User's Guide
SBOU081A – November 2009 – Revised August 2016
BUF08832EVM User Guide and Software Tutorial
This user's guide describes the characteristics, operation, and use of the BUF08832EVM evaluation
board. It discusses how to set up and configure the software and hardware, and reviews various aspects
of the program operation. Throughout this document, the terms evaluation board, evaluation module, and
EVM are synonymous with the BUF08832EVM. This user's guide also includes information regarding
operating procedures and input/output connections, an electrical schematic, and a parts list for the EVM.
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Contents
Overview ...................................................................................................................... 2
BUF08832EVM Hardware Setup .......................................................................................... 3
BUF08832EVM Hardware Overview ...................................................................................... 6
BUF08832EVM Software Setup .......................................................................................... 13
BUF08832EVM Software Overview...................................................................................... 16
BUF08832EVM Documentation .......................................................................................... 26
List of Figures
1
BUF08832EVM Hardware Setup .......................................................................................... 3
2
BUF08832_Test_Board Block Diagram
3
USB_DIG_Platform Theory of Operation ................................................................................. 5
4
Typical Hardware Connections ............................................................................................ 6
5
Connecting Power to the EVM ............................................................................................. 7
6
Connecting the USB Cable ................................................................................................. 8
7
BUF08832EVM Default Jumper Settings ................................................................................. 9
8
BKSEL Switch .............................................................................................................. 12
9
BUF08832EVM Software Installation .................................................................................... 14
10
BUF08832EVM Software Install Window ............................................................................... 14
11
BUF08832EVM Software About Button ................................................................................. 15
12
BUF08832EVM Software Functioning Properly ........................................................................ 16
13
BUF08832EVM Software: No Communication with the USB_DIG_Platform....................................... 17
14
BUF08832_Test_Board Jumper JMP1 Set For Logic ‘1’
15
BUF08832_Test_Board Jumper JMP1 Set For Logic ‘0’
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24
25
..................................................................................
.............................................................
.............................................................
Measuring and Entering Power-Supply Voltage .......................................................................
Auto Write Feature Enabled ..............................................................................................
Save to File Dialog Box Button and Window ...........................................................................
File Format of Saved Data ................................................................................................
Load From File Button and Window .....................................................................................
Run Batch Dialog Button and Window ..................................................................................
Control Panel Button and Window .......................................................................................
Program OTP All Channels Button ......................................................................................
Max Bank Field .............................................................................................................
BUF08832_Test_Board Schematic ......................................................................................
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PowerPAD is a trademark of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
WinZIP is a registered trademark of WinZIP International, LLC.
All other trademarks are the property of their respective owners.
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Overview
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List of Tables
1
1
Signal Definition of J1 (25-Pin Male DSUB) on BUF08832_Test_Board............................................. 4
2
BUF08832_Test_Board Jumper Functions ............................................................................. 10
3
USB_DIG_Platform Jumper Functions .................................................................................. 11
4
BUF08832_Test_Board Bill of Materials
...............................................................................
28
Overview
The BUF08832 is a programmable gamma-voltage generator and VCOM calibrator. This device offers eight
programmable gamma channels and one programmable VCOM channel, making it ideal for 10-bit source
TFT-LCD reference drivers. The BUF08832EVM is a platform for evaluating the performance of the
BUF08832 under various signal, reference, and supply conditions. This document gives a general
overview of the BUF08832EVM, and provides a general description of the features and functions to be
considered while using this evaluation module.
1.1
BUF08832EVM Kit Contents
Contact the Texas Instruments Product Information Center nearest you if any component is missing.
The complete kit includes the following items:
• BUF08832_Test_Board PCB
• USB DIG Platform PCB
• USB cable
• Barrel plug cable assembly (part # 10-01935 - Tensility International Corporation) for external power
supply
• CD-ROM that contains this user’s guide, product software, and related documentation
Check the TI web site at http://www.ti.com to verify that you have the latest versions of the related
software.
1.2
Related Documentation from Texas Instruments
The following documents provide information regarding Texas Instruments' integrated circuits used in the
assembly of the BUF08832EVM. This user's guide is available from the TI web site under literature
number SBOU081. Any letter appended to the literature number corresponds to the document revision
that is current at the time of the writing of this document. Newer revisions may be available from the TI
web site, or call the Texas Instruments' Literature Response Center at (800) 477-8924 or the Product
Information Center at (972) 644- 5580. When ordering, identify the document by both title and literature
number.
