BUF08630EVM

User's Guide SBOU091A – September 2010 – Revised August 2016 BUF08630EVM User Guide and Software Tutorial This user's guide describes the characteristics, operation, and use of the BUF08630EVM evaluation board. It discusses how to set up and configure the software and hardware, and reviews various aspects of the program operation. Throughout this document, the terms evaluation board, evaluation module, and EVM are synonymous with the BUF08630EVM. This user's guide also includes information regarding operating procedures and input/output connections, an electrical schematic, and a parts list for the EVM. 1 2 3 4 5 6 Contents Overview ...................................................................................................................... 3 BUF08630EVM Hardware Setup .......................................................................................... 4 BUF08630EVM Hardware Overview ...................................................................................... 7 BUF08630EVM Software Setup .......................................................................................... 15 BUF08630EVM Software Overview...................................................................................... 16 BUF08630EVM Documentation .......................................................................................... 27 List of Figures 1 BUF08630EVM Hardware Setup .......................................................................................... 4 2 BUF08630_Test_Board Block Diagram 3 USB_DIG_Platform Block Diagram 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 .................................................................................. 4 ....................................................................................... 6 Typical Hardware Connections for BUF08630EVM ..................................................................... 7 Connecting External Power to the EVM .................................................................................. 8 Connecting the USB Cable to the USB_DIG Platform .................................................................. 9 Confirmation of USB_DIG Platform Driver Installation .................................................................. 9 BUF08630EVM Default Jumper Settings ............................................................................... 10 BKSEL Switch .............................................................................................................. 13 BUF08630EVM Software Install Window ............................................................................... 15 BUF08630EVM License Agreements ................................................................................... 16 BUF08630EVM Software Installation Progress ........................................................................ 16 BUF08630EVM Software About Button ................................................................................. 16 BUF08630EVM Software Functioning Properly ........................................................................ 17 BUF08630EVM Software: Communication Error with the USB_DIG_Platform .................................... 17 BUF08630_Test_Board Jumper JMP1 Set For Logic ‘1’ ............................................................. 18 BUF08630_Test_Board Jumper JMP1 Set For Logic ‘0’ ............................................................. 18 Measuring and Entering Power-Supply Voltage ....................................................................... 19 Auto Write Feature Enabled .............................................................................................. 20 Save to File Dialog Box Button and Window ........................................................................... 21 File Format of Saved Data ................................................................................................ 21 Load From File Button and Window ..................................................................................... 22 Run Batch Dialog Button and Window .................................................................................. 23 Control Panel Button and Window ....................................................................................... 24 Program OTP All Channels Button ...................................................................................... 25 Gain Settings ............................................................................................................... 26 Microsoft, Windows are registered trademarks of Microsoft Corporation. WinZIP is a registered trademark of WinZIP International, LLC. All other trademarks are the property of their respective owners. SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 1 www.ti.com 27 Adding External Gain Resistors .......................................................................................... 26 28 BUF08630_Test_Board Schematic ...................................................................................... 