User's Guide
SLUU324B – July 2008 – Revised March 2018
bq77PL900EVM-001
This evaluation module (EVM) is a complete evaluation system for the bq77PL900, a five- to ten-cell Li-ion
battery protection and AFE integrated circuit. The EVM includes one bq77PL900 circuit module. Microsoft®
Windows® based PC software is available for download. An communication adapter is required to
interface this EVM with the PC and can be purchased separately. The circuit module includes one
bq77PL900 integrated circuit (IC), sense resistor, power FETs and all other onboard components
necessary to protect the cells from overcharge, over discharge, short circuit, and over current discharge in
5 to 10 series cell Li-ion or Li-polymer battery packs. The circuit module connects directly across the cells
in a battery. With the EV2300 interface board and software, the user can read the bq77PL900 data
registers, program the IC protection limits, and evaluate the overall functionality of the bq77PL900 solution
under different operational conditions.
1
2
3
4
5
6
7
8
9
Contents
Features ....................................................................................................................... 2
1.1
Kit Contents.......................................................................................................... 2
bq77PL900 Circuit Module and Interfaces ............................................................................... 3
2.1
Circuit Module Connections ....................................................................................... 3
2.2
Signal Descriptions ................................................................................................. 3
bq77PL900 Circuit Module Configuration................................................................................. 4
3.1
Cell Count Configuration ........................................................................................... 4
3.2
Logic Level Selection ............................................................................................... 5
3.3
Pre-Charge Configuration ......................................................................................... 5
3.4
Ground Connection ................................................................................................. 5
3.5
Cell Monitor Connections .......................................................................................... 6
3.6
FET Use.............................................................................................................. 6
3.7
Current Sense Connections ....................................................................................... 6
3.8
Other Circuit Configurations ....................................................................................... 6
bq77PL900 EVM Hardware Connection and Operation ................................................................ 7
4.1
Initial Considerations ............................................................................................... 7
4.2
Cell Connections .................................................................................................... 9
4.3
Pack Connections .................................................................................................. 9
4.4
Thermal Sensor.................................................................................................... 10
4.5
Basic Operation.................................................................................................... 10
Software Installation ....................................................................................................... 10
5.1
System Requirements ............................................................................................ 10
5.2
Communication Adapter .......................................................................................... 10
5.3
Install The bq77PL900EVM Software .......................................................................... 10
Troubleshooting Unexpected Dialog Boxes ............................................................................ 11
Software Operation ........................................................................................................ 11
7.1
Registers Tab ..................................................................................................... 12
7.2
Control Tab ......................................................................................................... 13
7.3
EEPROM Tab ...................................................................................................... 14
7.4
Basic Operation With Software .................................................................................. 16
References: ................................................................................................................ 17
bq77PL900 Circuit Module Physical Construction ..................................................................... 17
9.1
Board Layout ....................................................................................................... 17
9.2
Bill of Materials .................................................................................................... 21
9.3
bq77PL900 Circuit Module Performance Specification Summary .......................................... 23
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Features
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List of Figures
1
Transient Effect of FET Operation ......................................................................................... 7
2
Basic Connections ........................................................................................................... 8
3
Registers Tab Window
4
Control Tab Window ....................................................................................................... 13
5
EEPROM Tab Window .................................................................................................... 15
6
EEPROM Preview Window ............................................................................................... 16
7
EEPROM File Options ..................................................................................................... 16
8
Top Silk Screen............................................................................................................. 18
9
Top Assembly............................................................................................................... 18
10
Top Layer
11
Bottom Layer................................................................................................................ 19
12
Bottom Silk Screen ......................................................................................................... 20
13
Bottom Assembly ........................................................................................................... 20
14
Schematic Diagram ........................................................................................................ 22
....................................................................................................
...................................................................................................................
12
19
List of Tables
........................................................................................................
1
Ordering Information
2
Cell Connections ............................................................................................................. 3
3
PACK Connections .......................................................................................................... 3
4
Serial Interface Connections ............................................................................................... 4
5
Host Connections ............................................................................................................ 4
6
Power Output Connections ................................................................................................. 4
7
Cell Count Configuration Jumper Position
8
9
10
11
2
............................................................................... 5
Logic Level Configuration Jumper Position .............................................................................. 5
PMS Pin Selection ........................................................................................................... 5
Bill of Materials ............................................................................................................. 21
Performance Specification Summary .................................................................................... 23
Trademarks
Microsoft, Windows are registered trademarks of Microsoft Corporation.
1
Features
•
•
•
•
1.1
Complete evaluation system for the bq77PL900 five to ten series cell lithium-ion or lithium-polymer
battery protector and analog front end IC in stand-alone mode
Populated circuit module for quick setup
PC software and interface board available separately for easy evaluation
Connections for attaching a the circuit module to a host system
Kit Contents
•
•
bq77PL900 circuit module
4 wire cable
Table 1. Ordering Information
2
EVM Part Number
Chemistry
Configuration
Capacity
bq77PL900EVM-001
Li-ion
Five to ten cells
Any
bq77PL900EVM-001
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bq77PL900 Circuit Module and Interfaces
The bq77PL900 circuit module contains the bq77PL900 IC and related circuitry to demonstrate the
features of the IC. Two FETs are paired for the high current charge and discharge to reduce resistance in
the FETs. A zero volt charge FET and current limit resistor is provided. A thermistor provides temperature
sensing for the device. Other components provide support for the IC and connections to the board.
2.1
Circuit Module Connections
Connections are provided for the following interfaces:
• Direct cell connections
• PACK connection
• Evaluation and programming interface (I2C)
• Host monitoring and control
• Regulated power
2.2
Signal Descriptions
Signals available on the EVM are described in this section. For details on the location and connector
types, refer to the physical construction section.
Cell connections are described in Table 2. Cell connection sequence is described in Section 4.2.
Table 2. Cell Connections
Reference
Designator
Pin Number
J5
1, 2
J4
3
J3
J2
J1
Signal
Description
BATTERY–
–ve connection of first (bottom) cell, high current connection
1N
–ve connection of first (bottom) cell, connected to BATTERY– with R2
2
1P
+ve connection of first (bottom) cell
1
2P
+ve connection of second cell
4
3P
+ve connection of third cell
3
4P
+ve connection of fourth cell
2
5P
+ve connection of fifth cell
1
6P
+ve connection of sixth cell
4
7P
+ve connection of seventh cell
3
8P
+ve connection of eighth cell
2
9P
+ve connection of ninth cell
1
10P
+ve connection of tenth cell, connected to BATTERY+ with R1
BATTERY+
Most positive cell output, high current connection
1, 2
Load connections are described in Table 3.
Table 3. PACK Connections
Reference
Designator
Pin Number
Signal
Description
J15
1, 2
PACK+
Positive output of evaluation board
J14
1, 2
PACK–
Negative output of evaluation board
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Evaluation and programming I2C interface signals are provided on J12 and are described in Table 4.
Table 4. Serial Interface Connections
Reference
Designator
Pin Number
Signal
Description
J12
1
GND
Signal reference for the IC
2
SCLK
Serial interface clock connection
3
SDATA
Serial interface data connection
4
EEPROM
EEPROM write enable pin connection
Host monitoring and control signals are described in Table 5.
Table 5. Host Connections
Reference
Designator
Pin Number
Signal
Description
J13
1
EEPROM
EEPROM write enable pin connection
2
SDATA
Serial interface data connection
3
SCLK
Serial interface clock connection
4
GND
Signal reference for the IC
5
XRST
Active low reset from the IC
6
TS1
Thermistor voltage input to TIN of IC
7
XALERT
Status register change signal from IC
8
IOUT
Current monitor output from IC
9
VOUT
Voltage monitor output from IC
10
GND
Signal reference for the IC
Regulated power signals are provided for monitoring or connection to a host board. Signals are described
in Table 6.
Table 6. Power Output Connections
3
Reference
Designator
Pin Number
Signal
Description
J11
1
GND
Signal reference for the IC
2
5V
5V output from VREG1
3
GND
Signal reference for the IC
4
3.3V
3.3V output from VREG2
bq77PL900 Circuit Module Configuration
This section describes how to configure the bq77PL900 circuit module to operate in the desired mode for
evaluation, and changes the user may want to make to the board for specific evaluations.
3.1
Cell Count Configuration
Cell count for the bq77PL900 is selected using J6 through J8 to set the level of the CNF pins. Positioning
the shunt toward the top of the board (VSEL, connecting pins 2-3) provides a logic high, positioning
toward the bottom of the board (GND, connecting pins 1-2) provides a low. Table 7 shows configuration
settings for different cell counts.
