User's Guide
SLPU003A – February 2014 – Revised February 2014
High Power Density, Low Profile NexFET™ Power Block II
for Notebook Power Supply
The evaluation module (EVM) CSD87381PEVM-603 uses the CSD87381P together with TI controller
TPS51219 providing 1.35-V output at up to 15 A from input voltage ranging 8 to 20 V.
1
2
3
4
5
6
7
8
Contents
Description ................................................................................................................... 2
1.1
Typical Applications ................................................................................................ 2
1.2
Features ............................................................................................................. 2
Electrical Performance Specifications .................................................................................... 2
Schematic .................................................................................................................... 3
Test Setup ................................................................................................................... 4
4.1
Test Equipment ..................................................................................................... 4
4.2
Recommended Test Setup ....................................................................................... 5
Test Procedure .............................................................................................................. 6
5.1
Line and Load Regulation and Efficiency Measurement Procedure ........................................ 6
5.2
List of Testpoints ................................................................................................... 6
5.3
Equipment Shutdown .............................................................................................. 6
Performance Data and Typical Characteristic Curves ................................................................. 7
EVM Assembly Drawing and PCB Layout ............................................................................... 8
Bill of Materials ............................................................................................................. 12
List of Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
........................................................................................
Tip and Barrel Measurement for Vsw Waveform .......................................................................
CSD87381PEVM-603 Recommended Test Setup .....................................................................
Efficiency versus Output Current for CSD87381P With TPS51219 ..................................................
Switching Node Waveform, VIN = 12 V, Iout = 10 A ...................................................................
Switching Node Waveform, VIN = 19 V, Iout = 10 A ...................................................................
CSD87381PEVM-603 Top Layer Assembly Drawing (Top View) ....................................................
CSD87381PEVM-603 Bottom Assembly Drawing (Bottom View) ....................................................
CSD87381PEVM-603 Top Copper (Top View) .........................................................................
CSD87381PEVM-603 Internal Layer 1 (Top View) .....................................................................
CSD87381PEVM-603 Internal Layer 2 (Top View) ...................................................................
CSD87381PEVM-603 Internal Layer 3 (Top View) ...................................................................
CSD87381PEVM-603 Internal Layer 4 (Top View) ...................................................................
CSD87381PEVM-603 Bottom Copper (Top View) ....................................................................
CSD87381PEVM-603 Schematic
3
4
5
7
7
7
8
8
9
9
10
10
11
11
List of Tables
1
CSD87381PEVM-603 Electrical Performance Specifications .........................................................
2
2
Function of Each Testpoint ................................................................................................
6
NexFET, D-CAP2 are trademarks of Texas Instruments.
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
Copyright © 2014, Texas Instruments Incorporated
1
Description
1
www.ti.com
Description
The CSD87381PEVM-603 is designed to use a regulated voltage ranging 8 to 20 V to produce 1.35-V
output at up to 15 A of load current. The CSD87381PEVM-603 demonstrates Power Block II together with
TI controller TPS51219 in a typical low voltage application with D-CAP2™ mode operation. The EVM also
provides a number of testpoints to evaluate the performance of the CSD87381P.
1.1
Typical Applications
•
•
•
1.2
Notebook computers
I/O supplies
System power supplies
Features
The CSD87381PEVM-603 features:
• 2% tolerance 1.35-V output voltage
• Up to 15-ADC steady state output current
• 300-kHz switching frequency
• More than 92% peak efficiency
2
Electrical Performance Specifications
Table 1. CSD87381PEVM-603 Electrical Performance Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT CHARACTERISTICS
Voltage range
VIN voltage
5V voltage
OUTPUT CHARACTERISTICS
(1)
Output voltage, VOUT
VIN = 12 V, IOUT = 10 A
4.5
12
20
V
5
5.5
V
1.35
Output load current, IOUT
10
V
15
A
SYSTEMS CHARACTERISTICS
Switching frequency
VIN = 12 V, VOUT = 1.35 V, IOUT = 10 A
300
Peak efficiency
VIN = 12 V, VOUT = 1.35 V
92.0
Full load efficiency
VIN = 12 V, VOUT = 1.35 V, IOUT = 12 A
86.0
Operating temperature
(1)
2
25
kHz
%
°C
The output voltage can be adjusted by changing the values of R104 and R107 in Figure 1. For details, refer to the TPS51219
data sheet, SLUSAG1. The TPS51219 device supports output voltage from 0.5 to 2 V.
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Schematic
www.ti.com
3
Schematic
TP100
5VIN_100
1
2
R100
10K
ON
R101
100K
5Vin
GND
J100
TP101
2
OFF
J101
PGOOD_100
ENABLE_100
1
TP102
TP103
4
3
2
1
VIN_100
R108
10R
VOUT_100
R109
C114
DNP
10R
13
8
22 µF
22 µF
TP104
R105
0R
+
DNP
C112
2.2 µF
GND
J103
C106
9 5VIN_100
Vout
1.35 V at 15 A
4
3
2
1
L100
1.0 µH
10
U100
TPS51219RTE
TP107
VOUT_100
12
11
PGND
V5
7
22 µF
TP105
4
3
14
EN
BST
15
DL
VSNS
GSNS_100
TP109
MODE
GSNS
GND
DH
C111
10000 pF
J102
22 µF
5
0.1 µF
SW
COMP
R107
21K
8 to 20 V
GND
C104
1
C105
REFIN
5
C110
0.1 µF
4
16
17
3
VSNS_100
PGOOD
PWPD
R104
10K
C103
Q100
CSD87381P
VREF
TRIP
2
6
1
C102
R103
4.7
TP106
C101
2
PGOOD_100
R102
100K
ENABLE_100
C100
1000pF
Vin
R106
DNP
C107
330 µF
+
C108
330 µF
C109
10 µF
TP108
C113
DNP
C115
10000 pF
R110
TP110
DNP
Figure 1. CSD87381PEVM-603 Schematic
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
High Power Density, Low Profile NexFET™ Power Block II for Notebook Power
Supply
Copyright © 2014, Texas Instruments Incorporated
3
Test Setup
4
Test Setup
4.1
Test Equipment
www.ti.com
Voltage source VIN: The input voltage source VIN must be a 0-V to 20-V variable DC source capable of
supplying 10 ADC. Connect VIN to J102 (as shown in Figure 3).
Voltage source V5VIN: The input voltage source V5VIN must be a 0-V to 5-V variable DC source
capable of supplying 1 ADC. Connect V5VIN to J100 (as shown in Figure 3).
Multimeters:
• V1: VIN at TP103 (Vins) and TP104 (GNDS)
• V2: 5V at TP100 (5V) and TP101 (GND)
• V3: Vouts at TP107 (Vouts) and TP108 (GNDS)
• A1: VIN input current
• A2: 5V input current
Output load: The output load must be an electronic constant-resistance mode load capable of 0-ADC to
20-ADC at 1.35 V.
Oscilloscope: A digital or analog oscilloscope can be used to measure the switch node waveform.
Differential probe must be used for the switch node waveform measurements. The oscilloscope should be
set for 50-Ω impedance, 1-GHz bandwidth, DC coupling, 50-ns/division horizontal resolution, 5-V/division
vertical resolution. When measuring the switch node waveform, place the negative probe tip on the GND
pad of the input cap and positive tip on the CSD87381P Vsw top metal (as shown in Figure 2).
Figure 2. Tip and Barrel Measurement for Vsw Waveform
Fan: Some of the components in this EVM may approach temperatures of 60°C during operation. TI
recommends a small fan capable of 200 to 400 LFM to reduce component temperatures while the EVM is
operating. The fan needs to run when the load current is higher than 10 A.
Recommended Wire Gauge:
1. VIN to J102 (8-V to 20-V input):
The recommended wire size is 1x AWG number 14 per input connection, with the total length of wire
less than 4 ft (2 ft input, 2 ft return).
2. V5VIN to J100 (5-V input):
The recommended wire size is 1x AWG number 18 per input connection, with the total length of wire
less than 4 ft (2 ft input, 2 ft return).
3. J103 to LOAD:
The minimum recommended wire size is 2x AWG number 14, with the total length of wire less than 4 ft
(2 ft output, 2 ft return).
4
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Test Setup
www.ti.com
4.2
Recommended Test Setup
DC Source
VIN
J102
GND
Vin
Vins
TP103
V1
GNDS
TP104
V3
V2
Vout
J100
DC Source
V5IN
5V
TP100
A2
TP102
TP105
GND
TP101
Vouts
TP107
Electronic
Load
GNDS
TP108
GND
J103
EN(J101)
TP106, TP109, TP110
Figure 3. CSD87381PEVM-603 Recommended Test Setup
Figure 3 shows the recommended test setup to evaluate the CSD87381PEVM-603. Working at an ESD
workstation, make sure that any wrist straps, bootstraps, or mats are connected. Reference the user-toearth ground before power is applied to the EVM.
