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CD4051B-Q1, CD4053B-Q1
SCHS354B – AUGUST 1998 – REVISED APRIL 2019
CD405xB-Q1 CMOS Single 8-Channel Analog Multiplexer/Demultiplexer
with Logic-Level Conversion
1 Features
3 Description
•
The
CD405xB-Q1
analog
multiplexers
and
demuliplexers are digitally-controlled analog switches
having low ON impedance and very low OFF leakage
current. These multiplexer circuits dissipate extremely
low quiescent power over the full VDD – VSS and
VDD – VEE supply-voltage ranges, independent of the
logic state of the control signals.
1
•
•
•
•
•
•
•
•
•
AEC-Q100 Qualified for Automotive Applications
– Temperature Grade 1: –45°C To +125°C, TA
Wide Range of Digital and Analog Signal Levels
– Digital: 3 V to 20 V
– Analog: ≤ 20 VP-P
Low ON Resistance,125 Ω (Typical) Over 15 VP-P
Signal Input Range for VDD – VEE = 18 V
High OFF Resistance, Channel Leakage of
±100 pA (Typical) at VDD – VEE = 18 V
Logic-Level Conversion for Digital Addressing
Signals of 3 V to 20 V (VDD – VSS = 3 V to 20 V)
to Switch Analog Signals to 20 VP-P (VDD – VEE =
20 V) Matched Switch Characteristics, rON = 5 Ω
(Typical) for VDD – VEE = 15 V Very Low Quiescent
Power Dissipation Under All Digital-Control Input
and Supply Conditions, 0.2 µW (Typical) at
VDD – VSS = VDD – VEE = 10 V
Binary Address Decoding on Chip
5 V, 10 V, and 15 V Parametric Ratings
100% Tested for Quiescent Current at 20 V
Maximum Input Current of 1 µA at 18 V Over Full
Package Temperature Range, 100 nA at 18 V and
25°C
Break-Before-Make Switching Eliminates Channel
Overlap
Device Information(1)
PART NUMBER
CD405xB
•
•
•
•
•
•
•
•
Analog and Digital Multiplexing and
Demultiplexing
A/D and D/A Conversion
Signal Gating
Factory Automation
Televisions
Appliances
Consumer Audio
Programmable Logic Circuits
Sensors
BODY SIZE (NOM)
SOIC (D) (16)
9.90 mm × 3.91 mm
TSSOP (PW) (16) 5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Diagrams of CD405xB-Q1
INH
C
B
A
Ch 0
CBA
000
001
Ch 1
010
Ch 2
011
Ch 3
100
Ch 4
COM
101
110
111
CD4051B
INH
B
Ch X0
A
BA
00
2 Applications
•
PACKAGE
01
X COM
10
Y COM
11
Ch 6
Ch 7
INH
Ch Y0
Ch X1
ax OR ay
A
ax
A
ay
B
bx
B
by
C
cx
C
cy
Ch Y1
Ch X2
bx OR by
Ch Y2
Ch X3
CD4052B
Ch 5
Ch Y3
cx OR cy
CD4053B
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CD4051B-Q1, CD4053B-Q1
SCHS354B – AUGUST 1998 – REVISED APRIL 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
5
5
5
5
6
8
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
AC Performance Characteristics...............................
Typical Characteristics ..............................................
Parameter Measurement Information ................ 10
Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagrams ..................................... 14
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 16
9
Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Application ................................................. 17
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 Device and Documentation Support ................. 20
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
20
20
20
13 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
Changes from Revision A (January 2008) to Revision B
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Deleted part number CD4052B-Q1 from the data sheets ...................................................................................................... 1
2
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Copyright © 1998–2019, Texas Instruments Incorporated
Product Folder Links: CD4051B-Q1 CD4053B-Q1
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
5 Pin Configuration and Functions
CD4051B-Q1
D or PW Package
(Top View)
CH 4 IN/OUT
1
16
VDD
CH 6 IN/OUT
2
15
CH 2 IN/OUT
CO M OUT/IN
3
14
CH 1 IN/OUT
CH 7 IN/OUT
4
13
CH 0 IN/OUT
CH 5 IN/OUT
5
12
CH 3 IN/OUT
INH
6
11
A
VEE
7
10
B
VSS
8
9
C
No t to scale
Pin Functions CD4051B-Q1
PIN
I/O
DESCRIPTION
NO.
NAME
1
CH 4 IN/OUT
I/O
Channel 4 in/out
2
CH 6 IN/OUT
I/O
Channel 6 in/out
3
COM OUT/IN
I/O
Common out/in
4
CH 7 IN/OUT
I/O
Channel 7 in/out
5
CH 5 IN/OUT
I/O
Channel 5 in/out
6
INH
I
7
VEE
—
Negative power input
8
VSS
—
Ground
9
C
I
Channel select C. See Table 1.
10
B
I
Channel select B. See .
11
A
I
Channel select A. See Table 1.
12
CH 3 IN/OUT
I/O
Channel 3 in/out
13
CH 0 IN/OUT
I/O
Channel 0 in/out
14
CH 1 IN/OUT
I/O
Channel 1 in/out
15
CH 2 IN/OUT
I/O
Channel 2 in/out
16
VDD
—
Positive power input
Disables all channels. See Table 1.
Copyright © 1998–2019, Texas Instruments Incorporated
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
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CD4053B-Q1
D or PW Package
(Top View)
BY IN/OUT
1
16
VDD
BX IN/OUT
2
15
BX OR BY OUT/IN
CY IN/OUT
3
14
AX OR AY OUT/IN
CX OR CY OUT/IN
4
13
AY IN/OUT
CX IN/OUT
5
12
AX IN/OUT
INH
6
11
A
VEE
7
10
B
VSS
8
9
C
No t to scale
Pin Functions CD4053B-Q1
PIN
I/O
DESCRIPTION
NO.
NAME
1
BY IN/OUT
I/O
B channel Y in/out
2
BX IN/OUT
I/O
B channel X in/out
3
CY IN/OUT
I/O
C channel Y in/out
4
CX OR CY
OUT/IN
I/O
C common out/in
5
CX IN/OUT
I/O
C channel X in/out
6
INH
I
7
VEE
—
Negative power input
8
VSS
—
Ground
9
C
I
Channel select C. See Table 1.
10
B
I
Channel select B. See Table 1.
11
A
I
Channel select A. See Table 1.
12
AX IN/OUT
I/O
A channel X in/out
13
AY IN/OUT
I/O
A channel Y in/out
14
AX OR AY
OUT/IN
I/O
A common out/in
15
BX OR BY
OUT/IN
I/O
B common out/in
16
VDD
—
Positive power input
4
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Disables all channels. See Table 1.
Copyright © 1998–2019, Texas Instruments Incorporated
Product Folder Links: CD4051B-Q1 CD4053B-Q1
CD4051B-Q1, CD4053B-Q1
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply Voltage
V+ to V-, Voltages Referenced to VSS Terminal
DC Input Voltage
DC Input Current
Any One Input
TJMAX1
Maximum junction temperature, ceramic package
TJMAX2
Maximum junction temperature, plastic package
Tstg
Storage temperature
(1)
MIN
MAX
UNIT
–0.5
20
V
–0.5
VDD + 0.5
V
–10
10
mA
175
°C
150
°C
150
°C
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
CD4051B-Q1 in PDIP, CDIP, SOIC, SOP, TSSOP Packages
V(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002 (1)
HBM ESD Classification Level 2
±3000
Charged-device model (CDM), per AEC Q100-011
CDM ESD Classification Level C6
±2000
V
CD4053B-Q1 in PDIP, CDIP, SOP and TSSOP Packages
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002 (1)
HBM ESD Classification Level 2
±2500
Charged-device model (CDM), per AEC Q100-011
CDM ESD Classification Level C6
±1500
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Temperature Range
MIN
MAX
UNIT
–55
125
°C
6.4 Thermal Information
CD405xB-Q1
THERMAL METRIC (1)
D
PW
16 Pins
16 Pins
108
UNIT
RθJA
Junction-to-ambient thermal resistance
86.7
RθJC(top)
Junction-to-case (top) thermal resistance
47.3
°C/W
RθJB
Junction-to-board thermal resistance
45.3
°C/W
ψJT
Junction-to-top characterization parameter
12.1
°C/W
ψJB
Junction-to-board characterization parameter
44.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 1998–2019, Texas Instruments Incorporated
Product Folder Links: CD4051B-Q1 CD4053B-Q1
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
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6.5 Electrical Characteristics
over operating free-air temperature range, VSUPPLY = ±5 V, and RL = 100 Ω, (unless otherwise noted) (1)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PARAMETER
VIS (V)
VEE (V)
VSS (V)
VDD (V)
TEMP
SIGNAL INPUTS (VIS) AND OUTPUTS (VOS)
–55°C
5
–40°C
5
25°C
5
0.04
150
125°C
150
–55°C
10
–40°C
10
Quiescent Device Current, IDD Max
5
85°C
25°C
10
0.04
10
85°C
300
125°C
300
–55°C
20
µA
–40°C
15
25°C
20
0.04
600
125°C
600
–55°C
100
–40°C
20
25°C
100
0.08
0
5
3000
125°C
3000
–55°C
800
25°C
850
470
0
0
10
85°C
1200
1300
–55°C
310
25°C
300
180
0
15
520
125°C
550
–55°C
200
25°C
Change in ON Resistance
(Between Any Two Channels),
∆rON
5
0
0
10
0
0
15
240
300
125°C
0
Ω
210
125
85°C
0
400
85°C
–40°C
0
1050
125°C
–40°C
Drain to Source ON Resistance rON Max
0 ≤ VIS ≤ VDD
100
85°C
–40°C
0
20
85°C
300
15
25°C
Ω
10
5
–55°C
± 100
–40°C
OFF Channel Leakage Current: Any Channel OFF (Max)
or ALL Channels OFF (Common OUT/IN) (Max)
0
0
18
25°C
± 0.01
± 100 (2)
nA
± 1000 (2)
85°C
125°C
ON Channel Leakage Current: Any Channel ON (Max) or
ALL Channels ON (Common OUT/IN) (Max)
Input, CIS
5 or 0
-5
0
10.5
85°C
± 300 (3)
5
0
0
18
85°C
± 300 (3)
–5
–5
–5
25°C
CD4051B-Q1
Capacitance
Output, COS
6
5
30
pF
CD4053B-Q1
25°C
Feed through, CIOS
(1)
(2)
(3)
nA
9
0.2
Peak-to-Peak voltage symmetrical about (VDD – VEE) / 2.
Determined by minimum feasible leakage measurement for automatic testing.
Does not apply to Hi-Rel CD4051BF and CD4051BFA3 devices.
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
Electrical Characteristics (continued)
over operating free-air temperature range, VSUPPLY = ±5 V, and RL = 100 Ω, (unless otherwise noted)(1)
TEST CONDITIONS
MIN
TYP
MAX
30
60
15
30
10
20
UNIT
PARAMETER
VIS (V)
VEE (V)
VDD
RL = 200 kΩ ,
5
CL = 50 pF,
10
tr , tf = 20 ns
15
Propagation Delay Time (Signal Input to Output)
VSS (V)
VDD (V)
TEMP
25°C
ns
CONTROL (ADDRESS OR INHIBIT), VC
5
Input Low Voltage, VIL , Max
10
15
VIL = VDD
through 1
kΩ ;
VIH = VDD
through 1
kΩ
–55°C
1.5
–40°C
1.5
25°C
1.5
85°C
1.5
125°C
1.5
–55°C
3
–40°C
3
25°C
3
85°C
3
125°C
3
–55°C
4
–40°C
4
25°C
4
85°C
VEE = VSS,
RL = 1 kΩ to VSS,
IIS < 2 µA on All OFF
Channels
4
125°C
4
–55°C
3.5
–40°C
5
25°C
3.5
3.5
85°C
3.5
125°C
3.5
–55°C
7
–40°C
Input High Voltage, VIH , Min
10
25°C
7
7
85°C
125°C
7
–55°C
11
25°C
85°C
Input Current, IIN (Max)
VIN = 0, 18
18
Propagation
Delay Time
Propagation
Delay Time
Propagation
Delay Time
Inhibit-to-Signal OUT (Channel
Turning ON) (See Figure 10)
Inhibit-to-Signal OUT (Channel
Turning OFF) (See Figure 16)
tr , tf = 20
ns,
CL = 50 pF,
RL = 10 kΩ
tr , tf = 20
ns,
CL = 50 pF,
RL = 1 kΩ
tr , tf = 20
ns,
CL = 50 pF,
RL = 10 kΩ
11
11
11
125°C
11
–55°C
± 0.1
–40°C
± 0.1
25°C
± 10–5
85°C
±1
125°C
Address-to-Signal OUT (Channels ON
or OFF) (See Figure 9, Figure 10, and
Figure 14)
V
7
–40°C
15
V
± 0.1
µA
±1
0
0
5
450
720
0
0
10
160
320
0
0
15
120
240
–5
0
5
225
450
0
0
5
400
720
0
0
10
160
320
0
0
15
120
240
–10
0
5
200
400
0
0
5
200
450
0
0
10
90
210
0
0
15
70
160
–10
0
5
130
300
5
7.5
ns
ns
ns
Input Capacitance, CIN (Any Address or Inhibit Input)
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
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6.6 AC Performance Characteristics
PARAMETER
TEST CONDITIONS
VIS (V)
VDD (V)
RL (kΩ)
5 (1)
10
1
Cutoff (–3dB)
Frequency Channel
ON (Sine Wave
Input)
VOS at Common OUT/IN
CD4053B-Q1
30
CD4051B-Q1
20
VEE = VSS ,
20 Log
Total Harmonic
Distortion, THD
TYP
MHz
VOS at Any Channel
VOS
= – 3 dB
VIS
2 (1)
5
3 (1)
10
5 (1)
15
UNIT
60
0.3%
10
0.2%
0.12%
VEE = VSS, fIS = 1 kHz Sine Wave
5 (1)
–40dB Feedthrough
Frequency
(All Channels OFF)
10
Address-or-Inhibit-toSignal
Crosstalk
(1)
(2)
8
VOS at Common OUT/IN
CD4053B-Q1
8
CD4051B-Q1
12
VEE = VSS ,
MHz
VOS at Any Channel
VOS
20 Log
= – 40dB
VIS
5 (1)
–40dB Signal
Crosstalk
Frequency
1
10
1
VEE = VSS,
20 Log
VOS
= – 40dB
VIS
8
Between Any two Channels
3
Between Sections,
CD4052 Only
Measured on Common
6
Measured on Any Channel
10
Between Any Two
Sections, CD4053 Only
In Pin 2, Out Pin 14
2.5
In Pin 15, Out Pin 14
10 (2)
10
MHz
6
65
VEE = 0, VSS = 0, tr , tf = 20 ns,
VCC = VDD – VSS (Square Wave)
65
mVPEAK
Peak-to-Peak voltage symmetrical about (VDD - VEE) / 2.
Both ends of channel.
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
6.7 Typical Characteristics
300
VDD - VEE = 5V
rON , CHANNEL ON RESISTANCE (Ω)
rON , CHANNEL ON RESISTANCE (Ω)
600
500
400
TA = 125oC
300
TA = 25oC
200
TA = -55oC
100
250
150
TA = 25oC
100
TA = -55oC
50
0
-10
0
-4
-3
-2
-1
0
1
2
3
4
5
-7.5
rON , CHANNEL ON RESISTANCE (Ω)
TA = 25oC
VDD - VEE = 5V
500
400
300
200
10V
15V
100
0
-10
-7.5
-5
-2.5
0
2.5
5
7.5
200
TA = 125oC
150
TA = 25oC
100
TA = -55oC
50
0
-10
10
-7.5
-5
-2.5
0
2.5
6
7.5
1kΩ
500Ω
100Ω
2
PD , POWER DISSIPATION PACKAGE (µ W)
RL = 100kΩ, RL = 10kΩ
TEST CIRCUIT
VDD
TA = 25oC
ALTERNATING “O”
AND “I” PATTERN
CL = 50pF
104
f
VDD = 15V
103
0
-2
VDD = 10V
102
-4
-4
-2
0
2
4
VIS , INPUT SIGNAL VOLTAGE (V)
10
Figure 4. Channel ON Resistance vs Input Signal Voltage
(All Types)
105
VDD = 5V
VSS = 0V
VEE = -5V
TA = 25oC
-6
5
VIS , INPUT SIGNAL VOLTAGE (V)
Figure 3. Channel ON Resistance vs Input Signal Voltage
(All Types)
VOS , OUTPUT SIGNAL VOLTAGE (V)
10
VDD - VEE = 15V
VIS , INPUT SIGNAL VOLTAGE (V)
-6
7.5
250
600
4
-5
-2.5
0
2.5
5
VIS , INPUT SIGNAL VOLTAGE (V)
Figure 2. Channel ON Resistance vs Input Signal Voltage
(All Types)
Figure 1. Channel ON Resistance vs Input Signal Voltage
(All Types)
rON , CHANNEL ON RESISTANCE (Ω)
TA = 125oC
200
6
Figure 5. ON Characteristics for 1 of 8 Channels
(CD4051B-Q1)
VDD = 5V
B/D
CD4029
A B C
VDD
100Ω 11 10 9
13
14
15
12 CD4051
1
5
3
2
48 7 6 C
L
100Ω
Ι
CL = 15pF
10
1
10
102
103
104
SWITCHING FREQUENCY (kHz)
105
Figure 6. Dynamic Power Dissipation vs Switching
Frequency (CD4051B-Q1)
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PD , POWER DISSIPATION PACKAGE (µW)
Typical Characteristics (continued)
105
TA = 25oC
ALTERNATING “O”
AND “I” PATTERN
CL = 50pF
104
VDD = 15V
VDD = 10V
103
VDD = 5V
102
CL = 15pF
TEST CIRCUIT
VDD f
9
4
CL
100Ω
3
12
5
13
100Ω
CD4053 2
10
1
11
15
6
14
7
8
Ι
10
1
10
102
103
104
SWITCHING FREQUENCY (kHz)
105
Figure 7. Dynamic Power Dissipation vs Switching Frequency (CD4053B-Q1)
7 Parameter Measurement Information
VDD = 15V
VDD = 7.5V
VDD = 5V
VDD = 5V
5V
7.5V
16
5V
16
16
16
VSS = 0V
VSS = 0V
VSS = 0V
VEE = 0V
7
8
VEE = -7.5V
7
8
VEE = -10V
7
8
VEE = -5V
7
8
VSS = 0V
(D)
(C)
(B)
(A)
Figure 8. Typical Bias Voltages
NOTE
The ADDRESS (digital-control inputs) and INHIBIT logic levels are: 0 = VSS
and 1 = VDD. The analog signal (through the TG) may swing from VEE to VDD.
tr = 20ns
90%
50%
tr = 20ns
tf = 20ns
90%
50%
90%
50%
10%
10%
tf = 20ns
90%
50%
10%
10%
TURN-ON TIME
90%
50%
90%
10%
TURN-OFF TIME
TURN-OFF TIME
tPHZ
Figure 9. Waveforms, Channel Being Turned ON
(RL = 1 kΩ)
10
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10%
10%
TURN-ON
TIME
Figure 10. Waveforms, Channel Being Turned OFF
(RL = 1 kΩ)
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Product Folder Links: CD4051B-Q1 CD4053B-Q1
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
Parameter Measurement Information (continued)
VDD
VDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IDD
16
15
14
13
12
11
10
9
VDD
1
2
3
4
5
6
7
8
IDD
16
15
14
13
12
11
10
9
IDD
CD4053
CD4052
Figure 11. OFF Channel Leakage Current - Any Channel OFF
VDD
1
2
3
4
5
6
7
8
IDD
16
15
14
13
12
11
10
9
VDD
IDD
CD4051
VDD
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4053
CD4052
Copyright © 2017, Texas Instruments Incorporated
Figure 12. On Channel Leakage Current - Any Channel On
Figure 13. OFF Channel Leakage Current - All Channels OFF
VDD
VDD
VEE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VSS
CD4051
OUTPUT
VDD
OUTPUT
1
RL
CL
2
RL
CL
3
VDD
VEE
4
VDD
5
VEE
6
VEE
VSS CLOCK
7
IN
8
VSS
VSS
OUTPUT
16
15
14
13
12
11
10
9
CD4052
VDD
VDD
VEE
VSS CLOCK
VSS
IN
VSS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4053
RL
VDD
CL
VEE
VSS CLOCK
IN
VSS
Figure 14. Propagation Delay - Address Input to Signal Output
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Parameter Measurement Information (continued)
VDD
OUTPUT
RL
1
2
3
4
5
6
7
8
50pF
VEE
VDD
VSS
VDD
CLOCK VEE
IN
VSS
VDD
OUTPUT
16
15
14
13
12
11
10
9
50pF
RL
VEE
VDD
VSS
VDD
CLOCK VEE
IN VSS
tPHL AND tPLH VSS
CD4051
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
OUTPUT
RL
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
50pF
VEE
VDD
VDD
VSS CLOCK VEE
IN VSS
VDD
V
tPHL AND tPLH SS
CD4053
V
tPHL AND tPLH SS
CD4052
Figure 15. Propagation Delay - Inhibit Input to Signal Output
VDD
VDD
VDD
µA
VIH
1K
VIH
1
2
3
4
5
6
7
8
1K
VIL
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VIH
VIL
15
14
13
12
11
10
9
1K
1K
µA
VIH
1K
VIL
VIH
VIL
16
15
14
13
12
11
10
9
1K
µA
VIH
VIL
CD4053B
CD4052B
CD4051B
1
2
3
4
5
6
7
8
VIL
MEASURE < 2µA ON ALL
“OFF” CHANNELS (e.g., CHANNEL 6)
MEASURE < 2µA ON ALL
“OFF” CHANNELS (e.g., CHANNEL by)
MEASURE < 2µA ON ALL
“OFF” CHANNELS (e.g., CHANNEL 2x)
Figure 16. Input Voltage Test Circuits (Noise Immunity)
VDD
VDD
1
2
3
4
5
6
7
8
Ι
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Ι
16
15
14
13
12
11
10
9
10kΩ
KEITHLEY
160 DIGITAL
MULTIMETER
TG
“ON”
Y
X-Y
PLOTTER
H.P.
MOSELEY
7030A
CD4053
Submit Documentation Feedback
1kΩ
RANGE
VSS
CD4052
Figure 17. Quiescent Device Current
12
VDD
X
Figure 18. Channel ON Resistance Measurement
Circuit
Copyright © 1998–2019, Texas Instruments Incorporated
Product Folder Links: CD4051B-Q1 CD4053B-Q1
CD4051B-Q1, CD4053B-Q1
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
Parameter Measurement Information (continued)
VDD
1
2
3
4
5
6
7
8
VSS
VDD
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VDD
Ι
VSS
CD4051
CD4053
16
15
14
13
12
11
10
9
VDD
Ι
VSS
CD4052
VSS
NOTE: Measure inputs sequentially,
to both VDD and VSS connect all
unused inputs to either VDD or VSS .
NOTE: Measure inputs sequentially,
to both VDD and VSS connect all
unused inputs to either VDD or VSS .
Figure 19. Input Current
5VP-P
OFF
CHANNEL
5VP-P
CHANNEL
ON
RF
VM
COMMON
1K
CHANNEL
OFF
RF
VM
RL
VDD
RL
6
7
8
RL
Figure 20. Feedthrough (All Types)
5VP-P
CHANNEL
ON
RF
VM
CHANNEL
OFF
RL
Figure 21. Crosstalk Between Any Two Channels
(All Types)
CHANNEL IN Y
ON OR OFF
CHANNEL IN X
ON OR OFF
RL
RF
VM
RL
Figure 22. Crosstalk Between Duals or Triplets (CD4053B-Q1)
A
B
CD4051B
C
INH
A
B
C
D
E
Q0
A
1/2
CD4556
B
E
Q1
Q2
A
B
CD4051B
C
INH
COMMON
A
B
CD4051B
C
INH
Figure 23. 24-to-1 MUX Addressing
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8 Detailed Description
8.1 Overview
The CD4051B-Q1and CD4053B-Q1analog multiplexers are digitally-controlled analog switches having low ON
impedance and very low OFF leakage current. Control of analog signals up to 20 VP-P can be achieved by digital
signal amplitudes of 4.5 V to 20 V (if VDD – VSS = 3 V, a VDD – VEE of up to 13 V can be controlled; for VDD – VEE
level differences above 13 V, a VDD – VSS of at least 4.5 V is required). For example, if VDD = +4.5 V, VSS = 0 V,
and VEE = –13.5 V, analog signals from –13.5 V to +4.5 V can be controlled by digital inputs of 0 V to 5 V. These
multiplexer circuits dissipate extremely low quiescent power over the full VDD – VSS and VDD – VEE supply-voltage
ranges, independent of the logic state of the control signals. When a logic 1 is present at the inhibit input
terminal, all channels are off.
The CD4051B-Q1 device is a single 8-channel multiplexer having three binary control inputs, A, B, and C, and an
inhibit input. The three binary signals select 1 of 8 channels to be turned on, and connect one of the 8 inputs to
the output.
The CD4053B-Q1 device is a triple 2-channel multiplexer having three separate digital control inputs, A, B, and
C, and an inhibit input. Each control input selects one of a pair of channels which are connected in a single-pole,
double-throw configuration.
When these devices are used as demultiplexers, the CHANNEL IN/OUT terminals are the outputs and the
COMMON OUT/IN terminals are the inputs.
8.2 Functional Block Diagrams
CHANNEL IN/OUT
16 VDD
7
6
5
4
3
2
1
0
4
2
5
1
12
15
14
13
TG
TG
A 11
TG
B 10
LOGIC
LEVEL
CONVERSION
C
9
INH
6
TG
BINARY
TO
1 OF 8
DECODER
WITH
INHIBIT
COMMON
OUT/IN
3
TG
TG
TG
TG
7 VEE
8 VSS
All inputs are protected by standard CMOS protection network.
Figure 24. Functional Block Diagram, CD4051B-Q1
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
Functional Block Diagrams (continued)
LOGIC
LEVEL
CONVERSION
16 VDD
BINARY TO
1 OF 2
DECODERS
WITH
INHIBIT
IN/OUT
cy
cx
by
bx
ay
ax
3
5
1
2
13
12
TG
COMMON
OUT/IN
ax OR ay
14
A 11
TG
TG
COMMON
OUT/IN
bx OR by
15
B 10
TG
COMMON
OUT/IN
C
TG
9
cx OR cy
4
TG
INH
6
VDD
8
VSS
7
VEE
All inputs are protected by standard CMOS protection network.
Figure 25. Functional Block Diagram, CD4053B-Q1
8.3 Feature Description
The CD405xB-Q1 line of multiplexers and demultiplexers can accept a wide range of digital and analog signal
levels. Digital signals range from 3 V to 20 V, and analog signals are accepted at levels ≤ 20 V. They have low
ON resistance, typically 125 Ω over 15 VP-P signal input range for VDD – VEE = 18 V. This allows for very little
signal loss through the switch. Matched switch characteristics are typically rON = 5 Ω for VDD – VEE = 15 V.
The CD405xB-Q1 devices also have high OFF resistance, which keeps from wasting power when the switch is in
the OFF position, with typical channel leakage of ±100 pA at VDD – VEE = 18 V. Very low quiescent power
dissipation under all digital-control input and supply conditions, typically 0.2 µW at VDD – VSS = VDD – VEE = 10 V
keeps power consumption total very low. All devices have been 100% tested for quiescent current at 20 V with
maximum input current of 1 µA at 18 V over the full package temperature range, and only 100 nA at 18 V and
25°C.
Logic-level conversion for digital addressing signals of 3 V to 20 V (VDD – VSS = 3 V to 20 V) to switch analog
signals to 20 VP-P (VDD – VEE = 20 V). Binary address decoding on chip makes channel selection easy. When
channels are changed, a break-before-make system eliminates channel overlap.
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8.4 Device Functional Modes
Table 1. Truth Table (1)
INPUT STATES
INHIBIT
ON CHANNEL(S)
C
B
A
L
L
L
L
0
L
L
L
H
1
L
L
H
L
2
L
L
H
H
3
L
H
L
L
4
L
H
L
H
5
L
H
H
L
6
L
H
H
H
7
H
X
X
X
None
CD4051B-Q1
CD4053B
(1)
16
L
L
L
L
ay or by or cy
L
H
H
H
ay or by or cy
H
X
X
X
None
X = Don't Care
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The CD405xB-Q1 multiplexers and demuliplexers can be used for a wide variety of applications.
9.2 Typical Application
One application of the CD4051B-Q1 is to use it in conjunction with a microcontroller to poll a keypad. Figure 26
shows the basic schematic for such a polling system. The microcontroller uses the channel select pins to cycle
through the different channels while reading the input to see if a user is pressing any of the keys. This is a very
robust setup, allowing for multiple simultaneous key-presses with very little power consumption. It also uses very
few pins on the microcontroller. The down side of polling is that the microcontroller must continually scan the
keys for a press and can do little else during this process.
Microcontroller
Input
Channel Select
3.3 V
INH
C
B
A
Ch 0
CBA
000
001
010
COM
3.3 V
Ch 3
100
Ch 4
110
111
VEE
VSS
CD4051B
k1
Ch 2
011
101
VDD
Ch 1
k0
Ch 5
Ch 6
Ch 7
k2
k3
k4
k5
k6
k7
Pull-down resistors (10NŸ)
Figure 26. The CD4051B-Q1 Being Used to Help Read Button Presses on a Keypad.
9.2.1 Design Requirements
These devices use CMOS technology and have balanced output drive. Take care to avoid bus contention
because it can drive currents that would exceed maximum limits. The high drive will also create fast edges into
light loads, so routing and load conditions should be considered to prevent ringing.
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Typical Application (continued)
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– For switch time specifications, see propagation delay times in Electrical Characteristics.
– Inputs should not be pushed more than 0.5 V above VDD or below VEE.
– For input voltage level specifications for control inputs, see VIH and VIL in Electrical Characteristics.
2. Recommended Output Conditions
– Outputs should not be pulled above VDD or below VEE.
3. Input/output current consideration: The CD405xB-Q1 series of parts do not have internal current drive
circuitry and thus cannot sink or source current. Any current will be passed through the device.
9.2.3 Application Curve
VOS , OUTPUT SIGNAL VOLTAGE (V)
6
4
VDD = 5V
VSS = 0V
VEE = -5V
TA = 25oC
RL = 100kΩ, RL = 10kΩ
1kΩ
500Ω
100Ω
2
0
-2
-4
-6
-6
-4
-2
0
2
4
VIS , INPUT SIGNAL VOLTAGE (V)
6
Figure 27. ON Characteristics for 1 of 8 Channels
(CD4051B-Q1)
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Electrical Characteristics.
Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, a 0.1-μF bypass capacitor is recommended. If there are multiple pins labeled VCC, then a 0.01-μF or
0.022-μF capacitor is recommended for each VCC because the VCC pins will be tied together internally. For
devices with dual supply pins operating at different voltages, for example VCC and VDD, a 0.1-µF bypass
capacitor is recommended for each supply pin. It is acceptable to parallel multiple bypass capacitors to reject
different frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor
should be installed as close to the power terminal as possible for best results.
18
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SCHS354B – AUGUST 1998 – REVISED APRIL 2019
11 Layout
11.1 Layout Guidelines
Reflections and matching are closely related to loop antenna theory, but different enough to warrant their own
discussion. When a PCB trace turns a corner at a 90° angle, a reflection can occur. This is primarily due to the
change of width of the trace. At the apex of the turn, the trace width is increased to 1.414 times its width. This
upsets the transmission line characteristics, especially the distributed capacitance and self–inductance of the
trace — resulting in the reflection. It is a given that not all PCB traces can be straight, and so they will have to
turn corners. Figure 28 shows progressively better techniques of rounding corners. Only the last example
maintains constant trace width and minimizes reflections.
11.2 Layout Example
BETTER
BEST
2W
WORST
1W min.
W
Figure 28. Trace Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
• Implications of Slow or Floating CMOS Inputs, SCBA004
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 2. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
CD4051B-Q1
Click here
Click here
Click here
Click here
Click here
CD4053B-Q1
Click here
Click here
Click here
Click here
Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
20
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Product Folder Links: CD4051B-Q1 CD4053B-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CD4051BQPWRG4Q1
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CM051BQ
CD4051BQPWRQ1
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CM051BQ
CD4053BQM96G4Q1
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CD4053Q
CD4053BQM96Q1
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CD4053Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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