CC1150RSTRG3

CC1150 CC1150 Low Power Sub-1 GHz RF Transmitter Applications • Ultra low power UHF wireless transmitters • Operating in the 315/433/868/915 MHz ISM/SRD bands • AMR – Automatic Meter Reading • Consumer Electronics • RKE – Remote Keyless Entry • • • • • Low power telemetry Home and building automation Wireless alarm and security systems Industrial monitoring and control Wireless sensor networks Product Description The CC1150 is a low cost true single chip UHF transmitter designed for very low power wireless applications. The circuit is mainly intended for the ISM (Industrial, Scientific and Medical) and SRD (Short Range Device) frequency bands at 315, 433, 868 and 915 MHz, but can easily be programmed for operation at other frequencies in the 300-348 MHz, 400-464 MHz and 800-928 MHz bands. CC1150 is part of Chipcon’s SmartRF®04 technology platform based on 0.18 µm CMOS technology. The RF transmitter is integrated with a highly configurable baseband modulator. The modulator supports various modulation formats and has a configurable data rate up to 500 kBaud. The CC1150 provides extensive hardware support for packet handling, data buffering and burst transmissions. The main operating parameters and the 64byte transmit FIFO of CC1150 can be controlled via an SPI interface. In a typical system, the CC1150 will be used together with a microcontroller and a few additional passive components. Key Features • • • • • • • • Small size (QLP 4x4 mm package, 16 pins) True single chip UHF RF transmitter Frequency bands: 300-348 MHz, 400-464 MHz and 800-928 MHz Programmable data rate up to 500 kBaud Low current consumption Programmable output power up to +10 dBm for all supported frequencies Programmable baseband modulator Ideal for multi-channel operation • • Very few external components: Completely on-chip frequency synthesizer, no external filters needed Configurable packet handling hardware Suitable for frequency hopping systems due to a fast settling frequency synthesizer Optional Forward Error Correction with interleaving 64-byte TX data FIFO SWRS037A Page 1 of 60 • • • CC1150 Features (continued from front page) • • • • • • • • • • Suited for systems compliant with EN 300 220 and FCC CFR Part 15 Many powerful digital features allow a high-performance RF system to be made using an inexpensive microcontroller Efficient SPI interface: All registers can be programmed with one “burst” transfer Integrated analog temperature sensor Lead-free “green” package Flexible support for packet oriented systems: On chip support for sync word insertion, flexible packet length and automatic CRC handling OOK and flexible ASK shaping supported 2-FSK, GFSK and MSK supported Optional automatic whitening of data Support for asynchronous transparent transmit mode for backwards compatibility with existing radio communication protocols Abbreviations Abbreviations used in this data sheet are described below. ADC Analog to Digital Converter NRZ Non Return to Zero (Coding) AFC Automatic Frequency Compensation OOK On-Off-Keying AGC Automatic Gain Control PA Power Amplifier AMR Automatic Meter Reading PCB Printed Circuit Board ASK Amplitude Shift Keying PD Power Down BER Bit Error Rate PER Packet Error Rate CCA Clear Channel Assessment PLL Phase Locked Loop CFR Code of Federal Regulations POR Power-On Reset CRC Cyclic Redundancy Check QLP Quad Leadless Package CW Contionus Wave (Unmodulated Carrier) QPSK Quadrature Phase Shift Keying DC Direct Current RC Resistor-Capacitor EIRP Equivalent Isotropic Radiated Power RCOSC RC Oscillator ESR Equivalent Series Resistance RF Radio Frequency FCC Federal Communications Commission RSSI Received Signal Strength Indicator FEC Forward Error Correction RX Receive, Receive Mode FIFO First-In-First-Out SAW Surface Aqustic Wave FSK Frequency Shift Keying SMD Surface Mount Device GFSK Gaussian shaped Frequency Shift Keying SNR Signal to Noise Ratio ISM Industrial, Scientific, Medical SPI Serial Peripheral Interface LC Inductor-Capacitor SRD Short Range Devices LO Local Oscillator TBD To Be Defined LSB Least Significant Byte TX Transmit, Transmit Mode LQI Link Quality Indicator UHF Ultra High frequency MCU Microcontroller Unit VCO Voltage Controlled Oscillator MSK Minimum Shift Keying XOSC Crystal Oscillator N/A Not Applicable XTAL Crystal SWRS037A Page 2 of 60 CC1150 Table Of Contents APPLICATIONS ...........................................................................................................................................1 PRODUCT DESCRIPTION.........................................................................................................................1 KEY FEATURES ..........................................................................................................................................1 FEATURES (CONTINUED FROM FRONT PAGE)................................................................................2 ABBREVIATIONS ...............................................................................................................................................2 TABLE OF CONTENTS ..............................................................................................................................3 1 ABSOLUTE MAXIMUM RATINGS ...........................................................................................................5 2 OPERATING CONDITIONS ......................................................................................................................5 3 GENERAL CHARACTERISTICS ...............................................................................................................5 4 ELECTRICAL SPECIFICATIONS ...............................................................................................................6 4.1 CURRENT CONSUMPTION .....................................................................................................................6 4.2 RF TRANSMIT SECTION ........................................................................................................................7 4.3 CRYSTAL OSCILLATOR .........................................................................................................................8 4.4 FREQUENCY SYNTHESIZER CHARACTERISTICS .....................................................................................8 4.5 ANALOG TEMPERATURE SENSOR .........................................................................................................9 4.6 DC CHARACTERISTICS .........................................................................................................................9 4.7 POWER ON RESET .................................................................................................................................9 5 PIN CONFIGURATION ..........................................................................................................................10 6 CIRCUIT DESCRIPTION ........................................................................................................................11 7 APPLICATION CIRCUIT ........................................................................................................................11 7.1 BIAS RESISTOR ...................................................................................................................................11 7.2 BALUN AND RF MATCHING ................................................................................................................11 7.3 CRYSTAL ............................................................................................................................................12 7.4 REFERENCE SIGNAL ............................................................................................................................12 7.5 ADDITIONAL FILTERING......................................................................................................................12 7.6 POWER SUPPLY DECOUPLING ..............................................................................................................12 7.7 ANTENNA CONSIDERATIONS ..............................................................................................................13 7.8 PCB LAYOUT RECOMMENDATIONS ....................................................................................................15 8 CONFIGURATION OVERVIEW ..............................................................................................................16 9 CONFIGURATION SOFTWARE ..............................................................................................................17 10 4-WIRE SERIAL