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CLV4051ATPWRG4Q1

CLV4051ATPWRG4Q1

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP16

  • 描述:

    SN74LV4051A-Q1 AUTOMOTIVE CATALO

  • 数据手册
  • 价格&库存
CLV4051ATPWRG4Q1 数据手册
Product Folder Sample & Buy Technical Documents Support & Community Tools & Software SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 SN74LV4051A-Q1 8-Channel Analog Multiplexer/Demultiplexer 1 Features 3 Description • • This 8-channel CMOS analog multiplexer and demultiplexer is designed for 2-V to 5.5-V VCC operation. 1 • • • • • • • Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B 2-V to 5.5-V VCC Operation Supports Mixed-Mode Voltage Operation on All Ports High On-Off Output-Voltage Ratio Low Crosstalk Between Switches Individual Switch Controls Extremely Low Input Current Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II The SN74LV4051A handles analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. Device Information(1) PART NUMBER PACKAGE TSSOP (16) SN74LV4051A-Q1 SOIC (16) BODY SIZE (NOM) 5.00 mm × 4.40 mm 10.30 mm × 7.50 mm 9.90 mm × 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • Automotive Infotainment and Cluster Telematics, eCall Logic Diagram (Positive Logic) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 5 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 5 5 5 6 6 7 7 7 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions ...................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics VCC = 3.3 V ± 0.3 V ......... Switching Characteristics VCC = 5 V ± 0.5 V ............ Analog Switch Characteristics .................................. Operating Characteristics.......................................... Parameter Measurement Information .................. 8 Detailed Description ............................................ 11 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 11 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application ................................................. 12 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 13 11.1 Layout Guidelines ................................................. 13 11.2 Layout Example .................................................... 13 12 Device and Documentation Support ................. 14 12.1 Trademarks ........................................................... 14 12.2 Electrostatic Discharge Caution ............................ 14 12.3 Glossary ................................................................ 14 13 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History Changes from Revision D (June 2011) to Revision E • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 5 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 SN74LV4051A-Q1 www.ti.com SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 5 Pin Configuration and Functions D, DW, or PW Package 16 Pins Top View Pin Functions PIN NAME NO. I/O DESCRIPTION Y4 1 I (1) Input to mux Y6 2 I (1) Input to mux (1) COM 3 O Y7 4 I (1) Input to mux Y5 5 I (1) Input to mux INH 6 I (1) Enables the outputs of the device. Logic low level with turn the outputs on, high level will turn them off. GND 7 — Ground GND 8 — Ground C 9 I Selector line for outputs (see Device Functional Modes for specific information) B 10 I Selector line for outputs (see Device Functional Modes for specific information) A 11 I Selector line for outputs (see Device Functional Modes for specific information) Y3 12 I (1) Input to mux Y0 13 I (1) Input to mux Y1 14 I (1) Input to mux Y2 15 I (1) Input to mux Vcc 16 I (1) Output of mux Device power input These I/O descriptions represent the device when used as a multiplexer, when this device is operated as a demultiplexer pins Y0-Y7 may be considered outputs (O) and the COM pin may be considered inputs (I). Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 3 SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com Figure 1. Logic Diagram (Positive Logic) 4 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 SN74LV4051A-Q1 www.ti.com SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX –0.5 7V VCC Supply voltage VI Input voltage (2) VIO Switch I/O voltage (2) IIK Input clamp current VI < 0 –20 IIOK I/O diode current VIO < 0 –50 IT Switch through current VIO = 0 to VCC –25 Tstg (1) (2) (3) (3) UNIT –0.5 7V –0.5 VCC + 0.5 V mA 25 Continuous current through VCC or GND –50 50 Storage temperature –65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 5.5 V maximum. 