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CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
CC2538 Powerful Wireless Microcontroller System-On-Chip for 2.4-GHz IEEE 802.15.4,
6LoWPAN, and ZigBee® Applications
1 Device Overview
1.1
Features
1
• Microcontroller
– Powerful ARM® Cortex®-M3 With Code Prefetch
– Up to 32-MHz Clock Speed
– 512KB, 256KB or 128KB of In-SystemProgrammable Flash
– Supports On-Chip Over-the-Air Upgrade (OTA)
– Supports Dual ZigBee Application Profiles
– Up to 32KB of RAM (16KB With Retention in All
Power Modes)
– cJTAG and JTAG Debugging
• RF
– 2.4-GHz IEEE 802.15.4 Compliant RF
Transceiver
– Excellent Receiver Sensitivity of –97 dBm
– Robustness to Interference With ACR of 44 dB
– Programmable Output Power up to 7 dBm
• Security Hardware Acceleration
– Future Proof AES-128/256, SHA2 Hardware
Encryption Engine
– Optional – ECC-128/256, RSA Hardware
Acceleration Engine for Secure Key Exchange
– Radio Command Strobe Processor and Packet
Handling Processor for Low-Level MAC
Functionality
• Low Power
– Active-Mode RX (CPU Idle): 20 mA
– Active-Mode TX at 0 dBm (CPU Idle): 24 mA
– Power Mode 1 (4-µs Wake-Up, 32-KB RAM
Retention, Full Register Retention): 0.6 mA
– Power Mode 2 (Sleep Timer Running, 16-KB
RAM Retention, Configuration Register
Retention): 1.3 µA
– Power Mode 3 (External Interrupts, 16-KB RAM
Retention, Configuration Register Retention):
0.4 µA
– Wide Supply-Voltage Range (2 V to 3.6 V)
1.2
•
•
•
• Peripherals
– µDMA
– 4 × General-Purpose Timers
(Each 32-Bit or 2 × 16-Bit)
– 32-Bit 32-kHz Sleep Timer
– 12-Bit ADC With 8 Channels and Configurable
Resolution
– Battery Monitor and Temperature Sensor
– USB 2.0 Full-Speed Device (12 Mbps)
– 2 × SPI
– 2 × UART
– I2C
– 32 General-Purpose I/O Pins
(28 × 4 mA, 4 × 20 mA)
– Watchdog Timer
• Layout
– 8-mm × 8-mm QFN56 Package
– Robust Device for Industrial Operation up to
125°C
– Few External Components
– Only a Single Crystal Needed for Asynchronous
Networks
• Development Tools
– CC2538 Development Kit
– Reference Design Certified Under FCC and
ETSI Regulations
– Full Software Support for Contiki/6LoWPAN,
Smart Grid, Lighting, and ZigBee Home
Automation With Sample Applications and
Reference Designs Available
– Code Composer Studio™
– IAR Embedded Workbench® for ARM
– SmartRF™ Studio
– SmartRF Flash Programmer
Applications
Smart Grid and Home Area Network
Home and Building Automation
Intelligent Lighting Systems
•
•
Wireless Sensor Networks
Internet of Things
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
1.3
www.ti.com
Description
The CC2538xFnn is the ideal wireless microcontroller System-on-Chip (SoC) for high-performance ZigBee
applications. The device combines a powerful ARM Cortex-M3-based MCU system with up to 32KB onchip RAM and up to 512KB on-chip flash with a robust IEEE 802.15.4 radio. This enables the device to
handle complex network stacks with security, demanding applications, and over-the-air download. Thirtytwo GPIOs and serial peripherals enable simple connections to the rest of the board. The powerful
hardware security accelerators enable quick and efficient authentication and encryption while leaving the
CPU free to handle application tasks. The multiple low-power modes with retention enable quick startup
from sleep and minimum energy spent to perform periodic tasks. For a smooth development, the
CC2538xFnn includes a powerful debugging system and a comprehensive driver library. To reduce the
application flash footprint, CC2538xFnn ROM includes a utility function library and a serial boot loader.
Combined with the robust and comprehensive Z-Stack software solutions from TI, the CC2538 provides
the most capable and proven ZigBee solution in the market.
Device Information (1)
PART NUMBER
CC2538RTQ
(1)
2
PACKAGE
BODY SIZE
RTQ (56)
8.00 mm × 8.00 mm
For more information, see Section 8, Mechanical Packaging and Orderable Information.
