CC3000EM

Product Folder Sample & Buy Technical Documents Support & Community Tools & Software Not Recommended For New Designs CC3000 www.ti.com SWRS126 – NOVEMBER 2012 TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor FEATURES 1 • Wireless network processor – IEEE 802.11 b/g – Embedded IPv4 TCP/IP stack • Best-in-class radio performance Wi-Fi™ – TX power: +18.0 dBm at 11 Mbps, CCK – RX sensitivity: –88 dBm, 8% PER, 11 Mbps • Works with low MIPS and low-cost MCUs with compact memory footprint • FCC, IC, and CE certified with a chip antenna • HW design files and design guide available from TI • Integrated crystal and power management • Small form factor: 16.3 mm × 13.5 mm × 2 mm 234 • • • Operating temperature: –20°C to 70°C Based on TI's seventh generation of proven Wi-Fi solutions Complete platform solution including user and porting guides, API guide, sample applications, and support community APPLICATIONS • • • • • Home automation Home security Connected appliances Smart energy M2M communication DESCRIPTION The TI CC3000 module is a self-contained wireless network processor that simplifies the implementation of Internet connectivity (see Figure 1). TI's SimpleLink™ Wi-Fi solution minimizes the software requirements of the host microcontroller (MCU) and is thus the ideal solution for embedded applications using any low-cost and lowpower MCU. The TI CC3000 module reduces development time, lowers manufacturing costs, saves board space, eases certification, and minimizes the RF expertise required. This complete platform solution includes software drivers, sample applications, API guide, user documentation, and a world-class support community. For more information on TI’s wireless platform solutions for Wi-Fi, go to TI's Wireless Connectivity wiki (www.ti.com/connectivitywiki). SWRS126-013 Figure 1. Wi-Fi Solution for TI SimpleLink CC3000 Module 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SimpleLink, Smart Config are trademarks of Texas Instruments. Wi-Fi is a trademark of Wi-Fi Alliance. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated CC3000 Not Recommended For New Designs SWRS126 – NOVEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. FEATURES WLAN • • • • • 802.11b/g integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK and OFDM rates from 1 to 54 Mbps in the 2.4-GHz ISM band Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design. Advanced connection manager with seven user-configurable profiles stored in an NVMEM allows automatic fast connection to an access point without user or host intervention. Supports all Wi-Fi security modes for personal networks: WEP, WPA, and WPA2 with on-chip security accelerators Smart Config™ WLAN provisioning tools allow customers to connect a headless device to a WLAN network using a smart phone, tablet, or PC. Network Stack • Integrated IPv4 TCP/IP stack with BSD socket APIs enables simple internet connectivity with any microcontroller, microprocessor, or ASIC. • Supports four simultaneous TCP or UDP sockets • Built-in network protocols: ARP, ICMP, DHCP client, and DNS client enable easy connection to the local network and to the Internet. Host Interface and Driver • Interfaces over 4-wire serial peripheral interface (SPI) with any microcontroller, or processor at clock speed up to16 MHz • Low footprint driver provided for TI MCUs and easily ported to any processor or ASIC • Simple APIs enable easy integration with any single-threaded or multi-threaded application. System • Works from a single, preregulated power supply or connects directly to a battery • Separated I/O voltage rail allows flexible integration with host processors • Ultra-low leakage shut-down mode with current 3.6V TYP C5 1uF CAP1005 GND GND GND GND 10 RESERVED_3 R2 0R RES1005 37 38 39 40 GND GND WL_RS232_RX 9 SPI_CLK 8 GND WL_EN1 CC3000MOD 18 WL_RS232_TX 7 17 WL_EN2 6 GND 5 16 TP5 TP4 and TP5 CC3000 Radio Tool Connection 1.8V. NC 4 SPI_DIN TP4 3 15 R5 0R RES1005 SDA_EEPROM SPI_IRQ 0R NC RESERVED_1 27 SPI_DOUT NC 0R Test Mode for Radio Tool Operation TP2 28 GND 14 Function mode R4 NL RES1005 GND 36 R5 SDA_CC3000 2 SPI_CS R4 RF_ANT GND 1 TP1 Mode R1 0R RES1005 NL_10pF CAP1005 13 C3 12 2 1 3 J1 NL_U.FL-R-SMT(10) U.FL C2 10pF CAP1005 GND GND GND GND GND GND Optional for conductive measurment WL_SPI_CLK_HOST WL_SPI_DIN_HOST WL_SPI_IRQ_HOST WL_SPI_DOUT_HOST WL_SPI_CS_HOST Connect to Host SPI Interface. SWRS126-009 Figure 9. CC3000 Module to Host Reference Design NOTE For flexibility, VIO_HOST supports both cases in which the VBAT and VIO voltages of the MCU can be the same or different. Table 9 lists the bill of materials. Table 9. Bill of Materials Part Reference ANT1 C1 C0402, 2.2 pF Manufacturer PN ACX AT8010-E2R9HAA Walsin 0402N2R2C500LT Hl1005-1C2N2SMT L2 L0402, 2.2 nH ACX C0402, 10 pF Walsin 0402N100J500LT C4, C5 (1) C0402, 1 µF Murata GRM155R60J105KE19D R0402, 0R Walsin WR04X000PTL RF coaxial U.FL, SMD Hirose U.FL-R-SMT-1(10) J1 12 Manufacturer C2 (1) R1, R2, R5 (1) (1) Description 2.4-GHz chip antenna, 8.0 × 1.0 mm Any component with similar values can be used. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: CC3000 CC3000 Not Recommended For New Designs www.ti.com SWRS126 – NOVEMBER 2012 DESIGN RECOMMENDATIONS This section describes the layout recommendations for the CC3000 module, RF trace, and antenna. Antenna The ACX ceramic antenna is mounted on the CC3000 EVM board with a specific layout and matching circuit for the radiation test conducted in FCC, CE and IC certifications. Figure 10 shows the location of the antenna on the EVM board as well as the RF trace routing from the CC3000 module. No trace and Via stitching beside RF trace ground under Antenna on antenna section the edge of PCB Top layer Bottom layer Constant No sharp impedance for corner RF trace SWRS126-015 Figure 10. RF Trace and Antenna Design for PCB Layout Module Layout Recommendations Observe the following module layout recommendations (see also Figure 11): • Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted. • Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting layer. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: CC3000 13 CC3000 Not Recommended For New Designs SWRS126 – NOVEMBER 2012 www.ti.com Signal trace Solid ground plane and vias run on third layer No trace under module Top layer Bottom layer SWRS126-014 Figure 11. Module Layout RF Trace and Antenna Layout Recommendations Observe the following recommendations for RF trace and antenna layout (see also Figure 10): • RF traces must have 50-Ω impedance (microstrip transmission line). • RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace mitered. RF traces must not have sharp corners. • There must be no traces or ground under the antenna section. • RF traces must have via stitching on the ground plane beside the RF trace on both sides. • RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. 14 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: CC3000 PACKAGE OPTION ADDENDUM www.ti.com 1-Dec-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC3000MOD NRND 46 TBD Call TI Call TI -20 to 70 CC3000MODR NRND 46 TBD Call TI Call TI -20 to 70 CC3000MODT NRND 46 TBD Call TI Call TI CC3000YFVR NRND DSBGA YFV 126 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM CC3000YFVT NRND DSBGA YFV 126 TBD Call TI Call TI XCC3000MOD OBSOLETE 46 TBD Call TI Call TI CC3000 CC3000 -20 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Dec-2015 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device CC3000YFVR Package Package Pins Type Drawing DSBGA YFV 126 SPQ 0 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 Pack Materials-Page 1 4.7 B0 (mm) K0 (mm) P1 (mm) 5.16 0.7 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC3000YFVR DSBGA YFV 126 0 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated