CD74HCT283M

CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 High-Speed CMOS Logic 4-Bit Binary Full Adder with Fast Carry 1 Features 2 Description • • • • • The CDx4HC283 and CDx4HCT283 contain 4-bit binary adders. The HCT device has TTL-voltage compatible inputs. • • • • • Adds two binary numbers Full internal lookahead Fast ripple carry for economical expansion Operates with both positive and negative logic Fanout (over temperature range) – Standard outputs 10 LSTTL loads – Bus driver outputs 15 LSTTL loads Wide operating temperature range: –55℃ to 125℃ Balanced propagation delay and transition times Significant power reduction compared to LSTTL Logic ICs HC types – 2 V to 6 V operation – High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V HCT types – 4.5 V to 5.5 V operation – Direct LSTTL input logic compatibility, VIL = 0.8 V (max), VIH = 2 V (min) – CMOS input compatibility, II ≤ 1 µA at VOL, VOH Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) CD54HC283 J (CDIP, 16) 24.38 mm × 6.92 mm CD74HC283CD74H D (SOIC, 16) C283 N (PDIP, 16) 9.90 mm × 3.90 mm CD74HCT283CD74 D (SOIC, 16) HCT283 N (PDIP, 16) 9.90 mm × 3.90 mm (1) 19.31 mm × 6.35 mm 19.31 mm × 6.35 mm For all packages see the orderable addendum at the end of the datasheet. Functional Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings(1) .................................... 4 5.2 Recommended Operating Conditions ........................4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................6 6 Parameter Measurement Information............................ 8 7 Detailed Description........................................................9 7.1 Overview..................................................................... 9 7.2 Functional Block Diagram........................................... 9 7.3 Feature Description.....................................................9 8 Power Supply Recommendations................................10 9 Layout.............................................................................10 9.1 Layout Guidelines..................................................... 10 10 Device and Documentation Support..........................11 10.1 Receiving Notification of Documentation Updates.. 11 10.2 Support Resources................................................. 11 10.3 Trademarks............................................................. 11 10.4 Electrostatic Discharge Caution.............................. 11 10.5 Glossary.................................................................. 11 11 Mechanical, Packaging, and Orderable Information.................................................................... 11 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (October 2003) to Revision E (July 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 4 Pin Configuration and Functions J, N, or D package 16-Pin CDIP, PDIP, or SOIC Top View Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 3 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 5 Specifications 5.1 Absolute Maximum Ratings(1) VCC Supply voltage MIN MAX – 0.5 7 UNIT V IIK Input diode current For VI < –0.5 V or VI > VCC + 0.5 V ±20 mA IOK Output diode current For VO < –0.5 V or VO > VCC + 0.5 V ±20 mA IO Drain current, per output For –0.5 V < VO < VCC + 0.5 V ±25 mA IO Output source or sink current per output pin For VO > –0.5 V or VO < VCC + 0.5 V ±25 mA Continuous current through VCC or GND ±50 mA TJ Junction temperature 150 °C Tstg Storage temperature range 150 °C 300 °C – 65 Lead temperature (Soldering 10s)(SOIC - lead tips only) (1) Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 5.2 Recommended Operating Conditions VCC Supply voltage range VI, VO DC input or output voltage MIN MAX 2 6 V VCC V HC types 0 2V Input rise and fall time TA UNIT 1000 4.5 V 500 6V 400 Temperature range –55 ns 125 V 5.3 Thermal Information THERMAL METRIC RθJA (1) 4 Junction-to-ambient thermal resistance (1) D (SOIC) N (PDIP) 16 PINS 16 PINS UNIT 73 67 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 5.4 Electrical Characteristics PARAMETER TEST CONDITIONS(2) VCC (V) 25℃ MIN TYP –40℃ to 85℃ MAX MIN MAX –55℃ to 125℃ MIN MAX UNIT HC TYPES High level input voltage VIH Low level input voltage VIL High level output voltage VOH Low level output voltage VOL 2 1.5 1.5 1.5 4.5 3.15 3.15 3.15 6 4.2 4.2 V 4.2 2 0.5 0.5 0.5 4.5 1.35 1.35 1.35 6 1.8 1.8 1.8 IOH = –20 μA 2 1.9 1.9 1.9 IOH = –20 μA 4.5 4.4 4.4 4.4 V V IOH = –20 μA 6 5.9 5.9 5.9 IOH = –4 mA 4.5 3.98 3.84 3.7 IOH = –5.2 mA 6 6 5.34 5.2 IOL = 20 μA 2 0.1 0.1 0.1 IOL = 20 μA 4.5 0.1 0.1 0.1 IOL = 20 μA 6 0.1 0.1 0.1 V IOL = 4 mA 4.5 0.26 0.33 0.4 IOL = 5.2 mA 6 0.26 0.33 0.4 V V II Input leakage current VCC or GND 6 ±0.1 ±1 ±1 µA ICC Supply current VCC or GND 6 8 80 160 µA HCT Types VIH High level input voltage 4.5 to 5.5 VIL Low level input voltage 4.5 to 5.5 VOH 2 2 0.8 2 0.8 0.8 IOH = – 20 μA 4.5 4.4 IOH = – 4 mA 4.5 3.98 4.5 0.1 0.1 0.1 V VOL Low level output voltage IOL = 20 μA IOL = 4 mA 4.5 0.26 0.33 0.4 V II Input leakage current VCC to GND 5.5 ±0.1 ±1 ±1 µA ICC Supply current VCC or GND 5.5 8 80 160 µA CIN input held at VCC – 2.1 4.5 to 5.5 100 540 675 735 µA B1, A1, A0 inputs held at VCC – 2.1 4.5 to 5.5 100 360 450 490 µA B0 input held at VCC – 2.1 4.5 to 5.5 100 144 180 196 µA B3, A3, A2, B2 inputs held at VCC – 2.1 4.5 to 5.5 100 180 225 245 µA VOL ΔICC (1) (2) (1) Additional supply current per input pin 4.4 V High level output voltage VOH 4.4 V 3.84 V 3.7 V For dual-supply systems theoretical worst case (VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA. VI = VIH or VIL, unless otherwise noted. Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 5 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 5.5 Switching Characteristics TEST CONDITIONS PARAMETER VCC (V) 25℃ MIN TYP –40 to 85℃ MAX MIN –55℃ to 125℃ MAX MIN MAX UNIT HC TYPES tPLH, tPHL tPLH, tPHL tPLH, tPHL tPLH, tPHL tPLH, tPHL tPLH, tPHL CL = 50 pF Propagation delay CIN to S0 27 34 41 2 180 225 270 4.5 36 45 54 13 CL = 15 pF 5 CL = 50 pF 6 31 38 46 2 195 245 295 4.5 39 49 59 15 CL = 15 pF 5 CL = 50 pF 6 33 42 50 2 230 290 345 4.5 46 58 69 16 CL = 15 pF 5 CL = 50 pF 6 39 49 59 2 195 245 295 4.5 39 49 59 19 CL = 15 pF 5 CL = 50 pF 6 33 42 50 2 210 265 315 4.5 42 53 63 CL = 5 0pF An, Bn to Sn 45 6 CL = 50 pF An, Bn to COUT 240 40 CL = 50 pF CL = 50 pF CIN to S3 200 32 5 CL = 50 pF CIN to S2, CIN to COUT 160 CL = 15 pF CL = 50 pF CIN to S1 2 4.5 16 CL = 15 pF 5 CL = 50 pF 6 36 45 54 2 75 95 110 4.5 15 19 22 6 13 16 19 - 10 10 10 tTLH, tTHL Output transition time CL = 50 pF CIN Input capacitance CL = 50 pF CPD Power dissipation capacitance(1) (2) 18 5 70 CL = 15 pF 5 13 CL = 50 pF 4.5 ns ns ns ns ns ns ns pF pF HCT TYPES 6 tPLH, tPHL Propagation delay CIN to S0 tPLH, tPHL CIN to S1 tPLH, tPHL CIN to S2, CIN to COUT tPLH, tPHL CIN to S3 tPLH, tPHL An, Bn to COUT tPLH, tPHL An, Bn to Sn Submit Document Feedback CL = 15 pF 5 CL = 50 pF 4.5 CL = 15 pF 5 CL = 50 pF 4.5 CL = 15 pF 5 CL = 50 pF 4.5 CL = 15 pF 5 CL = 50 pF 4.5 CL = 15 pF 5 CL = 50 pF 4.5 31 39 47 43 54 65 46 58 69 53 66 80 48 60 72 49 61 74 18 19 22 20 21 ns ns ns ns ns ns Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 5.5 Switching Characteristics (continued) PARAMETER tTLH, tTHL Output transition time CIN Input capacitance CPD Power dissipation capacitance(1) (2) (1) (2) TEST CONDITIONS VCC (V) CL = 50 pF 4.5 5 25℃ MIN TYP –40 to 85℃ MAX MIN –55℃ to 125℃ MAX MIN MAX UNIT 15 19 22 ns 10 10 10 pF 82 pF CPD is used to determine the dynamic power consumption, per package. PD = VCC 2 fi (CPD + CL) where: fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 7 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 6 Parameter Measurement Information Test Point From Output Under Test CL(1) 1. Includes probe and test-fixture capacitance. Figure 6-1. Load Circuit for Push-Pull Output Figure 6-2. HC and HCT Transition Times and Propagation Delay Times, Combination Logic Figure 6-3. HCT Transition Times and Propagation Delay Times, Combination Logic 1. The greater between tr and tf is the same as tt. 2. The greater between tplh and tphl is the same as tpd. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 7 Detailed Description 7.1 Overview The ’HC283 and ’HCT283 binary full adders add two 4-bit binary numbers and generate a carry-out bit if the sum exceeds 15. Because of the symmetry of the add function, this device can be used with either all active-high operands (positive logic) or with all active-low operands (negative logic). When using positive logic the carry-in input must be tied low if there is no carry-in. 7.2 Functional Block Diagram 7.3 Feature Description • • Balanced CMOS Push-Pull Outputs Clamp Diode Structure Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 9 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 CD54HC283, CD74HC283, CD54HCT283, CD74HCT283 www.ti.com SCHS176E – NOVEMBER 1997 – REVISED JULY 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CD54HC283 CD74HC283 CD54HCT283 CD74HCT283 11 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-8976501EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8976501EA CD54HC283F3A Samples CD54HC283F3A ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8976501EA CD54HC283F3A Samples CD54HCT283F3A ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 CD54HCT283F3A Samples CD74HC283E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC283E Samples CD74HC283M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC283M Samples CD74HC283M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC283M Samples CD74HC283ME4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC283M Samples CD74HC283MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC283M Samples CD74HCT283E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HCT283E Samples CD74HCT283M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT283M Samples CD74HCT283M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT283M Samples CD74HCT283MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT283M Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of