CSD18531Q5A

Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design CSD18531Q5A SLPS321G – JUNE 2012 – REVISED AUGUST 2017 CSD18531Q5A 60-V N-Channel NexFET™ Power MOSFET 1 Features • • • • • • • • 1 Product Summary Ultra-Low Qg and Qgd Low-Thermal Resistance Avalanche Rated Logic Level Lead-Free Terminal Plating RoHS Compliant Halogen Free SON 5-mm × 6-mm Plastic Package TA = 25°C DC-DC Conversion Secondary Side Synchronous Rectifier Battery Motor Control 60 V Qg Gate Charge Total (10 V) 36 nC Qgd Gate Charge Gate-to-Drain RDS(on) Drain-to-Source On-Resistance VGS(th) Threshold Voltage 1.8 V QTY MEDIA PACKAGE SHIP 13-Inch Reel CSD18531Q5AT 250 7-Inch Reel SON 5.00-mm × 6.00-mm Plastic Package Tape and Reel TA = 25°C VALUE UNIT VDS Drain-to-Source Voltage 60 V VGS Gate-to-Source Voltage ±20 V Continuous Drain Current (Package Limited) 100 Continuous Drain Current (Silicon Limited), TC = 25°C 134 8 D IDM 7 2 D PD 4 mΩ Absolute Maximum Ratings 1 G 3.5 2500 ID 3 VGS = 10 V DEVICE Top View S nC 4.4 (1) For all available packages, see the orderable addendum at the end of the data sheet. This 60-V, 3.5-mΩ, 5-mm × 6-mm NexFET™ power MOSFET is designed to minimize losses in power conversion applications. S 5.9 VGS = 4.5 V CSD18531Q5A 3 Description S UNIT Drain-to-Source Voltage Device Information(1) 2 Applications • • • TYPICAL VALUE VDS 6 D 5 D D P0093-01 Continuous Drain Current(1) 19 Pulsed Drain Current(2) 400 Power Dissipation(1) 3.8 Power Dissipation, TC = 25°C 156 A A W TJ Operating Junction –55 to 175 °C Tstg Storage Temperature –55 to 175 °C EAS Avalanche Energy, Single Pulse ID = 67 A, L = 0.1 mH, RG = 25 Ω 224 mJ (1) Typical RθJA = 40°C/W on a 1-in2, 2-oz Cu pad on a 0.06-in thick FR4 PCB. (2) Max RθJC = 1°C/W, pulse duration ≤ 100 μs, duty cycle ≤ 1%. RDS(on) vs VGS Gate Charge 10 TC = 25° C, I D = 22 A TC = 125° C, I D = 22 A 10 VGS - Gate-to-Source Voltage (V) RDS(on) - On-State Resistance (m:) 12 8 6 4 2 0 ID = 22 A VDS = 30 V 8 6 4 2 0 0 2 4 6 8 10 12 14 16 VGS - Gate-to-Source Voltage (V) 18 20 D007 0 5 10 15 20 25 Qg - Gate Charge (nC) 30 35 D004 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CSD18531Q5A SLPS321G – JUNE 2012 – REVISED AUGUST 2017 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Specifications......................................................... 1 1 1 2 4 5.1 Electrical Characteristics........................................... 4 5.2 Thermal Information .................................................. 4 5.3 Typical MOSFET Characteristics.............................. 5 6 Device and Documentation Support.................... 8 6.1 Receiving Notification of Documentation Updates.... 8 6.2 6.3 6.4 6.5 7 Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 8 8 8 8 Mechanical Packaging, and Orderable Information ............................................................. 9 7.1 7.2 7.3 7.4 Q5A Package Dimensions ........................................ 9 Recommended PCB Pattern................................... 10 Recommended Stencil Opening ............................. 10 Q5A Tape and Reel Information ............................. 11 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (October 2016) to Revision G Page • Changed temperature range from 150°C : to 175°C.............................................................................................................. 1 • Changed IDM using 175°C data from 370 A : to 400 A ........................................................................................................... 1 • Changed PD using 175°C data from 3.1 W : to 3.8 W............................................................................................................ 1 • Changed Figure 6 to extend to 175°C.................................................................................................................................... 5 • Changed Figure 8 to extend to 175°C.................................................................................................................................... 6 • Changed Figure 10 using 175°C data .................................................................................................................................... 6 • Changed Figure 12 to extend to 175°C.................................................................................................................................. 6 Changes from Revision E (August 2015) to Revision F Page • Changed the 125°C RDS(on) vs VGS curve to reflect typical part characterization ................................................................... 1 • Changed the 125°C curve in Figure 7 to reflect typical part characterization ........................................................................ 5 • Added Receiving Notification of Documentation Updates section to the Device and Documentation Support section......... 8 Changes from Revision D (May 2015) to Revision E Page • Corrected device size in description from m to mm. .............................................................................................................. 1 • Corrected package type to SON. .......................................................................................................................................... 1 Changes from Revision C (March 2015) to Revision D • Page Added Community Resources. .............................................................................................................................................. 8 Changes from Revision B (October 2012) to Revision C Page • Added part number to title. .................................................................................................................................................... 1 • Changed Qg value to 36 nC, measured at 10 V. ................................................................................................................... 1 • Added 7" reel to Ordering Information. .................................................................................................................................. 1 • Increase max pulsed current to 370 A. ................................................................................................................................. 1 • Added line for max power dissipation with the case temperature held to 25°C..................................................................... 1 • Updated pulsed current conditions. ....................................................................................................................................... 1 • Updated Figure 1 to show ZθJC curves. .................................................................................................................................. 5 2 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A CSD18531Q5A www.ti.com SLPS321G – JUNE 2012 – REVISED AUGUST 2017 • Updated Figure 10.................................................................................................................................................................. 6 • Updated Figure 12. ................................................................................................................................................................ 6 Changes from Revision A (June 2012) to Revision B Page • Changed the Transconductance TYP value From: 177 S To: 128 S. .................................................................................... 4 • Changed the Turn On and Turn Off Delay Time, Rise and Fall Time Test. Conditions From: IDS = 22 A, RG = 2 Ω To: IDS = 22 A, RG = 0 Ω. ............................................................................................................................................................. 4 • Changed the Qrr Reverse Recovery Charge TYP value From: 68 nC To: 100 nC. .............................................................. 