CSD87384MEVM-603

User's Guide SLPU001A – February 2014 – Revised February 2014 High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply The evaluation module (EVM) CSD87384MEVM-603 uses the CSD87384M together with TI controller TPS51219 providing 1.0-V output at up to 30 A from input voltage ranging 8 to 20 V. 1 2 3 4 5 6 7 8 Contents Description ................................................................................................................... 2 1.1 Typical Applications ................................................................................................ 2 1.2 Features ............................................................................................................. 2 Electrical Performance Specifications .................................................................................... 2 Schematic .................................................................................................................... 3 Test Setup ................................................................................................................... 4 4.1 Test Equipment ..................................................................................................... 4 4.2 Recommended Test Setup ....................................................................................... 5 Test Procedure .............................................................................................................. 6 5.1 Line and Load Regulation and Efficiency Measurement Procedure ........................................ 6 5.2 List of Testpoints ................................................................................................... 6 5.3 Equipment Shutdown .............................................................................................. 6 Performance Data and Typical Characteristic Curves ................................................................. 7 EVM Assembly Drawing and PCB Layout ............................................................................... 8 Bill of Materials ............................................................................................................. 12 List of Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 ........................................................................................ Tip and Barrel Measurement for Vsw Waveform ....................................................................... CSD87384MEVM-603 Recommended Test Setup ..................................................................... Efficiency versus Output Current for CSD87384M With TPS51219 ................................................. Switching Node Waveform, VIN = 12 V, Iout = 20 A ................................................................... Switching Node Waveform, VIN = 19 V, Iout = 20 A ................................................................... CSD87384MEVM-603 Top Layer Assembly Drawing (Top View) .................................................... CSD87384MEVM-603 Bottom Assembly Drawing (Bottom View) ................................................... CSD87384MEVM-603 Top Copper (Top View) ......................................................................... CSD87384MEVM-603 Internal Layer 1 (Top View) .................................................................... CSD87384MEVM-603 Internal Layer 2 (Top View) ................................................................... CSD87384MEVM-603 Internal Layer 3 (Top View) ................................................................... CSD87384MEVM-603 Internal Layer 4 (Top View) ................................................................... CSD87384MEVM-603 Bottom Copper (Top View) ................................................................... CSD87384MEVM-603 Schematic 3 4 5 7 7 7 8 8 9 9 10 10 11 11 List of Tables 1 CSD87384MEVM-603 Electrical Performance Specifications ........................................................ 2 2 Function of Each Testpoint ................................................................................................ 