DAC128S085EVM Booster Pack User’s Guide
User's Guide
Literature Number: SNAU164
July 2014
Contents
1
DAC128S085 BoosterPack Components ................................................................................. 4
2
Software Installation ............................................................................................................. 5
2.1
2.2
3
Graphical User Interface (GUI).............................................................................................
Launchpad Firmware Upgrade .............................................................................................
2.2.1 MSP430 Firmware Upgrade Application Installation ...........................................................
2.2.2 Firmware upgrade ..................................................................................................
5
6
6
6
DAC128S085 BoosterPack Setup and Operation .................................................................... 11
3.1
3.2
Connections ................................................................................................................. 11
Launching the Software ................................................................................................... 11
4
Board Layout ..................................................................................................................... 14
5
Schematic
6
......................................................................................................................... 19
Bill Of Materials .................................................................................................................. 20
2
Contents
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
www.ti.com
List of Figures
1-1.
DAC128S085EVM Evaluation Board...................................................................................... 4
2-1.
DAC12xSxxx Installation Directory ........................................................................................ 5
2-2.
USB Firmware Upgrade Window .......................................................................................... 6
2-3.
Driver Not Installed .......................................................................................................... 8
2-4.
Driver Authentication Warning
2-5.
3-1.
3-2.
3-3.
4-1.
4-2.
4-3.
4-4.
4-5.
5-1.
............................................................................................. 9
Driver Installed .............................................................................................................. 10
DAC128S085EVM Attached to MSP430 ................................................................................ 11
Part Select................................................................................................................... 12
Selectable Fields in GUI ................................................................................................... 13
Top Assembly Layer ....................................................................................................... 14
Top Layer Routing ......................................................................................................... 15
Power Layer Routing ...................................................................................................... 16
Ground Layer Routing ..................................................................................................... 17
Bottom Layer Routing...................................................................................................... 18
DAC128S085EVM Schematic ............................................................................................ 19
List of Tables
1-1.
Device and Package Configurations ...................................................................................... 4
6-1.
DAC128S085 Bill of Materials ............................................................................................ 20
SNAU164 – July 2014
Submit Documentation Feedback
List of Figures
Copyright © 2014, Texas Instruments Incorporated
3
Chapter 1
SNAU164 – July 2014
DAC128S085 BoosterPack Components
Figure 1-1. DAC128S085EVM Evaluation Board
Table 1-1. Device and Package Configurations
4
DEVICE
IC
Package
U1
LM4120IM5-4.1
SOT-23
U2
DAC128S085CIMT
TSSOP-16
DAC128S085 BoosterPack Components
Copyright © 2014, Texas Instruments Incorporated
SNAU164 – July 2014
Submit Documentation Feedback
Chapter 2
SNAU164 – July 2014
Software Installation
2.1
Graphical User Interface (GUI)
To use the DAC128S085EVM install the DAC12xSxxx Software:
1. If you are receiving the DAC128S085EVM from a FAE the software GUI will be in a .zip file. Otherwise,
click this link http://www.ti.com/product/dac128s085, scroll down to the “software” section, and
download the latest evaluation software.
2. Unzip the downloaded file into a known directory, and run the “setup.exe” file located in [Unzip
location]\ DAC12xSxxx \EVM_GUI\ DAC12xSxxx _Installer_v1.zip\ DAC12xSxxx
_Installer\Installer\Volume. Follow the pop-screen instructions by clicking the “Next” button to install the
software.
Figure 2-1. DAC12xSxxx Installation Directory
3. When the installation is finished, please click “Finish” button.
SNAU164 – July 2014
Submit Documentation Feedback
Software Installation
Copyright © 2014, Texas Instruments Incorporated
5
Launchpad Firmware Upgrade
2.2
www.ti.com
Launchpad Firmware Upgrade
Note: This section is only needed with a brand new Launchpad. If a Launchpad is shipped with an
DAC128S085 EVM then skip section 2.2.
2.2.1 MSP430 Firmware Upgrade Application Installation
1. 1. Navigate to http://www.ti.com/tool/msp430usbdevpack and click on Get Software.
2. 2. Scroll-down to the end of the page to find the USB Collateral Installers section.
3. 3. Click on MSP430_USB_Firmware_Upgrade_Example-x-x-x-Setup.exe to download the tool; the
page will redirect to a submission form.
4. 4. Complete the information requested and submit the form; if approved, a download button will
appear.
5. 5. Run the installation file and follow the on-screen instructions until completion. When asked about the
setup type, select Application Only. Click Finish when done.
2.2.2 Firmware upgrade
1. If you are receiving the DAC128S085EVM from a FAE the firmware is a text file
“DAC128S085EVM_Firmware-v0.87.txt”
2. Open the MSP430 USB Firmware Upgrade application. By default, the application can be launched
from Start >> Programs >> Texas Instruments >> MSP430 USB Firmware Upgrade Example.
3. Click Next to proceed on the first prompt; read and accept the license agreement and click Next to
continue.
Figure 2-2. USB Firmware Upgrade Window
4. Enable the Select Firmware button and browse to open the downloaded firmware
“DAC128S085EVM_Firmware-v0.87.txt”.
5. Press the BSL button on the MSP430 LaunchPad and connect to the PC with a USB cable; if detected,
the text on the Firmware Upgrade tool will change from No device connected to Found 1 device.
6
Software Installation
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Launchpad Firmware Upgrade
www.ti.com
6. Click on the Upgrade Firmware button to program the LaunchPad. Close the application when done.
Update USB Driver
1. Before launching the DAC12xSxxx software, connect the DAC128S085EVM board to a USB port of
your PC. Go to Device Manager and find “MSP43-USB Example”. Right click and select Update Driver
Software.
SNAU164 – July 2014
Submit Documentation Feedback
Software Installation
Copyright © 2014, Texas Instruments Incorporated
7
Launchpad Firmware Upgrade
www.ti.com
Figure 2-3. Driver Not Installed
8
Software Installation
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Launchpad Firmware Upgrade
www.ti.com
2. On the next screen, select the “Browse my computer for driver software” option and go to the directory
of your install files and select the “TI_ADC_DAC_EVMs_Driver.inf” file.
3. 3. If prompted with a warning window select “Install this Driver Anyway”. Close the installation window
when it is done. The device manager should now display a “TI_ADC_DAC_EVMs” item followed by a
COM port number.
Figure 2-4. Driver Authentication Warning
SNAU164 – July 2014
Submit Documentation Feedback
Software Installation
Copyright © 2014, Texas Instruments Incorporated
9
Launchpad Firmware Upgrade
www.ti.com
Figure 2-5. Driver Installed
10
Software Installation
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Chapter 3
SNAU164 – July 2014
DAC128S085 BoosterPack Setup and Operation
3.1
Connections
1. Attach the DAC128S085EVM BoosterPack onto the MSP430 LaunchPad using connectors JA, JB, JC,
JD. The proper orientation of the Launchpad and DAC128S085EVM is when the text “LaunchPad” and
“2013 TI” are in the same direction.
Figure 3-1. DAC128S085EVM Attached to MSP430
2. Connect the USB cable from the LaunchPad to the PC
3.2
Launching the Software
1. The DAC12xSxxx GUI software can be run by clicking on Start >> All Program >> DAC12xSxxx. After
running the GUI select DAC128S085.
SNAU164 – July 2014
Submit Documentation Feedback
DAC128S085 BoosterPack Setup and Operation
Copyright © 2014, Texas Instruments Incorporated
11
Launching the Software
www.ti.com
Figure 3-2. Part Select
2. GUI Descriptions
• • DB[15:12]: These 4 bits control different write modes, channel selects, and special operation
modes. See the DAC128S085 datasheet for more details.
• • DB[11:0]: These 12 bits are for setting the DAC output codes.
• • DB[11:0] Output Type: This field changes DB[11:0] to either binary, decimal, or hexadecimal type.
12
DAC128S085 BoosterPack Setup and Operation
Copyright © 2014, Texas Instruments Incorporated
SNAU164 – July 2014
Submit Documentation Feedback
Launching the Software
www.ti.com
Figure 3-3. Selectable Fields in GUI
3. 3. Quick start:
• a. Write “1001” to DB[15:12] to switch into WTM mode
• b. Write “0000” to DB[15:12] and “800” to DB[11:0] to select channel A and set channel A output to
Vref/2 of 2.048V.
SNAU164 – July 2014
Submit Documentation Feedback
DAC128S085 BoosterPack Setup and Operation
Copyright © 2014, Texas Instruments Incorporated
13
Chapter 4
SNAU164 – July 2014
Board Layout
Figure 4-1. Top Assembly Layer
14
Board Layout
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
www.ti.com
Figure 4-2. Top Layer Routing
SNAU164 – July 2014
Submit Documentation Feedback
Board Layout
Copyright © 2014, Texas Instruments Incorporated
15
www.ti.com
Figure 4-3. Power Layer Routing
16
Board Layout
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
www.ti.com
Figure 4-4. Ground Layer Routing
SNAU164 – July 2014
Submit Documentation Feedback
Board Layout
Copyright © 2014, Texas Instruments Incorporated
17
www.ti.com
Figure 4-5. Bottom Layer Routing
18
Board Layout
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Chapter 5
SNAU164 – July 2014
Schematic
U1
LM4120IM5-4.1/NOPB
5V
4
3
OUT
EN
REF
VA
DNP
DNP
JVA
VREF
VA
1
2
3
5
1
C1
0.047µF
C9
4.7µF
GND
SH-JVA_2-3
5V
2
C2
0.1µF
IN
GND
J1
3.3V
JA-2
JA-7
U2
DAC128S085CIMT/NOPB
5V
JA
1
2
3
4
5
6
7
8
9
10
JC
1
2
3
4
5
6
7
8
9
10
JB-6
1
JA-2
15
JA-7
16
DIN
SYNC
SCLK
VOUTA
VOUTB
VOUTC
VOUTD
VOUTE
VOUTF
VOUTG
VOUTH
DOUT
R3
R4
R5
R6
R14
R13
R12
R11
3
4
5
6
14
13
12
11
2
1
3
5
7
200
200
200
200
200
200
200
200
JB-7
VA
VREF
C3
0.01µF
C4
0.01µF
C5
0.01µF
C6
0.01µF
C14
0.01µF
C13
0.01µF
C12
0.01µF
C11
0.01µF
2
4
6
8
7
5
3
1
8
6
4
2
JD
1
2
3
4
5
6
7
8
9
10
JB
1
2
3
4
5
6
7
8
9
10
JB-6
JB-7
J2
VA
VREF1
VREF2
GND
7
8
9
10
C8
0.1µF
C7
0.1µF
C15
0.1µF
C16
4.7µF
Figure 5-1. DAC128S085EVM Schematic
SNAU164 – July 2014
Submit Documentation Feedback
Schematic
Copyright © 2014, Texas Instruments Incorporated
19
Chapter 6
SNAU164 – July 2014
Bill Of Materials
Table 6-1. DAC128S085 Bill of Materials
20
Designator
Quantit
y
Value
Description
PartNumber
Manufacturer
!PCB
1
C1
1
0.047uF
Printed Circuit Board
SV601044
Any
CAP, CERM, 0.047uF, 6.3V, +/-10%,
X7R, 0603
GRM188R70J473K
A01D
MuRata
C2, C7, C8, C15
4
0.1uF
CAP, CERM, 0.1uF, 10V, +/-10%, X7R,
0603
C0603C104K8RAC
TU
Kemet
C3, C4, C5, C6,
8
C11, C12, C13, C14
0.01uF
CAP, CERM, 0.01uF, 25V, +/-10%,
X7R, 0603
GRM188R71E103K
A01D
MuRata
C9, C16
2
4.7uF
CAP, TA, 4.7uF, 10V, +/-10%, 1.4 ohm,
SMD
TPSA475K010R140 AVX
0
J1, J2
2
Header, TH, 100mil, 4x2, Gold plated,
230 mil above insulator
TSW-104-07-G-D
Samtec
JA, JB, JC, JD
4
Connector, Receptacle, 100mil, 10x1,
Gold plated, TH
SSW-110-23-F-S
Samtec
JVA
1
Header, 100mil, 3x1, Tin plated, TH
PEC03SAAN
Sullins Connector
Solutions
LBL1
1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per roll
THT-14-423-10
Brady
R3, R4, R5, R6,
8
R11, R12, R13, R14
200
RES, 200 ohm, 1%, 0.1W, 0603
CRCW0603200RFK Vishay-Dale
EA
SH-JVA_2-3
1
1x2
Shunt, 100mil, Gold plated, Black
382811-6
AMP
U1
1
Precision Micropower Low Dropout
Voltage Reference, 5-pin SOT-23, PbFree
LM4120IM54.1/NOPB
Texas Instruments
U2
1
12-Bit Micro Power OCTAL Digital-toAnalog Converter with Rail-to-Rail
Outputs, 16-pin TSSOP, Pb-Free
DAC128S085CIMT/
NOPB
Texas Instruments
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or N/A
mount.
N/A
GND
0
Black
Test Point, TH, Multipurpose, Black
5011
Keystone
Electronics
VA
0
Red
Test Point, TH, Multipurpose, Red
5010
Keystone
Electronics
Bill Of Materials
SNAU164 – July 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated