CC1070
CC1070 Single Chip Low Power RF Transmitter for Narrowband Systems
Applications
• Narrowband low power UHF wireless
data transmitters
• 402 / 424 / 426 / 429 / 433 / 447 / 449 /
469 / 868 and 915 MHz ISM/SRD
band systems
• TPMS – Tire Pressure Monitoring
Systems
•
•
•
•
AMR – Automatic Meter Reading
Wireless alarm and security systems
Home automation
Low power telemetry
Product Description
CC1070 is a true single-chip UHF
transmitter designed for very low power
and very low voltage wireless applications.
The circuit is mainly intended for the ISM
(Industrial, Scientific and Medical) and
SRD (Short Range Device) frequency
bands at 402, 424, 426, 429, 433, 447,
449, 469, 868 and 915 MHz, but can
easily be programmed for multi-channel
operation at other frequencies in the 402 470 and 804 - 940 MHz range.
CC1070 will be used together with a
microcontroller and a few external passive
components.
The CC1070 is especially suited for narrowband systems with channel spacings of
12.5 or 25 kHz complying with ARIB STD
T-67 and EN 300 220.
The CC1070 main operating parameters
can be programmed via a serial bus, thus
making CC1070 a very flexible and easy to
use transmitter. In a typical application
Features
• True single chip UHF RF transmitter
• Frequency range 402 - 470 MHz and
804 - 940 MHz
• Programmable output power
• Low supply voltage (2.3 to 3.6 V)
• Very few external components required
• Small size (QFN 20 package)
• Pb-free package
• Data rate up to 153.6 kBaud
• OOK, FSK and GFSK data modulation
• Fully on-chip VCO
SWRS043A
• Programmable
frequency
makes
crystal temperature drift compensation
possible without TCXO
• Suitable for frequency hopping systems
• Suited
for
systems
targeting
compliance with EN 300 220, FCC
CFR47 part 15 and ARIB STD T-67
• Development kit available
• Easy-to-use software for generating the
CC1070 configuration data
Page 1 of 54
CC1070
Table of Contents
1
Abbreviations................................................................................................................ 4
2
Absolute Maximum Ratings ........................................................................................ 5
3
Operating Conditions ................................................................................................... 5
4
Electrical Specifications .............................................................................................. 5
4.1
RF Transmit Section ............................................................................................ 6
4.2
Crystal Oscillator Section..................................................................................... 8
4.3
Frequency Synthesizer Section ........................................................................... 9
4.4
Digital Inputs / Outputs ...................................................................................... 10
4.5
Current Consumption......................................................................................... 11
5
Pin Assignment........................................................................................................... 12
6
Circuit Description...................................................................................................... 13
7
Application Circuit...................................................................................................... 13
8
Configuration Overview ............................................................................................. 16
8.1
9
Configuration Software ...................................................................................... 16
Microcontroller Interface ........................................................................................... 17
9.1
4-wire Serial Configuration Interface ................................................................. 18
9.2
Signal Interface .................................................................................................. 20
10
Data Rate Programming............................................................................................. 22
11
Frequency Programming ........................................................................................... 23
11.1
12
Dithering ......................................................................................................... 24
Transmitter .................................................................................................................. 24
12.1
FSK Modulation Formats ............................................................................... 24
12.2
OOK Modulation............................................................................................. 24
12.3
Output Power Programming........................................................................... 25
12.4
TX Data Latency............................................................................................. 26
12.5
Reducing Spurious Emission and Modulation Bandwidth ............................. 26
13
Output Matching and Filtering .................................................................................. 26
14
Frequency Synthesizer .............................................................................................. 29
14.1
VCO, Charge Pump and PLL Loop Filter....................................................... 29
14.2
VCO and PLL Self-Calibration ....................................................................... 30
14.3
PLL Turn-on Time versus Loop Filter Bandwidth .......................................... 31
14.4
PLL Lock Time versus Loop Filter Bandwidth ............................................... 32
15
VCO Current Control .................................................................................................. 32
16
Power Management.................................................................................................... 33
17
Crystal Oscillator ........................................................................................................ 34
18
Built-in Test Pattern Generator ................................................................................. 36
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Page 2 of 54
CC1070
19
Interrupt upon PLL Lock ............................................................................................ 36
20
PA_EN Digital Output Pin .......................................................................................... 36
20.1
Interfacing an External PA ............................................................................. 36
20.2
General Purpose Output Control Pins ........................................................... 36
20.3
PA_EN Pin Drive ............................................................................................ 37
21
System Considerations and Guidelines................................................................... 37
22
PCB Layout Recommendations ................................................................................ 39
23
Antenna Considerations ............................................................................................ 39
24
Configuration Registers............................................................................................. 40
24.1
25
CC1070 Register Overview............................................................................ 41
Package Marking ........................................................................................................ 52
25.1
Soldering Information ..................................................................................... 52
25.2
Tray Specification........................................................................................... 52
25.3
Carrier Tape and Reel Specification .............................................................. 52
26
Ordering Information.................................................................................................. 53
27
General Information.................................................................................................... 54
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Page 3 of 54
CC1070
1
Abbreviations
ACP
AMR
ASK
BOM
bps
BT
CW
DNM
ESR
FHSS
FM
FS
FSK
GFSK
IC
ISM
kbps
MCU
NA
NRZ
OOK
PA
PD
PCB
PN9
PLL
PSEL
RF
SPI
SRD
TBD
TX
UHF
VCO
XOSC
XTAL
Adjacent Channel Power
Automatic Meter Reading
Amplitude Shift Keying
Bill Of Materials
bits per second
Bandwidth-Time product (for GFSK)
Continuous Wave
Do Not Mount
Equivalent Series Resistance
Frequency Hopping Spread Spectrum
Frequency Modulation
Frequency Synthesizer
Frequency Shift Keying
Gaussian Frequency Shift Keying
Integrated Circuit
Industrial Scientific Medical
kilo bits per second
Micro Controller Unit
Not Applicable
Non Return to Zero
On-Off Keying
Power Amplifier
Phase Detector / Power Down
Printed Circuit Board
Pseudo-random Bit Sequence (9-bit)
Phase Locked Loop
Program Select
Radio Frequency
Serial Peripheral Interface
Short Range Device
To Be Decided/Defined
Transmit (mode)
Ultra High Frequency
Voltage Controlled Oscillator
Crystal oscillator
Crystal
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Page 4 of 54
CC1070
2
Absolute Maximum Ratings
The absolute maximum ratings given Table 1 should under no circumstances be violated.
Stress exceeding one or more of the limiting values may cause permanent damage to the
device.
Min
Max
Unit
Supply voltage, VDD
Parameter
-0.3
5.0
V
Voltage on any pin
Storage temperature range
Package body temperature
Humidity non-condensing
ESD
-0.3
-50
VDD+0.3, max 5.0
150
260
85
500
V
°C
°C
%
V
5
Condition
All supply pins must have the
same voltage
Norm: IPC/JEDEC J-STD-020C
1
CDM model
Table 1. Absolute maximum ratings
1
The reflow peak soldering temperature (body temperature) is specified according to
IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices”.
Caution! ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
3
Operating Conditions
The operating conditions for CC1070 are listed in Table 2.
Parameter
Min
Typ
Max
Unit
RF Frequency Range
402
804
470
940
MHz
MHz
Operating ambient temperature range
-40
105
°C
Supply voltage
2.3
3.6
V
3.0
Condition / Note
Programmable in
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