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CC1125
SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
CC1125 Ultra-High Performance RF Narrowband Transceiver
1 Device Overview
1.1
Features
1
• High-Performance, Single-Chip Transceiver
– Adjacent Channel Selectivity: 67 dB at
6.25-kHz Offset
– Blocking Performance: 104 dB at 10 MHz
– Excellent Receiver Sensitivity
• –129 dBm at 300 bps
• –123 dBm at 1.2 kbps
• –110 dBm at 50 kbps
– Very Low Phase Noise: –115 dBc/Hz at
10-kHz Offset
• Suitable for Systems Targeting ETSI
Category 1
• Separate 128-Byte RX and TX FIFOs
• Support for Seamless Integration With the CC1190
Device for Increased Range Giving up to 3-dB
Improvement in Sensitivity and up to +27-dBm
Output Power
• High Spectral Efficiency (9.6 kbps in 12.5-kHz
Channel in Compliance With FCC Narrowbanding
Mandate)
• Power Supply
– Wide Supply Voltage Range (2.0 V to 3.6 V)
– Low Current Consumption:
• RX: 2 mA in RX Sniff Mode
• RX: 17 mA Peak Current in Low-Power
Mode
• RX: 26 mA Peak Current in HighPerformance Mode
• TX: 47 mA at +14 dBm
– Power Down: 0.12 μA (0.5 μA With Enhanced
Wake-On-Radio (eWOR) Timer Running)
1.2
•
•
•
•
• Programmable Output Power up to +16 dBm With
0.4-dB Step Size
• Automatic Output Power Ramping
• Configurable Data Rates: 0 to 200 kbps
• Supported Modulation Formats: 2-FSK,
2-GFSK, 4-FSK, 4-GFSK, MSK, OOK
• WaveMatch: Advanced Digital Signal Processing
for Improved Sync Detect Performance
• RoHS-Compliant 5-mm x 5-mm No-Lead QFN
32-Pin Package (RHB)
• Regulations – Suitable for Systems Targeting
Compliance With
– Europe: ETSI EN 300 220 Category 1, ETSI EN
54-25, ETSI EN 300 113, and EN 301 166
– US: FCC CFR47 Part 15, 24, 90, 101
– Japan: ARIB RCR STD-T30, T-67, T-108
• Peripherals and Support Functions
– eWOR Functionality for Automatic Low-Power
Receive Polling
– Includes Functions for Antenna Diversity
Support
– Support for Retransmissions
– Support for Auto-Acknowledge of Received
Packets
– TCXO Support and Control, also in Power
Modes
– Automatic Clear Channel Assessment (CCA) for
Listen-Before-Talk (LBT) Systems
– Built-in Coding Gain Support for Increased
Range and Robustness
– Digital RSSI Measurement
– Temperature Sensor
Applications
Social Alarms
Narrowband Ultra-Low-Power Wireless Systems
With Channel Spacing Down to 4 kHz
169-, 315-, 433-, 868-, 915-, 920-, 950-MHz
ISM/SRD Band Systems
Wireless Metering and Wireless Smart Grid (AMR
and AMI)
•
•
•
•
•
•
•
IEEE 802.15.4g Systems
Home and Building Automation
Wireless Alarm and Security Systems
Industrial Monitoring and Control
Wireless Healthcare Applications
Wireless Sensor Networks and Active RFID
Private Mobile Radios
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC1125
SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
1.3
www.ti.com
Description
The CC1125 device is a fully integrated single-chip radio transceiver designed for high performance at
very low-power and low-voltage operation in cost-effective wireless systems. All filters are integrated, thus
removing the need for costly external SAW and IF filters. The device is mainly intended for the ISM
(Industrial, Scientific and Medical) and SRD (Short Range Device) frequency bands at 164–192 MHz,
274–320 MHz, 410–480 MHz, and 820–960 MHz.
The CC1125 device provides extensive hardware support for packet handling, data buffering, burst
transmissions, clear channel assessment, link quality indication, and Wake-On-Radio. The main operating
parameters of the CC1125 device can be controlled through an SPI interface. In a typical system, the
CC1125 device will be used with a microcontroller and only a few external passive components.
Device Information (1)
PART NUMBER
CC1125RHB
(1)
1.4
PACKAGE
BODY SIZE
VQFN (32)
5.00 mm x 5.00 mm
For more information, see Section 8, Mechanical Packaging and Orderable Information
Functional Block Diagram
Figure 1-1 shows the system block diagram of the CC1125 device.
CC112X
(optional 32kHz
clock intput)
Ultra low power 32kHz
auto-calibrated RC oscillator
4k byte
ROM
Power on reset
MARC
Main Radio Control Unit
Ultra low power 16 bit
MCU
CSn (chip select)
SPI
Serial configuration
and data interface
SI (serial input)
Interrupt and
IO handler
System bus
SO (serial output)
SCLK (serial clock)
eWOR
Enhanced ultra low power
Wake On Radio timer
Configuration and
status registers
Battery sensor /
temp sensor
256 byte
FIFO RAM
buffer
Packet handler
and FIFO control
(optional GPIO0-3)
RF and DSP frontend
Output power ramping and OOK / ASK modulation
I
Fully integrated Fractional-N
Frequency Synthesizer
Q
High linearity
LNA
LNA_N
(optional GPIO for
antenna diversity)
ifamp
XOSC
XOSC_Q2
90dB dynamic
range ADC
(optional bit clock)
Channel
filter
ifamp
LNA_P
XOSC_Q1
Data interface with
signal chain access
Cordic
14dBm high
efficiency PA
Modulator
PA
(optional autodetected
external XOSC / TCXO)
Highly flexible FSK / OOK
demodulator
(optional low jitter serial
data output for legacy
protocols)
90dB dynamic
range ADC
AGC
Automatic Gain Control, 60dB VGA range
RSSI measurements and carrier sense detection
Figure 1-1. Functional Block Diagram
2
Device Overview
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
Table of Contents
1
Device Overview ......................................... 1
4.15
High-Speed Clock Input (TCXO) .................... 19
1.1
Features .............................................. 1
4.16
32-kHz Clock Input .................................. 19
1.2
Applications ........................................... 1
1.3
Description ............................................ 2
1.4
Functional Block Diagram ............................ 2
...........................
.......................................
4.19 Temperature Sensor ...............................
4.20 Typical Characteristics ..............................
Detailed Description ...................................
5.1
Block Diagram.......................................
5.2
Frequency Synthesizer ..............................
5.3
Receiver .............................................
5.4
Transmitter ..........................................
5.5
Radio Control and User Interface ...................
5.6
4.5 Enhanced Wake-On-Radio (eWOR) ............
5.7
Sniff Mode ...........................................
5.8
Antenna Diversity ...................................
5.9
WaveMatch ..........................................
Typical Application Circuit ...........................
Device and Documentation Support ...............
7.1
Device Support ......................................
7.2
Documentation Support .............................
7.3
Community Resources ..............................
7.4
Trademarks..........................................
7.5
Electrostatic Discharge Caution .....................
7.6
Glossary .............................................
2
3
Revision History ......................................... 4
Terminal Configuration and Functions .............. 5
4
..........................................
3.2
Pin Configuration .....................................
Specifications ............................................
4.1
Absolute Maximum Ratings ..........................
4.2
Handling Ratings .....................................
3.1
4.3
4.4
Pin Diagram
6
7
7
7
Recommended Operating Conditions (General
Characteristics) ....................................... 7
Thermal Resistance Characteristics for RHB
Package .............................................. 7
4.5
RF Characteristics .................................... 8
4.6
................................ 8
................. 9
Current Consumption, Transmit Modes .............. 9
Current Consumption, Receive Modes.............. 10
Receive Parameters................................. 11
Transmit Parameters ................................ 17
PLL Parameters ..................................... 18
Wake-up and Timing ................................ 19
High-Speed Crystal Oscillator ....................... 19
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
5
5
Regulatory Standards
Current Consumption, Static Modes
6
7
8
4.17
Low Speed RC Oscillator
20
4.18
I/O and Reset
20
20
21
24
24
24
25
25
25
25
26
26
27
28
29
29
30
30
30
30
30
Mechanical Packaging and Orderable
Information .............................................. 31
Table of Contents
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3
CC1125
SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This data manual revision history highlights the changes made to the SWRS120D device-specific data
manual to make it an SWRS120E revision.
Changes from Revision D (June 2014) to Revision E
•
•
4
Page
Added Ambient to the temperature range condition and removed Tj from Temperature range ........................... 7
Added data to TCXO table ......................................................................................................... 19
Revision History
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
3 Terminal Configuration and Functions
3.1
Pin Diagram
25 AVDD_PFD_CHP
26 DCPL_PFD_CHP
27 AVDD_SYNTH2
28 AVDD_XOSC
DCPL_XOSC
29
30 XOSC_Q1
XOSC_Q2
31
32 EXT_XOSC
Figure 3-1 shows pin names and locations for the CC1125 device.
VDD_GUARD
1
24
LPF1
RESET_N
2
23
LPF0
GPIO3
3
22
AVDD_SYNTH1
GPIO2
4
21
DCPL_VCO
DVDD
5
20
LNA_N
DCPL
6
SI
7
SCLK
8
CC1125
19 LNA_P
GND
GROUND PAD
18
TRX_SW
17
PA
11
12
13
14
15
16
GPIO0
CSn
DVDD
AVDD_IF
RBIAS
AVDD_RF
N.C.
SO (GPIO1)
10
9
Figure 3-1. Package 5-mm × 5-mm QFN
Terminal Configuration and Functions
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CC1125
SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
3.2
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Pin Configuration
The following table lists the pin-out configuration for the CC1125 device.
PIN NO.
PIN NAME
TYPE /
DIRECTION
DESCRIPTION
1
VDD_GUARD
Power
2.0–3.6 V VDD
2
RESET_N
Digital input
Asynchronous, active-low digital reset
3
GPIO3
Digital I/O
General-purpose I/O
4
GPIO2
Digital I/O
General-purpose I/O
5
DVDD
Power
2.0–3.6 VDD to internal digital regulator
6
DCPL
Power
Digital regulator output to external decoupling capacitor
7
SI
Digital input
Serial data in
8
SCLK
Digital input
Serial data clock
9
SO(GPIO1)
Digital I/O
Serial data out (general-purpose I/O)
10
GPIO0
Digital I/O
General-purpose I/O
11
CSn
Digital input
Active-low chip select
12
DVDD
Power
2.0–3.6 V VDD
13
AVDD_IF
Power
2.0–3.6 V VDD
14
RBIAS
Analog
External high-precision resistor
15
AVDD_RF
Power
2.0–3.6 V VDD
16
N.C.
17
PA
Analog
Single-ended TX output (requires DC path to VDD)
18
TRX_SW
Analog
TX and RX switch. Connected internally to GND in TX and floating (high-impedance)
in RX.
19
LNA_P
Analog
Differential RX input (requires DC path to GND)
20
LNA_N
Analog
Differential RX input (requires DC path to GND)
21
DCPL_VCO
Power
Pin for external decoupling of VCO supply regulator
22
AVDD_SYNTH1
Power
2.0–3.6 V VDD
23
LPF0
Analog
External loop filter components
24
LPF1
Analog
External loop filter components
25
AVDD_PFD_CHP Power
2.0–3.6 V VDD
26
DCPL_PFD_CHP
Power
Pin for external decoupling of PFD and CHP regulator
27
AVDD_SYNTH2
Power
2.0–3.6 V VDD
28
AVDD_XOSC
Power
2.0–3.6 V VDD
29
DCPL_XOSC
Power
Pin for external decoupling of XOSC supply regulator
30
XOSC_Q1
Analog
Crystal oscillator pin 1 (must be grounded if a TCXO or other external clock
connected to EXT_XOSC is used)
31
XOSC_Q2
Analog
Crystal oscillator pin 2 (must be left floating if a TCXO or other external clock
connected to EXT_XOSC is used)
32
EXT_XOSC
Digital input
Pin for external clock input (must be grounded if a regular crystal connected to
XOSC_Q1 and XOSC_Q2 is used)
–
GND
Ground pad
The ground pad must be connected to a solid ground plane.
6
Not connected
Terminal Configuration and Functions
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
4 Specifications
All measurements performed on CC1120EM_868_915 rev.1.0.1, CC1120EM_955 rev.1.2.1,
CC1120EM_420_470 rev.1.0.1 or CC1120EM_169 rev.1.2 (fxosc = 32 MHz), and CC1125EM_868_915
rev.1.1.0, CC1125EM_420_470 rev.1.1.0, CC1125EM_169 rev.1.1.0, CC1125EM-Cat1-868 (fxosc = 40
MHz).
Absolute Maximum Ratings (1) (2)
4.1
PARAMETER
MIN
Supply voltage (VDD, AVDD_x)
–0.3
MAX
UNIT
CONDITION
3.9
V
All supply pins must have the same voltage
Solder reflow temperature
260
°C
According to IPC/JEDEC J-STD-020
Input RF level
+10
dBm
Voltage on any digital pin
–0.3
VDD+0.3
V
Voltage on analog pins
(including DCPL pins)
–0.3
2.0
V
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under general characteristics is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
4.2
Handling Ratings
Tstg
Storage temperature range
Electrostatic
discharge (ESD)
performance:
VESD
(1)
(2)
max 3.9
Human body model (HBM), per ANSI/ESDA/JEDEC JS001
Charged device model (CDM), per JESD22C101 (2)
(1)
All pins
MIN
MAX
UNIT
–40
125
°C
–2
2
kV
–500
500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V HBM allows safe manufacturing with a standard ESD control process.
4.3
Recommended Operating Conditions (General Characteristics)
PARAMETER
MIN
MAX
UNIT
Voltage supply range
2.0
3.6
V
0
VDD
V
–40
85
°C
Voltage on digital inputs
Temperature range
4.4
TYP
CONDITION
All supply pins must have the same voltage
Ambient
Thermal Resistance Characteristics for RHB Package
°C/W (1)
AIR FLOW (m/s) (2)
RθJC
Junction-to-case (top)
21.1
0.00
RθJB
Junction-to-board
5.3
0.00
RθJA
Junction-to-free air
31.3
0.00
PsiJT
Junction-to-package top
0.2
0.00
PsiJB
Junction-to-board
5.3
0.00
RθJC
Junction-to-case (bottom)
0.8
0.00
(1)
(2)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 40 mW and an ambient temperature of 25ºC is assumed.
m/s = meters per second
Specifications
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CC1125
SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
4.5
www.ti.com
RF Characteristics
PARAMETER
MIN
TYP
820
Frequency bands
Data rate step size
4.6
MHz
410
480
MHz
(320)
MHz
164
192
MHz
(205)
(240)
MHz
(136.7)
(160)
MHz
CONDITION
See SWRA398 for more information.
Contact TI for more information about the
use of these frequency bands.
30
Hz
In 820–950 MHz band
15
Hz
In 410–480 MHz band
6
Hz
In 164–192 MHz band
0
200
kbps
Packet mode
0
100
kbps
Transparent mode
1e-4
bps
Regulatory Standards
PERFORMANCE MODE
Frequency Band
Suitable for compliance with
820–960 MHz
ARIB T-108
ARIB T-96
ETSI EN 300 220 category 1
ETSI EN 54-25
FCC PART 101
FCC PART 24 SUBMASK D
FCC PART 15.247
FCC PART 15.249
FCC PART 90 MASK G
FCC PART 90 MASK J
Performance also suitable
for systems targeting
maximum allowed output
power in the respective
bands, using a range
extender such as the
CC1190 device
410–480 MHz
ARIB T-67
ARIB RCR STD-30
ETSI EN 301 166
ETSI EN 300 113
ETSI EN 300 220 category 1
FCC PART 90 MASK D
FCC PART 90 MASK E
FCC PART 90 MASK G
Performance also suitable
for systems targeting
maximum allowed output
power in the respective
bands, using a range
extender
164–192 MHz
ETSI EN 300 220 category 1
ETSI EN 301 166
ETSI EN 300 113
FCC PART 90 MASK C
FCC PART 90 MASK D
FCC PART 90 MASK E
Performance also suitable
for systems targeting
maximum allowed output
power in the respective
bands, using a range
extender
820–960 MHz
ETSI EN 300 220 category 2
FCC PART 15.247
FCC PART 15.249
410–480 MHz
ETSI EN 300 220 category 2
164–192 MHz
ETSI EN 300 220 category 2
High-performance mode
Low-power mode
8
UNIT
960
(273.3)
Frequency resolution
Data rate
MAX
Specifications
Comments
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4.7
SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
Current Consumption, Static Modes
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated.
