CDC5801ADBQG4


   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 D Low Jitter Clock Multiplier by x4, x6, x8. D D D D D D D D D D D D Input Frequency Range (19 MHz to 125 MHz). Supports Output Frequency From 150 MHz to 500 MHz Fail-Safe Power Up Initialization Low Jitter Clock Divider by /2, /3, /4. Input Frequency Range (50 MHz to 125 MHz). Supports Ranges of Output Frequency From 12.5 MHz to 62.5 MHz 2.6 mUI Programmable Bidirectional Delay Steps Typical 8-ps Phase Jitter (12 kHz to 20 MHz) at 500 MHz Typical 2.1-ps RMS Period Jitter (Entire Frequency Band) at 500 MHz One Single-Ended Input and One Differential Output Pair Output Can Drive LVPECL, LVDS, and LVTTL Three Power Operating Modes to Minimize Power Low Power Consumption (Typical 200 mW at 500 MHz) Packaged in a Shrink Small-Outline Package (DBQ) No External Components Required for PLL Spread Spectrum Clock Tracking Ability to Reduce EMI D Applications: Video Graphics, Gaming Products, Datacom, Telecom D Accepts LVCMOS, LVTTL Inputs for D D REFCLK Terminal Accepts Other Single-Ended Signal Levels at REFCLK Terminal by Programming Proper VDDREF Voltage Level (For Example, HSTL 1.5 if VDDREF = 1.6 V) Supports Industrial Temperature Range of −40°C to 85°C DBQ PACKAGE (TOP VIEW) VDDREF REFCLK VDDP GNDP GND LEADLAG DLYCTRL GNDPA VDDPA VDDPD STOPB PWRDNB 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 P0 P1 VDDO GNDO CLKOUT NC CLKOUTB GNDO VDDO MULT0/DIV0 MULT1/DIV1 P2 NC − No internal connection description The CDC5801A device provides clock multiplication and division from a single-ended reference clock (REFCLK) to a differential output pair (CLKOUT/CLKOUTB). The multiply and divide terminals (MULT/DIV0:1) provide selection for frequency multiplication and division ratios, generating CLKOUT/CLOUTKB frequencies ranging from 12.5 MHz to 500 MHz with a clock input reference (REFCLK) ranging from 19 MHz to 125 MHz. See Table 1 and Table 2 for detail frequency support. The implemented phase aligner provides the possibility to phase align (zero delay) between CLKOUT/CLKOUTB and REFCLK or any other CLK in the system by feeding the clocks that need to be aligned to the DLYCTRL and the LEADLAG terminals. The phase aligner also allows the user to delay or advance the CLKOUT/CLKOUTB with steps of 2.6 mUI (unit interval). For every rising edge on the DLYCTRL terminal, the output clocks are delayed by 2.6-mUI step size as long as there is low on the LEADLAG terminal. Similarly, for every rising edge on the DLYCTRL terminal, the output clocks are advanced by 2.6-mUI step size as long as there is high on the LEADLAG terminal. The CDC5801A has a fail-safe power up initialization state-machine which supports proper operation under all power up conditions. As the phase between REFCLK and CLKOUT/CLKOUTB is random after power up, the application may implement a self calibration routine at power up to produce a certain phase start position, before programming a fixed delay with the clock on the DLYCTRL terminal. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2005, Texas Instruments Incorporated  
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             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 Depending on the selection of the mode terminals (P0:2), the device behaves as a multiplier (by 4, 6, or 8) with the phase aligner bypassed or as a multiplier or divider with programmable delay and phase aligner functionality. Through the select terminals (P0:2) user can also bypass the phase aligner and the PLL (test mode) and output the REFCLK directly on the CLKOUT/CLKOUTB terminals. Through P0:2 terminals the outputs could be in a high impedance state. This device has another unique capability to be able to function with a wide band of voltages on the REFCLK terminal by varying the voltage on the VDDREF terminal. The CDC5801A has a fail-safe power up initialization state-machine which supports proper operation under all power up conditions. The CDC5801A device is characterized for operation over free-air temperatures of −40°C to 85°C. functional block diagram PWRDWNB P0 P1 P2 STOPB Control Logic PLLCLK Phase Aligner Bypass MUX PLL REFCLK CLKOUT B Phase Aligner Divider Ratio VDDREF/2 φD A VDDPD/2 2 2 MULT0/DIV0 MULT1/DIV1 DLYCTRL POST OFFICE BOX 655303 LEADLAG • DALLAS, TEXAS 75265 CLKOUTB 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 FUNCTION TABLE† MODE P0 P1 P2 CLKOUT/CLKOUTB Multiplication with programmable delay and phase alignment active‡ 0 0 0 REFCLK multiplied by ratio per Table 1 selected by MULT/DIV terminals. Outputs are delayed or advanced based on DLYCTRL and LEADLAG terminal configuration. Division with programmable delay and phase alignment active ‡ 0 0 1 REFCLK divided by ratio per Table 2 selected by MULT/DIV terminals. Outputs are delayed or advanced based on DLYCTRL and LEADLAG terminal configuration. Multiplication only mode (phase aligner bypassed) § 1 0 0 In this mode one can only multiply as per Table 1. Programmable delay capability and divider capability is deactivated. PLL is running. Test mode 1 1 0 PLL and phase aligner both bypassed. REFCLK is directly channeled to output. Hi-Z mode 0 1 X Hi-Z † X = don’t care, Hi-Z = high impedance ‡ Please see Table 4 and Table 5 for explanation for the programmability and phase alignment functions. § In this mode the DLYCTRL and LEADLAG terminals must be strapped high or low. Lowest possible jitter is achieved in this mode, but a delay of 200 ps to 2 ns expected typically from REFCLK to CLKOUT depending on the output frequency. Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION CLKOUT 20 O Output clock CLKOUTB 18 O Output clock (complement) DLYCTRL 7 I Every rising edge on this terminal delays/advances the CLKOUT/CLKOUTB signal by 1/384th of the CLKOUT/CLKOUTB period. (e.g., for a 90 degree delay or advancement one needs to provide 96 rising edges). See Table 4. GND 5 GND for VDDREF and VDDPD GNDO 17, 21 GNDP 4 GNDPA 8 LEADLAG 6 I Decides if the output clock is delayed or advanced with respect to REFCLK. See Table 4. MULT0/DIV0 15 I PLL multiplier and divider select MULT1/DIV1 14 I PLL multiplier and divider select NC 19 PWRDNB 12 I Active low power down state, CLKOUT/CLKOUTB goes low P0 24 I Mode control, see the Function Table P1 23 I Mode control, see the Function Table P2 13 I Mode control, see the Function Table REFCLK 2 I Reference input clock STOPB 11 I Active low output disabler, PLL and PA still running, CLKOUT and CLKOUTB goes to a dc value as per Table 3 VDDPA VDDPD 9 I Supply voltage for phase aligner 10 I Reference voltage for the DLYCTRL, LEADLAG terminals and STOPB function 1 I Reference voltage for REFCLK 16, 22 I Supply voltage for the output terminals (CLKOUT, CLKOUTB) 3 I Supply voltage for PLL VDDREF VDDO VDDP GND for clock output terminals (CLKOUT, CLKOUTB) GND for PLL GND for phase aligner Not used POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 PLL divider/multiplier selection Table 1 and Table 2 list the supported REFCLK and BUSCLK (CLKOUT/CLKOUTB) frequencies. Table 1. Multiplication Ratios (P0:2 = 000 or 100) REFCLK (MHZ) MULTIPLICATION RATIO BUSCLK (MHZ) 0 38−125 4 152−500 1 25−83.3 6 150−500 1 19−62.5 8 152−500 MULT0 MULT1 0 0 1 Table 2. Divider Ratio (P0:2 = 001) MULT0 MULT1 REFCLK (MHZ) DIVISION RATIO BUSCLK(1) (MHZ) 0 0 100−125 2 50−62.5 1 0 75−93 3 25−31 1 1 50−62 4 12.5−15.5 † BUSCLK will be undefined until a valid reference clock is available at REFCLK. After applying REFCLK, the PLL requires stabilization time to achieve phase lock. Table 3. Clock Output Driver States STATE PWRDNB STOPB CLKOUT CLKOUTB Powerdown 0 X GND GND CLK stop 1 0 Normal 1 1 VO, STOP As per Function Table VO, STOP As per Function Table Table 4. Programmable Delay and Phase Alignment DLYCTRL LEADLAG Each rising edge† Each rising edge† 1 CLKOUT AND CLKOUTB Will be advanced by one step size (see Table 5) 0 Will be delayed by one step size (see Table 5) † For every 32nd edge, there are one or two edges the phase aligner does not update. Therefore, CLKOUT phase is not updated on every 32nd edge. Table 5. Clock Output Driver States FUNCTIONALITY STEP SIZE Multiply by 4, 6, 8 CLKOUT period/384 (for example, 6.5 ps at 400 MHz) Divide by 2 CLKOUT period/3072 (for example, 6.5 ps at 50 MHz) Divide by 3 CLKOUT period/6144 (for example, 6.5 ps at 25 MHz) Divide by 4 CLKOUT period/12288 (for example, 6.5 ps at 12.5 MHz) NOTE: The frequency of the DLYCTRL terminal must always be equal or less than the frequency of the LEADLAG terminal. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V Output voltage range, VO, at any output terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDD + 0.5 V Input voltage range,VI, at any input terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDD + 0.5 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to the GND terminals. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C‡ TA = 85°C POWER RATING DBQ 1400 mW 11 mW/°C 740 mW ‡ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. recommended operating conditions Supply voltage, VDD (VDDP, VDDPA, VDDO) MIN NOM MAX 3 3.3 3.6 0.7 × VDD High-level input voltage, VIH (CMOS) REFCLK low-level input voltage, VIL 0.7 × VDDREF REFCLK high-level input voltage, VIH Input signal high voltage, VIH (STOPB, DLYCTRL, LEADLAG) 0.7 × VDDPD Input reference voltage for (REFCLK) (VDDREF) 1.235 Input reference voltage for (DLYCTRL and LEADLAG) (VDDPD) 1.235 V V V High-level output current, IOH Low-level output current, IOL Operating free-air temperature, TA V V 0.3 × VDDPD Input signal low voltage, VIL (STOPB, DLYCTRL, LEADLAG) V V 0.3 × VDD 0.3 × VDDREF Low-level input voltage, VIL (CMOS) UNIT −40 VDD VDD V −16 mA 16 mA 85 °C V timing requirements MIN Input frequency of modulation, fmod (if driven by SSC CLKIN) MAX 33 Modulation index (nonlinear maximum 0.5%) UNIT kHz 0.6% Input slew rate, SR 1 4 Input duty cycle on REFCLK 40% 60% Input frequency on REFCLK 19 125 MHz 200 MHz 400 MHz Allowable frequency on DLYCTRL Allowable frequency on LEADLAG Allowable duty cycle on DLYCTRL and LEADLAG POST OFFICE BOX 655303 25% • DALLAS, TEXAS 75265 V/ns 75% 5 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) TEST CONDITIONS† PARAMETER VO(STOP) Output voltage during CLK stop mode See Figure 1 VOX VO Output crossing-point voltage See Figure 1 and Figure 4 Output voltage swing (VOH − VOL) See Figure 1 VIK Input clamp voltage VDD = 3 V, II = −18 mA See Figure 1, VDD = 3 to 3.6 V VOH High-level output voltage VOL Low-level output voltage IOH IOL VDD = 3 V, IOH = −16 mA See Figure 1, VDD = 3 to 3.6 V High-level output current Low-level output current VDD = 3 V, VDD = 3.135 V, IOL = 16 mA VO = 1 V VDD = 3.3 V, VDD = 3.465 V, VO = 1.65 V VO = 3.135 V VDD = 3.135 V, VDD = 3.3 V, VDD = 3.465 V, VO = 1.95 V VO = 1.65 V High-impedance-state output current P0 = 0, IOZ(STOP) High-impedance-state output current during CLK stop Stop = 0, VO = GND or VDD IOZ(PD) High-impedance-state output current in power-down state PWRDNB = 0, VO = GND or VDD IIH IIL ZO Low-level input current Output impedance (single ended) Reference current TYP‡ MAX 2 V 0.5VDDO−0.2 1.7 0.5VDDO+0.2 2.9 V −1.2 V 2.0 V 2.2 0.3 0.6 0.5 −32 −14.5 mA −21 61.5 65 25.5 P1 = 1 −10 mA 36 ± 10 µA ± 100 µA 100 µA VDD = 3.6 V, VI = VDD 10 PWRDNB, P0:2, MULT/ DIV0:1 VDD = 3.6 V, VI = VDD 10 REFCLK, STOPB VDD = 3.6 V, VI = 0 −10 PWRDNB, P0:2, MULT/ DIV0:1 VDD = 3.6 V, VI = 0 −10 µA µA High state RI at IO −14.5 mA to −16.5 mA 15 35 50 Low state RI at IO 14.5 mA to 16.5 mA 11 17 35 VDDREF, VDDPD VDD = 3.6 V Input capacitance CO Output capacitance IDD(PD) Supply current in power-down state V −52 −51 43 V 2.6 REFCLK, STOPB CI UNIT 1.1 VO = 0.4 V IOZ High-level input current MIN Ω PWRDNB = 0 50 µA PWRDNB = 1 0.5 mA VI = VDD or GND VO = VDD or GND 2 pF 3 pF REFCLK = 0 MHz to 100 MHz, PWDNB = 0, STOPB = 1 150 µA IDD(CLKSTOP) Supply current in CLK stop state BUSCLK configured for 500 MHz 40 mA IDD(NORMAL) Supply current in normal state BUSCLK = 500 MHz P0:2 = 000; load see Figure 1 70 mA † VDD refers to any of the following; VDDPA, VDDPD, VDDREF, VDDO, and VDDP ‡ All typical values are at VDD = 3.3 V, TA = 25°C. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 jitter specification over recommended operating free-air temperature range and VCC (unless otherwise noted) PARAMETER t(jitter) (Multiplication only mode. Phase alignment and programmable delay features are not selected (PA bypass). See Figure 2.) TEST CONDITIONS 155 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 6 40 50 27 27 ps 200 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 5.5 36 36 36 23 23 ps 312 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 3 20 18 18 17 17 ps 400 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 2.3 17 12 12 15 15 ps 500 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 2.1 16 8 8 14 14 ps 155 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 9 70 50 50 50 ps 200 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 7 55 36 36 40 40 ps 312 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 4 35 18 18 30 30 ps 400 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 3.1 27 13 13 25 25 ps t(jitter) (Multiplication with phase alignment and programmable delay features selected. See Figure 2.) MIN TYP† CLKOUT MAX UNIT † All typical values are at VDD = 3.3 V, TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 jitter specification over recommended operating free-air temperature range and VCC (unless otherwise noted) (continued) PARAMETER t(jitter) (Multiplication with phase alignment and programmable delay features selected. See Figure 2.) CLKOUT MAX UNIT 500 MHz ps 12.5 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 12 75 55 55 ps 15.5 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 8 50 38 38 ps 25 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 7.5 50 35 35 ps 31 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 5.5 30 23 23 ps 50 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 8 40 12 30 30 ps 62.5 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 5.5 28 9 24 24 ps 12.5 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 12.5 80 55 55 ps 15.5 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 8.5 55 38 38 ps 25 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 10 60 35 35 ps 31 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Cycle-to-cycle (+) Cycle-to-cycle (−) 7 40 23 23 ps MULT0:1 = 00 (Divider ratio = 2) MULT0:1 = 11 (Divider ratio = 4) MULT0:1 = 10 (Divider ratio = 3) 8 TYP† 2.9 24 9 9 20 20 MULT0:1 = 10 (Divider ratio = 3) t(jitter) (Divider mode with phase alignment and programmable delay features selected. See Figure 2.) MIN Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Phase jitter (accumulated, 50 kHz to 80 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) MULT0:1 = 11 (Divider ratio = 4) t(jitter) (Divider mode with phase aligner not active: DLYCTRL =LEADLAG = 0 or 1. See Figure 2.) TEST CONDITIONS POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 jitter specification over recommended operating free-air temperature range and VCC (unless otherwise noted) (continued) PARAMETER t(jitter) (Divider mode with phase alignment and programmable delay features selected. See Figure 2.) CLKOUT TEST CONDITIONS MIN TYP† MAX UNIT 50 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 9 50 13 35 35 ps 62.5 MHz Period RMS (1Σ jitter, full frequency band) Period p-p Phase jitter (accumulated, 12 kHz to 20 MHz) Cycle-to-cycle (+) Cycle-to-cycle (−) 6.5 30 10 26 26 ps MULT0:1 = 00 (Divider ratio = 2) † All typical values are at VDD = 3.3 V, TA = 25°C. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS t(DC) Output duty cycle See Figure 3 tr, tf Output rise and fall times (measured at 20%−80% of output voltage) See Figure 5 and Figure 1 MIN TYP† MAX 45% 55% 150 350 UNIT ps † All typical values are at VDD = 3.3 V, TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 state transition latency specifications PARAMETER t(powerup) t(VDDpowerup) t(MULT) t(CLKON) Delay time, PWRDNB↑ to CLKOUT/ CLKOUTB output settled (excluding t(DISTLOCK)) FROM TO Powerdown Normal TEST CONDITIONS MIN TYP† MAX 3 See Figure 6 ms Delay time, PWRDNB↑ to internal PLL and clock are on and settled 3 Delay time, power up to CLKOUT/CLKOUTB output settled 3 VDD Delay time, power up to internal PLL and clock are on and settled MULT0 and MULT1 change to CLKOUT/ CLKOUTB output resettled (excluding t(DISTLOCK)) STOPB↑ to CLKOUT/CLKOUTB glitch-free clock edges UNIT Normal See Figure 6 ms 3 Normal Normal See Figure 7 1 ms CLK Stop Normal See Figure 8 10 ns CLK Stop Normal See Figure 8 20 cycles t(CLKSETL) STOPB↑ to CLKOUT/CLKOUTB output settled to within 50 ps of the phase before STOPB was disabled t(CLKOFF) STOPB↓ to CLKOUT/CLKOUTB output disabled Normal CLK Stop See Figure 8 5 ns t(powerdown) Delay time, PWRDNB↓ to the device in the power-down mode Normal Power− down See Figure 6 1 ms t(STOP) Maximum time in CLKSTOP (STOPB = 0) before reentering normal mode (STOPB = 1) STOPB Normal See Figure 8 100 µs t(ON) Minimum time in normal mode (STOPB = 1) before reentering CLKSTOP (STOPB = 0) Normal CLK stop See Figure 8 100 † All typical values are at VDD = 3.3 V, TA = 25°C. PARAMETER MEASUREMENT INFORMATION CLKOUT 50 Ω VCM 50 Ω 10 pF CLKOUTB Figure 1. Test Load and Voltage Definitions (VO(STOP), VOX, VOH, VOL) 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ms 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION CLKOUTB CLKOUT tcycle,i tcycle,i+1 Cycle-to-Cycle Jitter = | tcycle,i − tcycle,i+r| Over 1000 Consecutive Cycles Figure 2. Cycle-to-Cycle Jitter CLKOUT CLKOUTB tpw+ tcycle Duty Cycle = (tpw+/tcycle) Figure 3. Output Duty Cycle CLKOUT VX+ VX, nom VX− CLKOUTB Figure 4. Crossing-Point Voltage VOH 80% 20% VOL tr tf Figure 5. Voltage Waveforms PWRDNB CLKOUT/ CLKOUTB ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ Figure 6. PWRDNB Transition Timings POST OFFICE BOX 655303 ÎÎ ÎÎ ÎÎ t(power down) t(power up) • DALLAS, TEXAS 75265 11 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION MULT0 and/or MULT1 ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ CLKOUT/ CLKOUTB t(MULT) Figure 7. MULT Transition Timings t(ON) t(STOP) STOPB t(CLKSETL) t(CLKON) (see Note A) CLKOUT/ CLKOUTB ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ Output Clock Not Specified Glitches OK Clock Enabled and Glitch Free ÎÎ ÎÎ ÎÎ Clock Output Settled Within 50 ps of the Phase Before Disabled NOTE A: Vref = VO ± 200 mV Figure 8. STOPB Transition Timings 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 t(CLKOFF) (see Note A) 

   

             SCAS813A − AUGUST 2005 − REVISED DECEMBER 2005 Z = 50 Ω ; Length = L1 CDCVF2310 Clock Buffer 3.3 V CDC5801 VDDREF A 3.3 V REFCLK VDDP GNDP GND 3.3 V CLK Outputs are Phase Aligned Between the Two Buffers P0 P1 VDDO GNDO 3.3 V CDCVF2310 Clock Buffer CLKOUT LEADLAG NC DLYCTRL CLKOUTB Z = 50 Ω 20 R GNDPA GNDO VDDPA VDDPD VDDO MULT0/DIV0 3.3 V STOPB MULT1/DIV1 3.3 V PWRDNB CLK 155.52 MHz Z = 50 Ω Z = 50 Ω 19.44 MHz Very Low Jitter 19.44 MHz P2 Z = 50 Ω ; Length = L1 Figure 9. Using the CDC5801A Device as a Multiplier by 8 and Aligning Two Different Clocks POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants *All dimensions are nominal Device CDC5801ADBQR Package Package Pins Type Drawing SSOP DBQ 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CDC5801ADBQR SSOP DBQ 24 2500 356.0 356.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated