CC3200MOD
CC3200MOD
SWRS166C – NOVEMBER 2014 – REVISED SEPTEMBER
2020
SWRS166C – NOVEMBER 2014 – REVISED SEPTEMBER 2020
www.ti.com
CC3200MOD SimpleLink™ Wi-Fi® and Internet-of-Things Module, Solution,
Single-Chip Wireless MCU
•
1 Features
•
•
•
•
•
•
•
CC3200MOD is a Wi-Fi® module consisting of
CC3200R1M2RGC single-chip wireless
microcontroller (MCU)
Fully integrated module includes all required
clocks, SPI Flash, and passives
Modular FCC, IC, TELEC, and CE certifications
save customer effort, time, and money
Wi-Fi Alliance members can request certificate
transfer of Wi-Fi CERTIFIED™ modules
1.27-mm pitch QFM package for easy assembly
and low-cost PCB design
Applications MCU subsystem:
– Arm® Cortex®-M4 core at 80 MHz
– Embedded memory:
• Integrated serial Flash
• RAM (up to 256KB)
• Peripheral drivers in ROM
– Hardware crypto engine for advanced hardware
security including:
• AES, DES, and 3DES
• SHA and MD5
• CRC and Checksum
– 8-Bit parallel camera
– One Multichannel Audio Serial Port (McASP)
interface with support for I2S format
– One SD (MMC) interface
– 32-channel Micro Direct Memory Access
(μDMA)
– Two Universal Asynchronous Receivers and
Transmitters (UARTs)
– Two Serial Peripheral Interfaces (SPIs)
– One Inter-integrated Circuit (I2C)
– Four General-Purpose Timers (GPTs)
– 16-Bit Pulse-Width Modulation (PWM) mode
– One Watchdog Timer Module
– 4-channel, 12-bit Analog-to-Digital Converters
(ADCs)
– Up to 25 individually programmable GPIO pins
Wi-Fi network processor subsystem:
– 802.11 b/g/n radio, baseband, and medium
access control
– TCP/IP Stack
•
•
Eight simultaneous TCP, UDP, or RAW
sockets
• Two simultaneous TLS v1.2 or SSL 3.0
sockets
– ARP, ICMP, DHCP, DNS, and mDNS support
– HTTP server with built-in programmable HTML
page for over-the-network device configuration
– Powerful crypto engine for fast, secured WLAN
connections with 256-bit encryption
– Station, Access Point, and Wi-Fi Direct® Modes
– WPA2 personal and enterprise security
– SimpleLink™ connection manager for managing
Wi-Fi security states
– TX power:
• 17.0 dBm at 1 DSSS
• 17.25 dBm at 11 CCK
• 13.5 dBm at 54 OFDM
– RX sensitivity:
• –94.7 dBm at 1 DSSS
• –87.0 dBm at 11 CCK
• –73.0 dBm at 54 OFDM
– Application Throughput:
• UDP: 16 Mbps
• TCP: 13 Mbps
Power-management subsystem:
– Integrated DC/DC converter with
a wide-supply voltage:
• VBAT: 2.3 to 3.6 V
– Low-power consumption At 3.6 V:
• Hibernate with Real-Time Clock (RTC):
7 μA
• Low-Power Deep Sleep: 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12 to 24 hours
Baking times: 1 time
48
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11.5 Soldering and Reflow Condition
•
•
•
•
•
•
Heating method: Conventional convection or IR convection
Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent method
Solder paste composition: Sn/3.0 Ag/0.5 Cu
Allowable reflow soldering times: 2 times based on the reflow soldering profile
(see Figure 11-1)
Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 11-1)
Peak temperature: 245°C
Figure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder
Joint)
Note
TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module.
This coating can lead to localized stress on the solder connections inside the module and impact the
module reliability. Use caution during the module assembly process to the final PCB to avoid the
presence of foreign material inside the module.
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the processors,
generate code, develop algorithm implementations, and fully integrate and debug software and hardware
modules. The tool's support documentation is electronically available within the Code Composer Studio™
Integrated Development Environment (IDE).
The following products support development of the CC3200MOD applications:
Software Development Tools: Code Composer Studio Integrated Development Environment (IDE): including
Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time
Foundation Software ( DSP/BIOS™), which provides the basic run-time target software needed to support any
CC3200MOD application.
Hardware Development Tools: Extended Development System ( XDS™) Emulator
For a complete listing of development-support tools for the CC3200MOD platform, visit the Texas Instruments
website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or
authorized distributor.
TI Designs and Reference Designs
The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded
processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs
include schematic or block diagrams, BOMs, and design files to speed your time to market.
12.1.2 Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes,
TI recommends that the user has the latest service pack in his or her module for production. To stay informed,
sign up for the SDK Alert Me button on the tools page or www.ti.com/tool/cc3200sdk .
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12.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3200MOD and support tools (see Figure 12-1).
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for
example, CC3200MOD ). Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering
prototypes (TMDX) through fully qualified production devices and tools (TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
null Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
X
CC 3 2 2 0 MOD xxxx
MOB
R
PACKAGING
R = tape/reel
T = small reel
PREFIX
X = preproduction device
no prefix = production device
PACKAGE DESIGNATOR
MOB = LGA package
SM2 = S module
SM12 = SF module
DEVICE FAMILY
CC = wireless connectivity
SERIES NUMBER
3 = Wi-Fi Centric
MODULE
MOD = module
Figure 12-1. CC3200MOD Module Nomenclature
For orderable part numbers of CC3200MOD devices in the QFM package type, see Section 13.2, see ti.com, or
contact your TI sales representative.
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12.3 Documentation Support
The following documents describe the CC3200MOD processor and MPU. These documents are available online
at www.ti.com.
SimpleLink™ Wi-Fi® CC3200 and Internet-of-Things Solution, a Single Chip Wireless MCU Technical
Reference Manual
CC3200 Peripheral Driver Library User's Guide Documentation
12.4 Trademarks
Wi-Fi CERTIFIED™ is a trademark of Wi-Fi Alliance.
SimpleLink™ and Internet-on-a chip™ are trademarks of TI.
E2E™, Code Composer Studio™, DSP/BIOS™, and XDS™ are trademarks of Texas Instruments.
BoosterPack™ is a trademark of Texas Instruments.
Macrocell™ is a trademark of Kappa Global Inc.
Wi-Fi® and Wi-Fi Direct® are registered trademarks of Wi-Fi Alliance.
Thumb® is a registered trademark of Arm Limited.
ZigBee® is a registered trademark of ZigBee Alliance.
All other trademarks are the property of their respective owners.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document.
13.1 Mechanical Drawing
Note
Maximum height of the module is 2.45 mm, because it includes a paper label on the top side.
[1.5 + 0.88 + 0.07].
Figure 13-1. Mechanical Drawing
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Figure 13-2. Land Pattern Drawing
Note
1. All dimensions are in mm.
2. Solder mask should be the same or 5% larger than the dimension of the pad
3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make the solder
paste 20% smaller than the pad.
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13.2 Package Option
We offer two reel size options for flexibility: a 750-unit reel and a 250-unit reel.
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13.2.1 Packaging Information
(1)
(2)
(3)
(4)
(5)
Orderable Device
Status (1)
Package
Drawing
Pins
Package Qty
Eco Plan (2)
Lead/Ball Finish
MSL, Peak Temp (3)
Op Temp (°C)
Device Marking(4) (5)
CC3200MODR1M2AMOBR
ACTIVE
MOB
63
750
RoHS Exempt
Ni Au
3, 250°C
–20 to 70
CC3200MODR1M2AMOB
CC3200MODR1M2AMOBT
ACTIVE
MOB
63
250
RoHS Exempt
Ni Au
3, 250°C
–20 to 70
CC3200MODR1M2AMOB
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material)
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by
third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain
information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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13.2.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
P1
K0
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
Device
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CC3200MODR1M2AMOB
R
MOB
63
750
330.0±2.0
44.0
17.85±0.10
20.85±0.10
2.50±0.10
24.00±0.10
44.00±0.30
Q1
CC3200MODR1M2AMOB
T
MOB
63
250
330.0±2.0
44.0
17.85±0.10
20.85±0.10
2.50±0.10
24.00±0.10
44.00±0.30
Q1
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
L
W
58
H
Device
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC3200MODR1M2AMOBR
MOB
63
750
354.0
354.0
55.0
CC3200MODR1M2AMOBT
MOB
63
250
354.0
354.0
55.0
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PACKAGE OUTLINE
MOB0063A
QFM - 2.4 mm max height
SCALE 0.650
QUAD FLAT MODULE
17.75
17.25
A
B
PIN 1 INDEX
AREA
20.75
20.25
2X (0.45)
2X (0.38)
C
2.40
2.03
0.1
0.88
0.72
2X 12.7
(0.3) TYP
20X 1.27
30X 1.27
16
17
27
28
29
15
(0.3)
TYP
(0.32)
PADS 1,16,28 & 43
9X
2 0.05
1.5
60
57
2X
19.05
63
56
59
62
6X 3
61
55
58
54X
2
1
42
44
54
PIN 1 ID
(45 X1)
0.81
0.15
0.05
0.08
C A B
C
43
1.5
6X 3
4221462/D 06/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
MOB0063A
QFM - 2.4 mm max height
QUAD FLAT MODULE
SEE DETAIL
PKG
54X ( 0.81)
44
54
1
43
42
2
( 8.1)
9X ( 2)
0.05 MIN TYP
(45 X 1)
58
( 0.2) TYP
VIA
61
55
SOLDER MASK
OPENING
9X
METAL UNDER
SOLDER MASK
59
62
56
PKG
6X (3)
2X (19.1)
(1.5)
63
57
(0.65)
TYP
60
(1.5)
(0.65)
TYP
6X (3)
(1.27) TYP
15
29
16
(R0.05)
ALL PADS
28
17
27
2X (16.1)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE:6X
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SIGNAL PADS DETAIL
4221462/D 06/2019
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
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EXAMPLE STENCIL DESIGN
MOB0063A
QFM - 2.4 mm max height
QUAD FLAT MODULE
PKG
54X ( 0.81)
54
(R0.05)
TYP
44
1
43
2
42
SOLDER MASK
EDGE, TYP
SOLDER MASK EDGE
58
55
SEE DETAILS
61
59
62
56
PKG
(3) TYP
2X (19.1)
(1.5) TYP
57
63
60
(1.5) TYP
(3) TYP
(1.27) TYP
15
29
16
28
17
27
2X (16.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
(1.54)
EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA
PAD 55: 77.5 %, PADS 56 - 63: 79%
SCALE:6X
(0.55) TYP
(0.55) TYP
(0.45)
2X ( 0.89)
(R0.05)
TYP
(0.55 TYP)
( 0.89) TYP
(0.55) TYP
METAL
TYP
(R0.05) TYP
PADS 56 - 63 DETAIL
PAD 55 DETAIL
SCALE:10X
SCALE:10X
4221462/D 06/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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