Device Overview
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1.4
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
Functional Block Diagram
JTAG
ARM
CortexTM± M3
SWO
128KB/256KB/512KB Flash
NVIC
32 MHz
MPU
16KB Standard SRAM
cJTAG/JTAG
4KB ROM
ICEPick
2 UARTS
Systick Timer
2 SSI/SPI
Timer/PWM/CCP
4x (32 bit or 2x16 bit)
USB Full-Speed
Device
Watchdog Timer
I2C
32 GPIO
SYSTEM
SERIAL INTERFACES
DEBUG
INTERFACE
16KB Retention SRAM
SECURITY
32-ch DMA
AES-128/256
SHA-256
32-MHz XTAL
and 16-MHz RC Oscillator
ECC
RSA-2048
32-kHz XTAL
and 32-kHz RC Oscillator
32-bit Sleep Timer
Command-Strobe
Processor
LDO Regulator
Power-on Reset and BrownOut Detection
MAC Timer
Low-Power
Comparator
RF Chain
Demod
Modulator
ANALOG
IEEE 802.15.4 RADIO
Packet-Handling
Processor
8-ch 12-bit ADC
RX
Synth
TX
With Temp Sensor
Figure 1-1. CC2538 Block Diagram
Device Overview
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CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
www.ti.com
Table of Contents
1
2
3
4
Device Overview ......................................... 1
5.15
Analog Temperature Sensor ........................ 15
1.1
Features .............................................. 1
5.16
ADC Characteristics................................. 16
1.2
Applications ........................................... 1
5.17
Control Input AC Characteristics .................... 17
1.3
Description ............................................ 2
5.18
DC Characteristics .................................. 17
1.4
Functional Block Diagram ............................ 3
5.19
5.20
USB Interface DC Characteristics .................. 17
Thermal Resistance Characteristics for RTQ
Package ............................................. 18
Revision History ......................................... 5
Device Comparison ..................................... 6
Terminal Configuration and Functions .............. 7
6.1
Input, Output Matching .............................. 20
Specifications
6.2
Crystal ............................................... 20
5.1
............................................ 9
Absolute Maximum Ratings .......................... 9
ESD Ratings .......................................... 9
Recommended Operating Conditions ................ 9
Electrical Characteristics ............................ 10
General Characteristics ............................. 11
RF Receive Section ................................. 12
RF Transmit Section ................................ 13
32-MHz Crystal Oscillator ........................... 14
32.768-kHz Crystal Oscillator ....................... 14
32-kHz RC Oscillator ................................ 14
16-MHz RC Oscillator ............................... 15
RSSI/CCA Characteristics .......................... 15
FREQEST Characteristics .......................... 15
Frequency Synthesizer Characteristics ............. 15
6.3
On-Chip 1.8-V Voltage-Regulator Decoupling ...... 21
6.4
Power-Supply Decoupling and Filtering............. 21
6.5
References .......................................... 21
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
4
Applications, Implementation, and Layout........ 19
Signal Descriptions ................................... 7
4.1
5
6
7
8
Device and Documentation Support ............... 22
7.1
Device Support ...................................... 22
7.2
Documentation Support ............................. 23
7.3
Additional Information ............................... 23
7.4
Trademarks.......................................... 24
7.5
Electrostatic Discharge Caution ..................... 24
7.6
Export Control Notice
7.7
Glossary ............................................. 24
...............................
24
Mechanical Packaging and Orderable
Information .............................................. 25
8.1
Packaging Information
Table of Contents
..............................
25
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SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
2 Revision History
Changes from Revision C (February 2015) to Revision D
•
Changed Figure 6-1 CC2538xFnn Application Circuit
Page
.........................................................................
Changes from Revision B (September 2014) to Revision C
•
•
•
19
Page
Changed ZigBee Smart Energy 1.x and ZigBee Light Link to Smart Grid and Lighting..................................... 1
Added 8-ch to the 12-bit ADC ....................................................................................................... 3
Added ESD Ratings table. .......................................................................................................... 9
Revision History
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CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
www.ti.com
3 Device Comparison
Table 3-1. CC2538 Family of Devices Available
6
DEVICE
FLASH (KB)
RAM (KB)
SECURITY HW AES/SHA SECURITY HW ECC/RSA
CC2538SF53
512
32
Yes
Yes
CC2538SF23
256
32
Yes
Yes
CC2538NF53
512
32
Yes
No
CC2538NF23
256
32
Yes
No
CC2538NF11
128
16
Yes
No
Device Comparison
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SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
43 AVDD_GUARD
44 PD6/XOSC32K_Q1
45 PD7/XOSC32K_Q2
46 JTAG_TMS
47 JTAG_TCK
48 PB7
49 PB6
50 PB5
51 PB4
52 PB3
53 PB2
54 PB1
55 DVDD
56 DCOUPL1
4 Terminal Configuration and Functions
DGND_USB
1
42 R_BIAS
USB_P
2
41 AVDD
USB_N
3
40 AVDD
DVDD_USB
4
39 AVDD
PB0
5
38 RF_N
PC7
6
37 RF_P
PC6
7
36 AVDD
PC5
8
35 XOSC32M_Q2
PC4
9
34 XOSC32M_Q1
DVDD 10
33 AVDD
RESET_N 28
PD2 27
PD1 26
PD0 25
DVDD 24
PA7 23
PA6 22
29 PD3
PA5 21
PC0 14
PA4 20
30 PD4
PA3 19
PC1 13
PA2 18
31 PD5
PA1 17
PC2 12
PA0 16
32 DCOUPL2
DVDD 15
PC3 11
P0142-01
Connect the exposed ground pad to a solid ground plane, as this is the ground connection for the chip.