27 29 BUF08630EVM PCB Components Layout .............................................................................. 28 1 Signal Definition of J1 (25-Pin Male DSUB) on BUF08630_Test_Board............................................. 5 2 BUF08630_Test_Board Jumper Functions ............................................................................. 11 3 USB_DIG_Platform Jumper Functions .................................................................................. 12 4 BUF08630_Test_Board Bill of Materials List of Tables 2 BUF08630EVM User Guide and Software Tutorial ............................................................................... 29 SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Overview www.ti.com 1 Overview The BUF08630 is a programmable gamma-voltage generator and VCOM calibrator. This device offers two banks of eight programmable gamma channels and one programmable VCOM channel, making it ideal for 10-bit source TFT-LCD reference drivers. The BUF08630EVM is a platform for evaluating the performance of the BUF08630 under various signal, reference, and supply conditions. This document gives a general overview of the BUF08630EVM, and provides a general description of the features and functions to be considered while using this evaluation module. 1.1 BUF08630EVM Kit Contents Contact the Texas Instruments Product Information Center nearest you if any component is missing. It is highly recommended that you check the TI web site at http://www.ti.com to verify that you have the latest versions of the related software. The complete kit includes the following items: • BUF08630_Test_Board PCB • USB_DIG Platform PCB • USB cable • Barrel plug cable assembly (part # 10-01935 - Tensility International Corporation) for external power supply • CD-ROM that contains this user’s guide, product software, and related documentation 1.2 Related Documentation from Texas Instruments The following documents provide information regarding Texas Instruments' integrated circuits used in the assembly of the BUF08630EVM. This user's guide is available from the TI web site under literature number SBOU081. Any letter appended to the literature number corresponds to the document revision that is current at the time of the writing of this document. Newer revisions may be available from the TI web site, or call the Texas Instruments' Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644- 5580. When ordering, identify the document by both title and literature number. Related Documentation Document Literature Number BUF08630 Product Data Sheet SBOS515 USB_DIG Platform Users Guide SBOU058 SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 3 BUF08630EVM Hardware Setup 2 www.ti.com BUF08630EVM Hardware Setup Figure 1 shows the system setup for the BUF08630EVM. The PC runs software that communicates with the USB_DIG Platform. The USB_DIG Platform generates the analog and digital signals used to communicate with the BUF08630_Test_Board. Connectors on the BUF08630_Test_Board allow the user to connect to the device under test (DUT), in order to monitor the power, current, and voltage of the BUF08630 DUT. +6VDC Wall Supply BUF08630 Analog Supplies (2) BUF08630 Test_Board Outputs USB_DIG Platform Computer Measurement Device Figure 1. BUF08630EVM Hardware Setup 2.1 Theory of Operation for BUF08630_Test_Board Hardware Figure 2 presents a block diagram of the BUF08630_Test_Board. The functionality of this PCB is relatively simple. It provides connections to the I2C interface and general-purpose input/outputs (GPIO) on the USB_DIG Platform board. It also provides connection points for external connections of the shunt voltage, bus voltage, and GND. External BUF08630 Analog Power Supplies (2) T5 T4 VDUT Supply (VSD Power Supply) 25-Pin Male DSUB J1 Test Outputs BUF08630 TPG2 Test Point Header 2 I C Interface 2 I C A0 Address Jumper Figure 2. BUF08630_Test_Board Block Diagram 4 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Hardware Setup www.ti.com 2.2 Signal Definitions of J1 (25-Pin Male DSUB) Table 1 lists the different signals connected to J1 on the BUF08630_Test_Board. Table 1. Signal Definition of J1 (25-Pin Male DSUB) on BUF08630_Test_Board PIN on J1 Signal 1 N/C No connection 2 N/C No connection 3 N/C No connection 4 N/C No connection 5 N/C No connection 6 N/C No connection 7 N/C No connection 8 N/C No connection 9 I2C_SCK No connection 10 I2C_SDA2 No connection 11 N/C No connection 12 I2C_SCK_ISO I2C clock signal (SCL) channel 1; can be disconnected using a switch 13 I2C_SDA_ISO I2C data signal (SDA) channel 1; can be disconnected using a switch 14 N/C No connection 15 N/C No connection 16 N/C No connection 17 VDUT Switched 3V/5V power. Note that when power is switched off, digital I/O is also switched off. 18 VCC No connection 19 N/C No connection 20 N/C No connection 21 GND Common ground connection 22 SPI_SCK No connection 23 SPI_CS1 No connection 24 SPI_DOUT1 No connection 25 SPI_DIN1 No connection SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630 Pin BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 5 BUF08630EVM Hardware Setup 2.3 www.ti.com Theory of Operation for USB_DIG_Platform Figure 3 shows the block diagram for the USB_DIG Platform. This platform is a general-purpose data acquisition system that is used on several different Texas Instruments evaluation modules. The details of its operation are included in a separate document, SBOU058 (available for download at www.ti.com). The block diagram shown in Figure 3 gives a brief overview of the platform. The primary control device on the USB_DIG Platform is the TUSB3210. 3.3V Regulator VS mC 3.3V VUSB 5V TUSB3210 8052 mC with USB Interface and UART USB Bus from Computer 8K byte EEPROM Reset Button and Power-On Reset External Power (6V dc) Adjustable Regulator VCC (2.7V to 5.5V) Buffers and Latches I2C/SPI Control and Measure Bits Calibration EEPROM USB DIG Platform Power Switching VDUT (2.7V to 5.5V) Switched Power Figure 3. USB_DIG_Platform Block Diagram 6 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Hardware Overview www.ti.com 3 BUF08630EVM Hardware Overview The BUF08630EVM hardware overview involves connecting the two PCBs of the EVM together, applying power, connecting the USB cable, and setting the jumpers. This section presents the details of this procedure. 3.1 Electrostatic Discharge Warning CAUTION Many of the components on the BUF08630EVM are susceptible to damage by electrostatic discharge (ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling the EVM, including the use of a grounded wrist strap at an approved ESD workstation. 3.2 Typical Hardware Connections To set up the BUF08630EVM hardware, connect the two PCBs of the EVM together, and apply a power source to the BUF08630_Test_Board. The external connections may be the real-world system that the BUF08630 will be incorporated into. Figure 4 illustrates the typical hardware connections. Supply Max = 20V Required External Connections DC Power for USB_Dig_Platform 9V GND USB Cable Figure 4. Typical Hardware Connections for BUF08630EVM SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 7 BUF08630EVM Hardware Overview 3.3 www.ti.com Connecting the Hardware To connect the two PCBs of the BUF08630EVM together, gently push on both sides of the DSUB connectors (as shown in Figure 5). Note that the USB_DIG Platform board has two DSUB connectors; either may be used. Make sure that the two connectors are completely pushed together; loose connections may cause intermittent operation. 3.4 Connecting Power After the two parts of the BUF08630EVM are conjoined, connect a +9V wall supply to the USB_DIG Platform board, as Figure 5 shows. Always connect power before connecting the USB cable. If you connect the USB cable before connecting the power, the computer will attempt to communicate with an unpowered device that will not be able to respond. Figure 5. Connecting External Power to the EVM In addition, the BUF08630_Test_Board also requires two external dc power sources. These sources are not included with the kit, and the respective voltage of each source may differ depending on your specific testing needs. One source will be used to provide dc supply voltage to the BUF08630_Test board; the other will be used to deliver half that value to HVDD, also on the BUF08630_Test_Board. For example, if VS (terminal T4) is connected to a +12V dc external supply, HVDD (terminal T5) should be connected to a separate +6V dc external supply. 8 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Hardware Overview www.ti.com 3.5 Connecting the USB Cable to the BUF08630EVM Once power is connected, the USB cable must be connected to the DIG Platform, as shown in Figure 6. Note that the BUF08630_Test_Board and the USB_DIG Platform board must each be powered on before connecting the USB cable. Typically, the computer will respond with a Found New Hardware, USB Device pop-up dialog. The pop-up window typically changes to Found New Hardware, USB Human Interface Device. This pop-up indicates that the device is ready to be used. The USB_DIG Platform uses the human interface device drivers that are part of the Microsoft® Windows® operating system. In some cases, the Windows Add Hardware Wizard will pop up. If this prompt occurs, allow the system device manager to install the human interface drivers by clicking Yes when requested to install drivers. Figure 6. Connecting the USB Cable to the USB_DIG Platform In some cases, the Windows Add Hardware Wizard will be shown. If this prompt occurs, allow the system device manager to install the human interface drivers by clicking Yes when requested to install drivers. Windows will confirm installation of the drivers with the message shown in Figure 7. Figure 7. Confirmation of USB_DIG Platform Driver Installation SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 9 BUF08630EVM Hardware Overview 3.6 www.ti.com BUF08630EVM Default Jumper Settings Figure 8 shows the default jumpers configuration for the BUF08630EVM. In general, the jumper settings of the USB_DIG Platform will not need to be changed. You may want to change some of the jumpers on the BUF08630_Test_Board to match your specific configuration. For