Input Connections:
1. Prior to connecting the DC source VIN, TI recommends to limit the source current from VIN to 10-A
maximum. Ensure that VIN is initially set to 0 V and connected (as shown in Figure 3).
2. Prior to connecting the DC source V5VIN, TI recommends to limit the source current from V5VIN to 1A maximum. Ensure that V5VIN is initially set to 0 V and connected (as shown in Figure 3).
3. Connect a voltmeter, V1, at TP103 (Vins) and TP104 (GNDS) to measure VIN voltage, V2 at TP100
(5V), and TP101 (GND) to measure 5V voltage (as shown in Figure 3).
4. Connect a current meter A1 between DC source VIN and J102 to measure the input current.
5. Connect a current meter V2 between DC source V5VIN and J100 to measure the 5V input current.
Output Connections:
1. Connect the load to J103 and set load to constant resistance mode to sink 0-ADC before VIN and 5V
are applied.
2. Connect a voltmeter V3 at TP107 (Vouts) and TP108 (GNDS) to measure the output voltage.
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
Copyright © 2014, Texas Instruments Incorporated
5
Test Procedure
www.ti.com
5
Test Procedure
5.1
Line and Load Regulation and Efficiency Measurement Procedure
1. Ensure load is set to constant resistance mode and to sink 0 ADC.
2. Ensure a jumper is on J101 on the EVM to set the EVM at OFF position before VIN and V5VIN are
applied.
3. Increase VIN from 0 to 12 V. Using V1 to measure input voltage.
4. Increase V5VIN from 0 to 5 V. Using V2 to measure input voltage.
5. Remove the jumper on J101 to enable the controller.
6. Vary load from 0 to 15 ADC, VOUT should remain in load regulation.
7. Vary VIN from 12 to 19 V, VOUT should remain in line regulation.
8. Decrease load to 0 A.
9. Put a jumper to short J101 to disable the controller.
10. Decrease V5VIN to 0 V.
11. Decrease VIN to 0 V.
5.2
List of Testpoints
Table 2. Function of Each Testpoint
5.3
Testpoints
Name
TP100
5V
Description
5V supply
TP101
GND
GND for 5V supply
TP102
PGOOD
Power good
TP103
Vins
VIN supply
TP104
GND
GND for VIN supply
TP105
SW
Switch node
TP107
Vouts
VOUT sense
TP108
GNDS
GND sense
TP106
REFIN
REFIN (Vout Setting)
TP109
GSNS
Differential sensing (low)
TP110
VSNS
Differential sensing (high)
Equipment Shutdown
1. Shut down the load.
2. Put the jumper on J101.
3. Shut down V5VIN and VIN.
6
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Performance Data and Typical Characteristic Curves
www.ti.com
6
Performance Data and Typical Characteristic Curves
Figure 4 through Figure 6 show typical performance curves for CSD87381PEVM-603.
94
92
Efficiency (%)
90
88
86
84
82
80
VIN = 12 V
78
VIN = 19 V
76
0
1
2
3
4
5
6
7
8
Output Current (A)
9
10
11
12
C001
(1) Efficiency at VGS = 5.0 V, VO = 1.35 V, fSW = 300 kHz, LO = 1 µH, TA = 25°C
Figure 4. Efficiency versus Output Current for CSD87381P With TPS51219
Figure 5. Switching Node Waveform,
VIN = 12 V, Iout = 10 A
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Figure 6. Switching Node Waveform,
VIN = 19 V, Iout = 10 A
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
Copyright © 2014, Texas Instruments Incorporated
7
EVM Assembly Drawing and PCB Layout
7
www.ti.com
EVM Assembly Drawing and PCB Layout
Figure 7 through Figure 14 show the design of the CSD87381PEVM-603 printed circuit board. The EVM
was designed using a six-layer, 1-oz. copper circuit board.
Figure 7. CSD87381PEVM-603 Top Layer Assembly Drawing (Top View)
Figure 8. CSD87381PEVM-603 Bottom Assembly Drawing (Bottom View)
8
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 9. CSD87381PEVM-603 Top Copper (Top View)
Figure 10. CSD87381PEVM-603 Internal Layer 1 (Top View)
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
Copyright © 2014, Texas Instruments Incorporated
9
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 11. CSD87381PEVM-603 Internal Layer 2 (Top View)
Figure 12. CSD87381PEVM-603 Internal Layer 3 (Top View)
10
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 13. CSD87381PEVM-603 Internal Layer 4 (Top View)
Figure 14. CSD87381PEVM-603 Bottom Copper (Top View)
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
Copyright © 2014, Texas Instruments Incorporated
11
Bill of Materials
8
www.ti.com
Bill of Materials
The EVM components list according to the schematic shown in Figure 1.
Qty
Designator
Value
Description
Package Ref
Part Number
Manufacturer
1
C100
1000pF
CAP CER 1000PF 50V 5% X7R
0402
0402
CC0402JRX7R9B Yageo
B102
4
C101, C102,
C103, C104
22uF
CAP CER 22UF 25V 20% X7R 1210
1210
TMK325B7226M
M-TR
TAIYO
2
C105, C110
0.1uF
CAP CER 0.1UF 25V 20% X7R
0402
0402
C1005X7R1E104
M050BB
TDK
1
C106
DNP
CAP CER 1000PF 25V 5% X7R
0402
0402
C0402C102J3RA
CTU
KEMET
2
C107, C108
330uF
Capacitor, POSCAP, 330uF, 2.0V,
0.006 Ohms, 20%, D2T Size
D2T
EEF-SX0D331XE
Panasonic
1
C109
10uF
CAP CER 10UF 25V 10% X5R 0805
0805
C2012X5R1E106
K
TDK
2
C111, C115
10000pF
CAP CER 10000PF 25V 5% X7R
0402
0402
C0402C103J3RA
CTU
KEMET
1
C112
2.2uF
CAP CER 2.2UF 25V 20% X7R
0805
0805
C2012X7R1E225
M085AB
TDK
1
C113
DNP
CAP CER 330PF 50V 1% NP0 0603
0603
C1608C0G1H331
F080AA
TDK
1
J100
ED1514
Terminal Block, 2-pin, 6-A, 3.5mm
0.27 x 0.25 inch
ED1514
ON SHORE TECH
1
J101
2 position
CONN HDR BRKWAY .100 2POS
VERT
0.100 inch x 2
5-146274-2
TE connecttivity
2
J102, J103
ED120/4DS
Terminal Block, 4x1, 5.08mm, TH
TERM_BLK,
4pos, 5.08mm
ED120/4DS
On-Shore
Technology
1
L100
1.0uH
Inductor, 1.0uH, 20A, 0.003 Ohms,
20%
0.400 x 0.453 inch PIMB103E1R0MS
cyntec
1
Q100
CSD87381P
Pico
LGA2.5X5 mm
CSD87381P
TI
2
R100, R104
10K
RES 10.0K OHM 1/16W 1% 0402
SMD
0402
RC0402FR0710KL
Yageo
2
R101, R102
100K
RES 100K OHM 1/16W 1% 0402
SMD
0402
RC0402FR07100KL
Yageo
1
R103
4.7
RES, 4.7 ohm, 5%, 0.063W, 0402
0402
CRCW04024R70J Vishay-Dale
NED
1
R105
0R
RES 0.0 OHM 1/10W JUMP SMD
0402
0402
MCS04020Z0000
ZE000
VISHAY
1
R107
21K
Resistor, Chip, 1/16W, 1%
0402
RC0402FR0721KL
Yageo
2
R108, R109
10R
RES 10 OHM 1/10W 1% 0402 SMD
0402
ERJ-2RKF10R0X
PANASONIC
1
SH100
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
7
TP100, TP102, 5000
TP103, TP105,
TP106, TP107,
TP110
Test Point, Red, Thru Hole Color
Keyed
0.100 x 0.100 inch 5000
Keystone
4
TP101, TP104, 5001
TP108, TP109
Test Point, Black, Thru Hole Color
Keyed
0.100 x 0.100 inch 5001
Keystone
1
U100
TPS51219RTE IC, High Performance, Single
Synchronous Step-Down Controller
QFN-16
TPS51219RTE
Texas Instruments
0
C114
DNP
Capacitor, Ceramic, 16V, X7R, 10%
0402
STD
TDK
0
R106
DNP
RES 2.2 OHM 1/4W 1% 1206 SMD
1206
Std
Panasonic
0
R110
DNP
Resistor, Chip, 1/16W, 1%
0402
Std
Std
12
High Power Density, Low Profile NexFET™ Power Block II for Notebook
Power Supply
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Revision History
www.ti.com
Revision History
Changes from Original (February 2014) to A Revision .................................................................................................. Page
•
•
•
Updated Figure 2
Updated Figure 7
Updated Figure 8
.........................................................................................................................
.........................................................................................................................
.........................................................................................................................
4
8
8
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
SLPU003A – February 2014 – Revised February 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Revision History
13
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