CONFIGURATION AND DATA INTERFACE ...................................................................18 10.1 CHIP STATUS BYTE ............................................................................................................................19 10.2 REGISTER ACCESS ..............................................................................................................................20 10.3 SPI READ ...........................................................................................................................................20 10.4 COMMAND STROBES ..........................................................................................................................20 10.5 FIFO ACCESS .....................................................................................................................................21 10.6 PATABLE ACCESS ............................................................................................................................22 11 MICROCONTROLLER INTERFACE AND PIN CONFIGURATION ...............................................................22 11.1 CONFIGURATION INTERFACE ..............................................................................................................22 11.2 GENERAL CONTROL AND STATUS PINS ..............................................................................................22 11.3 OPTIONAL RADIO CONTROL FEATURE ...............................................................................................23 12 DATA RATE PROGRAMMING ...............................................................................................................23 13 PACKET HANDLING HARDWARE SUPPORT .........................................................................................24 13.1 DATA WHITENING ...............................................................................................................................24 13.2 PACKET FORMAT ................................................................................................................................25 13.3 PACKET HANDLING IN TRANSMIT MODE ............................................................................................26 13.4 PACKET HANDLING IN FIRMWARE ......................................................................................................26 14 MODULATION FORMATS.....................................................................................................................27 14.1 FREQUENCY SHIFT KEYING ................................................................................................................27 14.2 MINIMUM SHIFT KEYING....................................................................................................................27 14.3 AMPLITUDE MODULATION .................................................................................................................28 15 FORWARD ERROR CORRECTION WITH INTERLEAVING ........................................................................28 15.1 FORWARD ERROR CORRECTION (FEC)...............................................................................................28 15.2 INTERLEAVING ...................................................................................................................................28 SWRS037A Page 3 of 60 CC1150 16 16.1 16.2 16.3 16.4 16.5 17 18 19 19.1 20 21 21.1 22 23 23.1 23.2 24 24.1 24.2 24.3 24.4 24.5 24.6 24.7 24.8 25 25.1 25.2 26 26.1 26.2 27 28 28.1 RADIO CONTROL ................................................................................................................................30 POWER ON START-UP SEQUENCE........................................................................................................31 CRYSTAL CONTROL ............................................................................................................................31 VOLTAGE REGULATOR CONTROL.......................................................................................................32 ACTIVE MODE ....................................................................................................................................32 TIMING ...............................................................................................................................................32 DATA FIFO ........................................................................................................................................33 FREQUENCY PROGRAMMING ..............................................................................................................34 VCO...................................................................................................................................................34 VCO AND PLL SELF-CALIBRATION ...................................................................................................34 VOLTAGE REGULATORS .....................................................................................................................35 OUTPUT POWER PROGRAMMING ........................................................................................................35 SHAPING AND PA RAMPING ...............................................................................................................36 GENERAL PURPOSE / TEST OUTPUT CONTROL PINS ...........................................................................37 ASYNCHRONOUS AND SYNCHRONOUS SERIAL OPERATION ................................................................39 ASYNCHRONOUS SERIAL OPERATION .................................................................................................39 SYNCHRONOUS SERIAL OPERATION ...................................................................................................39 SYSTEM CONSIDERATIONS AND GUIDELINES ......................................................................................39 SRD REGULATIONS ............................................................................................................................39 FREQUENCY HOPPING AND MULTI-CHANNEL SYSTEMS .....................................................................40 WIDEBAND MODULATION NOT USING SPREAD SPECTRUM .................................................................40 DATA BURST TRANSMISSIONS............................................................................................................41 CONTINUOUS TRANSMISSIONS ...........................................................................................................41 LOW COST SYSTEMS ..........................................................................................................................41 BATTERY OPERATED SYSTEMS ..........................................................................................................41 INCREASING OUTPUT POWER .............................................................................................................41 CONFIGURATION REGISTERS ..............................................................................................................42 CONFIGURATION REGISTER DETAILS .................................................................................................45 STATUS REGISTER DETAILS .................................................................................................................55 PACKAGE DESCRIPTION (QLP 16) ......................................................................................................57 RECOMMENDED PCB LAYOUT FOR PACKAGE (QLP 16) .....................................................................57 SOLDERING INFORMATION..................................................................................................................57 REFERENCES.......................................................................................................................................58 GENERAL INFORMATION ....................................................................................................................59 DOCUMENT HISTORY .........................................................................................................................59 SWRS037A Page 4 of 60 CC1150 1 Absolute Maximum Ratings Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. Parameter Min Max Units Supply voltage –0.3 3.6 V Voltage on any digital pin –0.3 VDD+0.3 V Condition All supply pins must have the same voltage max 3.6 Voltage on the pins RF_P, RF_N and DCOUPL –0.3 2.0 V Voltage ramp-up 120 kV/µs Input RF level +10 dBm 150 °C Solder reflow temperature 260 °C According to IPC/JEDEC J-STD-020C ESD