Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU
1 Device Overview
1.1
Features
1
• World's First Dual-Band (Sub-1 GHz and 2.4 GHz)
Wireless Microcontroller
• Microcontroller
– Powerful Arm® Cortex®-M3 Processor
– EEMBC CoreMark® Score: 142
– EEMBC ULPBench™ Score: 158
– Clock Speed up to 48-MHz
– 128KB of In-System Programmable Flash
– 8KB of SRAM for Cache
(or as General-Purpose RAM)
– 20KB of Ultra-Low-Leakage SRAM
– 2-Pin cJTAG and JTAG Debugging
– Supports Over-the-Air (OTA) Update
• Ultra-Low-Power Sensor Controller
– Can Run Autonomously From the Rest of the
System
– 16-Bit Architecture
– 2KB of Ultra-Low-Leakage SRAM for Code and
Data
• Efficient Code-Size Architecture, Placing Parts of
TI-RTOS, Drivers, Bluetooth® low energy
Controller and Bootloader in ROM
• RoHS-Compliant Package
– 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
– 5-mm × 5-mm RHB VQFN32 (15 GPIOs)
– 4-mm × 4-mm RSM VQFN32 (10 GPIOs)
• Peripherals
– All Digital Peripheral Pins Can Be Routed to
Any GPIO
– Four General-Purpose Timer Modules
(Eight 16-Bit or Four 32-Bit Timers, PWM Each)
– 12-Bit ADC, 200 ksamples/s, 8-Channel Analog
MUX
– Continuous Time Comparator
– Ultra-Low-Power Clocked Comparator
– Programmable Current Source
– UART
– 2× SSI (SPI, MICROWIRE, TI)
– I2C, I2S
– Real-Time Clock (RTC)
– AES-128 Security Module
– True Random Number Generator (TRNG)
– Support for Eight Capacitive Sensing Buttons
– Integrated Temperature Sensor
SPACER
SPACER
1
SPACER
SPACER
• External System
– On-Chip Internal DC/DC Converter
– Seamless Integration With the SimpleLink™
CC1190 and CC2592 Range Extender
• Low Power
– Wide Supply Voltage Range: 1.8 to 3.8 V
– RX: 5.4 mA (Sub-1 GHz), 6.4 mA (Bluetooth low
energy, 2.4 GHz)
– TX at +10 dBm: 13.4 mA (Sub-1 GHz)
– TX at +9 dBm: 22.3 mA (Bluetooth low energy,
2.4 GHz)
– TX at +0 dBm: 10.5 mA (Bluetooth low energy,
2.4 GHz)
– Active-Mode MCU 48 MHz Running Coremark:
2.5 mA (51 µA/MHz)
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode Sensor Controller at 24 MHz:
0.4 mA + 8.2 µA/MHz
– Sensor Controller, One Wakeup Every Second
Performing One 12-Bit ADC Sampling: 0.95 µA
– Standby: 0.7 µA (RTC Running and RAM and
CPU Retention)
– Shutdown: 185 nA (Wakeup on External Events)
• RF Section
– 2.4-GHz RF Transceiver Compatible With
Bluetooth low energy 4.2 Specification
– Excellent Receiver Sensitivity –124 dBm Using
Long-Range Mode, –110 dBm at 50 kbps
(Sub-1 GHz),
–87 dBm at Bluetooth low energy
– Excellent Selectivity (±100 kHz): 56 dB
– Excellent Blocking Performance (±10 MHz):
90 dB
– Programmable Output Power up to +15 dBm
(Sub-1 GHz) and +9 dBm at 2.4 GHz (Bluetooth
low energy)
– Single-Ended or Differential RF Interface
– Suitable for Systems Targeting Compliance With
Worldwide Radio Frequency Regulations
– ETSI EN 300 220, EN 303 204 (Europe)
– EN 300 440 Class 2 (Europe)
– EN 300 328 (Europe)
– FCC CFR47 Part 15 (US)
– ARIB STD-T66 (Japan)
– ARIB STD-T108 (Japan)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
– Wireless M-Bus (EN 13757-4) and IEEE®
802.15.4g PHY
• Tools and Development Environment
– Full-Feature and Low-Cost Development Kits
– Multiple Reference Designs for Different RF
Configurations
– Packet Sniffer PC Software
1.2
•
•
•
•
•
•
•
•
Sensor Controller Studio
SmartRF™ Studio
SmartRF Flash Programmer 2
IAR Embedded Workbench® for Arm
Code Composer Studio™ (CCS) IDE
CCS UniFlash
Applications
315-, 433-, 470-, 500-, 779-, 868-, 915-,
920-MHz and 2.4-GHz ISM and SRD Systems
Low-Power Wireless Systems
With 50-kHz to 5-MHz Channel Spacing
Home and Building Automation
Wireless Alarm and Security Systems
Industrial Monitoring and Control
Bluetooth low energy Beacon Management
Bluetooth low energy Commissioning
Smart Grid and Automatic Meter Reading
1.3
–
–
–
–
–
–
•
•
•
•
•
•
•
•
Wireless Healthcare Applications
Wireless Sensor Networks
Active RFID
IEEE 802.15.4g, IP-Enabled Smart Objects
(6LoWPAN), Wireless M-Bus, KNX Systems,
Wi-SUN™, and Proprietary Systems
Energy-Harvesting Applications
Electronic Shelf Label (ESL)
Long-Range Sensor Applications
Heat-Cost Allocators
Description
The CC1350 device is a cost-effective, ultra-low-power, dual-band RF device from Texas Instruments™
that is part of the SimpleLink™ microcontroller (MCU) platform. The platform consists of Wi-Fi®, Bluetooth®
low energy, Sub-1 GHz, Ethernet, Zigbee®, Thread, and host MCUs. These devices all share a common,
easy-to-use development environment with a single core software development kit (SDK) and a rich tool
set. A one-time integration of the SimpleLink platform enables users to add any combination of devices
from the portfolio into their design, allowing 100 percent code reuse when design requirements change.
For more information, visit www.ti.com/simplelink.
With very low active RF and MCU current consumption, in addition to flexible low-power modes, the
device provides excellent battery life and allows long-range operation on small coin-cell batteries and in
energy harvesting applications.
The CC1350 is a device in the CC13xx and CC26xx family of cost-effective, ultra-low-power wireless
MCUs capable of handling both Sub-1 GHz and 2.4-GHz RF frequencies. The CC1350 device combines a
flexible, very low-power RF transceiver with a powerful 48-MHz Arm® Cortex®-M3 microcontroller in a
platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Cortex®-M0)
handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power
and flexibility to handle both Sub-1 GHz protocols and 2.4 GHz protocols (for example Bluetooth low
energy). This enables the combination of a Sub-1 GHz communication solution that offers the best
possible RF range together with a Bluetooth low energy smartphone connection that enables great user
experience through a phone application. The Sub-1 GHz only device in this family is the CC1310.
The CC1350 device is a highly integrated, true single-chip solution incorporating a complete RF system
and an on-chip DC/DC converter.
Sensors can be handled in a very low-power manner by a dedicated autonomous ultra-low-power MCU
that can be configured to handle analog and digital sensors; thus the main MCU (Arm® Cortex®-M3) can
maximize sleep time.
The power and clock management and radio systems of the CC1350 device require specific configuration
and handling by software to operate correctly, which has been implemented in the TI-RTOS. TI
recommends using this software framework for all application development on the device. The complete
TI-RTOS and device drivers are offered free of charge in source code.
2
Device Overview
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
Device Information (1)
PACKAGE
BODY SIZE (NOM)
CC1350F128RGZ
PART NUMBER
VQFN (48)
7.00 mm × 7.00 mm
CC1350F128RHB
VQFN (32)
5.00 mm × 5.00 mm
CC1350F128RSM
VQFN (32)
4.00 mm × 4.00 mm
(1)
For more information, see Section 9.
Device Overview
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
3
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
1.4
www.ti.com
Functional Block Diagram
Figure 1-1 shows a block diagram for the CC1350 device.
SimpleLinkTM CC1350 Wireless MCU
cJTAG
RF core
ROM
Main CPU:
ADC
ARM®
Cortex®-M3
128-KB
Flash
ADC
Digital PLL
DSP Modem
8-KB
Cache
20-KB
SRAM
ARM®
Cortex®-M0
4x 32-Bit Timers
UART
2x SSI (SPI,µW,TI)
ROM
Sensor Controller
General Peripherals / Modules
I 2C
4-KB
SRAM
Sensor Controller
Engine
12-Bit ADC, 200ks/s
I2S
Watchdog Timer
2x Analog Comparators
10 / 15 / 30 GPIOs
TRNG
SPI / I2C Digital Sensor IF
AES
Temp. / Batt. Monitor
Constant Current Source
32 ch. PDMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC-DC Converter
Copyright © 2016, Texas Instruments Incorporated
Figure 1-1. CC1350 Block Diagram
4
Device Overview
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
Table of Contents
1
Device Overview ......................................... 1
5.19
DC Characteristics .................................. 31
1.1
Features .............................................. 1
5.20
Thermal Characteristics ............................. 32
1.2
Applications ........................................... 2
5.21
Timing and Switching Characteristics ............... 32
1.3
Description ............................................ 2
5.22
Typical Characteristics .............................. 36
1.4
Functional Block Diagram ............................ 4
...............
..................
Detailed Description ...................................
6.1
Overview ............................................
6.2
Main CPU ...........................................
6.3
RF Core .............................................
6.4
Sensor Controller ...................................
6.5
Memory ..............................................
6.6
Debug ...............................................
6.7
Power Management .................................
6.8
Clock Systems ......................................
6.9
General Peripherals and Modules ..................
6.10 Voltage Supply Domains ............................
6.11 System Architecture .................................
Application, Implementation, and Layout .........
7.1
Application Information ..............................
7.2
TI Design or Reference Design .....................
Device and Documentation Support ...............
8.1
Device Nomenclature ...............................
8.2
Tools and Software .................................
8.3
Documentation Support .............................
8.4
Texas Instruments Low-Power RF Website ........
8.5
Additional Information ...............................
8.6
Community Resources ..............................
8.7
Trademarks..........................................
8.8
Electrostatic Discharge Caution .....................
8.9
Export Control Notice ...............................
8.10 Glossary .............................................
2
3
Revision History ......................................... 6
Device Comparison ..................................... 7
4
Terminal Configuration and Functions .............. 8
3.1
5
6
Related Products ..................................... 7
4.1
Pin Diagram – RSM Package ........................ 8
4.2
Signal Descriptions – RSM Package ................. 9
4.3
Pin Diagram – RHB Package ....................... 10
4.4
Signal Descriptions – RHB Package ................ 11
4.5
Pin Diagram – RGZ Package ....................... 12
4.6
Signal Descriptions – RGZ Package ................ 13
Specifications ........................................... 15
5.1
Absolute Maximum Ratings ......................... 15
5.2
ESD Ratings
5.3
Recommended Operating Conditions ............... 15
5.4
Power Consumption Summary...................... 16
5.5
..................................
.
Receive (RX) Parameters, 431 MHz to 527 MHz ..
Transmit (TX) Parameters, 861 MHz to 1054 MHz .
Transmit (TX) Parameters, 431 MHz to 527 MHz ..
1-Mbps GFSK (Bluetooth low energy) – RX ........
1-Mbps GFSK (Bluetooth low energy) – TX ........
PLL Parameters .....................................
ADC Characteristics.................................
Temperature Sensor ................................
Battery Monitor ......................................
Continuous Time Comparator .......................
Low-Power Clocked Comparator ...................
Programmable Current Source .....................
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
........................................
15
RF Characteristics
17
Receive (RX) Parameters, 861 MHz to 1054 MHz
17
7
8
23
25
26
26
27
28
28
29
29
30
30
30
9
5.23
Typical Characteristics – Sub-1 GHz
5.24
Typical Characteristics – 2.4 GHz
37
42
44
44
44
45
46
47
47
48
49
49
50
50
51
51
52
53
53
54
56
56
56
56
57
57
57
57
Mechanical, Packaging, and Orderable
Information .............................................. 57
9.1
Packaging Information
..............................
Table of Contents
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
57
5
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from November 20, 2016 to July 13, 2018
•
•
•
•
•
•
•
•
Changed Description section ....................................................................................................... 2
Changed Table 3-1 ................................................................................................................... 7
Changed test conditions for Receiver sensitivity, 50 kbps in Section 5.6 ................................................... 17
Added parameters to Section 5.6 ................................................................................................. 17
Added Receiver sensitivity parameters to Section 5.7 ......................................................................... 23
Changed ............................................................................................................................. 33
Changed footnote in ................................................................................................................ 33
Added Software section ........................................................................................................... 54
Changes from June 20, 2016 to November 20, 2016
•
•
•
•
•
•
•
•
•
•
•
•
6
Page
Page
Added 4-mm × 4-mm and 5-mm × 5-mm packages ............................................................................. 1
Added Figure 4-1 ..................................................................................................................... 8
Added Figure 4-2 .................................................................................................................... 10
Added support for split supply rail to Section 5.3 ............................................................................... 15
Added OOK modulation support to Section 5.4 ................................................................................. 16
Added receive parameters for 431-MHz to 527-MHz band in Section 5.7 .................................................. 23
Added transmit parameters for 431-MHz to 527-MHz band in Section 5.9 ................................................. 26
Changed ADC reference voltage to correct value in Section 5.13 ........................................................... 29
Added thermal characteristics for RHB and RSM packages in Section 5.20 ............................................... 32
Added Figure 5-10 .................................................................................................................. 37
Added Section 6.10 ................................................................................................................. 50
Changed Figure 8-1 ................................................................................................................. 53
Revision History
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
3 Device Comparison
Table 3-1 lists the device family overview.
