CLVTH32244IGKEREP

SN74LVTH32244 3.3-V ABT 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCBS749C – OCTOBER 2000 – REVISED DECEMBER 2006 FEATURES • • • • • Member of the Texas Instruments Widebus+™ Family Typical VOLP (Output Ground Bounce) VCC. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MAX 2.7 3.6 UNIT Supply voltage VIH High-level input voltage VIL Low-level input voltage 0.8 VI Input voltage 5.5 V IOH High-level output current –32 mA IOL Low-level output current ∆t/∆v Input transition rise or fall rate ∆t/∆VCC Power-up ramp rate 200 TA Operating free-air temperature –40 (1) 4 MIN VCC V 2 Outputs enabled V V 64 mA 10 ns/V µs/V 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback °C SN74LVTH32244 3.3-V ABT 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCBS749C – OCTOBER 2000 – REVISED DECEMBER 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 2.7 V, II = –18 mA VCC = 2.7 V to 3.6 V, IOH = –100 µA VCC = 2.7 V, IOH = –8 mA VCC = 3 V, IOH = –32 mA VCC = 2.7 V VOL VCC = 3 V Control inputs II Data inputs Ioff Data inputs TYP (1) MAX UNIT –1.2 V VCC – 0.2 2.4 V 2 IOL = 100 µA 0.2 IOL = 24 mA 0.5 IOL = 16 mA 0.4 IOL = 32 mA 0.5 IOL = 64 mA 0.55 VCC = 0 or 3.6 V, VI = 5.5 V 10 VCC = 3.6 V, VI = VCC or GND ±1 VCC = 3.6 V VCC = 0, II(hold) MIN VCC = 3 V VI = VCC 1 VI = 0 VI = 2 V µA –5 ±100 VI or VO = 0 to 4.5 V VI = 0.8 V V µA 75 µA –75 ±500 VCC = 3.6 V, (2) VI = 0 to 3.6 V IOZH VCC = 3.6 V, VO = 3 V IOZL VCC = 3.6 V, VO = 0.5 V IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don't care IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don't care ±100 µA Outputs high VCC = 3.6 V, IO = 0, VI = VCC or GND ICC 5 µA –5 µA ±100 µA 0.38 Outputs low 10 Outputs disabled mA 0.38 ∆ICC (3) VCC = 3 V to 3.6 V, One input at VCC – 0.6 V, Other inputs at VCC or GND CI VI = 3 V or 0 4 pF Co VO = 3 V or 0 9 pF (1) (2) (3) 0.2 mA All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Submit Documentation Feedback 5 SN74LVTH32244 3.3-V ABT 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCBS749C – OCTOBER 2000 – REVISED DECEMBER 2006 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ (1) 6 FROM (INPUT) TO (OUTPUT) A Y OE Y OE Y VCC = 3.3 V ± 0.3 V VCC = 2.7 V UNIT MIN TYP (1) MAX 1.2 2.3 3.2 3.7 1.2 2 3.2 3.7 1.2 2.6 4 5 1.2 2.7 4 5 2.2 3.3 4.5 5 2 3.1 4.2 4.4 tsk(LH) 0.5 tsk(HL) 0.5 All typical values are at VCC = 3.3 V, TA = 25°C. Submit Documentation Feedback MIN MAX ns ns ns ns SN74LVTH32244 3.3-V ABT 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCBS749C – OCTOBER 2000 – REVISED DECEMBER 2006 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 2.7 V Input 1.5 V th 2.7 V 1.5 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 2.7 V Input 1.5 V 1.5 V 0V tPHL tPLH VOH Output 1.5 V 1.5 V VOL tPHL Output Waveform 1 S1 at 6 V (see Note B) 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH tPLH VOH Output 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) SN74LVTH32244GKER NRND LFBGA GKE 96 1000 TBD SNPB Level-2-235C-1 YEAR -40 to 85 HV244 SN74LVTH32244ZKER ACTIVE LFBGA ZKE 96 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 HV244 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVTH32244 : • Enhanced Product: SN74LVTH32244-EP Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVTH32244GKER LFBGA GKE 96 1000 330.0 24.4 5.7 13.7 2.0 8.0 24.0 Q1 SN74LVTH32244ZKER LFBGA ZKE 96 1000 330.0 24.4 5.7 13.7 2.0 8.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVTH32244GKER LFBGA GKE 96 1000 336.6 336.6 41.3 SN74LVTH32244ZKER LFBGA ZKE 96 1000 336.6 336.6 41.3 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated