CDC339
SCAS331A – MARCH 1994 – REVISEDCDC339
MAY 2020
SCAS331A – MARCH 1994 – REVISED MAY 2020
www.ti.com
CDC339 Clock Driver with 3-State Outputs
1 Features
3 Description
•
The CDC339 is a high-performance, low-skew clock
driver. It is specifically designed for applications
requiring synchronized output signals at both the
primary clock frequency and one-half the primary
clock frequency. The four Y outputs switch in phase
and at the same frequency as the clock (CLK) input.
The four Q outputs switch at one-half the frequency of
CLK.
•
•
•
•
•
•
Low Output Skew, Low Pulse Skew for ClockDistribution and Clock-Generation Applications
TTL-Compatible Inputs and Outputs
Distributes One Clock Input to Eight Outputs
– Four Same-Frequency Outputs
– Four Half-Frequency Outputs
Distributed VCC and Ground Pins Reduce
Switching Noise
High-Drive Outputs (−48-mA IOH, 48-mA IOL)
State-of-the-Art EPIC-ΙΙB™ BiCMOS Design
Significantly Reduces Power Dissipation
Package Options Include Plastic Small-Outline
(DW) and Shrink Small-Outline (DB) Packages
2 Applications
•
Data center switch and server motherboard
When the output-enable (OE) input is low and the
clear (CLR) input is high, the Y outputs follow CLK
and the Q outputs toggle on low-to-high transitions of
CLK. Taking CLR low asynchronously resets the Q
outputs to the low level. When OE is high, the outputs
are in the high-impedance state.
The CDC339 is characterized for operation from
−40°C to 85°C.
Device Information
(1)
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
CDC339DW
SOIC (20)
132 mm² 12.8 x 10.3
CDC339DB
SSOP (20)
38 mm² 5.3 x 7.2
For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Symbol
Logic Diagram (Positive Logic)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
Submit Document Feedback
Copyright
© 2020 Texas
Instruments
Incorporated
intellectual
property
matters
and other important disclaimers. PRODUCTION DATA.
Product Folder Links: CDC339
1
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 Recommended Operating Conditions.........................4
6.3 Electrical Characteristics.............................................5
6.4 Timing Requirements ................................................. 5
6.5 Switching Characteristics ...........................................5
7 Parameter Measurement Information............................ 6
8 Device and Documentation Support..............................8
8.1 Receiving Notification of Documentation Updates......8
8.2 Support Resources..................................................... 8
8.3 Trademarks................................................................. 8
8.4 Electrostatic Discharge Caution..................................8
8.5 Glossary......................................................................8
9 Mechanical, Packaging, and Orderable Information.... 9
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (March 1994) to Revision A (May 2020)
Page
• Updated to new TI standard............................................................................................................................... 1
• Added Application bullet..................................................................................................................................... 1
2
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
5 Pin Configuration and Functions
Figure 5-1. DB OR DW PACKAGE (TOP VIEW)
Function Table
INPUTS
(1)
OUTPUTS
OE
CLR
CLK
Y1−Y4
Q1−Q4
H
X
X
Z
Z
L
L
L
L
L
L
L
H
H
L
L
H
L
L
Q0 (1)
L
H
↑
H
Q 0 (1)
The level of the Q outputs before the indicated steady-state input conditions were established.
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
3
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
7
V
VI
Input voltage range(2)
–0.5
7
V
VO
Voltage range applied to any output in the disabled or power-off state
–0.5
5.5
V
IO
Current into any output in the low state
96
mA
IIK (VI < 0)
Input clamp current
–18
mA
IOK (VO < 0)
Output clamp current
–50
mA
0.6
W
Maximum power dissipation at TA = 55°C (in still air)(3)
Tstg
(1)
(2)
(3)
DB Package
DW Package
Storage temperature
–65
1.6
W
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For
more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data
Book, literature number SCBD002B.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
MAX
UNIT
4.75
5.25
V
2
0
V
0.8
V
VCC
V
IOH
High-level output current
–48
mA
IOL
Low-level output current
48
mA
fclock
Input clock frequency
80
MHz
TA
Operating free-air temperature
85
°C
(1)
4
MIN
–40
Unused pins (input or I/O) must be held high or low.
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
6.3 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
VCC = 4.75 V
MIN
TYP(1)
II = –18 mA
MAX
UNIT
−1.2
V
0.5
V
VOH
VCC = 4.75 V
IOH = − 48 mA
VOL
VCC = 4.75 V
IOL = 48 mA
IIH
VCC = 5.25 V
VI = 2.7 V
50
µA
IIL
VCC = 5.25 V
VI = 0.5 V
−50
µA
IOZ
VCC = 5.25 V
VO = 2.7 V or 0.5 V
IO (2)
VCC = 5.25 V
VO = 2.5 V
VCC = 5.25 V
ICC
IO = 0
VI = VCC or GND
2
V
−50
±50
µA
−180
mA
Outputs high
70
Outputs low
85
Outputs disabled
70
mA
Ci
VI = 2.5 V or 0.5 V
3
pF
Co
VO = 2.5 V or 0.5 V
8
pF
(1)
(2)
All typical values are at VCC = 5 V, TA = 25°C.
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
6.4 Timing Requirements
over recommended ranges of supply voltage and operating free-air temperature
MIN
fclock
Clock frequency
tw
Pulse duration
tsu
Setup time
CLR low
4
CLK low
4
CLK high
4
CLR inactive before CLK↑
2
Clock duty cycle
MAX
UNIT
80
MHz
ns
ns
40%
60%
6.5 Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (see Figure 6-1 and Figure 6-2)
PARAMETER
FROM (INPUT)
TO (OUTPUT)
fmax
tPLH
tPHL
tPHL
tPZH
tPZL
tPHZ
tPLZ
tsk(o)
(1)
MIN
TYP(1)
MAX UNIT
80
CLK
Any Y or Q
CLR
Any Q
OE
Any Y or Q
OE
Any Y or Q
CLK↑
MHz
3
9
3
9
4
9
2
7
3
7
2
7
2
7
Y↑
0.75
Q↑
0.9
Y↑ and Q↑
0.9
ns
ns
ns
ns
ns
tr
0.9
ns
tf
0.7
ns
All typical values are at VCC = 5 V, TA = 25°C.
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
5
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
7 Parameter Measurement Information
Figure 7-1. Load Circuit and Voltage Waveforms
6
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
Figure 7-2. Skew Waveforms and Calculations
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
7
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
8 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
8.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
8.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.3 Trademarks
EPIC-ΙΙB™ is a trademark of Texas Instruments Incorporated.
TI E2E™ is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
8.5 Glossary
TI Glossary
8
This glossary lists and explains terms, acronyms, and definitions.
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
CDC339
www.ti.com
SCAS331A – MARCH 1994 – REVISED MAY 2020
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Document Feedback
Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: CDC339
9
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
CDC339DB
ACTIVE
SSOP
DB
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CK339
Samples
CDC339DW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CDC339
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
很抱歉,暂时无法提供与“CDC339DW”相匹配的价格&库存,您可以联系我们找货
免费人工找货