instance, you may wish to set a specific I2C address on the DUT. Figure 8. BUF08630EVM Default Jumper Settings 10 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Hardware Overview www.ti.com Table 2 summarizes the function of the BUF08630_Test_Board jumpers. For most applications, Jumpers 2 through 5 are all set to the respective default position. Table 2. BUF08630_Test_Board Jumper Functions Jumper Default Purpose 2 L This jumper selects I C A0 address selection. Two separate I2C addresses can be selected, depending on whether JMP1 is set to high or low. INT This jumper selects whether the BKSEL pin on the BUF08630 is controlled by the manual switch located on the BUF08630_Test_Board or whether the BKSEL can be controlled by an external source connected to terminal T3. The default INT position allows the BKSEL pin to be controlled by the manual switch. INT This jumper selects whether the VSD pin on the BUF08630 is connected to the VDUT signal generated from the USB_DIG_Platform or whether digital supply pin is connected to terminal T1, allowing for an external supply to power the digital circuitry. The default INT position connects the VSD pin to the VDUT control signal. INT This jumper selects whether the SCL pin on the BUF08630 is connected to the I2C_SCK_ISO signal generated from the USB_DIG_Platform or whether the SCL pin is connected to terminal T2 allowing for an external source to control the I2C clock line. The default INT position connects the SCL pin to the I2C_SCK_ISO control signal. JMP5 INT This jumper selects whether the SDA pin on the BUF08630 is connected to the I2C_SDA_ISO signal generated from the USB_DIG_Platform or whether the SDA pin is connected to terminal T2 allowing for an external source to control the I2C data line. The default INT position connects the SDA pin to the I2C_SDA_ISO control signal. JMP6 Short This jumper shorts VCOM and AVDD to each other. In the Open position, terminal T6 can be used to set the VCOM using an external power source. JMP1 JMP2 JMP3 JMP4 SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 11 BUF08630EVM Hardware Overview www.ti.com Table 3 summarizes the function of the USB_DIG Platform jumpers. For most applications, the default jumper position should be used. A separate document (SBOU058) gives details regarding the operation and design of the USB_DIG Platform. Table 3. USB_DIG_Platform Jumper Functions Jumper (1) 12 Default Purpose JUMP1 EXT This jumper selects external power or bus power. External power is applied on J5 or T3 (9V dc). Bus power is 5V from the USB bus. External power is typically used because the USB Bus power is noisy. JUMP2 EXT Same as JUMP1. JUMP3 EE ON This jumper determines where the TUSB3210 will load the USB_DIG Platform firmware upon powerup or reset. The EE Off position is used for development for development or firmware update. JUMP4, JUMP5 L, L This jumper sets the address for the USB board. The only reason to change from the default setting is if multiple boards are being used. JUMP9 5V This jumper selects the voltage of the device under test supply (VDUT = 5V or 3V). This jumper is typically the only jumper that is changed for most applications. JUMP10 WP ON This write protects the firmware EEPROM. JUMP11 WP ON This write protects the calibration EEPROM JUMP13 REG Uses the regulator output to generate the VDUT supply. The USB bus can be used as the VDUT supply. JUMP14 9V Uses the external power (9V as opposed to the bus) JUMP17 BUS While in the BUS position VDUT operation is normal. While in the Vraw position the VDUT supply is connected to an external source. This configuration allows for any value of VDUT between 3V and 5V. (1) JUMP18 VDUT Connects the pull-up on GPIO to the VDUT supply or the VCC supply. CAUTION: Adjusting outside of this range will damage the EVM. BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Hardware Overview www.ti.com 3.7 BUF08630EVM Features This section describes some of the hardware features present on the BUF08630EVM. 3.7.1 JMP1: I2C Address Hardware Setting Jumper JMP1 is used to set the hardware setting for the A0 I2C address pin on the BUF08630. Using JMP1, the A0 address can be set to either a logic '1' or a logic '0' to allow for two unique I2C addresses. See Section 5.2.1 for more details about how to configure the BUF08630EVM software to match the JMP1 hardware setting. 3.7.2 BKSEL: OTP Bank Selection The BKSEL switch (illustrated in Figure 9) located on the BUF08630_Test_Board selects the memory bank to be used when operating the EVM. Bank 0 selects the gamma curve that is stored in Bank_0 of the BUF08630. Bank 1 selects the gamma curve that is stored in Bank_1 of the BUF08630. Figure 9. BKSEL Switch 3.7.3 JMP2: BKSEL Control Setting Jumper JMP2 determines how the OTP memory bank selection is controlled. There are two settings for JMP2. Position INT specifies that control of the BKSEL pin is handled on the BUF08630_Test_Board. For this jumper setting, the BKSEL switch controls whether Bank 0 or Bank 1 OTP is selected. The EXT position for JMP2 allows for an external control signal connected to terminal T3 to determine the selection of which OTP bank to be used. 3.7.4 JMP3: VSD Control Setting Jumper JMP3 selects where the BUF08630 digital supply pin is connected. If JMP3 is set in the INT position, the VSD pin is connected to the switchable VDUT signal generated from the USB_DIG_Platform. This voltage can be set to either 3.3V or 5V depending on how JUMP9 on the USB_DIG_Platform is set. While JMP3 is set to the INT position, the VSD Power button on the BUF08630 software is able to control whether the VDUT supply voltage is turned on or off. When JMP3 is set in the EXT position, an external supply connected to terminal T1 can be used to provide the digital supply voltage for the BUF08630. SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 13 BUF08630EVM Hardware Overview 3.7.5 www.ti.com JMP4: I2C SCK Control Setting Jumper JMP4 selects where the BUF08630 I2C SCL pin is connected. If JMP4 is set in the INT position, the I2C clock signal is generated from the I2C_SCK_ISO signal from the USB_DIG_Platform. When JMP4 is set in the EXT position, an external source connected to SCL pin of terminal T2 can be used to provide the I2C SCK signal for the BUF08630. 3.7.6 JMP5: I2C SDA Control Setting Jumper JMP5 selects where the BUF08630 I2C SDA pin is connected. If JMP5 is set in the INT position, the I2C data signal is generated from the I2C_SDA_ISO signal from the USB_DIG_Platform. When JMP5 is set in the EXT position, an external source connected to SDA pin of terminal T2 can be used to provide the I2C SDA signal for the BUF08630. 3.7.7 JMP6: VCOM Supply Control Setting Jumper JMP6 selects where the BUF08630 VCOM supply pin is connected. If JMP6 is set to the SHORT position, the VCOM supply pin is connected to the VS pin. When JMP6 is set in the OPEN position, an external supply connected to terminal T6 can be used to provide the VCOM supply voltage for the BUF08630. 3.7.8 BUF08630 Device Placement The BUF08630_Test_Board allows the user two separate locations on the board where the BUF08630 test device can be installed. The U1 location on the BUF08630_Test_Board allows for a BUF08630 device that is soldered down on a DIP adaptor board to be installed on the BUF08630_Test_Board. The output capability of the BUF08630 that is soldered on this adaptor board can be fully evaluated. The PowerPAD of this soldered BUF08630 is connected correctly, and allows the device to dissipate the necessary power while being evaluated. The U2 location on the BUF08630_Test_Board is a 20-pin QFN/MLF test socket that allows the user to evaluate and program many devices very quickly. One drawback to this socket is that there is no connection to the PowerPAD of the BUF08630. Because of this drawback, while in this socket, the BUF08630 cannot operate ar ts full output capability as a result of thermal dissipation limitations.. CAUTION Only one location should be populated at a time. The use of both locations simultaneously will likely damage one or both of the devices being tested. 3.7.9 Terminal Strip TPG2 Terminal strip TPG2 provides the individual channel output signals on a single row of headers as well as a row of vias. This footprint provides the user with multiple options on how to interface the output signals of the BUF08630 with their display panel. The user can also develop a custom cable to connect directly to the headers to thedesired panels or to solder directly to the individual vias. 14 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Software Setup www.ti.com 4 BUF08630EVM Software Setup This section discusses how to install the BUF08630 software. 4.1 Operating Systems for BUF08630EVM Software The BUF08630EVM software has been tested on the Microsoft Windows XP, Windows Vista, and WIndows7 operating systems (OSs) with United States and European regional settings. 4.2 BUF08630EVM Software Installation The BUF08630EVM software is included on the CD that is shipped with the EVM kit. It is also available through the BUF08630EVM product folder on the TI web site. To download the software to your system, insert the disc into an available CD-ROM drive. Navigate to the drive contents and open the BUF08630EVM software folder. Locate the compressed file (BUF08630EVM.zip) and open it. Using WinZIP® or a similar file compression program, extract the BUF08630EVM files into a specific BUF08630 folder (for example, C:\BUF08630) on your hard drive. Figure 10. BUF08630EVM Software Install Window After the installation process initializes, the user must choose the directory where the program is to be installed, usually defaulting to C:\Program Files\BUF08630\ and C:\Program Files\National Instruments\. Following this selection, two license agreements are presented that must be accepted; see Figure 11. After accepting the Texas Instruments and National Instruments license agreements, the progress bar opens and shows the installation of the software. Once the installation process is completed, click Finish. SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 15 BUF08630EVM Software Setup www.ti.com The BUF08630EVM software installer file then opens to begin the installation process, as Figure 12 shows. space Figure 11. BUF08630EVM License Agreements 4.3 Figure 12. BUF08630EVM Software Installation Progress Software Description and Set-Up The BUF08630EVM software allows the user to read and write to all registers in the BUF08630 gamma correction buffer. Furthermore, it allows programming of the OTP register on the BUF08630. The software also permits the user to select either I2C address. Press the About button as shown in Figure 13 to verify that you have the latest version of the software. Figure 13. BUF08630EVM Software About Button 5 BUF08630EVM Software Overview This section discusses how to use the BUF08630 software. 5.1 Starting the BUF08630EVM Software The BUF08630 software can be operated through the Windows Start menu. From Start, select All Programs; then select the BUF08630EVM program. 16 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Software Overview www.ti.com Figure 14 shows how the software should appear if the EVM is functioning properly. Figure 14. BUF08630EVM Software Functioning Properly Figure 15 shows an error that pops up if the computer cannot communicate with the EVM. If you receive this error, first check to see that the USB cable is properly connected on both ends. This error can also occur if you connect the USB cable before the USB_DIG_Platform power source. Another possible source for this error is a problem with your PC USB Human Interface Device driver. Make sure that the device is recognized when the USB cable is plugged in; recognition is indicated by a Windows-generated confirmation sound. Figure 15. BUF08630EVM Software: Communication Error with the USB_DIG_Platform SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 17 BUF08630EVM Software Overview 5.2 5.2.1 www.ti.com Using the BUF08630 Software I2C Address Selection As mentioned previously in the BUF08630_Test_Board Features section (see Section 3.7), jumper JMP1 is used to set the I2C address pin of the BUF08630. Figure 16 shows how the hardware and software must both be set to allow for communication between the BUF08630EVM and the software. Without jumper JMP1 and the software address button configured correctly, the software will not be able to communicate with the BUF08630 device. Figure 16. BUF08630_Test_Board Jumper JMP1 Set For Logic ‘1’ When JMP1 and the software are set as shown in Figure 17, the second I2C address can be configured. Figure 17. BUF08630_Test_Board Jumper JMP1 Set For Logic ‘0’ 18 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Software Overview www.ti.com 5.2.2 Measuring the Power Supply You must measure the power supply (VS) with respect to the GND on the BUF08630_Test_Board and enter it in the VSUP field located in the top section of the software interface, as shown in Figure 18. Figure 18. Measuring and Entering Power-Supply Voltage The voltage out of each DAC is calculated according to the VS value entered. For example, changing the value in the channel 6 cell as shown below immediately changes the output of channel 6 to 0.996V. The calculation is performed according to Equation 1. V ´ Code_in_Decimal VDAC_CHANNEL = S 1024 (1) Example 1. Channel 6: Code 44 (hexadecimal) = 68 (decimal) VDAC_CHANNEL = 15V ´ 68 = 0.996V 1024 SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 19 BUF08630EVM Software Overview 5.2.3 www.ti.com Read DAC Button By pressing the Read DAC button in the BUF08630EVM software, all of the BUF08630 DAC/VCOM registers are read to obtain the respective current register contents. Once the read procedure is complete, all of the corresponding text boxes are updated to show the current values present in the DAC/VCOM registers. 5.2.4 Write DAC Button The method used to write the values in the DAC/VCOM registers is based on whether or not the Auto Write feature is enabled. The BUF08630 has two methods of writing information into the DAC/VCOM registers. The first method allows for the output voltage to change immediately after the writing to the DAC register. In the BUF08630EVM software, this mode is configured by enabling the Auto Write feature found in the Buffer Menu dropdown menu. In this mode, as an individual channel is written to, the output voltage changes as soon as the user moves to a different text box in the software. The second method of writing to the DAC/VCOM registers allows for the user to write multiple channels and then have all of the output voltages change at the same time rather than each channel voltage changing as soon as it is written to. Disabling the Auto Write feature in the software allows the user to enter all of the values desired for all of the channels and then press the Write DAC button to change all of the output voltage of all of the channels at one time. When the Auto Write feature is enabled, no change occurs to the output voltages when the Write DAC button is pressed. No change occurs because after the text box for a given channel has been updated, as soon as another item in the software is clicked, the Auto Write feature automatically performs