Figure 4-1. 56-Pin RTQ Package (Top View)
4.1
Signal Descriptions
Table 4-1. Signal Descriptions
NAME
AVDD
NUMBER
PIN TYPE
33, 36, 39, 40, 41 Power (analog)
DESCRIPTION
2-V–3.6-V analog power-supply connection
AVDD_GUARD
43
Power (analog)
2-V–3.6-V analog power-supply connection
DCOUPL1
56
Power (digital)
1.8-V regulated digital-supply decoupling capacitor
DCOUPL2
32
Power (digital)
1.8-V regulated digital-supply decoupling capacitor. Short this pin to
pin 56.
DGND_USB
1
Ground (USB pads)
USB ground
DVDD
Power (digital)
2-V–3.6-V digital power-supply connection
DVDD_USB
10, 15, 24, 55
4
Power (USB pads)
3.3-V USB power-supply connection
JTAG_TCK
47
Digital I/O
JTAG TCK
JTAG_TMS
46
Digital I/O
JTAG TMS
PA0
16
Digital/analog I/O
GPIO port A pin 0. ROM bootloader UART RXD
PA1
17
Digital/analog I/O
GPIO port A pin 1. ROM bootloader UART TXD
PA2
18
Digital/analog I/O
GPIO port A pin 2. ROM bootloader SSI CLK
Terminal Configuration and Functions
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CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
www.ti.com
Table 4-1. Signal Descriptions (continued)
NAME
NUMBER
PIN TYPE
DESCRIPTION
PA3
19
Digital/analog I/O
GPIO port A pin 3. ROM bootloader SSI SEL
PA4
20
Digital/analog I/O
GPIO port A pin 4. ROM bootloader SSI RXD
PA5
21
Digital/analog I/O
GPIO port A pin 5. ROM bootloader SSI TXD
PA6
22
Digital/analog I/O
GPIO port A pin 6
PA7
23
Digital/analog I/O
GPIO port A pin 7
PB0
5
Digital I/O
GPIO port B pin 0
PB1
54
Digital I/O
GPIO port B pin 1
PB2
53
Digital I/O
GPIO port B pin 2
PB3
52
Digital I/O
GPIO port B pin 3
PB4
51
Digital I/O
GPIO port B pin 4
PB5
50
Digital I/O
GPIO port B pin 5
PB6
49
Digital I/O
GPIO port B pin 6, TDI (JTAG)
PB7
48
Digital I/O
GPIO port B pin 7, TDO (JTAG)
PC0
14
Digital I/O
GPIO port C pin 0, 20 mA output capability, no pull-up or pull-down
PC1
13
Digital I/O
GPIO port C pin 1, 20 mA output capability, no pull-up or pull-down
PC2
12
Digital I/O
GPIO port C pin 2, 20 mA output capability, no pull-up or pull-down
PC3
11
Digital I/O
GPIO port C pin 3, 20 mA output capability, no pull-up or pull-down
PC4
9
Digital I/O
GPIO port C pin 4
PC5
8
Digital I/O
GPIO port C pin 5
PC6
7
Digital I/O
GPIO port C pin 6
PC7
6
Digital I/O
GPIO port C pin 7
PD0
25
Digital I/O
GPIO port D pin 0
PD1
26
Digital I/O
GPIO port D pin 1
PD2
27
Digital I/O
GPIO port D pin 2
PD3
29
Digital I/O
GPIO port D pin 3
PD4
30
Digital I/O
GPIO port D pin 4
PD5
31
Digital I/O
GPIO port D pin 5
PD6/XOSC32K_Q1
44
Digital/analog I/O
GPIO port D pin 6 / 32-kHz crystal oscillator pin 1
PD7/XOSC32K_Q2
45
Digital/analog I/O
GPIO port D pin 7 / 32-kHz crystal oscillator pin 1
R_BIAS
42
Analog I/O
External precision bias resistor for reference current
RESET_N
28
Digital input
Reset, active-low
RF_N
38
RF I/O
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_P
37
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
USB_P
2
USB I/O
USB differential data plus (D+)
USB_N
3
USB I/O
USB differential data minus (D–)
XOSC32M_Q1
34
Analog I/O
32-MHz crystal oscillator pin 1 or external-clock input
XOSC32M_Q2
35
Analog I/O
32-MHz crystal oscillator pin 2
8
Terminal Configuration and Functions
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SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
5 Specifications
Absolute Maximum Ratings (1) (2) (3)
5.1
over operating free-air temperature range (unless otherwise noted)
Supply voltage
All supply pins must have the same voltage
Voltage on any digital pin
MIN
MAX
–0.3
3.9
–0.3
VDD + 0.3, ≤ 3.9
Input RF level
Tstg
(1)
(2)
(3)
Storage temperature range
V
10
dBm
125
°C
ESD Ratings
VESD
5.3
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.2
(1)
(2)
–40
UNIT
Electrostatic discharge (ESD)
performance:
VALUE
UNIT
±1
kV
±500
V
Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1)
Charged device model (CDM),
per JESD22-C101 (2)
All pins
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Operating ambient temperature range, TA
Operating supply voltage
(1)
(1)
MIN
MAX
UNIT
–40
125
°C
2
3.6
V
The CC2538 contains a power on reset (POR) module and a brown out detector (BOD) that prevent the device from operating under
unsafe supply voltage conditions. In the two lowest power modes, PM2 and PM3, the POR is active but the BOD is powered down,
which gives a limited voltage supervision.
If the supply voltage is lowered to below 1.4 V during PM2/PM3, at temperatures of 70°C or higher, and then brought back up to good
operating voltage before active mode is re-entered, registers and RAM contents that are saved in PM2, PM3 may become altered.
Hence, care should be taken in the design of the system power supply to ensure that this does not occur. The voltage can be
periodically supervised accurately by entering active mode, as a BOD reset is triggered if the supply voltage is below approximately
1.7 V.
Specifications
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CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
5.4
www.ti.com
Electrical Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V, and 8-MHz system clock, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
Icore
Core current consumption
TEST CONDITIONS
MIN
TYP MAX UNIT
Digital regulator on. 16-MHz RCOSC running. No radio,
crystals, or peripherals active.
CPU running at 16-MHz with flash access
7
mA
32-MHz XOSC running. No radio or peripherals active.
CPU running at 32-MHz with flash access,.
13
mA
32-MHz XOSC running, radio in RX mode, –50-dBm input
power, no peripherals active, CPU idle
20
mA
32-MHz XOSC running, radio in RX mode at –100-dBm input
power (waiting for signal), no peripherals active, CPU idle
24
32-MHz XOSC running, radio in TX mode, 0-dBm output
power, no peripherals active, CPU idle
24
mA
32-MHz XOSC running, radio in TX mode, 7-dBm output
power, no peripherals active, CPU idle
34
mA
Power mode 1. Digital regulator on; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD
and sleep timer active; RAM and register retention
0.6
mA
Power mode 2. Digital regulator off; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and
sleep timer active; RAM and register retention
1.3
2
µA
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
0.4
1
µA
27
mA
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)
General-purpose timer
Iperi
120
µA
SPI
300
µA
I2C
0.1
mA
UART
0.7
mA
Sleep timer
Including 32.753-kHz RCOSC
0.9
µA
USB
48-MHz clock running, USB enabled
3.8
mA
ADC
When converting
1.2
mA
Erase
12
mA
8
mA
Flash
10
Timer running, 32-MHz XOSC used
Burst-write peak current
Specifications
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5.5
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
General Characteristics
Measured on TI's CC2538 EM reference design with TA = 25 °C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Wake-Up and Timing
Power mode 1 → active
Digital regulator on, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of 16-MHz RCOSC
4
µs
Power mode 2 or 3 → active
Digital regulator off, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of regulator and 16-MHz RCOSC
136
µs
Initially running on 16-MHz RCOSC, with 32-MHz XOSC off
0.5
Active → TX or RX
With 32-MHz XOSC initially on
RX/TX and TX/RX turnaround
USB PLL start-up time
With 32-MHz XOSC initially on
ms
192
µs
192
µs
32
µs
Radio Part
RF frequency range
Programmable in 1-MHz steps, 5 MHz between channels
for compliance with (1)
Radio baud rate
As defined by
(1)
Radio chip rate
As defined by
(1)
2394
2507
250
2
MHz
kbps
MChip/s
Flash Memory
Flash erase cycles
20
Flash page size
(1)
k Cycles
2
KB
IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless
Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
Specifications
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CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
5.6
www.ti.com
RF Receive Section
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted.
Bold limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz.
PARAMETER
TEST CONDITIONS
PER = 1%, as specified by
(25 °C, 3 V, 2440 MHz)
(1)
requires –85 dBm
(1)
PER = 1%, as specified by
(1)
requires –85 dBm
(1)
PER = 1%, as specified by
(1)
requires –20 dBm
(1)
Saturation (maximum input level)
Adjacent-channel rejection,
5-MHz channel spacing
Receiver sensitivity
MIN
TYP MAX
UNIT
–97
–92
dBm
–88
dBm
, normal operating conditions
, entire operating conditions
10
dBm
Wanted signal –82 dBm, adjacent modulated channel at
5 MHz, PER = 1%, as specified by (1).
(1)
requires 0 dB
44
dB
Adjacent-channel rejection,
–5-MHz channel spacing
Wanted signal –82 dBm, adjacent modulated channel at
–5 MHz, PER = 1%, as specified by (1).
(1)
requires 0 dB
44
dB
Alternate-channel rejection,
10-MHz channel spacing
Wanted signal –82 dBm, adjacent modulated channel at
10 MHz, PER = 1%, as specified by (1)
(1)
requires 30 dB
52
dB
Alternate-channel rejection,
–10-MHz channel spacing
Wanted signal –82 dBm, adjacent modulated channel at
–10 MHz, PER = 1%, as specified by (1)
(1)
requires 30 dB
52
dB
51
51
dB
Channel rejection
Wanted signal at –82 dBm. Undesired signal is an IEEE
≥ 20 MHzXXXXX 802.15.4 modulated channel, stepped through all channels
≤ –20 MHzXXXXX from 2405 to 2480 MHz. Signal level for PER = 1%.
Blocking/desensitization
5 MHz from band edgeXXXXX Wanted signal 3 dB above the sensitivity level, CW jammer,
10 MHz from band edgeXXXXX PER = 1%. Measured according to EN 300 440 class 2.
20 MHz from band edgeXXXXX
50 MHz from band edgeXXXXX
–5 MHz from band edgeXXXXX
–10 MHz from band edgeXXXXX
–20 MHz from band edgeXXXXX
–50 MHz from band edgeXXXXX
–35
–34
–37
–32
–37
–38
–35
–34
Spurious emission. Only largest spurious
Conducted measurement with a 50-Ω single-ended load.
emission stated within each band.
Suitable for systems targeting compliance with EN 300 328,
30 MHz–1000 MHzXXXXX EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66.
1 GHz–12.75 GHzXXXXX
–80
–80
Frequency error tolerance (2)
Symbol rate error tolerance
(1)
(2)
(3)
12
(3)
dBm
dBm
(1)
requires minimum 80 ppm
±150
ppm
(1)
requires minimum 80 ppm
±1000
ppm
IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless
Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
Difference between center frequency of the received RF signal and local oscillator frequency
Difference between incoming symbol rate and the internally generated symbol rate
Specifications
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5.7
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
RF Transmit Section
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507
MHz.
PARAMETER
Nominal output power
TEST CONDITIONS
MIN
Delivered to a single-ended 50-Ω load through a balun using
maximum-recommended output-power setting
(1)
requires minimum –3 dBm
Programmable output-power
range
Spurious emissions
TYP
MAX
UNIT
7
dBm
30
dB
–56
–58
–58
–60
–54
–51
–42
dBm
Maximum recommended output power setting (2)
Measured according to stated regulations.
25–1000 MHz (outside restricted bands)
25–1000 MHz (within FCC restricted bands)
25–1000 MHz (within ETSI restricted bands)
Only largest spurious emission
1800–1900 MHz (ETSI restricted band)
stated within each band.
5150–5300 MHz (ETSI restricted band)
1–12.75 GHz (except restricted bands)
At 2483.5 MHz and above (FCC restricted band),
fc= 2480 MHz (3)
(1)
Error vector magnitude (EVM)
Measured as defined by
using maximum-recommended outputpower setting
(1)
requires maximum 35%.
Optimum load impedance
Differential impedance on the RF pins
(1)
(2)
(3)
3%
66 + j64
Ω
IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless
Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
TI's CC2538 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15, and
ARIB STD-T-66.
To improve margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz, use a lower output-power
setting or less than 100% duty cycle.
Specifications
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32-MHz Crystal Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
Crystal frequency
32
Crystal frequency accuracy
requirement (1)
ESR
Equivalent series resistance
C0
CL
–40
40
ppm
60
Ω
pF
16
Crystal shunt capacitance
1
1.9
7
Crystal load capacitance
10
13
16
0.3
Power-down guard time
The crystal oscillator must be in power down for a
guard time before using it again. This requirement
is valid for all modes of operation. The need for
power-down guard time can vary with crystal type
and load.
UNIT
MHz
6
Start-up time
(1)
MAX
pF
ms
3
ms
Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and
Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
5.9
32.768-kHz Crystal Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
TYP
MAX
32.768
Crystal frequency accuracy
requirement (1)
–40
UNIT
kHz
40
ppm
ESR
Equivalent series resistance
40
130
Ω
C0
Crystal shunt capacitance
0.9
2
pF
CL
Crystal load capacitance
12
16
pF
Start-up time
0.4
(1)
s
Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and
Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
5.10 32-kHz RC Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Calibrated frequency
TEST CONDITIONS
(1)
0.4
(3)
Calibration time (4)
14
MAX
UNIT
kHz
±0.2%
Temperature coefficient (2)
(1)
(2)
(3)
(4)
TYP
32.753
Frequency accuracy after calibration
Supply-voltage coefficient
MIN
%/ °C
3
%/V
2
ms
The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.
Frequency drift when temperature changes after calibration
Frequency drift when supply voltage changes after calibration
When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC32K_CALDIS is 0.
Specifications
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5.11 16-MHz RC Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Frequency
TEST CONDITIONS
MIN
TYP
(1)
MAX
16
Uncalibrated frequency accuracy
±18%
Calibrated frequency accuracy
±0.6%
MHz
±1%
Start-up time
10
Initial calibration time
(1)
(2)
UNIT
(2)
µs
50
µs
The calibrated 16-MHz RC oscillator frequency is the 32-MHz xtal frequency divided by 2.
When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC_PD is set to 0.