PARAMETER
MIN
Power down with retention
TYP
MAX
UNIT
0.12
1
µA
CONDITION
0.5
µA
Low-power RC oscillator running
XOFF mode
170
µA
Crystal oscillator / TCXO disabled
IDLE mode
1.3
mA
Clock running, system waiting with no
radio activity
4.8
4.8.1
Current Consumption, Transmit Modes
950-MHz Band (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
PARAMETER
MIN
TYP
MAX
UNIT
TX current consumption +10 dBm
37
mA
TX current consumption 0 dBm
26
mA
4.8.2
CONDITION
868-, 915-, and 920-MHz Bands (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 40 MHz if nothing else stated
PARAMETER
MIN
TYP
MAX
UNIT
TX current consumption +14 dBm
47
mA
TX current consumption +10 dBm
38
mA
4.8.3
CONDITION
434-MHz Band (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 40 MHz if nothing else stated
PARAMETER
MIN
TYP
MAX
UNIT
TX current consumption +15 dBm
51
mA
TX current consumption +14 dBm
47
mA
TX current consumption +10 dBm
36
mA
4.8.4
CONDITION
169-MHz Band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 40 MHz if nothing else stated
PARAMETER
MIN
TYP
MAX
UNIT
TX current consumption +15 dBm
56
mA
TX current consumption +14 dBm
52
mA
TX current consumption +10 dBm
40
mA
4.8.5
CONDITION
Low-Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
TX current consumption +10 dBm
MIN
TYP
MAX
32
UNIT
CONDITION
mA
Specifications
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
4.9
4.9.1
www.ti.com
Current Consumption, Receive Modes
High-Performance Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
MIN
TYP
MAX
UNIT
RX wait for sync
1.2 kbps, 4-byte preamble
2
mA
38.4 kbps, 4-byte preamble
13.4
mA
433-, 868-, 915-, and 920-MHz bands
26
mA
169-MHz band
27
mA
Average current consumption
Check for data packet every 1 second using
wake on radio
15
µA
CONDITION
Using RX sniff mode, where the receiver
wakes up at regular intervals to look for an
incoming packet
RX peak current, fxosc = 40 MHz
4.9.2
Peak current consumption during packet
reception at the sensitivity threshold
50 kbps, 5-byte preamble, 40-kHz RC
oscillator used as sleep timer
Low-Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
RX peak current low-power RX mode
1.2 kbps
10
MIN
TYP
MAX
UNIT
17
Specifications
mA
CONDITION
Peak current consumption during packet
reception at the sensitivity level
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4.10 Receive Parameters
All RX measurements made at the antenna connector, to a bit error rate (BER) limit of 1%.
4.10.1 General Receive Parameters (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
PARAMETER
MIN
Saturation
TYP
MAX
+10
UNIT
CONDITION
dBm
Digital channel filter programmable bandwidth
fxosc = 32 MHz
2.8
200
fxosc = 40 MHz
3.5
250
kHz
kHz
IIP3, normal mode
–14
dBm
At maximum gain
IIP3, high linearity mode
–8
dBm
Using 6-dB gain reduction in front end
±12
%
With carrier sense detection enabled and
assuming 4-byte preamble
±0.2
%
With carrier sense detection disabled
–56
dBm
< –57
dBm
Datarate offset tolerance
Spurious emissions
1–13 GHz (VCO leakage at 3.5 GHz)
30 MHz to 1 GHz
Radiated emissions measured according to
ETSI EN 300 220, fc = 869.5 MHz
Optimum source impedance
868-, 915-, and 920-MHz bands
60 + j60 / 30 + j30
Ω
433-MHz band
100 + j60 / 50+ j30
Ω
169-MHz band
140 + j40 / 70 + j20
Ω
(Differential or single-ended RX
configurations)
Specifications
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4.10.2 RX Performance in 950-MHz Band (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
PARAMETER
Sensitivity
Note: Sensitivity can be improved if the TX and
RX matching networks are separated.
Blocking and Selectivity
1.2 kbps 2-FSK, 12.5-kHz channel separation,
4-kHz deviation, 10-kHz channel filter
Blocking and Selectivity
50 kbps 2-GFSK, 200-kHz channel separation,
25-kHz deviation, 100-kHz channel filter
(Same modulation format as 802.15.4g
Mandatory Mode)
Blocking and Selectivity
200 kbps 4-GFSK, 83-kHz deviation (outer
symbols), 200-kHz channel filter, zero IF
(1)
(2)
12
MIN
UNIT
CONDITION
–120
TYP
MAX
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz (1)
–107
dBm
50 kbps 2GFSK, DEV=25 kHz, CHF=100
kHz
–100
dBm
200 kbps, DEV=83 kHz (outer symbols),
CHF=200 kHz, 4GFSK (2)
51
dB
± 12.5 kHz (adjacent channel)
52
dB
± 25 kHz (alternate channel)
73
dB
± 1 MHz
76
dB
± 2 MHz
81
dB
± 10 MHz
43
dB
± 200 kHz (adjacent channel)
51
dB
± 400 kHz (alternate channel)
62
dB
± 1 MHz
65
dB
± 2 MHz
71
dB
± 10 MHz
37
dB
± 200 kHz (adjacent channel)
44
dB
± 400 kHz (alternate channel)
55
dB
± 1 MHz
58
dB
± 2 MHz
64
dB
± 10 MHz
DEV is short for deviation, CHF is short for channel filter bandwidth
BT=0.5 is used in all GFSK measurements
Specifications
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
4.10.3 RX Performance in 868-, 915-, and 920-MHz Bands (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated if nothing else stated
PARAMETER
MIN
Sensitivity
Blocking and Selectivity
0.3-kbps 2-FSK, 6.25-kHz channel
separation, 1-kHz deviation, 3.8-kHz
channel filter
fxosc = 40 MHz using TCXO
Blocking and Selectivity
1.2-kbps 2-FSK, 12.5-kHz channel
separation, 4-kHz deviation, 10-kHz
channel filter
fxosc = 40 MHz using TCXO
Blocking and Selectivity
1.2-kbps 2-GFSK, 25-kHz channel
separation, 4-kHz deviation, 16-kHz
channel filter
fxosc = 40 MHz using TCXO
Using external SAW filter for
compliance with ETSI category 1
Blocking and Selectivity
38.4-kbps 2-GFSK, 100-kHz channel
separation, 20-kHz deviation, 100kHz channel filter
Blocking and Selectivity
50-kbps 2-GFSK, 200-kHz channel
separation, 25-kHz deviation, 100kHz channel filter
(Same modulation format as
802.15.4g Mandatory Mode)
Blocking and Selectivity
200-kbps 4-GFSK, 83-kHz deviation
(outer symbols), 200-kHz channel
filter, zero IF
Image rejection
(Image compensation enabled)
fxosc = 40 MHz using TCXO
(1)
TYP
MAX
UNIT
CONDITION
–129
dBm
300 bps, DEV=1 kHz CHF=3.8 kHz (1),
fxosc = 40 MHz
–123
dBm
1.2 kbps, DEV=20 kHz CHF=50 kHz
–114
dBm
4.8 kbps OOK
–110
dBm
38.4 kbps, DEV=20 kHz CHF=100 kHz
–110
dBm
50 kbps 2GFSK, DEV=25 kHz, CHF=100 kHz
–103
dBm
200 kbps, DEV=83 kHz (outer symbols),
CHF=200 kHz, 4GFSK
62
dB
± 6.25 kHz (adjacent channel)
63
dB
± 12.5 kHz (alternate channel)
83
dB
± 1 MHz
87
dB
± 2 MHz
91
dB
± 10 MHz
58
dB
+ 12.5 kHz (adjacent channel)
58
dB
± 25 kHz (alternate channel)
78
dB
± 1 MHz
82
dB
± 2 MHz
86
dB
± 10 MHz
58
dB
± 25 kHz (alternate channel)
77
dB
± 1 MHz
106
dB
± 2 MHz
101
dB
± 10 MHz
42
dB
± 100 kHz (adjacent channel)
43
dB
± 200 kHz (alternate channel)
62
dB
± 1 MHz
66
dB
± 2 MHz
74
dB
± 10 MHz
43
dB
± 200 kHz (adjacent channel)
50
dB
± 400 kHz (alternate channel)
61
dB
± 1 MHz
65
dB
± 2 MHz
74
dB
± 10 MHz
36
dB
± 200 kHz (adjacent channel)
44
dB
± 400 kHz (alternate channel)
55
dB
± 1 MHz
59
dB
± 2 MHz
67
dB
± 10 MHz
58
dB
1.2 kbps, DEV=4 kHz CHF=10 kHz (1), image at
-125 kHz
DEV is short for deviation, CHF is short for channel filter bandwidth
Specifications
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4.10.4 RX Performance in 434-MHz Band (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated if nothing else stated
PARAMETER
Sensitivity
Blocking and Selectivity
0.3-kbps 2-FSK, 6.25-kHz channel
separation, 1-kHz deviation, 3.8-kHz
channel filter
fxosc = 40 MHz using TCXO
Blocking and Selectivity
1.2-kbps 2-FSK, 12.5-kHz channel
separation, 4-kHz deviation, 10-kHz
channel filter
fxosc = 40 MHz using TCXO
Blocking and Selectivity
38.4-kbps 2-GFSK, 100-kHz channel
separation, 20-kHz deviation, 100-kHz
channel filter
(1)
14
MIN
TYP
MAX
UNIT
CONDITION
–129
dBm
300 bps, DEV=1 kHz, CHF=3.8 kHz (1)
fxosc = 40 MHz
–123
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz (1)
–109
dBm
50-kbps 2-GFSK, DEV=25 kHz, CHF=100
kHz (1)
–116
dBm
1.2 kbps, DEV=20 kHz CHF=50 kHz (1)
65
dB
+ 6.25 kHz (adjacent channel)
66
dB
+ 12.5 kHz (alternate channel)
86
dB
± 1 MHz
90
dB
± 2 MHz
95
dB
± 10 MHz
60
dB
+ 12.5 kHz (adjacent channel)
61
dB
± 25 kHz (alternate channel)
80
dB
± 1 MHz
85
dB
± 2 MHz
91
dB
± 10 MHz
47
dB
+ 100 kHz (adjacent channel)
50
dB
± 200 kHz (alternate channel)
67
dB
± 1 MHz
71
dB
± 2 MHz
78
dB
± 10 MHz
DEV is short for deviation, CHF is short for channel filter bandwidth
Specifications
Copyright © 2011–2014, Texas Instruments Incorporated
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
4.10.5 RX Performance in 169-MHz Band (High-Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
PARAMETER
MIN
Sensitivity
Blocking and Selectivity
0.3-kbps 2-FSK, 6.25-kHz channel
separation, 1-kHz deviation, 3.8-kHz
channel filter
fxosc = 40 MHz using TCXO
Blocking and Selectivity
1.2-kbps 2-FSK, 12.5-kHz channel
separation, 4-kHz deviation, 10-kHz
channel filter
fxosc = 40 MHz using TCXO
TYP
MAX
UNIT
CONDITION
–129
dBm
300 bps, DEV=1 kHz, CHF=3.8 kHz (1)
fxosc = 40 MHz
–123
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz (1)
67
dB
± 6.25 kHz (adjacent channel)
67
dB
+ 12.5 kHz (alternate channel)
88
dB
± 1 MHz
101
dB
–2 MHz
104
dB
± 10 MHz
63
dB
± 12.5 kHz (adjacent channel)
65
dB
± 25 kHz (alternate channel)
82
dB
± 1 MHz
86
dB
± 2 MHz
–10 MHz
93
dB
Spurious Response Rejection
1.2-kbps 2-FSK, 12.5-kHz channel
separation, 4-kHz deviation, 10-kHz
channel filter
70
dB
Image Rejection
(Image compensation enabled)
66
dB
(1)
1.2 kbps, DEV=4 kHz CHF=10 kHz (1), image at
–125 kHz
DEV is short for deviation, CHF is short for channel filter bandwidth
Specifications
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4.10.6 RX Performance in Low-Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
UNIT
CONDITION
–111
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz (1)
–99
dBm
38.4 kbps, DEV=50 kHz CHF=100 kHz (1)
–99
dBm
50-kbps 2-GFSK, DEV=25 kHz, CHF=100
kHz (1)
46
dB
± 12.5 kHz (adjacent channel)
46
dB
± 25 kHz (alternate channel)
73
dB
± 1 MHz
78
dB
± 2 MHz
79
dB
± 10 MHz
43
dB
± 50 kHz (adjacent channel)
45
dB
+ 100 kHz (alternate channel)
71
dB
± 1 MHz
74
dB
± 2 MHz
75
dB
± 10 MHz
37
dB
+ 100 kHz (adjacent channel)
43
dB
+ 200 kHz (alternate channel)
58
dB
± 1 MHz
62
dB
± 2 MHz
64
dB
+ 10 MHz
Blocking and Selectivity
50-kbps 2-GFSK, 200-kHz channel
separation, 25-kHz deviation, 100-kHz
channel filter
(Same modulation format as 802.15.4g
Mandatory Mode)
43
dB
+ 200 kHz (adjacent channel)
52
dB
+ 400 kHz (alternate channel)
60
dB
± 1 MHz
64
dB
± 2 MHz
65
dB
± 10 MHz
Saturation
+10
dBm
Sensitivity
Blocking and Selectivity
1.2-kbps 2-FSK, 12.5-kHz channel
separation, 4-kHz deviation, 10-kHz channel
filter
Blocking and Selectivity
1.2-kbps 2-FSK, 50-kHz channel separation,
20-kHz deviation, 50-kHz channel filter
Blocking and Selectivity
38.4-kbps 2-GFSK, 100-kHz channel
separation, 20-kHz deviation, 100-kHz
channel filter
(1)
16
MIN
TYP
MAX
DEV is short for deviation, CHF is short for channel filter bandwidth
Specifications
Copyright © 2011–2014, Texas Instruments Incorporated
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SWRS120E – JUNE 2011 – REVISED OCTOBER 2014
4.11 Transmit Parameters
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
MIN
UNIT
CONDITION
+12
dBm
At 950 MHz
+14
dBm
At 915- and 920-MHz
+15
dBm
At 915- and 920-MHz with VDD = 3.6 V
+15
dBm
At 868 MHz
+16
dBm
At 868 MHz with VDD = 3.6 V
+15
dBm
At 433 MHz
+16
dBm
At 433 MHz with VDD = 3.6 V
+15
dBm
At 169 MHz
+16
dBm
At 169 MHz with VDD = 3.6 V
–11
dBm
Within fine step size range
–40
dBm
Within coarse step size range
0.4
dB
Within fine step size range
–75
dBc
4-GFSK 9.6 kbps in 12.5-kHz channel,
measured in 100-Hz bandwidth at 434 MHz
(FCC Part 90 Mask D compliant)
–58
dBc
4-GFSK 9.6 kbps in 12.5-kHz channel,
measured in 8.75-kHz bandwidth (ETSI 300 220
compliant)
–61
dBc
2-GFSK 2.4 kbps in 12.5-kHz channel, 1.2-kHz
deviation
50-ms periods).
Optimum load
Specifications
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4.12 PLL Parameters
4.12.1 High-Performance Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 40 MHz using TCXO if nothing else stated
PARAMETER
MIN
TYP
Phase noise in 950-MHz band
fxosc = 32 MHz
Phase noise in 868-, 915-, 920-MHz bands
Phase noise in 433-MHz band
Phase noise in 169-MHz band
MAX
UNIT
CONDITION
–100
dBc/Hz
± 10 kHz offset
–103
dBc/Hz
± 100 kHz offset
–123
dBc/Hz
± 1 MHz offset
–101
dBc/Hz
± 10 kHz offset
–102
dBc/Hz
± 100 kHz offset
–124
dBc/Hz
± 1 MHz offset
–107
dBc/Hz
± 10 kHz offset
–110
dBc/Hz
± 100 kHz offset
–130
dBc/Hz
± 1 MHz offset
–115
dBc/Hz
± 10 kHz offset
–115
dBc/Hz
± 100 kHz offset
–135
dBc/Hz
± 1 MHz offset
4.12.2 Low-Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
Phase noise in 950-MHz band
Phase noise in 868-, 915- , and 920-MHz
bands
Phase noise in 433-MHz band
Phase noise in 169-MHz band
18
MIN
TYP
MAX
UNIT
CONDITION
–90
dBc/Hz
± 10 kHz offset
–92
dBc/Hz
± 100 kHz offset
–124
dBc/Hz
± 1 MHz offset
–95
dBc/Hz
± 10 kHz offset
–95
dBc/Hz
± 100 kHz offset
–124
dBc/Hz
± 1 MHz offset
–98
dBc/Hz
± 10 kHz offset
–102
dBc/Hz
± 100 kHz offset
–129
dBc/Hz
± 1 MHz offset
–106
dBc/Hz
± 10 kHz offset
–110
dBc/Hz
± 100 kHz offset
–136
dBc/Hz
± 1 MHz offset
Specifications
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4.13 Wake-up and Timing
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PARAMETER
MIN
TYP
Powerdown to IDLE
IDLE to RX/TX
RX/TX turnaround
RX/TX to IDLE time
MAX
UNIT
CONDITION
0.4
ms
Depends on crystal
166
µs
Calibration disabled
461
µs
Calibration enabled
50
µs
296
µs
Calibrate when leaving RX/TX enabled
0
µs
Calibrate when leaving RX/TX disabled
Frequency synthesizer calibration
391
µs
When using SCAL strobe
Minimum required number of preamble bytes
0.5
bytes
Time from start RX until valid RSSI,
including gain settling (function of channel
bandwidth. Programmable for trade-off
between speed and accuracy)
4.6
ms
12.5-kHz channels
0.3
ms
200-kHz channels
Required for RF front-end gain settling only.
Digital demodulation does not require preamble
for settling.
4.14 High-Speed Crystal Oscillator
TA = 25°C, VDD = 3.0 V if nothing else stated
PARAMETER
MIN
Crystal frequency
TYP
MAX
32
44
Load capacitance (CL)
UNIT
CONDITION
MHz
It is expected that there will be degraded
sensitivity at multiples of XOSC/2 in RX, and an
increase in spurious emissions when the RF
channel is close to multiples of XOSC in TX. We
recommend that the RF channel is kept
RX_BW/2 away from XOSC/2 in RX, and that
the level of spurious emissions be evaluated if
the RF channel is closer than 1 MHz to multiples
of XOSC in TX.
10
pF
ESR