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CSD17570Q5B
SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
CSD17570Q5B 30 V N-Channel NexFET™ Power MOSFET
1 Features
•
•
•
•
•
•
•
1
Product Summary
Ultra-Low Resistance
Low Thermal Resistance
Avalanche Rated
Pb Free Terminal Plating
RoHS Compliant
Halogen Free
SON 5 mm × 6 mm Plastic Package
TA = 25°C
TYPICAL VALUE
Drain-to-Source Voltage
30
V
Qg
Gate Charge Total (4.5 V)
93
nC
Qgd
Gate Charge Gate-to-Drain
RDS(on)
Drain-to-Source On-Resistance
VGS(th)
Threshold Voltage
3 Description
8
1
7
2
G
4
0.56
mΩ
1.5
V
Device
Qty
Media
Package
Ship
2500
13-Inch Reel
CSD17570Q5BT
250
7-Inch Reel
SON 5 × 6 mm
Plastic Package
Tape and
Reel
Absolute Maximum Ratings
VALUE
UNIT
VDS
Drain-to-Source Voltage
30
V
VGS
Gate-to-Source Voltage
±20
V
Continuous Drain Current (Package limited)
100
Continuous Drain Current (Silicon limited),
TC = 25°C
407
D
ID
3
VGS = 10 V
TA = 25°C
Top Icon
S
mΩ
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
This 30 V, 0.56 mΩ, SON 5 × 6 mm NexFET™ power
MOSFET is designed to minimize resistance for
ORing and hot swap applications and is not intended
for switching applications.
S
nC
0.74
CSD17570Q5B
ORing and Hot Swap Applications
S
34
VGS = 4.5 V
Ordering Information(1)
2 Applications
•
UNIT
VDS
D
6
D
5
D
D
P0093-01
A
Continuous Drain Current, TA = 25°C(1)
53
IDM
Pulsed Drain Current, TA = 25°C(2)
400
A
PD
Power Dissipation(1)
3.2
W
TJ,
Tstg
Operating Junction and
Storage Temperature Range
–55 to 150
°C
EAS
Avalanche Energy, single pulse
ID = 90 A, L = 0.1 mH, RG = 25 Ω
450
mJ
(1) Typical RθJA = 40°C/W on a 1 inch2 , 2 oz. Cu pad on a
0.06 inch thick FR4 PCB.
(2) Pulse duration ≤100 μs, duty cycle ≤2%
.
.
.
.
RDS(on) vs VGS
Gate Charge
10
TC = 25°C, I D = 50A
TC = 125°C, I D = 50A
1.8
VGS - Gate-to-Source Voltage (V)
RDS(on) - On-State Resistance (mΩ)
2
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
2
4
6
8
10
12
14
16
VGS - Gate-to- Source Voltage (V)
18
20
G001
ID = 50A
VDS = 15V
9
8
7
6
5
4
3
2
1
0
0
20
40
60
80 100 120 140 160 180 200
Qg - Gate Charge (nC)
G001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CSD17570Q5B
SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Specifications.........................................................
1
1
1
2
3
5.1 Electrical Characteristics........................................... 3
5.2 Thermal Information .................................................. 3
5.3 Typical MOSFET Characteristics.............................. 4
6
Device and Documentation Support.................... 7
6.1 Receiving Notification of Documentation Updates.... 7
6.2
6.3
6.4
6.5
7
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
7
7
7
7
Mechanical, Packaging, and Orderable
Information ............................................................. 8
7.1
7.2
7.3
7.4
Q5B Package Dimensions ........................................ 8
Recommended PCB Pattern..................................... 9
Recommended Stencil Pattern ................................. 9
Q5B Tape and Reel Information ............................. 10
4 Revision History
Changes from Revision C (January 2015) to Revision D
Page
•
Added the Receiving Notification of Documentation Updates and Community Resources sections to Device and
Documentation Support. ........................................................................................................................................................ 7
•
Changed the dimension between pads 3 and 4 from 0.028 inches: to 0.050 inches in the Recommended PCB
Pattern section diagram ......................................................................................................................................................... 9
Changes from Revision B (August 2014) to Revision C
•
Page
Corrected Pulsed Drain Current to read 400 A. .................................................................................................................... 1
Changes from Revision A (May 2014) to Revision B
Page
•
