CC2650MODAMOHR

Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Design CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module 1 Device Overview 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultra-Low-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air (OTA) Upgrade • Ultra-Low-Power Sensor Controller – Can Run Autonomous From the Rest of the System – 16-Bit Architecture – 2KB of Ultra-Low-Leakage SRAM for Code and Data • Efficient Code Size Architecture, Placing Drivers, Bluetooth® low energy Controller, IEEE® 802.15.4 Medium Access Control (MAC), and Bootloader in ROM • Integrated Antenna • Peripherals – All Digital Peripheral Pins Can Be Routed to Any GPIO – Four General-Purpose Timer Modules (8 × 16-Bit or 4 × 32-Bit Timer, PWM Each) – 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX – Continuous Time Comparator – Ultra-Low-Power Analog Comparator – Programmable Current Source – UART – 2 × SSI (SPI, MICROWIRE, TI) – I2C – I2S – Real-Time Clock (RTC) – AES-128 Security Module – True Random Number Generator (TRNG) – 15 GPIOs – Support for Eight Capacitive Sensing Buttons – Integrated Temperature Sensor • External System – On-Chip Internal DC-DC Converter – No External Components Needed, Only Supply Voltage • Low Power – Wide Supply Voltage Range – Operation from 1.8 to 3.8 V – Active-Mode RX: 6.2 mA – Active-Mode TX at 0 dBm: 6.8 mA – Active-Mode TX at +5 dBm: 9.4 mA – Active-Mode MCU: 61 µA/MHz – Active-Mode MCU: 48.5 CoreMark/mA – Active-Mode Sensor Controller: 0.4 mA + 8.2 µA/MHz – Standby: 1 µA (RTC Running and RAM/CPU Retention) – Shutdown: 100 nA (Wake Up on External Events) • RF Section – 2.4-GHz RF Transceiver Compatible With Bluetooth low energy (BLE) 5.1 Specification and IEEE 802.15.4 PHY and MAC – CC2650MODA RF-PHY Qualified (QDID: 88415) – Excellent Receiver Sensitivity (–97 dBm for Bluetooth low energy and –100 dBm for 802.15.4), Selectivity, and Blocking Performance – Programmable Output Power up to +5 dBm – Pre-certified for Compliance With Worldwide Radio Frequency Regulations – ETSI RED (Europe) – IC (Canada) – FCC (USA) – ARIB STD-T66 (Japan) – JATE (Japan) • Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF Configurations – Packet Sniffer PC Software – Sensor Controller Studio – SmartRF™ Studio – SmartRF Flash Programmer 2 – IAR Embedded Workbench® for ARM – Code Composer Studio™ 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 1.2 • • • • • Applications Building Automation Medical and Health Appliances Industrial Consumer Electronics 1.3 www.ti.com • • • • Proximity Tags Alarm and Security Remote Controls Wireless Sensor Networks Description The SimpleLink™ CC2650MODA device is a wireless microcontroller (MCU) module that targets Bluetooth® low energy applications. The CC2650MODA device can also run ZigBee® and 6LoWPAN and ZigBee RF4CE™ remote control applications. The module is based on the SimpleLink CC2650 wireless MCU, a member of the CC26xx family of costeffective, ultra-low-power, 2.4-GHz RF devices. Very-low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin-cell batteries and in energy-harvesting applications. The CC2650MODA module contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. This sensor controller is good for interfacing with external sensors or for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2650MODA device is good for applications within a wide range of products including industrial, consumer electronics, and medical devices. The CC2650MODA module is pre-certified for operation under the regulations of the FCC, IC, ETSI, and ARIB. These certifications save significant cost and effort for customers when integrating the module into their products. The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly running on a separate ARM® Cortex®-M0 processor. This architecture improves overall system performance and power consumption and makes more flash memory available. The Bluetooth low energy software stack (BLE-Stack) and the ZigBee software stack ( Z-Stack™) are available free of charge. Device Information (1) PART NUMBER CC2650MODAMOH (1) 2 PACKAGE BODY SIZE MOH (Module) 16.90 mm × 11.00 mm For more information, see Section 10. Device Overview Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 1.4 SWRS187D – AUGUST 2016 – REVISED JULY 2019 Functional Block Diagram Figure 1-1 is a block diagram for the CC2650MODA device. SimpleLink CC2650MODA Wireless MCU Module 32.768-kHz Crystal Oscillator 24-MHz Crystal Oscillator RF Balun cJTAG RF core ROM Main CPU ADC ADC 128-KB Flash ARM Cortex-M3 Digital PLL DSP Modem 8-KB Cache 20-KB SRAM ROM Sensor Controller General Peripherals / Modules I2C 4× 32-bit Timers UART 2× SSI (SPI, µWire, TI) 4-KB SRAM ARM Cortex-M0 Sensor Controller Engine 12-bit ADC, 200 ks/s I2S Watchdog Timer 2× Analog Comparators 15 GPIOs TRNG SPI / I2C Digital Sensor IF AES Temp. / Batt. Monitor Constant Current Source 32 ch. µDMA RTC Time-to-Digital Converter 2-KB SRAM DC-DC Converter Copyright © 2017, Texas Instruments Incorporated Figure 1-1. CC2650MODA Block Diagram Device Overview Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 3 CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 www.ti.com Table of Contents Device Overview ......................................... 1 6.2 Functional Block Diagram ........................... 24 1.1 Features .............................................. 1 6.3 Main CPU ........................................... 25 1.2 Applications ........................................... 2 6.4 RF Core ............................................. 25 1.3 Description ............................................ 2 6.5 Sensor Controller 1.4 Functional Block Diagram ............................ 3 6.6 Memory .............................................. 27 2 3 Revision History ......................................... 5 Device Comparison ..................................... 6 6.7 Debug 6.8 Power Management ................................. 28 4 Terminal Configuration and Functions .............. 7 1 Related Products ..................................... 6 3.1 5 4.1 Module Pin Diagram .................................. 7 4.2 Pin Functions ......................................... 8 ............................................ 9 Absolute Maximum Ratings .......................... 9 ESD Ratings .......................................... 9 Recommended Operating Conditions ................ 9 Power Consumption Summary...................... 10 General Characteristics ............................. 10 Antenna ............................................. 11 1-Mbps GFSK (Bluetooth low energy) – RX ........ 11 1-Mbps GFSK (Bluetooth low energy) – TX ........ 12 Specifications 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 5.10 5.11 5.12 5.13 5.14 5.15 5.16 5.17 5.18 5.19 5.20 5.21 5.22 6 4 8 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX ................................................... 12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX ................................................... 13 ............. 32.768-kHz Crystal Oscillator (XOSC_LF) .......... 48-MHz RC Oscillator (RCOSC_HF) ............... 32-kHz RC Oscillator (RCOSC_LF)................. ADC Characteristics................................. Temperature Sensor ................................ Battery Monitor ...................................... Continuous Time Comparator ....................... Low-Power Clocked Comparator ................... Programmable Current Source ..................... DC Characteristics .................................. 24-MHz Crystal Oscillator (XOSC_HF) 13 13 13 13 14 15 15 15 15 16 16 Thermal Resistance Characteristics for MOH Package ............................................. 17 ............................... 5.24 Switching Characteristics ........................... 5.25 Typical Characteristics .............................. Detailed Description ................................... 6.1 Overview ............................................ 5.23 7 Timing Requirements 17 17 20 24 24 9 ................................... ............................................... ...................................... .................. 6.11 System Architecture ................................. 6.12 Certification .......................................... 6.13 End Product Labeling ............................... 6.14 Manual Information to the End User ................ 6.15 Module Marking ..................................... Application, Implementation, and Layout ......... 7.1 Application Information .............................. 7.2 Layout ............................................... 26 27 6.9 Clock Systems 29 6.10 General Peripherals and Modules 29 30 30 32 32 33 34 34 35 Environmental Requirements and Specifications ........................................... 36 8.1 PCB Bending ........................................ 36 8.2 Handling Environment 8.3 Storage Condition ................................... 36 8.4 Baking Conditions ................................... 36 8.5 Soldering and Reflow Condition .............................. .................... 36 37 Device and Documentation Support ............... 38 9.1 Device Nomenclature ............................... 38 9.2 Tools and Software 9.3 Documentation Support ............................. 40 9.4 Texas Instruments Low-Power RF Website 9.5 Low-Power RF eNewsletter ......................... 40 9.6 Community Resources .............................. 41 9.7 Additional Information ............................... 41 9.8 Trademarks.......................................... 41 ................................. ........ 39 40 9.9 Electrostatic Discharge Caution ..................... 42 9.10 Export Control Notice 9.11 Glossary ............................................. 42 ............................... 42 10 Mechanical, Packaging, and Orderable Information .............................................. 42 .............................. .................. PACKAGE MATERIALS INFORMATION ........... 10.1 Packaging Information 42 10.2 PACKAGE OPTION ADDENDUM 43 10.3 Table of Contents 44 Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187D – AUGUST 2016 – REVISED JULY 2019 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from July 1, 2017 to July 31, 2019 • • Page Added Module Marking section. .................................................................................................. 33 Added Environmental Requirements and Specifications section. ............................................................ 36 Revision History Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 5 CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 www.ti.com 3 Device Comparison Table 3-1. Device Family Overview DEVICE CC2650MODAMOH (1) 3.1 PHY SUPPORT Multiprotocol (1) FLASH (KB) RAM (KB) GPIO PACKAGE 128 20 15 MOH The CC2650 device supports all PHYs and can be reflashed to run all the supported standards. Related Products TI's Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable for a broad range of applications. The offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol). TI's SimpleLink™ Sub-1 GHz Wireless MCUs Long-range, low-power wireless connectivity solutions are offered in a wide range of Sub-1 GHz ISM bands. Companion Products Review products that are frequently purchased or used in conjunction with this product. SimpleLink™ CC2650 Wireless MCU LaunchPad™ Development Kit The CC2650 LaunchPad™ development kit brings easy Bluetooth® low energy connectivity to the LaunchPad kit ecosystem with the SimpleLink ultra-low power CC26xx family of devices. This LaunchPad kit also supports development for multi-protocol support for the SimpleLink multi-standard CC2650 wireless MCU and the rest of CC26xx family of products: CC2630 wireless MCU for ZigBee®/6LoWPAN and CC2640 wireless MCU for Bluetooth low energy. Reference Designs for CC2650MODA TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download designs at ti.com/tidesigns. 6 Device Comparison Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187D – AUGUST 2016 – REVISED JULY 2019 4 Terminal Configuration and Functions Section 4.1 shows pin assignments for the CC2650MODA device. 4.1 Module Pin Diagram Antenna GND 1 25 GND NC 2 24 NC GND 3 23 VDD DIO 0 4 22 VDD DIO 1 5 DIO 2 6 DIO 3 7 DIO 4 8 21 DIO 14 G1 G2 G3 G4 20 DIO 13 19 DIO 12 18 DIO 11 (Exposed GND Pads) 17 DIO 10 JTAG_TMS 9 13 14 15 16 nRESET DIO 7 DIO 8 DIO 9 (2) 12 DIO 5/JTAG_TDO JTAG_TCK (1) 11 DIO 6/JTAG_TDI 10 The following I/O pins marked in bold in the pinout have high-drive capabilities: • DIO 2 • DIO 3 • DIO 4 • JTAG_TMS • DIO 5/JTAG_TDO • DIO 6/JTAG_TDI The following I/O pins marked in italics in the pinout have analog capabilities: • DIO 7 • DIO 8 • DIO 9 • DIO 10 • DIO 11 • DIO 12 • DIO 13 • DIO 14 Figure 4-1. CC2650MODA MOH Package (16.9-mm × 11-mm) Module Pinout Terminal Configuration and Functions Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 7 CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 4.2 www.ti.com Pin Functions Table 4-1 describes the CC2650MODA pins. Table 4-1. Signal Descriptions – MOH Package PIN NAME PIN NO. PIN TYPE DESCRIPTION DIO_0 4 Digital I/O GPIO, Sensor Controller DIO_1 5 Digital I/O GPIO, Sensor Controller DIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDO DIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDI DIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analog EGP G1, G2, G3, G4 Power Ground – Exposed ground pad GND 1, 3, 25 — Ground JTAG_TCK 10 Digital I/O JTAG TCKC JTAG_TMS 9 Digital I/O JTAG TMSC, high-drive capability NC 2, 24 NC Not Connected—TI recommends leaving these pins floating nRESET 13 Digital input Reset, active low. No internal pullup VDD 22, 23 Power 1.8-V to 3.8-V main chip supply 8 Terminal Configuration and Functions Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187D – AUGUST 2016 – REVISED JULY 2019 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) VDD Supply voltage Voltage on any digital pin Vin (3) Voltage on ADC input MIN MAX UNIT –0.3 4.1 V V –0.3 VDD + 0.3, max 4.1 Voltage scaling enabled –0.3 VDD Voltage scaling disabled, internal reference –0.3 1.49 Voltage scaling disabled, VDD as reference –0.3 VDD / 2.9 5 dBm –40 85 °C Input RF level Tstg (1) (2) (3) Storage temperature V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to ground, unless otherwise noted. Including analog capable DIO. 5.2 ESD Ratings VALUE Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1) VESD Electrostatic discharge Charged device model (CDM), per JESD22-C101 (2) (1) (2) 5.3 All pins ±1000 RF pins ±500 Non-RF pins ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Recommended Operating Conditions Ambient temperature Operating supply voltage (VDD) For operation in battery-powered and 3.3-V systems (internal DC-DC can be used to minimize power consumption) MIN MAX –40 85 °C 1.8 3.8 V Specifications Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA UNIT 9 CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 5.4 www.ti.com Power Consumption Summary Tc = 25°C, VDD = 3.0 V with internal DC-DC converter, unless otherwise noted PARAMETER Icore Core current consumption TEST CONDITIONS MIN TYP Reset. RESET_N pin asserted or VDD below Power-onReset threshold 100 Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF 1 Standby. With RTC, CPU, RAM and (partial) register retention. XOSC_LF 1.2 Standby. With Cache, RTC, CPU, RAM and (partial) register retention. RCOSC_LF 2.5 Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF 2.7 Idle. Supply systems and RAM powered. MAX UNIT nA µA 550 1.45 mA + 31 µA/MHz Active. Core running CoreMark Radio RX 6.2 Radio TX, 0-dBm output power 6.8 Radio TX, 5-dBm output power 9.4 mA Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) (1) Iperi (1) 5.5 Peripheral power domain Delta current with domain enabled 20 Serial power domain Delta current with domain enabled 13 RF core Delta current with power domain enabled, clock enabled, RF Core Idle 237 µDMA Delta current with clock enabled, module idle 130 Timers Delta current with clock enabled, module idle 113 I2C Delta current with clock enabled, module idle 12 I2S Delta current with clock enabled, module idle 36 SSI Delta current with clock enabled, module idle 93 UART Delta current with clock enabled, module idle 164 µA Iperi is not supported in Standby or Shutdown. General Characteristics Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FLASH MEMORY Supported flash erase cycles before failure Flash page/sector erase current 100 Average delta current Flash page/sector erase time (1) Flash page/sector size Flash write current Average delta current, 4 bytes at a time Flash write time (1) 4 bytes at a time (1) 10 k Cycles 12.6 mA 8 ms 4 KB 8.15 mA 8 µs This number is dependent on flash aging and will increase over time and erase cycles. Specifications Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 5.6 SWRS187D – AUGUST 2016 – REVISED JULY 2019 Antenna Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Polarization TYP UNIT Linear Peak Gain 2450 MHz 1.26 Efficiency 2450 MHz 57% 5.7 MAX dBi 1-Mbps GFSK (Bluetooth low energy) – RX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity BER = 10 –3 –97 dBm Receiver saturation BER = 10–3 4 dBm Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency. Data rate error tolerance –350 350 kHz –750 750 ppm Co-channel rejection (1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB Selectivity, ±1 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 3 (2) dB Selectivity, ±2 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 29 / 23 (2) dB Selectivity, ±3 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 38 / 26 (2) dB Selectivity, ±4 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 42 / 29 (2) dB Selectivity, ±5 MHz or more (1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 32 dB Selectivity, Image frequency (1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 23 dB Selectivity, Image frequency ±1 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 3 / 26 (2) dB Out-of-band blocking (3) 30 MHz to 2000 MHz –20 dBm Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level –34 dBm Spurious emissions, 30 MHz to 1000 MHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –71 dBm Spurious emissions, 1 GHz to 12.75 GHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –62 dBm RSSI dynamic range 70 dB RSSI accuracy ±4 dB (1) (2) (3) Numbers given as I/C dB X / Y, where X is +N MHz and Y is –N MHz Excluding one exception at Fwanted / 2, per Bluetooth Specification Specifications Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 11 CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 5.8 www.ti.com 1-Mbps GFSK (Bluetooth low energy) – TX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Output power, highest setting Output power, lowest setting Spurious emission conducted measurement (1) (1) 5.9 TYP MAX UNIT 5 dBm –21 dBm f < 1 GHz, outside restricted bands –43 f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity PER = 1% –100 dBm Receiver saturation PER = 1% –7 dBm Adjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1% 35 dB Alternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1% 52 dB Channel rejection, ±15 MHz or more Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1% 57 dB Blocking and desensitization, 5 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 64 dB Blocking and desensitization, 10 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 64 dB Blocking and desensitization, 20 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Blocking and desensitization, 50 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 68 dB Blocking and desensitization, –5 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, –10 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, –20 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Blocking and desensitization, –50 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 67 dB Spurious emissions, 30 MHz to 1000 MHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66 –71 dBm Spurious emissions, 1 GHz to 12.75 GHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66 –62 dBm Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency >200 ppm 100 dB ±4 dB RSSI dynamic range RSSI accuracy 12 Specifications Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187D – AUGUST 2016 – REVISED JULY 2019 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Output power, highest setting Output power, lowest setting Error vector magnitude Spurious emission conducted measurement (1) (1) TYP MAX UNIT 5 dBm –21 dBm At maximum output power 2% f < 1 GHz, outside restricted bands –43 f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) 5.11 24-MHz Crystal Oscillator (XOSC_HF) (1) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Crystal frequency Start-up time (3) MAX 24 Crystal frequency tolerance (2) (1) (2) TYP –40 (3) UNIT MHz 40 ppm 150 µs Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth and IEEE 802.15.4 specification Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection 5.12 32.768-kHz Crystal Oscillator (XOSC_LF) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Crystal frequency Initial crystal frequency tolerance, Bluetooth low energy applications TYP MAX 32.768 Tc = 25°C Crystal aging UNIT kHz –20 20 ppm -3 3 ppm/year 5.13 48-MHz RC Oscillator (RCOSC_HF) Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Frequency TYP 48 Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy (1) ±0.25% Start-up time (1) MAX UNIT MHz 5 µs Accuracy relatively to the calibration source (XOSC_HF). 5.14 32-kHz RC Oscillator (RCOSC_LF) Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Calibrated frequency MIN TYP 32.8 Temperature coefficient 50 MAX UNIT kHz ppm/°C Specifications Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 13 CC2650MODA SWRS187D – AUGUST 2016 – REVISED JULY 2019 www.ti.com 5.15 ADC Characteristics Tc = 25°C, VDD = 3.0 V and voltage scaling enabled, unless otherwise noted PARAMETER (1) TEST CONDITIONS MIN Input voltage range TYP 0 VDD Resolution 12 Sample rate Offset Gain error DNL (3) Differential nonlinearity INL (4) Integral nonlinearity Internal 4.3-V equivalent reference (2) , 200 ksps, THD (1) (2) (3) (4) (5) 14 LSB 2.4 LSB >–1 LSB ±3 LSB 10 Bits 11.1 (2) , 200 ksps, –65 VDD as reference, 200 ksps, 9.6-kHz input tone –69 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone –71 dB Internal 4.3-V equivalent reference (2), 200 ksps, 9.6-kHz input tone 60 VDD as reference, 200 ksps, 9.6-kHz input tone 63 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 69 Internal 4.3-V equivalent reference (2), 200 ksps, 9.6-kHz input tone 67 VDD as reference, 200 ksps, 9.6-kHz input tone 72 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 73 Conversion time Serial conversion, time-to-output, 24-MHz clock 50 Current consumption Internal 4.3-V equivalent reference (2) 0.66 mA Current consumption VDD as reference 0.75 mA Reference voltage Equivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS™ API to include the gain or offset compensation factors stored in FCFG1. SINAD Signal-to-noise and and SNDR distortion ratio SFDR ksps 2 9.8 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Total harmonic distortion V (2) Effective number of bits VDD as reference, 200 ksps, 9.6-kHz input tone Internal 4.3-V equivalent reference 9.6-kHz input tone UNIT Bits 200 Internal 4.3-V equivalent reference (2) Internal 4.3-V equivalent reference 9.6-kHz input tone ENOB MAX Spurious-free dynamic range dB dB clockcycles 4.3 (2) (5) V Reference voltage Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API to include the gain or offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3 V) as follows: Vref = 4.3 V × 1408 / 4095 1.48 V Reference voltage VDD as reference (Also known as RELATIVE) (input voltage scaling enabled) VDD V Reference voltage VDD as reference (Also known as RELATIVE) (input voltage scaling disabled) VDD / 2.82 (5) V Input Impedance 200 ksps, voltage scaling enabled. Capacitive input, input impedance depends on sampling frequency and sampling time >1 MΩ Using IEEE Std 1241™-2010 for terminology and test methods. Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24. For a typical example, see Figure 5-25. Applied voltage must be within absolute maximum ratings (see Section 5.1) at all times. Specifications Copyright © 2016–2019, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187D – AUGUST 2016 – REVISED JULY 2019 5.16 Temperature Sensor Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Resolution TYP MAX 4 Range –40 UNIT °C 85 °C Accuracy ±5 °C Supply voltage coefficient (1) 3.2 °C/V (1) Automatically compensated when using supplied driver libraries. 5.17 Battery Monitor Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Resolution TYP MAX 50 Range 1.8 Accuracy UNIT mV 3.8 13 V mV 5.18 Continuous Time Comparator Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDD V External reference voltage 0 VDD V Internal reference voltage DCOUPL as reference 1.27 Offset Hysteresis Decision time Step from –10 mV to +10 mV Current consumption when enabled (1) (1) V 3 mV