Related Documentation
Document
2
Literature Number
BUF08832 Product Data Sheet
SBOS476
USB DIG Platform Users Guide
SBOU058
BUF08832EVM User Guide and Software Tutorial
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BUF08832EVM Hardware Setup
Figure 1 shows the system setup for the BUF08832EVM. The PC runs software that communicates with
the USB DIG Platform. The USB DIG Platform generates the analog and digital signals used to
communicate with the BUF08832_Test_Board. Connectors on the BUF08832_Test_Board allow the user
to connect to the device under test (DUT), in order to monitor the power, current, and voltage of the
BUF08832 DUT.
Figure 1. BUF08832EVM Hardware Setup
2.1
Theory of Operation for BUF08832_Test_Board Hardware
Figure 2 presents a block diagram of the BUF08832_Test_Board. The functionality of this PCB is relatively
simple. It provides connections to the I2C interface and general-purpose input/outputs (GPIO) on the USB
DIG Platform board. It also provides connection points for external connections of the shunt voltage, bus
voltage, and GND.
External BUF08832
Analog Power Supply
T4
VDUT Supply
(VSD Power Supply)
25-Pin
Male DSUB Signals
from USB Dig Platform
2
IC
Interface
Output Channels
BUF08832
T5
2
I C A0 Address
Jumper
Figure 2. BUF08832_Test_Board Block Diagram
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Signal Definitions of J1 (25-Pin Male DSUB)
Table 1 lists the different signals connected to J1 on the BUF08832_Test_Board. Table 1 also identifies
signals connected to pins on J1 that are not used on the BUF08832_Test_Board.
Table 1. Signal Definition of J1 (25-Pin Male DSUB) on BUF08832_Test_Board
4
PIN On J1
Signal
1
NC
No connection
BUF08832 Pin
2
NC
No connection
3
NC
No connection
4
NC
No connection
5
NC
No connection
6
NC
No connection
7
NC
No connection
8
NC
No connection
9
I2C_SCK
No connection
2
10
I C_SDA2
No connection
11
NC
No connection
12
I C_SCK_ISO
I2C clock signal (SCL) channel 1; can be
disconnected using a switch
13
I2C_SDA_ISO
I2C data signal (SDA) channel 1; can be
disconnected using a switch
14
NC
No connection
15
NC
No connection
16
NC
No connection
17
VDUT
Switched 3V or 5V power. Note that when
power is switched off, the digital I/O is also
switched off.
18
VCC
No connection
19
NC
No connection
20
NC
No connection
21
GND
22
SPI_SCK
No connection
23
SPI_CS1
No connection
24
SPI_DOUT
No connection
25
SPI_DIN1
No connection
2
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Common or ground connection for power.
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2.3
Theory of Operation for USB_DIG_Platform
Figure 3 shows the block diagram for the USB DIG Platform. This platform is a general-purpose data
acquisition system that is used on several different Texas Instruments evaluation modules. The details of
its operation are included in a separate document, SBOU058 (available for download at www.ti.com). The
block diagram shown in Figure 3 gives a brief overview of the platform. The primary control device on the
USB DIG Platform is the TUSB3210.
External
Power
Adjustable
Regulator
VCC
(2.7V to 5.5V)
3.3V Regulator
Power
Switching
VDUT
(2.7V to 5.5V)
Switched Power
USB Dig Platform
EVM
VS Microcontroller
3.3V
USB
from
Computer
VUSB
5V
TUSB3210
8052 mC
with USB Interface
and UART
2
Buffers and
Latches
IC
SPI
Control Bits
Measure Bits
8Kx8 Byte
EEPROM
Reset Button
and
Power On Reset
Figure 3. USB_DIG_Platform Theory of Operation
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BUF08832EVM Hardware Overview
The BUF08832EVM hardware overview involves connecting the two PCBs of the EVM together, applying
power, connecting the USB cable, and setting the jumpers. This section presents the details of this
procedure.
3.1
Electrostatic Discharge Warning
CAUTION
Many of the components on the BUF08832EVM are susceptible to damage by
electrostatic discharge (ESD). Customers are advised to observe proper ESD
handling precautions when unpacking and handling the EVM, including the use
of a grounded wrist strap at an approved ESD workstation.
3.2
Typical Hardware Connections
To set up the BUF08832EVM hardware, connect the two PCBs of the EVM together, and apply a power
source to the BUF08832 Test Board. The external connections may be the real-world system that the
BUF08832 will be incorporated into. Figure 4 illustrates the typical hardware connections.
Figure 4. Typical Hardware Connections
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3.3
Connecting the Hardware
To connect the two PCBs of the BUF08832EVM together, gently push on both sides of the DSUB
connectors (as shown in Figure 5). Make sure that the two connectors are completely pushed together;
loose connections may cause intermittent operation.