6 SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply Copyright © 2014, Texas Instruments Incorporated 1 Description 1 www.ti.com Description The CSD87384MEVM-603 is designed to use a regulated voltage ranging 8 to 20 V to produce 1.0-V output at up to 30 A of load current. The CSD87384MEVM-603 demonstrates Power Block II together with TI controller TPS51219 in a typical low voltage application with D-CAP2™ mode operation. The EVM also provides a number of testpoints to evaluate the performance of the CSD87384M. 1.1 Typical Applications • • • 1.2 Notebook computers I/O supplies System power supplies Features The CSD87384MEVM-603 features: • 2% tolerance 1.0-V output voltage • Up to 30-ADC steady state output current • 300-kHz switching frequency • More than 90% peak efficiency 2 Electrical Performance Specifications Table 1. CSD87384MEVM-603 Electrical Performance Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT CHARACTERISTICS Voltage range VIN voltage 5V voltage 4.5 12 20 5 5.5 V OUTPUT CHARACTERISTICS (1) Output voltage, VOUT VIN = 12 V, IOUT = 10 A 1 Output load current, IOUT 25 V 30 A SYSTEMS CHARACTERISTICS Switching frequency VIN = 12 V, VOUT = 1.0 V, IOUT = 25 A 300 Peak efficiency VIN = 12 V, VOUT = 1.0 V 90.2 Full load efficiency VIN = 12 V, VOUT = 1.0 V, IOUT = 30 A 84.3 Operating temperature (1) 2 25 kHz % °C The output voltage can be adjusted by changing the values of R204 and R207 in Figure 1. For details, refer to the TPS51219 data sheet, SLUSAG1. The TPS51219 device supports output voltage from 0.5 to 2 V. High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Schematic www.ti.com 3 Schematic TP200 5VIN_200 1 5Vin 2 R200 10K GND R201 100K J200 TP201 2 OFF J201 PGOOD_200 ENABLE_200 1 ON TP202 TP203 TP209 R208 10 C214 DNP 10 C204 22 µF 22 µF 2 11 TP207 L200 0.36 µH R205 0 + C210 2.2 µF GND J203 C206 DNP 9 5VIN_200 Vout 1.0 V at 25 A 4 3 2 1 VOUT_200 4 10 8 GND J202 5 12 PGND V5 7 C203 22 µF TP205 1 3 13 14 EN BST PGOOD_200 15 MODE DL VSNS GND GSNS C212 DNP R209 VOUT_200 16 17 PWPD 4 DH TRIP R207 0 3 VSNS_200 C202 8 to 20 V TP204 C205 0.1 µF SW 5 C211 0.1 µF GSNS_200 R203 2.2 REFIN COMP R204 DNP C201 22 µF Q200 CSD87384M VREF 6 2 PGOOD TP206 1 ENABLE_200 C200 1000pF R202 100K Vin 4 3 2 1 VIN_200 R206 2.2R C207 330 µF + C208 330 µF C209 10 µF TP208 C213 330 pF U200 TPS51219RTE C215 0.01 µF R210 DNP TP210 Figure 1. CSD87384MEVM-603 Schematic SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply Copyright © 2014, Texas Instruments Incorporated 3 Test Setup 4 Test Setup 4.1 Test Equipment www.ti.com Voltage source VIN: The input voltage source VIN must be a 0-V to 20-V variable DC source capable of supplying 10 ADC. Connect VIN to J202 (as shown in Figure 3). Voltage source V5VIN: The input voltage source V5VIN must be a 0-V to 5-V variable DC source capable of supplying 1 ADC. Connect V5VIN to J200 (as shown in Figure 3). Multimeters: • V1: VIN at TP203 (Vins) and TP204 (GNDS) • V2: 5V at TP200 (5V) and TP201 (GND) • V3: Vouts at TP207 (Vouts) and TP208 (GNDS) • A1: VIN input current • A2: 5V input current Output load: The output load must be an electronic constant-resistance mode load capable of 0-ADC to 40-ADC at 1.0 V. Oscilloscope: A digital or analog oscilloscope can be used to measure the switch node waveform. Differential probe must be used for the switch node waveform measurements. The oscilloscope should be set for 50-Ω impedance, 1-GHz bandwidth, DC coupling, 50-ns/division horizontal resolution, 5-V/division vertical resolution. When measuring the switch node waveform, place the negative probe tip on the GND pad of the input cap and positive tip on the CSD87384M Vsw top metal (as shown in Figure 2). Figure 2. Tip and Barrel Measurement for Vsw Waveform Fan: Some of the components in this EVM may approach temperatures of 60°C during operation. TI recommends a small fan capable of 200 to 400 LFM to reduce component temperatures while the EVM is operating. The fan needs to run when the load current is higher than 25 A. Recommended Wire Gauge: 1. VIN to J202 (8-V to 20-V input): The recommended wire size is 1x AWG number 14 per input connection, with the total length of wire less than 4 ft (2 ft input, 2 ft return). 2. V5VIN to J200 (5-V input): The recommended wire size is 1x AWG number 18 per input connection, with the total length of wire less than 4 ft (2 ft input, 2 ft return). 3. J203 to LOAD: The minimum recommended wire size is 2x AWG number 14, with the total length of wire less than 4 ft (2 ft output, 2 ft return). 4 High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Test Setup www.ti.com 4.2 Recommended Test Setup DC Source VIN J202 GND Vin Vins TP203 V1 GNDS TP204 V3 V2 Vout Vouts TP207 J200 DC Source V5IN 5V TP200 A2 TP202 Electronic Load TP205 GND TP201 GNDS TP208 GND J203 EN(J201) TP206, TP209, TP210 Figure 3. CSD87384MEVM-603 Recommended Test Setup Figure 3 shows the recommended test setup to evaluate the CSD87384MEVM-603. Working at an ESD workstation, make sure that any wrist straps, bootstraps, or mats are connected. Reference the user-toearth ground before power is applied to the EVM. Input Connections: 1. Prior to connecting the DC source VIN, TI recommends to limit the source current from VIN to 10 A maximum. Ensure that VIN is initially set to 0 V and connected (as shown in Figure 3). 2. Prior to connecting the DC source V5VIN, TI recommends to limit the source current from 5V to 0.5-A maximum. Ensure that V5VIN is initially set to 0 V and connected (as shown in Figure 3). 3. Connect a voltmeter, V1, at TP203 (Vins) and TP204 (GNDS) to measure VIN voltage, V2 at TP200 (5V), and TP201 (GND) to measure 5V voltage (as shown in Figure 3). 4. Connect a current meter A1 between DC source VIN and J202 to measure the input current. 5. Connect a current meter A2 between DC source 5V and J200 to measure the 5V input current. Ouput Connections: 1. Connect the load to J203 and set load to constant resistance mode to sink 0-ADC before VIN and 5V are applied. 2. Connect a voltmeter V3 at TP207 (VOUTS) and TP208 (GNDS) to measure the output voltage. SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply Copyright © 2014, Texas Instruments Incorporated 5 Test Procedure www.ti.com 5 Test Procedure 5.1 Line and Load Regulation and Efficiency Measurement Procedure 1. Ensure load is set to constant resistance mode and to sink 0 ADC. 2. Ensure a jumper is on J201 on the EVM to set the EVM at OFF position before VIN and V5VIN are applied. 3. Increase VIN from 0 to 12 V. Using V1 to measure input voltage. 4. Increase V5VIN from 0 to 5 V. Using V2 to measure input voltage. 5. Remove the jumper on J201 to enable the controller. 6. Turn on the fan. 7. Vary load from 0-30 ADC, VOUT should remain in load regulation. 8. Vary VIN from 12 to 19 V, VOUT should remain in line regulation. 9. Decrease load to 0 A. 10. Put a jumper to short J201 to disable the controller. 11. Decrease V5VIN to 0 V. 12. Decrease VIN to 0 V. 5.2 List of Testpoints Table 2. Function of Each Testpoint Testpoints 5.3 Name Description TP200 5V 5V supply TP201 GND GND for 5V supply TP202 PGOOD Power good TP203 Vins VIN supply TP204 GND GND for VIN supply TP205 SW Switch node TP207 Vouts VOUT sense TP208 GNDS GND sense TP206 REFIN REFIN (Vout Setting) TP209 GSNS Differential sensing (low) TP210 VSNS Differential sensing (high) Equipment Shutdown 1. Shut down the load. 2. Put the jumper on J201. 3. Shut down V5VIN and VIN. 6 High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Performance Data and Typical Characteristic Curves www.ti.com 6 Performance Data and Typical Characteristic Curves Efficiency (%) Figure 4 through Figure 6 show typical performance curves for CSD87384MEVM 91 89 87 85 83 81 79 77 75 73 71 69 67 65 VIN = 12 V VIN = 19 V 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Current (A) C001 A. Efficiency at VGS = 5.0 V, VO = 1.0 V, fSW = 300 kHz, LO = 0.36 µH, TA = 25°C Figure 4. Efficiency versus Output Current for CSD87384M With TPS51219 Figure 5. Switching Node Waveform, VIN = 12 V, Iout = 20 A SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Figure 6. Switching Node Waveform, VIN = 19 V, Iout = 20 A High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply Copyright © 2014, Texas Instruments Incorporated 7 EVM Assembly Drawing and PCB Layout 7 www.ti.com EVM Assembly Drawing and PCB Layout Figure 7 through Figure 14 show the design of the CSD87384MEVM-603 printed circuit board. The EVM was designed using a six-layer, 1-oz. copper