Dual-Mode Bluetooth® CC2564 Module With
Integrated Antenna Evaluation Board
User's Guide
Literature Number: SWRU427
December 2015
Contents
1
2
3
4
5
6
7
8
9
Introduction ......................................................................................................................... 4
CC2564MODAEM Features .................................................................................................... 5
CC2564MODAEM Board Applications ..................................................................................... 5
Introduction to CC2564MODAEM Board .................................................................................. 6
Kit Contents ........................................................................................................................ 6
Requirements ...................................................................................................................... 7
Overview ............................................................................................................................. 8
Hardware Description ......................................................................................................... 11
8.1
Connectors ..............................................................................................................
8.1.1
EM Connectors ..............................................................................................
8.1.2
COM Connector .............................................................................................
8.1.3
Debug Header ...............................................................................................
12
12
13
13
8.2
Board Configurations ...................................................................................................
8.2.1
Power Supplies Configuration .............................................................................
8.2.2
Slow Clock ...................................................................................................
8.2.3
UART Configuration ........................................................................................
8.2.4
PCM Configuration..........................................................................................
14
14
15
15
16
Software Tools ................................................................................................................... 18
9.1
TI Dual-Mode Bluetooth Stack ........................................................................................ 18
9.2
TI Dual-Mode Bluetooth Service Packs for the CC256x Device
9.3
2
.................................................
Bluetooth Hardware Evaluation Tool .................................................................................
Table of Contents
18
18
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List of Figures
1
CC2564MODAEM Board ................................................................................................... 6
2
MSP430 Hardware Setup Example ....................................................................................... 7
3
TM4C Hardware Setup Example .......................................................................................... 8
4
Other MCU Hardware Setup Examples................................................................................... 8
5
CC2564MODAEM Board Front Overview ................................................................................ 9
6
CC2564MODAEM Board Back Connectors
7
CC2564MODAEM Block Diagram ....................................................................................... 11
8
Jumper Configurations..................................................................................................... 14
9
Clock Input .................................................................................................................. 15
10
UART Default Configuration .............................................................................................. 15
11
UART COM Connector Configuration ................................................................................... 16
12
PCM Connector Configuration ............................................................................................ 16
13
Resistors to Change the Direction of the PCM ......................................................................... 17
14
R11 DNI to Enable Audio Features ...................................................................................... 17
............................................................................
10
MSP430 is a trademark of Texas Instruments.
ARM, Keil, µVision are registered trademarks of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG.
All other trademarks are the property of their respective owners.
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3
User's Guide
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Dual-Mode Bluetooth® CC2564 Module With Integrated
Antenna Evaluation Board (CC2564MODAEM)
1
Introduction
The CC2564MODAEM evaluation board contains the CC2564MODA Bluetooth® host controller interface
(HCI) module with integrated antenna and is intended for evaluation and design purposes. For a complete
evaluation solution, the CC2564MODAEM board plugs directly into the following hardware development
kits (HDKs):
• MSP-EXP430F5529
• MSP-EXP430F5438
• DK-TM4C123G
• DK-TM4C129X
• Other MCUs
A certified and royalty-free TI dual-mode Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the
MSP430 and TM4C12x MCUs. The CC2564MODAEM hardware design files (schematics, layout, and bill
of materials [BOM]) are provided as a reference to aid in the implementation of the CC2564MODA
module.
The CC2564MODA module is a complete Bluetooth BR/EDR/LE HCI solution with integrated antenna
based on TI's CC2564B dual-mode Bluetooth single-chip device, which reduces design effort and enables
fast time to market. The CC2564MODA module includes TI's seventh-generation Bluetooth core, providing
a product-proven solution that is Bluetooth 4.1 compliant. The devices provide one of the best Bluetooth
RF performances with a transmit power and receive sensitivity that provides range of about 2× compared
to other Bluetooth low energy-only solutions. TI’s power-management hardware and software algorithms
provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.
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CC2564MODAEM Features
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2
CC2564MODAEM Features
The CC2564MODAEM board includes the following features:
• CC2564MODA Bluetooth HCI module with integrated antenna (MOG package)
• Supports Bluetooth specification v4.1
• Supports dual-mode (Bluetooth and Bluetooth low energy)
• Offers class 1.5 transmit power (+10 dBm)
• Offers high sensitivity (-93 dBm typ)
• Offers 32.768-kHz oscillator
• Offers UART interface: control and data
• Offers PCM/I2S interface: voice and audio
• Offers layer PCB design
• Offers 1.8-V LDO (LP2985-18)
• Offers three voltage level translators (SN74AVC4T774)
• Offers EM connectors that plug directly into the following TI hardware development kits:
– MSP-EXP430F5529
– MSP-EXP430F5438
– DK-TM4C123G
– DK-TM4C129X
– Other MCUs
• Offers COM connectors that plug directly into the TI HDKs
• Features certified and royalty-free TI dual-mode Bluetooth stack (TIBLUETOOTHSTACK-SDK):
– MSP430™ (CC256XMSPBTBLESW)
– TM4C (CC256XM4BTBLESW)
– Other MCUs (CC256XSTBTBLESW)
3
CC2564MODAEM Board Applications
Examples of embedded wireless applications include the following:
• Cable replacement
• Printer adapters
• Printers and scanners
• Computers and peripherals
• Personal digital assistants (PDAs)
• Wireless sensors
• Industrial control applications
• Low-power medical
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Introduction to CC2564MODAEM Board
4
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Introduction to CC2564MODAEM Board
TI intends this user's guide to help you integrate TI's Bluetooth development platform, the
CC2564MODAEM evaluation board, with TI's evaluation platforms and software development kits (SDKs).
The guide describes the components and configurations of the board to use for various Bluetooth
applications and includes specific information about the module to help apply the board specifics to your
application. Module information and capabilities, including pin descriptions and available software and
tools, are provided to enhance your out-of-box experience.
Figure 1 shows the CC2564MODAEM board.
Figure 1. CC2564MODAEM Board
5
Kit Contents
The CC2564MODAEM kit includes the following contents:
• One CC2564MODAEM board with the TI dual-mode Bluetooth CC2564 module with integrated
antenna
• One block jumper for the MSP-EXP430F5438 board
• Four jumpers for the MSP-EXP430F5529 board
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Requirements
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6
Requirements
The following hardware and software tools are required for a complete evaluation:
Hardware
• One MSP430 experimenter board – sold separately:
– MSP-EXP430F5529 board
– MSP-EXP430F5438 board
• One TM4C development kit – sold separately:
– DK-TM4C123G development kit
– DK-TM4C129X development kit
Software
• TI dual-mode Bluetooth stack
– On MSP430 MCUs: CC256XMSPBTBLESW
– On TM4C MCUs: CC256XM4BTBLESW
• Other MCUs
– On STM32F4 MCUs: CC256XSTBTBLESW
Tools
• TI dual-mode Bluetooth Service Pack for CC256x (optional)
• CC256x Bluetooth Hardware Evaluation Tool (optional)
• Integrated development environment (IDE) versions – platform dependent:
– Code Composer Studio (CCS)
– IAR 7.2/7.3 for ARM®
– ARM Keil® µVision® 4.70.0.0
Figure 2 shows an example of the MSP430 hardware setup.
Figure 2. MSP430 Hardware Setup Example
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Overview
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Figure 3 shows an example of the TM4C hardware setup.
Figure 3. TM4C Hardware Setup Example
Figure 4 shows examples of other MCU hardware setups using the CC256xEM Bluetooth Adapter Kit
(CC256x_STADAPT): the STM3240G-EVAL board and the STM32FDISCOVERY board.
Figure 4. Other MCU Hardware Setup Examples
7
Overview
The CC2564MODAEM board is the development environment for the CC2564MODA module and plugs
directly into TI's MSP430 and TM4C experimenter boards with EM connectors that simplify prototype
wiring and field trials. This module is based on TI’s CC2564B device, uses a host controller interface
(HCI), and is a cost-effective and flexible way to implement a Bluetooth network. The HCI reduces the cost
of the BOM, offering designers the flexibility to choose a controller and eliminate redundant processing
capacity while the Bluetooth stack resides and executes on the host processor of the application.
The CC2564MODAEM board has two connectors: EM and COM. The I/Os for the EM are at 3.3 V, which
is the default assembly configuration. The I/Os for the COM are at 1.8 V and require hardware
modification.
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Overview
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TI intends the CC2564MODAEM board for evaluation purposes and to work with TI's Hardware
Development Kit (for more information, see Section 9, Software Tools). To implement this reference
design, schematic and layout files are available on the CC2564MODA product page.
Figure 5 shows the front overview of the CC2564MODAEM board.
Figure 5. CC2564MODAEM Board Front Overview
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Overview
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Figure 6 shows the back of the CC2564MODAEM board.
Figure 6. CC2564MODAEM Board Back Connectors
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Hardware Description
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8
Hardware Description
Figure 7 shows the high-level block diagram of the CC2564MODAEM board. The CC2564MODA module
includes an integrated antenna. The oscillator is the default clock with a frequency accuracy of 32.768 kHz
±250 ppm. The signals from the dual-mode Bluetooth CC2564 module include UART, PCM, nSHUTD, and
slow clock. The CC2564MODAEM board includes the following connectors:
• EM (default)
• COM
The connectors can supply power to the CC2564MODA module through VBAT_EDGE or VBAT_MCU.
Signals for the EM connector are controlled using level shifters. The hardware can be configured and
modified to use the slow clock from the connectors. A third connector, the debug header, is used for
testing. The I/Os of the EM connector are at 3.3 V. The I/Os of the COM connector are at 1.8 V and
require hardware modification. The I/Os for the debug header connector are at 1.8 V and require hardware
modification.
LDO
VBAT_MCU
VBAT
VDD_IO
UART
PCM
EM
Connector
Level Shifters
UART
nSHUTD
Slow Clock
Antenna
PCM
COM
Connector
CC2564MODA
nSHUTD
VBAT_EDGE
Debug
Header
Slow Clock
Oscillator
32.768 kHz
Slow Clock
Figure 7. CC2564MODAEM Block Diagram
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Hardware Description
8.1
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Connectors
This section describes the CC2564MODAEM EM, COM, and debug header connectors.
8.1.1
EM Connectors
The EM connectors mount on a variety of TI MCU platforms, such as the MSP430 (MSP-EXP430F5529
and MSP-EXP430F5438) and the TM4C (DK-TM4C123G and DK-TM4C129X) device. All EM I/Os are at
3.3-V levels. Pin assignments are described with respect to the CC2564MODA side. For example,
MODULE_UART_RX refers to the receiving UART RX pin on the CC2564MODA module that connects to
the UART TX pin on the MCU.
Table 1 describes the standard pinout for EM1.
Table 1. EM1 Connector Standard Pinout
Pin
EM Adaptor Assignment
Pin
EM Adaptor Assignment
1
GND
2
N/C
3
MODULE_UART_CTS
4
N/C
5
SLOW_CLK
6
N/C
7
MODULE_UART_RX
8
N/C
9
MODULE_UART_TX
10
N/C
11
N/C
12
N/C
13
N/C
14
N/C
15
N/C
16
N/C
17
N/C
18
N/C
19
GND
20
N/C
Table 2 describes the standard pinout for EM2.
Table 2. EM2 Connector Standard Pinout
Pin
12
EM Adaptor Assignment
Pin
EM Adaptor Assignment
1
N/C
2
GND
3
N/C
4
N/C
5
N/C
6
N/C
7
3.3 V
8
MODULE_AUDIO_DATA_OUT
9
3.3 V
10
MODULE_AUDIO_DATA_IN
11
MODULE_AUDIO_FSINK
12
N/C
13
N/C
14
N/C
15
N/C
16
N/C
17
MODULE_AUDIO_CLK
18
MODULE_UART_RTS
19
nSHUTD
20
N/C
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8.1.2
COM Connector
The COM connector interfaces with TI's MPU platforms, such as the AM335x evaluation module
(TMDXEVM3358). All COM I/Os are at 1.8 V. Some components must not be installed (DNI) to use the
COM connector. Table 3 describes the COM pins (for more information, see Section 8.2, Board
Configurations).
Table 3. COM Connector
Pin
(1)
Relevant Com Connector Pin Assignment
1
SLOW_CLK_EDGE
8
1V8_IN
52
AUD_CLK_1V8
54
AUD_FSYNC_1V8
56
AUD_IN_1V8
58
AUD_OUT_1V8
66
HCI_TX_1V8
68
HCI_RX_1V8
70
HCI_CTS_1V8
72
HCI_RTS_1V8
76
TX_DEBUG_1V8
89
nSHUTDOWN_1V8
3, 9, 19, 37, 47, 63, 77, 83, 87, 95, 97
GND
2, 6, 18, 22, 42, 60, 64, 92
GND
(1)
8.1.3
All pins not listed are NC.
Debug Header
The debug header enables important signals in the design such as power, ground, debug, UART, and
audio signals for testing and debugging. The I/Os are at 1.8 V.
Table 4 describes the debug header assignments.
Table 4. Debug Header Pinout
Pin
EM Adapter Pin Assignment
Pin
EM Adapter Pin Assignment
1
GND
2
VBAT
3
VIO_HOST
4
GND
5
AUD_FSYNC_1V8
6
AUD_CLK_1V8
7
AUD_OUT_1V8
8
AUD_IN_1V8
9
CLK_REQ_OUT_1V8
10
SLOW_CLK_EDGE
11
HCI_TX_1V8
12
HCI_RX_1V8
13
HCI_CTS_1V8
14
HCI_RTS_1V8
15
TX_DEBUG_1V8
16
nSHUTDOWN_1V8
17
VDD_1V8
18
GND
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Hardware Description
8.2
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Board Configurations
8.2.1
Power Supplies Configuration
The CC2564MODA module requires two power sources:
• VDD_IN: main power supply for the module
• VDD_IO: power source for the 1.8-V I/O ring
The HCI module includes several on-chip voltage regulators for increased noise immunity and can be
connected directly to the battery.
8.2.1.1
Jumper Configurations
The CC2564MODAEM board has four jumpers that can be configured to control power on the board. The
power supply can be enabled through either the COM or EM connector through the VBAT_MCU or
VBAT_EDGE jumper. VBAT_EDGE and VBAT_MCU supply power to the entire board. VDD_1V8 is the
power supply jumper to the pins going in and out of the module. The VBAT_CC jumper is the main default
power supply to the CC2564 device.
NOTE: For correct operation, ensure that jumpers are configured to connect power to the device.
Table 5 describes the jumper configurations and has the configuration for the board.
Table 5. Jumper Configurations
Jumper
Description
VDD_1V8 (J1)
Supplies power to CC2564 I/Os
VBAT_CC (J2)
Main power supply for CC2564
VBAT_EDGE (J3)
Enables power supply through COM connector
VBAT_MCU (J4)
Enables power supply through EM connectors
Figure 8 shows the default settings for the jumpers on the CC2564MODAEM board.
Figure 8. Jumper Configurations
8.2.1.2
Measuring Current Consumption
These jumpers measure current consumption by placing current sense resistors on R10 for VBAT_CC and
R7 for VDD_1V8. Both resistors are 0.10 Ω, 1/4 W. The VBAT_CC jumper (J2) measures the power
consumed by the CC2564 device, including the RF TX and RF RX. The VDD_1V8 jumper (J1) measures
power consumed by the digital VDD_IO.
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8.2.2
Slow Clock
8.2.2.1
Clock Inputs
The slow clock can be placed on the board (the default setting) or sourced from an external source. The
CC2564MODA connects to SLOW_CLK_IN and can be a digital signal in the range of 0 to 1.8 V. The
frequency accuracy of the slow clock must be 32.768 kHz ±250 ppm for Bluetooth use (according to the
Bluetooth specification).
Figure 9 shows the clock inputs.
EM
Connector
Level Shifters
Slow Clock
Slow Clock
Oscillator
32.768 kHz
CC2564MODA
Slow Clock
(Default)
COM
Connector
SLOW_CLK_IN
Slow Clock
Figure 9. Clock Input
8.2.3
UART Configuration
The UART for the CC2564MODAEM board can be routed to the EM or COM connector. The signals are
also available to the debug header to probe the signals. Figure 10 shows the EM connector as the default
UART configuration. The dotted line shows that the COM connector is not connected. To configure the
COM connector for UART, remove or depopulate the U3 level shifter as shown in Figure 10, where the
level shifter is dotted to represent the unpopulated level shifter
(Default)
EM
Connector
UART
Level Shifters
UART
UART
COM
Connector
CC2564MODA
UART
Figure 10. UART Default Configuration
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Figure 11 shows the UART COM connector configuration.
(Default)
EM
Connector
UART
Level Shifters
UART
UART
COM
Connector
CC2564MODA
UART
Figure 11. UART COM Connector Configuration
8.2.4
PCM Configuration
For voice and assisted audio features, the PCM signals from the CC2564MODA (master) module must be
connected to an external audio host (slave). This relationship signifies that the CC2564MODA module
provides the FSYNC and slow clock signals to the codec. The PCM configuration is required for the
following profiles:
• HFP
• HSP
• A3DP
Two configurations are available for the two connectors, EM and COM. Figure 12 shows the default
configuration and the following sections show how to set up each connector.
(Default)
EM
Connector
PCM
Level Shifters
PCM
PCM
COM
Connector
CC2564MODA
PCM
Figure 12. PCM Connector Configuration
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8.2.4.1
EM Configuration
The EM connectors allow configuration of the CC2564MODA as the master or as the slave. The default
configuration is a master role for the module through the EM connectors. To change the direction of the
PCM so that the module is configured as the slave, perform the following steps:
1. Connect resistor R18.
2. Remove resistor R19 on the U4 level shifter (for the positions of the resistors, see Figure 13 ).
Figure 13. Resistors to Change the Direction of the PCM
The board can also be set up to use audio features. To use audio features, disconnect (DNI) the R11
resistor on the U4 level shifter (for the positions of the resistors, see Figure 14).
Figure 14. R11 DNI to Enable Audio Features
8.2.4.2
COM Configuration
To configure the COM connector, the resistors connected to U4 must be pulled high, switching the
direction of the level shifter. The signal in the COM connector can be configured to run in either direction
without requiring any changes to the board components.
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Software Tools
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9
Software Tools
9.1
TI Dual-Mode Bluetooth Stack
TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy technology and is comprised of
single-mode and dual-mode offerings implementing the specification for Bluetooth 4.0 wireless technology.
The Bluetooth stack provides simple command line sample applications to speed development. The stack
works with the following:
• Any MSP430 MCU with flash equal to or greater to 128KB and RAM equal or greater than 8KB
(CC256XMSPBTBLESW)
• Any TM4C MCU with flash equal to or greater than 128KB (CC256XM4BTBLESW)
• Other MCUs (CC256XSTBTBLESW)
For detailed documentation, see the Bluetooth Stack Demo APPS wiki page.
9.2
TI Dual-Mode Bluetooth Service Packs for the CC256x Device
The CC256x Bluetooth Service Packs are mandatory initialization scripts that contain bug fixes and
platform-specific configurations. The scripts must be loaded into the corresponding CC256x device after
every power cycle. The CC256x SPs are delivered as a Bluetooth Script (BTS) file. A BTS file is a scripted
binary file that contains the embedded HCI commands and HCI events.
9.3
Bluetooth Hardware Evaluation Tool
The CC256x Bluetooth Hardware Evaluation Tool is a program that can be downloaded as a complete
package from TI. The tool is an intuitive user-friendly tool used to test TI's Bluetooth chips, including this
CC256xQFNEM board. More specifically, the tool tests RF performance and modifies the service packs of
our Bluetooth chips.
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