3.4
Connecting Power
After the two parts of the BUF08832EVM are connected, as Figure 5 shows, connect the power to the
EVM. Always connect power before connecting the USB cable. If you connect the USB cable before
connecting the power, the computer will attempt to communicate with an unpowered device that will not be
able to respond.
Figure 5. Connecting Power to the EVM
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Connecting the USB Cable to the BUF08832EVM
Figure 6 shows the typical response to connecting the USB DIG Platform board to a PC USB port for the
first time. Note that the EVM must be powered on before connecting the USB cable. Typically, the
computer will respond with a Found New Hardware, USB Device pop-up dialog. The pop-up window
typically changes to Found New Hardware, USB Human Interface Device. This pop-up indicates that the
device is ready to be used. The USB DIG Platform uses the human interface device drivers that are part
of the Microsoft® Windows® operating system.
In some cases, the Windows Add Hardware Wizard will pop up. If this prompt occurs, allow the system
device manager to install the human interface drivers by clicking Yes when requested to install drivers.
Figure 6. Connecting the USB Cable
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3.6
BUF08832EVM Default Jumper Settings
Figure 7 shows the default jumpers configuration for the BUF08832EVM. In general, the jumper settings of
the USB DIG Platform will not need to be changed. You may want to change some of the jumpers on the
BUF08832_Test_Board to match your specific configuration. For instance, you may wish to set a specific
I2C address on the DUT.
Figure 7. BUF08832EVM Default Jumper Settings
Jumpers 2 through 5 on the BUF08832_Test_Board are all typically set to the same position. When set to
the INT position, the signals for digital supply, bank select and the digital communication lines are
generated and controlled from the USB_DIG_Platform or by the onboard bank select switch. When these
jumpers are set to the EXT position, the previously described signals connect to the terminal strips T1, T2,
and T3. Jumper 1 controls the I2C address pin for the BUF08832. This jumper can set the address for A0
to either high or low.
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Table 2 summarizes the function of the BUF08832_Test_Board jumpers. For most applications, Jumpers
2 through 5 are all set to either the INT or the EXT position.
Table 2. BUF08832_Test_Board Jumper Functions
Jumper
Default
Purpose
2
JMP1
JMP2
JMP3
JMP4,
JMP5
10
L
This jumper selects I C AO address selection. Two
separate I2C addresses can be selected, depending
on whether JMP1 is set to high or low.
INT
This jumper selects whether the BKSEL pin on the
BUF08832 is controlled by the manual switch
located on the BUF08832_Test_Board or whether
the BKSEL can be controlled by an external source
connected to terminal T3. The default INT position
allows the BKSEL pin to be controlled by the
manual switch.
INT
This jumper selects whether the VSD pin on the
BUF08832 is connected to the VDUT signal
generated from the USB_DIG_Platform or whether
digital supply pin is connected to terminal T1,
allowing for an external supply to power the digital
circuitry. The default INT position connects the VSD
pin to the VDUT control signal.
INT
This jumper selects whether the SCL pin on the
BUF08832 is connected to the I2C_SCK_ISO signal
generated from the USB_DIG_Platform or whether
the SCL pin is connected to terminal T2 allowing for
an external source to control the I2C clock line. The
default INT position connects the SCL pin to the
I2C_SCK_ISO control signal.
INT
This jumper selects whether the SDA pin on the
BUF08832 is connected to the I2C_SDA_ISO signal
generated from the USB_DIG_Platform or whether
the SDA pin is connected to terminal T2 allowing for
an external source to control the I2C data line. The
default INT position connects the SDA pin to the
I2C_SDA_ISO control signal.
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Table 3 summarizes the function of the USB DIG Platform jumpers. For most applications, the default
jumper position should be used. A separate document (SBOU058) gives details regarding the operation
and design of the USB DIG Platform.
Table 3. USB_DIG_Platform Jumper Functions
Jumper
(1)
Default
Purpose
JUMP1
EXT
This jumper selects external power or bus power.
External power is applied on J5 or T3 (9V dc). Bus
power is 5V from the USB bus. External power is
typically used because the USB Bus power is noisy.
JUMP2
EXT
Same as JUMP1.
JUMP3
EE ON
JUMP4, JUMP5
L, L
This jumper sets the address for the USB board.
The only reason to change from the default setting
is if multiple boards are being used.
JUMP9
5V
This jumper selects the voltage of the device under
test supply (VDUT = 5V or 3V). This jumper is
typically the only jumper that is changed for most
applications.
JUMP10
WP ON
This write protects the firmware EEPROM.
JUMP11
WP ON
This write protects the calibration EEPROM
JUMP13
REG
Uses the regulator output to generate the VDUT
supply. The USB bus can be used as the VDUT
supply.
JUMP14
9V
Uses the external power (9V as opposed to the
bus)
JUMP17
BUS
While in the BUS position VDUT operation is normal.
While in the Vraw position the VDUT supply is
connected to an external source. This configuration
allows for any value of VDUT between 3V and 5V. (1)
JUMP18
VDUT
Connects the pull-up on GPIO to the VDUT supply or
the VCC supply.
This jumper determines where the TUSB3210 will
load the USB DIG Platform firmware upon power-up
or reset. The EE Off position is used for
development for development or firmware update.
CAUTION: Adjusting outside of this range will damage the EVM.
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BUF08832_Test_Board Features
This section describes some of the hardware features present on the BUF08832_Test_Board.
3.7.1
JMP1: I2C Address Hardware Setting
Jumper JMP1 is used to set the hardware setting for the A0 I2C address pin on the BUF08832. Using
JMP1, the A0 address can be set to either a logic '1' or a logic '0' to allow for two unique I2C addresses.
See Section 5.2.1 for more details about how to configure the BUF08832EVM software to match the JMP1
hardware setting.
3.7.2
BKSEL: OTP Bank Selection
The BKSEL switch (illustrated in Figure 8) located on the BUF08832_Test_Board selects the memory
bank to be used when operating the EVM. Bank 0 selects the gamma curve that is stored in Bank_0 of the
BUF08832. Bank 1 selects the gamma curve that is stored in Bank_1 of the BUF08832.
Figure 8. BKSEL Switch
3.7.3
JMP2: BKSEL Control Setting
Jumper JMP2 determines how the OTP memory bank selection is controlled. There are two settings JMP2
can be set to. Position INT specifies that control of the BKSEL pin is handled on the BUF08832EVM. For
this jumper setting, the BKSEL switch controls whether Bank 0 or Bank 1 OTP is selected.
The EXT position for JMP2 allows for an external control signal connected to terminal T3 to determine the
selection of which OTP bank to be used.
3.7.4
JMP3: VSD Control Setting
Jumper JMP3 selects where the BUF08832 digital supply pin is connected. If JMP3 is set in the INT
position, the VSD pin is connected to the switchable VDUT signal generated from the USB_DIG_Platform.
This voltage can be set to either 3.3V or 5V depending on how JUMP9 on the USB_DIG_Platform is set.
While JMP3 is set to the INT position, the VSD Power button on the BUF08832 software is able to control
whether the VDUT supply voltage is turned on or off.
When JMP3 is set in the EXT position, an external supply connected to terminal T1 can be used to
provide the digital supply voltage for the BUF08832.
3.7.5
JMP4: I2C SCK Control Setting
Jumper JMP4 selects where the BUF08832 I2C SCL pin is connected. If JMP4 is set in the INT position,
the I2C clock signal is generated from the I2C_SCK_ISO signal from the USB_DIG_Platform.
When JMP4 is set in the EXT position, an external source connected to SCL pin of terminal T2 can be
used to provide the I2C SCK signal for the BUF08832.
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3.7.6
JMP5: I2C SDA Control Setting
Jumper JMP5 selects where the BUF08832 I2C SDA pin is connected. If JMP5 is set in the INT position,
the I2C data signal is generated from the I2C_SDA_ISO signal from the USB_DIG_Platform.
When JMP4 is set in the EXT position, an external source connected to SDA pin of terminal T2 can be
used to provide the I2C SDA signal for the BUF08832.
3.7.7
BUF08832 Device Placement
The BUF08832_Test_Board allows the user two separate locations on the board where the BUF08832
test device can be installed. The U1 location on the BUF08832_Test_Board is a ZIF socket that allows the
user to evaluate and program many devices very quickly. One drawback to this socket is that there is no
connection to the PowerPAD™ thermal pad of the BUF08832. Because of this drawback, while in this
socket, the BUF08832 cannot be operated to its full output capability as a result of thermal dissipation
limitations.
The U2 location allows for a BUF08832 device that is soldered down on a DIP adaptor board to be
installed on the BUF08832_Test_Board. The output capability of the BUF08832 that is soldered to this
adaptor board can be fully evaluated. The thermal pad of this soldered BUF08832 is connected correctly
allowing the device to dissipate the necessary power while being evaluated. One populated BUF00832
DIP adaptor board is provided with the EVM.
CAUTION
Only one location should be populated at a time. The use of both locations
simultaneously will likely damage one or both of the devices being tested.
3.7.8
Terminal Strip T5
Terminal strip T5 provides the individual channel output signals on a single row of headers as well as a
row of vias. This footprint provides the user with multiple options on how to interface the output signals of
the BUF08832 with the appropriate display panel or evaluation system. Users can develop a custom cable
to connect the headers directly to their panels or solder directly to the individual vias.
4
BUF08832EVM Software Setup
This section discusses how to install the BUF08832 software.
4.1
Operating Systems for BUF08832 Software
The BUF08832EVM software has been tested on the Microsoft Windows XP operating system (OS) with
United States and European regional settings. The software should also function on other Windows
operating systems.
4.2
BUF08832EVM Software Installation
The BUF08832EVM software is included on the CD that is shipped with the EVM kit. It is also available
through the BUF08832EVM product folder on the TI web site. To download the software to your system,
insert the disc into an available CD-ROM drive. Navigate to the drive contents and open the
BUF08832EVM software folder. Locate the compressed file (BUF08832EVM.zip) and open it. Using
WinZIP® or a similar file compression program, extract the BUF08832EVM files into a specific BUF08832
folder (for example, C:\BUF08832) on your hard drive.
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Once the files are extracted, navigate to the BUF08832 folder that you created on your hard drive. Locate
the setup.exe file; then click the file to start the installation process, as shown in Figure 9.
Figure 9. BUF08832EVM Software Installation
The BUF08832 software installer file then opens to begin the installation process, as Figure 10 shows.
Figure 10. BUF08832EVM Software Install Window
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After the installer has begun, the user is given the choice of where to install the program on the PC.
Following this option, two license agreements are presented that must be accepted. After accepting the
Texas Instruments and National Instruments license agreements, the progress bar opens and shows the
installation of the software. At the completion of the software installation, a Read Me file opens, showing
the hardware that is provided with the BUF08832EVM kit. Click the Finish button to complete the
installation procedure.
4.3
Software Description and Set-Up
The BUF08832EVM software allows the user to read and write to all registers in the BUF08832 gamma
correction buffer. Furthermore, it allows programming of the OTP register on the BUF08832. The software
also permits the user to select either I2C address. Press the About button as shown in Figure 11 to verify
that you have the latest version of the software.
Figure 11. BUF08832EVM Software About Button
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BUF08832EVM Software Overview
This section discusses how to install the BUF08832 software.
5.1
Starting the BUF08832EVM Software
The BUF08832 software can be operated through the Windows Start menu. From Start, select All
Programs; then select the BUF08832EVM program. Figure 12 shows how the software should appear if
the EVM is functioning properly.
Figure 12. BUF08832EVM Software Functioning Properly
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Figure 13 shows an error that pops up if the computer cannot communicate with the EVM. If you receive
this error, first check to see that the USB cable is properly connected. This error can also occur if you
connect the USB cable before the USB DIG Platform 9V power source. A second possible reason for this
problem is that there may be a problem with your computer USB human interface device driver. Make
sure that when you plug the in the USB cable, the computer recognizes the device. If the sound is on, you
will hear the distinctive sound that you expect when a USB device is properly connected to the PC.
Figure 13. BUF08832EVM Software: No Communication with the USB_DIG_Platform
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5.2
5.2.1
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Using the BUF08832 Software
I2C Address Selection
As mentioned previously in the BUF08832_Test_Board Features section (see Section 3.7), jumper JMP1
is used to set the I2C address pin of the BUF08832. Figure 14 shows how the hardware and software
must both be set to allow for communication between the BUF08832EVM and the software. Without
jumper JMP1 and the software address button configured correctly, the software will not be able to
communicate with the BUF08832 device.
Figure 14. BUF08832_Test_Board Jumper JMP1 Set For Logic ‘1’
When JMP1 and the software are set as shown in Figure 15, the second I2C address can be configured.
Figure 15. BUF08832_Test_Board Jumper JMP1 Set For Logic ‘0’
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5.2.2
Measuring the Power Supply
You must measure the power supply (VS) with respect to the GND on the BUF08832_Test_Board and
enter it in the VSUP field located in the top section of the software interface, as shown in Figure 16.
Figure 16. Measuring and Entering Power-Supply Voltage
The voltage out of each DAC is calculated according to the VS value entered. For example, changing the
value in the channel 6 cell as shown below immediately changes the output of channel 6 to 0.996V. The
calculation is performed according to Equation 1.
V ´ Code_in_Decimal
VDAC_CHANNEL = S
1024
(1)
Example 1.
Channel 6: Code 44 (hexadecimal) = 68 (decimal)
VDAC_CHANNEL = 15V ´ 68 = 0.996V
1024
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BUF08832EVM User Guide and Software Tutorial
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BUF08832EVM Software Overview
5.2.3
www.ti.com
Read DAC Button
By pressing the Read DAC button in the BUF08832EVM software, all of the BUF08832 DAC/VCOM
registers are read to obtain the respective current register contents. Once the read procedure is complete,
all of the corresponding text boxes are updated to show the current values present in the DAC/VCOM
registers.
