CY74FCT2257T
QUAD 2-INPUT MULTIPLEXER
WITH 3-STATE OUTPUTS
SCCS038B – SEPTEMBER 1994 – REVISED OCTOBER 2001
D
D
D
D
D
D
D
D
D
Q OR SO PACKAGE
(TOP VIEW)
Function and Pinout Compatible With FCT
and F Logic
25-Ω Output Series Resistors to Reduce
Transmission-Line Reflection Noise
TTL Output Level Versions of Equivalent
FCT Functions
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
Ioff Supports Partial-Power-Down Mode
Operation
Fully Compatible With TTL Input and
Output Logic Levels
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
12-mA Output Sink Current
15-mA Output Source Current
3-State Outputs
S
I0a
I1a
Ya
I0b
I1b
Yb
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
OE
I0c
I1c
Yc
I0d
I1d
Yd
description
The CY74FCT2257T has four identical two-input multiplexers that select four bits of data from two sources
under the control of a common data-select (S) input. The I0 inputs are selected when S is low, and the I1 inputs
are selected when S is high. Data appears at the output in noninverted form for the CY74FCT2257T. On-chip
termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2257T can
replace the FCT257T to reduce noise in an existing design.
The CY74FCT2257T is a logic implementation of a four-pole, two-position switch, in which the position of the
switch is determined by the logic levels supplied to S. Outputs are forced to the high-impedance off state when
the output-enable (OE) input is high.
All but one device must be in the high-impedance state to prevent currents from exceeding the maximum ratings
if outputs are tied together. Design of the OE signals must ensure that there is no overlap when outputs of 3-state
devices are tied together.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
PIN DESCRIPTION
NAME
DESCRIPTION
I
Data inputs
S
Common data-select input
OE
Y
Output-enable input (active low)
Data outputs
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CY74FCT2257T
QUAD 2-INPUT MULTIPLEXER
WITH 3-STATE OUTPUTS
SCCS038B – SEPTEMBER 1994 – REVISED OCTOBER 2001
ORDERING INFORMATION
SPEED
(ns)
ORDERABLE
PART NUMBER
Tape and reel
4.3
CY74FCT2257CTQCT
Tube
4.3
CY74FCT2257CTSOC
Tape and reel
4.3
CY74FCT2257CTSOCT
PACKAGE†
TA
QSOP – Q
–40°C
40°C to 85°C
SOIC – SO
TOP-SIDE
MARKING
FR257-3
FCT2257C
QSOP – Q
Tape and reel
5
CY74FCT2257ATQCT
FR257-1
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OE
S
I1
X
OUTPUT
Y
H
X
I0
X
L
H
X
L
L
L
H
X
H
H
L
L
L
X
L
L
L
H
X
H
Z
H = High logic level, L = Low logic level, X = Don’t
care, Z = High-impedance (off) state
logic diagram (positive logic)
OE
S
I0a
I1a
I0b
I1b
I0c
I1c
I0d
I1d
2
15
1
2
4
Ya
3
5
7
Yb
6
14
12
Yc
13
11
9
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Yd
CY74FCT2257T
QUAD 2-INPUT MULTIPLEXER
WITH 3-STATE OUTPUTS
SCCS038B – SEPTEMBER 1994 – REVISED OCTOBER 2001
absolute maximum rating over operating free-air temperature range (unless otherwise noted)†
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W
Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
MIN
NOM
MAX
UNIT
4.75
5
5.25
V
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
V
High-level output current
–15
mA
IOL
TA
Low-level output current
12
mA
85
°C
High-level input voltage
2
Operating free-air temperature
–40
V
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
CY74FCT2257T
QUAD 2-INPUT MULTIPLEXER
WITH 3-STATE OUTPUTS
SCCS038B – SEPTEMBER 1994 – REVISED OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VOH
VCC = 4.75 V,
VCC = 4.75 V,
IIN = –18 mA
IOH = –15 mA
VOL
Rout
VCC = 4.75 V,
VCC = 4.75 V,
IOL = 12 mA
IOL = 12 mA
Vhys
IIH
All inputs
IIL
IOZH
IOZL
IOS‡
MIN
2.4
20
TYP†
MAX
UNIT
–0.7
–1.2
V
3.3
V
0.3
0.55
V
25
40
Ω
0.2
V
VCC = 5.25 V,
VCC = 5.25 V,
VIN = 2.7 V
VIN = 0.5 V
±1
µA
±1
µA
VCC = 5.25 V,
VCC = 5.25 V,
VOUT = 2.7 V
VOUT = 0.5 V
10
µA
–10
µA
VCC = 5.25 V,
VCC = 0 V,
VOUT = 0 V
VOUT = 4.5 V
–225
mA
–60
–120
±1
µA
0.1
0.2
mA
0.5
2
mA
0.06
0.12
mA/
MHz
0.7
1.4
1
2.4
0.7
1.4||
1.7
5.4||
Ci
5
10
Co
9
12
Ioff
ICC
∆ICC
ICCD¶
IC#
VCC = 5.25 V,
VIN ≤ 0.2 V,
VIN ≥ VCC – 0.2 V
§
VCC = 5.25 V, VIN = 3.4 V , f1 = 0, Outputs open
VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open,
OE = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
VCC = 5.25 V,
Outputs open,
open
OE = GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
One bit switching
at f1 = 10 MHz
at 50% duty cycle
Four bits switching
at f1 = 2.5 MHz
at 50% duty cycle
VIN = 3.4 V or GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
VIN = 3.4 V or GND
mA
pF
pF
† Typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus
and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise,
prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In
any sequence of parameter tests, IOS tests should be performed last.
§ Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND
¶ This parameter is derived for use in total power-supply calculations.
# IC
= ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1)
Where:
IC
= Total supply current
ICC = Power-supply current with CMOS input levels
∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V)
DH
= Duty cycle for TTL inputs high
NT
= Number of TTL inputs at DH
ICCD = Dynamic current caused by an input transition pair (HLH or LHL)
f0
= Clock frequency for registered devices, otherwise zero
f1
= Input signal frequency
N1
= Number of inputs changing at f1
All currents are in milliamperes and all frequencies are in megahertz.
|| Values for these conditions are examples of the ICC formula.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CY74FCT2257T
QUAD 2-INPUT MULTIPLEXER
WITH 3-STATE OUTPUTS
SCCS038B – SEPTEMBER 1994 – REVISED OCTOBER 2001
switching characteristics over operating free-air temperature range (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
Ia or Ib
Y
tPLH
tPHL
S
Y
tPZH
tPZL
OE
Y
OE
Y
tPHZ
tPLZ
POST OFFICE BOX 655303
CY74FCT2257AT
• DALLAS, TEXAS 75265
CY74FCT2257CT
MIN
MAX
MIN
MAX
1.5
5
1.5
4.7
1.5
5
1.5
4.7
1.5
7
1.5
5.2
1.5
7
1.5
5.2
1.5
7
1.5
6
1.5
7
1.5
6
1.5
5.5
1.5
5
1.5
5.5
1.5
5
UNIT
ns
ns
ns
ns
5
CY74FCT2257T
QUAD 2-INPUT MULTIPLEXER
WITH 3-STATE OUTPUTS
SCCS038B – SEPTEMBER 1994 – REVISED OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7V
From Output
Under Test
From Output
Under Test
Test
Point
CL = 50 pF
(see Note A)
Open
TEST
GND
CL = 50 pF
(see Note A)
500 Ω
S1
500 Ω
S1
Open
7V
Open
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
500 Ω
LOAD CIRCUIT FOR
3-STATE OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
tsu
3V
1.5 V
Input
1.5 V
th
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
1.5 V
1.5 V
VOL
tPHL
Out-of-Phase
Output
tPLZ
≈3.5 V
1.5 V
tPZH
VOH
1.5 V
VOL
1.5 V
0V
Output
Waveform 1
(see Note B)
tPLH
1.5 V
1.5 V
tPZL
VOH
In-Phase
Output
3V
Output
Control
Output
Waveform 2
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
74FCT2257CTSOCTE4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74FCT2257CTSOCTG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CY74FCT2257ATQCT
ACTIVE
SSOP/QSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2257ATQCTE4
ACTIVE
SSOP/QSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2257ATQCTG4
ACTIVE
SSOP/QSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2257CTSOCT
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CY74FCT2257CTSOCT
Package Package Pins
Type Drawing
SOIC
DW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.7
2.7
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CY74FCT2257CTSOCT
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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