CC2662R1FTWRGZRQ1

CC2662R-Q1 SWRS259C – DECEMBER 2020 – REVISED JULY 2023 CC2662R-Q1 SimpleLink™ Wireless BMS MCU 1 Features Wireless microcontroller • • • • • • • • • Powerful 48-MHz Arm® Cortex®-M4F processor EEMBC CoreMark® score: 148 352KB flash program memory 256KB of ROM for protocols and library functions 8KB of cache SRAM 80KB of ultra-low leakage SRAM with parity for high-reliability operation 2-pin cJTAG and JTAG debugging Supports over-the-air upgrade (OTA) Programmable radio supporting SimpleLink™ WBMS High performance radio • • –92 dBm RX sensitivity for proprietary WBMS protocol Output power up to +5 dBm with temperature compensation Regulatory compliance • Suitable for systems targeting compliance with these standards: – ETSI EN 300 328, EN 300 440 Cat. 2 and 3 – FCC CFR47 Part 15 – ARIB STD-T66 MCU peripherals Qualified for automotive application • • • • • • • • • Security enablers Ultra-low power sensor controller • • • • • Autonomous MCU with 4KB of SRAM Sample, store, and process sensor data Fast wake-up for low-power operation Software defined peripherals; capacitive touch, flow meter, LCD AEC-Q100 qualified with the following results: – Device temperature grade 2: –40°C to +105°C ambient operating temperature range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C3 Functional Safety Quality-Managed – Documentation available to aid functional safety system design Low power consumption • • • MCU consumption: – 3.4 mA active mode, CoreMark® – 71 μA/MHz running CoreMark® – 0.94 μA standby mode, RTC, 80KB RAM – 0.15 μA shutdown mode, wake-up on pin Ultra low-power sensor controller consumption: – 31.9 μA in 2 MHz mode – 808.5 μA in 24 MHz mode Radio consumption – 6.9 mA RX – 7.0 mA TX at 0 dBm – 9.2 mA TX at +5 dBm • • • • Digital peripherals can route to any of 31 GPIOs Four 32-bit or eight 16-bit general-purpose timers 12-bit ADC, 200 kSamples/s, 8 channels 8-bit DAC Two comparators Two UART, Two SSI, I2C, I2S Real-time clock (RTC) Integrated temperature and battery monitor AES 128- and 256-bit cryptographic accelerator ECC and RSA public key hardware accelerator SHA2 Accelerator (full suite up to SHA-512) True random number generator (TRNG) Development tools and software • • • • • CC2662RQ1-EVM-WBMS Development Kit SimpleLink™ WBMS Software Development Kit SmartRF™ Studio for simple radio configuration Sensor Controller Studio for building low-power sensing applications SysConfig system configuration tool Operating range • • • On-chip buck DC/DC converter 1.8-V to 3.63-V single supply voltage -40 to +105°C Package • • 7-mm × 7-mm RGZ VQFN48 with wettable flanks (31 GPIOs) RoHS-compliant package Wireless protocol support • SimpleLink™ WBMS An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 2 Applications • • – Wireless battery management system (BMS) Cable replacement Automotive 3 Description The SimpleLink™ 2.4 GHz CC2662R-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting wireless automotive applications. The device is optimized for low-power wireless communication in applications such as battery management systems (BMS) and cable replacement. The highlighted features of this device include: • Support for TI's SimpleLink wireless BMS (WBMS) protocol for robust, low latency and high throughput communication. • Functional Safety Quality-Managed classification including TI quality-managed development process and forthcoming functional safety FIT rate calculation, FMEDA and functional safety documentation. • AEC-Q100 qualified for Grade 2 temperature range (–40 °C to +105 °C) and is offered in a 7-mm x 7-mm VQFN package with wettable flanks. • Low standby current of 0.94 μA with full RAM retention. • Excellent radio link budget of 97 dBm. The CC2662R-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee®, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment and rich tool set. For more information, visit SimpleLink™ MCU platform. Device Information(1) (1) 2 PART NUMBER PACKAGE BODY SIZE (NOM) CC2662R1FTWRGZRQ1 VQFN (48) 7.00 mm × 7.00 mm For the most current part, package, and ordering information for all available devices, see the Package Option Addendum or see the TI website. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 4 Functional Block Diagram 2.4 GHz RF Core cJTAG Main CPU 256KB ROM ADC ADC Arm® Cortex®-M4F Processor Up to 352KB Flash with 8KB Cache 48 MHz 71 µA/MHz (3.0 V) Up to 80KB SRAM with Parity Digital PLL DSP Modem 16KB SRAM Arm® Cortex®-M0 Processor General Hardware Peripherals and Modules ROM Sensor Interface I2C and I2S 4× 32-bit Timers Sensor Controller 2× UART 2× SSI (SPI) 8-bit DAC 32 ch. µDMA Watchdog Timer 12-bit ADC, 200 ks/s 31 GPIOs TRNG 2x Low-Power Comparator AES-256, SHA2-512 Temperature and Battery Monitor SPI-I2C Digital Sensor IF ECC, RSA RTC Capacitive Touch IF Time-to-Digital Converter LDO, Clocks, and References Optional DC/DC Converter 4KB SRAM Figure 4-1. CC2662R-Q1 Block Diagram Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 3 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 2 3 Description.......................................................................2 4 Functional Block Diagram.............................................. 3 5 Revision History.............................................................. 4 6 Device Comparison......................................................... 5 7 Terminal Configuration and Functions..........................6 7.1 Pin Diagram – RGZ Package (Top View)....................6 7.2 Signal Descriptions..................................................... 7 7.3 Connections for Unused Pins and Modules................8 8 Specifications.................................................................. 9 8.1 Absolute Maximum Ratings........................................ 9 8.2 ESD Ratings............................................................... 9 8.3 Recommended Operating Conditions.........................9 8.4 Power Supply and Modules........................................ 9 8.5 Power Consumption - Power Modes........................ 10 8.6 Power Consumption - Radio Modes......................... 11 8.7 Nonvolatile (Flash) Memory Characteristics............. 11 8.8 Thermal Resistance Characteristics......................... 11 8.9 Receive (RX) ............................................................12 8.10 Transmit (TX).......................................................... 13 8.11 Timing and Switching Characteristics..................... 13 8.12 Peripheral Characteristics.......................................18 8.13 Typical Characteristics............................................ 25 9 Detailed Description......................................................31 9.1 Overview................................................................... 31 9.2 System CPU............................................................. 31 9.3 Radio (RF Core)........................................................32 9.4 Memory..................................................................... 33 9.5 Sensor Controller...................................................... 34 9.6 Cryptography............................................................ 35 9.7 Timers....................................................................... 36 9.8 Serial Peripherals and I/O.........................................37 9.9 Battery and Temperature Monitor............................. 37 9.10 µDMA...................................................................... 37 9.11 Debug......................................................................37 9.12 Power Management................................................38 9.13 Clock Systems........................................................ 39 9.14 Network Processor..................................................39 10 Application, Implementation, and Layout................. 40 10.1 Reference Designs................................................. 40 10.2 Junction Temperature Calculation...........................41 11 Device and Documentation Support..........................42 11.1 Device Nomenclature..............................................42 11.2 Tools and Software..................................................42 11.3 Documentation Support.......................................... 44 11.4 Support Resources................................................. 44 11.5 Trademarks............................................................. 44 11.6 Electrostatic Discharge Caution.............................. 45 11.7 Glossary.................................................................. 45 12 Mechanical, Packaging, and Orderable Information.................................................................... 46 5 Revision History Changes from December 11, 2020 to May 19, 2023 (from Revision A (June 2022) to Revision B (May 2023)) Page • Changed "Radio consumption" (TX currents) in Section 1 Features .................................................................1 • Updated numbering of sections, figures, and tables throughout the data sheet................................................ 1 • Updated formatting throughout data sheet to match current documentation standards.....................................1 • Added PRODUCTION DATA.............................................................................................................................. 1 • Changed package options for CC2340R2.......................................................................................................... 5 • Changed the TYP values of the "Radio transmit current" parameter in Section 8.6 Power Consumption Radio Modes ....................................................................................................................................................11 • Updated Table 8-1 Typical TX Current and Output Power ...............................................................................27 Changes from May 19, 2023 to July 12, 2023 (from Revision B (May 2023) to Revision C (July 2023)) Page • Updated "48MHz Arm Cortex-M4" to "Arm Cortex-M4F."................................................................................... 1 4 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 6 Device Comparison X CC1311R3 X X CC1311P3 X X X 7 X 7 mm VQFN (48) X 5 X 5 mm VQFN (40) RAM + GPIO Cache (KB) 4 X 4 mm VQFN (24) +20 dBm PA Multiprotocol Thread ZigBee Bluetooth® LE Sidewalk X FLASH (KB) 5 X 5 mm VQFN (32) X PACKAGE SIZE 4 X 4 mm VQFN (32) CC1310 Wi-SUN® Wireless M-Bus Device 2.4GHz Prop. Sub-1 GHz Prop. RADIO SUPPORT 32-128 16-20 + 8 10-30 X 352 32 + 8 22-30 352 32 + 8 26 X 352 80 + 8 30 X 704 144 + 8 30 X X X CC1312R X X X CC1312R7 X X X CC1352R X X X X X X X X 352 80 + 8 28 X CC1352P X X X X X X X X X 352 80 + 8 26 X CC1352P7 X X X X X X X X X 704 144 + 8 26 X X X X 512 36 12-26 X CC2340R5 (1) X X X X X X CC2640R2F X 128 20 + 8 10-31 CC2642R X 352 80 + 8 31 X CC2642R-Q1 X 352 80 + 8 31 X 352 32 + 8 23-31 X X 352 32 + 8 22-26 X X CC2651R3 X X X CC2651P3 X X X X X X X CC2652R X X X X X 352 80 + 8 31 X CC2652RB X X X X X 352 80 + 8 31 X CC2652R7 X X X X X 704 144 + 8 31 X CC2652P X X X X X X 352 80 + 8 26 X CC2652P7 X X X X X X 704 144 + 8 26 X CC2662R-Q1 X 352 80 + 8 31 X (1) ZigBee and Thread support enabled by future software update Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 5 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 7 Terminal Configuration and Functions 38 DIO_25 37 DIO_24 40 DIO_27 39 DIO_26 42 DIO_29 41 DIO_28 44 VDDS 43 DIO_30 46 X48M_N 45 VDDR 48 VDDR_RF 47 X48M_P 7.1 Pin Diagram – RGZ Package (Top View) 34 VDDS_DCDC 4 33 DCDC_SW DIO_0 5 32 DIO_22 DIO_1 6 31 DIO_21 DIO_2 7 30 DIO_20 DIO_3 8 29 DIO_19 DIO_4 9 28 DIO_18 DIO_5 10 27 DIO_17 DIO_6 11 26 DIO_16 DIO_7 12 25 JTAG_TCKC DCOUPL 23 JTAG_TMSC 24 3 X32K_Q2 DIO_15 21 VDDS3 22 X32K_Q1 DIO_13 19 DIO_14 20 35 RESET_N DIO_11 17 DIO_12 18 36 DIO_23 2 DIO_9 15 DIO_10 16 1 VDDS2 13 DIO_8 14 RF_P RF_N Figure 7-1. RGZ (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View) The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities: • • • • • • Pin 10, DIO_5 Pin 11, DIO_6 Pin 12, DIO_7 Pin 24, JTAG_TMSC Pin 26, DIO_16 Pin 27, DIO_17 The following I/O pins marked in Figure 7-1 in italics have analog capabilities: • • • • • • • • 6 Pin 36, DIO_23 Pin 37, DIO_24 Pin 38, DIO_25 Pin 39, DIO_26 Pin 40, DIO_27 Pin 41, DIO_28 Pin 42, DIO_29 Pin 43, DIO_30 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 7.2 Signal Descriptions Table 7-1. Signal Descriptions – RGZ Package PIN NAME NO. I/O TYPE DESCRIPTION DCDC_SW 33 — Power Output from internal DC/DC converter(1) DCOUPL 23 — Power 1.27-V regulated digital-supply (decoupling capacitor)(2) DIO_0 5 I/O Digital GPIO, Sensor Controller DIO_1 6 I/O Digital GPIO, Sensor Controller DIO_2 7 I/O Digital GPIO, Sensor Controller DIO_3 8 I/O Digital GPIO, Sensor Controller DIO_4 9 I/O Digital GPIO, Sensor Controller DIO_5 10 I/O Digital GPIO, Sensor Controller, high-drive capability DIO_6 11 I/O Digital GPIO, Sensor Controller, high-drive capability DIO_7 12 I/O Digital GPIO, Sensor Controller, high-drive capability DIO_8 14 I/O Digital GPIO DIO_9 15 I/O Digital GPIO DIO_10 16 I/O Digital GPIO DIO_11 17 I/O Digital GPIO DIO_12 18 I/O Digital GPIO DIO_13 19 I/O Digital GPIO DIO_14 20 I/O Digital GPIO DIO_15 21 I/O Digital GPIO DIO_16 26 I/O Digital GPIO, JTAG_TDO, high-drive capability DIO_17 27 I/O Digital GPIO, JTAG_TDI, high-drive capability DIO_18 28 I/O Digital GPIO DIO_19 29 I/O Digital GPIO DIO_20 30 I/O Digital GPIO DIO_21 31 I/O Digital GPIO DIO_22 32 I/O Digital GPIO DIO_23 36 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_24 37 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_25 38 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_26 39 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_27 40 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_28 41 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_29 42 I/O Digital or Analog GPIO, Sensor Controller, analog DIO_30 43 I/O Digital or Analog GPIO, Sensor Controller, analog EGP — — GND Ground – exposed ground pad JTAG_TMSC 24 I/O Digital JTAG TMSC, high-drive capability JTAG_TCKC 25 I Digital JTAG TCKC RESET_N 35 I Digital Reset, active low. No internal pullup resistor RF_P 1 — RF Positive RF input signal to LNA during RX Positive RF output signal from PA during TX RF_N 2 — RF Negative RF input signal to LNA during RX Negative RF output signal from PA during TX VDDR 45 — Power 1.7-V to 1.95-V supply, must be powered from the internal DC/DC converter or the internal Global LDO(3) (2) Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 7 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 Table 7-1. Signal Descriptions – RGZ Package (continued) PIN NAME NO. I/O TYPE DESCRIPTION VDDR_RF 48 — Power 1.7-V to 1.95-V supply, must be powered from the internal DC/DC converter or the internal Global LDO(4) (2) VDDS 44 — Power 1.8-V to 3.63-V main chip supply(1) VDDS2 13 — Power 1.8-V to 3.63-V DIO supply(1) VDDS3 22 — Power 1.8-V to 3.63-V DIO supply(1) VDDS_DCDC 34 — Power 1.8-V to 3.63-V DC/DC converter supply X48M_N 46 — Analog 48-MHz crystal oscillator pin 1 X48M_P 47 — Analog 48-MHz crystal oscillator pin 2 X32K_Q1 3 — Analog 32-kHz crystal oscillator pin 1 X32K_Q2 4 — Analog 32-kHz crystal oscillator pin 2 (1) (2) (3) (4) For more details, see the technical reference manual listed in Section 11.3. Do not supply external circuitry from this pin. If internal DC/DC converter is not used, this pin is supplied internally from the Global LDO. If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the Global LDO. 7.3 Connections for Unused Pins and Modules Table 7-2. Connections for Unused Pins FUNCTION SIGNAL NAME GPIO DIO_n 32.768-kHz crystal DC/DC converter(2) (1) (2) 8 PIN NUMBER ACCEPTABLE PRACTICE(1) PREFERRED PRACTICE(1) 5–12 14–21 26–32 36–43 NC or GND NC NC NC X32K_Q1 3 X32K_Q2 4 DCDC_SW 33 NC NC VDDS_DCDC 34 VDDS VDDS NC = No connect When the DC/DC converter is not used, the inductor between DCDC_SW and VDDR can be removed. VDDR and VDDR_RF must still be connected and the VDDR decoupling capacitor must be connected and moved close to VDDR. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) (2) VDDS(3) Vin Tstg (1) (2) (3) (4) (5) MIN MAX Supply voltage –0.3 4.1 V Voltage on any digital pin (4) (5) –0.3 VDDS + 0.3, max 4.1 V Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P –0.3 VDDR + 0.3, max 2.25 V Voltage scaling enabled –0.3 VDDS Voltage scaling disabled, internal reference –0.3 1.49 Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9 –40 150 Voltage on ADC input Storage temperature UNIT V °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to ground, unless otherwise noted. VDDS2 and VDDS3 must be at the same potential as VDDS. Including analog capable DIO. Injection current is not supported on any GPIO pin 8.2 ESD Ratings VESD (1) (2) (3) Electrostatic discharge VALUE UNIT Human body model (HBM), per AEC Q100-002(1) (2) All pins ±2000 V Charged device model (CDM), per AEC Q100-011(3) All pins ±500 V AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operating ambient temperature range –40 105 °C Operating supply voltage (VDDS) 1.8 3.63 V Rising supply voltage slew rate 0 100 mV/µs Falling supply voltage slew rate(1) 0 20 mV/µs (1) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor must be used to ensure compliance with this slew rate. 8.4 Power Supply and Modules over operating free-air temperature range (unless otherwise noted) PARAMETER TYP VDDS Power-on-Reset (POR) threshold UNIT 1.1 - 1.55 V VDDS Brown-out Detector (BOD) Rising threshold 1.77 V VDDS Brown-out Detector (BOD), before initial boot (1) Rising threshold 1.70 V VDDS Brown-out Detector (BOD) Falling threshold 1.75 V (1) Brown-out Detector is trimmed at initial boot, value is kept until device is reset by a POR reset or the RESET_N pin Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 9 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.5 Power Consumption - Power Modes When measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. PARAMETER TEST CONDITIONS TYP UNIT Core Current Consumption Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 Shutdown. No clocks running, no retention 150 RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF 0.94 µA RTC running, CPU, 80KB RAM and (partial) register retention XOSC_LF 1.09 µA RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF 3.2 µA RTC running, CPU, 80KB RAM and (partial) register retention. XOSC_LF 3.3 µA Idle Supply Systems and RAM powered RCOSC_HF 675 µA Active MCU running CoreMark at 48 MHz RCOSC_HF 3.39 mA Peripheral power domain Delta current with domain enabled 97.7 Serial power domain Delta current with domain enabled 7.2 RF Core Delta current with power domain enabled, clock enabled, RF Core idle µDMA Delta current with clock enabled, module is idle 63.9 Timers Delta current with clock enabled, module is idle(3) 81.0 I2C Delta current with clock enabled, module is idle 10.8 I2S Delta current with clock enabled, module is idle 27.6 SSI Delta current with clock enabled, module is idle UART Delta current with clock enabled, module is idle(1) 167.5 CRYPTO (AES) Delta current with clock enabled, module is idle(2) 25.6 PKA Delta current with clock enabled, module is idle 84.7 TRNG Delta current with clock enabled, module is idle 35.6 Reset and Shutdown Standby without cache retention Icore Standby with cache retention nA Peripheral Current Consumption Iperi 210.9 µA 82.9 Sensor Controller Engine Consumption ISCE (1) (2) (3) 10 Active mode 24 MHz, infinite loop 808.5 Low-power mode 2 MHz, infinite loop 31.9 µA Only one UART running Only one SSI running Only one GPTimer running Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.6 Power Consumption - Radio Modes When measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. PARAMETER TEST CONDITIONS Radio receive current Radio transmit current TYP UNIT 2440 MHz 6.9 mA 0 dBm output power setting 2440 MHz 7.0 mA +5 dBm output power setting 2440 MHz 9.2 mA 8.7 Nonvolatile (Flash) Memory Characteristics Over operating free-air temperature range and VDDS = 3.0 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP Flash sector size MAX 8 UNIT KB Supported flash erase cycles before failure, full bank(1) 30 k Cycles Supported flash erase cycles before failure, single sector(2) 60 k Cycles Maximum number of write operations per row before sector erase(3) 83 Flash retention 105 °C Flash sector erase current Flash sector erase 30k cycles Flash write current Average delta current, 4 bytes at a time Flash write time 4 bytes at a time (3) (4) 10.7 Zero cycles Flash sector erase time(4) (1) (2) Years at 105 °C 11.4 Average delta current time(4) Write Operations mA 10 ms 4000 ms 6.2 mA 21.6 µs A full bank erase is counted as a single erase cycle on each sector Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k cycles Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum per write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum number of write operations per row is reached. This number is dependent on Flash aging and increases over time and erase cycles 8.8 Thermal Resistance Characteristics PACKAGE THERMAL METRIC(1) RGZ (VQFN) UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 24.2 °C/W(2) RθJC(top) Junction-to-case (top) thermal resistance 13.6 °C/W(2) RθJB Junction-to-board thermal resistance 7.8 °C/W(2) ψJT Junction-to-top characterization parameter 0.1 °C/W(2) ψJB Junction-to-board characterization parameter 7.7 °C/W(2) RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W(2) (1) (2) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. °C/W = degrees Celsius per watt. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 11 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.9 Receive (RX) When measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2 Mbps Receiver sensitivity Differential mode. Measured at SMA connector, BER = 10–3 –92 dBm Receiver saturation Differential mode. Measured at SMA connector, BER = 10–3 >5 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–440 / 500) kHz Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–700 / 750) ppm Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 Selectivity, ±2 MHz(1) –7 dB Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz, BER = 10–3 8 / 4(2) dB Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 33 / 31(2) dB Selectivity, ±6 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ±6 MHz or more, BER = 10–3 37 / 32(2) dB Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 4 dB Selectivity, image frequency ±2 MHz(1) Note that Image frequency + 2 MHz is the Co-channel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10–3 –7 / 36(2) dB Out-of-band blocking(3) 30 MHz to 2000 MHz –16 dBm Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –12 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level –38 dBm RSSI dynamic range 63 dB RSSI Accuracy (+/-) ±4 dB (1) (2) (3) 12 Numbers given as I/C dB X / Y, where X is +N MHz and Y is –N MHz Excluding one exception at Fwanted / 2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.10 Transmit (TX) All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters 5dBm output power Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm Output power programmable range Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB Spurious emissions and harmonics Spurious emissions (1) Harmonics (1) (1) f < 1 GHz, outside restricted bands +5 dBm setting < –36 dBm f < 1 GHz, restricted bands ETSI +5 dBm setting < –54 dBm f < 1 GHz, restricted bands FCC +5 dBm setting < –55 dBm f > 1 GHz, including harmonics +5 dBm setting < –42 dBm Second harmonic +5 dBm setting < –42 dBm Third harmonic +5 dBm setting < –42 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Category 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 8.11 Timing and Switching Characteristics 8.11.1 Reset Timing PARAMETER MIN RESET_N low duration TYP MAX UNIT 1 µs 8.11.2 Wakeup Timing Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not include software overhead. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT MCU, Reset to Active(1) 850 - 3000 µs MCU, Shutdown to Active(1) 850 - 3000 µs MCU, Standby to Active 160 µs MCU, Active to Standby 36 µs MCU, Idle to Active 14 µs (1) The wakeup time is dependent on remaining charge on the VDDR capacitor when starting the device, and thus how long the device has been in Reset or Shutdown before starting up again. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 13 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.11.3 Clock Specifications 8.11.3.1 48 MHz Crystal Oscillator (XOSC_HF) Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.(1) PARAMETER MIN TYP Crystal frequency 48 ESR Equivalent series resistance 6 pF < CL ≤ 9 pF 20 ESR Equivalent series resistance 5 pF < CL ≤ 6 pF LM Motional inductance, relates to the load capacitance that is used for the crystal (CL in Farads)(5) CL Crystal load capacitance(4) (4) (5) 60 Ω 80 Ω H 7(3) 5 UNIT MHz < 0.3 × 10–24 / CL 2 Start-up time(2) (1) (2) (3) MAX 9 200 pF µs Probing or otherwise stopping the crystal while the DC/DC converter is enabled may cause permanent damage to the device. Start-up time using the TI-provided power driver. Start-up time may increase if driver is not used. On-chip default connected capacitance including reference design parasitic capacitance. Connected internal capacitance is changed through software in the Customer Configuration section (CCFG). Adjustable load capacitance is integrated within the device. The crystal manufacturer's specification must satisfy this requirement for proper operation. 8.11.3.2 48 MHz RC Oscillator (RCOSC_HF) Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN TYP MAX UNIT Frequency 48 MHz Uncalibrated frequency accuracy ±1 % Calibrated frequency accuracy(1) ±0.25 % 5 µs Start-up time (1) Accuracy relative to the calibration source (XOSC_HF) 8.11.3.3 2 MHz RC Oscillator (RCOSC_MF) Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN TYP MAX UNIT Calibrated frequency 2 MHz Start-up time 5 µs 8.11.3.4 32.768 kHz Crystal Oscillator (XOSC_LF) Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN Crystal frequency ESR Equivalent series resistance CL Crystal load capacitance (1) TYP MAX 32.768 6 UNIT kHz 30 100 kΩ 7(1) 12 pF Default load capacitance using TI reference designs including parasitic capacitance. Crystals with different load capacitance may be used. 8.11.3.5 32 kHz RC Oscillator (RCOSC_LF) Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. MIN Temperature coefficient (1) 14 TYP 32.8 (1) (2) Calibrated frequency ±50 MAX UNIT kHz ppm/C When using RCOSC_LF as source for the low frequency system clock (SCLK_LF), the accuracy of the SCLK_LF-derived Real Time Clock (RTC) can be improved by measuring RCOSC_LF relative to XOSC_HF and compensating for the RTC tick speed. This functionality is available through the TI-provided Power driver. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com (2) SWRS259C – DECEMBER 2020 – REVISED JULY 2023 The SIMPLELINK-WBMS-SDK does not use RCOSC_LF, but XOSC_LF. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 15 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.11.4 Synchronous Serial Interface (SSI) Characteristics 8.11.4.1 Synchronous Serial Interface (SSI) Characteristics Over operating free-air temperature range (unless otherwise noted) PARAMETER NO. PARAMETER MIN TYP UNIT 65024 System Clocks (2) S1 tclk_per SSIClk cycle time S2(1) tclk_high SSIClk high time 0.5 tclk_per S3(1) tclk_low SSIClk low time 0.5 tclk_per (1) (2) 12 MAX Refer to SSI timing diagrams Figure 8-1, Figure 8-2, and Figure 8-3. When using the TI-provided Power driver, the SSI system clock is always 48 MHz. S1 S2 SSIClk S3 SSIFss SSITx SSIRx MSB LSB 4 to 16 bits Figure 8-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement S2 S1 SSIClk S3 SSIFss SSITx MSB LSB 8-bit control SSIRx 0 MSB LSB 4 to 16 bits output data Figure 8-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer 16 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 Figure 8-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 8.11.5 UART 8.11.5.1 UART Characteristics Over operating free-air temperature range (unless otherwise noted) PARAMETER MIN UART rate TYP MAX 3 UNIT MBaud Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 17 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.12 Peripheral Characteristics 8.12.1 ADC Analog-to-Digital Converter (ADC) Characteristics Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1) Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers. PARAMETER TEST CONDITIONS Input voltage range MIN TYP 0 Resolution 12 Sample rate Offset Gain error DNL(4) Differential nonlinearity INL Integral nonlinearity ENOB Effective number of bits THD Total harmonic distortion SINAD, SNDR SFDR (1) 18 Signal-to-noise and distortion ratio MAX VDDS UNIT V Bits 200 kSamples/s Internal 4.3 V equivalent reference(2) –0.24 LSB reference(2) 7.14 LSB >–1 LSB ±4 LSB Internal 4.3 V equivalent Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone 9.8 Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone, DC/DC enabled 9.8 VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 10.1 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone 11.1 Internal reference, voltage scaling disabled, 14-bit mode, 200 kSamples/s, 600 Hz input tone (5) 11.3 Internal reference, voltage scaling disabled, 15-bit mode, 200 kSamples/s, 150 Hz input tone (5) 11.6 Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone –65 VDDS as reference, 200 kSamples/s, 9.6 kHz input tone –70 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone –72 Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone 60 VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 63 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone 68 Internal 4.3 V equivalent reference(2), 200 kSamples/s, 9.6 kHz input tone 70 Spurious-free dynamic range VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 73 Internal reference, voltage scaling disabled, 32 samples average, 200 kSamples/s, 300 Hz input tone 75 Conversion time Serial conversion, time-to-output, 24 MHz clock Current consumption Internal 4.3 V equivalent reference(2) Current consumption VDDS as reference Reference voltage Equivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/ offset compensation factors stored in FCFG1 Reference voltage Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3 V) as follows: Vref = 4.3 V × 1408 / 4095 Reference voltage 50 Bits dB dB dB clock-cycles 0.42 mA 0.6 mA 4.3(2) (3) V 1.48 V VDDS as reference, input voltage scaling enabled VDDS V Reference voltage VDDS as reference, input voltage scaling disabled VDDS / 2.82(3) V Input impedance 200 kSamples/s, voltage scaling enabled. Capacitive input, Input impedance depends on sampling frequency and sampling time >1 MΩ Using IEEE Std 1241-2010 for terminology and test methods Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com (2) (3) (4) (5) SWRS259C – DECEMBER 2020 – REVISED JULY 2023 Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V Applied voltage must be within Absolute Maximum Ratings (see Section 8.1 ) at all times No missing codes ADC_output = ∑(4n samples) >> n,n = desired extra bits Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 19 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.12.2 DAC 8.12.2.1 Digital-to-Analog Converter (DAC) Characteristics Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters Resolution 8 Bits Any load, any VREF, pre-charge OFF, DAC charge-pump ON 1.8 3.63 Any load, VREF = DCOUPL, pre-charge ON 2.6 3.63 16 VDDS Supply voltage FDAC Clock frequency Buffer OFF (internal load) Voltage output settling time VREF = VDDS, buffer OFF, internal load 1000 13 V kHz 1 / FDAC Internal Load - Continuous Time Comparator / Low Power Clocked Comparator Differential nonlinearity VREF = VDDS, load = Continuous Time Comparator or Low Power Clocked Comparator FDAC = 250 kHz ±1 Differential nonlinearity VREF = VDDS, load = Continuous Time Comparator or Low Power Clocked Comparator FDAC = 16 kHz ±1.2 DNL Offset error(2) Load = Continuous Time Comparator Offset error(2) Load = Low Power Clocked Comparator Max code output voltage variation(2) Load = Continuous Time Comparator Max code output voltage variation(2) Load = Low Power Clocked Comparator Output voltage range(2) Load = Continuous Time Comparator 20 LSB(1) VREF = VDDS= 3.63 V ±0.67 VREF = VDDS= 3.0 V ±0.81 VREF = VDDS = 1.8 V ±1.27 VREF = DCOUPL, pre-charge ON ±3.43 VREF = DCOUPL, pre-charge OFF ±2.88 VREF = VDDS = 3.63 V ±0.77 VREF = VDDS = 3.0 V ±0.77 VREF = VDDS= 1.8 V ±3.46 VREF = DCOUPL, pre-charge ON ±3.44 VREF = DCOUPL, pre-charge OFF ±4.70 VREF = VDDS = 3.63 V ±1.61 VREF = VDDS = 3.0 V ±1.71 VREF = VDDS= 1.8 V ±2.10 VREF = DCOUPL, pre-charge ON ±6.00 VREF = DCOUPL, pre-charge OFF ±3.85 VREF =VDDS= 3.63 V ±2.92 VREF =VDDS= 3.0 V ±3.06 VREF = VDDS= 1.8 V ±3.91 VREF = DCOUPL, pre-charge ON ±7.84 VREF = DCOUPL, pre-charge OFF ±4.06 VREF = VDDS= 3.63 V, code 1 0.03 VREF = VDDS= 3.63 V, code 255 3.46 VREF = VDDS= 3.0 V, code 1 0.02 VREF = VDDS= 3.0 V, code 255 2.86 VREF = VDDS= 1.8 V, code 1 0.01 VREF = VDDS = 1.8 V, code 255 1.71 VREF = DCOUPL, pre-charge OFF, code 1 0.01 VREF = DCOUPL, pre-charge OFF, code 255 1.21 VREF = DCOUPL, pre-charge ON, code 1 1.27 VREF = DCOUPL, pre-charge ON, code 255 2.46 Submit Document Feedback LSB(1) LSB(1) LSB(1) LSB(1) V Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER Output voltage range(2) Load = Low Power Clocked Comparator (1) (2) TEST CONDITIONS MIN TYP VREF = VDDS= 3.63 V, code 1 0.03 VREF = VDDS= 3.63 V, code 255 3.46 VREF = VDDS= 3.0 V, code 1 0.02 VREF = VDDS= 3.0 V, code 255 2.85 VREF = VDDS = 1.8 V, code 1 0.01 VREF = VDDS = 1.8 V, code 255 1.71 VREF = DCOUPL, pre-charge OFF, code 1 0.01 VREF = DCOUPL, pre-charge OFF, code 255 1.21 VREF = DCOUPL, pre-charge ON, code 1 1.27 VREF = DCOUPL, pre-charge ON, code 255 2.46 MAX UNIT V 1 LSB (VREF 3.63 V/3.0 V/1.8 V/DCOUPL/ADCREF) = 13.44 mV/11.13 mV/6.68 mV/4.67 mV/5.48 mV Includes comparator offset Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 21 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.12.3 Temperature and Battery Monitor 8.12.3.1 Temperature Sensor Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Resolution MAX UNIT 2 °C Accuracy -40 °C to 0 °C ±4.0 °C Accuracy 0 °C to 105 °C ±2.5 °C 4.1 °C/V Supply voltage (1) coefficient(1) The temperature sensor is automatically compensated for VDDS variation when using the TI-provided driver. 8.12.3.2 Battery Monitor Measured on the CC26x2REM-7ID-Q1 reference design with Tc = 25 °C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Resolution MAX 25 Range 1.8 Integral nonlinearity (max) Accuracy TYP 72 V mV 22.5 mV Offset error -32 mV Gain error -1.3 % 22 VDDS = 3.0 V mV 3.63 28 UNIT Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.12.4 Comparators 8.12.4.1 Continuous Time Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Input voltage range(1) TYP 0 Offset Measured at VDDS / 2 Decision time Step from –10 mV to 10 mV Current consumption Internal reference (1) MIN MAX UNIT VDDS V ±5 mV 0.78 µs 8.6 µA The input voltages can be generated externally and connected throughout I/Os or an internal reference voltage can be generated using the DAC 8.12.4.2 Low-Power Clocked Comparator Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Input voltage range MIN 0 Clock frequency MAX UNIT VDDS V SCLK_LF Internal reference voltage(1) Using internal DAC with VDDS as reference voltage, DAC code = 0 - 255 Offset Measured at VDDS / 2, includes error from internal DAC Decision time (1) TYP 0.024 - 2.865 Step from –50 mV to 50 mV V ±5 mV 1 Clock Cycle The comparator can use an internal 8 bits DAC as its reference. The DAC output voltage range depends on the reference voltage selected. See DAC Characteristics 8.12.5 Current Source 8.12.5.1 Programmable Current Source Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Current source programmable output range (logarithmic range) Resolution MIN TYP MAX 0.25 - 20 µA 0.25 µA Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 UNIT 23 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.12.6 GPIO 8.12.6.1 GPIO DC Characteristics PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = 25 °C, VDDS = 1.8 V GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 1.44 GPIO VOH at 4 mA load IOCURR = 1 GPIO VOL at 4 mA load IOCURR = 1 GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 32 GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS GPIO low-to-high input transition, with hysteresis GPIO high-to-low input transition, with hysteresis V 0.36 1.44 V V 0.36 V 68 110 µA 11 18.5 39 µA IH = 1, transition voltage for input read as 0 → 1 0.72 1.08 1.17 V IH = 1, transition voltage for input read as 1 → 0 0.54 0.72 0.87 V GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.18 0.36 0.51 V GPIO minimum VIH Lowest GPIO input voltage reliably interpreted as High 1.17 GPIO maximum VIL Highest GPIO Input voltage reliably interpreted as Low V 0.63 V TA = 25 °C, VDDS = 3.0 V GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only GPIO VOH at 4 mA load IOCURR = 1 GPIO VOL at 4 mA load IOCURR = 1 2.4 V 0.6 2.4 V V 0.6 V TA = 25 °C, VDDS = 3.63 V GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only GPIO VOH at 4 mA load IOCURR = 1 GPIO VOL at 4 mA load IOCURR = 1 GPIO pullup current Input mode, pullup enabled, Vpad = 0 V GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 64 GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.52 GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 1.14 GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.38 GPIO minimum VIH Lowest GPIO input voltage reliably interpreted as a High 2.47 GPIO maximum VIL Highest GPIO input voltage reliably interpreted as a Low 24 Submit Document Feedback 2.9 V 0.6 2.9 135 V V 0.6 V 380 µA 102 178 µA 1.90 2.21 V 1.48 1.83 V 0.42 1.07 V 264 V 1.33 V Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.13 Typical Characteristics All measurements in this section are done with Tc = 25 °C and VDDS = 3.0 V, unless otherwise noted. See Section 8.3 for device limits. Values exceeding these limits are for reference only. 8.13.1 MCU Current Running CoreMark, SCLK_HF = 48 MHz RCOSC 80 kB RAM retention, no Cache Retention, RTC On SCLK_LF = 32 kHz XOSC VDDS = 3.0 V 6 12 5.5 10 8 Current [uA] Current [mA] 5 4.5 4 6 4 3.5 2 3 2.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 0 -40 3.8 -25 -10 5 20 35 50 65 80 95 105 Temperature [ oC] Voltage [V] Figure 8-4. Active Mode (MCU) Current vs. Supply Voltage (VDDS) Figure 8-5. Standby Mode (MCU) Current vs. Temperature 80 kbps RAM Retention, no Cache Retention, RTC On SCLK_LF = 32 kHz RCOSC VDDS = 3.6 V 12 10 Current [uA) 8 6 4 2 0 -40 -25 -10 5 20 35 50 65 80 95 105 Temperature [ oC] Figure 8-6. Standby Mode (MCU) Current vs. Temperature (VDDS = 3.6 V) Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 25 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8 7.9 7.8 7.7 7.6 7.5 7.4 7.3 7.2 7.1 7 6.9 6.8 6.7 6.6 6.5 6.4 6.3 6.2 6.1 6 -40 11.5 11 10.5 10 9.5 Current [mA] Current [mA] 8.13.2 RX Current 9 8.5 8 7.5 7 6.5 6 5.5 -25 -10 5 20 35 50 65 80 95 105 5 1.8 2 Temperature [ oC] 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Figure 8-7. RX Current versus Temperature (WBMS, 2.44 GHz) 26 2.2 Figure 8-8. RX Current versus Supply Voltage (VDDS) (WBMS, 2.44 GHz) Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.13.3 TX Current 9 12 8.8 11.5 8.6 11 8.4 10.5 8.2 10 Current [mA] Current [mA] 8 7.8 7.6 7.4 7.2 7 9.5 9 8.5 8 7.5 6.8 7 6.6 6.5 6.4 6 6.2 6 -40 -25 -10 5 20 35 50 65 80 95 105 5.5 1.8 2 2.2 2.4 2.6 Temperature [ oC] 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Figure 8-9. TX Current vs. Temperature (WBMS, 2.44 GHz, 0 dBm) Figure 8-10. TX Current vs. Supply Voltage (VDDS) (WBMS, 2.44 GHz, 0 dBm) Table 8-1 shows typical TX current and output power for different output power settings. Table 8-1. Typical TX Current and Output Power CC2662R-Q1 at 2.4 GHz, VDDS = 3.0 V (Measured on CC2652REM-7ID-Q1) txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA] 0x8623 5 5.0 9.2 0x5E1A 4 4.1 8.6 0x7217 3.5 3.6 8.8 0x4867 3 3.2 8.2 0x3860 2 2.0 7.6 0x2E5C 1 1.2 7.3 0x2E59 0 0.3 7.0 0x2853 -2 -2.2 6.8 0x10D9 -5 -5.0 5.9 0x0AD1 -10 -9.5 5.3 0x0ACC -15 -13.7 4.9 0x0AC8 -20 -18.6 4.6 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 27 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.13.4 RX Performance -87 -84 -85 -88 -87 -90 -88 Sensitivity [dBm] Sensitivity [dBm] -86 -89 -91 -92 -93 -89 -90 -91 -92 -93 -94 -94 -95 -95 -96 -96 -97 -97 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 -98 -40 2.48 -25 -10 5 20 Frequency [GHz] 35 50 65 80 95 105 Temperature [°C] Figure 8-11. Sensitivity versus Frequency (WBMS, 2.44 GHz) Figure 8-12. Sensitivity versus Temperature (WBMS, 2.44 GHz) -86 -84 -87 -86 -88 -88 Sensitivity [dBm] Sensitivity [dBm] -89 -90 -91 -92 -90 -92 -94 -93 -96 -94 -98 -95 -96 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 -100 1.8 2 Figure 8-13. Sensitivity versus Supply Voltage (VDDS) (WBMS, 2.44 GHz) 28 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 Voltage [V] Voltage [V] Figure 8-14. Sensitivity versus Supply Voltage (VDDS) (WBMS, 2.44 GHz, DCDC off) Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -40 Output Power [dBm] Output Power [dBm] 8.13.5 TX Performance -25 -10 5 20 35 50 65 80 95 105 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.2 3 -40 -25 -10 5 35 50 65 80 95 Figure 8-15. Output Power vs. Temperature (WBMS, 2.44 GHz, 0dBm) Figure 8-16. Output Power vs. Temperature (WBMS, 2.44 GHz, +5dBm) 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 1.8 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.2 3 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 2 2.2 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.6 2.8 3 3.2 3.4 3.6 3.8 Figure 8-18. Output Power vs. Supply Voltage (VDDS) (WBMS, 2.44 GHz, +5dBm) Output Power [dBm] Figure 8-17. Output Power vs. Supply Voltage (VDDS) (WBMS, 2.44 GHz, 0dBm) 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 2.4 105 Voltage [V] Voltage [V] Output Power [dBm] 20 Temperature [ oC] Output Power [dBm] Output Power [dBm] Temperature [ oC] 2.456 2.464 2.472 2.48 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.2 3 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48 Frequency [GHz] Frequency [GHz] Figure 8-19. Output Power vs. Frequency (WBMS, 0dBm) Figure 8-20. Output Power vs. Frequency (WBMS, +5dBm) Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 29 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 8.13.6 ADC Performance 11.4 Vin = 3.0 V Sine wave, Internal reference, Fin = Fs / 10 Internal Reference, No Averaging Internal Unscaled Reference, 14-bit Mode 10.2 11.1 10.15 10.1 ENOB [Bit] ENOB [Bit] 10.8 10.5 10.2 10.05 10 9.95 9.9 9.9 9.85 9.6 0.2 0.3 0.5 0.7 1 2 3 4 5 6 7 8 10 20 9.8 30 40 50 70 100 1 Frequency [kHz] 2 4 5 6 7 8 10 70 100 200 Vin = 3.0 V Sine wave, Internal reference, 200 kSamples/s 2.5 1 2 0.5 1.5 DNL [LSB] 1.5 0 1 -0.5 0.5 -1 0 -1.5 -0.5 0 400 800 1200 1600 2000 2400 2800 3200 3600 4000 0 400 800 1200 1600 ADC Code Vin = 1 V, Internal reference, 200 kSamples/s 1.009 1.008 1.008 1.007 1.007 Voltage [V] 1.009 1.006 1.005 1.004 1.002 1.001 1.001 10 20 30 40 4000 1.004 1.002 0 3600 1.005 1.003 -10 3200 1.006 1.003 -20 2800 Vin = 1 V, Internal reference, 200 kSamples/s 1.01 -30 2400 Figure 8-24. DNL versus ADC Code 1.01 1 -40 2000 ADC Code Figure 8-23. INL versus ADC Code Voltage [V] 30 40 50 Figure 8-22. ENOB versus Sampling Frequency Vin = 3.0 V Sine wave, Internal reference, 200 kSamples/s 50 60 70 80 90 100 1 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage [V] Temperature [°C] Figure 8-25. ADC Accuracy versus Temperature 30 20 Frequency [kHz] Figure 8-21. ENOB versus Input Frequency INL [LSB] 3 Figure 8-26. ADC Accuracy versus VDDS Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9 Detailed Description 9.1 Overview Figure 4-1 shows the core modules of the CC2662R-Q1 device. 9.2 System CPU The CC2662R-Q1 SimpleLink™ Wireless MCU contains an Arm® Cortex®-M4F system CPU, which runs the application and the higher layers of the Wireless BMS protocol stack. The system CPU is the foundation of a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts. Its features include the following: • ARMv7-M architecture optimized for small-footprint embedded applications • Arm Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit Arm core in a compact memory size • Fast code execution permits increased sleep mode time • Deterministic, high-performance interrupt handling for time-critical applications • Single-cycle multiply instruction and hardware divide • Hardware division and fast digital-signal-processing oriented multiply accumulate • Saturating arithmetic for signal processing • IEEE 754-compliant single-precision Floating Point Unit (FPU) • Memory Protection Unit (MPU) for safety-critical applications • Full debug with data matching for watchpoint generation – Data Watchpoint and Trace Unit (DWT) – JTAG Debug Access Port (DAP) – Flash Patch and Breakpoint Unit (FPB) • Trace support reduces the number of pins required for debugging and tracing – Instrumentation Trace Macrocell Unit (ITM) – Trace Port Interface Unit (TPIU) with asynchronous serial wire output (SWO) • Optimized for single-cycle flash memory access • Tightly connected to 8-KB 4-way random replacement cache for minimal active power consumption and wait states • Ultra-low-power consumption with integrated sleep modes • 48 MHz operation • 1.25 DMIPS per MHz Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 31 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.3 Radio (RF Core) The RF Core is a highly flexible and future proof radio module which contains an Arm Cortex-M0 processor that interfaces the analog RF and base-band circuitry, handles data to and from the system CPU side, and assembles the information bits in a given packet structure. The RF Core offers a high level, command-based API to the main CPU that configurations and data are passed through. The Arm Cortex-M0 processor is not programmable by customers and is interfaced through the TI-provided RF driver that is included with the SimpleLink Software Development Kit (SDK). The RF Core can autonomously handle the time-critical aspects of the radio protocols, thus offloading the main CPU, which reduces power consumption and leaves more resources for the user application. Several signals are also available to control external circuitry such as RF switches or range extenders autonomously. The various physical layer radio formats are partly built as a software defined radio where the radio behavior is either defined by radio ROM contents or by non-ROM radio formats delivered in form of firmware patches with the SimpleLink SDKs. This allows the radio platform to be updated for support of future versions of standards even with over-the-air (OTA) upgrades while still using the same silicon. 32 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.4 Memory The up to 352-KB nonvolatile (Flash) memory provides storage for code and data. The flash memory is in-system programmable and erasable. The last flash memory sector must contain a Customer Configuration section (CCFG) that is used by boot ROM and TI provided drivers to configure the device. This configuration is done through the ccfg.c source file that is included in all TI provided examples. The ultra-low leakage system static RAM (SRAM) is split into up to five 16-KB blocks and can be used for both storage of data and execution of code. Retention of SRAM contents in Standby power mode is enabled by default and included in Standby mode power consumption numbers. Parity checking for detection of bit errors in memory is built-in, which reduces chip-level soft errors and thereby increases reliability. System SRAM is always initialized to zeroes upon code execution from boot. To improve code execution speed and lower power when executing code from nonvolatile memory, a 4-way nonassociative 8-KB cache is enabled by default to cache and prefetch instructions read by the system CPU. The cache can be used as a general-purpose RAM by enabling this feature in the Customer Configuration Area (CCFG). There is a 4-KB ultra-low leakage SRAM available for use with the Sensor Controller Engine which is typically used for storing Sensor Controller programs, data and configuration parameters. This RAM is also accessible by the system CPU. The Sensor Controller RAM is not cleared to zeroes between system resets. The ROM includes a TI-RTOS kernel and low-level drivers, as well as significant parts of selected radio stacks, which frees up flash memory for the application. The ROM also contains a serial (SPI and UART) bootloader that can be used for initial programming of the device. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 33 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.5 Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in both Standby and Active power modes. The peripherals in this domain can be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously; thereby significantly reducing power consumption and offloading the system CPU. The Sensor Controller Engine is user programmable with a simple programming language that has a syntax similar to C. This programmability allows for sensor polling and other tasks to be specified as sequential algorithms rather than static configuration of complex peripheral modules, timers, DMA, register programmable state machines, or event routing. The main advantages are: • Flexibility - data can be read and processed in unlimited manners while still • 2 MHz low-power mode enables lowest possible handling of digital sensors • Dynamic reuse of hardware resources • 40-bit accumulator supporting multiplication, addition and shift • Observability and debugging options Sensor Controller Studio is used to write, test, and debug code for the Sensor Controller. The tool produces C driver source code, which the System CPU application uses to control and exchange data with the Sensor Controller. Typical use cases may be (but are not limited to) the following: • Read analog sensors using integrated ADC or comparators • Interface digital sensors using GPIOs, SPI, UART, or I2C (UART and I2C are bit-banged) • Capacitive sensing • Waveform generation • Very low-power pulse counting (flow metering) • Key scan The Sensor Controller peripherals include the following: • The low-power clocked comparator can be used to wake the system CPU from any state in which the comparator is active. A configurable internal reference DAC can be used in conjunction with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC. • Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higheraccuracy alternative to the low-power clocked comparator. The Sensor Controller takes care of baseline tracking, hysteresis, filtering, and other related functions when these modules are used for capacitive sensing. • The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources including timers, I/O pins, software, and comparators. • The analog modules can connect to up to eight different GPIOs • Dedicated SPI Controller with up to 6 MHz clock speed The Sensor Controller peripherals can also be controlled from the main application processor. 34 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.6 Cryptography The CC2662R-Q1 device comes with a wide set of modern cryptography-related hardware accelerators, drastically reducing code footprint and execution time for cryptographic operations. It also has the benefit of being lower power and improves availability and responsiveness of the system because the cryptography operations runs in a background hardware thread. Together with a large selection of open-source cryptography libraries provided with the Software Development Kit (SDK), this allows for secure and future proof IoT applications to be easily built on top of the platform. The hardware accelerator modules are: • True Random Number Generator (TRNG) module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear-combinatorial circuit. • Secure Hash Algorithm 2 (SHA-2) with support for SHA224, SHA256, SHA384, and SHA512 • Advanced Encryption Standard (AES) with 128 and 256 bit key lengths • Public Key Accelerator - Hardware accelerator supporting mathematical operations needed for elliptic curves up to 512 bits and RSA key pair generation up to 1024 bits. Through use of these modules and the TI provided cryptography drivers, the following capabilities are available for an application or stack: • Key Agreement Schemes – Elliptic curve Diffie–Hellman with static or ephemeral keys (ECDH and ECDHE) – Elliptic curve Password Authenticated Key Exchange by Juggling (ECJ-PAKE) • Signature Generation – Elliptic curve Diffie-Hellman Digital Signature Algorithm (ECDSA) • Curve Support – Short Weierstrass form (full hardware support), such as: • NIST-P224, NIST-P256, NIST-P384, NIST-P521 • Brainpool-256R1, Brainpool-384R1, Brainpool-512R1 • secp256r1 – Montgomery form (hardware support for multiplication), such as: • Curve25519 • SHA2 based MACs – HMAC with SHA224, SHA256, SHA384, or SHA512 • Block cipher mode of operation – AESCCM – AESGCM – AESECB – AESCBC – AESCBC-MAC • True random number generation Other capabilities, such as RSA encryption and signatures as well as Edwards type of elliptic curves such as Curve1174 or Ed25519, can also be implemented using the provided hardware accelerators but are not part of the TI SimpleLink SDK for the CC2662R-Q1 device. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 35 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.7 Timers A large selection of timers are available as part of the CC2662R-Q1 device. These timers are: • Real-Time Clock (RTC) • A 70-bit 3-channel timer running on the 32 kHz low frequency system clock (SCLK_LF) This timer is available in all power modes except Shutdown. The timer can be calibrated to compensate for frequency drift when using the RCOSC_LF as the low frequency system clock. If an external LF clock with frequency different from 32.768 kHz is used, the RTC tick speed can be adjusted to compensate for this. When using TI-RTOS, the RTC is used as the base timer in the operating system and should thus only be accessed through the kernel APIs such as the Clock module. The real time clock can also be read by the Sensor Controller Engine to timestamp sensor data and also has dedicated capture channels. By default, the RTC halts when a debugger halts the device. General-Purpose Timers (GPTIMER) • The four flexible GPTIMERs can be used as either 4× 32 bit timers or 8× 16 bit timers, all running on up to 48 MHz. Each of the 16- or 32-bit timers support a wide range of features such as one-shot or periodic counting, pulse width modulation (PWM), time counting between edges and edge counting. The inputs and outputs of the timer are connected to the device event fabric, which allows the timers to interact with signals such as GPIO inputs, other timers, DMA and ADC. The GPTIMERs are available in Active and Idle power modes. Sensor Controller Timers The Sensor Controller contains 3 timers: AUX Timer 0 and 1 are 16-bit timers with a 2N prescaler. Timers can either increment on a clock or on each edge of a selected tick source. Both one-shot and periodical timer modes are available. • AUX Timer 2 is a 16-bit timer that can operate at 24 MHz, 2 MHz or 32 kHz independent of the Sensor Controller functionality. There are 4 capture or compare channels, which can be operated in one-shot or periodical modes. The timer can be used to generate events for the Sensor Controller Engine or the ADC, as well as for PWM output or waveform generation. Radio Timer • A multichannel 32-bit timer running at 4 MHz is available as part of the device radio. The radio timer is typically used as the timing base in wireless network communication using the 32-bit timing word as the network time. The radio timer is synchronized with the RTC by using a dedicated radio API when the device radio is turned on or off. This ensures that for a network stack, the radio timer seems to always be running when the radio is enabled. The radio timer is in most cases used indirectly through the trigger time fields in the radio APIs and should only be used when running the accurate 48 MHz high frequency crystal as the source of SCLK_HF. Watchdog timer The watchdog timer is used to regain control if the system operates incorrectly due to software errors. It is typically used to generate an interrupt to and reset of the device for the case where periodic monitoring of the system components and tasks fails to verify proper functionality. The watchdog timer runs on a 1.5 MHz clock rate and cannot be stopped once enabled. The watchdog timer pauses to run in Standby power mode and when a debugger halts the device. 36 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.8 Serial Peripherals and I/O The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's synchronous serial interfaces. The SSIs support both SPI Controller and Peripheral up to 4 MHz. The SSI modules support configurable phase and polarity. The UARTs implement universal asynchronous receiver and transmitter functions. They support flexible baudrate generation up to a maximum of 3 Mbps. The I2S interface is used to handle digital audio and can also be used to interface pulse-density modulation microphones (PDM). The I2C interface is also used to communicate with devices compatible with the I2C standard. The I2C interface can handle 100 kHz and 400 kHz operation, and can serve as both Controller and Target. The I/O controller (IOC) controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function, and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high-drive capabilities, which are marked in bold in Section 7. All digital peripherals can be connected to any digital pin on the device. For more information, see the CC13x2, CC26x2 SimpleLink™ Wireless MCU Technical Reference Manual. 9.9 Battery and Temperature Monitor A combined temperature and battery voltage monitor is available in the CC2662R-Q1 device. The battery and temperature monitor allows an application to continuously monitor on-chip temperature and supply voltage and respond to changes in environmental conditions as needed. The module contains window comparators to interrupt the system CPU when temperature or supply voltage go outside defined windows. These events can also be used to wake up the device from Standby mode through the Always-On (AON) event fabric. 9.10 µDMA The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data-transfer tasks from the system CPU, thus allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform a transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory when the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list): • • • • Highly flexible and configurable channel operation of up to 32 channels Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral Data sizes of 8, 16, and 32 bits Ping-pong mode for continuous streaming of data 9.11 Debug The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface. The device boots by default into cJTAG mode and must be reconfigured to use 4-pin JTAG. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 37 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 9.12 Power Management To minimize power consumption, the CC2662R-Q1 supports a number of power modes and power management features (see Table 9-1). Table 9-1. Power Modes MODE SOFTWARE CONFIGURABLE POWER MODES ACTIVE IDLE STANDBY SHUTDOWN RESET PIN HELD CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On Retention Off Off Supply System On On Duty Cycled Off Off Register and CPU retention Full Full Partial No No SRAM retention Full Full Full No No 48 MHz high-speed clock (SCLK_HF) XOSC_HF or RCOSC_HF XOSC_HF or RCOSC_HF Off Off Off 2 MHz medium-speed clock (SCLK_MF) RCOSC_MF RCOSC_MF Available Off Off 32 kHz low-speed clock (SCLK_LF) XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF Off Off Peripherals Available Available Off Off Off Sensor Controller Available Available Available Off Off Wake-up on RTC Available Available Available Off Off Wake-up on pin edge Available Available Available Available Off Wake-up on reset pin On On On On On Brownout detector (BOD) On On Duty Cycled Off Off Power-on reset (POR) On On On Off Off Watchdog timer (WDT) Available Available Paused Off Off In Active mode, the application system CPU is actively executing code. Active mode provides normal operation of the CPU and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 9-1). In Idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event brings the processor back into active mode. In Standby mode, only the always-on (AON) domain is active. An external wake-up event, RTC event, or Sensor Controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode. In Shutdown mode, the device is entirely turned off (including the AON domain and Sensor Controller), and the I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin defined as a wake from shutdown pin wakes up the device and functions as a reset trigger. The CPU can differentiate between reset in this way and reset-by-reset pin or power-on reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the flash memory contents. 38 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Interface independently of the system CPU. This means that the system CPU does not have to wake up, for example to perform an ADC sampling or poll a digital sensor over SPI, thus saving both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio tool enables the user to program the Sensor Controller, control its peripherals, and wake up the system CPU as needed. All Sensor Controller peripherals can also be controlled by the system CPU. Note The power, RF and clock management for the CC2662R-Q1 device require specific configuration and handling by software for optimized performance. This configuration and handling is implemented in the TI-provided drivers that are part of the CC2662R-Q1 software development kit (SDK). Therefore, TI highly recommends using this software framework for all application development on the device. The complete SDK with TI-RTOS, device drivers, and examples are offered free of charge in source code. 9.13 Clock Systems The CC2662R-Q1 device has several internal system clocks. The 48 MHz SCLK_HF is used as the main system (MCU and peripherals) clock. This can be driven by the internal 48 MHz RC Oscillator (RCOSC_HF) or an external 48 MHz crystal (XOSC_HF). Radio operation requires an external 48 MHz crystal. SCLK_MF is an internal 2 MHz clock that is used by the Sensor Controller in low-power mode and also for internal power management circuitry. The SCLK_MF clock is always driven by the internal 2 MHz RC Oscillator (RCOSC_MF). SCLK_LF is the 32.768 kHz internal low-frequency system clock. It can be used by the Sensor Controller for ultra-low-power operation and is also used for the RTC and to synchronize the radio timer before or after Standby power mode. SCLK_LF can be driven by the internal 32.8 kHz RC Oscillator (RCOSC_LF), a 32.768 kHz watch-type crystal, or a clock input on any digital IO. When using a crystal or the internal RC oscillator, the device can output the 32 kHz SCLK_LF signal to other devices, thereby reducing the overall system cost. Note that theSDK relies on a 32.768 kHz crystal (XOSC_LF) being used. 9.14 Network Processor Depending on the product configuration, the CC2662R-Q1 device can function as a wireless network processor (WNP - a device running the wireless protocol stack with the application running on a separate host MCU), or as a system-on-chip (SoC) with the application and protocol stack running on the system CPU inside the device. In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 39 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 10 Application, Implementation, and Layout Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. For general design guidelines and hardware configuration guidelines, refer to CC13xx/CC26xx Hardware Configuration and PCB Design Considerations Application Report. 10.1 Reference Designs The following reference designs should be followed closely when implementing designs using the CC2662R-Q1 device. Special attention must be paid to RF component placement, decoupling capacitors and DC/DC regulator components, as well as ground connections for all of these. CC26x2REM-7ID-Q1 Design Files The CC26x2REM-7ID-Q1 reference design provides schematic, layout and production files for the characterization board used for deriving the performance number found in this document. CC2662RQ1-EVM-WBMS Design Files The CC2662RQ1-EVM-WBMS Design Files contain detailed schematics and layouts to build application specific boards using the CC2662R-Q1 device. Sub-1 GHz and 2.4 The antenna kit allows real-life testing to identify the optimal antenna for your GHz Antenna Kit for application. The antenna kit includes 16 antennas covering frequencies from LaunchPad™ Development Kit 169 MHz to 2.4 GHz, including: and SensorTag • PCB antennas • Helical antennas • Chip antennas • Dual-band antennas for 868 MHz and 915 MHz combined with 2.4 GHz The antenna kit includes a JSC cable to connect to the Wireless MCU LaunchPad Development Kits and SensorTags. 40 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 10.2 Junction Temperature Calculation This section shows the different techniques for calculating the junction temperature under various operating conditions. For more details, see Semiconductor and IC Package Thermal Metrics. There are three recommended ways to derive the junction temperature from other measured temperatures: 1. From package temperature: T J = ψJT × P + Tcase (1) 2. From board temperature: T J = ψJB × P + Tboard (2) 3. From ambient temperature: T J = RθJA × P + TA (3) P is the power dissipated from the device and can be calculated by multiplying current consumption with supply voltage. Thermal resistance coefficients are found in Section 8.8. Example: Using Equation 3, the temperature difference between ambient temperature and junction temperature is calculated. In this example, we assume a simple use case where the radio is transmitting continuously at 0 dBm output power. Let us assume the ambient temperature is 105 °C and the supply voltage is 3 V. To calculate P, we need to look up the current consumption for Tx at 105 °C in . From the plot, we see that the current consumption is 7.9 mA. This means that P is 7.9 mA × 3 V = 23.7 mW. The junction temperature is then calculated as: T J = 23.0°C W × 23.7mW + TA = 0.5°C + TA (4) As can be seen from the example, the junction temperature will be 0.5 °C higher than the ambient temperature when running continuous Tx at 105 °C. For various application use cases current consumption for other modules may have to be added to calculate the appropriate power dissipation. For example, the MCU may be running simultaneously as the radio, peripheral modules may be enabled, etc. Typically, the easiest way to find the peak current consumption, and thus the peak power dissipation in the device, is to measure as described in Measuring CC13xx and CC26xx current consumption. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 41 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 11 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed as follows. 11.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or datecode. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, XCC2662R-Q1 is in preview; therefore, an X prefix/identification is assigned). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGZ). For orderable part numbers of CC2662R-Q1 devices in the RGZ (7-mm x 7-mm) package type, see the Package Option Addendum of this document, the Device Information in Section 3, the TI website (www.ti.com), or contact your TI sales representative. CC2662 R 1 FTW RGZ PREFIX X = Experimental device Blank = Qualified devie R Q1 AUTOMOTIVE Q1 Q1 = Q100 DEVICE SimpleLink™ Ultra-Low-Power Wireless MCU R = Large Reel T = Small Reel CONFIGURATION R = Regular P = +20 dBm PA included PACKAGE RGZ = 48-pin VQFN (Very Thin Quad Flatpack No-Lead) ROM Revision F = Flash T = -40
C to 105 C W = Wettable flanks Figure 11-1. Device Nomenclature 11.2 Tools and Software The CC2662R-Q1 device is supported by a variety of software and hardware development tools. Development Kit CC2662RQ1-EVM-WBMS Development Kit The SimpleLink CC2662RQ1-EVM-WBMS development kit is an easy-to-use evaluation module for Wireless BMS evaluation board featuring BQ7961x-Q1 FuSa Compliant and SimpleLink™ CC2662R-Q1 wireless MCU. 42 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 It contains everything needed to start developing on the SimpleLink™ CC2662R-Q1, including a XDS110 JTAG debug probe for programming, debugging, and energy measurements. The SimpleLink™ CC2662R-Q1 is an AEC-Q100 compliant wireless microcontroller (MCU) targeting wireless automotive applications. The device is optimized for low-power wireless communication in applications such as battery management systems (BMS) and cable replacement. Software SimpleLink™ WMBS SDK The SimpleLink WMBS Software Development Kit (SDK) provides a complete package for the development of wireless applications on the 2.4 GHz CC2662R-Q1 device The SimpleLink WMBS SDK is part of TI’s SimpleLink MCU platform, offering a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. For more information about the SimpleLink MCU Platform, visit http://www.ti.com/simplelink. Development Tools Code Composer Studio™ Integrated Development Environment (IDE) Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse® software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers. CCS has support for all SimpleLink Wireless MCUs and includes support for EnergyTrace™ software (application energy usage profiling). A real-time object viewer plugin is available for TI-RTOS, part of the SimpleLink SDK. Code Composer Studio is provided free of charge when used in conjunction with the XDS debuggers included on a LaunchPad Development Kit. SmartRF™ Studio SmartRF™ Studio is a Windows® application that can be used to evaluate and configure SimpleLink Wireless MCUs from Texas Instruments. The application will help designers of RF systems to easily evaluate the radio at an early stage in the design process. It is especially useful for generation of configuration register values and for practical testing and debugging of the RF system. SmartRF Studio can be used either as a standalone application or together with applicable evaluation boards or debug probes for the RF device. Features of the SmartRF Studio include: • • • • Link tests - send and receive packets between nodes Antenna and radiation tests - set the radio in continuous wave TX and RX states Export radio configuration code for use with the TI SimpleLink SDK RF driver Custom GPIO configuration for signaling and control of external switches Sensor Controller Studio Sensor Controller Studio is used to write, test and debug code for the Sensor Controller peripheral. The tool generates a Sensor Controller Interface driver, which is a set of C source files that are compiled into the System CPU application. These source files also contain the Sensor Controller binary image and allow the System CPU application to control and exchange data with the Sensor Controller. Features of the Sensor Controller Studio include: • • Ready-to-use examples for several common use cases Full toolchain with built-in compiler and assembler for programming in a C-like programming language Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 43 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 • Provides rapid development by using the integrated sensor controller task testing and debugging functionality, including visualization of sensor data and verification of algorithms CCS UniFlash CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs. UniFlash has a GUI, command line, and scripting interface. CCS UniFlash is available free of charge. 11.2.1 SimpleLink™ Microcontroller Platform The SimpleLink microcontroller platform sets a new standard for developers with the broadest portfolio of wired and wireless Arm® MCUs (System-on-Chip) in a single software development environment. Delivering flexible hardware, software and tool options for your IoT applications. Invest once in the SimpleLink software development kit and use it throughout your entire portfolio. Learn more on ti.com/simplelink. 11.3 Documentation Support To receive notification of documentation updates on data sheets, errata, application notes and similar, navigate to the device product folder on ti.com/product/CC2662R-Q1. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. The current documentation that describes the MCU, related peripherals, and other technical collateral is listed as follows. Errata CC2662R-Q1 Silicon Errata The silicon errata describes the known exceptions to the functional specifications for each silicon revision of the device and description on how to recognize a device revision. Application Reports All application reports for the CC2662R-Q1 device are found on the device product folder at: ti.com/product/ CC2662R-Q1. Technical Reference Manual (TRM) CC13x2, CC26x2 SimpleLink™ Wireless MCU TRM The TRM provides a detailed description of all modules and peripherals available in the device family. 11.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.5 Trademarks Code Composer Studio™, EnergyTrace™, and TI E2E™ are trademarks of Texas Instruments. Arm® and Cortex® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. CoreMark® is a registered trademark of Embedded Microprocessor Benchmark Consortium Corporation. Wi-Fi® is a registered trademark of Wi-Fi Alliance. Arm Thumb® is a registered trademark of Arm Limited (or its subsidiaries). Eclipse® is a registered trademark of Eclipse Foundation. Windows® is a registered trademark of Microsoft Corporation. All trademarks are the property of their respective owners. 44 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 45 CC2662R-Q1 www.ti.com SWRS259C – DECEMBER 2020 – REVISED JULY 2023 12 Mechanical, Packaging, and Orderable Information 46 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: CC2662R-Q1 PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) CC2662R1FTWRGZRQ1 ACTIVE VQFN RGZ 48 4000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 CC2662 Q1 R1F (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of