5.2.4
Write DAC Button
The method used to write the values in the DAC/VCOM registers is based on whether or not the Auto Write
feature is enabled. The BUF08832 has two methods of writing information into the DAC/VCOM registers.
The first method allows for the output voltage to change immediately after the writing to the DAC register.
In the BUF08832EVM software, this mode is configured by enabling the Auto Write feature found in the
Buffer Menu dropdown menu. In this mode, as an individual channel is written to, the output voltage
changes as soon as the user moves to a different text box in the software. The second method of writing
to the DAC/VCOM registers allows for the user to write multiple channels and then have all of the output
voltages change at the same time rather than each channel voltage changing as soon as it is written to.
Disabling the Auto Write feature in the software allows the user to enter all of the values desired for all of
the channels and then press the Write DAC button to change all of the output voltage of all of the
channels at one time. When the Auto Write feature is enabled, no change occurs to the output voltages
when the Write DAC button is pressed. No change occurs because after the text box for a given channel
has been updated, as soon as another item in the software is clicked, the Auto Write feature automatically
performs a write command to the updated channel that then updates the output voltage. When in the Auto
Write enabled mode, the Write DAC button cannot be pressed with different data in the corresponding
channel text boxes than the values already stored in the DAC/VCOM register; thus, no change occurs.
Figure 17 shows the location in the Buffer Menu showing the Auto Write feature enabled. Clicking on the
Auto Write feature again enables/disables the feature, depending on its current state.
Figure 17. Auto Write Feature Enabled
20
BUF08832EVM User Guide and Software Tutorial
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BUF08832EVM Software Overview
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5.2.5
Reset Button
Pressing the Reset button in the BUF08832EVM software calls a General-Call Reset for the BUF08832.
The status of the DAC/VCOM registers after the General-Call Reset depends on whether the OTP has been
programmed or not. If the OTP has been programmed, the channel registers will be loaded with the most
recent values programmed into the OTP memory. If the OTP memory has not been programmed, the
channel registers will default to 1000000000, or midsupply.
Pressing the Reset button does not generate a Read DAC call, so the corresponding channels are not
updated. The Read DAC button must be pressed in order to update the text boxes to the respective
current corresponding values.
5.2.6
Save to File Button
The register configurations of the BUF08832 DACs are displayed in both analog voltage and in
hexadecimal (see Figure 12). The DAC codes (that is, gamma voltages) can be saved into a text file using
the Save to File button.
Pressing the Save to File button opens a file-save dialog box similar to that shown in Figure 18. Pressing
the folder icon creates a new folder on your PC. It is a good idea to create a directory exclusively for
BUF08832 DAC code (that is, gamma voltage) files. Enter a unique file name in the Filename field to store
your BUF08832 register information. Press the OK button to save the file.
Figure 18. Save to File Dialog Box Button and Window
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BUF08832EVM Software Overview
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Saved BUF08832 DAC codes (gamma voltages) exist in a text file that can be opened in a text editor, as
Figure 19 illustrates.
Figure 19. File Format of Saved Data
5.2.7
Load From File Button
The BUF08832EVM software is also able to load data saved from previous evaluations. A saved register
configuration can be loaded into the BUF08832 using the Load From File button, as shown in Figure 20.
The program remembers where you saved the last register configuration. Simply select the desired
configuration and press Open.
Figure 20. Load From File Button and Window
22
BUF08832EVM User Guide and Software Tutorial
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BUF08832EVM Software Overview
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5.2.8
Changing the DAC/VCOM Analog Voltage
The voltage of any of the DAC or VCOM channels can be adjusted in several ways. First, you can change
the voltage by entering the desired voltage directly in the voltage text box. In order to be able to manually
type the voltage into the text box, you must first click on the cell to be edited. Click a second time and the
cell turns from blue to black, and allows the user to type the updated voltage in the cell. The hexadecimal
DAC codes can be entered in the Code column in the same manner.
Another method of changing the voltage of a DAC or VCOM channel is through the use of the slider on the
main software window. There is only a single slider that is used for all channels. In order to use the slider
to adjust the voltage of a particular channel, that channel must first be selected. To select a channel, click
on either the channel number, voltage, or code of a particular channel. The entire channel row highlights
in blue to show the user that the channel is selected. Adjusting the slider bar then only updates the
highlighted channel.
The final method to change DAC/VCOM voltages is through the ±1 Code and ±5 Code buttons on the main
software window. These buttons allow for fine and coarse adjustments, respectively, to the highlighted
channel, giving the user the ability to quickly step the channel output up or down as needed without
having to manually enter the changes in the Code column.
5.2.9
Run Batch Button
The Run Batch button (as noted in Figure 21) enables the user to configure the BUF08832 to cycle
through different register configurations in a continuous loop. When connected to the end application, this
feature can be used to cycle through different gamma settings to determine what the optimal settings must
be for a given application.
When the Run Batch button is pressed, a new dialog box displays as Figure 21 shows. The delay time is
the amount of time allowed between loading new configurations into the BUF08832 DUT.
Use the Single Step Up and Single Step Down buttons to step through the selected files manually. The
currently selected file name is displayed in the lower left corner area of the dialog box. Double-click on the
file names to select them. Once a series of filenames have been selected, the check box turns dark.
Double-click on a filename again to unselect it from the batch run.
Figure 21. Run Batch Dialog Button and Window
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BUF08832EVM Software Overview
5.2.10
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Control Panel Button
Pressing the Control Panel button brings up a display panel that allows you to adjust each channel using
a set of graphical sliders, as shown in Figure 22. Simply drag the slider to adjust the desired channel
output. The DAC code and corresponding output value of each channel change automatically. This
function is similar to the slider present on the primary BUF08832EVM software window that changes
based on the channel that highlighted (as discussed in the above section).
Figure 22. Control Panel Button and Window
24
BUF08832EVM User Guide and Software Tutorial
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BUF08832EVM Software Overview
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5.2.11
Program OTP All Channels Button
As Figure 23 shows, pressing the Program OTP All Channels button allows you to program a gamma
curve into the nonvolatile memory in the BUF08832. All eight channels (including the VCOM channels) are
then programmed simultaneously. The values are stored in the memory bank that is selected via the
BKSEL switch (see Section 3.7.2).
Figure 23. Program OTP All Channels Button
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25
BUF08832EVM Documentation
5.2.12
www.ti.com
Max Bank Field
The Max Bank field at the top of the software interface (as shown in Figure 24) shows how many times
the memory of the most-programmed channel of the selected memory bank has been previously written
to.
• None: Max bank shows 0
• Once: Max Bank shows 0
• Twice: Max bank shows 1
• Three times: Max bank shows 2
• 16 times: Max bank shows 15
Figure 24. Max Bank Field
6
BUF08832EVM Documentation
This section contains the complete bill of materials and schematic diagram for the BUF08832_Test_Board.
Documentation information for the USB_DIG_Platform can be found in the USB_DIG_Platform User’s
Guide, SBOU058, available at the TI web site at http://www.ti.com.
26
BUF08832EVM User Guide and Software Tutorial
SBOU081A – November 2009 – Revised August 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
SBOU081A – November 2009 – Revised August 2016
Submit Documentation Feedback
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
J1
Male
1
Ext
JMP2
JMP5
JMP3
Vsd
BKSEL_INT
Copyright © 2009–2016, Texas Instruments Incorporated
SPI_SCK
SPI_CS1
SPI_DOUT1
SPI_DIN1
SDA
SCL
BKSEL
SDA
SCL
Vsd
BKSEL
3
Int
I2C_SDA_ISO
I2C_SCK_ISO
1
Ext
DAC_A
DAC_B
DAC_C
DAC_D
ads1_Vin+
ads1_Vinads2_Vin+
ads2_VinI2C_SCK
I2C_SDA2
ONE_WIRE
I2C_SDA_ISO
I2C_SCK_ISO
XTR +Loop
XTR -Loop
INAVdut
Vcc
+ 15V
-15V
3
Int
3
Int
C10
1uF
3
Int
2
T_STRIP2
1
2
JMP4
2
BKSEL
GND
1
Ext
1
Ext
4.7uF
+ C9
Vdut
JMP1
2
Vsd
GND3
Vsd
3
1
2
SCL
SDA
BKSEL
Vs
BKSEL
19
7
8
Vsd
11
12
9
10
C4
0.1uF 13
8
C3
0.1uF 14
2
11
12
9
10
C8
0.1uF 13
19
7
0.1uF
C6
C7
0.1uF 14
2
Vs
Vsd
249k
R4
SCL
SDA
SW_SPDT
SW1
A0
BKSEL
SCL
SDA
GNDd
Vsd
Vsd
4
BKSEL_INT
BUF08832
Vcom_fb
Vcom
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
Vcom_fb
Vcom
20
1
3
4
5
6
15
16
17
18
20
1
3
4
5
6
15
16
17
18
SN74LVC1G17DBV
U3
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
BUF08832
GNDa2
GNDa1
Vs2
Vs1
U1
A0
BKSEL
SCL
SDA
GNDd
Vsd
GNDa2
GNDa1
Vs2
Vs1
U2
2
0.1uF
C5
3
T3
1
2
3
1
2
2
T_STRIP3
SCL
SDA
GND
T2
T_STRIP2
Vsd
GND
C2
1uF
GND2
5
T1
4.7uF
+ C1
Vs
R2
omit
R1
omit
R3
omit
GND
CON10
1
2
3
4
5
6
7
8
9
10
T5
6.1
1
Vs
2
GND
T_STRIP2
T4
Vs
www.ti.com
BUF08832EVM Documentation
BUF08832_Test_Board Schematic
Figure 25 shows the schematic for the BUF08832_Test_Board.
3
1
2
Figure 25. BUF08832_Test_Board Schematic
BUF08832EVM User Guide and Software Tutorial
27
BUF08832EVM Documentation
6.2
www.ti.com
BUF08832_Test_Board Bill of Materials
Table 4 lists the bill of materials for this EVM.
Table 4. BUF08832_Test_Board Bill of Materials
No.
Qty
Value
Ref Des
Description
Vendor
Part number
Vishay/Dale
CMF5034R000FHEB
1
1
34Ω
R1
RES 34.0Ω 1% 50PPM 1/4W See
Assembly Drawing
2
1
1.2kΩ
R2
RES 1.21kΩ 1% 50PPM 1/4W
See Assembly Drawing
Vishay/Dale
CMF501K2100FHEB
3
1
150Ω
R3
RES 150Ω 1% 50PPM 1/4W See
Assembly Drawing
Vishay/Dale
CMF50150R00FHEB
4
1
249kΩ
R4
RES 249kΩ 1/16W .5% 0603 SMD Susumu Co Ltd
RR0816P-2493-D-39D
5
2
4.7uF
C1, C9
CAP TANT 4.7µF 35V 10% SMD
Vishay/Sprague
293D475X9035C2TE3
GRM188F51E105ZA12D
6
2
1µF
C2, C10
CAP CER 1 µF 25V Y5V 0603
Murata Electronics
North America
7
6
0.1µF
C3-C8
CAP .10µF 25V CERAMIC Y5V
0603
Kemet
C0603C104Z3VACTU
8
1
U1
Socket, TSSOP 28-Pin ZIF
ENPLAS
OTS-20(28)-0.65-01
Samtec Inc
SS-110-G-2
SN74LVC1G17DBVR
9
2
U2
CONN RCPT .100" 10POS GOLD
T/H
10
1
U3
IC BUFFER SCHMIT TRIG
SOT235
Texas Instruments
11
1
J1
CONN D-SUB PLUG R/A 25POS
30GOLD (With Threaded Inserts
and Board locks)
AMP/Tyco Electronics 5747842-4
12
1
S1
SWITCH TOGGLE SPDT .4VA PC
E-Switch
MNT
200AWMSP1T1A1M2RE
13
3
T1, T3, T4
TERM BLOCK .2 IN 2 POS PCB
Tyco Electronics
1437671-1
T2
TERM BLOCK 3POS 5.08MM
SCREWLESS
Tyco Electronics
1437671-4
T5
CONN HEADER 10POS .100"
SGL GOLD
Samtec
TSW-132-07-G-S
Pin Socket (U1)
Pin SOCKET RCPT .014-.026
30AU (R1,R2,R3)
AMP
5050863-5
CONN HEADER 1POS .100" SGL
GOLD
Samtec
TSW-132-07-G-S
Keystone
2203
DSUB25M
14
1
15
1
16
6
17
8
TP cut to size
Test Points, All
18
4
Standoff
—
Standoffs, Hex , 4-40 Threaded,
0.500" length, 0.250" OD,
Aluminum Iridite Finish
19
4
Screw
—
SCREW MACHINE PHIL 4-40X1/4
Building Fasteners
SS
PMSSS 440 0025 PH
20
5
JUMP3 cut to
size
JMP1-JMP5
CONN HEADER 3POS .100" SGL
GOLD
Samtec
TSW-132-07-G-S
21
5
N/A
SHUNT LP W/HANDLE 2 POS
30AU
AMP/Tyco Electronics 881545-2
22
1
U1
IC CURR/PWR MON BI-DIR
MSOP-10
Texas Instruments
T5 Cut to size
BUF08832
BUF08832AIDGS
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (November 2009) to A Revision ................................................................................................ Page
•
28
Changed power supply in the BUF08832EVM Kit Contents section.
Revision History
..............................................................
2
SBOU081A – November 2009 – Revised August 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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