6.2 ESD Ratings VALUE Human body model (HBM), per AEC Q100-002 (1) V(ESD) (1) Electrostatic discharge Charged device model (CDM), per AEC Q100-011 UNIT ±2000 All pins ±500 Corner pins (1, 8, 9, and 16) ±750 V AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions See (1) MIN VCC 2 (2) Supply voltage VCC = 2 V VIH High-level input voltage NOM MAX 5.5 UNIT V 1.5 VCC = 2.3 V to 2.7 V VCC × 0.7 VCC = 3 V to 3.6 V VCC × 0.7 VCC = 4.5 V to 5.5 V VCC × 0.7 VCC = 2 V V 0.5 VCC = 2.3 V to 2.7 V VCC × 0.3 VCC = 3 V to 3.6 V VCC × 0.3 VIL Low-level input voltage VI Control input voltage 0 5.5 V VIO Input/output voltage 0 VCC V Δt/Δv Input transition rise or fall rate VCC = 4.5 V to 5.5 V VCC × 0.3 VCC = 2.3 V to 2.7 V 200 VCC = 3 V to 3.6 V 100 VCC = 4.5 V to 5.5 V TA Operating free-air temperature TA Operating free-air temperature (1) (2) SN74LV4051ATDRQ1,SN74LV4051ATDWRQ1 SN74LV4051ATPWRQ1 SN74LV4051AQPWRQ1 V ns/V 20 –40 105 –40 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. With supply voltages at or near 2 V, the analog switch on-state resistance becomes very nonlinear. It is recommended that only digital signals be transmitted at these low supply voltages. Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 5 SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com 6.4 Thermal Information SN74LV4051A-Q1 THERMAL METRIC (1) DW PW D 16 PINS 16 PINS 16 PINS RθJB Junction-to-board thermal resistance 85.1 92.4 113.3 RθJC(top) Junction-to-case (top) thermal resistance 47.2 52.9 48.1 RθJB Junction-to-board thermal resistance 49.8 49.5 58.4 ψJT Junction-to-top characterization parameter 17.8 15.5 6.2 ψJB Junction-to-board characterization parameter 49.3 49.2 57.8 (1) UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER ron ron(p) On-state switch resistance Peak on-state resistance TEST CONDITIONS IT = 2 mA, VI = VCC or GND, VINH = VIL (see Figure 2) IT = 2 mA, VI = VCC or GND, VINH = VIL VCC TA = 25°C MIN TA = -40 to 105°C MIN TYP TA = -40 to 125°C TYP MAX MAX MIN TYP MAX 2.3 V 38 180 225 225 3V 30 150 190 190 4.5 V 22 75 100 100 2.3 V 113 500 600 600 3V 54 180 225 225 4.5 V 31 100 125 125 2.3 V 2.1 30 40 40 3V 1.4 20 30 30 4.5 V 1.3 15 20 20 UNIT Ω Ω Difference in on-state resistance between switch IT = 2 mA, VI = VCC or GND, VINH = VIL Control input current VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1 ±2 μA IS(off) Off-state switch leakage current VI = VCC and VO = GND, or VI = GND and VO = VCC, VINH = VIH (see Figure 3) 5.5 V ±0.1 ±1 ±2 μA IS(on) On-state switch leakage current VI = VCC or GND, VINH = VIL (see Figure 4) 5.5 V ±0.1 ±1 ±2 μA ICC Supply current VI = VCC or GND 5.5 V 20 40 μA CIC Control input capacitance f = 10 MHz 3.3 V 2 pF CIS Common terminal capacitance 3.3 V 23.4 pF COS Switch terminal capacitance 3.3 V 5.7 pF CF Feedthrough capacitance 0.5 pF Δron II 6 Submit Documentation Feedback Ω Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 SN74LV4051A-Q1 www.ti.com SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 6.6 Switching Characteristics VCC = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) tPLH tPHL tPZH tPZL tPHZ tPLZ TA = -40 to 105°C TA = 25°C TA = -40 to 125°C FROM (INPUT) TO (OUTPUT) TEST CONDITIONS Propagation delay time COM or Yn Yn or COM CL = 50 pF (see Figure 5) 2.5 9 12 14 ns Enable delay time INH COM or Yn CL = 50 pF (see Figure 6) 5.5 20 25 25 ns Disable delay time INH COM or Yn CL = 50 pF (see Figure 6) 8.8 20 25 25 ns PARAMETER MIN TYP MAX MIN MAX MIN UNIT MAX 6.7 Switching Characteristics VCC = 5 V ± 0.5 V over recommended operating free-air temperature range (unless otherwise noted) tPLH tPHL tPZH tPZL tPHZ tPLZ TA = 25°C TA = -40 to 105°C TA = -40 to 125°C FROM (INPUT) TO (OUTPUT) TEST CONDITIONS COM or Yn Yn or COM CL = 50 pF (see Figure 5) 1.5 6 8 10 ns Enable delay time INH COM or Yn CL = 50 pF (see Figure 6) 4 14 18 18 ns Disable delay time INH COM or Yn CL = 50 pF (see Figure 6) 6.2 14 18 18 ns PARAMETER Propagation delay time MIN TYP MAX MIN TYP MAX MIN TYP MAX UNIT 6.8 Analog Switch Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER Frequency response (switch on) Crosstalk (control input to signal output) Feedthrough attenuation (switch off) Sine-wave distortion (1) (2) FROM (INPUT) COM or Yn INH COM or Yn COM or Yn TO (OUTPUT) Yn or COM COM or Yn Yn or COM Yn or COM TEST CONDITIONS VCC TA = 25°C MIN TYP CL = 50 pF, RL = 600 Ω, fin = 1 MHz (sine wave) (1) (see Figure 7) 2.3 V 20 3V 25 4.5 V 35 CL = 50 pF, RL = 600 Ω, fin = 1 MHz (square wave) (seeFigure 8 ) 2.3 V 20 3V 35 4.5 V 60 CL = 50 pF, RL = 600 Ω, fin = 1 MHz (2) (see Figure 9) 2.3 V –45 CL = 50 pF, RL = 10 kΩ, fin = 1 kkHz (sine wave) (see Figure 10) VI = 2 Vp-p VI = 2.5 Vp-p VI = 4 Vp-p 3V –45 4.5 V –45 2.3 V 0.1% 3V 0.1% 4.5 V 0.1% MAX UNIT MHz mV dB Adjust fin voltage to obtain 0-dBm output. Increase fin frequency until dB meter reads −3 dB. Adjust fin voltage to obtain 0-dBm input. 6.9 Operating Characteristics VCC = 3.3 V, TA = 25°C (unless otherwise noted) PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS CL = 50 pF, f = 10 MHz TYP UNIT 5.9 pF Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 7 SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com 7 Parameter Measurement Information = x W – Figure 2. On-State Resistance Test Circuit Figure 3. Off-State Switch Leakage-Current Test Circuit Figure 4. On-State Switch Leakage-Current Test Circuit 8 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 SN74LV4051A-Q1 www.ti.com SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 Parameter Measurement Information (continued) W Figure 5. Propagation Delay Time, Signal Input to Signal Output W W ≈ ≈ ≈ – ≈ Figure 6. Switching Time (tPZL, tPLZ, tPZH, tPHZ), Control to Signal Output Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 9 SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com Parameter Measurement Information (continued) m W Figure 7. Frequency Response (Switch On) W W Figure 8. Crosstalk (Control Input, Switch Output) m W W Figure 9. Feedthrough Attenuation (Switch Off) m m W Figure 10. Sine-Wave Distortion 10 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 SN74LV4051A-Q1 www.ti.com SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 8 Detailed Description 8.1 Overview This device is an 8-channel analog multiplexer. A multiplexer is used when several signals must share the same device or resource. This device allows the selection of one of these signals at a time, for analysis or propagation. 8.2 Functional Block Diagram 8.3 Feature Description This device contains one 8-channel multiplexer for use in a variety of applications, and can also be configured as demultiplexer by using the COM pin as an input and the Yx pins as outputs. This device is qualified for automotive applications and has an extended temperature range of –40°C to 125°C (maximum depends on package type). 8.4 Device Functional Modes Table 1. Function Table INPUTS INH C B A ON CHANNEL L L L L Y0 L L L H Y1 L L H L Y2 L L H H Y3 L H L L Y4 L H L H Y5 L H H L Y6 L H H H Y7 H X X X None Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 11 SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information A multiplexer is used in applications where multiple signals share a resource. In the example below, several different sensors are connected to the analog-to-digital converter (ADC) of a microcontroller unit (MCU). 9.2 Typical Application Figure 11. Example of Multiplexer Use With Analog Sensors and the ADC of an MCU 9.2.1 Design Requirements Designing with the SN74LV4051A-Q1 device requires a stable input voltage between 2 V (see Recommended Operating Conditions for details) and 5.5 V. Another important design consideration is the characteristics of the signal being multiplexed, to ensure no important information is lost due to timing or incompatibility with this device. 9.2.2 Detailed Design Procedure Normally, processing eight different analog signals would require eight separate ADCs, but Figure 11 shows how to achieve this using only one ADC and four GPIOs (general-purpose input/outputs). 12 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 SN74LV4051A-Q1 www.ti.com SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 10 Power Supply Recommendations Most systems have a common 3.3-V or 5-V rail that can supply the Vcc pin of this device. If this is not available, a switched-mode power supply (SMPS) or a low dropout regulator (LDO) can supply this device from a higher voltage rail. 11 Layout 11.1 Layout Guidelines TI recommends keeping the signal lines as short and as straight as possible. Incorporation of microstrip or stripline techniques is also recommended when signal lines are more than 1 inch long. These traces must be designed with a characteristic impedance of either 50 Ω or 75 Ω,as required by the application. Do not place this device too close to high-voltage switching components, as they may cause interference. 11.2 Layout Example Figure 12. Layout Schematic Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 13 SN74LV4051A-Q1 SCLS520E – AUGUST 2003 – REVISED JANUARY 2015 www.ti.com 12 Device and Documentation Support 12.1 Trademarks All trademarks are the property of their respective owners. 12.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: SN74LV4051A-Q1 PACKAGE OPTION ADDENDUM www.ti.com 21-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CLV4051ATDWRG4Q1 ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 L4051AQ CLV4051ATPWRG4Q1 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 L4051AQ SN74LV4051AQPWRQ1 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 4051AQ1 SN74LV4051ATDRQ1 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 L4051AQ SN74LV4051ATDWRQ1 ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 L4051AQ SN74LV4051ATPWRQ1 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 L4051AQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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