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Table 7. Cell Count Configuration Jumper Position
3.2
Cell Count
J8 Position/CNF2
J7 Position /CNF1
10
GND/0
GND/0
J6 Position /CNF0
GND/0
9
GND/0
GND/0
VSEL/1
8
GND/0
VSEL/1
GND/0
7
GND/0
VSEL/1
VSEL/1
6
VSEL/1
GND/0
GND/0
5
VSEL/1
GND/0
VSEL/1
Logic Level Selection
Selection of the VLOG voltage for the bq77PL900 is provided by J10. The VLOG selection sets the
interface voltage for the logic signals on the IC. Selecting the shunt position is described in Table 8. Set
VLOG to 5V for EEPROM programming with the EV2300.
Table 8. Logic Level Configuration Jumper Position
3.3
Shunt Position
J10 Pins Connected
VLOG Selection
Up
1-2
5V
Down
2-3
3.3V
Pre-Charge Configuration
The bq77PL900EVM-001 circuit module includes a pre-charge current path. The IC PMS pin is configured
by J9. Table 9 shows configuration selections. Refer to the bq77PL900 datasheet for more information.
The current path is made up of the pre-charge FET Q5 and resistor R19. The value of R19 on the EVM
was selected to meet its power rating with 42V and nominal resistance. The resulting current is low,
consider the conditions relevant to your evaluation and replace the resistor with a different value if
needed.
Table 9. PMS Pin Selection
3.4
Shunt Position
J9 Pins Connected
PMS Selection
Up
2-3
PACK+
Down
1-2
GND
Comment
Pre-charge FET not used
Pre-charge FET used if enabled in EEPROM
Ground Connection
The IC ground reference on the bq77PL900EVM-001 circuit module is connected to the BATTERY– net
near J5 using a zero ohm resistor R39. Due to the voltages which can be induced during high current
discharge, ground on the bq77PL900 is recommended on the battery side of the sense resistor. This
causes the voltage at the SRP pin to be above ground during discharge. Board resistance will also cause
SRB to be above ground during discharge.
The ground connection on the battery side of the sense resistor causes the ground reference of the IC to
be modulated from the PACK– terminal by the load current. When connecting to the analog signals, the
user should reference the signal ground. For digital signals, the circuitry will need to use the digital ground
or accept the modulation of current in the ground reference.
R40 provides an optional grounding position on the battery side of the sense resistor. Although not
recommended, R41 provides a grounding option on the pack side of the sense resistor. Be sure to verify
that the check voltages at the IC pins are within acceptable datasheet limits during all modes of operation.
Note that grounding on the pack side of the sense resistor will not eliminate modulation of the signals due
to current, only reduce them by the sense resistor drop. The user should be certain only 1 of R39, R40 or
R41 is shorted and that the sense resistor is not bypassed by a connection between PACK– and system
ground.
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bq77PL900 Circuit Module Configuration
3.5
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Cell Monitor Connections
Resistors R1 and R2 are installed by default and allow the high current connections to be used for cell
monitoring. If separate connections are desired for cell monitoring, remove the R1 and R2 resistors and
make connection from 1N and 10P back to the cells when the equivalent high current connection is made
during the cell connection sequence.
3.6
FET Use
The circuit module provides FETs for charge and discharge control. If your evaluation does not require
charge FETs, openings are provided in the solder mask near J15 on both the top and bottom side to short
the charge FET. An added connection should be large enough to carry the current used in your
evaluation. If your evaluation does not require charge or discharge FETs, the BATTERY+ and PACK+
connections should be connected together and to the top of the cell stack to provide power and wake up
voltage to the bq77PL900.
3.7
Current Sense Connections
Components R17, R20 and C17 provide a 40 μs time constant between the sense resistor and current
sense terminals. If this delay is objectionable, C17 may need to be reduced or removed for the evaluation.
3.8
Other Circuit Configurations
A reverse clamp diode D12 is provided at the pack outputs to prevent board damage during turn off of
inductive loads. This diode will also provide reverse charger protection within the capability of the part.
The part used is rated at 3A, be sure this is sufficient for your evaluation. A larger diode may be
connected to the pack terminals if needed.
The EVM could be used in a variety of systems. Capacitors C26 to C35 provide some transient protection,
by absorbing impulses present from the load. Several capacitors are used rather than one due to the size
and the decrease in capacitance at high voltage. If the capacitance is not needed in evaluation, it could be
removed. In some applications, the capacitance may not be sufficient for transient suppression. Holes X1
to X6, D9 and RT2 are provided between the pack terminal traces for installation of additional transient
suppression components that may be needed for specific system evaluations.
Suppression of transients to the EVM is important both to prevent exceeding the IC voltage ratings, and
for proper operation of the system due to the power supply hold up circuit used for the IC on the EVM:
• Diodes D1 and D8 are necessary to prevent rapid loss of supply voltage to the IC during short circuit
events, and to prevent negative voltage at the BAT and PACK pins during a reversed charger
connection.
• The DSG and CHG gate drive signals from the IC are driven to approximately 12V below the value of
the BAT and PACK voltages as seen by the IC. This provides sufficient gate drive to bias the PChannel FETs fully ON. Under steady-state operating conditions, the voltages at the IC pins will be the
same as the voltages at the external terminals.
• Under transient conditions (typically caused by dynamic system loads), the D1/C11 and D8/C24
components will store the peak voltages seen at the external pins. There may be instantaneous
differences in the voltages seen at the BAT and PACK pins of the IC relative to the source terminals of
the power FETs.
• If these transients are very large, the power FETs may briefly shut off. This happens because the gate
drive voltages are referenced to the value of BAT and/or PACK voltage seen at the IC pin, which may
be momentarily higher than the actual BAT or PACK voltage in the actual system. The resulting actual
Vgs differential may not be sufficient to maintain the ON state of the power FETs when the sensed
BAT or PACK voltage is higher than the actual BAT or PACK voltage.
• The circuit used for maintaining the supply voltage to the IC may need to be modified in a system that
has significant voltage transients to prevent momentary shutoff of the power FETS during these
conditions. See Figure 1 for further explanation.
• If your system does not require D1 and D8, these are located on the bottom side of the board and may
be shorted. Refer to section 9 for location of these components.
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Voltage
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60
Fast transient applied on battery or external system voltage (e.g., due to load pulse)
Voltage at IC BAT (or PACK) pin is delayed, peak detected from a ctual
battery / FET source
50
40
Gate Drive Voltage (DSG, CHG pin output) is referenced to BAT (o r PACK)
pin sensed voltage
30
20
10
0
FET
status
ON
OFF
ON
FET shuts off momentarily when Vgs minimum threshold
is not maintained (actual Vgs < sensed Vgs)
Vgs
time
Figure 1. Transient Effect of FET Operation
4
bq77PL900 EVM Hardware Connection and Operation
This section describes the connection of the circuit module and EVM. Simple operation is also described.
4.1
Initial Considerations
Boards are tested after assembly with a basic functional test. This test may not check every connection on
the board. Boards should be checked for function in the user’s environment before relying on the safety
features of the board.
Before connecting the board for operation, configure it for the desired state as described in Section 3.
Be sure to observe the cautions and warnings in this document.
The connection of the EVM will look similar to Figure 2. The manufacturer's rating for the terminal blocks
for Pack and Battery connections is 24A nominal per terminal. Parallel connections are provided for high
current operation. Note that the EV2300 is not required for basic operation, and it should be connected to
the computer and EVM circuit module only after proper installation of software. The software along with
the EV2300 allows monitoring of the IC status, setting the programmable safety limits and controlling the
device in host mode. Installation of the software and its use are described in a later section.
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bq77PL900 EVM Hardware Connection and Operation
-
I2C
178 1/4W 1%
178 1/4W 1%
178 1/4W 1%
178 1/4W 1%
178 1/4W 1%
178 1/4W 1%
178 1/4W 1%
178 1/4W 1%
BENCH +
POWER
SUPPLY
-
178 1/4W 1%
178 1/4W 1%
CELLS OR
SIMULATED CELLS
COMPUTER
USB
EV2300
+
Load
or
Charger
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Figure 2. Basic Connections
8
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4.2
Cell Connections
Unused cell inputs should be shorted together. For example, if 8 cells are used, the 10P, 9P and 8P
terminals should be connected together.
For initial evaluation, it is suggested power supplies be used for cell simulation to observe the behavior of
the device. Resistors can be used for cell voltage simulation to reduce the number of power supplies
needed, 180 Ω or similar resistors are suggested. Tolerances can be selected or resistances adjusted to
provide desired variations in simulated voltage. Smaller values will work also, the smaller the value, the
more current is required from the battery simulator power supply and the smaller the influence on the
voltages if cell balancing is operated.
If power supplies or cells are used, inductance in the high current path should be minimized. Inductance in
this path can cause inductive transients at the board when the load current is stopped or the bq77PL900
opens the discharge FET with current flow. Use heavy gauge wires for the high current connections;
minimize inductances by keeping leads close together.
Cells should be connected in sequence from lowest to highest voltage as described in the following steps:
1. Connect the lowest cell negative terminal to the EVM BATTERY– terminal. Connect it also to the EVM
1N terminal if R2 was removed.
2. Connect the lowest cell positive terminal to the EVM 1P terminal
3. Connect the second lowest cell positive terminal to the 2P terminal
4. Connect the next lowest cell positive terminal to the 3P terminal
5. Continue connecting each higher cell in sequence. When all other connections have been made,
connect the most positive cell to the EVM BATTERY+ terminal, then to the 10P terminal if R1 was
removed.
6. When removing cells, disconnect in the reverse order.
4.3
Pack Connections
A load or charger is connected to the pack terminals using the terminal blocks provided. It is
recommended that the load or charger be connected with the current switched off to prevent arcing or
transients during connection of the wires to the terminal blocks.
Although designed for 30A operation, the board may not dissipate enough power to operate without
exceeding the ratings. The user should monitor the temperature of the board and components during
evaluation and provide cooling air and/or heatsinks as required for operation. The thermal sensor on the
board may not respond to protect the FETs from damaging temperatures due to its location and possible
thermal gradients on the board.
CAUTION
The bq77PL900 circuit module may be damaged by over temperature. To avoid
damage, monitor the temperature during evaluation and provide cooling as
needed for your system environment.
WARNING
The bq77PL900 circuit module may become hot during operation
due to dissipation of heat. Avoid contact with the board. Follow all
applicable safety procedures applicable to your laboratory.
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4.4
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Thermal Sensor
The thermal protection on the bq77PL900EVM circuit module is set to provide a trip threshold of 60°C with
nominal values. Component tolerances and substitute values may alter this trip point. The thermistor in
particular will impact the linearity and limit of the temperature sensor. The thermistor could be moved off
board for sensing cell temperature, or closer to the FETs or a heatsink or other system component for
evaluation. To adjust the value of the trip point, change the value of R22. The linearization resistor R29
will have a lesser effect.
4.5
Basic Operation
The following steps are suggested for basic operation for a board configured for 10 cells with the default
safety configuration in EEPROM.
1. Connect cells or cell simulation resistors and a power supply to the battery side of the board. Set the
bench supply (if used) to approximately 20V.
2. Connect a disabled load to the pack terminals.
3. Wake up the part by momentarily connecting a charge voltage > 7.5V to the pack terminals. If the load
is disconnected, the user can momentarily short the BATTERY+ to PACK+ with a resistor.
4. Monitor the XALERT, 3.3V or 5V outputs to observe the operation of the device as desired.
5. Increase the load to >10A to observe XALERT goes low due to overcurrent or under voltage if the
power supply current limits.
6. Remove the load and attach a charger to allow the device to recover.
7. If using a power supply, reduce the voltage of the cells to observe the device shuts off at ~14V.
5
Software Installation
This section describes how to install the software for the bq77PL900EVM-001, and how to connect the PC
interface board of the EVM.
5.1
System Requirements
The bq77PL900EVSW requires Windows 2000, Windows XP, or newer operating system version. You
must have administrative rights on the computer.
5.2
Communication Adapter
A communication adapter supported by the software is required. The EV2400 is the newer communication
adapter. See http://www.ti.com/tool/EV2400. The EV2400 uses human interface device drivers included
with the operating system and driver installation is not required. The bq77PL900EVM Software does
require the Support components to enable specific TI software (bqEVSW) to work with EV2400 available
in the EV2400 tool folder.
The EV2300 is an older interface which requires drivers. If your use the EV2300 and it works with your
system changing to the EV2400 is not required. EV2300 drivers may not be available for all systems. See
http://www.ti.com/tool/EV2300 for 32 bit drivers. For more information on the EV2300 and drivers search
at http://e2e.ti.com/.
The bq77PL900EVSW does not support other communication adapters.
5.3
Install The bq77PL900EVM Software
Find the latest software version in the bq77PL900EVM-001 tool folder
http://www.ti.com/tool/bq77PL900EVM-001. Check periodically for software updates. Use the following
steps to install the bq77PL900 Evaluation Software:
1. Copy the archive file to a directory of your choice.
2. Extract the archive containing the installation package into the temporary directory. Be sure to preserve
folder names.
3. In the temporary folder, double-click on setup.exe and follow the installer instructions to complete the
bq77PL900 EVSW installation.
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4. If using the EV2400 install the support components. In some cases the support components will need
updated to communicate, installing a newer EVSW such as bq30z554-R1 bqEasy Software will provide
the update.
5. If using the EV2300 and the computer was previously used with the EV2300, driver installation should
not be needed. If using the EV2300 on a new computer install drivers for the EV2300. Use the drivers
from the EV2300 tool folder disregarding the drivers included with the bq77PL900EVSW.
6
Troubleshooting Unexpected Dialog Boxes
Ensure that the files were extracted from the zip file using the Preserve Folder names option.
Ensure that all the files were extracted from the zip file.
The user that is downloading the files must be logged in as the administrator.
The driver is not signed, so the administrator must allow installation of unsigned drivers in the operating
system policy.
7
Software Operation
This section describes operation of the software.
Software is started from the sequence Start > All Programs > Texas Instruments > bq77PL900 Evaluation
Software.
The software window has 2 sections, a tab section and a status section. The left side of the window
displays one of 3 tabs selected by clicking on the tab name and described in the following sections. The
right section of the window provides visual indicators of the status register which is polled periodically by
the software. The connection status of the I2C is shown above the status section.
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Software Operation
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Registers Tab
After the software starts, the registers tab is displayed. The registers tab can be used to read all registers
and write selected registers. The scanning check box in the right bottom corner controls continuous
scanning of the registers. Register scanning is independent of the status section scanning. When the
scanning box is not checked, the values are not automatically read when the tab is selected. Select the
"Read All" button to update the register status when scanning is off. Random patterns should not be
written to the registers, refer to the data sheet for register bit definitions.
Figure 3. Registers Tab Window
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7.2
Control Tab
The Control tab is shown in Figure 4. This tab allows the user to adjust control of the features of the part.
In stand-alone mode, the features are not applicable and are grayed out. When host mode is selected, the
user can make adjustments to demonstrate controls that would be performed by the host in a system
implementation. Refer to the data sheet for detailed bit definitions.
The OUTPUT CONTROL section is used primarily to turn on and off FETs and clear errors. The STATE
CONTROL section is used to select Host mode, the amplifier gains and shutdown. The FUNCTION
CONTROL section contains the Thermistor Power control, but also along with the CELL SEL section
allows demonstration of the voltage and current monitor outputs and selections. These would normally be
used in a host controlled system to monitor the battery operation and allow calibration of the host
measurement system. Refer to the data sheet for more information on the features to support system
calibration.
The CELL BALANCE section allows control of individual cell-balancing bits, and should not be randomly
written. In host mode the user has control of cell balancing. Cell balancing should be enabled using an
algorithm to protect the cell sense IC pins from over voltage induced by the cell balancing function. This is
summarized by:
• No adjacent cell balancing
• No every-other-cell balancing.
See the application note Cell Balancing With the bq77PL900, SLUA463 for more information on cell
balancing.
Figure 4. Control Tab Window
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Software Operation
7.3
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EEPROM Tab
CAUTION
The EV2300 provides 5V for the EEPROM signal when programming. If the
board is configured for VLOG = 3.3V during programming, damaging voltages
may be imposed on VREG2 and the I2C lines. Disconnect any sensitive host
and set VLOG = 5V before programming with the EV2300.
The EEPROM tab is used to change the settings of the protection features of the device. The values are
read from the part and the window updated when the tab is selected. Changes can be made using the
selection and checkboxes. The Preview button will display the present EEPROM selections in a register
format. The preview window must be closed before other operations can take place. Changes will be
written to the EEPROM when the Program EEPROM button is selected. Note that the EEPROM can only
be written when the voltage to the part is sufficient.
With the EEPROM tab selected, the File menu will have options to save or open EEPROM data. The save
option will allow a file to be created from the current settings even if they have not been programmed to
the device. The open option will allow a file to be read and replace the values in the window. These values
loaded from the file are not written to the EEPROM until the "Program EEPROM" button is selected.
Selecting either the Control or Registers tab before programming will cause the settings to be lost. The
settings in the device will be read again when the EEPROM tab is selected again. Selections can be made
and saved to a file without having a device connected.
14
bq77PL900EVM-001
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Software Operation
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Figure 5. EEPROM Tab Window
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Software Operation
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Figure 6. EEPROM Preview Window
Figure 7. EEPROM File Options
7.4
Basic Operation With Software
The following steps are suggested for basic operation in host mode for a board configured for 10 cells with
the default safety configuration in EEPROM.
1. Connect cells or cell simulation resistors and a power supply to the battery side of the board. Set the
bench supply (if used) to approximately 20V.
2. Install the software.
3. Connect the EV2300 to the computer with the USB cable.
4. Connect the communication cable from the EV2300 I2C port to the circuit module J12.
5. Start the software.
6. Connect a disabled load to the pack terminals.
7. Wake up the part by momentarily connecting a charge voltage >7.5V to the pack terminals. If the load
is disconnected, the user can momentarily short the BATTERY+ to PACK+ with a low value resistor.
The device will wake up in standalone mode.
8. Select the control tab in the software window.
16
bq77PL900EVM-001
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References:
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9. In the control tab, select ‘host’ the STATE CONTROL Control Mode box. The features in the window
should become clearly visible.
10. Observe using a voltmeter or other method that the pack has no output voltage.
11. In the OUTPUT CONTROL section, select the check boxes for CHG and DSG FETs.
12. Observe using a voltmeter or other method that the pack has an output voltage.
13. Decrease the power supply voltage to approximately 10V. Observe that the UV indicator comes on
and the output voltage goes away.
14. Increase the power supply voltage to 20V. Observe that the UV indicator remains on and the output
voltage remains off.
15. Click on the Toggle LTCLR button in the OUTPUT CONTROL section. Observe the UV indicator goes
out and the output voltage comes on again.
8
References:
1. Texas Instruments, bq77PL900, Five to Ten Series Cell Lithium-Ion or Lithium-Polymer Battery
Protector and Analog Front End Data Sheet
2. Texas Instruments, Cell Balancing With the bq77PL900 Application Report
3. Texas Instruments, EV2400 Evaluation Module Interface Board User's Guide
4. Texas Instruments, EV2300 Evaluation Module Interface Board User's Guide
9
bq77PL900 Circuit Module Physical Construction
This section contains the pcb layout, bill of materials and schematic of the bq77PL900EVM circuit module.
9.1
Board Layout
The bq77PL900EVM circuit module is a 4.5-inch × 3.25-inch 2-layer circuit card assembly. It is designed
for easy connection with cell connections on the left side and load connection on the right using standard
wires to the terminal blocks. Dual FETs are used to reduce resistance for a design-specified 30A current
flow. Wide trace areas are used to reduce voltage drops and provide surface area for heat dissipation
without a heatsink. This layout and construction allows easy understanding of the connections for
evaluation, but results in a large board. The main solution components are outlined on the silkscreen
layer.
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bq77PL900 Circuit Module Physical Construction
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See additional information in the configuration and operation sections of this document. Figure 8 to
Figure 13 show the board layout.
Figure 8. Top Silk Screen
Figure 9. Top Assembly
18
bq77PL900EVM-001
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Figure 10. Top Layer
Figure 11. Bottom Layer
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bq77PL900 Circuit Module Physical Construction
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Figure 12. Bottom Silk Screen
Figure 13. Bottom Assembly
20
bq77PL900EVM-001
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9.2
Bill of Materials
The bill of materials for the circuit module is shown in Table 10. Substitute parts may be used in the
manufacturing of the assembly.
Table 10. Bill of Materials
RefDes
Value
Description
Size
Part Number
MFR
C1–C10, C16–C20,
C36, C37
0.1 μF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
C11, C24
2.2 μF
Capacitor, Ceramic, 50V, Y5V, 20%
1206
STD
Std
C12, C21
4.7 nF
Capacitor, Ceramic, 50V, X7R, 20%
0603
Std
Std
C13
4.7 μF
Capacitor, Ceramic, 50V, Y5V, 20%
1210
Std
Std
C14, C15
1 μF
Capacitor, Ceramic, 50V, X7R, 10%
1206
Std
Std
C22
10 nF
Capacitor, Ceramic, 16V, X7R, 20%
0603
Std
Std
C23, C25
2.2 μF
Capacitor, Ceramic, 16V, X7R, 20%
0603
Std
Std
C26–C35
2.2 μF
Capacitor, Ceramic, 100V, X7R
1210
GRM32ER72A225K
Murata
D1, D8
Diode, Switching, 90V, 225 mA Ifm, High speed
SOD-323
1SS355
Rohm
D10, D11, D13
Diode, TVS Bidirectional , 17 A, 300V
SOT23
SM05T1
ON Semiconductor
D12
Diode, Schottky 3-A 100-V
SMC
MBRS3100T3
On Semi
D2–D5
Diode, Zener, 300mW, 16V
SOD-523
BZX585-C16
Philips
D6, D7
Diode, Dual, Zener, 5.6V, 300mW
SOT23
AZ23C5V6
Vishay-Telefunken
D9
Diode, SMT TVS Unidirectional
DO-214AB
1.5SMCxxx
TSC
J1, J5, J14, J15
Header, Side Entry 2-pin, 5 mm spacing
0.441 × 0.200 inch
1711026
Phoenix Contact
J11
Header, 2x2-pin, 100 mil spacing (36-pin strip)
0.20 × 0.20 inch
PTC36DAAN
Sullins
J12
Header, Friction Lock Ass'y, 4-pin Right Angle,
0.400 × 0.500 inch
22-05-3041
Molex
J13
Header, Male 10-pin, 100mil spacing, (36-pin strip)
0.100 inch × 10
PTC36SAAN
Sullins
J2, J3
Terminal Block, 4-pin, 6-A, 3,5 mm
0.55 × 0.25 inch
ED555/4DS
OST
J4
Terminal Block, 3-pin, 6-A, 3,5 mm
0.41 × 0.25 inch
ED555/3DS
OST
J6–J10
Header, Male 3-pin, 100mil spacing, (36-pin strip)
0.100 inch x 3
PTC36SAAN
Sullins
Q1–Q4
MOSFET, P-ch, –80V, –110A
DDPAK
SUM110P08-11L
Vishay
Q5
Trans, P-Chan 60V 3A
SO-8
NDS9407
Fairchild
R1, R2, R39
0
Resistor, Chip, 1/10W, 5%
0805
Std
Std
R15, R23, R30, R34
1MΩ
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R16, R21, R24
1KΩ
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R17, R20
200Ω
Resistor, Chip, 1/16W, 1%
0603
Std
Std
R18
0.001Ω, 1W
±275ppm
Resistor, Chip, 1W, 1%
2512
WSL25121L000FEA
Vishay
R19
1.78kΩ
Resistor, Chip, 1W, 1%
2512
Std
STD
R22
6.98kΩ
Resistor, Chip, 1/16W, 1%
0603
Std
Std
R25, R31, R35
100kΩ
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R26–R28, R36–R38
100Ω
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R29
61.9kΩ
Resistor, Chip, 1/16W, 1%
0603
Std
Std
R3, R42
10kΩ
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R32
390kΩ
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R33
820kΩ
Resistor, Chip, 1/16W, 5%
0603
Std
Std
R4–R14
510Ω
Resistor, Chip, 1/16W, 5%
0603
Std
Std
Resistor, Chip, 1/10W, 5%
0805
Std
Std
Thermistor, TH, ±1%
0.095 × 0.150 inch
103AT-2
Semitec
RT2
Varistor
1206
VxxMLx1206N
Littelfuse
SPK1–SPK4
Spark Gap, 0.010 inch space
0.050 × 0.070 inch
Spark Gap
mfg
TP1, TP2, TP5–TP9
Test Point, 0.020 Hole
0.043 inch
STD
STD
TP3, TP4
Test Point, SM, 0.150 × 0.090
0.185 × 0.135 inch
5016
Keystone
U1
IC, 5-10 Series Cell L-Ion or L-Polymer Battery Protection and
AFE
SSOP-48
BQ77PL900DL
TI
X1– X6
Through Hole, O.040 Dia
STD
STD
—
PCB
HPA216
Any
Shunt, 100-mil black
929950-00
3m
R40, R41
RT1**
10kΩ
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Figure 14. Schematic Diagram
22
bq77PL900EVM-001
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9.3
bq77PL900 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the bq6400 circuit module.
Typical voltage will depend on the number of cells configured. Typical current will depend on the
application. Board cooling may be required for continuous operation at or below maximum current.
Table 11. Performance Specification Summary
Specification
Input voltage PACK+ to PACK–
Min
Typ
Max
7.5
–
50
V
0
–
30
A
Continuous charge and discharge current
Unit
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (October 2013) to B Revision ............................................................................................... Page
•
•
•
•
Changed reference to communication adapter, and software included in the Abstract to available for download. .......... 1
Deleted reference to software and documentation included on a CD in the Features section, changed by adding software
access instructions. ....................................................................................................................... 2
Changed operating system requirements for newer systems in the Software Installation section, added adapter section,
and changed driver installation instructions. ......................................................................................... 10
Changed section title, reference format, and added EV2400 document to References section. ............................. 17
SLUU324B – July 2008 – Revised March 2018
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23
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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