CD74FCT273
BiCMOS OCTAL D-TYPE FLIP-FLOP
WITH RESET
SCBS737A – JULY 2000 – REVISED JULY 2000
D
D
D
D
D
D
D
D
D
D
E OR M PACKAGE
(TOP VIEW)
BiCMOS Technology With Low Quiescent
Power
Buffered Inputs
Direct Clear Input
48-mA Output Sink Current
Output Voltage Swing Limited to 3.7 V
Controlled Output Edge Rates
Input/Output Isolation From VCC
SCR Latch-Up-Resistant BiCMOS Process
and Circuit Design
Applications Include:
– Buffer/Storage Registers
– Shift Registers
– Pattern Generators
Package Options Include Plastic
Small-Outline (M) Package and Standard
Plastic (E) DIP
CLR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
description
The CD74FCT273 is a positive-edge-triggered, D-type flip-flop with a direct clear (CLR) input. This device uses
a small-geometry BiCMOS technology. The output stage is a combination of bipolar and CMOS transistors that
limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V)
reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and
ground bounce and their effects during simultaneous output switching. The output configuration also enhances
switching speed and is capable of sinking 48 mA.
Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the
positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not
directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the
D input has no effect at the output. All eight flip-flops are controlled by a common clock (CLK) and a common
reset (CLR). The outputs are placed in a low state when CLR is taken low, independent of the CLK.
The CD74FCT273 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
CLR
CLK
D
OUTPUT
Q
L
X
X
L
H
↑
H
H
H
↑
L
L
H
L
X
Q0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CD74FCT273
BiCMOS OCTAL D-TYPE FLIP-FLOP
WITH RESET
SCBS737A – JULY 2000 – REVISED JULY 2000
logic symbol†
CLR
CLK
1D
2D
3D
4D
5D
6D
7D
8D
1
R
11
C1
3
2
1D
4
5
7
6
8
9
13
12
14
15
17
16
18
19
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
CLK
1D
2D
3D
4D
3
4
7
8
6D
13
7D
14
8D
17
18
11
1D
1D
C1
1D
C1
R
CLR
5D
1D
C1
R
1D
C1
R
1D
C1
R
1D
C1
R
1D
C1
R
C1
R
R
1
2
5
6
1Q
2Q
3Q
9
12
4Q
15
5Q
6Q
16
19
7Q
8Q
logic diagram, each flip-flop (positive logic)
D
C
C
TG
TG
Q
C
C
C
C
TG
CLK(I)
TG
C
C
C
C
R
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CD74FCT273
BiCMOS OCTAL D-TYPE FLIP-FLOP
WITH RESET
SCBS737A – JULY 2000 – REVISED JULY 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
DC supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
DC input diode current, IIK (VI < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
DC output diode current, IOK (VO < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
DC output sink current per output pin, IOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
DC output source current per output pin, IOH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA
Continuous current through VCC, ICC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 mA
Continuous current through GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Package thermal impedance, θJA (see Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions (see Note 2)
MIN
MAX
UNIT
4.75
5.25
V
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
IOL
∆t/∆v
High-level input voltage
2
V
0.8
V
VCC
VCC
V
High-level output current
–15
mA
Low-level output current
48
mA
10
ns/V
Input transition rise or fall rate
0
V
TA
Operating free-air temperature
0
70
°C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating temperature range (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN
MAX
MIN
UNIT
–1.2
V
VIK
VOH
II = –18 mA
IOH = –15 mA
4.75 V
VOL
II
IOL = 48 mA
VI = VCC or GND
4.75 V
0.55
0.55
V
5.25 V
±0.1
±1
mA
IOZ
IOS‡
VO = VCC or GND
VI = VCC or GND,
5.25 V
±0.5
±10
mA
ICC
VI = VCC or GND,
One input at 3.4 V,
Other inputs at VCC or GND
∆ICC§
4.75 V
VO = 0
IO = 0
5.25 V
–1.2
MAX
2.4
2.4
–60
–60
mA
5.25 V
8
80
mA
5.25 V
1.6
1.6
mA
10
pF
Ci
VI = VCC or GND
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed 100 ms.
§ This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC.
POST OFFICE BOX 655303
V
• DALLAS, TEXAS 75265
3
CD74FCT273
BiCMOS OCTAL D-TYPE FLIP-FLOP
WITH RESET
SCBS737A – JULY 2000 – REVISED JULY 2000
timing requirements over recommended operating conditions (unless otherwise noted) (see
Figure 1)
MIN
fclock
Clock frequency
tw
Pulse duration
tsu
Setup time
th
Hold time
CLR low
7
CLK high or low
7
Data before CLK↑
3
CLR before CLK↑
4
Data after CLK↑
2
MAX
UNIT
70
MHz
ns
ns
ns
switching characteristics over recommended operating conditions, CL = 50 pF (unless otherwise
noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TA = 25°C
TYP
fmax
tpd
d
MIN
MAX
70
CLK
CLR
An Q
Any
UNIT
MHz
7
2
13
8
2
13
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
TYP
36
UNIT
pF
CD74FCT273
BiCMOS OCTAL D-TYPE FLIP-FLOP
WITH RESET
SCBS737A – JULY 2000 – REVISED JULY 2000
PARAMETER MEASUREMENT INFORMATION
7V
CL = 50 pF
(see Note A)
500 Ω
From Output
Under Test
Test
Point
From Output
Under Test
Open
TEST
GND
CL = 50 pF
(see Note A)
500 Ω
S1
S1
Open
7V
Open
7V
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
500 Ω
Open Drain
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
1.5 V
10%
90%
3V
1.5 V
10% 0 V
90%
tr
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
3V
Timing Input
1.5 V
0V
tw
tsu
3V
1.5 V
1.5 V
Input
th
3V
1.5 V
1.5 V
Data Input
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
1.5 V
Input
0V
tPLH
tPHL
1.5 V
1.5 V
VOL
tPHL
Out-of-Phase
Output
tPLZ
≈3.5 V
1.5 V
tPZH
VOH
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
Output
Waveform 1
(see Note B)
tPLH
1.5 V
1.5 V
tPZL
VOH
In-Phase
Output
3V
Output
Control
Output
Waveform 2
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
V
VOH – 0.3 V OH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr and tf = 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CD74FCT273E
ACTIVE
PDIP
N
20
20
RoHS &
Non-Green
NIPDAU
N / A for Pkg Type
0 to 70
CD74FCT273E
CD74FCT273M
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
74FCT273M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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