CLC007
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SNLS016E – JULY 1998 – REVISED APRIL 2013
CLC007 Serial Digital Cable Driver with Dual Complementary Outputs
Check for Samples: CLC007
FEATURES
DESCRIPTION
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The Texas Instruments Comlinear CLC007 is a
monolithic, high-speed cable driver designed for the
SMPTE 259M serial digital video data transmission
standard. The CLC007 drives 75Ω transmission lines
(Belden 8281 or equivalent) at data rates up to 400
Mbps. Controlled output rise and fall times (750 ps
typical) minimize transition-induced jitter. The output
voltage swing, typically 1.65V, set by an accurate,
low-drift internal bandgap reference, delivers an 800
mV swing to back-matched and terminated 75Ω
cable.
1
2
No External Pull-Down Resistors
Differential Input and Output
Low Power Dissipation
Single +5V or −5.2V Supply
Replaces GS9007 in Most Applications
APPLICATIONS
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Digital Routers and Distribution Amplifiers
Coaxial Cable Driver for Digital Transmission
Line
Twisted Pair Driver
Digital Distribution Amplifiers
SMPTE, Sonet/SDH, and ATM Compatible
Driver
Buffer Applications
KEY SPECIFICATION
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The CLC007 is powered from a single +5V or −5.2V
supply and comes in an 8-pin SOIC package.
650 ps Rise and Fall Times
Data Rates to 400 Mbps
2 Sets of Complimentary Outputs
200 mV Differential Input
Low Residual Jitter (25 pspp)
270 Mbps Eye Pattern
0
1
2
The CLC007’s class AB output stage consumes less
power than other designs, 195 mW with all outputs
terminated, and requires no external bias resistors.
The differential inputs accept a wide range of digital
signals from 200 mVP-P to ECL levels within the
specified common-mode limits. All this make the
CLC007 an excellent general purpose high speed
driver for digital applications.
Connection Diagram
3
4
5
TIME (1 ns/Div)
Figure 1.
Q0 1
8 VCC
Q0 2
7 VIN+
Q1 3
6 VIN-
Q1 4
5 VEE
6
Figure 2. 8-Pin SOIC
See D Package
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
CLC007
SNLS016E – JULY 1998 – REVISED APRIL 2013
www.ti.com
Typical Application
VCC
75:
80.6:
80.6:
75: Coax
75:
8
7
1
+
VIN+
0.1 PF
2
75:
0.1 PF
75: Coax
CLC007
6
VIN-
75:
3
4
75:
0.1 PF
75: Coax
5
133:
133:
75:
75:
0.1 PF
75: Coax
VEE
75:
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
Supply Voltage
6V
Output Current
30 mA
Maximum Junction Temperature
+125°C
−65°C to +150°C
Storage Temperature Range
Lead Temperature
(Soldering 10 Second)
+300°C
ESD Rating (Human body Model)
Package Thermal Resistance
Reliability Information
(1)
(2)
1000V
θJA 8–pin SOIC
+160°C
θJC 8–pin SOIC
+105°C/W
MTTF
254 Mhr
Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The table of ELECTRICAL CHARACTERISTICS specifies conditions of device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage (VCC – VEE)
2
+4.5V to +5.5V
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SNLS016E – JULY 1998 – REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS
(VCC = 0V, VEE = −5V; unless otherwise specified).
Parameter
Conditions
Typ +25°C
Min/Max
+25°C
Min/Max
0°C
to+70°C
Min/Max
−40°C to
+85°C
Units
39
—
—
—
mA
STATIC PERFORMANCE
See
(1)
Supply Current, Unloaded
See
(2)
34
28/45
26/47
26/47
mA
Output HIGH Voltage (VOH)
See
(2)
−1.7
−2.0/1.4
−2.0/1.4
−2.0/1.4
V
Output Low Voltage (VOL)
See
(2)
−3.3
−3.6/3.0
−3.6/3.0
−3.6/3.0
V
10
30
50
50
μA
See
(2)
1.65
1.55/1.75
1.53/1.77
1.51/1.79
V
Common Mode Input Range Upper Limit
−0.7
−0.8
−0.8
−0.8
V
Common Mode Input Range Lower Limit
−2.6
−2.5
−2.5
−2.5
V
Minimum Differential Input Swing
200
200
200
200
mV
26
20
20
20
dB
650
425/955
400/1100
400/1100
ps
Supply Current, Loaded
Input Bias Current
Output Swing
Power Supply Rejection Ratio
(2)
AC PERFORMANCE
Output Rise and Fall Time
See
(1) (2) (3)
Overshoot
5
%
Propagation Delay
1.0
ns
Duty Cycle Distortion
50
Residual Jitter
25
ps
—
—
—
pspp
MISCELLANEOUS PERFORMANCE
Input Capacitance
1.0
Output Resistance
10
Ω
Output Inductance
6
nH
(1)
(2)
(3)
pF
Measured with both outputs driving 150Ω, AC coupled at 270 Mbps.
Spec is 100% tested at +25°C
Measured between the 20% and 80% levels of the waveform.
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CLC007
SNLS016E – JULY 1998 – REVISED APRIL 2013
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OPERATION
Input Interfacing
The CLC007 has high impedance, emitter-follower buffered, differential inputs. Single-ended signals may also be
input. Transmission lines supplying input signals must be properly terminated close to the CLC007. Either A.C. or
D.C. coupling as in Figure 4 or Figure 5 may be used. Figure 4, Figure 6, and Figure 7 show how Theveninequivalent resistor networks are used to provide input termination and biasing. The input D.C. common-mode
voltage range is 0.8V to 2.5V below the positive power supply (VCC). Input signals plus bias should be kept within
the specified common-mode range. For an 800 mVP-P input signal, typical input bias levels range from 1.2V to
2.1V below the positive supply.
Resistor to VCC (R1)
Resistor to VEE (R2)
ECL, 50Ω, 5V, VT=2V
Load Type
82.5Ω
124Ω
ECL, 50Ω, 5.2V, VT=2V
80.6Ω
133Ω
ECL, 75Ω, 5V, VT=2V
124Ω
187Ω
ECL, 75Ω, 5.2V, VT=2V
121Ω
196Ω
800 mVP-P, 50Ω, 5V, VT=1.6V
75.0Ω
154Ω
800 mVP-P, 75Ω, 5V, VT=1.6V
110Ω
232Ω
800 mVP-P, 2.2 KΩ, 5V, VT=1.6V
3240Ω
6810Ω
VCC
VIN+
VIN-
To next
stage
VEE
Figure 3. Input Stage
VCC
VCC
ECL Output
Z0
R1
R1
0.1 PF
8
7
1
+
2
CLC007
6
VTT
Z0
3
4
0.1 PF
5
R2
R2
VTT
VEE
VEE
Figure 4. AC Coupled Input
4
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CLC007
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SNLS016E – JULY 1998 – REVISED APRIL 2013
VCC
ECL Output
Z0
8
7
1
+
2
CLC007
6
3
4
Z0
= Z0
5
= Z0
VTT
VEE
Figure 5. DC Coupled Input
VCC
R5
75:
R4
75:
R6
75:
C1
0.1 PF
J3
R7
75:
C2
0.1 PF
J4
R8
75:
C3
0.1 PF
J5
R9
75:
C4
0.1 PF
J6
8
7
4
+
3
CLC007
6
J2
VIN+
2
1
R3
154:
R1
154:
5
VEE
Figure 6. Single Ended 50Ω ECL Input
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CLC007
SNLS016E – JULY 1998 – REVISED APRIL 2013
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VCC
R5
75:
R4
75:
C1
0.1 PF
J3
R7
75:
C2
0.1 PF
J4
R8
75:
C3
0.1 PF
J5
R9
75:
C4
0.1 PF
J6
8
7
J1
VIN-
R6
75:
4
+
3
CLC007
6
J2
VIN+
2
1
R3
154:
R1
154:
5
VEE
Figure 7. Differential 50Ω ECL Input
Output Interfacing
The CLC007’s class AB output stage, Figure 8, requires no standing current in the output transistors and
therefore requires no biasing or pull-down resistors. Advantages of this arrangement are lower power dissipation
and fewer external components. The output may be either D.C. or A.C. coupled to the load. A bandgap voltage
reference sets output voltage levels which are compatible with F100K and 10K ECL when correctly terminated.
The outputs do not have the same output voltage temperature coefficient as 10K. Therefore, noise margins will
be reduced over the full temperature range when driving 10K ECL. Noise margins will not be affected when
interfacing to F100K since F100K is fully voltage and temperature compensated.
VCC
VEE
VCC
VEE
Figure 8. Output Stage
6
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SNLS016E – JULY 1998 – REVISED APRIL 2013
VCC
for 75: input:
R1 = R3 = 232:
R4 = R5 = 110:
R6
75:
R5
75:
R4
75:
75: Coax
J3
75:
8
J1
VIN+
7
J2
VIN-
6
1
+
2
R7
75:
75: Coax
J4
CLC007
4
R3
154:
R1
154:
75:
3
R8
75:
5
75:
R9
75:
RIN = 50:
VBIAS = VCC - 1.62V
75: Coax
J5
75: Coax
J6
VEE
75:
VCC - VEE = +5V
Figure 9. Differential Input DC Coupled Output
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CLC007
SNLS016E – JULY 1998 – REVISED APRIL 2013
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Output Rise And Fall Times
Output load capacitance can significantly affect output rise and fall times. The effect of load capacitance, stray or
otherwise, may be reduced by placing the output back-match resistor close to the output pin and by minimizing
all interconnecting trace lengths. Figure 10 shows the effect on risetime of parallel load capacitance across a
150Ω load.
OUTPUT CAPACITANCE (pFd)
50
40
30
20
10
0
500
1000
1500
2000
2500
3000
RISE TIME (ps)
Figure 10. Rise Time vs CL
PCB Layout Recommendations
Printed circuit board layout affects the performance of the CLC007. The following guidelines will aid in achieving
satisfactory device performance.
• Use a ground plane or power/ground plane sandwich design for optimum performance.
• Bypass device power with a 0.01 µF monolithic ceramic capacitor in parallel with a 6.8 µF tantalum
electrolytic capacitor located no more than 0.1” (2.5 mm) from the device power pins.
• Provide short, symmetrical ground return paths for:
– Inputs,
– Supply bypass capacitors and
– The output load.
• Provide short, grounded guard traces located
– Under the centerline of the package,
– 0.1” (2.5 mm) from the package pins
– On both top and bottom of the board with connecting vias.
8
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CLC007
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SNLS016E – JULY 1998 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
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Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CLC007BM/NOPB
ACTIVE
SOIC
D
8
95
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
CLC00
7BM>D
CLC007BMX/NOPB
ACTIVE
SOIC
D
8
2500
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
CLC00
7BM>D
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of