CD74HC238EE4

[ /Title (CD74 HC138 , CD74 HCT13 8, CD74 HC238 , CD74 HCT23 8) /Subject (High Speed CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238 Data sheet acquired from Harris Semiconductor SCHS147I October 1997 - Revised August 2004 High-Speed CMOS Logic 3- to 8-Line Decoder/ Demultiplexer Inverting and Noninverting Features Ordering Information • Select One Of Eight Data Outputs Active Low for 138, Active High for 238 TEMP. RANGE (oC) PACKAGE CD54HC138F3A -55 to 125 16 Ld CERDIP CD54HC238F3A -55 to 125 16 Ld CERDIP CD54HCT138F3A -55 to 125 16 Ld CERDIP CD54HCT238F3A -55 to 125 16 Ld CERDIP CD74HC138E -55 to 125 16 Ld PDIP CD74HC138M -55 to 125 16 Ld SOIC CD74HC138MT -55 to 125 16 Ld SOIC CD74HC138M96 -55 to 125 16 Ld SOIC CD74HC238E -55 to 125 16 Ld PDIP • HC Types - 2 V to 6 V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V CD74HC238M -55 to 125 16 Ld SOIC CD74HC238MT -55 to 125 16 Ld SOIC CD74HC238M96 -55 to 125 16 Ld SOIC • HCT Types - 4.5-V to 5.5-V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8 V (Max), VIH = 2 V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH CD74HC238NSR -55 to 125 16 Ld SOP CD74HC238PW -55 to 125 16 Ld TSSOP CD74HC238PWR -55 to 125 16 Ld TSSOP CD74HC238PWT -55 to 125 16 Ld TSSOP Description CD74HCT138E -55 to 125 16 Ld PDIP The ’HC138, ’HC238, ’HCT138, and ’HCT238 are high-speed silicon-gate CMOS decoders well suited to memory address decoding or data-routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low-power Schottky TTL logic. Both circuits have three binary select inputs (A0, A1, and A2). If the device is enabled, these inputs determine which one of the eight normally high outputs of the HC/HCT138 series go low or which of the normally low outputs of the HC/HCT238 series go high. CD74HCT138M -55 to 125 16 Ld SOIC CD74HCT138MT -55 to 125 16 Ld SOIC CD74HCT138M96 -55 to 125 16 Ld SOIC CD74HCT238E -55 to 125 16 Ld PDIP CD74HCT238M -55 to 125 16 Ld SOIC CD74HCT238M96 -55 to 125 16 Ld SOIC PART NUMBER • l/O Port or Memory Selector • Three Enable Inputs to Simplify Cascading • Typical Propagation Delay of 13 ns at VCC = 5 V, CL = 15 pF, TA = 25oC • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. Two active low and one active high enables (E1, E2, and E3) are provided to ease the cascading of decoders. The decoder’s eight outputs can drive ten low-power Schottky TTL equivalent loads. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2004, Texas Instruments Incorporated 1 CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238 Pinout Functional Diagram HC/HCT HC/HCT 238 138 CD54HC138, CD54HCT138, CD54HC238, CD54HCT238 (CERDIP) CD74HC138, CD74HCT138, CD74HCT238 (PDIP, SOIC) CD74HC238 (PDIP, SOIC, SOP, TSSOP) TOP VIEW A0 1 15 2 14 3 13 A1 A2 Y0 Y0 Y1 Y1 Y2 Y2 Y3 Y3 Y4 Y4 Y5 Y5 Y6 Y6 Y7 Y7 12 A0 1 16 VCC A1 2 15 Y0 (Y0) A2 3 14 Y1 (Y1) E1 4 13 Y2 (Y2) E2 5 12 Y3 (Y3) E3 6 11 Y4 (Y4) (Y7) Y7 7 10 Y5 (Y5) GND 8 9 Y6 (Y6) 4 11 5 10 6 9 E1 E2 E3 7 Signal names in parentheses are for ’HC138 and ’HCT138. TRUTH TABLE ’HC138, ’HCT138 INPUTS ENABLE ADDRESS OUTPUTS E3 E2 E1 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X H X X X H H H H H H H H H L X X X X X H H H H H H H X H X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H H L L H H H H H H H H H H L H = High Voltage Level, L = Low Voltage Level, X = Don’t Care TRUTH TABLE ’HC238, ’HCT238 INPUTS ENABLE ADDRESS OUTPUTS E3 E2 E1 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X H X X X L L L L L L L L L X X X X X L L L L L L L L X H X X X X L L L L L L L L H L L L L L H L L L L L L L H L L L L H L H L L L L L L H L L L H L L L H L L L L L H L L L H H L L L H L L L L H L L H L L L L L L H L L L H L L H L H L L L L L H L L H L L H H L L L L L L L H L H L L H H H L L L L L L L H H = High Voltage Level, L = Low Voltage Level, X = Don’t Care 2 CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Package Thermal Impedance, θJA (see Note 1): E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating, and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems, theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS A0-A2 1.5 E1, E2 1.25 E3 1 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER SYMBOL TEST CONDITIONS -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 150 - 190 - 225 ns 4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 13 - - - - - ns CL = 50pF 6 - - 26 - 33 - 38 ns HC TYPES Propagation Delay tPLH, tPHL CL = 50pF Address to Output 4 CD54/74HC138, CD54/74HCT138, CD54/74HC238, CD54/74HCT238 Switching Specifications Input tr, tf = 6ns PARAMETER TEST CONDITIONS SYMBOL Enable to Output HC/HCT138 (Continued) tPLH, tPHL CL = 50pF Output Transition Time (Figure 1) tTLH, tTHL CL = 50pF Power Dissipation Capacitance (Notes 3, 4) CPD Input Capacitance CIN CL = 15pF - -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 150 - 190 - 265 ns 4.5 - - 30 - 38 - 53 ns 6 - - 26 - 33 - 45 ns 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns 5 - 67 - - - - - pF - - - 10 - 10 - 10 pF 4.5 - - 35 - 44 - 53 ns 5 - 14 - - - - - ns HCT TYPES Propagation Delay Address to Output tPLH, tPHL CL = 50pF CL = 15pF Enable to Output HC/HCT138 tPLH, tPHL CL = 50pF 4.5 - - 35 - 44 - 53 ns Enable to Output HC/HCT238 tPLH, tPHL CL = 15pF 4.5 - - 40 - 50 - 60 ns Output Transition Time (Figure 2) tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns 5 - 67 - - - - - pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD Input Capacitance CIN CL = 15pF - NOTES: 3. CPD is used to determine the dynamic power consumption, per gate. 4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns 90% 50% 10% INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC tTLH 90% 1.3V 10% INVERTING OUTPUT tPLH tPHL FIGURE 7. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 8. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8688401EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8688401EA CD54HC238F3A CD54HC138F ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54HC138F CD54HC138F3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 8406201EA CD54HC138F3A CD54HC238F3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8688401EA CD54HC238F3A CD54HCT138F ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54HCT138F CD54HCT138F3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 8550401EA CD54HCT138F3A CD54HCT238F3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8974501EA CD54HCT238F3A CD74HC138E ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type -55 to 125 CD74HC138E CD74HC138EE4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type -55 to 125 CD74HC138E CD74HC138M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC138M CD74HC138M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC138M CD74HC138M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC138M CD74HC138ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC138M CD74HC138MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC138M CD74HC138MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC138M CD74HC238E ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type -55 to 125 CD74HC238E CD74HC238EE4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type -55 to 125 CD74HC238E Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 6-Feb-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74HC238M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC238M CD74HC238M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC238M CD74HC238M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC238M CD74HC238MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC238M CD74HC238NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC238M CD74HC238PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HJ238 CD74HC238PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HJ238 CD74HC238PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HJ238 CD74HC238PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HJ238 CD74HC238PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HJ238 CD74HCT138E ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type -55 to 125 CD74HCT138E CD74HCT138M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT138M CD74HCT138M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT138M CD74HCT138M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT138M CD74HCT238E ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) NIPDAU N / A for Pkg Type -55 to 125 CD74HCT238E CD74HCT238M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT238M CD74HCT238M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT238M CD74HCT238M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT238M Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 6-Feb-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74HCT238PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HK238 CD74HCT238PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HK238 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of