CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
D
D
D
D
D
D
D
D
D
D
D
Q PACKAGE
(TOP VIEW)
Function, Pinout, and Drive Compatible
With FCT, F Logic, and AM29825
Reduced VOH (Typically = 3.3 V) Version of
Equivalent FCT Functions
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
Ioff Supports Partial-Power-Down Mode
Operation
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
64-mA Output Sink Current
32-mA Output Source Current
High-Speed Parallel Register With
Positive-Edge-Triggered D-Type Flip-Flops
Buffered Common Clock-Enable (EN) and
Asynchronous-Clear (CLR) Inputs
3-State Outputs
OE1
OE2
D0
D1
D2
D3
D4
D5
D6
D7
CLR
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
OE3
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
EN
CP
description
This bus-interface register is designed to eliminate the extra packages required to buffer existing registers and
provide extra data width for wider address/data paths or buses carrying parity. The CY74FCT825T is an 8-bit
buffered register with all the CY74FCT823T controls, plus multiple enables (OE1, OE2, OE3) to allow multiuser
control of the interface, e.g., CS, DMA, and RD/WR. This device is ideal for use as an output port requiring high
IOL/IOH.
This device is designed for high-capacitance load drive capability, while providing low-capacitance bus loading
at both inputs and outputs. Outputs are designed for low-capacitance bus loading in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE†
SPEED
(ns)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
–40°C to 85°C QSOP – Q
Tape and reel
6
CY74FCT825CTQCT
FCT825C
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
PIN DESCRIPTION
NAME
I/O
D
I
D flip-flop data inputs
CLR
I
When CLR is low and OE is low, Q outputs are low. When CLR is high, data can be entered into the register.
CP
O
Clock pulse for the register. Enters data into the register on the low-to-high clock transition.
Y
O
Register 3-state outputs
EN
I
Clock enable. When EN is low, data on the D input is transferred to the Q output on the low-to-high clock transition. When
EN is high, the Q outputs do not change state, regardless of the data or clock input transitions.
OE
I
Output control. When OE is high, the Y outputs are in the high-impedance state. When OE is low, true register data is present
at the Y outputs.
DESCRIPTION
FUNCTION TABLE
INTERNAL
OUTPUTS
INPUTS
OE
CLR
EN
D
CP
Q
Y
H
H
H
H
L
L
L
H
↑
L
Z
↑
H
Z
H
L
X
X
X
L
Z
L
L
X
X
X
L
L
H
H
H
X
X
NC
Z
L
H
H
X
X
NC
NC
H
H
L
L
↑
L
Z
H
H
L
H
↑
H
Z
L
H
L
L
↑
L
L
L
H
L
H
↑
H
H
FUNCTION
Z
Clear
Hold
Load
H = High logic level, L = Low logic level, X = Don’t care, NC = No change,
↑ = Low-to-high transition, Z = High-impedance state
logic diagram (positive logic)
OE1
OE2
OE3
CLR
CP
EN
1
2
23
11
13
CL
14
CP Q
D0
3
D
To Seven Other Channels
2
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22
Y0
CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
absolute maximum rating over operating free-air temperature range (unless otherwise noted)†
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, qJA (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
MIN
NOM
MAX
UNIT
4.75
5
5.25
V
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
V
High-level output current
–32
mA
IOL
TA
Low-level output current
64
mA
85
°C
High-level input voltage
2
Operating free-air temperature
–40
V
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
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3
CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VCC = 4.75 V,
VOH
VCC = 4
4.75
75 V
VOL
Vhys
VCC = 4.75 V,
All inputs
II
IIH
VCC = 5.25 V,
VCC = 5.25 V,
VIN = VCC
VIN = 2.7 V
IIL
IOZH
VCC = 5.25 V,
VCC = 5.25 V,
VIN = 0.5 V
VOUT = 2.7 V
IOZL
IOS‡
VCC = 5.25 V,
VCC = 5.25 V,
VOUT = 0.5 V
VOUT = 0 V
Ioff
ICC
VCC = 0 V,
VCC = 5.25 V,
MIN
IIN = –18 mA
IOH = –32 mA
TYP†
MAX
UNIT
–0.7
–1.2
V
2
IOH = –15 mA
IOL = 64 mA
2.4
V
3.3
0.3
0.55
V
5
µA
±1
µA
±1
µA
10
µA
0.2
V
–10
µA
–225
mA
±1
µA
0.1
0.2
mA
0.5
2
mA
0.06
0.12
mA/
MHz
0.7
1.4
VIN = 3.4 V or GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
1.2
3.4
1.6
3.2||
VIN = 3.4 V or GND
3.9
12.2||
Ci
5
10
Co
9
12
∆ICC
ICCD¶
IC#
–60
VOUT = 4.5 V
VIN ≤ 0.2 V,
VIN ≥ VCC – 0.2 V
VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open
VCC = 5.25 V, One bit switching at 50% duty cycle, Outputs open,
OE = EN = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
VCC = 5.25 V,
Outputs open,
open
OE = EN = GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
One bit switching
at f1 = 5 MHz
at 50% duty cycle
Eight bits switching
at f1 = 2.5 MHz
at 50% duty cycle
–120
mA
pF
pF
† Typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or
sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence
of parameter tests, IOS tests should be performed last.
§ Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND
¶ This parameter is derived for use in total power-supply calculations.
# IC
= ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1)
Where:
IC
= Total supply current
ICC = Power-supply current with CMOS input levels
∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V)
DH
= Duty cycle for TTL inputs high
NT
= Number of TTL inputs at DH
ICCD = Dynamic current caused by an input transition pair (HLH or LHL)
f0
= Clock frequency for registered devices, otherwise zero
f1
= Input signal frequency
N1
= Number of inputs changing at f1
All currents are in milliamperes and all frequencies are in megahertz.
|| Values for these conditions are examples of the ICC formula.
4
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CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
PARAMETER
TEST LOAD
CP
tw
Pulse duration
tsu
time before CP↑
Setup time,
th
Hold time,
time after CP↑
trec
Recovery time
CLR low
Data
EN
Data
EN
CLR before CP↑
CY74FCT825AT
MIN
MAX
CY74FCT825BT
MIN
MAX
CY74FCT825CT
MIN
CL = 50 pF,,
RL = 500 Ω
7
6
6
6
6
6
CL = 50 pF,,
RL = 500 Ω
4
3
3
4
3
3
CL = 50 pF,,
RL = 500 Ω
2
1.5
1.5
2
0
0
6
6
6
CL = 50 pF,
RL = 500 Ω
MAX
UNIT
ns
ns
ns
ns
switching characteristics over operating free-air temperature range (see Figure 1)
CY74FCT825AT
CY74FCT825BT
CY74FCT825CT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST LOAD
tPLH
tPHL
CP
Y
CL = 50 pF,,
RL = 500 Ω
10
7.5
6
10
7.5
6
tPLH
tPHL
CP
Y
CL = 300 pF,,
RL = 500 Ω
20
15
12.5
20
15
12.5
tPLH
CLR
Y
CL = 50 pF,
RL = 500 Ω
14
9
8
tPZH
tPZL
OE
Y
CL = 50 pF,,
RL = 500 Ω
12
8
7
12
8
7
tPZH
tPZL
OE
Y
CL = 300 pF,,
RL = 500 Ω
23
15
12.5
23
15
12.5
tPHZ
tPLZ
OE
Y
CL = 5 pF,,
RL = 500 Ω
7
6.5
6
7
6.5
6
tPHZ
tPLZ
OE
Y
CL = 50 pF,
RL = 500 Ω
8
7.5
6.5
8
7.5
6.5
POST OFFICE BOX 655303
MIN
MAX
• DALLAS, TEXAS 75265
MIN
MAX
MIN
MAX
UNIT
ns
ns
ns
ns
ns
ns
ns
5
CY74FCT825T
8-BIT BUS-INTERFACE REGISTER
WITH 3-STATE OUTPUTS
SCCS070A – OCTOBER 2001 – REVISED NOVEMBER 2001
PARAMETER MEASUREMENT INFORMATION
7V
From Output
Under Test
From Output
Under Test
Test
Point
CL = 50 pF
(see Note A)
Open
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
S1
500 Ω
500 Ω
LOAD CIRCUIT FOR
3-STATE OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
tsu
3V
1.5 V
Input
1.5 V
th
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
1.5 V
1.5 V
VOL
tPHL
Out-of-Phase
Output
tPLZ
≈3.5 V
1.5 V
tPZH
VOH
1.5 V
VOL
1.5 V
0V
Output
Waveform 1
(see Note B)
tPLH
1.5 V
1.5 V
tPZL
VOH
In-Phase
Output
3V
Output
Control
Output
Waveform 2
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CY74FCT825ATSOC
ACTIVE
SOIC
DW
24
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT825A
CY74FCT825CTQCT
ACTIVE
SSOP
DBQ
24
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
FCT825C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of