.com Communication with the bq77908A from other hosts must be straightforward. See to the data sheet for timing and interface details. On the EVM, zero delay mode can be set to allow communication using a 0.1-inch shunt (not provided) at J6 pins 1 to 2, or a signal at ZD on J3. To program, the onboard programming voltage switch can be used by controlling the PGM signal on J3. Signals must be 3.3-V CMOS levels. 6 Related Documents From Texas Instruments To obtain a copy of any of the following TI document, call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center (PIC) at (972) 644-5580. When ordering, identify this document by its title and literature number. Updated documents can also be obtained through the TI Web site at www.ti.com Document bq77908A Multi-Cell Lithium-Ion/Polymer Precision Protector Data Sheet 7 Literature Number SLUSAV5 bq77908AEVM Circuit Description and Configuration This section describes the circuit on the bq77908A circuit module and how to configure it for changes the user may want to make to the board for specific evaluations. In many cases, an EVM schematic is used as a starting point for a circuit design. This can result in unnecessary extra components on the product design that take up space and add cost. Refer to the schematic in Section 8 while reading the following descriptions. Note that the schematic has two pages: the first shows the main functions, and the second page shows primarily cell count configuration and protection components. 7.1 Battery Voltage Clamp The TVS diode D9 provides a clamp for transients on the pack. A common transient is due to system inductances and sudden load shutoff. The breakdown voltage of D9 must be set near or below the 5-V per cell absolute maximum of the device. As a transient pushes the voltage up the I-V curve, a substantial device here reduces the demands on other clamping components in the system, which may be needed to protect the device. Alternatives to D9 may be to control the system inductance and current switching rate, use capacitance to absorb transients, or other transient protectors such as MOVs where appropriate. 7.2 Device Power The device is powered through the BAT pin. C12 is a bypass capacitor near the IC; the footprint is large in order to make it easy to mount larger capacitors, in the event that this is desired in evaluation. R5 and J1 provide a way to measure current to the device during evaluation and are not needed in an application. D2 provides power from the battery to the IC and prevents the IC power from being pulled down when the battery voltage dips suddenly due to a heavy load on the battery. C2 provides an operating reservoir for device current during battery voltage droop. D1 limits the voltage to the BAT pin preventing overvoltage from rectification of transients by D2. Power is provided through R4. The 200-Ω resistor provides for a voltage drop when an overvoltage charger pulls down BAT through D8. For lower cell counts, this resistor may be a smaller value. R3 is a 0-Ω connection to the high-current battery positive connection BATT+ which is shared with the PACK+. This jumper is provided in case the user wants to power the part from the current monitor line instead. 7.3 Cell Monitor Inputs and Configuration The cell monitor inputs are provided through an RC filter network. The series resistors RVCX connect the cells to the device to allow voltage measurement and limit the balancing current. Balancing current is approximately the cell voltage divided by twice the resistor. The EVM is circuit-designed to use the internal balancing path at near the maximum current. The 47-Ω RVCX value on the EVM is nominally within 10% of the 50-Ω minimum recommended in the data sheet and prevents exceeding the absolute maximum balancing current up to 4.3 V per cell. The input capacitance is typically connected between cell inputs, except the capacitances at VC8 and VC9 are connected to ground to avoid pushing the inputs below ground during transients. The capacitance must not be increased beyond the 1 µF shown because the 18 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Circuit Description and Configuration www.ti.com capacitors are discharged into the device during balancing. The filter effect both reduces cell transients to the device inputs and slows voltage recovery after balancing. The resulting time constant is complicated due to the multiple components but relatively short due to the small resistors used for high balancing current. Due to the cell input voltage measurement after balancing, the time constant (RVCX) must not be made too large. Note that two limits are implied by the absolute maximum cell-to-cell differential rating of the part. One is the applied differential voltage, or 5 V on any cell regardless of the other inputs. Note also that this is an applied voltage, not the voltage induced by the part during balancing, which may be higher. The second voltage limit is the voltage to ground the cumulative voltage from summing the individual limits. Because the input filter time constant is small, clamping the inputs to safe values may be required. While a Zener or TVS diode per cell may be a suitable way to protect the device in some applications, the EVM provides patterns D14 to D18 to clamp the inputs for cells 8 to 4 to ground. The top cell input is clamped (VC1 with D14 on the EVM), and cell 4's input, VC7, is clamped with D18 on the EVM because this input showed more sensitivity than others in testing. For nominal transients, these clamps along with the capacitors between cells hold the inputs to safe values; however, different or additional clamping may be required in evaluation or the target application. The EVM has resistor jumper positions and is populated to connect to the cells with N+1 wires where N is the number of cells. R42 connects the high-current BATT– connection to the lowest cell monitor point. Similarly, R57 connects cell 8 input to the high-current path through R3. Additional resistor patterns R53 to R58 allow the same connections when the board is configured for other series cell counts. The board may be configured to monitor the cell voltages directly at the cells (N+3 wires) by removing R42 and R59 or the equivalent. When configuring the part for fewer than 8 cells, the unused inputs must not be left floating and must be connected to avoid exceeding absolute maximums. The EVM provides patterns to allow flexible connections. The unused pin group may be connected together on the EVM by shorting the capacitors between them or shorting the appropriate resistor jumper positions R62 to R64. The unused pin group then needs to be connected to a safe level, either to the top cell through one of the unused cell RVCX patterns or to the highest used VCx pin using the appropriate R63 to R65. When configuring for fewer than 8 cells and using the cell simulator, be sure to remove components to avoid parallel paths. Due to the flexibility allowed by the EVM for configuration, it is recommended evaluators study the schematic before modifying the board to achieve their desired configuration. Table 9 shows possible configurations for different cell counts assuming use of the cell simulator, retaining the N+1 wiring plan, and adjusting the transient protection. The board operates at a lower cell count without the transient protection adjustment, but users must be sure they provide adequate protection for the IC in the evaluation and system design to prevent damage. The table describes a change from the 8-cell default to one of the other configurations. The users must check configurations if multiple changes are made. D14 is shown removed in the table for less than 8 cells to avoid any possible leakage current or unexpected clamp during evaluation. Table 9. Cell Count Component Configuration Cell Count/ Reference Designator 8 Cells (Default) 7 Cells 6 Cells 5 Cells 4 Cells C6 Installed Remove Installed Installed Installed C7 Installed Installed Remove Installed Installed C8 Installed Installed Installed Remove Installed C9 Installed Installed Installed Installed Remove D1 Installed < 35 V < 30 V < 25 V < 20 V D9 Installed < 35 V < 30 V < 25 V < 20 V D14 Installed Remove Remove Remove Remove D15 — < 35 V — — — D16 — — < 30 V — — D17 — — — < 25 V — D18 Installed Installed Installed Installed Installed R18 Installed Remove Remove Remove Remove R19 Installed Installed Remove Remove Remove SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 19 bq77908AEVM Circuit Description and Configuration www.ti.com Table 9. Cell Count Component Configuration (continued) Cell Count/ Reference Designator 8 Cells (Default) 7 Cells 6 Cells 5 Cells 4 Cells R20 Installed Installed Installed Remove Remove R21 Installed Installed Installed Installed Remove R53 — — — — 0Ω R54 — — — 0Ω — R55 — — 0Ω — — R56 — 0Ω — — — R57 Installed Remove Remove Remove Remove R62 — 100 Ω 0Ω 0Ω 0Ω R63 — — 100 Ω 0Ω 0Ω R64 — — — 100 Ω 0Ω R65 — — — — 100 Ω The cell count programmed in the EEPROM must match the physical connection for proper operation. If the device is programmed for more than the connected cells, the unused cells are still checked by the device and show undervoltage or open-cell faults. If the device is programmed for fewer than the connected cells, the upper cells are ignored and faults on these cells are not checked. Also be aware that the voltage applied to the part can exceed the absolute maximum or show undervoltage when used with the resistor simulator. WARNING When the device is configured for fewer than the connected cells, the device does not monitor the upper cells and does not protect against faults on those unmonitored cells. 7.4 Ground Connection The IC VSS (ground) reference on the bq77908AEVM-001 circuit module is connected to the BATT– at the sense resistor. Note the range of the inputs when considering moving the ground location in an application design. The ground connection must be made at one location on the high-current path to avoid differential voltages on the board ground due to high currents. 7.5 Current Sense Connections R50 and R52 in parallel make the current sense resistor. Two resistors allow for lower heat dissipation per component at a given current and allow flexibility in evaluation. R43 and R44 isolate the sense input pins from the current path transients; C20 and C25 provide filtering. Be aware that C20 and C25 add a time delay to the system current response depending on where sense resistor voltage falls in relation to the threshold voltage. A mismatch in C20 and C25 can convert a common-mode signal to a differential signal at the device pins; the C22 pattern is available if a differential filter is desired. 7.6 Filter Capacitors The regulator filter capacitor C17 value of 4.7 µF exceeds the minimum data sheet value of 1 µF. The 1-µF DCAP and CCAP filter capacitors C21 and C26 are the data sheet recommended typical values 20 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Circuit Description and Configuration www.ti.com 7.7 FET Circuits The circuit board has five TO-220 power FET patterns to allow flexibility in evaluation. By default, the board is populated for parallel FET operation. The Q3 discharge FET is mounted to a heatsink expecting high-discharge currents. Users must monitor temperature in their evaluation environment and provide additional cooling if required. Q7 is the parallel charge FET. Anticipating a low-charge current of up to a couple amperes, Q7 does not have a heatsink. Users must measure the device temperature in their evaluation environment and provide heatsinking and cooling, if required. The Q4 pattern allows an FET to be installed instead of Q7 to provide series FET configuration. In this case, the pack negative is the CHG– terminal. HS2 pattern is provided for Q4. If configured for series FETs, it is recommended to insulate DSG– to avoid erroneous connections. Patterns Q5 ane Q6 are in parallel with Q3 and Q4 to provide for optional patterns, to allow parallel FET connection, to provide for a large heatsink to be mounted to the FETs off the board edge if desired, or to provide connection points for additional circuitry. When using series FETs the CPCKN can rise above VSS when the FETs are shut off or the device is shut down. This can result in an increased supply current. Look for TI application reports related to the device for alternate series FET configurations on the Texas Instruments Web site.. C34 and C35 provide an ESD path and high-frequency bypass during switching of the discharge FET. Two capacitors in series are used so that if one is shorted, the other still blocks dc signals. C36 and C37 provide a similar function for the charge FET or across both FETs in series configuration. Several other components relate to the FET operation. R48 and R49 pull down the gate to source voltage for the FETs to keep them off when the bq77908A is shut down. R41 is the discharge FET gate drive resistor, 1 kΩ on the EVM. This value adjusts the turnoff time of the discharge FET. Increasing the turnoff time reduces the inductive transients during a protection event, but increases heating in the discharge FET. FET turn on is also affected, so be sure to consider this if the system can turn on with load applied. The 1-kΩ value may need to be adjusted for your application or other FETs; consult the FET vendor data. R51 and C33 patterns provide locations to provide feedback to slow the discharge FET switching if appropriate in your application. The charge FET typically can be allowed to switch faster due to lower current. The value of R47 can be adjusted if desired. When no FETs are desired, Q7 and Q3 can be shorted source to drain. Shorting the FETs is important in this case; both provide a high-current output path and a proper reference for the DPCKN, CPCKN, and CCAP signals. Adjustments to the flag circuitry may also be desired in this configuration. 7.8 Detection Sensing The device detects load presence with the DPCKN pin. This is connected to the discharge negative signal DSG– with R45. The 100-Ω value is the data sheet recommended typical RDPCKN and provides some isolation of the pin from load transients. C29 provides some filtering to avoid transients pushing DPCKN above its absolute maximum. D7 is an optional diode to limit the DPCKN voltage to the BAT pin clamp, if required; in testing, it has not appeared necessary. R46 is the RLDRM_DET resistor in the data sheet. This resistor discharges the load capacitance and in series FET configuration, pulls down CPCKN to allow turnon of the CHG output. Note that this resistor provides an unswitched load and must not be made too small. R46 might be removed in parallel FET configurations to reduce the battery drain during continued loads after protection because the device has a weak internal pulldown on DPCKN. CPCKN is the charge negative sense which is used by the device to sense the charge FET source voltage. It is also the negative power supply for the CHG output driver. R40 is the data sheet RCPCKN and is the typical recommended value. C30 is an optional pattern for filtering, if desired. D8 limits the voltage across BAT to CPCKN during transients or situations when the applied charger voltage exceeds the device absolute maximum. D8 also functions in the series FET configuration to prevent CPCKN from significantly exceeding BAT. 7.9 Output Protection Components D10 is an inductive clamp diode also known as a flyback or freewheel diode. It conducts if the discharge FET opens with an inductive load to clamp the DSG– to the BATT+. Note that inductance of the cells and interconnect is clamped by D9, but load current is handled by D10. D11 prevents CHG– from significantly exceeding BATT+. It provides an inductive load clamp in the series FET configuration when D10 is likely removed. Also in the series FET configuration D11 shorts a reversed charger after the FETs open. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 21 bq77908AEVM Circuit Description and Configuration www.ti.com The EVM contains some features to avoid ESD on several of the signals that come to the output side of the board. Spark gaps are provided at most outputs. Pairs of series capacitors bypass most signals to CHG–. If one capacitor is shorted, the other may remain functional. ESD performance of the EVM was not tested, the user must test their system to applicable standards. 7.10 Reserved Pins Pins 23, 24, and 25 of the bq77908A must be tied to GND for normal operation of the device. In an application, these might normally be tied directly to VSS; on the EVM, they are individually pulled down for possible future use. Pin 30 must not be connected in normal operation. The EVM provided the R30 pattern for possible future use. This is omitted for normal designs. Pins 2, 4, and 37 are not connected. 7.11 Flag Outputs CHGFLAG and DSGFLAG are signals output from the board for indicating the CHG and DSG pin status. These are isolated from the device pins by R39 and R34 which prevent excessive loading from shorting the device pins and forcing the FETs off. D6 and D5 prevent current from the board connector pins from driving the device or turning on the FETs due to external connections. If used for monitoring the status, these must have some large-value pulldown. Note that the reference level of the CHGFLAG varies with CHG– when the charge FET is off. If the board is configured to not use a FET and the flag terminals are used as outputs, the appropriate diode can be shorted and resistors adjusted as needed. 7.12 Thermal Sensor The thermal protection on the bq77908AEVM circuit module is set to provide a trip threshold between 65°C and 70°C with nominal values. Component tolerances and substitute values may alter this trip point. An onboard thermistor RT1 is mounted near the center top of the board. If RT1 is removed, an offboard thermistor can be connected at J7 or J8 and used for sensing temperature closer to the cells. To adjust the value of the trip point, change the value of R27: Trip ratio is nominally 0.2 = RT(trip)/(RT(trip) + R27); consider component and device tolerances as needed for your design. C15 provides some filtering for TS on switching of VTSB; its value can vary but it must not be so large that it prevents the TS signal from stabilizing before temperature measurement. A charger can access the thermistor through J7 and R28. R28 provides for some isolation of the external connection, but is small to reduce error. Adjust R28 as needed for evaluation or system design. 7.13 ZEDE ZEDE is the zero delay test mode control pin of the bq77908A. This pin also provides the communication enable to the device for programming and checking the device status. R37 provides a pulldown for ZEDE for normal operation. R9 connects the pin to J3 to allow control by a communication interface. The TI USB-TO-GPIO Interface Adapter has a weak pullup for the signal used to control ZEDE, so the 100-kΩ value of R37 is larger than the strong pulldown recommended by the data sheet. Connecting J6 pins 2 to 3 provides a lower value pulldown of ZEDE through R23 if needed for evaluation, but prevents data access by the TI Interface Adapter. Connecting J6 pins 1 to 2 pulls up ZEDE to test zero delay mode and allows communication with hosts which do not control ZEDE. 7.14 Programming Interface The serial communication interface is connected to J3 with isolation resistors R12 to R15. D3 provides ESD protection. R16 and R17 pull the lines low when not connected. Pullup resistors for communication with the EVM must be provided by the host or other offboard connection. Q1, Q2, and related components provide a switch for the 14-V programming voltage controlled by the interface adapter. It is expected that this circuitry is on a production fixture in a system design. R24 provides a pulldown for the EEPROM pin when programming voltage is not present. This resistor can be smaller to avoid noise, depending on the capability of the programming power supply and switch. When programming the EVM with software other than the bq77908GUI Evaluation Software and supported host interface, provide a logic control to the J3 PGM pin at the appropriate time indicated in the data sheet programming diagram. 22 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908A Circuit Module Physical Construction www.ti.com 8 bq77908A Circuit Module Physical Construction This section contains the PCB layout, bill of materials, and schematic of the bq77908AEVM circuit module. The bq77908AEVM-001 consists of two circuit module assemblies, the bq77908AEVM main board or HPA731, and the resistor simulator or HPA582. 8.1 8.1.1 Main Board Board Layout The bq77908AEVM circuit module is a 4.7-inch × 3.25-inch, 4-layer, printed-circuit board assembly. It is designed for easy connection with cell connections on the left side and load connection on the right using standard wires to the terminal blocks. The board was planned for a 30-A current flow. Wide trace areas are used to reduce voltage drops. The EVM layout and construction allows easy understanding of the connections for evaluation, but the connector area and programming features result in a large board. The main solution components are outlined on the silkscreen layer; the discharge FET can be envisioned moving into this area; and the area might further be reduced by careful layout. See additional information in the configuration and operation sections of this document. Figure 10 to Figure 17 show the board layout. TEXAS INSTRUMENTS Figure 10. Top Silkscreen SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 23 bq77908A Circuit Module Physical Construction www.ti.com Figure 11. Top Assembly Figure 12. Top Layer 24 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908A Circuit Module Physical Construction www.ti.com Figure 13. Layer 2 Figure 14. Layer 3 SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 25 bq77908A Circuit Module Physical Construction www.ti.com Figure 15. Bottom Layer Figure 16. Bottom Silkscreen 26 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908A Circuit Module Physical Construction www.ti.com Figure 17. Bottom Assembly 8.1.2 Bill of Materials The bill of materials for the circuit module is shown in Table 10. Substitute parts may be used in the manufacturing of the assembly. Table 10. bq77908A Circuit Module Bill of Materials Count Reference Design Value Description Size Part Number Manufacturer 17 C1, C4, C18, C19, C20, C23, C24, C25, C27, C28, C29, C31, C32, C34, C35, C36, C37 0.1 µF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 C12 0.1 µF Capacitor, Ceramic, 50V, X7R, 10% 1210 Std Std 1 C15 10 nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 C17 4.7 µF Capacitor, Ceramic, 50V, X7R, 10% 1210 Std Std 1 C2 10 µF Capacitor, Ceramic, 50V, Y5V, 20% 1210 Std Std 2 C21, C26 1 µF Capacitor, Ceramic, 25V, X5R, 10% 1206 Std Std 0 C22 Capacitor, 0603, Not installed 0603 0 C3, C5 Capacitor, Ceramic, 10V, X7R, 10% 0603 0 C30 Capacitor, 1206, Not installed 1206 0 C33 Capacitor, Ceramic, 50V, X7R, 10% 0603 9 C6, C7, C8, C9, C10, C11, C13, C14, C16 1 µF Capacitor, Ceramic, 10V, X7R, 10% 0603 Std Std 2 D1, D14 ** 36V TVS Diode, TVS, Unidirectional, 600-W SMB P6SMB36AT3G ON Semiconductor Diode, Fast rectifier, 200V, 5A D-PAK MURD620CTG or UF5A400D1-13 or RF505B6STL ON Semiconductor or Diodes or Rohm 2 D10, D11 MURD620CT 0 D12, D13, D15, D16, D17 Diode, TVS, Pattern only, 600-W SMB 1 D18 ** 17V TVS Diode, TVS, Unidirectional, 600-W SMB 1SMB17AT3G ON Semiconductor 4 D2, D4, D5, D6 1N4148W Diode, Signal, 300-mA, 75-V, 350-mW SOD-123 1N4148W-7-F Diodes 1 D3 5.6V Diode, Dual, Zener, 5.6V, 300mW SOT23 AZ23C5V6-V-G Vishay-Telefunken 0 D7 Diode, Signal, 300-mA, 75-V, 350-mW SOD-123 1 D9 ** 36V TVS Diode, Unidirectional TVS, 1500W SMC 1.5SMC36A Littelfuse 1 HS1 581102B02500G Heatsink, TO-220/218 vertical 0.640 x 0.640 inch 581102B02500G Aavid Thermalloy 0 HS2 Heatsink, Pattern only, TO-220/218 vertical 0.640 x 0.640 inch 2 J1, J2 Header, Male 2-pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins PEC02SAAN SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 27 bq77908A Circuit Module Physical Construction www.ti.com Table 10. bq77908A Circuit Module Bill of Materials (continued) Count 28 Reference Design Value Description Size Part Number Manufacturer 0 J8 Header, Male 2-pin, 100mil spacing 4 J10, J12, J15, J16 1714955 Header, 32A, 500V, 2-pin, 250 mil spacing 0.492 x 0.500 inch 1714955 Phoenix Contact 4 J11, J13, J14, J17 3267 Connector, Banana Jack, Uninsulated 0.500 dia. inch 3267 Pomona 0 J18 Header, 11-pin, 100mil spacing, 0.100 inch x 11 1 J3 5103308-1 Header, 2x5-pin, 100mil spacing 0.330 x 0.800 inch 5103308-1 Tyco 1 J4 ** 1803455 Header, 8A 300V, 5-pin Vert. Entry 0.280 x 0.700 inch 1803455 Phoenix Contact 1 J5 ** 1803468 Header, 8A 300V, 6-pin Vert. Entry 0.2800 x 0.750 inch 1803468 Phoenix Contact 1 J6 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins 1 J7 ED555/2DS Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 inch ED555/2DS OST 1 J9 ED555/3DS Terminal Block, 3-pin, 6-A, 3.5mm 0.41 x 0.25 inch ED555/3DS OST 1 Q1 BSS84 MOSFET, Pch, –50 V, –0.13A, 10 Ω SOT23 BSS84 Fairchild 1 Q2 BSS138 MOSFET, Nch, 50V, 0.22A, 3.5 Ω SOT23 BSS138 Fairchild 1 Q3 IRFB3207ZPBF MOSFET, Nchan, 75V, 170A, 4.1 mΩ TO-220AB IRFB3207ZPBF IR 0 Q4, Q5, Q6 MOSFET, Nchan, Pattern only TO-220AB 1 Q7 IRFB3607PBF MOSFET, Nchan, 75V, 80A, 9 mΩ TO-220AB IRFB3607PBF IR 3 R1, R16, R17 1M Resistor, Chip, 1/16W, 5% 0603 Std Std 2 R10, R37 100k Resistor, Chip, 1/16W, 5% 0603 Std Std 9 R18, R19, R20, R21, R22, R25, R26, R29, R31 47 Resistor, Metal Film, 1/4 watt, ± 5% 1206 Std Std 3 R2, R6, R46 47k Resistor, Chip, 1/16W, 5% 0603 Std Std 9 R23, R33, R35, R36, R38, R41, R43, R44, R47 1k Resistor, Chip, 1/16W, 5% 0603 Std Std 4 R24, R27, R34, R39 10k Resistor, Chip, 1/16W, 5% 0603 Std Std 1 R28 47 Resistor, Chip, 1/16W, 5% 0603 Std Std 3 R3, R42, R57 0 Resistor, Chip, 1/16W, 5% 0603 Std Std 0 R30, R51, R53, R54, R55, R56, R58, R59, R60, R61, R62, R63, R65 Resistor, Chip, 1/16W, 5% 0603 1 R4 200 Resistor, Metal Film, 1/4 watt, ± 5% 1206 Std Std 2 R48, R49 5.1M Resistor, Chip, 1/16W, 5% 0603 Std Std 10 R5, R8, R9, R12, R13, R14, R15, R32, R40, R45 100 Resistor, Chip, 1/16W, 1% 0603 Std Std 2 R50, R52 0.002 Resistor, 2 mΩ, 1W, 1% 2512 WSL25122L000FEA Vishay 0 R64 Resistor, Chip, 1/16W, 1% 0603 0 R7, R11 Resistor, Metal Film, 1/4 watt, ± 5% 1206 Std Std 1 RT1 Thermistor, TH, ±1% 0.095 X 0.150 inch 103AT-2 Semitec 0 SPK1, SPK2, SPK3, SPK4, SPK5, SPK6 Spark Gap, 0.010 inch space 0.050 x 0.070 inch 0 TP37, TP49, TP51, TP52 Plated Through Hole, Dia. 0.094 0.150 x 0.150 inch 4 TP34, TP35, TP39, TP40 5020 Test Point, loop 0.100 x 0.100 inch 5020 Keystone 8 TP13, TP18, TP3, TP30, TP38, TP41, TP47, TP48 5002 Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 0 TP1, TP10, TP11, TP12, TP14, TP17, TP2, TP21, TP22, TP23, TP24, TP25, TP26, TP27, TP28, TP29, TP31, TP32, TP33, TP36, TP4, TP42, TP43, TP45, TP46, TP5, TP6, TP7, TP8, TP9 Test Point, 0.020 Hole 0 TP15, TP16, TP19, TP20, TP44, TP50, TP53 Test Point, 0.032 Hole 1 U1 TSSOP-38 (DBT) bq77908ADBT TI 1 — PCB, 4.7 In x 3.25 In x 0.062 In HPA731 Any 1 — Shunt, 100-mil, Black 929950-00 3M 1 — Thermal pad SP900S-0.009-00-54 Bergquist 1 — Screw, 6-32 x 0.375", pan head, Nylon Std Std 1 P4 (##) ** TERMBLOCK PLUG 5POS 3.81MM 1827156 Phoenix Contact 1 P5 (##) ** TERMBLOCK PLUG 6POS 3.81MM 1827169 Phoenix Contact 4 — Standoff, M-F threaded 6-32, 0.5", Nylon 4816 Keystone 4 — Nut, Hex, 6-32, Nylon Std Std 10k bq77908ADBT IC, Multicell Lithium-Ion/Lithium Polymer Pack Protection 0.100 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908A Circuit Module Physical Construction www.ti.com Table 10. bq77908A Circuit Module Bill of Materials (continued) Count Reference Design Value — 1 Notes: 1. Description Size Part Number Resistive Cell Simulator HPA582 Manufacturer TI These assemblies are ESD sensitive; ESD precautions shall be observed. 2. These assemblies must be clean and free from flux and all contaminants. Using unclean flux is unacceptable. 3. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 4. Reference designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. 5. Install thermal pad between heatsink & Q3 and secure with screw. If heatsink is substituted, use appropriate screw thread 6. Provide connectors (##) with assembly, install on J4 and J5 after test 7. Install shunt on J1 during test 8. Install standoffs at board corners, nut on top SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 29 bq77908A Circuit Module Physical Construction www.ti.com Figure 18. Schematic Diagram, Sheet 1 of 2 30 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback www.ti.com bq77908A Circuit Module Physical Construction Figure 19. Schematic Diagram, Sheet 2 of 2 8.1.3 bq77908A Circuit Module Performance Specification Summary This section summarizes the performance specifications of the bq77908A circuit module in its default 8-cell parallel FET configuration. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 31 bq77908A Circuit Module Physical Construction www.ti.com Typical voltage depends on the number of cells configured. Typical current depends on the application. Board cooling may be required for continuous operation at or below maximum current. Table 11. Performance Specification Summary Specification Min Typ Max Unit 5.6 — 34 V Continuous discharge current (current into DSG– terminal) 0 — 30 A Continuous charge current (current into CHG– terminal) 0 — –6 A Input voltage PACK+ with respect to BATT–, CHG–, or DSG– 8.2 8.2.1 Resistor Cell Simulator Board Layout The resistor cell simulator is a 1.75-inch x 2.00-inch, 2-layer circuit board assembly. It is designed for easy connection to the bq77908A circuit board assembly using the connectors on the bottom side. Additional patterns are included on the board for test points. Figure 20. Resistor Simulator Top Silkscreen 32 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback www.ti.com bq77908A Circuit Module Physical Construction Figure 21. Resistor Simulator Top Layer SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 33 bq77908A Circuit Module Physical Construction www.ti.com Figure 22. Resistor Simulator Bottom Layer 34 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback www.ti.com bq77908A Circuit Module Physical Construction Figure 23. Resistor Simulator Top Assembly SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 35 bq77908A Circuit Module Physical Construction www.ti.com Figure 24. Resistor Simulator Bottom Assembly 8.2.2 Resistor Simulator Bill of Materials The bill of materials for the Resistor Simulator circuit module is shown in Table 12. Table 12. Resistor Simulator Bill of Materials Count Reference Design Value Description Size Part Number Manufacturer 0 J1, J3 Terminal Block, 4-pin, 6-A, 3.5 mm 0.55 x 0.25 inch ED555/4DS OST 0 J2 Terminal Block, 3-pin, 6-A, 3.5 mm 0.41 x 0.25 inch ED555/3DS OST 0 J4 Header, Male 2x11-pin, 100 mil spacing 0.100 inch x 11 x 2 PEC11DAAN Sullins 0 J5, J8 150-mil hole for standard banana plug 0.300 dia inch 1 J6 ** 1875454 Header, 8A, 160 V, 5-pin, 3.81 mm spacing, Top 6.85 x 22.96 mm Entry 1875454 Phoenix Contact 1 J7 ** 1875467 Header, 8A, 160 V, 6-pin, 3.81 mm spacing, Top 6.85 x 26.77 mm Entry 1875467 Phoenix Contact 10 R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, 200 Resistor, Metal Film, 1/4 watt, ± 1% 1206 STD STD 0 R11, R12, R13, R14, R15, R16, R17, R18, R19, R20 Resistor, Chip, 1W, 1% 2512 0 TP1, TP2 Pad, TH 0.038 inch 1 — PCB, 2 In x 1.75 In x 0.062 In HPA582 Any Notes: 1. These assemblies are ESD sensitive; ESD precautions shall be observed. 36 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback bq77908A Circuit Module Physical Construction www.ti.com Table 12. Resistor Simulator Bill of Materials (continued) Count Reference Design Value Description Size Part Number Manufacturer 2. These assemblies must be clean and free from flux and all contaminants. Using unclean flux is unacceptable. 3. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 4. Reference designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. SLUU854 – February 2012 Submit Documentation Feedback bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated 37 bq77908A Circuit Module Physical Construction www.ti.com Figure 25. Resistor Simulator Schematic Diagram 38 bq77908AEVM Evaluation Module Copyright © 2012, Texas Instruments Incorporated SLUU854 – February 2012 Submit Documentation Feedback EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/ kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this is strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. REGULATORY COMPLIANCE INFORMATION (continued) FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. 【Important Notice for Users of this Product in Japan】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjukku-ku, Tokyo, Japan http://www.tij.co.jp 【ご使用にあたっての注】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用い ただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER 【Important Notice for Users of this Product in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【ご使用にあたっての注】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. 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