5.12 RSSI/CCA Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
RSSI range
TYP
MAX
UNIT
100
dB
Absolute uncalibrated RSSI/CCA
accuracy
±4
dB
RSSI/CCA offset (1)
73
dB
1
dB
Step size (LSB value)
(1)
Real RSSI = Register value – offset
5.13 FREQEST Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
FREQEST range
TYP
MAX
UNIT
±250
kHz
FREQEST accuracy
±10
kHz
FREQEST offset (1)
15
kHz
Step size (LSB value)
7.8
kHz
(1)
Real FREQEST = Register value – offset
5.14
Frequency Synthesizer Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
PARAMETER
Phase noise, unmodulated carrier
5.15
TEST CONDITIONS
MIN
TYP
At ±1-MHz offset from carrier
–111
At ±2-MHz offset from carrier
–119
At ±5-MHz offset from carrier
–126
MAX
UNIT
dBc/Hz
Analog Temperature Sensor
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
Output at 25°C
Initial accuracy without calibration
Accuracy using 1-point calibration (entire
temperature range)
TYP
1422
Temperature coefficient
Voltage coefficient
MIN
4.2
Measured using integrated ADC, using
internal band-gap voltage reference and
maximum resolution
Current consumption when enabled (ADC
current not included)
1
MAX
UNIT
12-bit ADC
/1°C
/0.1 V
±10
°C
±5
°C
0.3
mA
Specifications
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5.16
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ADC Characteristics
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
ENOB (1)
0
VDD
V
VDD is voltage on AVDD5 pin
0
VDD
V
External reference voltage differential
VDD is voltage on AVDD5 pin
0
VDD
Input resistance, signal
Using 4-MHz clock speed
197
kΩ
Full-scale signal (1)
Peak-to-peak, defines 0 dBFS
2.97
V
Effective number of bits
Single-ended input, 7-bit setting
5.7
Single-ended input, 9-bit setting
7.5
Single-ended input, 10-bit setting
9.3
Single-ended input, 12-bit setting
10.8
Differential input, 7-bit setting
8.3
Differential input, 10-bit setting
10.0
Differential input, 12-bit setting
11.5
7-bit setting, both single and differential
0–20
Single-ended input, 12-bit setting, –6 dBFS
–75.2
Differential input, 12-bit setting, –6 dBFS
–86.6
V
Bits
kHz
dB
Single-ended input, 12-bit setting
70.2
Differential input, 12-bit setting
79.3
Single-ended input, 12-bit setting, –6 dBFS
78.8
Differential input, 12-bit setting, –6 dBFS
88.9
Common-mode rejection ratio
Differential input, 12-bit setting, 1-kHz sine (0
dBFS), limited by ADC resolution
>84
dB
Crosstalk
Single-ended input, 12-bit setting, 1-kHz sine (0
dBFS), limited by ADC resolution
< –84
dB
Offset
Midscale
–3
mV
DNL (1)
Differential nonlinearity
INL (1)
Integral nonlinearity
(1)
Signal-to-noise-and-distortion
Conversion time
dB
0.68%
12-bit setting, mean
12-bit setting, maximum
12-bit setting, mean
0.05
0.9
4.6
12-bit setting, maximum
13.3
Single-ended input, 7-bit setting
35.4
Single-ended input, 9-bit setting
46.8
Single-ended input, 10-bit setting
57.5
Single-ended input, 12-bit setting
66.6
Differential input, 7-bit setting
40.7
Differential input, 9-bit setting
51.6
Differential input, 10-bit setting
61.8
Differential input, 12-bit setting
70.8
7-bit setting
20
9-bit setting
36
10-bit setting
68
12-bit setting
132
Current consumption
Internal reference voltage
Internal reference VDD coefficient
16
6.5
Differential input, 9-bit setting
Gain error
(1)
UNIT
VDD is voltage on AVDD5 pin
Signal to nonharmonic ratio (1)
SINAD
(–THD+N)
TYP MAX
External reference voltage
Total harmonic distortion
CMRR
MIN
Input voltage
Useful power bandwidth
THD (1)
TEST CONDITIONS
LSB
LSB
dB
µs
1.2
mA
1.19
V
2
mV/V
Measured with 300-Hz sine-wave input and VDD as reference
Specifications
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ADC Characteristics (continued)
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Internal reference temperature
coefficient
5.17
TYP MAX
0.4
UNIT
mV/10 °C
Control Input AC Characteristics
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
System clock, fSYSCLK
tSYSCLK = 1/fSYSCLK
The undivided system clock is 32 MHz when crystal oscillator is used.
The undivided system clock is 16 MHz when calibrated 16-MHz RC
oscillator is used.
RESET_N low duration (1)
See item 1, Figure 5-1. This is the shortest pulse that is recognized
as a complete reset pin request.
Interrupt pulse duration
See item 2, Figure 5-1.This is the shortest pulse that is recognized as
an interrupt request.
(1)
TYP
MAX
UNIT
32
MHz
16
1
µs
20
ns
Shorter pulses may be recognized, but might not lead to a complete reset of all modules within the chip.