Table 3-1. Device Family Overview
DEVICE
RADIO SUPPORT
FLASH
(KB)
RAM
(KB)
GPIOs
PACKAGE SIZE
CC1350F128RGZ
Proprietary, Wireless M-Bus,
IEEE 802.15.4g,
Bluetooth low energy
128
20
30
RGZ (7 mm × 7 mm VQFN48)
CC1350F128RHB
Proprietary, Wireless M-Bus,
IEEE 802.15.4g,
Bluetooth low energy
128
20
15
RHB (5 mm × 5 mm VQFN32)
CC1350F128RSM
Proprietary, Wireless M-Bus,
IEEE 802.15.4g,
Bluetooth low energy
128
20
10
RSM (4 mm × 4 mm VQFN32)
CC1310
Sub-1 GHz
Proprietary, Wireless M-Bus,
IEEE 802.15.4g
128
64/32
20
16
10-30
RGZ (7 mm × 7 mm VQFN48)
RHB (5 mm × 5 mm VQFN32)
RSM (4 mm × 4 mm VQFN32)
CC2640R2
Bluetooth 5 low energy
2.4-GHz proprietary FSK-based formats
128
20
10-31
RGZ (7 mm × 7 mm VQFN48)
RHB (5 mm × 5 mm VQFN32)
RSM (4 mm × 4 mm VQFN32)
YFV (2.7 mm × 2.7 mm DSBGA34)
CC1312R
Sub-1 GHz
Proprietary, Wireless M-Bus,
IEEE 802.15.4g
352
80
30
RGZ (7 mm × 7 mm VQFN48)
CC1352R
Dual-band (2.4-GHz and Sub-1 GHz)
Multiprotocol
352
80
28
RGZ (7 mm × 7 mm VQFN48)
CC2642R
Bluetooth 5 low energy
2.4-GHz proprietary FSK-based formats
352
80
31
RGZ (7 mm × 7 mm VQFN48)
CC2652R
Multiprotocol
Bluetooth 5 low energy
Zigbee
Thread
2.4-GHz proprietary FSK-based formats
352
80
31
RGZ (7 mm × 7 mm VQFN48)
3.1
Related Products
Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF
solutions suitable for a broad range of application. The offerings range from fully customized
solutions to turnkey offerings with precertified hardware and software (protocol).
Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of
Sub-1 GHz ISM bands.
Companion Products Review products that are frequently purchased or used with this product.
Device Comparison
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
7
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
4 Terminal Configuration and Functions
4.1
Pin Diagram – RSM Package
17 VSS
18 DCDC_SW
19 VDDS_DCDC
20 VSS
21 RESET_N
22 DIO_5
23 DIO_6
24 DIO_7
Figure 4-1 shows the RSM pinout diagram.
DIO_8 25
16 DIO_4
DIO_9 26
15 DIO_3
VDDS 27
14 JTAG_TCKC
VDDR 28
13 JTAG_TMSC
VSS 29
12 DCOUPL
X24M_N 30
11 VDDS2
X24M_P 31
10 DIO_2
3
4
5
6
7
8
VSS
X32K_Q1
X32K_Q2
VSS
DIO_0
2
RX_TX
1
RF_P
9
RF_N
VDDR_RF 32
DIO_1
Figure 4-1. RSM (4-mm × 4-mm) Pinout, 0.4-mm Pitch
Top View
I/O pins marked in Figure 4-1 in bold have high-drive capabilities; they are as follows:
• Pin 8, DIO_0
• Pin 9, DIO_1
• Pin 10, DIO_2
• Pin 13, JTAG_TMSC
• Pin 15, DIO_3
• Pin 16, DIO_4
I/O pins marked in Figure 4-1 in italics have analog capabilities; they are as follows:
• Pin 22, DIO_5
• Pin 23, DIO_6
• Pin 24, DIO_7
• Pin 25, DIO_8
• Pin 26, DIO_9
8
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
4.2
SWRS183B – JUNE 2016 – REVISED JULY 2018
Signal Descriptions – RSM Package
Table 4-1. Signal Descriptions – RSM Package
PIN
NAME
NO.
TYPE
DESCRIPTION
DCDC_SW
18
Power
Output from internal DC/DC (1)
DCOUPL
12
Power
1.27-V regulated digital-supply decoupling capacitor (2)
DIO_0
8
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_1
9
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_2
10
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_3
15
Digital I/O
GPIO, high-drive capability, JTAG_TDO
DIO_4
16
Digital I/O
GPIO, high-drive capability, JTAG_TDI
DIO_5
22
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_6
23
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_7
24
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_8
25
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_9
26
Digital or analog I/O
GPIO, Sensor Controller, analog
EGP
–
Power
JTAG_TMSC
13
Digital I/O
JTAG TMSC
JTAG_TCKC
14
Digital I/O
JTAG TCKC (3)
RESET_N
21
Digital input
RF_N
2
RF I/O
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_P
1
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
RX_TX
4
RF I/O
Optional bias pin for the RF LNA
VDDS
27
Power
1.8-V to 3.8-V main chip supply (1)
VDDS2
11
Power
1.8-V to 3.8-V GPIO supply (1)
VDDS_DCDC
19
Power
1.8-V to 3.8-V DC/DC supply
VDDR
28
Power
1.7-V to 1.95-V supply, connect to output of internal DC/DC (2) (4)
VDDR_RF
32
Power
1.7-V to 1.95-V supply, connect to output of internal DC/DC (2) (5)
3, 7, 17,
20, 29
Power
Ground
X32K_Q1
5
Analog I/O
32-kHz crystal oscillator pin 1
X32K_Q2
6
Analog I/O
32-kHz crystal oscillator pin 2
X24M_N
30
Analog I/O
24-MHz crystal oscillator pin 1
X24M_P
31
Analog I/O
24-MHz crystal oscillator pin 2
VSS
(1)
(2)
(3)
(4)
(5)
Ground; exposed ground pad
Reset, active low. No internal pullup.
See the technical reference manual listed in Section 8.3 for more details.
Do not supply external circuitry from this pin.
For design consideration regrading noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™
Wireless MCU Technical Reference Manual.
If internal DC/DC is not used, this pin is supplied internally from the main LDO.
If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
9
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
4.3
www.ti.com
Pin Diagram – RHB Package
17 DCDC_SW
18 VDDS_DCDC
19 RESET_N
20 DIO_7
21 DIO_8
22 DIO_9
23 DIO_10
24 DIO_11
Figure 4-2 shows the RHB pinout diagram.
DIO_12 25
16 DIO_6
DIO_13 26
15 DIO_5
DIO_14 27
14 JTAG_TCKC
VDDS 28
13 JTAG_TMSC
VDDR 29
12 DCOUPL
X24M_N 30
11 VDDS2
X24M_P 31
10 DIO_4
1
2
3
4
5
6
7
8
RF_P
RX_TX
X32K_Q1
X32K_Q2
DIO_0
DIO_1
DIO_2
9
RF_N
VDDR_RF 32
DIO_3
Figure 4-2. RHB (5-mm × 5-mm) Pinout, 0.5-mm Pitch
Top View
I/O pins marked in Figure 4-2 in bold have high-drive capabilities; they are as follows:
• Pin 8, DIO_2
• Pin 9, DIO_3
• Pin 10, DIO_4
• Pin 15, DIO_5
• Pin 16, DIO_6
I/O pins marked in Figure 4-2 in italics have analog capabilities; they are as follows:
• Pin 20, DIO_7
• Pin 21, DIO_8
• Pin 22, DIO_9
• Pin 23, DIO_10
• Pin 24, DIO_11
• Pin 25, DIO_12
• Pin 26, DIO_13
• Pin 27, DIO_14
10
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
4.4
SWRS183B – JUNE 2016 – REVISED JULY 2018
Signal Descriptions – RHB Package
Table 4-2. Signal Descriptions – RHB Package
PIN
NAME
TYPE
NO.
DESCRIPTION
DCDC_SW
17
Power
Output from internal DC/DC (1)
DCOUPL
12
Power
1.27-V regulated digital-supply decoupling (2)
DIO_0
6
Digital I/O
GPIO, Sensor Controller
DIO_1
7
Digital I/O
GPIO, Sensor Controller
DIO_2
8
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_3
9
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_4
10
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_5
15
Digital I/O
GPIO, high-drive capability, JTAG_TDO
DIO_6
16
Digital I/O
GPIO, high-drive capability, JTAG_TDI
DIO_7
20
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_8
21
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_9
22
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_10
23
Digital or analog I/O
GPIO, Sensor Controller, Analog
DIO_11
24
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_12
25
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_13
26
Digital or analog I/O
GPIO, Sensor Controller, analog
DIO_14
27
Digital or analog I/O
GPIO, Sensor Controller, analog
EGP
–
Power
JTAG_TMSC
13
Digital I/O
JTAG TMSC, high-drive capability
JTAG_TCKC
14
Digital I/O
JTAG TCKC (3)
RESET_N
19
Digital input
RF_N
2
RF I/O
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_P
1
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
RX_TX
3
RF I/O
Optional bias pin for the RF LNA
VDDR
29
Power
1.7-V to 1.95-V supply, connect to output of internal DC/DC (2) (4)
VDDR_RF
32
Power
1.7-V to 1.95-V supply, connect to output of internal DC/DC (2) (5)
VDDS
28
Power
1.8-V to 3.8-V main chip supply (1)
VDDS2
11
Power
1.8-V to 3.8-V GPIO supply (1)
VDDS_DCDC
18
Power
1.8-V to 3.8-V DC/DC supply
X24M_N
30
Analog I/O
24-MHz crystal oscillator pin 1
X24M_P
31
Analog I/O
24-MHz crystal oscillator pin 2
X32K_Q1
4
Analog I/O
32-kHz crystal oscillator pin 1
X32K_Q2
5
Analog I/O
32-kHz crystal oscillator pin 2
(1)
(2)
(3)
(4)
(5)
Ground; exposed ground pad
Reset, active low. No internal pullup.
For more details, see the technical reference manual listed in Section 8.3.
Do not supply external circuitry from this pin.
For design consideration regrading noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™
Wireless MCU Technical Reference Manual.
If internal DC/DC is not used, this pin is supplied internally from the main LDO.
If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
11
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
4.5
www.ti.com
Pin Diagram – RGZ Package
25 JTAG_TCKC
26 DIO_16
27 DIO_17
29 DIO_19
28 DIO_18
31 DIO_21
30 DIO_20
33 DCDC_SW
32 DIO_22
35 RESET_N
34 VDDS_DCDC
36 DIO_23
Figure 4-3 shows the RGZ pinout diagram.
DIO_24 37
24 JTAG_TMSC
DIO_25 38
23 DCOUPL
DIO_26 39
22 VDDS3
DIO_27 40
DIO_28 41
21 DIO_15
20 DIO_14
DIO_29 42
DIO_30 43
19 DIO_13
18 DIO_12
VDDS 44
17 DIO_11
16 DIO_10
VDDR 45
15 DIO_9
14 DIO_8
X24M_N 46
X24M_P 47
13 VDDS2
5
6
7
8
9
X32K_Q2
DIO_1
DIO_2
DIO_3
DIO_4
DIO_7 12
4
X32K_Q1
DIO_6 11
3
DIO_5 10
2
RF_N
RX_TX
RF_P
1
VDDR_RF 48
Figure 4-3. RGZ (7-mm × 7-mm) Pinout, 0.5-mm Pitch
Top View
I/O pins marked in Figure 4-3 in bold have high-drive capabilities; they are as follows:
• Pin 10, DIO_5
• Pin 11, DIO_6
• Pin 12, DIO_7
• Pin 24, JTAG_TMSC
• Pin 26, DIO_16
• Pin 27, DIO_17
I/O pins marked in Figure 4-3 in italics have analog capabilities; they are as follows:
• Pin 36, DIO_23
• Pin 37, DIO_24
• Pin 38, DIO_25
• Pin 39, DIO_26
• Pin 40, DIO_27
• Pin 41, DIO_28
• Pin 42, DIO_29
• Pin 43, DIO_30
12
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
4.6
SWRS183B – JUNE 2016 – REVISED JULY 2018
Signal Descriptions – RGZ Package
Table 4-3. Signal Descriptions – RGZ Package
PIN
NAME
NO.
TYPE
DESCRIPTION
DCDC_SW
33
Power
Output from internal DC/DC (1) (2)
DCOUPL
23
Power
1.27-V regulated digital-supply (decoupling capacitor) (2)
DIO_1
6
Digital I/O
GPIO, Sensor Controller
DIO_2
7
Digital I/O
GPIO, Sensor Controller
DIO_3
8
Digital I/O
GPIO, Sensor Controller
DIO_4
9
Digital I/O
GPIO, Sensor Controller
DIO_5
10
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_6
11
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_7
12
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_8
14
Digital I/O
GPIO
DIO_9
15
Digital I/O
GPIO
DIO_10
16
Digital I/O
GPIO
DIO_11
17
Digital I/O
GPIO
DIO_12
18
Digital I/O
GPIO
DIO_13
19
Digital I/O
GPIO
DIO_14
20
Digital I/O
GPIO
DIO_15
21
Digital I/O
GPIO
DIO_16
26
Digital I/O
GPIO, JTAG_TDO, high-drive capability
DIO_17
27
Digital I/O
GPIO, JTAG_TDI, high-drive capability
DIO_18
28
Digital I/O
GPIO
DIO_19
29
Digital I/O
GPIO
DIO_20
30
Digital I/O
GPIO
DIO_21
31
Digital I/O
GPIO
DIO_22
32
Digital I/O
GPIO
DIO_23
36
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_24
37
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_25
38
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_26
39
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_27
40
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_28
41
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_29
42
Digital or analog I/O GPIO, Sensor Controller, analog
DIO_30
43
Digital or analog I/O GPIO, Sensor Controller, analog
EGP
–
Power
JTAG_TMSC
24
Digital I/O
JTAG TMSC, high-drive capability
JTAG_TCKC
25
Digital I/O
JTAG TCKC (3)
RESET_N
35
Digital input
RF_N
2
RF I/O
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_P
1
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
(1)
(2)
(3)
Ground; exposed ground pad
Reset, active-low. No internal pullup.
See technical reference manual listed in Section 8.3 for more details.
Do not supply external circuitry from this pin.
For design consideration regrading noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™
Wireless MCU Technical Reference Manual.
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
13
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
Table 4-3. Signal Descriptions – RGZ Package (continued)
PIN
TYPE
DESCRIPTION
NAME
NO.
VDDR
45
Power
1.7-V to 1.95-V supply, connect to output of internal DC/DC (2) (4)
VDDR_RF
48
Power
1.7-V to 1.95-V supply, connect to output of internal DC/DC (2) (5)
VDDS
44
Power
1.8-V to 3.8-V main chip supply (1)
VDDS2
13
Power
1.8-V to 3.8-V DIO supply (1)
VDDS3
22
Power
1.8-V to 3.8-V DIO supply (1)
VDDS_DCDC
34
Power
1.8-V to 3.8-V DC/DC supply
X24M_N
46
Analog I/O
24-MHz crystal oscillator pin 1
X24M_P
47
Analog I/O
24-MHz crystal oscillator pin 2
RX_TX
3
RF I/O
X32K_Q1
4
Analog I/O
32-kHz crystal oscillator pin 1
X32K_Q2
5
Analog I/O
32-kHz crystal oscillator pin 2
(4)
(5)
14
Optional bias pin for the RF LNA
If internal DC/DC is not used, this pin is supplied internally from the main LDO.
If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
5 Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
MAX
UNIT
–0.3
4.1
V
–0.3
VDDSn + 0.3, max 4.1
V
–0.3
VDDR + 0.3, max 2.25
V
Voltage scaling enabled
–0.3
VDDS
Voltage scaling disabled, internal reference
–0.3
1.49
Voltage scaling disabled, VDDS as reference
–0.3
VDDS / 2.9
10
dBm
–40
150
°C
Supply voltage (VDDS, VDDS2, and VDDS3)
Voltage on any digital pin
(3) (4)
Voltage on crystal oscillator pins X32K_Q1, X32K_Q2, X24M_N, and X24M_P
Voltage on ADC input (Vin)
Input RF level
Storage temperature (Tstg)
(1)
(2)
(3)
(4)
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to ground, unless otherwise noted.
Including analog-capable DIO.
Each pin is referenced to a specific VDDSn (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see Table 6-3.
5.2
ESD Ratings
VALUE
VESD
(1)
(2)
5.3
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1)
All pins
±3000
Charged device model (CDM), per JESD22-C101 (2)
All pins
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Ambient temperature
Operating supply voltage (VDDS)
MIN
MAX
–40
85
UNIT
°C
1.8
3.8
V
VDDS < 2.7 V
1.8
3.8
V
VDDS ≥ 2.7 V
1.9
3.8
V
Rising supply voltage slew rate
0
100
mV/µs
Falling supply voltage slew rate
0
20
mV/µs
3
mV/µs
5
°C/s
For operation in battery-powered and
Operating supply voltages (VDDS2 and VDDS3) 3.3-V systems (internal DC/DC can be
used to minimize power consumption)
Operating supply voltages (VDDS2 and VDDS3)
Falling supply voltage slew rate, with low-power flash setting (1)
Positive temperature gradient in standby (2)
(1)
(2)
No limitation for negative temperature gradient, or outside
standby mode
For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor must be used
to ensure compliance with this slew rate.
Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see ).
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
15
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
5.4
www.ti.com
Power Consumption Summary
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design unless otherwise noted. Tc = 25°C, VDDS = 3.6 V
with DC/DC enabled, unless otherwise noted. Using boost mode (increasing VDDR to 1.95 V), will increase currents in this
table by 15% (does not apply to TX 14-dBm setting where this current is already included).
PARAMETER
Icore
Core current
consumption
TEST CONDITIONS
TYP
Reset. RESET_N pin asserted or VDDS below power-on-reset
threshold
100
Shutdown. No clocks running, no retention
185
Standby. With RTC, CPU, RAM, and (partial) register retention.
RCOSC_LF
0.7
Standby. With RTC, CPU, RAM, and (partial) register retention.
XOSC_LF
0.8
UNIT
nA
µA
Idle. Supply Systems and RAM powered.
570
Active. MCU running CoreMark at 48 MHz
1.2 mA + 25.5 µA/MHz
Active. MCU running CoreMark at 48 MHz
2.5
Active. MCU running CoreMark at 24 MHz
1.9
Radio RX, measured on CC1350EM-7XD-Dual Band reference
design, 868 MHz
5.4
mA
Radio RX, measured on CC1350EM-7XD-Dual Band reference
design, Bluetooth low energy, 2440 MHz
6.4
mA
Radio TX, 10-dBm output power, (G)FSK, 868 MHz
13.4
mA
Radio TX, 10-dBm output power, measured on CC1350EM-7XDDualBand reference design, 868 MHz
14.2
mA
Radio TX, OOK modulation, 10-dBm output power, AVG, 868 MHz
11.2
mA
Radio TX, boost mode (VDDR = 1.95 V), 14-dBm output power,
(G)FSK, 868 MHz
23.5
mA
Radio TX, boost mode (VDDR = 1.95 V), 14-dBm output power,
measured on CC1350EM-7XD-Dual Band reference design, 868 MHz
24.4
mA
Radio TX, OOK modulation, boost mode (VDDR = 1.95 V), 14-dBm,
AVG, 868 MHz
14.8
mA
Radio TX Bluetooth low energy, 0-dBm output power, measured on
CC1350EM-7XD-DualBand reference design, 2440 MHz
10.5
mA
Radio TX Bluetooth low energy, boost mode (VDDR = 1.95 V), 9-dBm
output power, measured on CC1350EM-7XD-Dual Band reference
design, 2440 MHz
22.3
mA
Radio TX, boost mode (VDDR = 1.95 V), 15-dBm output power,
(G)FSK, measured on CC1310EM-7XD-4251, 433.92 MHz
25.1
mA
Radio TX, 10-dBm output power, measured on CC1310EM-7XD4251, 433.92 MHz
13.2
mA
mA
PERIPHERAL CURRENT CONSUMPTION
Iperi
16
Peripheral power
domain
Delta current with domain enabled
20
Serial power
domain
Delta current with domain enabled
13
RF core
Delta current with power domain enabled,
clock enabled, RF core idle
237
µDMA
Delta current with clock enabled, module idle
130
Timers
Delta current with clock enabled, module idle
113
I2C
Delta current with clock enabled, module idle
12
I2S
Delta current with clock enabled, module idle
36
SSI
Delta current with clock enabled, module idle
93
UART
Delta current with clock enabled, module idle
164
Specifications
µA
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
5.5
SWRS183B – JUNE 2016 – REVISED JULY 2018
RF Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
287
TYP
MAX
(1)
351
359 (1)
Frequency bands
(1)
5.6
UNIT
(1)
439 (1)
431
527
718 (1)
878 (1)
861
1054
2152
2635
MHz
These frequency bands are functionally verified. Radio settings for specific physical layer parameters can be made available upon
request.
Receive (RX) Parameters, 861 MHz to 1054 MHz
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
Data rate
Data rate offset tolerance,
IEEE 802.15.4g PHY
TYP
MAX
Up to 4 Mbps
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode), BER = 10–3
Data rate step size
UNIT
bps
1600
ppm
1.5
bps
Digital channel filter programmable
bandwidth
Using VCO divide by 5 setting
Receiver sensitivity, 50 kbps
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode), BER = 10–2. 868 MHz and 915 MHz
–110
dBm
Receiver saturation
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode), BER = 10–2
10
dBm
Selectivity, ±200 kHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
44, 47
dB
Selectivity, ±400 kHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
48, 53
dB
Blocking ±1 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
59, 62
dB
Blocking ±2 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
64, 65
dB
Blocking ±5 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
67, 68
dB
Blocking ±10 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
76, 76
dB
Spurious emissions 1 GHz to 13 GHz
(VCO leakage at 3.5 GHz) and
30 MHz to 1 GHz
Conducted emissions measured according to
ETSI EN 300 220
40
4000
–70
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
kHz
dBm
17
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
Receive (RX) Parameters, 861 MHz to 1054 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
44
dB
RSSI dynamic range
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode). Starting from the sensitivity limit. This range will
give an accuracy of ±2 dB.
95
dB
RSSI accuracy
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode). Starting from the sensitivity limit across the given
dynamic range.
±2
dB
Receiver sensitivity, 500 kbps
GFSK, 175-kHz deviation, 1.243-MHz RX bandwidth,
BER = 10–2
–97
dBm
Blocking, ±2 MHz, 500 kbps
Wanted signal 3 dB above sensitivity limit. 500 kbps,
GFSK, 175-kHz deviation, 1.243-MHz RX bandwidth,
BER = 10–2
35, 36
dB
Blocking, ±10 MHz, 500 kbps
Wanted signal 3 dB above sensitivity limit. 500 kbps,
GFSK, 175-kHz deviation, 1.243-MHz RX bandwidth,
BER = 10–2
55, 47
dB
Receiver sensitivity, long-range mode,
5 kbps
20 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 2, 49-kHz RX bandwidth, BER = 10–2.
868 MHz and 915 MHz
–119
dBm
Receiver sensitivity, long-range mode,
2.5 kbps
20 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 4, 49-kHz RX bandwidth, BER = 10–2.
868 MHz and 915 MHz
–120
dBm
Receiver sensitivity, long-range mode,
1.25 kbps
20 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 8, 49-kHz RX bandwidth, BER = 10–2.
868 MHz and 915 MHz
–121
dBm
Selectivity, ±100 kHz, long-range mode,
5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
47, 47
dB
Selectivity, ±200 kHz, long-range mode,
5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
54, 55
dB
Selectivity, ±300 kHz, long-range mode,
5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
57, 56
dB
Blocking, ±1 MHz, long-range mode,
5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
68, 67
dB
Blocking, ±2 MHz, long-range mode,
5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
74, 74
dB
Blocking, ±10 MHz, long-range mode,
5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
85, 85
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), long-range
mode, 5 kbps
Wanted signal 3 dB above sensitivity limit. 20 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 2,
49-kHz RX bandwidth, BER = 10–2
52
dB
Receiver sensitivity, wM-BUS S2-mode,
32.768 kbps
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
–111
18
Specifications
dBm
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
Receive (RX) Parameters, 861 MHz to 1054 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Selectivity, ±200 kHz, wM-BUS
S2-mode, 32.768 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
42, 43
dB
Selectivity, ±400 kHz, wM-BUS
S2-mode, 32.768 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
41, 47
dB
Blocking, ±1 MHz, wM-BUS S2-mode,
32.768 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
43, 52
dB
Blocking, ±2 MHz, wM-BUS S2-mode,
32.768 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
52, 55
dB
Blocking, ±10 MHz, wM-BUS S2-mode,
32.768 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
68, 72
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), wM-BUS
S2-mode, 32.768 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.3 MHz, 32.768 ksym/s, Manchester coding,
FSK, 50-kHz deviation, 196-kHz RX bandwidth,
BER = 10–2
43
dB
Receiver sensitivity, wM-BUS C-mode,
100 kbps
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
–107
dBm
Selectivity, ±400 kHz, wM-BUS C-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
41, 46
dB
Selectivity, ±800 kHz, wM-BUS C-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
41, 50
dB
Blocking, ±1 MHz, wM-BUS C-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
43, 51
dB
Blocking, ±2 MHz, wM-BUS C-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
51, 53
dB
Blocking, ±5 MHz, wM-BUS C-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
55, 61
dB
Blocking, ±10 MHz, wM-BUS C-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, NRZ coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
67, 68
dB
Receiver sensitivity, wM-BUS T-mode,
100 kbps
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
–105
dBm
Selectivity, ±400 kHz, wM-BUS T-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
41, 46
dB
Selectivity, ±800 kHz, wM-BUS T-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
41, 50
dB
Blocking, ±1 MHz, wM-BUS T-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
42, 51
dB
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
19
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
Receive (RX) Parameters, 861 MHz to 1054 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Blocking, ±2 MHz, wM-BUS T-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
51, 52
dB
Blocking, ±5 MHz, wM-BUS T-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
54, 60
dB
Blocking, ±10 MHz, wM-BUS T-mode,
100 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 868.95 MHz, 100 ksym/s, 3 out of 6 coding, FSK,
45-kHz deviation, 196-kHz RX bandwidth, BER = 10–2
67, 68
dB
Receiver sensitivity, WideBand-DSSS
(WB-DSSS), 30 kbps
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 8, 622-kHz RX bandwidth,
BER = 10–2
–109
dBm
Blocking, ±1 MHz, WB-DSSS, 30 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 8, 622-kHz RX bandwidth,
BER = 10–2
57, 57
dB
Blocking, ±2 MHz, WB-DSSS, 30 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 8, 622-kHz RX bandwidth,
BER = 10–2
58, 58
dB
Blocking, ±5 MHz, WB-DSSS, 30 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 8, 622-kHz RX bandwidth,
BER = 10–2
59, 57
dB
Blocking, ±10 MHz, WB-DSSS, 30 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 8, 622-kHz RX bandwidth,
BER = 10–2
71, 68
dB
Receiver sensitivity, WideBand-DSSS
(WB-DSSS), 60 kbps
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 4, 622-kHz RX bandwidth,
BER = 10–2
–108
dBm
Blocking, ±1 MHz, WB-DSSS, 60 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 4, 622-kHz RX bandwidth,
BER = 10–2
56, 56
dB
Blocking, ±2 MHz, WB-DSSS, 60 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 4, 622-kHz RX bandwidth,
BER = 10–2
57, 57
dB
Blocking, ±5 MHz, WB-DSSS, 60 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 4, 622-kHz RX bandwidth,
BER = 10–2
57, 56
dB
Blocking, ±10 MHz, WB-DSSS, 60 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 4, 622-kHz RX bandwidth,
BER = 10–2
70, 67
dB
Receiver sensitivity, WideBand-DSSS
(WB-DSSS), 120 kbps
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 2, 622-kHz RX bandwidth,
BER = 10–2
–106
dBm
Blocking, ±1 MHz, WB-DSSS, 120 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 2, 622-kHz RX bandwidth,
BER = 10–2
54, 54
dB
Blocking, ±2 MHz, WB-DSSS, 120 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 2, 622-kHz RX bandwidth,
BER = 10–2
55, 55
dB
20
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
Receive (RX) Parameters, 861 MHz to 1054 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Blocking, ±5 MHz, WB-DSSS, 120 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 2, 622-kHz RX bandwidth,
BER = 10–2
55, 54
dB
Blocking, ±10 MHz, WB-DSSS, 120 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 2, 622-kHz RX bandwidth,
BER = 10–2
69, 65
dB
Receiver sensitivity, WideBand-DSSS
(WB-DSSS), 240 kbps
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 1, 622-kHz RX bandwidth,
BER = 10–2
–105
dBm
Blocking, ±1 MHz, WB-DSSS, 240 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 1, 622-kHz RX bandwidth,
BER = 10–2
53, 53
dB
Blocking, ±2 MHz, WB-DSSS, 240 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 1, 622-kHz RX bandwidth,
BER = 10–2
53, 54
dB
Blocking, ±5 MHz, WB-DSSS, 240 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 1, 622-kHz RX bandwidth,
BER = 10–2
53, 54
dB
Blocking, ±10 MHz, WB-DSSS, 240 kbps
Wanted signal 3 dB above sensitivity limit.
fRF = 915 MHz, 480 ksym/s, GFSK, 195-kHz deviation,
FEC (half rate), DSSS = 1, 622-kHz RX bandwidth,
BER = 10–2
68, 64
dB
Receiver sensitivity, 10 kbps
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
–114
dBm
Selectivity, ±100 kHz, 10 kbps
Wanted signal 3 dB above sensitivity limit. 10 kbps,
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
40, 40
dB
Selectivity, ±200 kHz, 10 kbps
Wanted signal 3 dB above sensitivity limit. 10 kbps,
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
46, 44
dB
Selectivity, ±400 kHz, 10 kbps
Wanted signal 3 dB above sensitivity limit. 10 kbps,
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
50, 45
dB
Blocking, ±2 MHz, 10 kbps
Wanted signal 3 dB above sensitivity limit. 10 kbps,
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
62, 61
dB
Blocking, ±10 MHz, 10 kbps
Wanted signal 3 dB above sensitivity limit. 10 kbps,
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
76, 72
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), 10 kbps
Wanted signal 3 dB above sensitivity limit. 10 kbps,
GFSK, 19-kHz deviation, 78-kHz RX bandwidth,
BER = 10–2
43
dB
Receiver sensitivity, 4.8 kbps
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
Selectivity, ±100 kHz, 4.8 kbps
Selectivity, ±200 kHz, 4.8 kbps
–114
dBm
Wanted signal 3 dB above sensitivity limit. 4.8 kbps,
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
44, 43
dB
Wanted signal 3 dB above sensitivity limit. 4.8 kbps,
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
49, 48
dB
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
21
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
Receive (RX) Parameters, 861 MHz to 1054 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Selectivity, ±400 kHz, 4.8 kbps
Wanted signal 3 dB above sensitivity limit. 4.8 kbps,
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
52, 49
dB
Blocking, ±2 MHz, 4.8 kbps
Wanted signal 3 dB above sensitivity limit. 4.8 kbps,
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
64, 63
dB
Blocking, ±10 MHz, 4.8 kbps
Wanted signal 3 dB above sensitivity limit. 4.8 kbps,
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
73, 72
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), 4.8 kbps
Wanted signal 3 dB above sensitivity limit. 4.8 kbps,
GFSK, 5.2-kHz deviation, 49-kHz RX bandwidth,
BER = 10–2
43
dB
Receiver sensitivity, CC1101 compatible
mode, 2.4 kbps
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
–116
dBm
Selectivity, ±100 kHz, CC1101
compatible mode, 2.4 kbps
Wanted signal 3 dB above sensitivity limit. 2.4 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
45, 44
dB
Selectivity, ±200 kHz, CC1101
compatible mode, 2.4 kbps
Wanted signal 3 dB above sensitivity limit. 2.4 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
51, 47
dB
Blocking, ±2 MHz, CC1101 compatible
mode, 2.4 kbps
Wanted signal 3 dB above sensitivity limit. 2.4 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
63, 62
dB
Blocking, ±10 MHz, CC1101 compatible
mode, 2.4 kbps
Wanted signal 3 dB above sensitivity limit. 2.4 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
76, 71
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), CC1101
compatible mode, 2.4 kbps
Wanted signal 3 dB above sensitivity limit. 2.4 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
45
dB
Receiver sensitivity, CC1101 compatible
mode, 1.2 kbps
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
–117
dBm
Selectivity, ±100 kHz, CC1101
compatible mode, 1.2 kbps
Wanted signal 3 dB above sensitivity limit. 1.2 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
45, 44
dB
Selectivity, ±200 kHz, CC1101
compatible mode, 1.2 kbps
Wanted signal 3 dB above sensitivity limit. 1.2 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
51, 47
dB
Blocking, ±2 MHz, CC1101 compatible
mode, 1.2 kbps
Wanted signal 3 dB above sensitivity limit. 1.2 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
63, 62
dB
Blocking, ±10 MHz, CC1101 compatible
mode, 1.2 kbps
Wanted signal 3 dB above sensitivity limit. 1.2 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
81, 81
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), CC1101
compatible mode, 1.2 kbps
Wanted signal 3 dB above sensitivity limit. 1.2 kbps,
GFSK, 5.2-kHz deviation (commonly used settings on
CC1101), 49-kHz RX bandwidth, BER = 10–2
45
dB
Receiver sensitivity, legacy long-range
mode, 625 bps
10 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 8, 40-kHz RX bandwidth, BER = 10–2.
868 MHz and 915 MHz.
Selectivity, ±100 kHz, legacy long-range
mode, 625 bps
Blocking ±1 MHz, legacy long-range
mode, 625 bps
22
–124
dBm
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
56, 56
dB
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
73, 77
dB
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
SWRS183B – JUNE 2016 – REVISED JULY 2018
Receive (RX) Parameters, 861 MHz to 1054 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Blocking ±2 MHz, legacy long-range
mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
79, 79
dB
Blocking ±10 MHz, legacy long-range
mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
91, 91
dB
Receiver sensitivity, OOK, 4.8 kbps
4.8 kbps, OOK, 40-kHz RX bandwidth, BER = 10–2.
868 MHz and 915 MHz
–115
dBm
5.7
Receive (RX) Parameters, 431 MHz to 527 MHz
Measured on the Texas Instruments CC1310EM-7XD-4251 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 433.92 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver sensitivity, 50 kbps
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode), BER = 10–2
–110
dBm
Receiver saturation
50 kbps, GFSK, 25-kHz deviation, 100-kHz RX bandwidth
(same modulation format as IEEE 802.15.4g mandatory
mode), BER = 10–2
10
dBm
Selectivity, ±200 kHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
40, 42
dB
Selectivity, ±400 kHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
42, 50
dB
Blocking ±1 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
53, 58
dB
Blocking ±2 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
59, 60
dB
Blocking ±10 MHz, 50 kbps
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
74, 74
dB
Spurious emissions 1 GHz to 13 GHz
(VCO leakage at 3.5 GHz) and
30 MHz to 1 GHz
Conducted emissions measured according to
ETSI EN 300 220
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), 50 kbps
–74
dBm
Wanted signal 3 dB above sensitivity limit. 50 kbps,
GFSK, 25-kHz deviation, 100-kHz RX bandwidth (same
modulation format as IEEE 802.15.4g mandatory mode),
BER = 10–2
43
dB
Receiver sensitivity, long-range mode,
5 kbps
20 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 2, 49-kHz RX bandwidth, BER = 10–2. 433 MHz
–119
dBm
Receiver sensitivity, long-range mode,
2.5 kbps
20 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 4, 49-kHz RX bandwidth, BER = 10–2. 433 MHz
–120
dBm
Receiver sensitivity, long-range mode,
1.25 kbps
20 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 8, 49-kHz RX bandwidth, BER = 10–2. 433 MHz
–121
dBm
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
23
CC1350
SWRS183B – JUNE 2016 – REVISED JULY 2018
www.ti.com
Receive (RX) Parameters, 431 MHz to 527 MHz (continued)
Measured on the Texas Instruments CC1310EM-7XD-4251 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 433.92 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
Receiver sensitivity, legacy long-range
mode, 625 bps
10 ksym/s, GFSK, 5-kHz deviation, FEC (half rate),
DSSS = 8, 40-kHz RX bandwidth, BER = 10–2.
868 MHz and 915 MHZ.
Selectivity, ±100 kHz, legacy long-range
mode, 625 bps
TYP
MAX
UNIT
–124
dBm
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
56, 56
dB
Selectivity, ±200 kHz, legacy long-range
mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
62, 65
dB
Blocking ±1 MHz, legacy long-range
mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
68, 73
dB
Blocking ±2 MHz, legacy long-range
mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
74, 74
dB
Blocking ±10 MHz, legacy long-range
mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
88, 89
dB
Image rejection (image compensation
enabled, the image compensation is
calibrated in production), legacy longrange mode, 625 bps
Wanted signal 3 dB above sensitivity limit. 10 ksym/s,
GFSK, 5-kHz deviation, FEC (half rate), DSSS = 8,
40-kHz RX bandwidth, BER = 10–2
55
dB
24
Specifications
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1350
CC1350
www.ti.com
5.8
SWRS183B – JUNE 2016 – REVISED JULY 2018
Transmit (TX) Parameters, 861 MHz to 1054 MHz
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC/DC enabled,
fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Maximum output power, boost mode
VDDR = 1.95 V
Minimum VDDS for boost mode is 2.1 V
868 MHz and 915 MHz
14
dBm
Maximum output power
868 MHz and 915 MHz
12
dBm
24
dB
Output power programmable range
Output power variation
Tested at +10-dBm setting
±0.9
dB
Output power variation, boost mode
+14 dBm
±0.5
dB
Spurious emissions
(excluding harmonics) (1)
Harmonics
Spurious emissions
out-of-band,
915 MHz (1)
Spurious emissions
out-of-band,
920.6 MHz (1)
(1)
Transmitting +14 dBm
ETSI restricted bands
工商网监
湘ICP备2023018690号