a write command to the updated channel that then updates the output voltage. When in the Auto Write enabled mode, the Write DAC button cannot be pressed with different data in the corresponding channel text boxes than the values already stored in the DAC/VCOM register; thus, no change occurs. Figure 19 shows the location in the Buffer Menu showing the Auto Write feature enabled. Clicking on the Auto Write feature again enables/disables the feature, depending on its current state. Figure 19. Auto Write Feature Enabled 20 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Software Overview www.ti.com 5.2.5 Reset Button Pressing the Reset button in the BUF08630EVM software performs two functions. The first function is to call a General-Call Reset for the BUF08630. The status of the DAC/VCOM registers after this General-Call Reset has been called depends upon whether the OTP has been programmed or not. If the OTP has been programmed, the channel registers will be loaded with the last values programmed into the OTP memory. If the OTP memory has not been programmed, the channel registers will default to 1000000000, or mid-supply. The second function performed after the Reset button is pressed is that a Read DAC call is made to update the corresponding channel text boxes to the current value for each channel. 5.2.6 Save to File Button The register configurations of the BUF08630 DACs are displayed in both analog voltage and in hexadecimal (see Figure 14). The DAC codes (that is, gamma voltages) can be saved into a text file using the Save to File button. Pressing the Save to File button opens a file-save dialog box similar to that shown in Figure 20. Pressing the folder icon creates a new folder on your PC. It is a good idea to create a directory exclusively for BUF08630 DAC code (that is, gamma voltage) files. Enter a unique file name in the File name field to store your BUF08630 register information. Press the OK button to save the file. Figure 20. Save to File Dialog Box Button and Window Saved BUF08630 DAC codes (gamma voltages) exist in a text file that can be opened in a text editor, as Figure 21 illustrates. Figure 21. File Format of Saved Data SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 21 BUF08630EVM Software Overview 5.2.7 www.ti.com Load From File Button The BUF08630EVM software is also able to load data saved from previous evaluations. A saved register configuration can be loaded into the BUF08630 using the Load From File button, as shown in Figure 22. The program remembers where you saved the last register configuration. Simply select the desired configuration and press Open. Figure 22. Load From File Button and Window 5.2.8 Changing the DAC/VCOM Analog Voltage The voltage of any of the DAC or VCOM channels can be adjusted in several ways. First, you can change the voltage by entering the desired voltage directly in the voltage text box. In order to be able to manually type the voltage into the text box, you must first click on the cell to be edited. Click a second time and the cell turns from blue to black, and allows the user to type the updated voltage in the cell. The hexadecimal DAC codes can be entered in the Code column in the same manner. Another method of changing the voltage of a DAC or VCOM channel is through the use of the slider on the main software window. There is only a single slider that is used for all channels. In order to use the slider to adjust the voltage of a particular channel, that channel must first be selected. To select a channel, click on either the channel number, voltage, or code of a particular channel. The entire channel row highlights in blue to show the user that the channel is selected. Adjusting the slider bar then only updates the highlighted channel. The final method to change DAC/VCOM voltages is through the ±1 Code and ±5 Code buttons on the main software window. These buttons allow for fine and coarse adjustments, respectively, to the highlighted channel, giving the user the ability to quickly step the channel output up or down as needed without having to manually enter the changes in the Code column. 22 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Software Overview www.ti.com 5.2.9 Run Batch Button The Run Batch button (as highlighted in Figure 23) enables the user to configure the BUF08630 to cycle through different register configurations in a continuous loop. When connected to the end application, this feature can be used to cycle through different gamma settings to determine what the optimal settings must be for a given application. When the Run Batch button is pressed, a new dialog box displays as Figure 23 shows. The delay time is the amount of time allowed between loading new configurations into the BUF08630 DUT. Use the Single Step Up and Single Step Down buttons to step through the selected files manually. The currently-selected file name is displayed in the lower left corner area of the dialog box. Double-click on the file names to select them. Once a series of filenames have been selected, the check box turns dark. Double-click on a filename again to unselect it from the batch run. Figure 23. Run Batch Dialog Button and Window SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 23 BUF08630EVM Software Overview 5.2.10 www.ti.com Control Panel Button Pressing the Control Panel button brings up a display panel that allows you to adjust each channel using a set of graphical sliders, as shown in Figure 24. Simply drag the slider to adjust the desired channel output. The DAC code and corresponding output value of each channel change automatically. This function is similar to the slider present on the primary BUF08630EVM software window that changes based on the channel that highlighted (as discussed in the above section). Figure 24. Control Panel Button and Window 24 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Software Overview www.ti.com 5.2.11 Program OTP All Channels Button As Figure 25 shows, pressing the Program OTP All Channels button allows you to program a gamma curve into the nonvolatile memory in the BUF08630. All eight channels (including the VCOM channels) are then programmed simultaneously. The values are stored in the memory bank that is selected via the BKSEL switch (see Section 3.7.2). Figure 25. Program OTP All Channels Button SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 25 BUF08630EVM Software Overview 5.2.12 www.ti.com Gain Figure 26 shows the different programmable gain settings for the VCOM output. The gain can be set using the included buffer gains of 1 through 6, or can be configured externally by the user. Figure 26. Gain Settings The external function allows you to customize your gain levels using external resistors R1, R2, and R3. Figure 27 shows where these resistors may be added on the BUF08630_Test_Board. You may use either surface-mount or through-hole resistors. Figure 27. Adding External Gain Resistors 26 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Documentation www.ti.com 6 BUF08630EVM Documentation This section contains the complete bill of materials and schematic diagram for the BUF08630_Test_Board. Documentation information for the USB_DIG_Platform can be found in the USB_DIG_Platform User’s Guide, SBOU058, available at the TI web site at http://www.ti.com. 6.1 BUF08630_Test_Board Schematic Figure 28 shows the schematic for the BUF08630_Test_Board. Figure 28. BUF08630_Test_Board Schematic SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback BUF08630EVM User Guide and Software Tutorial Copyright © 2010–2016, Texas Instruments Incorporated 27 BUF08630EVM Documentation 6.2 www.ti.com BUF08630_Test_Board PCB Layout The PCB layout of the components for the BUF08630EVM is shown in Figure 29. Figure 29. BUF08630EVM PCB Components Layout 28 BUF08630EVM User Guide and Software Tutorial SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated BUF08630EVM Documentation www.ti.com 6.3 BUF08630_Test_Board Bill of Materials Table 4 lists the bill of materials for this EVM. Table 4. BUF08630_Test_Board Bill of Materials No. Qty Value Ref Des Description Vendor Part number Vishay/Dale CMF5034R000FHEB 1 1 34Ω R1 Resistor, 34.0Ω 1% 50PPM 1/4W, See assembly drawing in Figure 28 2 1 1.2kΩ R2 Resistor, 1.21KΩ 1% 50PPM 1/4W, See assembly drawing in Figure 28 Vishay/Dale CMF501K2100FHEB 3 1 150Ω R3 Resistor, 150Ω 1% 50PPM 1/4W, See assembly drawing in Figure 28 Vishay/Dale CMF50150R00FHEB 4 1 249kΩ R4 Resistor, 249kΩ 1/16W .5% 0603 SMD Susumu Co Ltd RR0816P-2493-D-39D 51 4 4.7µF C1, C3, C9, C17 Capacitor, Tantalum 4.7µF 35V 10% SMD Vishay/Sprague 293D475X9035C2TE3 6 4 1µF C2, C4, C10, C18 Capacitor, Ceramic 1 µF 25V Y5V 0603 Murata Electronics North America GRM188F51E105ZA12D 7 10 0.1µF C5-C8, C11-C16 Capacitor, .10µF 25V Ceramic Y5V 0603 Kemet C0603C104Z3VACTU 8 1 U1 Test Socket for 20-Pin QFN/MLF Emulation Technology, Inc. S-MLF-00-020-A 9 2 U2 Conn RCPT .100" 11POS GOLD T/H; See assembly drawing in Figure 28 Samtec Inc SS-111-G-2 10 1 U3 IC Buffer Schmitt Trig SOT235 Texas Instruments SN74LVC1G17DBVR Term Block 3-Pos 5.08mm SCREWLESS Tyco Electronics 1437671-4 11 1 T2 12 6 Pin Socket (R1R3) Pin Socket Rcpt .014-.026 30AU AMP 5050863-5 13 8 TP Cut to Size Test Points, All Conn Header 1POS .100" SGL Gold Samtec TSW-132-07-G-S 14 4 Standoff None Standoffs, Hex , 4-40 Threaded, 0.500" length, 0.250" OD, Aluminum Iridite Finish Keystone 2203 15 4 Screw none Screw Machine Phil 4-40X1/4 SS Building Fasteners PMSSS 440 0025 PH Conn Header 3POS .100" SGL Gold Samtec TSW-132-07-G-S N/A Shunt LP W/Handle 2-Pos 30AU AMP/Tyco Electronics 881545-2 U1 20-Pin QFN Texas Instruments 16 5 17 5 18 1 Cut to Size BUF08630 JMP1-JMP6 BUF08630 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (September 2010) to A Revision ............................................................................................... Page • Changed power supply in BUF08630EVM Kit Contents section. ................................................................... 3 SBOU091A – September 2010 – Revised August 2016 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Revision History 29 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated