CC2652RSIPMOTR

CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 CC2652RSIP SimpleLink™ Multiprotocol 2.4-GHz Wireless System-in-Package 1 Features Wireless microcontroller • • • • • • • • Powerful 48-MHz Arm® Cortex®-M4F processor 352KB flash program memory 256KB of ROM for protocols and library functions 8KB of cache SRAM 80KB of ultra-low leakage SRAM with parity for high-reliability operation Dynamic multiprotocol manager (DMM) driver Programmable radio includes support for 2(G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC Supports over-the-air upgrade (OTA) Ultra-low power sensor controller • • • • Autonomous MCU with 4KB of SRAM Sample, store, and process sensor data Fast wake-up for low-power operation Software defined peripherals; capacitive touch, flow meter, LCD Low power consumption • • • MCU consumption: – 3.5 mA active mode, CoreMark – 74 μA/MHz running CoreMark – 1 μA standby mode, RTC, 80KB RAM – 160 nA shutdown mode, wake-up on pin Ultra low-power sensor controller consumption: – 30.1 μA in 2 MHz mode – 808 μA in 24 MHz mode Radio Consumption: – 7.3 mA RX at 2.4 GHz – 7.5 mA TX at 0 dBm – 9.8 mA TX at +5 dBm Wireless protocol support • • • • Thread, Zigbee®, Matter Bluetooth® 5.2 Low Energy SimpleLink™ TI 15.4-stack Proprietary systems High performance radio • • Regulatory compliance • Regulatory certification for compliance with worldwide radio frequency: – ETSI RED (Europe) / RER (UK) – ISED (Canada) – FCC (USA) MCU peripherals • • • • • • • • • Digital peripherals can be routed to any of 32 GPIOs Four 32-bit or eight 16-bit general-purpose timers 12-bit ADC, 200 kSamples/s, 8 channels 8-bit DAC Two comparators Programmable current source Two UART, two SSI, I2C, I2S Real-time clock (RTC) Integrated temperature and battery monitor Security enablers • • • • AES 128- and 256-bit cryptographic accelerator ECC and RSA public key hardware accelerator SHA2 Accelerator (full suite up to SHA-512) True random number generator (TRNG) Development tools and software • • • • • LP-CC2652PSIP Development Kit SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK) SmartRF™ Studio for simple radio configuration Sensor Controller Studio for building low-power sensing applications SysConfig system configuration tool Operating range • • • On-chip buck DC/DC converter 1.8-V to 3.8-V single supply voltage Tj: -40 to +105°C Package • • 7-mm × 7-mm MOT (32 GPIOs) RoHS-compliant package -103 dBm sensitivity for Bluetooth® Low Energy 125-kbps LE Coded PHY Output power up to +5 dBm with temperature compensation An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 2 Applications • • 2400 to 2480 MHz ISM and SRD systems 1 Building automation – Building security systems – motion detector, electronic smart lock, door and window sensor, garage door system, gateway – HVAC – thermostat, wireless environmental sensor, HVAC system controller, gateway – Fire safety system – smoke and heat detector, fire alarm control panel (FACP) – Elevators and escalators – elevator main control panel for elevators and escalators • • • • Industrial transport – asset tracking Medical Communication equipment – Wired networking – wireless LAN or Wi-Fi access points, edge router , small business router Personal electronics – Portable electronics – RF smart remote control – Home theater & entertainment – smart speakers, smart display, set-top box – Gaming – electronic and robotic toys – Wearables (non-medical) – smart trackers, smart clothing 3 Description The SimpleLink™ CC2652RSIP is a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include: • • • • • • • • Small 7-mm x 7-mm certified system-in-package module 2.4GHz with integrated DCDC components, balun, and crystal oscillators Wide flexibility of protocol stack support in the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK). Longer battery life wireless applications with low standby current of 1 µA with full RAM retention. Industrial temperature ready with lowest standby current of 11 µA at 105 ⁰C. Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current. Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards. Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-103 dBm for 125-kbps LE Coded PHY). The CC2652RSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform. Device Information PART NUMBER(1) CC2652RSIPMOTR (1) BODY SIZE (NOM) QFM (73) 7.00 mm × 7.00 mm For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 13, or see the TI website. 1 2 PACKAGE See RF Core for additional details on supported protocol standards, modulation formats, and data rates. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 4 Functional Block Diagram Figure 4-1 shows the functional block diagram of the CC2652RSIP module. 48-MHz 32.768-kHz Crystal Oscillator Crystal Oscillator 2.4 GHz ANT JTAG (1.8 V to 3.8 V) VDDS_PU RESET_N CC2652R User DIO_0-31 +5-dBm IPC RF (50 2.4 GHz) (1.8 V to 3.8 V) VDDS GND DCDC Passives Figure 4-1. CC2652RSIP Block Diagram Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 3 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Figure 4-2 shows an overview of the CC2652RSIP hardware. Figure 4-2. CC2652RSIP Hardware Overview 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 2 3 Description.......................................................................2 4 Functional Block Diagram.............................................. 3 5 Revision History.............................................................. 5 6 Device Comparison......................................................... 6 7 Terminal Configuration and Functions..........................7 7.1 Pin Diagram................................................................ 7 7.2 Signal Descriptions – SIP Package............................ 8 7.3 Connections for Unused Pins and Modules................9 8 Specifications................................................................ 10 8.1 Absolute Maximum Ratings...................................... 10 8.2 ESD Ratings............................................................. 10 8.3 Recommended Operating Conditions.......................10 8.4 Power Supply and Modules...................................... 10 8.5 Power Consumption - Power Modes.........................11 8.6 Power Consumption - Radio Modes......................... 12 8.7 Nonvolatile (Flash) Memory Characteristics............. 12 8.8 Thermal Resistance Characteristics......................... 12 8.9 RF Frequency Bands................................................ 12 8.10 Bluetooth Low Energy - Receive (RX).................... 13 8.11 Bluetooth Low Energy - Transmit (TX).................... 16 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX.................... 17 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX.....................18 8.14 Timing and Switching Characteristics..................... 18 8.15 Peripheral Characteristics.......................................22 8.16 Typical Characteristics............................................ 29 9 Detailed Description......................................................36 9.1 Overview................................................................... 36 9.2 System CPU............................................................. 36 9.3 Radio (RF Core)........................................................37 9.4 Memory..................................................................... 37 9.5 Sensor Controller...................................................... 39 9.6 Cryptography............................................................ 40 9.7 Timers....................................................................... 41 9.8 Serial Peripherals and I/O.........................................42 9.9 Battery and Temperature Monitor............................. 42 9.10 µDMA...................................................................... 42 9.11 Debug......................................................................42 9.12 Power Management................................................43 9.13 Clock Systems........................................................ 44 9.14 Network Processor..................................................44 9.15 Device Certification and Qualification..................... 45 9.16 Module Markings.....................................................47 9.17 End Product Labeling..............................................47 9.18 Manual Information to the End User....................... 47 10 Application, Implementation, and Layout................. 48 10.1 Application Information........................................... 48 10.2 Device Connection and Layout Fundamentals....... 49 10.3 PCB Layout Guidelines...........................................49 10.4 Reference Designs................................................. 53 10.5 Junction Temperature Calculation...........................54 11 Environmental Requirements and SMT Specifications ...............................................................55 11.1 PCB Bending...........................................................55 11.2 Handling Environment.............................................55 11.3 Storage Condition................................................... 55 11.4 PCB Assembly Guide..............................................55 11.5 Baking Conditions................................................... 56 11.6 Soldering and Reflow Condition..............................57 12 Device and Documentation Support..........................58 12.1 Device Nomenclature..............................................58 12.2 Tools and Software................................................. 58 12.3 Documentation Support.......................................... 61 12.4 Support Resources................................................. 61 12.5 Trademarks............................................................. 61 12.6 Electrostatic Discharge Caution..............................62 12.7 Glossary..................................................................62 13 Mechanical, Packaging, and Orderable Information.................................................................... 63 13.1 Packaging Information............................................ 63 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (February 2022) to Revision B (September 2022) Page • Updated development kit to LP-CC2652PSIP.................................................................................................... 1 • Updated CC2652RSIP Block diagram to include external antenna ...................................................................3 • Added RER (UK) to module comparison table................................................................................................... 6 • Corrected channel 16 to channel 26 in footnotes; Section 8.13 ...................................................................... 10 • Updated power limits based on allowable antenna gain in footnotes; Section 8.13 ........................................ 10 • List of certifications updated to include RER (UK)............................................................................................45 • Added UK certification section..........................................................................................................................46 • Added link to OEM integrators guide ............................................................................................................... 47 • Corrected development kit to be CC2652PSIP................................................................................................ 58 • Added module height and weight information ..................................................................................................63 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 5 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 6 Device Comparison 7 x 7 mm VQFN (48) 5 x 5 mm VQFN (40) 5 x 5 mm VQFN (32) 4 x 4 mm VQFN (32) +20 dBm PA Multiprotocol Thread ZigBee Bluetooth® LE Sidewalk PACKAGE SIZE FLASH (KB) RAM + Cache (KB) GPIO 32-128 16-20 + 8 10-30 352 32 + 8 22-30 352 32 + 8 26 X 352 80 + 8 30 X 704 144 + 8 30 X CC1310 X X CC1311R3 X X CC1311P3 X X CC1312R X X X CC1312R7 X X X CC1352R X X X X X X X X 352 80 + 8 28 X CC1352P X X X X X X X X X 352 80 + 8 26 X CC1352P7 X X X X X X X X X X X X X X X X X X 704 144 + 8 26 CC2640R2F X 128 20 + 8 10-31 CC2642R X 352 80 + 8 31 X CC2642R-Q1 X 352 80 + 8 31 X X 352 32 + 8 23-31 X X 352 32 + 8 22-26 X X X X X CC2651R3 X X X CC2651P3 X X X CC2652R X X X X X 352 80 + 8 31 X CC2652RB X X X X X 352 80 + 8 31 X CC2652R7 X X X X X 704 144 + 8 31 X CC2652P X X X X X X 352 80 + 8 26 X CC2652P7 X X X X X X 704 144 + 8 26 X X X X X X X X X X CC2651R3SIP A X X CC2652RSIP X X X CC2652PSIP X X X X Japan RER (UK) GPIO X 128 20+8 15 352 32 + 8 32 X 352 80 + 8 32 X X 352 80 + 8 30 X X Submit Document Feedback 16.9 x 11.0 QFM (29) X FLAS RAM + H (KB) Cache (KB) 7 x 7 QFM (59) CE X PACKAGE SIZE 7 x 7 QFM (73) FCC/IC X +10 dBm PA ZigBee CERTIFICATIONS Bluetooth® LE External RADIO SUPPORT X Module CC2650MODA X Integrated ANTENNA 6 Wi-SUN® Wireless M-Bus 2.4 GHz Prop. Device Sub-1 GHz Prop. RADIO SUPPORT X X Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 7 Terminal Configuration and Functions DIO_22 DIO_21 DIO_20 DIO_19 DIO_18 DIO_31 47 46 45 44 43 42 41 40 39 38 3 DIO_23 DIO_28 DIO_24 2 VDDS DIO_27 VDDS_PU 1 DIO_25 DIO_26 48 7.1 Pin Diagram 37 DIO_17 36 DIO_16 35 JTAG_TCKC 34 JTAG_TMSC CC2652RSIP 59 60 61 62 63 31 DIO_13 DIO_30 8 64 65 66 67 68 30 DIO_12 GND 9 69 70 71 72 73 29 DIO_11 GND 10 28 DIO_10 GND 11 27 DIO_9 GND 12 26 DIO_8 GND 13 25 DIO_7 24 7 23 DIO_29 22 DIO_14 21 32 20 58 19 57 18 56 17 55 16 54 15 6 14 NC DIO_6 DIO_15 DIO_5 33 DIO_4 53 DIO_1 52 DIO_2 51 GND 50 RF 49 GND 5 GND GND DIO_3 4 DIO_0 nRESET Figure 7-1. MOT (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View) The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities: • • • • • • Pin 23, DIO_5 Pin 24, DIO_6 Pin 25, DIO_7 Pin 34, JTAG_TMSC Pin 36, DIO_16 Pin 37, DIO_17 The following I/O pins marked in Figure 7-1 in italics have analog capabilities: • • • • • • • • Pin 1, DIO_26 Pin 2, DIO_27 Pin 3, DIO_28 Pin 7, DIO_29 Pin 8, DIO_30 Pin 44, DIO_23 Pin 45, DIO_24 Pin 48, DIO_25 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 7 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 7.2 Signal Descriptions – SIP Package Table 7-1. Signal Descriptions – SIP Package PIN 8 I/O TYPE 14 I/O Digital GPIO DIO_1 21 I/O Digital GPIO DIO_10 28 I/O Digital GPIO DIO_11 29 I/O Digital GPIO DIO_12 30 I/O Digital GPIO DIO_13 31 I/O Digital GPIO DIO_14 32 I/O Digital GPIO DIO_15 33 I/O Digital GPIO DIO_16 36 I/O Digital GPIO, JTAG_TDO, high-drive capability DIO_17 37 I/O Digital GPIO, JTAG_TDI, high-drive capability DIO_18 39 I/O Digital GPIO DIO_19 40 I/O Digital GPIO DIO_2 20 I/O Digital GPIO DIO_20 41 I/O Digital GPIO DIO_21 42 I/O Digital GPIO DIO_22 43 I/O Digital GPIO DIO_23 44 I/O Digital or Analog GPIO, analog capability DIO_24 45 I/O Digital or Analog GPIO, analog capability DIO_25 48 I/O Digital or Analog GPIO, analog capability DIO_26 1 I/O Digital or Analog GPIO, analog capability DIO_27 2 I/O Digital or Analog GPIO, analog capability DIO_28 3 I/O Digital or Analog GPIO, analog capability DIO_29 7 I/O Digital or Analog GPIO, analog capability DIO_3 15 I/O Digital DIO_30 8 I/O Digital or Analog DIO_31(1) 38 I/O Digital Supports only peripheral functionality. Does not support general purpose I/O functionality. DIO_4 22 I/O Digital GPIO DIO_5 23 I/O Digital GPIO, high-drive capability DIO_6 24 I/O Digital GPIO, high-drive capability DIO_7 25 I/O Digital GPIO, high-drive capability DIO_8 26 I/O Digital GPIO DIO_9 27 I/O Digital GPIO GND 5 — — GND GND 9 — — GND GND 10 — — GND GND 11 — — GND GND 12 — — GND GND 13 — — GND GND 16 — — GND GND 17 — — GND GND 19 — — GND GND 49-73 — — GND NAME NO. DIO_0 DESCRIPTION GPIO GPIO, analog capability Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Table 7-1. Signal Descriptions – SIP Package (continued) PIN NAME I/O NO. TYPE DESCRIPTION NC 6 — — nRESET 4 I Digital RF 18 — RF JTAG_TCKC 35 I Digital JTAG_TCKC JTAG_TMSC 34 I/O Digital JTAG_TMSC, high-drive capability VDDS 46 — Power 1.8-V to 3.8-V main SIP supply VDDS_PU 47 — Power Power to reset internal pullup resistor (1) No Connect Reset, active low. Internal pullup resistor to VDDS_PU 50 ohm RF port PORT_ID = 0x00 is not supported. See the SimpleLink™ CC13x2, CC26x2 Wireless MCU Technical Reference Manual for further details. 7.3 Connections for Unused Pins and Modules Table 7-2. Connections for Unused Pins – SIP Package FUNCTION SIGNAL NAME GPIO DIO_n No Connects NC (1) PIN NUMBER ACCEPTABLE PRACTICE(1) PREFERRED PRACTICE(1) 1-3 7-8 14-15 20-33 36-45 48 NC or GND NC 6 NC NC NC = No connect Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 9 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) (2) VDDS(3) Supply voltage Voltage on any digital Vin pin(4) (5) Voltage on ADC input MIN MAX –0.3 4.1 V V –0.3 VDDS + 0.3, max 4.1 Voltage scaling enabled –0.3 VDDS Voltage scaling disabled, internal reference –0.3 1.49 Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9 –40 150 Input level, RF pin Tstg (1) (2) (3) (4) (5) 5 Storage temperature UNIT V dBm °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to ground, unless otherwise noted. VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS. Including analog capable DIOs. Injection current is not supported on any GPIO pin 8.2 ESD Ratings VESD (1) (2) Electrostatic discharge VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins ±2000 V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) All pins ±500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operating junction temperature(1) –40 105 °C Operating supply voltage (VDDS) 1.8 3.8 V Rising supply voltage slew rate 0 100 mV/µs Falling supply voltage slew rate 0 20 mV/µs (1) For thermal resistance characteristics refer to Section 8.8. 8.4 Power Supply and Modules over operating free-air temperature range (unless otherwise noted) PARAMETER MIN VDDS Power-on-Reset (POR) threshold TYP 1.1 MAX 1.5 UNIT V VDDS Brown-out Detector (BOD) Rising threshold 1.77 V VDDS Brown-out Detector (BOD), before initial boot (1) Rising threshold 1.70 V VDDS Brown-out Detector (BOD) Falling threshold 1.75 V (1) 10 Brown-out Detector is trimmed at initial boot, value is kept until device is reset by a POR reset or the nRESET pin Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.5 Power Consumption - Power Modes When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. PARAMETER TEST CONDITIONS TYP UNIT Core Current Consumption 30 µA 160 nA RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF 0.99 µA RTC running, CPU, 80KB RAM and (partial) register retention XOSC_LF 1.15 µA RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF 3.36 µA RTC running, CPU, 80KB RAM and (partial) register retention. XOSC_LF 3.47 µA Idle Supply Systems and RAM powered RCOSC_HF 708 µA Active MCU running CoreMark at 48 MHz RCOSC_HF 3.5 mA Peripheral power domain Delta current with domain enabled 102 Serial power domain Delta current with domain enabled 7.56 RF Core Delta current with power domain enabled, clock enabled, RF core idle 221 µDMA Delta current with clock enabled, module is idle 67.1 Timers Delta current with clock enabled, module is idle(4) 85.1 I2C Delta current with clock enabled, module is idle 10.6 I2S Delta current with clock enabled, module is idle 27.6 SSI Delta current with clock enabled, module is idle UART Delta current with clock enabled, module is idle(2) 175.9 CRYPTO (AES) Delta current with clock enabled, module is idle(3) 26.9 PKA Delta current with clock enabled, module is idle 88.9 TRNG Delta current with clock enabled, module is idle 37.4 Standby without cache retention Icore Reset. nRESET pin asserted or VDDS below power-on-reset threshold(1) Shutdown. No clocks running, no retention Reset and Shutdown Standby with cache retention Peripheral Current Consumption Iperi µA 90.2 Sensor Controller Engine Consumption ISCE (1) (2) (3) (4) Active mode 24 MHz, infinite loop 808 Low-power mode 2 MHz, infinite loop 30.1 µA CC2652xSIP integrates a 100 kΩ pull-up resistor on nRESET Only one UART running Only one SSI running Only one GPTimer running Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 11 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.6 Power Consumption - Radio Modes When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. PARAMETER TEST CONDITIONS Radio receive current Radio transmit current 2.4 GHz PA (Bluetooth Low Energy) TYP UNIT 2440 MHz 7.3 mA 0 dBm output power setting 2440 MHz 7.9 mA +5 dBm output power setting 2440 MHz 10.9 mA 8.7 Nonvolatile (Flash) Memory Characteristics Over operating free-air temperature range and VDDS = 3.0 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP Flash sector size MAX 8 UNIT KB Supported flash erase cycles before failure, full bank(1) (5) 30 k Cycles Supported flash erase cycles before failure, single sector(2) 60 k Cycles Maximum number of write operations per row before sector erase(3) 83 Flash retention 105 °C Flash sector erase current Average delta current 9.7 mA Zero cycles 10 ms Flash sector erase time(4) Average delta current, 4 bytes at a time Flash write time(4) 4 bytes at a time (3) (4) (5) Years 30k cycles Flash write current (1) (2) 11.4 Write Operations 4000 ms 5.3 mA 21.6 µs A full bank erase is counted as a single erase cycle on each sector Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k cycles Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum per write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum number of write operations per row is reached. This number is dependent on Flash aging and increases over time and erase cycles Aborting flash during erase or program modes is not a safe operation. 8.8 Thermal Resistance Characteristics PACKAGE MOT (SIP) THERMAL METRIC(1) UNIT 73 PINS RθJA Junction-to-ambient thermal resistance 48.7 °C/W(2) RθJC(top) Junction-to-case (top) thermal resistance 12.4 °C/W(2) RθJB Junction-to-board thermal resistance 32.2 °C/W(2) ψJT Junction-to-top characterization parameter 0.40 °C/W(2) ψJB Junction-to-board characterization parameter 32.0 °C/W(2) (1) (2) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. °C/W = degrees Celsius per watt. 8.9 RF Frequency Bands Over operating free-air temperature range (unless otherwise noted). PARAMETER Frequency bands 12 MIN 2360 Submit Document Feedback TYP MAX UNIT 2500 MHz Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.10 Bluetooth Low Energy - Receive (RX) When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 125 kbps (LE Coded) Receiver sensitivity Differential mode. BER = 10–3 –103 dBm Receiver saturation Differential mode. BER = 10–3 >5 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–320 / 240) ppm Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–100 / 100) ppm Co-channel rejection(1) Wanted signal at –79 dBm, modulated interferer in channel, BER = 10–3 Selectivity, ±1 MHz(1) –1.5 dB Wanted signal at –79 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4.5(2) dB Selectivity, ±2 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±2 MHz, BER = 10–3 44 / 37(2) dB Selectivity, ±3 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±3 MHz, BER = 10–3 46 / 44(2) dB Selectivity, ±4 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±4 MHz, BER = 10–3 44 / 46(2) dB Selectivity, ±6 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±6 MHz, BER = 10–3 48 / 44(2) dB Selectivity, ±7 MHz Wanted signal at –79 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 51 / 45(2) dB Selectivity, Image frequency(1) Wanted signal at –79 dBm, modulated interferer at image frequency, BER = 10–3 37 dB Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –79 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4.5 / 44 (2) dB 500 kbps (LE Coded) Receiver sensitivity Differential mode. BER = 10–3 –98 dBm Receiver saturation Differential mode. BER = 10–3 >5 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–350 / 350) ppm Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–150 / 175) ppm Co-channel rejection(1) Wanted signal at –72 dBm, modulated interferer in channel, BER = 10–3 Selectivity, ±1 MHz(1) –3.5 dB Wanted signal at –72 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4(2) dB Selectivity, ±2 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±2 MHz, BER = 10–3 43 / 35(2) dB Selectivity, ±3 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±3 MHz, BER = 10–3 46 / 46(2) dB Selectivity, ±4 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±4 MHz, BER = 10–3 45 / 47(2) dB Selectivity, ±6 MHz(1) Wanted signal at –72 dBm, modulated interferer at ≥ ±6 MHz, BER = 10–3 46 / 45(2) dB Selectivity, ±7 MHz Wanted signal at –72 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 49 / 45(2) dB Selectivity, Image frequency(1) Wanted signal at –72 dBm, modulated interferer at image frequency, BER = 10–3 35 dB Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 13 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER Selectivity, Image frequency ±1 MHz(1) TEST CONDITIONS Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –72 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 MIN TYP 4 / 46(2) MAX UNIT dB 1 Mbps (LE 1M) Receiver sensitivity Differential mode. BER = 10–3 –96 dBm Receiver saturation Differential mode. BER = 10–3 >5 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–350 / 350) kHz Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–650 / 750) ppm Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 Selectivity, ±1 MHz(1) –6 dB Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 4(2) dB Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz,BER = 10–3 39 / 33(2) dB Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 36 / 40(2) dB Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 36 / 45(2) dB Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 40 dB Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 33 dB Selectivity, image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 41(2) dB Out-of-band blocking(3) 30 MHz to 2000 MHz –10 dBm Out-of-band blocking 2003 MHz to 2399 MHz –18 dBm Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –2 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level –42 dBm Spurious emissions, 30 to 1000 MHz(4) Measurement in a 50-Ω single-ended load. < –59 dBm Spurious emissions, 1 to 12.75 GHz(4) Measurement in a 50-Ω single-ended load. < –47 dBm RSSI dynamic range 70 dB RSSI accuracy ±4 dB 2 Mbps (LE 2M) Receiver sensitivity Differential mode. Measured at SMA connector, BER = 10–3 –90 dBm Receiver saturation Differential mode. Measured at SMA connector, BER = 10–3 >5 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–500 / 500) kHz Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–700 / 750) ppm Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel,BER = 10–3 Selectivity, ±2 MHz(1) Selectivity, ±4 MHz(1) 14 –7 dB Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz, BER = 10–3 8 / 4(2) dB Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 36 / 34(2) dB Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Selectivity, ±6 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10–3 Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 Selectivity, image frequency ±2 MHz(1) Note that Image frequency + 2 MHz is the Co-channel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10–3 Out-of-band blocking(3) 30 MHz to 2000 MHz –16 dBm Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –12 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2408 and 2414 MHz respectively, at the given power level –38 dBm (1) (2) (3) (4) 37 / 36(2) dB 4 dB –7 / 36(2) dB Numbers given as I/C dB X / Y, where X is +N MHz and Y is –N MHz Excluding one exception at Fwanted / 2, per Bluetooth Specification Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 15 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.11 Bluetooth Low Energy - Transmit (TX) When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters Max output power Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm Output power programmable range Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB Spurious emissions and harmonics Spurious emissions f < 1 GHz, outside restricted bands < –36 dBm f < 1 GHz, restricted bands ETSI < –54 dBm f < 1 GHz, restricted bands FCC < –55 dBm < –42 dBm Second harmonic < -42 dBm Third harmonic < -42 dBm f > 1 GHz, including harmonics Harmonics 16 +5 dBm setting Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters Receiver sensitivity PER = 1% –98 dBm Receiver saturation PER = 1% >5 dBm Adjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1% 36 dB Alternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1% 57 dB Channel rejection, ±15 MHz or more Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1% 59 dB Blocking and desensitization, 5 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 57 dB Blocking and desensitization, 10 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 62 dB Blocking and desensitization, 20 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 62 dB Blocking and desensitization, 50 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Blocking and desensitization, –5 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 59 dB Blocking and desensitization, –10 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 59 dB Blocking and desensitization, –20 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, –50 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Spurious emissions, 30 MHz to 1000 MHz Measurement in a 50-Ω single-ended load –66 dBm Spurious emissions, 1 GHz to 12.75 GHz Measurement in a 50-Ω single-ended load –53 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > 350 ppm Symbol rate error tolerance Difference between incoming symbol rate and the internally generated symbol rate > 1000 ppm RSSI dynamic range 95 dB RSSI accuracy ±4 dB Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 17 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX When measured on the CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters Max output power(1) Differential mode, delivered to a single-ended 50-Ω load through a balun 5 dBm Output power programmable range Differential mode, delivered to a single-ended 50-Ω load through a balun 26 dB Spurious emissions and harmonics Spurious emissions(1) Harmonics (1) f < 1 GHz, outside restricted bands < -36 dBm f < 1 GHz, restricted bands ETSI < -47 dBm f < 1 GHz, restricted bands FCC < -55 dBm f > 1 GHz, including harmonics < –42 dBm Second harmonic < -42 dBm Third harmonic < -42 dBm +5 dBm setting IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) Error vector magnitude (1) +5 dBm setting 2 % To meet the FCC 15.247 Part 15 (US) Band Edge requirement, Channel 26 output power is limited to 2 dBm and 0 dBm when using a max antenna gain of 3.3 dBi and 5.3 dBi, respectively. 8.14 Timing and Switching Characteristics 8.14.1 Reset Timing PARAMETER MIN nRESET low duration TYP MAX UNIT 1 µs 8.14.2 Wakeup Timing Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not include software overhead. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT MCU, Reset to Active(1) 850 - 4000 µs MCU, Shutdown to Active(1) 850 - 4000 µs MCU, Standby to Active 165 µs MCU, Active to Standby 36 µs MCU, Idle to Active 14 µs (1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has been in Reset or Shutdown before starting up again. 8.14.3 Clock Specifications 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF) Measured on a CC2652xSIP-EM reference design with integrated 48 MHz crystal including parameters based on external manufacturer's crystal specification at Tc = 25 °C, VDDS = 3.0 V at initial time, unless otherwise noted. MIN TYP Crystal frequency Start-up time(1) Crystal aging at 10 years(2) 18 UNIT MHz 200 Initial crystal frequency tolerance(2) (1) MAX 48 µs -16 18 ppm -4 2 ppm/year Start-up time using the TI-provided power driver. Start-up time may increase if driver is not used. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com (2) SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 External manufacturer's crystal specification 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF) Measured on a CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN TYP MAX UNIT Frequency 48 MHz Uncalibrated frequency accuracy ±1 % Calibrated frequency accuracy(1) ±0.25 % 5 µs Start-up time (1) Accuracy relative to the calibration source (XOSC_HF) 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF) Measured on a CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN TYP MAX UNIT Calibrated frequency 2 MHz Start-up time 5 µs 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF) Measured on a CC2652xSIP-EM reference design with integrated 32.768 kHz crystal including parameters based on external manufacturer's crystal specification at Tc = 25 °C, VDDS = 3.0 V at initial time, unless otherwise noted. MIN MAX UNIT -20 20 ppm -3 3 ppm/year Crystal frequency 32.768 Initial crystal frequency tolerance(1) Crystal aging at 1st year(1) (1) TYP kHz External manufacturer's crystal specification 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF) Measured on a CC2652xSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN TYP Calibrated frequency 32.8 Temperature coefficient. (1) MAX UNIT (1) kHz 50 ppm/°C When using RCOSC_LF as source for the low frequency system clock (SCLK_LF), the accuracy of the SCLK_LF-derived Real Time Clock (RTC) can be improved by measuring RCOSC_LF relative to XOSC_HF and compensating for the RTC tick speed. This functionality is available through the TI-provided Power driver. 8.14.4 Synchronous Serial Interface (SSI) Characteristics 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER NO. PARAMETER MIN TYP UNIT 65024 System Clocks (2) S1 tclk_per SSIClk cycle time S2(1) tclk_high SSIClk high time 0.5 tclk_per S3(1) tclk_low SSIClk low time 0.5 tclk_per (1) (2) 12 MAX Refer to SSI timing diagrams Figure 8-1, Figure 8-2, and Figure 8-3. When using the TI-provided Power driver, the SSI system clock is always 48 MHz. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 19 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 S1 S2 SSIClk S3 SSIFss SSITx SSIRx MSB LSB 4 to 16 bits Figure 8-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement S2 S1 SSIClk S3 SSIFss SSITx MSB LSB 8-bit control SSIRx 0 MSB LSB 4 to 16 bits output data Figure 8-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer 20 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 S1 S2 SSIClk (SPO = 0) S3 SSIClk (SPO = 1) SSITx (Controller) MSB SSIRx (Peripheral) MSB LSB LSB SSIFss Figure 8-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 8.14.5 UART Table 8-1. UART Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER MIN UART rate TYP MAX 3 UNIT MBaud Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 21 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.15 Peripheral Characteristics 8.15.1 ADC Analog-to-Digital Converter (ADC) Characteristics Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1) Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers. PARAMETER TEST CONDITIONS Input voltage range MIN TYP 0 Resolution –0.24 LSB Internal 4.3 V equivalent reference(2) 7.14 LSB >–1 LSB ±4 LSB Integral nonlinearity Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone reference(2), Internal 4.3 V equivalent 9.6 kHz input tone, DC/DC enabled Effective number of bits Total harmonic distortion Signal-to-noise and distortion ratio 200 kSamples/s, 9.8 9.8 VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 10.1 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone 11.1 Internal reference, voltage scaling disabled, 14-bit mode, 200 kSamples/s, 600 Hz input tone (5) 11.3 Internal reference, voltage scaling disabled, 15-bit mode, 200 kSamples/s, 150 Hz input tone (5) 11.6 Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone –65 VDDS as reference, 200 kSamples/s, 9.6 kHz input tone –70 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone –72 Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone 60 VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 63 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone 68 Internal 4.3 V equivalent 9.6 kHz input tone 22 ksps Gain error INL SFDR Bits 200 Internal 4.3 V equivalent reference(2) Differential nonlinearity SINAD, SNDR V Offset DNL(4) THD UNIT 12 Sample Rate ENOB MAX VDDS reference(2), 200 kSamples/s, 73 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone 75 Serial conversion, time-to-output, 24 MHz clock Current consumption Internal 4.3 V equivalent reference(2) Current consumption VDDS as reference Reference voltage Equivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/ offset compensation factors stored in FCFG1 Reference voltage Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3 V) as follows: Vref = 4.3 V × 1408 / 4095 Reference voltage Reference voltage dB dB 70 Spurious-free dynamic range VDDS as reference, 200 kSamples/s, 9.6 kHz input tone Conversion time Bits 50 dB Clock Cycles 0.42 mA 0.6 mA 4.3(2) (3) V 1.48 V VDDS as reference, input voltage scaling enabled VDDS V VDDS as reference, input voltage scaling disabled VDDS / 2.82(3) V Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1) Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers. PARAMETER Input impedance (1) (2) (3) (4) (5) TEST CONDITIONS MIN 200 kSamples/s, voltage scaling enabled. Capacitive input, Input impedance depends on sampling frequency and sampling time TYP MAX >1 UNIT MΩ Using IEEE Std 1241-2010 for terminology and test methods Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V Applied voltage must be within Absolute Maximum Ratings (see Section 8.1 ) at all times No missing codes ADC_output = Σ(4n samples ) >> n, n = desired extra bits 8.15.2 DAC 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters Resolution VDDS FDAC Supply voltage Clock frequency Voltage output settling time 8 1.8 3.8 External Load(4), any VREF, pre-charge OFF, DAC charge-pump OFF 2.0 3.8 Any load, VREF = DCOUPL, pre-charge ON 2.6 3.8 Buffer ON (recommended for external load) 16 250 Buffer OFF (internal load) 16 1000 VREF = VDDS, buffer OFF, internal load VREF = VDDS, buffer ON, external capacitive load = 20 13 pF(3) 20 External resistive load 200 10 kHz pF MΩ Short circuit current 400 VDDS = 3.8 V, DAC charge-pump OFF 51.1 VDDS = 3.0 V, DAC charge-pump ON 53.1 VDDS = 3.0 V, DAC charge-pump OFF 54.3 Max output impedance Vref = VDDS, buffer ON, CLK 250 VDDS = 2.0 V, DAC charge-pump ON kHz VDDS = 2.0 V, DAC charge-pump OFF V 1 / FDAC 13.8 External capacitive load ZMAX Bits Any load, any VREF, pre-charge OFF, DAC charge-pump ON 48.7 µA kΩ 70.2 VDDS = 1.8 V, DAC charge-pump ON 49.4 VDDS = 1.8 V, DAC charge-pump OFF 79.2 Internal Load - Continuous Time Comparator / Low Power Clocked Comparator Differential nonlinearity VREF = VDDS, load = Continuous Time Comparator or Low Power Clocked Comparator FDAC = 250 kHz ±1 Differential nonlinearity VREF = VDDS, load = Continuous Time Comparator or Low Power Clocked Comparator FDAC = 16 kHz ±1.2 DNL Offset error(2) Load = Continuous Time Comparator LSB(1) VREF = VDDS = 3.8 V ±0.64 VREF = VDDS= 3.0 V ±0.81 VREF = VDDS = 1.8 V ±1.27 VREF = DCOUPL, pre-charge ON ±3.43 VREF = DCOUPL, pre-charge OFF ±2.88 VREF = ADCREF ±2.37 LSB(1) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 23 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER Offset error(2) Load = Low Power Clocked Comparator Max code output voltage variation(2) Load = Continuous Time Comparator Max code output voltage variation(2) Load = Low Power Clocked Comparator Output voltage range(2) Load = Continuous Time Comparator Output voltage range(2) Load = Low Power Clocked Comparator TEST CONDITIONS MIN TYP VREF = VDDS= 3.8 V ±0.78 VREF = VDDS = 3.0 V ±0.77 VREF = VDDS= 1.8 V ±3.46 VREF = DCOUPL, pre-charge ON ±3.44 VREF = DCOUPL, pre-charge OFF ±4.70 VREF = ADCREF ±4.11 VREF = VDDS = 3.8 V ±1.53 VREF = VDDS = 3.0 V ±1.71 VREF = VDDS= 1.8 V ±2.10 VREF = DCOUPL, pre-charge ON ±6.00 VREF = DCOUPL, pre-charge OFF ±3.85 VREF = ADCREF ±5.84 VREF = VDDS= 3.8 V ±2.92 VREF =VDDS= 3.0 V ±3.06 VREF = VDDS= 1.8 V ±3.91 VREF = DCOUPL, pre-charge ON ±7.84 VREF = DCOUPL, pre-charge OFF ±4.06 VREF = ADCREF ±6.94 VREF = VDDS = 3.8 V, code 1 0.03 VREF = VDDS = 3.8 V, code 255 3.62 VREF = VDDS= 3.0 V, code 1 0.02 VREF = VDDS= 3.0 V, code 255 2.86 VREF = VDDS= 1.8 V, code 1 0.01 VREF = VDDS = 1.8 V, code 255 1.71 VREF = DCOUPL, pre-charge OFF, code 1 0.01 VREF = DCOUPL, pre-charge OFF, code 255 1.21 VREF = DCOUPL, pre-charge ON, code 1 1.27 VREF = DCOUPL, pre-charge ON, code 255 2.46 VREF = ADCREF, code 1 0.01 VREF = ADCREF, code 255 1.41 VREF = VDDS = 3.8 V, code 1 0.03 VREF = VDDS= 3.8 V, code 255 3.61 VREF = VDDS= 3.0 V, code 1 0.02 VREF = VDDS= 3.0 V, code 255 2.85 VREF = VDDS = 1.8 V, code 1 0.01 VREF = VDDS = 1.8 V, code 255 1.71 VREF = DCOUPL, pre-charge OFF, code 1 0.01 VREF = DCOUPL, pre-charge OFF, code 255 1.21 VREF = DCOUPL, pre-charge ON, code 1 1.27 VREF = DCOUPL, pre-charge ON, code 255 2.46 VREF = ADCREF, code 1 0.01 VREF = ADCREF, code 255 1.41 MAX UNIT LSB(1) LSB(1) LSB(1) V V External Load INL Integral nonlinearity DNL Differential nonlinearity 24 VREF = VDDS, FDAC = 250 kHz ±1 VREF = DCOUPL, FDAC = 250 kHz ±1 VREF = ADCREF, FDAC = 250 kHz ±1 VREF = VDDS, FDAC = 250 kHz ±1 Submit Document Feedback LSB(1) LSB(1) Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER Offset error Max code output voltage variation Output voltage range Load = Low Power Clocked Comparator (1) (2) (3) (4) TEST CONDITIONS MIN TYP VREF = VDDS= 3.8 V ±0.35 VREF = VDDS= 3.0 V ±0.50 VREF = VDDS = 1.8 V ±0.75 VREF = DCOUPL, pre-charge ON ±1.55 VREF = DCOUPL, pre-charge OFF ±1.30 VREF = ADCREF ±1.10 VREF = VDDS= 3.8 V ±1.00 VREF = VDDS= 3.0 V ±1.00 VREF = VDDS= 1.8 V ±1.00 VREF = DCOUPL, pre-charge ON ±3.45 VREF = DCOUPL, pre-charge OFF ±2.10 VREF = ADCREF ±1.90 VREF = VDDS = 3.8 V, code 1 0.03 VREF = VDDS = 3.8 V, code 255 3.59 VREF = VDDS = 3.0 V, code 1 0.02 VREF = VDDS= 3.0 V, code 255 2.82 VREF = VDDS= 1.8 V, code 1 0.01 VREF = VDDS = 1.8 V, code 255 1.70 VREF = DCOUPL, pre-charge OFF, code 1 0.01 VREF = DCOUPL, pre-charge OFF, code 255 1.21 VREF = DCOUPL, pre-charge ON, code 1 1.27 VREF = DCOUPL, pre-charge ON, code 255 2.46 VREF = ADCREF, code 1 0.01 VREF = ADCREF, code 255 1.42 MAX UNIT LSB(1) LSB(1) V 1 LSB (VREF 3.8 V/3.0 V/1.8 V/DCOUPL/ADCREF) = 14.10 mV/11.13 mV/6.68 mV/4.67 mV/5.48 mV Includes comparator offset A load > 20 pF will increases the settling time Keysight 34401A Multimeter Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 25 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.15.3 Temperature and Battery Monitor 8.15.3.1 Temperature Sensor Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Resolution MAX UNIT 2 °C Accuracy -40 °C to 0 °C ±4.0 °C Accuracy 0 °C to 105 °C ±2.5 °C 3.6 °C/V Supply voltage (1) coefficient(1) The temperature sensor is automatically compensated for VDDS variation when using the TI-provided driver. 8.15.3.2 Battery Monitor Measured on a Texas Instruments reference design with Tc = 25 °C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Resolution MAX 25 Range 1.8 Integral nonlinearity (max) Accuracy TYP mV 3.8 V 23 mV 22.5 mV Offset error -32 mV Gain error -1 % 26 VDDS = 3.0 V UNIT Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.15.4 Comparators 8.15.4.1 Low-Power Clocked Comparator Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Input voltage range Clock frequency MAX UNIT VDDS V SCLK_LF Internal reference voltage(1) Using internal DAC with VDDS as reference voltage, DAC code = 0 - 255 Offset Measured at VDDS / 2, includes error from internal DAC Decision time (1) TYP 0 0.024 - 2.865 Step from –50 mV to 50 mV V ±5 mV 1 Clock Cycle The comparator can use an internal 8 bits DAC as its reference. The DAC output voltage range depends on the reference voltage selected. See Section 8.15.2.1 8.15.4.2 Continuous Time Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Input voltage range(1) TYP 0 Offset Measured at VDDS / 2 Decision time Step from –10 mV to 10 mV Current consumption Internal reference (1) MIN MAX UNIT VDDS ±5 V mV 0.78 µs 8.6 µA The input voltages can be generated externally and connected throughout I/Os or an internal reference voltage can be generated using the DAC 8.15.5 Current Source 8.15.5.1 Programmable Current Source Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Current source programmable output range (logarithmic range) Resolution MIN TYP MAX UNIT 0.25 - 20 µA 0.25 µA Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 27 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.15.6 GPIO 8.15.6.1 GPIO DC Characteristics PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = 25 °C, VDDS = 1.8 V GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 1.56 V GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.24 V GPIO VOH at 4 mA load IOCURR = 1 1.59 V GPIO VOL at 4 mA load IOCURR = 1 0.21 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 73 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 19 µA GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.08 V GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 0.73 V GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.35 V GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 2.59 V GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.42 V GPIO VOH at 4 mA load IOCURR = 1 2.63 V GPIO VOL at 4 mA load IOCURR = 1 0.40 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 282 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 110 µA GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.97 V GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 1.55 V GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.42 V TA = 25 °C, VDDS = 3.0 V TA = 25 °C, VDDS = 3.8 V TA = 25 °C VIH Lowest GPIO input voltage reliably interpreted as a High VIL Highest GPIO input voltage reliably interpreted as a Low 28 Submit Document Feedback 0.8*VDDS V 0.2*VDDS V Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.16 Typical Characteristics All measurements in this section are done with Tc = 25 °C and VDDS = 3.0 V, unless otherwise noted. See Recommended Operating Conditions for device limits. Values exceeding these limits are for reference only. 8.16.1 MCU Current Running CoreMark, SCLK_HF = 48 MHz RCOSC 80 kB RAM Retention, no Cache Retention, RTC On, SCLK_LF = 32 kHZ XOSC 8 6 7 5.5 6 Current [uA] Current [mA] 5 4.5 4 5 4 3 2 3.5 1 3 0 -40 2.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 -25 -10 5 20 35 50 65 80 95 105 Temperature [ oC] 3.8 Figure 8-5. Standby Mode (MCU) Current vs. Temperature Voltage [V] Figure 8-4. Active Mode (MCU) Current vs. Supply Voltage (VDDS) 8.16.2 RX Current 8 11 7.9 10.5 7.8 10 7.7 9.5 Current [mA] Current [mA] 7.6 7.5 7.4 7.3 7.2 9 8.5 8 7.5 7.1 7 7 6.5 6.9 6 6.8 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [ oC] 100105 5.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Figure 8-6. RX Current vs. Temperature (BLE 1 Mbps, 2.44 GHz) Figure 8-7. RX Current vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 29 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.3 9.15 9 8.85 8.7 8.55 8.4 8.25 8.1 7.95 7.8 7.65 7.5 7.35 7.2 7.05 6.9 6.75 6.6 6.45 6.3 -40 12.1 11.95 11.8 11.65 11.5 Current [mA] Current [mA] 8.16.3 TX Current 11.35 11.2 11.05 10.9 10.75 10.6 10.45 10.3 10.15 -25 -10 5 20 35 50 65 80 95 10 -40 105 -25 -10 5 Temperature [ oC] 20 35 50 65 80 95 105 Temperature [ oC] Figure 8-8. TX Current vs. Temperature (BLE 1 Mbps, 2.44 GHz, 0 dBm) Figure 8-9. TX Current vs. Temperature (BLE 1 Mbps, 2.44 GHz, +5 dBm) 12.5 16.5 16 12 15.5 11.5 15 11 14.5 14 Current [mA] Current [mA] 10.5 10 9.5 9 8.5 13.5 13 12.5 12 11.5 11 10.5 8 10 7.5 9.5 9 7 6.5 1.8 8.5 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 8 1.8 2 2.2 2.4 2.6 Voltage [V] 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Figure 8-10. TX Current vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, 0 dBm) Figure 8-11. TX Current vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +5 dBm) Table 8-2 shows typical TX current and output power for different output power settings. Table 8-2. Typical TX Current and Output Power CC2652RSIP at 2.44 GHz, VDDS = 3.0 V (Measured on CC2652XSIP_EM) 30 txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA] 0xA03A 5 4.54 10.87 0x6620 4 3.49 9.89 0x5869 3 2.67 9.46 0x4060 2 1.53 8.81 0x3CA0 1 0.42 8.34 0x2E9C 0 -0.49 7.97 0x38DE -3 -3.15 7.23 0x1CD7 -5 -5.19 6.70 0x16D5 -6 -6.05 6.52 0x0AD0 -9 -8.94 6.04 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Table 8-2. Typical TX Current and Output Power (continued) CC2652RSIP at 2.44 GHz, VDDS = 3.0 V (Measured on CC2652XSIP_EM) txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA] 0x0ACE -10 -10.47 5.83 0x0ACC -12 -12.27 5.63 0x08C9 -15 -15.57 5.34 0x04C7 -18 -18.31 5.18 0x04C6 -20 -19.83 5.01 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 31 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 -101 -103 -100 -102 -99 -101 -98 -100 Sensitivity [dBm] Sensitivity [dBm] 8.16.4 RX Performance -97 -96 -95 -99 -98 -97 -94 -96 -93 -95 -92 -94 -91 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 -93 2.4 2.48 2.408 2.416 2.424 Frequency [MHz] 2.432 2.44 2.448 2.456 2.464 2.472 2.48 Frequency [MHz] Figure 8-12. Sensitivity vs. Frequency (BLE 1 Mbps) Figure 8-13. Sensitivity vs. Frequency (250 kbps) -90 -91 -91 -92 -93 -92 -94 Sensitivity [dBm] Sensitivity [dBm] -93 -94 -95 -96 -95 -96 -97 -98 -99 -97 -100 -98 -101 -99 -100 -40 -102 -25 -10 5 20 35 50 65 80 95 -103 -40 105 -25 -10 5 o -90 -90 -91 -91 -92 -92 -93 -93 -94 -95 -96 -98 -99 -99 2.6 2.8 3 3.2 3.4 3.6 3.8 -100 1.8 2 Voltage [V] 95 105 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Figure 8-16. Sensitivity vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz) 32 80 -96 -98 2.4 65 -95 -97 2.2 50 -94 -97 2 35 Figure 8-15. Sensitivity vs. Temperature (250 kbps, 2.44 GHz) Sensitivity [dBm] Sensitivity [dBm] Figure 8-14. Sensitivity vs. Temperature (BLE 1 Mbps, 2.44 GHz) -100 1.8 20 Temperature [ oC] Temperature [ C] Figure 8-17. Sensitivity vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, DCDC Off) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 -93 -94 -95 Sensitivity [dBm] -96 -97 -98 -99 -100 -101 -102 -103 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Figure 8-18. Sensitivity vs. Supply Voltage (VDDS) (250 kbps, 2.44 GHz) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 33 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -40 Output Power [dBm] Output Power [dBm] 8.16.5 TX Performance -25 -10 5 20 35 50 65 80 95 105 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.2 3 -40 -25 -10 5 50 65 80 95 Figure 8-20. Output Power vs. Temperature (BLE 1 Mbps, 2.44 GHz, +5 dBm) 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 1.8 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.2 3 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 2 2.2 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.6 2.8 3 3.2 3.4 3.6 3.8 Figure 8-22. Output Power vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +5 dBm) Output Power [dBm] 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 2.4 105 Voltage [V] Figure 8-21. Output Power vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, 0 dBm) Output Power [dBm] 35 Figure 8-19. Output Power vs. Temperature (BLE 1 Mbps, 2.44 GHz, 0 dBm) Voltage [V] 2.456 2.464 2.472 2.48 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.2 3 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48 Frequency [GHz] Frequency [GHz] Figure 8-23. Output Power vs. Frequency (BLE 1 Mbps, 0 dBm) 34 20 Temperature [ oC] Output Power [dBm] Output Power [dBm] Temperature [ oC] Figure 8-24. Output Power vs. Frequency (BLE 1 Mbps, +5 dBm) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 8.16.6 ADC Performance 11.4 Vin = 3.0 V Sine wave, Internal reference, Fin = Fs / 10 Internal Reference, No Averaging Internal Unscaled Reference, 14-bit Mode 10.2 11.1 10.15 10.1 ENOB [Bit] ENOB [Bit] 10.8 10.5 10.2 10.05 10 9.95 9.9 9.9 9.85 9.6 0.2 0.3 0.5 0.7 1 2 3 4 5 6 7 8 10 20 9.8 30 40 50 70 100 1 Frequency [kHz] 3 4 5 6 7 8 10 30 40 50 70 100 200 Figure 8-26. ENOB vs. Sampling Frequency Vin = 3.0 V Sine wave, Internal reference, 200 kSamples/s Vin = 3.0 V Sine wave, Internal reference, 200 kSamples/s 2.5 1 2 0.5 1.5 DNL [LSB] 1.5 0 1 -0.5 0.5 -1 0 -1.5 -0.5 0 400 800 1200 1600 2000 2400 2800 3200 3600 4000 0 400 800 1200 1600 ADC Code Vin = 1 V, Internal reference, 200 kSamples/s 1.009 1.008 1.008 1.007 1.007 Voltage [V] 1.009 1.006 1.005 1.004 1.002 1.001 1.001 10 20 30 40 4000 1.004 1.002 0 3600 1.005 1.003 -10 3200 1.006 1.003 -20 2800 Vin = 1 V, Internal reference, 200 kSamples/s 1.01 -30 2400 Figure 8-28. DNL vs. ADC Code 1.01 1 -40 2000 ADC Code Figure 8-27. INL vs. ADC Code Voltage [V] 20 Frequency [kHz] Figure 8-25. ENOB vs. Input Frequency INL [LSB] 2 50 60 70 80 90 100 1 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage [V] Temperature [°C] Figure 8-29. ADC Accuracy vs. Temperature Figure 8-30. ADC Accuracy vs. Supply Voltage (VDDS) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 35 CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 www.ti.com 9 Detailed Description 9.1 Overview Section 4 shows the core modules of the CC2652RSIP device. 9.2 System CPU The CC2652RSIP SimpleLink™ Wireless MCU contains an Arm® Cortex®-M4F system CPU, which runs the application and the higher layers of radio protocol stacks. The system CPU is the foundation of a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts. Its features include the following: • ARMv7-M architecture optimized for small-footprint embedded applications • Arm Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit Arm core in a compact memory size • Fast code execution permits increased sleep mode time • Deterministic, high-performance interrupt handling for time-critical applications • Single-cycle multiply instruction and hardware divide • Hardware division and fast digital-signal-processing oriented multiply accumulate • Saturating arithmetic for signal processing • IEEE 754-compliant single-precision Floating Point Unit (FPU) • Memory Protection Unit (MPU) for safety-critical applications • Full debug with data matching for watchpoint generation – Data Watchpoint and Trace Unit (DWT) – JTAG Debug Access Port (DAP) – Flash Patch and Breakpoint Unit (FPB) • Trace support reduces the number of pins required for debugging and tracing – Instrumentation Trace Macrocell Unit (ITM) – Trace Port Interface Unit (TPIU) with asynchronous serial wire output (SWO) • Optimized for single-cycle flash memory access • Tightly connected to 8-KB 4-way random replacement cache for minimal active power consumption and wait states • Ultra-low-power consumption with integrated sleep modes • 48 MHz operation • 1.25 DMIPS per MHz 36 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.3 Radio (RF Core) The RF Core is a highly flexible and future proof radio module which contains an Arm Cortex-M0 processor that interfaces the analog RF and base-band circuitry, handles data to and from the system CPU side, and assembles the information bits in a given packet structure. The RF core offers a high level, command-based API to the main CPU that configurations and data are passed through. The Arm Cortex-M0 processor is not programmable by customers and is interfaced through the TI-provided RF driver that is included with the SimpleLink Software Development Kit (SDK). The RF core can autonomously handle the time-critical aspects of the radio protocols, thus offloading the main CPU, which reduces power and leaves more resources for the user application. Several signals are also available to control external circuitry such as RF switches or range extenders autonomously. Multiprotocol solutions are enabled through time-sliced access of the radio, handled transparently for the application through the TI-provided RF driver and dual-mode manager. The various physical layer radio formats are partly built as a software defined radio where the radio behavior is either defined by radio ROM contents or by non-ROM radio formats delivered in form of firmware patches with the SimpleLink SDKs. This allows the radio platform to be updated for support of future versions of standards even with over-the-air (OTA) updates while still using the same silicon. 9.3.1 Bluetooth 5.2 Low Energy The RF Core offers full support for Bluetooth 5.2 Low Energy, including the high-sped 2-Mbps physical layer and the 500-kbps and 125-kbps long range PHYs (Coded PHY) through the TI provided Bluetooth 5.2 stack or through a high-level Bluetooth API. The Bluetooth 5.2 PHY and part of the controller are in radio and system ROM, providing significant savings in memory usage and more space available for applications. The new high-speed mode allows data transfers up to 2 Mbps, twice the speed of Bluetooth 4.2 and five times the speed of Bluetooth 4.0, without increasing power consumption. In addition to faster speeds, this mode offers significant improvements for energy efficiency and wireless coexistence with reduced radio communication time. Bluetooth 5.2 also enables unparalleled flexibility for adjustment of speed and range based on application needs, which capitalizes on the high-speed or long-range modes respectively. Data transfers are now possible at 2 Mbps, enabling development of applications using voice, audio, imaging, and data logging that were not previously an option using Bluetooth low energy. With high-speed mode, existing applications deliver faster responses, richer engagement, and longer battery life. Bluetooth 5.2 enables fast, reliable firmware updates. 9.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN) Through a dedicated IEEE radio API, the RF Core supports the 2.4-GHz IEEE 802.15.4-2011 physical layer (2 Mchips per second Offset-QPSK with DSSS 1:8), used in Thread, Zigbee, and 6LoWPAN protocols. The 802.15.4 PHY and MAC are in radio and system ROM. TI also provides royalty-free protocol stacks for Thread and Zigbee as part of the SimpleLink SDK, enabling a robust end-to-end solution. 9.4 Memory The up to 352-KB nonvolatile (Flash) memory provides storage for code and data. The flash memory is in-system programmable and erasable. The last flash memory sector must contain a Customer Configuration section (CCFG) that is used by boot ROM and TI provided drivers to configure the device. This configuration is done through the ccfg.c source file that is included in all TI provided examples. The ultra-low leakage system static RAM (SRAM) is split into up to five 16-KB blocks and can be used for both storage of data and execution of code. Retention of SRAM contents in Standby power mode is enabled by default and included in Standby mode power consumption numbers. Parity checking for detection of bit errors in memory is built-in, which reduces chip-level soft errors and thereby increases reliability. System SRAM is always initialized to zeroes upon code execution from boot. To improve code execution speed and lower power when executing code from nonvolatile memory, a 4-way nonassociative 8-KB cache is enabled by default to cache and prefetch instructions read by the system CPU. The cache can be used as a general-purpose RAM by enabling this feature in the Customer Configuration Area (CCFG). Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 37 CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 www.ti.com There is a 4-KB ultra-low leakage SRAM available for use with the Sensor Controller Engine which is typically used for storing Sensor Controller programs, data and configuration parameters. This RAM is also accessible by the system CPU. The Sensor Controller RAM is not cleared to zeroes between system resets. The ROM includes a TI-RTOS kernel and low-level drivers, as well as significant parts of selected radio stacks, which frees up flash memory for the application. The ROM also contains a serial (SPI and UART) bootloader that can be used for initial programming of the device. 38 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP www.ti.com CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.5 Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in both Standby and Active power modes. The peripherals in this domain can be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously; thereby significantly reducing power consumption and offloading the system CPU. The Sensor Controller Engine is user programmable with a simple programming language that has syntax similar to C. This programmability allows for sensor polling and other tasks to be specified as sequential algorithms rather than static configuration of complex peripheral modules, timers, DMA, register programmable state machines, or event routing. The main advantages are: • Flexibility - data can be read and processed in unlimited manners while still ensuring ultra-low power • 2 MHz low-power mode enables lowest possible handling of digital sensors • Dynamic reuse of hardware resources • 40-bit accumulator supporting multiplication, addition and shift • Observability and debugging options Sensor Controller Studio is used to write, test, and debug code for the Sensor Controller. The tool produces C driver source code, which the System CPU application uses to control and exchange data with the Sensor Controller. Typical use cases may be (but are not limited to) the following: • Read analog sensors using integrated ADC or comparators • Interface digital sensors using GPIOs, SPI, UART, or I2C (UART and I2C are bit-banged) • Capacitive sensing • Waveform generation • Very low-power pulse counting (flow metering) • Key scan The peripherals in the Sensor Controller include the following: • The low-power clocked comparator can be used to wake the system CPU from any state in which the comparator is active. A configurable internal reference DAC can be used in conjunction with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC. • Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higheraccuracy alternative to the low-power clocked comparator. The Sensor Controller takes care of baseline tracking, hysteresis, filtering, and other related functions when these modules are used for capacitive sensing. • The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources including timers, I/O pins, software, and comparators. • The analog modules can connect to up to eight different GPIOs • Dedicated SPI controller with up to 6 MHz clock speed The peripherals in the Sensor Controller can also be controlled from the main application processor. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 39 CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 www.ti.com 9.6 Cryptography The CC2652RSIP device comes with a wide set of modern cryptography-related hardware accelerators, drastically reducing code footprint and execution time for cryptographic operations. It also has the benefit of being lower power and improves availability and responsiveness of the system because the cryptography operations runs in a background hardware thread. Together with a large selection of open-source cryptography libraries provided with the Software Development Kit (SDK), this allows for secure and future proof IoT applications to be easily built on top of the platform. The hardware accelerator modules are: • True Random Number Generator (TRNG) module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear-combinatorial circuit. • Secure Hash Algorithm 2 (SHA-2) with support for SHA224, SHA256, SHA384, and SHA512 • Advanced Encryption Standard (AES) with 128 and 256 bit key lengths • Public Key Accelerator - Hardware accelerator supporting mathematical operations needed for elliptic curves up to 512 bits and RSA key pair generation up to 1024 bits. Through use of these modules and the TI provided cryptography drivers, the following capabilities are available for an application or stack: • Key Agreement Schemes – Elliptic curve Diffie–Hellman with static or ephemeral keys (ECDH and ECDHE) – Elliptic curve Password Authenticated Key Exchange by Juggling (ECJ-PAKE) • Signature Generation – Elliptic curve Diffie-Hellman Digital Signature Algorithm (ECDSA) • Curve Support – Short Weierstrass form (full hardware support), such as: • NIST-P224, NIST-P256, NIST-P384, NIST-P521 • Brainpool-256R1, Brainpool-384R1, Brainpool-512R1 • secp256r1 – Montgomery form (hardware support for multiplication), such as: • Curve25519 • SHA2 based MACs – HMAC with SHA224, SHA256, SHA384, or SHA512 • Block cipher mode of operation – AESCCM – AESGCM – AESECB – AESCBC – AESCBC-MAC • True random number generation Other capabilities, such as RSA encryption and signatures as well as Edwards type of elliptic curves such as Curve1174 or Ed25519, can also be implemented using the provided hardware accelerators but are not part of the TI SimpleLink SDK for the CC2652RSIP device. 40 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.7 Timers A large selection of timers are available as part of the CC2652RSIP device. These timers are: • Real-Time Clock (RTC) • A 70-bit 3-channel timer running on the 32 kHz low frequency system clock (SCLK_LF) This timer is available in all power modes except Shutdown. The timer can be calibrated to compensate for frequency drift when using the LF RCOSC as the low frequency system clock. If an external LF clock with frequency different from 32.768 kHz is used, the RTC tick speed can be adjusted to compensate for this. When using TI-RTOS, the RTC is used as the base timer in the operating system and should thus only be accessed through the kernel APIs such as the Clock module. The real time clock can also be read by the Sensor Controller Engine to timestamp sensor data and also has dedicated capture channels. By default, the RTC halts when a debugger halts the device. General Purpose Timers (GPTIMER) • The four flexible GPTIMERs can be used as either 4× 32 bit timers or 8× 16 bit timers, all running on up to 48 MHz. Each of the 16- or 32-bit timers support a wide range of features such as one-shot or periodic counting, pulse width modulation (PWM), time counting between edges and edge counting. The inputs and outputs of the timer are connected to the device event fabric, which allows the timers to interact with signals such as GPIO inputs, other timers, DMA and ADC. The GPTIMERs are available in Active and Idle power modes. Sensor Controller Timers The Sensor Controller contains 3 timers: AUX Timer 0 and 1 are 16-bit timers with a 2N prescaler. Timers can either increment on a clock or on each edge of a selected tick source. Both one-shot and periodical timer modes are available. • AUX Timer 2 is a 16-bit timer that can operate at 24 MHz, 2 MHz or 32 kHz independent of the Sensor Controller functionality. There are 4 capture or compare channels, which can be operated in one-shot or periodical modes. The timer can be used to generate events for the Sensor Controller Engine or the ADC, as well as for PWM output or waveform generation. Radio Timer • A multichannel 32-bit timer running at 4 MHz is available as part of the device radio. The radio timer is typically used as the timing base in wireless network communication using the 32-bit timing word as the network time. The radio timer is synchronized with the RTC by using a dedicated radio API when the device radio is turned on or off. This ensures that for a network stack, the radio timer seems to always be running when the radio is enabled. The radio timer is in most cases used indirectly through the trigger time fields in the radio APIs and should only be used when running the accurate 48 MHz high frequency crystal is the source of SCLK_HF. Watchdog timer The watchdog timer is used to regain control if the system operates incorrectly due to software errors. It is typically used to generate an interrupt to and reset of the device for the case where periodic monitoring of the system components and tasks fails to verify proper functionality. The watchdog timer runs on a 1.5 MHz clock rate and cannot be stopped once enabled. The watchdog timer pauses to run in Standby power mode and when a debugger halts the device. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 41 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.8 Serial Peripherals and I/O The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's synchronous serial interfaces. The SSIs support both SPI controller and peripheral up to 4 MHz. The SSI modules support configurable phase and polarity. The UARTs implement universal asynchronous receiver and transmitter functions. They support flexible baudrate generation up to a maximum of 3 Mbps. The I2S interface is used to handle digital audio and can also be used to interface pulse-density modulation microphones (PDM). The I2C interface is also used to communicate with devices compatible with the I2C standard. The I2C interface can handle 100 kHz and 400 kHz operation, and can serve as both controller and peripheral. The I/O controller (IOC) controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function, and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high-drive capabilities, which are marked in bold in Section 7. All digital peripherals can be connected to any digital pin on the device. For more information, see the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK). 9.9 Battery and Temperature Monitor A combined temperature and battery voltage monitor is available in the CC2652RSIP device. The battery and temperature monitor allows an application to continuously monitor on-chip temperature and supply voltage and respond to changes in environmental conditions as needed. The module contains window comparators to interrupt the system CPU when temperature or supply voltage go outside defined windows. These events can also be used to wake up the device from Standby mode through the Always-On (AON) event fabric. 9.10 µDMA The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data-transfer tasks from the system CPU, thus allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform a transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory when the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list): • • • • Highly flexible and configurable channel operation of up to 32 channels Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral Data sizes of 8, 16, and 32 bits Ping-pong mode for continuous streaming of data 9.11 Debug The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface. The device boots by default into cJTAG mode and must be reconfigured to use 4-pin JTAG. 42 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.12 Power Management To minimize power consumption, the CC2652RSIP supports a number of power modes and power management features (see Table 9-1). Table 9-1. Power Modes SOFTWARE CONFIGURABLE POWER MODES MODE ACTIVE IDLE STANDBY SHUTDOWN RESET PIN HELD CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On Retention Off Off Supply System On On Duty Cycled Off Off Register and CPU retention Full Full Partial No No SRAM retention Full Full Full No No 48 MHz high-speed clock (SCLK_HF) XOSC_HF or RCOSC_HF XOSC_HF or RCOSC_HF Off Off Off 2 MHz medium-speed clock (SCLK_MF) RCOSC_MF RCOSC_MF Available Off Off 32 kHz low-speed clock (SCLK_LF) XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF Off Off Peripherals Available Available Off Off Off Sensor Controller Available Available Available Off Off Wake-up on RTC Available Available Available Off Off Wake-up on pin edge Available Available Available Available Off Wake-up on reset pin On On On On On Brownout detector (BOD) On On Duty Cycled Off Off Power-on reset (POR) On On On Off Off Watchdog timer (WDT) Available Available Paused Off Off In Active mode, the application system CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 9-1). In Idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event brings the processor back into active mode. In Standby mode, only the always-on (AON) domain is active. An external wake-up event, RTC event, or Sensor Controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode. In Shutdown mode, the device is entirely turned off (including the AON domain and Sensor Controller), and the I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin defined as a wake from shutdown pin wakes up the device and functions as a reset trigger. The CPU can differentiate between reset in this way and reset-by-reset pin or power-on reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the flash memory contents. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 43 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the system CPU. This means that the system CPU does not have to wake up, for example to perform an ADC sampling or poll a digital sensor over SPI, thus saving both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio tool enables the user to program the Sensor Controller, control its peripherals, and wake up the system CPU as needed. All Sensor Controller peripherals can also be controlled by the system CPU. Note The power, RF and clock management for the CC2652RSIP device require specific configuration and handling by software for optimized performance. This configuration and handling is implemented in the TI-provided drivers that are part of the CC2652RSIP software development kit (SDK). Therefore, TI highly recommends using this software framework for all application development on the device. The complete SDK with TI-RTOS (optional), device drivers, and examples are offered free of charge in source code. 9.13 Clock Systems The CC2652RSIP device has several internal system clocks. The 48 MHz SCLK_HF is used as the main system (MCU and peripherals) clock. This can be driven by the internal 48 MHz RC Oscillator (RCOSC_HF) or in-package 48 MHz crystal (XOSC_HF). Note that the radio operation runs off the included, in-package 48 MHz crystal within the module. SCLK_MF is an internal 2 MHz clock that is used by the Sensor Controller in low-power mode and also for internal power management circuitry. The SCLK_MF clock is always driven by the internal 2 MHz RC Oscillator (RCOSC_MF). SCLK_LF is the 32.768 kHz internal low-frequency system clock. It can be used by the Sensor Controller for ultra-low-power operation and is also used for the RTC and to synchronize the radio timer before or after Standby power mode. SCLK_LF can be driven by the internal 32.8 kHz RC Oscillator (RCOSC_LF) or the included, in-package 32.768 kHz crystal within the module. When using the included, in-package crystal within the module, or the internal RC oscillator, the device can output the 32 kHz SCLK_LF signal to other devices, thereby reducing the overall system cost. 9.14 Network Processor Depending on the product configuration, the CC2652RSIP device can function as a wireless network processor (WNP - a device running the wireless protocol stack with the application running on a separate host MCU), or as a system-on-chip (SoC) with the application and protocol stack running on the system CPU inside the device. In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack. 44 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.15 Device Certification and Qualification The CC2652RSIP module from TI is certified for FCC, IC/ISED, ETSI/CE and UK as lised in Table 9-2. Moreover, the module is a Bluetooth Qualified Design by the Bluetooth Special Interest Group (Bluetooth SIG). TI Customers that build products based on the TI CC2652RSIP module can save in testing cost and time per product family. Note The FCC and IC IDs, as well as the UK and CE markings, must be located in both the user manual and on the packaging. Due to the small size of the module (7 mm x 7 mm), placing the IDs and markings in a type size large enough to be legible without the aid of magnification is impractical. Table 9-2. CC2652RSIP List of Certifications Regulatory Body FCC (USA) IC/ISED (Canada) ETSI/CE (Europe) & RER (UK) Specification ID (IF APPLICABLE) Part 15C + MPE FCC RF Exposure (Bluetooth) Part 15C + MPE FCC RF Exposure (802.15.4) RSS-102 (MPE) and RSS-247 (Bluetooth) RSS-102 (MPE) and RSS-247 (802.15.4) ZAT-CC2652RSIP 451H-CC2652RSIP EN 300328 v2.2.2 (2019-07) (Bluetooth) — EN 300328 v2.2.2 (2019-07) (802.15.4) — EN 62311:2020 and EN 50655:2017 (MPE) — EN 301 489-1 v2.2.3 (2019-11) — EN 301489-17 v3.2.4 (2020-09) — EN 62368-1:2020/A11:2020 — 9.15.1 FCC Certification and Statement CAUTION FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be co-located or operating with any other antenna or transmitter. The CC2652RSIPMOT module from TI is certified for FCC as a single-modular transmitter. The module is an FCC-certified radio module that carries a modular grant. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device is planned to comply with Part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference. • This device must accept any interference received, including interference that may cause undesired operation of the device. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 45 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.15.2 IC/ISED Certification and Statement CAUTION IC RF Radiation Exposure Statement: To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur. The CC2652RSIPMOT module from TI is certified for IC as a single-modular transmitter. The CC2652RSIPMOT module from TI is meets IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada licence-exempt RSS standards. Operation is subject to the following two conditions: • This device may not cause interference. • This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: • L'appareil ne doit pas produire de brouillage • L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 9.15.3 ETSI/CE Certification The CC2652RSIPMOT module from TI is CE certified with certifications to the appropriate EU radio and EMC directives summarized in the Declaration of Conformity and evidenced by the CE mark. The module is tested and certified against the Radio Equipment Directive (RED). See the full text of the for the EU Declaration of Conformity for the CC2652RSIPMOT device. 9.15.4 UK Certification The CC2652RSIPMOT module from TI is UK certified with certifications to the appropriate UK radio and EMC directives summarized in the Declaration of Conformity and evidenced by the UK mark. The module is tested and certified against the Radio Equipment Regulations 2017. See the full text of the for the UK Declaration of Conformity for the CC2652RSIPMOT device. 46 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 9.16 Module Markings Figure 9-1 shows the top-side marking for the CC2652RSIP module. CC2652 R SIP NNN NNNN Figure 9-1. Top-Side Marking Table 9-3 lists the CC2652RSIP module markings. Table 9-3. Module Descriptions MARKING DESCRIPTION CC2652 Generic Part Number R Model SIP SIP = Module type, X = pre-release NNN NNNN LTC (Lot Trace Code) 9.17 End Product Labeling The CC2652RSIPMOT module complies with the FCC single modular FCC grant, FCC ID: ZAT-CC2652RSIP.. The host system using this module must display a visible label indicating the following text: Contains FCC ID: ZAT-CC2652RSIP The CC2652RSIPMOT module complies with the IC single modular IC grant, IC: . The host system using this module must display a visible label indicating the following text: Contains IC: 451H-CC2652RSIP For more information on end product labeling and a sample label, please see section 4 of the OEM Integrators Guide 9.18 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information and warnings as shown in this manual. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 47 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 10 Application, Implementation, and Layout Note Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information 10.1.1 Typical Application Circuit Figure 10-1 shows the typical application schematic using the CC2652RSIP module. For the full reference schematic, download the LP-CC2652PSIP Design Files. Note The following guidelines are recommended for implementation of the RF design: • Ensure an RF path is designed with a characteristic impedance of 50 Ω. • Tuning of the antenna impedance matching network is recommended after manufacturing of the PCB to account for PCB parasitics. Please refer to CC13xx/CC26xx Hardware Configuration and PCB Design Considerations; section 5.1 for further information. Figure 10-1. CC2652RSIP Typical Application Schematic 48 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Table 10-1 provides the bill of materials for a typical application using the CC2652RSIP module in Figure 10-1. For full operation reference design, see the LP-CC2652PSIP Design Files Table 10-1. Bill of Materials QTY PART REFERENCE VALUE MANUFACTURER PART NUMBER 1 ANT1 2.4 GHz Ant Texas Instruments N/A Refer to 2.4-GHz Inverted F Antenna for details of the antenna implementation and PCB requirements. 1 C1 0.1 µF Murata GRT033C81E104KE01D Capacitor, ceramic, 0.1 µF, 25 V, ±10%, X6S, 0201 1 C2 15 pF Murata GRM0332C1H150JA01D Capacitor, ceramic, 1 pF, 50 V, ±5%, C0G/NP0, 0201 1 P1 U.FL Hirose U.FL-R-SMT-1(01) U.FL (UMCC) connector receptacle, male pin 50 Ω, surface mount solder 1 U49 CC2652RSIP Texas Instruments CC2652RSIPMOT SimpleLink™ multiprotocol 2.4-GHz wireless MCU DESCRIPTION 10.2 Device Connection and Layout Fundamentals 10.2.1 Reset In order to meet the module power-on-reset requirements, an external 0.1 µF capacitor is required on the nRESET pin during power ON. In addition, VDDS (Pin 46) and VDDS_PU (Pin 47) should be connected together. If the reset signal is not based upon a power-on-reset and is derived from an external MCU, then the external capacitor will not be needed and VDDS_PU (Pin 47) should be No Connect (NC). Please refer to Figure 10-1 for the recommended circuit implementation and Table 10-1 for the recommended 0.1 µF capacitor. 10.2.2 Unused Pins All unused pins can be left unconnected without the concern of having leakage current. Please refer to Section 7.3 for more details. 10.3 PCB Layout Guidelines This section details the PCB guidelines to speed up the PCB design using the CC2652RSIP module. The integrator of the CC2652RSIP modules must comply with the PCB layout recommendations described in the following subsections to minimize the risk with regulatory certifications for the FCC, IC/ISED, ETSI/CE. Moreover, TI recommends customers to follow the guidelines described in this section to achieve similar performance to that obtained with the TI reference design. 10.3.1 General Layout Recommendations Ensure that the following general layout recommendations are followed: • Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 49 CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 www.ti.com 10.3.2 RF Layout Recommendations It is critical that the RF section be laid out correctly to ensure optimal module performance. A poor layout can cause low-output power and sensitivity degradation. Figure 10-2 shows the RF placement and routing of the CC2652RSIP module with the 2.4-GHz inverted F antenna. Figure 10-2. Module Layout Guidelines Follow these RF layout recommendations for the CC2652RSIP module: • • • • • 50 RF traces must have a chararcterisitc impedance of 50-Ω. There must be no traces or ground under the antenna section. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must be as short as possible. The module must be as close to the PCB edge in consideration of the product enclosure and type of antenna being used. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 10.3.2.1 Antenna Placement and Routing The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 10-2 provides a summary of the antenna guidelines to follow with the CC2652RSIP module. Table 10-2. Antenna Guidelines SR NO. GUIDELINES 1 Place the antenna on an edge of the PCB. 2 Ensure that no signals are routed across the antenna elements on any PCB layer. 3 Most antennas, including the PCB antenna used on the LaunchPad™, require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well. 4 Ensure that there is provision to place matching components for the antenna. These must be tuned for best return loss when the complete board is assembled. Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance. 5 Ensure that the antenna characteristic impedance is 50-Ω as the module is designed for a 50-Ω system. 6 In case of printed antenna, ensure that the simulation is performed considering the soldermask thickness. 7 For good RF performance ensrue that the Voltge Standing Wave Ration (VSWR) is less than 2 across the frequency band of interest. 9 The feed point of the antenna is required to be grounded. This is only for the antenna type used on the CC2652PSIP LaunchPad™. See the specific antenna data sheets for the recommendations. Table 10-3 lists the recommended antennas to use with the CC2652RSIP module. Other antennas may be available for use with the CC2652RSIP module. Please refer to to the CC2652RSIP OEM integrators guide for a list of approved antennas (and antenna types) that can be used with the CC2652RSIP module. Table 10-3. Recommended Components CHOICE ANTENNA MANUFACTURER 1 2.4-GHz Inverted F Antenna Texas Instruments NOTES Refer to 2.4-GHz Inverted F Antenna for details of the Antenna implementation and PCB requirements. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 51 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 10.3.2.2 Transmission Line Considerations The RF signal from the module is routed to the antenna using a Coplanar Waveguide with ground (CPW-G) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding. Figure 10-3 shows a cross section of the coplanar waveguide with the critical dimensions. Figure 10-4 shows the top view of the coplanar waveguide with GND and via stitching. Figure 10-3. Coplanar Waveguide (Cross Section) S W Figure 10-4. CPW With GND and Via Stitching (Top View) 52 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 The recommended values for a 4-layer PCB board is provided in Table 10-4. Table 10-4. Recommended PCB Values for 4-Layer Board (L1 to L2 = 0.175 mm) PARAMETER VALUE UNITS W 0.300 mm S 0.500 mm H 0.175 mm 4.0 F/m Er (FR-4 substrate) 10.4 Reference Designs The following reference designs should be followed closely when implementing designs using the CC2652RSIP device. Special attention must be paid to RF component placement, decoupling capacitors and DCDC regulator components, as well as ground connections for all of these. CC2652xSIP-EM Design Files The CC2652xSIP-EM reference design provides schematic, layout and production files for the characterization board used for deriving the performance number found in this document. LP-CC2652PSIP Design Files The CC2652PSIP LaunchPad Design Files contain detailed schematics and layouts to build application specific boards using the CC2652PSIP module. This Launchpad Design is also used as the referenced for the CC2652RSIP module as it is pin-to-pin compatable with the CC2652RSIP module. Sub-1 GHz and 2.4 GHz Antenna Kit for LaunchPad™ Development Kit and SensorTag The antenna kit allows real-life testing to identify the optimal antenna for your application. The antenna kit includes 16 antennas for frequencies from 169 MHz to 2.4 GHz, including: • PCB antennas • Helical antennas • Chip antennas • Dual-band antennas for 868 MHz and 915 MHz combined with 2.4 GHz The antenna kit includes a JSC cable to connect to the Wireless MCU LaunchPad Development Kits and SensorTags. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 53 CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 www.ti.com 10.5 Junction Temperature Calculation This section shows the different techniques for calculating the junction temperature under various operating conditions. For more details, see Semiconductor and IC Package Thermal Metrics. There are three recommended ways to derive the junction temperature from other measured temperatures: 1. From package temperature: T J = ψJT × P + Tcase (1) T J = ψJB × P + Tboard (2) T J = RθJA × P + TA (3) 2. From board temperature: 3. From ambient temperature: P is the power dissipated from the device and can be calculated by multiplying current consumption with supply voltage. Thermal resistance coefficients are found in Section 8.8. Example: Using Equation 3, the temperature difference between ambient temperature and junction temperature is calculated. In this example, we assume a simple use case where the radio is transmitting continuously at 0 dBm output power. Let us assume the ambient temperature is 80 °C and the supply voltage is 3 V. To calculate P, we need to look up the current consumption for Tx at 80 °C in Typical Characteristics. From the plot, we see that the current consumption is 8.25 mA. This means that P is 8.25 mA × 3 V = 24.75 mW. The junction temperature is then calculated as: T J = 23.4°C W × 23.4mW + TA = 0.6°C + TA (4) As can be seen from the example, the junction temperature is 0.6 °C higher than the ambient temperature when running continuous Tx at 85 °C and, thus, well within the recommended operating conditions. For various application use cases current consumption for other modules may have to be added to calculate the appropriate power dissipation. For example, the MCU may be running simultaneously as the radio, peripheral modules may be enabled, etc. Typically, the easiest way to find the peak current consumption, and thus the peak power dissipation in the device, is to measure as described in Measuring CC13xx and CC26xx current consumption. 54 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 11 Environmental Requirements and SMT Specifications 11.1 PCB Bending The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch. 11.2 Handling Environment 11.2.1 Terminals The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not make skin contact with the LGA portion. 11.2.2 Falling The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product to malfunction. 11.3 Storage Condition 11.3.1 Moisture Barrier Bag Before Opened A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product will be 24 months from the date the bag is sealed. 11.3.2 Moisture Barrier Bag Open Humidity indicator cards must be blue, < 30%. 11.4 PCB Assembly Guide The wireless MCU modules are packaged in a substrate base Leadless Quad Flatpack (QFM) package. The modules are designed with pull back leads for easy PCB layout and board mounting. 11.4.1 PCB Land Pattern & Thermal Vias We recommended a solder mask defined land pattern to provide a consistent soldering pad dimension in order to obtain better solder balancing and solder joint reliability. PCB land pattern are 1:1 to module soldering pad dimension. Thermal vias on PCB connected to other metal plane are for thermal dissipation purpose. It is critical to have sufficient thermal vias to avoid device thermal shutdown. Recommended vias size are 0.2mm and position not directly under solder paste to avoid solder dripping into the vias. 11.4.2 SMT Assembly Recommendations The module surface mount assembly operations include: • • • • • • Screen printing the solder paste on the PCB Monitor the solder paste volume (uniformity) Package placement using standard SMT placement equipment X-ray pre-reflow check - paste bridging Reflow X-ray post-reflow check - solder bridging and voids Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 55 CC2652RSIP SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 www.ti.com 11.4.3 PCB Surface Finish Requirements A uniform PCB plating thickness is key for high assembly yield. For an electroless nickel immersion gold finish, the gold thickness should range from 0.05 µm to 0.20 µm to avoid solder joint embrittlement. Using a PCB with Organic Solderability Preservative (OSP) coating finish is also recommended as an alternative to Ni-Au. 11.4.4 Solder Stencil Solder paste deposition using a stencil-printing process involves the transfer of the solder paste through predefined apertures with the application of pressure. Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to placement of package is highly recommended to improve board assembly yields. 11.4.5 Package Placement Packages can be placed using standard pick and place equipment with an accuracy of ±0.05 mm. Component pick and place systems are composed of a vision system that recognizes and positions the component and a mechanical system that physically performs the pick and place operation. Two commonly used types of vision systems are: • A vision system that locates a package silhouette • A vision system that locates individual pads on the interconnect pattern The second type renders more accurate placements but tends to be more expensive and time consuming. Both methods are acceptable since the parts align due to a self-centering features of the solder joint during solder reflow. It is recommended to avoid solder bridging to 2 mils into the solder paste or with minimum force to avoid causing any possible damage to the thinner packages. 11.4.6 Solder Joint Inspection After surface mount assembly, transmission X-ray should be used for sample monitoring of the solder attachment process. This identifies defects such as solder bridging, shorts, opens, and voids. It is also recommended to use side view inspection in addition to X-rays to determine if there are "Hour Glass" shaped solder and package tilting existing. The "Hour Glass" solder shape is not a reliable joint. 90° mirror projection can be used for side view inspection. 11.4.7 Rework and Replacement TI recommends removal of modules by rework station applying a profile similar to the mounting process. Using a heat gun can sometimes cause damage to the module by overheating. 11.4.8 Solder Joint Voiding TI recommends to control solder joint voiding to be less than 30% (per IPC-7093). Solder joint voids could be reduced by baking of components and PCB, minimized solder paste exposure duration, and reflow profile optimization. 11.5 Baking Conditions Products require baking before mounting if: • Humidity indicator cards read > 30% • Temp < 30°C, humidity < 70% RH, over 96 hours Baking condition: 90°C, 12 to 24 hours Baking times: 1 time 56 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 11.6 Soldering and Reflow Condition • • • • • • Heating method: Conventional convection or IR convection Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method Solder paste composition: SAC305 Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 11-1) Temperature profile: Reflow soldering will be done according to the temperature profile (see Figure 11-1) Peak temperature: 260°C Figure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint) Table 11-1. Temperature Profile Convection or IR(1) Profile Elements Peak temperature range 235 to 240°C typical (260°C maximum) Pre-heat / soaking (150 to 200°C) 60 to 120 seconds Time above melting point 60 to 90 seconds Time with 5°C to peak 30 seconds maximum Ramp up < 3°C / second Ramp down < -6°C / second (1) For details, refer to the solder paste manufacturer's recommendation. Note TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module. This coating can lead to localized stress on the solder connections inside the module and impact the module reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 57 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 12 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed as follows. 12.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or datecode. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, XCC2652RSIP is in preview; therefore, an X prefix/identification is assigned). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGZ). For orderable part numbers of CC2652RSIP devices in the RGZ (7-mm x 7-mm) package type, see the Package Option Addendum of this document, the Device Information in Section 3, the TI website (www.ti.com), or contact your TI sales representative. CC2652 R SIP MOT R PREFIX X = Experimental device Blank = Qualified devie R = Large Reel PACKAGE DESIGNATOR MOT = LGA Package DEVICE SimpleLink™ Ultra-Low-Power Wireless MCU MODULE SIP = System-in-Package CONFIGURATION R = Regular P = +10 dBm PA included Figure 12-1. Device Nomenclature 12.2 Tools and Software The CC2652RSIP device is supported by a variety of software and hardware development tools. Development Kit CC2652PSIP LaunchPad™ Development Kit 58 The CC2652PSIP LaunchPad™ Development Kit enables development of high-performance wireless applications that benefit from low-power operation. The kit features the CC2652PSIP SimpleLink Wireless system-in-Package, which allows you to quickly evaluate and prototype 2.4-GHz wireless applications such as Bluetooth 5 Low Energy, Zigbee and Thread, plus combinations of these. The kit works with the LaunchPad ecosystem, easily enabling additional functionality like sensors, display and more. The built-in EnergyTrace™ Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 software is an energy-based code analysis tool that measures and displays the application’s energy profile and helps to optimize it for ultra-low-power consumption. Software SimpleLink™ CC13XXCC26XX SDK The SimpleLink CC13XX-CC26XX Software Development Kit (SDK) provides a complete package for the development of wireless applications on the CC13X2 / CC26X2 family of devices. The SDK includes a comprehensive software package for the CC2652RSIP device, including the following protocol stacks: • Bluetooth Low Energy 4 and 5.2 • Thread (based on OpenThread) • Zigbee 3.0 • TI 15.4-Stack - an IEEE 802.15.4-based star networking solution for Sub-1 GHz and 2.4 GHz • EasyLink - a large set of building blocks for building proprietary RF software stacks • Multiprotocol support - concurrent operation between stacks using the Dynamic Multiprotocol Manager (DMM) The SimpleLink CC13XX-CC26XX SDK is part of TI’s SimpleLink MCU platform, offering a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. For more information about the SimpleLink MCU Platform, visit http://www.ti.com/simplelink. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 59 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Development Tools Code Composer Studio™ Integrated Development Environment (IDE) Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse® software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers. CCS has support for all SimpleLink Wireless MCUs and includes support for EnergyTrace™ software (application energy usage profiling). A real-time object viewer plugin is available for TI-RTOS, part of the SimpleLink SDK. Code Composer Studio is provided free of charge when used in conjunction with the XDS debuggers included on a LaunchPad Development Kit. Code Composer Studio™ Cloud IDE Code Composer Studio (CCS) Cloud is a web-based IDE that allows you to create, edit and build CCS and Energia™ projects. After you have successfully built your project, you can download and run on your connected LaunchPad. Basic debugging, including features like setting breakpoints and viewing variable values is now supported with CCS Cloud. IAR Embedded Workbench® for Arm® IAR Embedded Workbench® is a set of development tools for building and debugging embedded system applications using assembler, C and C++. It provides a completely integrated development environment that includes a project manager, editor, and build tools. IAR has support for all SimpleLink Wireless MCUs. It offers broad debugger support, including XDS110, IAR I-jet™ and Segger J-Link™. A real-time object viewer plugin is available for TI-RTOS, part of the SimpleLink SDK. IAR is also supported out-of-the-box on most software examples provided as part of the SimpleLink SDK. A 30-day evaluation or a 32 KB size-limited version is available through iar.com. SmartRF™ Studio SmartRF™ Studio is a Windows® application that can be used to evaluate and configure SimpleLink Wireless MCUs from Texas Instruments. The application will help designers of RF systems to easily evaluate the radio at an early stage in the design process. It is especially useful for generation of configuration register values and for practical testing and debugging of the RF system. SmartRF Studio can be used either as a standalone application or together with applicable evaluation boards or debug probes for the RF device. Features of the SmartRF Studio include: • Link tests - send and receive packets between nodes • Antenna and radiation tests - set the radio in continuous wave TX and RX states • Export radio configuration code for use with the TI SimpleLink SDK RF driver • Custom GPIO configuration for signaling and control of external switches Sensor Controller Sensor Controller Studio is used to write, test and debug code for the Sensor Controller Studio peripheral. The tool generates a Sensor Controller Interface driver, which is a set of C source files that are compiled into the System CPU application. These source files also contain the Sensor Controller binary image and allow the System CPU application to control and exchange data with the Sensor Controller. Features of the Sensor Controller Studio include: • Ready-to-use examples for several common use cases • Full toolchain with built-in compiler and assembler for programming in a C-like programming language 60 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 • CCS UniFlash Provides rapid development by using the integrated sensor controller task testing and debugging functionality, including visualization of sensor data and verification of algorithms CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs. UniFlash has a GUI, command line, and scripting interface. CCS UniFlash is available free of charge. 12.2.1 SimpleLink™ Microcontroller Platform The SimpleLink microcontroller platform sets a new standard for developers with the broadest portfolio of wired and wireless Arm® MCUs (System-on-Chip) in a single software development environment. Delivering flexible hardware, software and tool options for your IoT applications. Invest once in the SimpleLink software development kit and use throughout your entire portfolio. Learn more on ti.com/simplelink. 12.3 Documentation Support To receive notification of documentation updates on data sheets, errata, application notes and similar, navigate to the device product folder on ti.com/product/CC2652RSIP. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. The current documentation that describes the MCU, related peripherals, and other technical collateral is listed as follows. TI Resource Explorer TI Resource Explorer Software examples, libraries, executables, and documentation are available for your device and development board. Errata CC2652RSIP Silicon Errata The silicon errata describes the known exceptions to the functional specifications for each silicon revision of the device and description on how to recognize a device revision. Application Reports All application reports for the CC2652RSIP device are found on the device product folder at: ti.com/product/ CC2652RSIP/technicaldocuments. Technical Reference Manual (TRM) CC13xx, CC26xx SimpleLink™ The TRM provides a detailed description of all modules and peripherals Wireless MCU TRM available in the device family. 12.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.5 Trademarks SimpleLink™, LaunchPad™, EnergyTrace™, Code Composer Studio™, and TI E2E™ are trademarks of Texas Instruments. I-jet™ is a trademark of IAR Systems AB. J-Link™ is a trademark of SEGGER Microcontroller Systeme GmbH. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 61 CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 Zigbee® is a registered trademark of Zigbee Alliance Inc. Bluetooth® is a registered trademark of Bluetooth SIG Inc. Wi-Fi® is a registered trademark of Wi-Fi Alliance. Arm Thumb® is a registered trademark of Arm Limited (or its subsidiaries). Eclipse® is a registered trademark of Eclipse Foundation. IAR Embedded Workbench® is a registered trademark of IAR Systems AB. Windows® is a registered trademark of Microsoft Corporation. All trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary TI Glossary 62 This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP CC2652RSIP www.ti.com SWRS262B – FEBRUARY 2021 – REVISED SEPTEMBER 2022 13 Mechanical, Packaging, and Orderable Information 13.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Note The total height of the module is 1.51 mm. The weight of the CC2652RSIP module is typically 0.186 g. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CC2652RSIP 63 PACKAGE OPTION ADDENDUM www.ti.com 28-Jun-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) CC2652RSIPMOTR ACTIVE QFM MOT 48 2000 RoHS (In Work) & Green (In Work) ENEPIG Level-3-260C-168 HR -40 to 105 CC2652 R SIP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of