RESET_N
1
2
Px.n
T0299-01
Figure 5-1. Control Input AC Characteristics
5.18 DC Characteristics
TA = 25°C, VDD = 3 V, drive strength set to high with CC_TESTCTRL.SC = 1, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
Logic-0 input voltage
Logic-1 input voltage
MAX
UNIT
0.5
V
2.5
V
Logic-0 input current
Input equals 0 V
–300
300
nA
Logic-1 input current
Input equals VDD
–300
300
nA
I/O-pin pullup and pulldown resistors
20
Logic-0 output voltage, 4-mA pins
Output load 4 mA
Logic-1 output voltage, 4-mA pins
Output load 4 mA
Logic-0 output voltage, 20-mA pins
Output load 20 mA
Logic-1 output voltage, 20-mA pins
Output load 20 mA
5.19
kΩ
0.5
V
2.4
V
0.5
V
2.4
V
USB Interface DC Characteristics
TA = 25°C, VDD = 3 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
USB pad voltage output, high
VDD 3.6 V, 4-mA load
3.4
V
USB pad voltage output, low
VDD 3.6 V, 4-mA load
0.2
V
Specifications
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5.20 Thermal Resistance Characteristics for RTQ Package
NAME
DESCRIPTION
RθJC-top
Junction-to-case (top)
RθJB
RθJA
°C/W (1)
(2)
AIR FLOW (m/s) (3)
8.9
0.00
Junction-to-board
3.1
0.00
Junction-to-free air
25.0
0.00
PsiJT
Junction-to-package top
3.1
0.00
PsiJB-bottom
Junction-to-board (bottom)
0.4
0.00
(1)
(2)
(3)
18
°C/W = degrees Celsius per watt.
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
m/s = meters per second.
Specifications
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6 Applications, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Few external components are required for the operation of the CC2538xFnn. Figure 6-1 is a typical
application circuit. For a complete USB reference design, see the CC2538xFnn product page on
www.ti.com. Table 6-1 lists typical values and descriptions of external components. The USB_P and
USB_N pins require series resistors R21 and R31 for impedance matching, and the D+ line must have a
pullup resistor, R32. The series resistors should match the 90-Ω ±15% characteristic impedance of the
USB bus. Notice that the pullup resistor and DVDD_USB require connection to a voltage source between
3 V and 3.6 V (typically 3.3 V). To accomplish this, it is recommend to connect the D+ pull-up to a port/pin
that does not have an internal pullup (that is, PC0..3), instead of connecting it directly to a 3.3 V supply
(that is, software control of D+ pullup recommended).
Optional 32 kHz crystal
2.0 V-3.6 V power supply
3.3 V power supply
C451
XTAL
C561
AVDD_GUARD 43
PD7/XOSC32K_Q2 45
PD6/XOSC32K_Q1 44
JTAG_TCK 47
1 DGND_USB
R31
JTAG_TMS 46
PB6 49
PB7 48
PB4 51
PB5 50
PB3 52
PB1 54
PB2 53
DVDD 55
DCOUPL 56
C441
R_BIAS 42
D+
2 USB_P
D-
3 USB_N
AVDD 40
4 DVDD_USB
AVDD 39
R21
R32
C31
C21
Antenna
(50 Ω)
R421
AVDD 41
5 PB0
C381
C382
L373
RF_N 38
6 PC7
RF_P 37
7 PC6
AVDD 36
L374
3.3 nH
L381
C372
C371
2 nH
CC2538
8 PC5
XOSC32M_Q2 35
DIE ATTACH PAD:
C373
1.2 pF
L372
XOSC32M_Q1 34
9 PC4
10 VDD
AVDD 33
11 PC3
DCOUPL2 32
12 PC2
PD5 31
13 PC1
PD4 30
14 PC0
PD3 29
C321
PD2 27
RESET_N 28
PD0 25
PD1 26
VDD 24
PA6 22
PA7 23
PA4 20
PA5 21
PA2 18
PA3 19
PA0 16
PA1 17
VDD 15
XTAL
C341
C351
C281
Power supply decoupling capacitors are not shown
Digital I/O not connected
R281
RESET_N
Figure 6-1. CC2538xFnn Application Circuit
Applications, Implementation, and Layout
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Table 6-1. Overview of External Components (Excluding Supply Decoupling
Capacitors)
Component
6.1
Description
Value
C21
USB D– decoupling
47 pF
C31
USB D+ decoupling
47 pF
C341
32-MHz xtal-loading capacitor
12 pF
C351
32-MHz xtal-loading capacitor
12 pF
C371
Part of the RF matching network
18 pF
C381
Part of the RF matching network
18 pF
C382
Part of the RF matching network
1 pF
C372
Part of the RF matching network
1 pF
C441
32-kHz xtal-loading capacitor
22 pF
C451
32-kHz xtal-loading capacitor
22 pF
C561
Decoupling capacitor for the internal digital regulator
1 µF
C321
Decoupling capacitor for the internal digital regulator
1 µF
C281
Filter capacitor for reset line
1 nF
L372
Part of the RF matching network
2 nH
L381
Part of the RF matching network
2 nH
R21
USB D– series resistor
33 Ω
R31
USB D+ series resistor
R32
USB D+ pullup resistor to signal full-speed device presence
R281
Filter resistor for reset line
2.2 Ω
R421
Resistor used for internal biasing
56 kΩ
33 Ω
1.5 kΩ
Input, Output Matching
When using an unbalanced antenna such as a monopole, use a balun to optimize performance. One can
implement the balun using low-cost, discrete inductors and capacitors. The recommended balun shown in
Figure 6-1 consists of L372, C372, C382 and L381.
If a balanced antenna such as a folded dipole is used, omit the balun.
6.2
Crystal
The 32-MHz crystal oscillator uses an external 32-MHz crystal, XTAL1, with two loading capacitors (C341
and C351). See the 32-MHz Crystal Oscillator section for details. Calculate the load capacitance across
the 32-MHz crystal by Equation 1.
1
CL =
+ Cparasitic
1
1
+
C341 C351
(1)
XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C441 and C451) used for the
32.768-kHz crystal oscillator. Use the 32.768-kHz crystal oscillator in applications where both low sleepcurrent consumption and accurate wake-up times are needed. Calculate the load capacitance across the
32.768-kHz crystal by Equation 2.
1
CL =
+ Cparasitic
1
1
+
C441 C451
(2)
Use a series resistor, if necessary, to comply with the ESR requirement.
20
Applications, Implementation, and Layout
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6.3
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
On-Chip 1.8-V Voltage-Regulator Decoupling
The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires decoupling
capacitors (C561, C321) and an external connection between them for stable operation.
6.4
Power-Supply Decoupling and Filtering
Optimum performance requires proper power-supply decoupling. The placement and size of the
decoupling capacitors and the power supply filtering are important to achieve the best performance in an
application. TI provides a recommended compact reference design for the user to follow.
6.5
References
1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY)
Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
2. CC2538xFnn User's Guide
3. Universal Serial Bus Revision 2.0 Specification
http://www.usb.org/developers/docs/usb_20_052709.zip
Applications, Implementation, and Layout
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7 Device and Documentation Support
7.1
7.1.1
Device Support
Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of the CC2538 device applications:
Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE):
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any CC2538 device application.
Hardware Development Tools: Extended Development System (XDS™) Emulator
For a complete listing of development-support tools for the CC2538 platform, visit the Texas Instruments
website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office
or authorized distributor.
7.1.2
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix)
(for example, CC2538).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
X and P devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, RTQ) and the temperature range (for example, blank is the default commercial
temperature range).
For orderable part numbers of CC2538 devices in the RTQ package types, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
22
Device and Documentation Support
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7.2
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
Documentation Support
The following documents describe the CC2538 processor. Copies of these documents are available on the
Internet at www.ti.com.
7.2.1
SWRZ045
CC2538 SoC for 2.4-GHz IEEE 802.15.4, 6LoWPAN and ZigBee Applications Errata
SWRA467
Developing a Low-Cost, Zigbee-Enabled Smart Energy Meter On CC2538
SWRA456
Pwr Consumption Meas & Optimization for CC2538 End Device With Z-Stack
SWRA447
Using CC2592 Front End with CC2538
SWRA437
CC2538 + CC1200 Evaluation Module
SWRA443
Using GCC/GDB With CC2538
SWRU325
CC2538 Peripheral Driver Library User's Guide
SWRU319
CC2538 SoC for 2.4-GHz IEEE 802.15.4 & ZigBee/ZigBee IP Apps User's Guide
SWRU333
CC2538 ROM User's Guide
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
7.3
Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. The selection
includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various
software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
7.3.1
Texas Instruments Low-Power RF Web Site
Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ
section, news and events updates. Go to www.ti.com/lprf.
Device and Documentation Support
Copyright © 2012–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2538
23
CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
7.3.2
www.ti.com
Low-Power RF Online Community
•
•
•
Forums, videos, and blogs
RF design help
E2E interaction
Join at: www.ti.com/lprf-forum.
7.3.3
Texas Instruments Low-Power RF Developer Network
Texas Instruments has launched an extensive network of low-power RF development partners to help
customers speed up their application development. The network consists of recommended companies, RF
consultants, and independent design houses that provide a series of hardware module products and
design services, including:
• RF circuit, low-power RF, and ZigBee design services
• Low-power RF and ZigBee module solutions and development tools
• RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork
7.3.4
Low-Power RF eNewsletter
The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and
other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter
articles include links to get more online information.
Sign up at: www.ti.com/lprfnewsletter
7.4
Trademarks
Code Composer Studio, SmartRF, E2E are trademarks of Texas Instruments.
Cortex is a registered trademark of ARM Limited.
ARM is a registered trademark of ARM Physical IP, Inc.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
ZigBee is a registered trademark of ZigBee Alliance.
7.5
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
7.7
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
24
Device and Documentation Support
Copyright © 2012–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2538
CC2538
www.ti.com
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
8 Mechanical Packaging and Orderable Information
8.1
Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2015, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2538
25
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
CC2538NF11RTQR
ACTIVE
QFN
RTQ
56
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538NF11
CC2538NF11RTQT
ACTIVE
QFN
RTQ
56
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538NF11
CC2538NF23RTQR
ACTIVE
QFN
RTQ
56
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538NF23
CC2538NF23RTQT
ACTIVE
QFN
RTQ
56
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538NF23
CC2538NF53RTQR
ACTIVE
QFN
RTQ
56
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538NF53
CC2538NF53RTQT
ACTIVE
QFN
RTQ
56
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538NF53
CC2538SF23RTQR
ACTIVE
QFN
RTQ
56
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538SF23
CC2538SF23RTQT
ACTIVE
QFN
RTQ
56
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538SF23
CC2538SF53RTQR
ACTIVE
QFN
RTQ
56
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538SF53
CC2538SF53RTQT
ACTIVE
QFN
RTQ
56
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
CC2538SF53
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of