Updated Figure 1 to state Max RθJC = 0.8ºC/W. .................................................................................................................... 4
•
Updated the SOA in Figure 10. ............................................................................................................................................. 6
Changes from Original (February 2014) to Revision A
•
2
Page
Updated the mechanical drawing. ......................................................................................................................................... 8
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SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
5 Specifications
5.1 Electrical Characteristics
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STATIC CHARACTERISTICS
BVDSS
Drain-to-Source Voltage
VGS = 0 V, ID = 250 μA
IDSS
Drain-to-Source Leakage Current
VGS = 0 V, VDS = 24 V
1
μA
IGSS
Gate-to-Source Leakage Current
VDS = 0 V, VGS = 20 V
100
nA
VGS(th)
Gate-to-Source Threshold Voltage
VDS = VGS, ID = 250 μA
RDS(on)
Drain-to-Source On-Resistance
gfs
Transconductance
30
1.1
V
1.5
1.9
V
VGS = 4.5 V, ID = 50 A
0.74
0.92
mΩ
VGS = 10 V, ID = 50 A
0.56
0.69
mΩ
VDS = 15 V, ID = 50 A
271
S
DYNAMIC CHARACTERISTICS
Ciss
Input Capacitance
Coss
Output Capacitance
10400
13600
pF
1450
1890
pF
Crss
RG
Reverse Transfer Capacitance
877
1140
pF
Series Gate Resistance
1.8
3.6
Ω
Qg
Gate Charge Total (4.5 V)
93
121
nC
Qgd
Gate Charge Gate-to-Drain
Qgs
Gate Charge Gate-to-Source
Qg(th)
Gate Charge at Vth
Qoss
Output Charge
td(on)
Turn On Delay Time
tr
Rise Time
td(off)
Turn Off Delay Time
tf
Fall Time
VGS = 0 V, VDS = 15 V, ƒ = 1 MHz
VDS = 15 V, ID = 50 A
VDS = 15 V, VGS = 0 V
VDS = 15 V, VGS = 10 V,
IDS = 50 A, RG = 0 Ω
34
nC
27
nC
17
nC
40
nC
5
ns
36
ns
144
ns
74
ns
DIODE CHARACTERISTICS
VSD
Diode Forward Voltage
ISD = 50 A, VGS = 0 V
0.8
1
V
Qrr
Reverse Recovery Charge
nC
Reverse Recovery Time
VDS= 15 V, IF = 50 A,
di/dt = 300 A/μs
34
trr
51
ns
5.2 Thermal Information
(TA = 25°C unless otherwise stated)
THERMAL METRIC
MIN
TYP
MAX
RθJC
Junction-to-Case Thermal Resistance (1)
0.8
RθJA
Junction-to-Ambient Thermal Resistance (1) (2)
50
(1)
(2)
UNIT
°C/W
RθJC is determined with the device mounted on a 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches
(3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board
design.
Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu.
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3
CSD17570Q5B
SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
GATE
www.ti.com
GATE
Source
N-Chan 5x6 QFN TTA MIN Rev3
N-Chan 5x6 QFN TTA MAX Rev3
Max RθJA = 50°C/W
when mounted on
1 inch2 (6.45 cm2) of
2 oz. (0.071 mm thick)
Cu.
Source
Max RθJA = 125°C/W
when mounted on a
minimum pad area of
2 oz. (0.071 mm thick)
Cu.
DRAIN
DRAIN
M0137-02
M0137-01
5.3 Typical MOSFET Characteristics
(TA = 25°C unless otherwise stated)
Figure 1. Transient Thermal Impedance
4
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SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
Typical MOSFET Characteristics (continued)
200
200
180
180
IDS - Drain-to-Source Current (A)
IDS - Drain-to-Source Current (A)
(TA = 25°C unless otherwise stated)
160
140
120
100
80
60
VGS =10V
VGS =6V
VGS =4.5V
40
20
0
0
160
140
120
100
80
60
TC = 125°C
TC = 25°C
TC = −55°C
40
20
0
0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2
VDS - Drain-to-Source Voltage (V)
G001
VDS = 5V
0
0.5
Figure 2. Saturation Characteristics
G001
ID = 50A
VDS = 15V
9
8
C − Capacitance (pF)
VGS - Gate-to-Source Voltage (V)
4
100000
7
6
5
4
3
10000
1000
Ciss = Cgd + Cgs
Coss = Cds + Cgd
Crss = Cgd
2
1
0
20
40
100
60
80 100 120 140 160 180 200
Qg - Gate Charge (nC)
G001
0
3
6
Figure 4. Gate Charge
9
12
15
18
21
24
VDS - Drain-to-Source Voltage (V)
27
30
G001
Figure 5. Capacitance
2.1
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
−75 −50 −25
0
25
50
75 100 125 150 175
TC - Case Temperature (ºC)
G001
Figure 6. Threshold Voltage vs Temperature
RDS(on) - On-State Resistance (mΩ)
2
ID = 250uA
VGS(th) - Threshold Voltage (V)
3.5
Figure 3. Transfer Characteristics
10
0
1
1.5
2
2.5
3
VGS - Gate-to-Source Voltage (V)
TC = 25°C, I D = 50A
TC = 125°C, I D = 50A
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
2
4
6
8
10
12
14
16
VGS - Gate-to- Source Voltage (V)
18
20
G001
Figure 7. On-State Resistance vs Gate-to-Source Voltage
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CSD17570Q5B
SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
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Typical MOSFET Characteristics (continued)
(TA = 25°C unless otherwise stated)
1.6
100
VGS = 4.5V
VGS = 10V
ISD − Source-to-Drain Current (A)
Normalized On-State Resistance
1.8
1.4
1.2
1
0.8
0.6
TC = 25°C
TC = 125°C
10
1
0.1
0.01
0.001
ID =50A
0.4
−75 −50 −25
0
25 50 75 100 125 150 175 200
TC - Case Temperature (ºC)
G001
0.0001
0
Figure 8. Normalized On-State Resistance vs Temperature
10us
100us
1ms
10ms
DC
IAV - Peak Avalanche Current (A)
IDS - Drain-to-Source Current (A)
G001
200
100
10
1
Single Pulse
Max RthetaJC = 0.8ºC/W
0.1
0.1
1
Figure 9. Typical Diode Forward Voltage
5000
1000
0.2
0.4
0.6
0.8
VSD − Source-to-Drain Voltage (V)
1
10
VDS - Drain-to-Source Voltage (V)
100
TC = 25ºC
TC = 125ºC
100
10
0.01
G001
Figure 10. Maximum Safe Operating Area
0.1
TAV - Time in Avalanche (mS)
1
G001
Figure 11. Single Pulse Unclamped Inductive Switching
IDS - Drain- to- Source Current (A)
120
100
80
60
40
20
0
−50 −25
0
25
50
75 100 125 150 175 200
TC - Case Temperature (ºC)
G001
Figure 12. Maximum Drain Current vs Temperature
6
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SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
6 Device and Documentation Support
6.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
6.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
6.3 Trademarks
NexFET, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
6.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
6.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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7
CSD17570Q5B
SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
www.ti.com
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
7.1 Q5B Package Dimensions
K
H
D3
6
D1
4
5
e
6
4
3
3
5
D2
7
2
E
2
7
•
1
8
1
8
L
b (8x)
c1
E1
d1
Top View
d2
Bottom View
Side View
•
Front View
DIM
MILLIMETERS
MIN
NOM
MAX
A
0.80
1.00
1.05
b
0.36
0.41
0.46
c
0.15
0.20
0.25
c1
0.15
0.20
0.25
c2
0.20
0.25
0.30
D1
4.90
5.00
5.10
D2
4.12
4.22
4.32
D3
3.90
4.00
4.10
d
0.20
0.25
0.30
d1
0.085 TYP
d2
0.319
0.369
0.419
E
4.90
5.00
5.10
E1
5.90
6.00
6.10
E2
3.48
3.58
3.68
e
H
0.36
0.46
0.56
L
0.46
0.56
0.66
L1
0.57
0.67
0.77
θ
0°
–
–
K
8
1.27 TYP
1.40 TYP
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SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
7.2 Recommended PCB Pattern
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through
PCB Layout Techniques.
7.3 Recommended Stencil Pattern
(0.020)
0.508
x4
(0.011)
0.286
(0.014)
0.350
(0.022)
0.562 x 4
(0.029)
0.746 x 8
2.186 (0.086)
4.318 (0.170)
0.300
(0.012)
1.270 (0.050)
(0.030)
0.766
(0.051)
1.294
x8
(0.060)
1.525
1.270 (0.050)
(0.042)
1.072
(0.259)
6.586
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CSD17570Q5B
SLPS471D – FEBRUARY 2014 – REVISED MAY 2017
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K0
4.00 ±0.10 (See Note 1)
0.30 ±0.05
2.00 ±0.05
+0.10
–0.00
12.00 ±0.30
Ø 1.50
1.75 ±0.10
7.4 Q5B Tape and Reel Information
5.50 ±0.05
B0
R 0.30 MAX
A0
8.00 ±0.10
Ø 1.50 MIN
R 0.30 TYP
A0 = 6.50 ±0.10
B0 = 5.30 ±0.10
K0 = 1.40 ±0.10
M0138-01
Notes:
1. 10-sprocket hole-pitch cumulative tolerance ±0.2
2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm
3. Material: black static-dissipative polystyrene
4. All dimensions are in mm (unless otherwise specified).
5. A0 and B0 measured on a plane 0.3 mm above the bottom of the pocket.
10
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CSD17570Q5B
ACTIVE
VSON-CLIP
DNK
8
2500
RoHS-Exempt
& Green
NIPDAU | SN
Level-1-260C-UNLIM
-55 to 150
CSD17570
CSD17570Q5BT
ACTIVE
VSON-CLIP
DNK
8
250
RoHS-Exempt
& Green
NIPDAU | SN
Level-1-260C-UNLIM
-55 to 150
CSD17570
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
