CC2595RGTR

CC2595 www.ti.com SWRS090A – SEPTEMBER 2010 – REVISED MARCH 2011 2.4-GHz RF FRONT END Check for Samples: CC2595 FEATURES • 1 • • • Low Cost and Small Package Very Few External Components 2.0-V to 3.6-V Operation • • • Less Than 1-μA Current Consumption in Power Down Mode Low Transmit Current Consumption 98 mA at 3 V for +20.7 dBm Out (PAE = 40%) RoHS Compliant 3- x 3-mm QFN-16 Package DESCRIPTION CC2595 is a PA solution that extends the range of any Zigbee or Bluetooth transceiver. It is a cost-effective and high performance RF front end for low-power and low-voltage wireless applications in the 2.4-GHz band. Its single-ended RF input and output make it compatible with any manufacturer’s transceiver if appropriate external parts are used. When a transmit/receive (T/R) switch and a balun are used, it can interface with existing and future CC24XX and CC25XX transceiver products. CC2595 extends the link budget by providing a power amplifier for improved output power. It is highly effective for high (+20 dBm) output power making it suitable for battery-operated systems. CC2595 contains PA and RF-matching for simple design of high performance wireless applications. It is packaged in a 3- x 3-mm, 16-lead QFN package with exposed paddle. FUNCTIONAL BLOCK DIAGRAM AVDD_PA1 AVDD_PA2 RF_IN RF_OUT Bias and Logic RBIAS1 RBIAS2 AVDD_BIAS PA_EN 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated CC2595 SWRS090A – SEPTEMBER 2010 – REVISED MARCH 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. GND 1 RF_IN 2 GND AVDD_PA1 GND GND PIN ASSIGNMENTS 16 15 14 13 12 RF_OUT 11 GND 10 RF_OUT 3 x 3 QFN - 16 9 5 6 7 8 PAEN 4 RBIAS2 GND RBIAS1 3 AVDD_BIAS GND GND Figure 1. CC2595 Pinout Table 1. Pin Descriptions for CC2595 2 PIN NO. PIN NAME TYPE 1 GND GND 2 RF_IN RF in/out 3 GND GND DESCRIPTION RF single-ended input 4 GND GND 5 AVDD_BIAS Power Supply voltage, analog and logic 6 RBIAS1 Analog Bias set resistor, stage 1 7 RBIAS2 Analog Bias set resistor, stage 2 8 PAEN Digital in 9 GND GND 10 RF_OUT RF in/out 11 GND GND 12 RF_OUT RF in/out 13 GND GND 14 GND GND 15 AVDD_PA1 Power 16 GND GND Chip enable: high = PA on RF single-ended output (1 of 2) RF single-ended output (2 of 2) Supply voltage, PA stage 1 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Links: CC2595 CC2595 www.ti.com SWRS090A – SEPTEMBER 2010 – REVISED MARCH 2011 Table 2. ORDERING INFORMATION (1) (1) (2) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –40ºC to 85ºC RGT (QFN) CC2595RGTR C2595 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). Supply voltage range Voltage on any digital pin VALUE UNIT -0.3 to 3.6 V -0.3 to VDD + 0.3, max 3.6 V +10 dBm RF input power RF_IN TSTG Storage temperature range –50 to 150 °C TJ Junction temperature 150 °C RF pins 1500 ESD (1) Excluding RF pins HBM (Human Body Model) V 2000 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN Operating supply voltage TA Operating free air temperature range NOM MAX UNIT 2 3.6 V –40 85 °C MAX UNIT ELECTRICAL CHARACTERISTICS TJ = 25°C, VDD = 3 V (unless otherwise specified) PARAMETER TEST CONDITIONS Current consumption No input signal Power down current EN = LOW MIN 30 High input level (control pin) 1.3 Low input level (control pin) Power down → Transmit TYP Time from EN goes HIGH to settled in TX mA 1 µA VDD V 0.3 V 1 µs Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Links: CC2595 3 CC2595 SWRS090A – SEPTEMBER 2010 – REVISED MARCH 2011 www.ti.com RF CHARACTERISTICS TJ = 25°C, VDD = 3 V (unless otherwise specified) PARAMETER TEST CONDITIONS f Frequency range of operation POUT Output power Pin = 0 dBm PAE Power added efficiency Pin = 0 dBm POUTHI Output power (high) VDD = 3.3 V, Pin = +3 dBm PAEHI Power added efficiency (high) VDD = 3.3 V, Pin = +3 dBm P1dB Output 1-dB compression point IRL Input return loss ORL Output return loss +22 8 Output power variation over supply voltage 2 V to 3.6 V Output power variation over temperature -40°C to 85°C The harmonics can be further reduced by using an external LC filter and antenna. Stability Load mismatch MAX UNIT 2483.5 MHz +20.7 dBm 40 2400 MHz to 2483.5 MHz 2nd harmonic 4 +20 Output power variation over frequency 3rd harmonic TYP 2400 10 Harmonics K MIN +22.5 % dBm 45 % +17 dBm 15 dB 10 dB 0.5 dB 4 dB 1 dB Compliant with international regulatory standards Compliant with international regulatory standards Unconditionally stable No damage at 10:1 VSWR condition; all phases Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Links: CC2595 CC2595 www.ti.com SWRS090A – SEPTEMBER 2010 – REVISED MARCH 2011 TYPICAL CHARACTERISTICS PA Output Power, PAE, Current Consumption and Gain vs Input Power (3-V Supply) 60 120 50 100 PA Output Power vs Supply, 0-dBm Input 22 21 40 80 20 60 Gain 19.5 40 I_supply 19 POUT 10 0 -25 20 18.5 18 0 -20 20 -15 -10 PIN - dBm -5 0 5 2 2.2 2.4 2.6 Noise Figure and Gain vs Frequency (3-V Supply) 30 7 28 25 22 Gain 5 24 4 22 POUT - dBm 26 6 3.6 49.0% P OUT (3.3 V) 48.0% 47.0% POUT (3 V) 21 46.0% 20 PAE (3.3 V) 19 18 43.0% PAE (3 V) 20 Noise Figure 16 2 2.44 2.46 2.48 f- Frequency - GHz 2.5 18 2.52 15 2.38 Figure 4. 45.0% 44.0% 17 2.42 3.4 50.0% 23 Gain - dB Noise Figure - dB 24 2.4 3.2 POUT and PAE vs Frequency (3-V Supply, 0-dBm Input and 3.3-V Supply, +3-dBm Input) 8 2.38 3 VSUPPLY - V Figure 3. Figure 2. 3 2.8 PAE - % 30 20.5 Gain - dB PAE Current - mA PAE - %, POUT - dBm, Gain - dB 21.5 42.0% 41.0% 2.4 2.42 2.44 2.46 2.48 f - Frequency - GHz 2.5 40.0% 2.52 Figure 5. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Links: CC2595 5 CC2595 SWRS090A – SEPTEMBER 2010 – REVISED MARCH 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) POUT and PAE vs Frequency (Three Temperatures and 3-V Supply, 0-dBm Input) 23 POUT (-40°C) POUT (27°C) 21 Pout - dBm 20 47.0% 46.0% POUT (85°C) 19 45.0% PAE (-40°C) 44.0% 43.0% 18 PAE (27°C) 17 42.0% 16 41.0% PAE (85°C) 15 14 13 2.38 2.4 PAE - % 22 48.0% 40.0% 39.0% 2.42 2.44 2.46 2.48 2.5 Frequency - GHz 38.0% 2.52 Figure 6. 6 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Links: CC2595 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CC2595RGTR ACTIVE VQFN RGT 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 C2595 CC2595RGTT ACTIVE VQFN RGT 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 C2595 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of