4 Changes from Original (June 2012) to Revision A • Page Added TA = 25°C to the Product Summary table ................................................................................................................... 1 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A 3 CSD18531Q5A SLPS321G – JUNE 2012 – REVISED AUGUST 2017 www.ti.com 5 Specifications 5.1 Electrical Characteristics TA = 25°C (unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC CHARACTERISTICS BVDSS Drain-to-source voltage VGS = 0 V, ID = 250 μA IDSS Drain-to-source leakage current VGS = 0 V, VDS = 48 V 1 μA IGSS Gate-to-source leakage current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate-to-source threshold voltage VDS = VGS, ID = 250 μA V RDS(on) Drain-to-source on-resistance gfs Transconductance 60 1.5 V 1.8 2.3 VGS = 4.5 V, ID = 22 A 4.4 5.8 VGS = 10 V, ID = 22 A 3.5 4.6 VDS = 30 V, ID = 22 A 128 mΩ S DYNAMIC CHARACTERISTICS Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance RG Series gate resistance Qg Gate charge total (4.5 V) Qg Gate charge total (10 V) Qgd Gate charge gate-to-drain Qgs Gate charge gate-to-source Qg(th) Gate charge at Vth Qoss Output charge td(on) VGS = 0 V, VDS = 30 V, ƒ = 1 MHz VDS = 30 V, ID = 22 A 3200 3840 pF 380 456 pF 11 14 pF 1.2 2.4 Ω 18 22 nC 36 43 nC 5.9 nC 6.9 nC 5.2 nC 32 nC Turnon delay time 4.4 ns tr Rise time 7.8 ns td(off) Turnoff delay time 20 ns tf Fall time 2.7 ns VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 10 V, IDS = 22 A, RG = 0 Ω DIODE CHARACTERISTICS VSD Diode forward voltage Qrr Reverse recovery charge trr Reverse recovery time ISD = 22 A, VGS = 0 V 0.8 VDS= 30 V, IF = 22 A, di/dt = 300 A/μs 100 1 nC V 40 ns 5.2 Thermal Information TA = 25°C (unless otherwise stated) MAX UNIT RθJC Junction-to-case thermal resistance (1) THERMAL METRIC 1.0 °C/W RθJA Junction-to-ambient thermal resistance (1) (2) 50 °C/W (1) (2) 4 MIN TYP RθJC is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81cm), 0.06-in (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A CSD18531Q5A www.ti.com GATE SLPS321G – JUNE 2012 – REVISED AUGUST 2017 GATE Source N-Chan 5x6 QFN TTA MIN Rev3 N-Chan 5x6 QFN TTA MAX Rev3 Max RθJA = 50°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu. Source Max RθJA = 125°C/W when mounted on a minimum pad area of 2-oz (0.071-mm) thick Cu. DRAIN DRAIN M0137-02 M0137-01 5.3 Typical MOSFET Characteristics TA = 25°C (unless otherwise stated) Figure 1. Transient Thermal Impedance Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A 5 CSD18531Q5A SLPS321G – JUNE 2012 – REVISED AUGUST 2017 www.ti.com Typical MOSFET Characteristics (continued) 200 140 175 120 IDS - Drain-to-Source Current (A) IDS - Drain-to-Source Current (A) TA = 25°C (unless otherwise stated) 150 125 100 75 50 VGS = 4.5 V VGS = 6.5 V VGS = 10 V 25 TC = 125° C TC = 25° C TC = -55° C 100 80 60 40 20 0 0 0 0.3 0.6 0.9 1.2 VDS - Drain-to-Source Voltage (V) 1.5 0 1 D002 2 3 4 VGS - Gate-to-Source Voltage (V) 5 D003 VDS = 5 V Figure 2. Saturation Characteristics Figure 3. Transfer Characteristics 10000 8 C - Capacitance (pF) VGS - Gate-to-Source Voltage (V) 10 6 4 1000 100 10 2 Ciss = Cgd + Cgs Coss = Cds + Cgd Crss = Cgd 1 0 0 5 10 15 20 25 Qg - Gate Charge (nC) VDS = 30 V 30 0 35 10 D004 60 D005 Figure 5. Capacitance 12 RDS(on) - On-State Resistance (m:) 2.4 VGS(th) - Threshold Voltage (V) 50 ID = 22 A Figure 4. Gate Charge 2.1 1.8 1.5 1.2 0.9 0.6 -75 20 30 40 VDS - Drain-to-Source Voltage (V) TC = 25° C, I D = 22 A TC = 125° C, I D = 22 A 10 8 6 4 2 0 -50 -25 0 25 50 75 100 TC - Case Temperature (° C) 125 150 175 0 2 D006 4 6 8 10 12 14 16 VGS - Gate-to-Source Voltage (V) 18 20 D007 ID = 250 µA Figure 6. Threshold Voltage vs Temperature 6 Figure 7. On-State Resistance vs Gate-to-Source Voltage Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A CSD18531Q5A www.ti.com SLPS321G – JUNE 2012 – REVISED AUGUST 2017 Typical MOSFET Characteristics (continued) TA = 25°C (unless otherwise stated) 100 2 VGS = 4.5 V VGS = 10 V ISD - Source-to-Drain Current (A) Normalized On-State Resistance 2.2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 -75 TC = 25° C TC = 125° C 10 1 0.1 0.01 0.001 0.0001 -50 -25 0 25 50 75 100 TC - Case Temperature (° C) 125 150 175 0 0.2 D008 0.4 0.6 0.8 VSD - Source-to-Drain Voltage (V) 1 D009 ID = 22 A Figure 8. Normalized On-State Resistance vs Temperature Figure 9. Typical Diode Forward Voltage 100 100 10 1 DC 10 ms 1 ms 0.1 0.1 TC = 25q C TC = 125q C IAV - Peak Avalanche Current (A) IDS - Drain-to-Source Current (A) 1000 100 µs 10 µs 1 10 VDS - Drain-to-Source Voltage (V) 100 10 0.01 0.1 TAV - Time in Avalanche (ms) D010 1 D011 Single pulse RθJC = 1.0°C/W Figure 10. Maximum Safe Operating Area Figure 11. Single Pulse Unclamped Inductive Switching IDS - Drain-to-Source Current (A) 120 100 80 60 40 20 0 -50 -25 0 25 50 75 100 125 TC - Case Temperature (° C) 150 175 D012 Figure 12. Maximum Drain Current vs Temperature Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A 7 CSD18531Q5A SLPS321G – JUNE 2012 – REVISED AUGUST 2017 www.ti.com 6 Device and Documentation Support 6.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 6.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.3 Trademarks NexFET, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 6.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 8 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A CSD18531Q5A www.ti.com SLPS321G – JUNE 2012 – REVISED AUGUST 2017 7 Mechanical Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 7.1 Q5A Package Dimensions L E2 H K 7 D2 3 4 b 4 5 5 6 3 6 e D1 7 2 2 8 8 1 1 q L1 Top View Bottom View Side View c A q E1 E Front View M0135-01 DIM MILLIMETERS MIN NOM MAX A 0.90 1.00 1.10 b 0.33 0.41 0.51 c 0.20 0.25 0.34 D1 4.80 4.90 5.00 D2 3.61 3.81 4.02 E 5.90 6.00 6.10 E1 5.70 5.75 5.80 E2 3.38 3.58 3.78 e 1.17 1.27 1.37 H 0.41 0.56 0.71 K 1.10 — — L 0.51 0.61 0.71 L1 0.06 0.13 0.20 0° — 12° θ Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A 9 CSD18531Q5A SLPS321G – JUNE 2012 – REVISED AUGUST 2017 www.ti.com 7.2 Recommended PCB Pattern Recommended PCB Pattern (continued) MILLIMETERS F1 DIM F7 F3 8 1 F2 F11 F5 F9 5 4 F6 F8 F4 F10 M0139-01 INCHES MIN MAX MIN MAX F1 6.205 6.305 0.244 0.248 F2 4.46 4.56 0.176 0.18 F3 4.46 4.56 0.176 0.18 F4 0.65 0.7 0.026 0.028 F5 0.62 0.67 0.024 0.026 F6 0.63 0.68 0.025 0.027 F7 0.7 0.8 0.028 0.031 F8 0.65 0.7 0.026 0.028 F9 0.62 0.67 0.024 0.026 F10 4.9 5 0.193 0.197 F11 4.46 4.56 0.176 0.18 For recommended circuit layout for PCB designs, see Reducing Ringing Through PCB Layout Techniques (SLPA005). 7.3 Recommended Stencil Opening (0.020) 8x 0.500 (0.020) 0.500 5 4 0.500 (0.020) 8x 1.585 (0.062) 1.235 (0.049) (0.024) 0.620 (0.170) 4.310 0.385 (0.015) 1.270 (0.050) 1 8 1.570 (0.062) 4x 0.615 (0.024) 1.105 (0.044) 3.020 (0.119) 10 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A CSD18531Q5A www.ti.com SLPS321G – JUNE 2012 – REVISED AUGUST 2017 K0 4.00 ±0.10 (See Note 1) 0.30 ±0.05 2.00 ±0.05 +0.10 –0.00 12.00 ±0.30 Ø 1.50 1.75 ±0.10 7.4 Q5A Tape and Reel Information 5.50 ±0.05 B0 R 0.30 MAX A0 8.00 ±0.10 Ø 1.50 MIN A0 = 6.50 ±0.10 B0 = 5.30 ±0.10 K0 = 1.40 ±0.10 R 0.30 TYP M0138-01 Notes: 1. 10 sprocket hole-pitch cumulative tolerance ±0.2. 2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm. 3. Material: black static-dissipative polystyrene. 4. All dimensions are in mm (unless otherwise specified). 5. A0 and B0 measured on a plane 0.3 mm above the bottom of the pocket. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: CSD18531Q5A 11 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CSD18531Q5A ACTIVE VSONP DQJ 8 2500 RoHS-Exempt & Green SN Level-1-260C-UNLIM -55 to 150 CSD18531 CSD18531Q5AT ACTIVE VSONP DQJ 8 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -55 to 150 CSD18531 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of