CDCS501
www.ti.com..................................................................................................................................................................................................... SCAS874 – APRIL 2009
SSC Clock Generator/Buffer
FEATURES
APPLICATIONS
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Part of a Family of Easy to use Clock
Generator Devices With Optional SSC
SSC Capable Clock Generator / Buffer
SSC Controllable via 3 External Pins
– ±0% to ±1.5% Center Spread
1 External Control Pin for SSC ON / OFF
Selection
40 MHz to 108 MHz Single-Ended LVCMOS
Input
Single 3.3V Device Power Supply
Wide Temperature Range – 40°C to 85°C
Low Space Consumption by 8 Pin TSSOP
Package
Consumer and Industrial Applications
Requiring EMI Reduction through Spread
Spectrum Clocking
PACKAGE
IN
SSC_SEL 0
SSC_SEL 1
GND
1
2
3
4
CDCS501
8
7
6
5
VDD
SSC_SEL 2
OUT
SSC_ON
BLOCK DIAGRAM
V DD
IN
SSC_SEL 0
SSC_SEL 1
SSC_SEL 2
LVCMOS
GND
SSC Generator
LV
CMOS
OUT
SPREAD
LOOK-UP
TABLE
SSC_ON
DESCRIPTION
The CDCS501 is a spread spectrum capable, LVCMOS Input Clock Buffer for EMI reduction.
The device is designed to counter common EMI problems in modern electronic designs.
It accepts a 3.3V LVCMOS signal at the input and spread this signal by a small amount, centered around the
input frequency. The amount of spread can be selected via 3 control pins. The Functional Table contains detailed
information on the amount of spread. A 4th control pin can be used to activate or deactivate the Spread
Spectrum Clock Generator.
Selecting SSC_ON = off will turn the Spread Spectrum Clock Generator off only. The device will still pass the
LVCMOS signal that’s presented at its input trough to its output. This pin is low active.
The wide operating frequency range covers most commonly used midrange Audio and Video frequencies. The
CDCS501 operates in 3.3V environment.
It is characterized for operation from –40°C to 85°C, and available in an 8-pin TSSOP package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
CDCS501
SCAS874 – APRIL 2009..................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTION TABLE
SSC_ON
SSC_SEL 0
SSC_SEL 1
SSC_SEL 2
SPREAD AMOUNT
1
x
x
X
0.00%
0
0
0
0
1.00%
0
0
0
1
1.50%
0
0
1
0
1.00%
0
0
1
1
1.50%
0
1
0
0
0.50%
0
1
0
1
0.75%
0
1
1
0
0.00%
0
1
1
1
0.50%
DEVICE INFORMATION
PACKAGE
IN
SSC_SEL 0
SSC_SEL 1
GND
1
2
3
4
8
7
6
5
CDCS501
VDD
SSC_SEL 2
OUT
SSC_ON
PIN FUNCTIONS
PIN
NAME
IN
OUT
NO.
Type
1
I
Description
LVCMOS Clock Input
6
O
LVCMOS Clock Output
2, 3, 7
I
Spread Selection Pins, internal Pull-up
SSC_ON
5
I
SSC on/off Pin, active low; internal Pull-down
VDD
8
Power
3.3V Power Supply
GND
4
Ground
Ground
SSC_SEL 0, 1, 2
PACKAGE THERMAL RESISTANCE FOR TSSOP (PW) PACKAGE (1)
THERMAL AIRFLOW (CFM)
CDCS501PW 8-PIN TSSOP
RθJA
RθJc
(1)
2
0
150
250
500
High K
149
142
138
132
Low K
230
185
170
150
High K
65
Low K
69
UNIT
°C / W
°C / W
The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): CDCS501
CDCS501
www.ti.com..................................................................................................................................................................................................... SCAS874 – APRIL 2009
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
VDD
Supply voltage range
–0.5 to 4.6
V
VIN
Input voltage range
–0.5 to 4.6
V
Vout
Output voltage range
–0.5 to 4.6
V
IIN
Input current (VI < 0, VI > VDD)
20
mA
Iout
Continuous output current
50
mA
TST
Storage temperature range
–65 to 150
°C
TJ
Maximum junction temperature
125
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
VDD
Supply voltage
3.0
3.6
V
fIN
Input Frequency
40
108
MHz
VIL
Low level input voltage LVCMOS
VIH
High level input voltage LVCMOS
VI
Input Voltage threshold LVCMOS
CL
Output Load Test LVCMOS
15
pF
IOH/IOL
Output Current
12
mA
TA
Operating free-air temperature
85
°C
0.3 VDD
0.7 VDD
V
0.5 VDD
–40
V
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Product Folder Link(s): CDCS501
V
3
CDCS501
SCAS874 – APRIL 2009..................................................................................................................................................................................................... www.ti.com
DEVICE CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
IDD
Device supply current
fOUT
Output frequency
IIH
LVCMOS input current
IIL
LVCMOS input current
VOH
VOL
TEST CONDITIONS
MIN
MAX
UNIT
108
MHz
VI = VDD; VDD = 3.6V
10
µA
VI = 0 V; VDD = 3.6V
–10
µA
fIN = 80 MHz
TYP
26
40
LVCMOS high-level output voltage
LVCMOS low-level output voltage
IOH = –0.1mA
2.9
IOH = –8mA
2.4
IOH = –12mA
2.2
mA
V
IOL = 0.1mA
0.1
IOL = 8mA
0.5
IOL = 12mA
0.8
V
tJIT(C-C)
Cycle to cycle jitter cycles
fout = 80 MHz; SSC = 1%, 10000 cycles
110
ps
tr/tf
Rise and fall time
20%–80%
0.75
ns
Odc
Output duty cycle
fMOD
Modulation frequency
45%
55%
30
kHz
40
VDD = 3.3 V
IDD - Supply Current - mA
35
30
25
20
15
10
20
30
40
50
60
70
80
90
100 110 120
f - Frequency - MHz
Figure 1. IDD vs. Input Frequency, VDD = 3.3V
4
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): CDCS501
CDCS501
www.ti.com..................................................................................................................................................................................................... SCAS874 – APRIL 2009
APPLICATION INFORMATION
SSC MODULATION
The exact implementation of the SSC modulation plays a vital role for the EMI reduction. The CDCS501 uses a
triangular modulation scheme implemented in a way that the modulation frequency depends on the VCO
frequency of the internal PLL and the spread amount is independent from the VCO frequency.
The modulation frequency can be calculated by using the below formula.
fmod = fIN / 2480
PARAMETER MEASUREMENT INFORMATION
VDD
CDCS501 1 kW
LVCMOS
1 kW
10 pF
Figure 2. Test Load
CDCS501
LVCMOS
LVCMOS
Typical Driver
Impedance
~32 W
Series Termination
~18 W
ZL = 50 W
Figure 3. Test Load for 50-Ω Board Enviroment
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): CDCS501
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CDCS501PW
ACTIVE
TSSOP
PW
8
150
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CS501
CDCS501PWR
ACTIVE
TSSOP
PW
8
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CS501
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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