circuit board. Figure 7. CSD87384MEVM-603 Top Layer Assembly Drawing (Top View) Figure 8. CSD87384MEVM-603 Bottom Assembly Drawing (Bottom View) 8 High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Assembly Drawing and PCB Layout www.ti.com Figure 9. CSD87384MEVM-603 Top Copper (Top View) Figure 10. CSD87384MEVM-603 Internal Layer 1 (Top View) SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply Copyright © 2014, Texas Instruments Incorporated 9 EVM Assembly Drawing and PCB Layout www.ti.com Figure 11. CSD87384MEVM-603 Internal Layer 2 (Top View) Figure 12. CSD87384MEVM-603 Internal Layer 3 (Top View) 10 High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Assembly Drawing and PCB Layout www.ti.com Figure 13. CSD87384MEVM-603 Internal Layer 4 (Top View) Figure 14. CSD87384MEVM-603 Bottom Copper (Top View) SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply Copyright © 2014, Texas Instruments Incorporated 11 Bill of Materials 8 www.ti.com Bill of Materials The EVM components list according to the schematic shown in Figure 1. Qty Designator Value Description Package Ref Part Number Manufacturer 1 C200 1000pF CAP CER 1000PF 25V 5% X7R 0402 0402 C0402C102J3RAC KEMET TU 4 C201, C202, C203, C204 22uF CAP CER 22UF 25V 20% X7R 1210 1210 TMK325B7226MM- TAIYO TR 2 C205, C211 0.1uF CAP CER 0.1UF 25V 20% X7R 0402 0402 C1005X7R1E104M TDK 1 C206 DNP Capacitor, Ceramic, 25V, X7R, 10% 0402 C0402C102J3RAC Std TU 2 C207, C208 330uF Capacitor, POSCAP, 330uF, 2.0V, 0.006 Ohms, 20%, D2T Size D2T EEF-SX0D331XE Panasonic 1 C209 10uF CAP CER 10UF 25V 10% X5R 0805 0805 C2012X5R1E106K TDK 1 C210 2.2uF CAP CER 2.2UF 25V 20% X7R 0805 0805 C2012X7R1E225M TDK 1 C213 330pF CAP CER 330PF 50V 1% NP0 0603 0603 C1608C0G1H331F TDK 080AA 1 C215 0.01uF CAP CER 10000PF 25V 5% X7R 0402 0402 C0402C103J3RAC KEMET TU 1 J200 ED1514 Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 inch ED1514 On-Shore Technology 1 J201 2 position CONN HDR BRKWAY .100 2POS VERT 0.100 inch x 2 PEC02SAAN FCI 2 J202, J203 ED120/4DS Terminal Block, 4x1, 5.08mm, TH TERM_BLK, 4pos, 5.08mm ED120/4DS On-Shore Technology 1 L200 0.36uH Inductor .36UH 30A POWER CHOKE SMD 11.7 X 10.0 X H4.0mm ETQP4LR36AFC Panasonic 1 Q200 CSD87384M Micro LGA2.5X5 mm CSD87384M Texas Instruments 1 R200 10K RES 100K OHM 1/16W 1% 0402 SMD 0402 RC0402FR0710KL Yageo 2 R201, R202 100K RES 100K OHM 1/16W 1% 0402 SMD 0402 RC0402FR07100KL Yageo 1 R203 2.2 RES 2.20 OHM 1/16W 1% 0402 SMD 0402 RC0402FR072R2L Yageo 2 R205, R207 0 RES 0.0 OHM 1/10W JUMP SMD 0402 0402 MCS04020Z0000Z E000 Vishay 1 R206 2.2R RES 2.2 OHM 1/4W 1% 1206 SMD 1206 ERJ-8RQF2R2V Panasonic 2 R208, R209 10 RES 10 OHM 1/10W 1% 0402 SMD 0402 ERJ-2RKF10R0X Panasonic 1 SH200 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M 7 TP200, TP202, 5000 TP203, TP205, TP206, TP207, TP210 Test Point, Red, Thru Hole Color Keyed 0.100 x 0.100 inch 5000 Keystone 4 TP201, TP204, 5001 TP208, TP209 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone 1 U200 TPS51219RTE IC, High Performance, Single Synchronous Step-Down Controller QFN-16 TPS51219RTE Texas Instruments 0 C212, C214 DNP Capacitor, Ceramic, 16V, X7R, 10% 0402 STD TDK 0 R204, R210 DNP Resistor, Chip, 1/16W, 1% Std Std 12 0402 High Power Density, Low Profile NexFET™ Power Block II for Notebook Power Supply SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Revision History www.ti.com Revision History Changes from Original (February 2014) to A Revision .................................................................................................. Page • • • Updated Figure 2 Updated Figure 7 Updated Figure 8 ......................................................................................................................... ......................................................................................................................... ......................................................................................................................... 4 8 8 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. SLPU001A – February 2014 – Revised February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Revision History 13 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated