CD4010BQDRQ1

CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com CMOS HEX BUFFER/CONVERTER Check for Samples: CD4010B-Q1 FEATURES 1 • • • • • Qualified for Automotive Applications 100% Tested for Quiescent Current at 20 V Maximum Input Current of 1 µA at 18 V Over Full Package-Temperature Range: 100 nA at 18 V and 25°C 5-V, 10-V, and 15-V Parametric Ratings Latch-Up Performance Meets 100 mA per JESD 78, Class I D PACKAGE (TOP VIEW) APPLICATIONS • • • • CMOS to DTL/TTL Hex Converter CMOS Current "Sink" or "Source" Driver CMOS High-to-Low Logic-Level Converter Multiplexer: 1-to-6 or 6-to-1 DESCRIPTION CD4010B hex buffer/converter may be used as CMOS to TTL or DTL logic-level converters or CMOS high-sink-current drivers. The CD4050B is the preferred hex buffer replacement for the CD4010B in all applications except multiplexers. For applications not requiring high sink current or voltage conversion, the CD4069UB hex inverter is recommended. The CD4010B is supplied in 16-lead hermetic dual-in-line ceramic (D) packages. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) SOIC – D Reel of 2500 ORDERABLE PART NUMBER CD4010BQDRQ1 TOP-SIDE MARKING CD4010BQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2012, Texas Instruments Incorporated CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Figure 1. Schematic Diagram – One of Six Identical Stages Functional Diagram 2 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD DC supply voltage range, voltages referenced to VSS terminal Input voltage range, all inputs DC input current, any one input PD Power dissipation per package Device dissipation per output transistor VALUE UNIT –0.5 to +20 V –0.5 to VDD +0.5 V ±10 mA TA = –40°C to +100°C 500 TA = +100°C to +125°C Derate linearly at 12 mW/°C to 200 mW mW 100 mW °C TA = full package-temperature range (all packages types) TA Operating temperature range –40 to +125 Tstg Storage temperature range –65 to +150 °C 100 mA Latch-up performance per JESD 78, Class I Human-body model (HBM) ESD (1) (2) Electrostatic discharge rating (2) 500 Machine model (MM) 100 Charged-Device Model (CDM) 1000 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Tested in accordance with AEC-Q100. RECOMMENDED OPERATING CONDITIONS MIN VDD VCC VI (1) Supply voltage range (1) Input voltage range MAX 3 18 3 VDD VCC VDD UNIT V V The CD4010B has high-to-low level voltage conversion capability, but not low-to-high level; therefore, it is recommended that VDD > VI > VCC. Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 3 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com STATIC ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER IDD Max TEST CONDITIONS LIMITS AT INDICATED TEMPERATURES (°C) VO VDD –40 +85 +125 Quiescent device current 0.4 IOL Min Output low (sink) current IOH Min Output high (source) current VOL Max VOH Min VIL Max VIH Min IIN Max 4 Input current UNIT TYP MAX 0, 5 5 1 30 30 0.02 1 0, 10 10 2 60 60 0.02 2 0, 15 15 4 120 120 0.02 4 0.04 20 0,20 20 20 600 600 0, 5 4.5 3.1 2.1 1.8 2.6 0, 5 5 3.6 2.4 2.1 3 4 0, 10 10 9.6 6.4 5.6 8 10 1.5 0, 15 15 40 19 16 24 36 4.6 0, 5 5 –0.23 –0.18 –0.15 –0.2 –0.4 2.5 0, 5 5 –0.9 –0.65 –0.58 –0.8 –1.6 9.5 0, 10 10 –0.5 –0.38 –0.33 –0.45 –0.9 13.5 0, 15 15 –1.6 –1.25 –1.1 –1.5 –3 mA mA 0, 5 5 0.05 0 0.05 0, 10 10 0.05 0 0.05 0, 15 15 0.05 0 0.05 0, 5 5 4.95 4.95 5 0, 10 10 9.95 9.95 10 0, 15 15 14.95 14.95 15 0.5 5 1.5 1 10 3 3 1.5 15 4 4 4.5 5 3.5 9 10 7 7 13.5 15 11 11 0, 18 18 ±0.1 Submit Documentation Feedback ±1 µA 3.4 0.5 Output voltage: High-level Input high voltage +25 MIN 0.4 Output voltage: Low-level Input low voltage VIN V V 1.5 V 3.5 ±1 V ±10–5 ±0.1 µA Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com DYNAMIC ELECTRICAL CHARACTERISTICS TA = 25°C, Input tr/tf = 20 ns, CL = 50 pf, RL = 200 kΩ TEST CONDITIONS PARAMETER tPLH tPHL tTLH Propagation delay time: low-to-high Propagation time: high-to-low Transition time: low-to-high tTHL Transition time: high-to-low CIN Input capacitance VDD (V) VI (V) LIMITS ALL PKGS VCC (V) TYP MAX 5 5 5 100 200 10 10 10 50 100 10 10 5 50 100 15 15 15 35 70 15 15 5 35 70 5 5 5 65 130 10 10 10 35 70 10 10 5 30 70 15 15 15 25 50 15 15 5 20 40 5 5 5 150 350 10 10 10 75 150 15 15 15 55 110 5 5 5 35 90 10 10 10 20 45 15 15 15 15 40 5 7.5 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 UNIT ns ns ns ns pF 5 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com TYPICAL CHARACTERISTICS 6 Figure 2. Minimum and Maximum Voltage Transfer Characteristics (VDD = 5 V) Figure 3. Minimum and Maximum Voltage Transfer Characteristics (VDD = 10 V) Figure 4. Minimum and Maximum Voltage Transfer Characteristics (VDD = 15 V) Figure 5. Typical Voltage Transfer Characteristics as a Function of Temperature Figure 6. Typical Output Low (Sink) Current Characteristics Figure 7. Minimum Output Low (Sink) Current Characteristics Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 8. Typical Output High (Source) Current Characteristics Figure 9. Minimum Output High (Source) Current Characteristics Figure 10. Typical Low-to-High Propagation Delay Time vs Load Capacitance Figure 11. Typical High-to-Low Propagation Delay Time vs Load Capacitance Figure 12. Typical Low-to-High Transition Time vs Load Capacitance Figure 13. Typical High-to-Low Transition Time vs Load Capacitance Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 7 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 14. Typical Dissipation Characteristics 8 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 15. Quiescent Device Current Test Circuit Figure 16. Noise Immunity Test Circuit Figure 17. Input Current Test Circuit Note: Dimensions in parentheses are in millimeters and are dereived from the basic inch dimensions as indicated. Grid graduation are in mils (10–3 inch). Figure 18. Dimensions and Layout Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 9 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com REVISION HISTORY Changes from Original (March 2010) to Revision A • 10 Page Changed STATIC ELECTRICAL CHARACTERISTICS table to correct typos and misplaced data .................................... 4 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CD4010BQDRQ1 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 CD4010BQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of