0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
DAC128S085EVM

DAC128S085EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVAL BOARD FOR DAC128S085

  • 数据手册
  • 价格&库存
DAC128S085EVM 数据手册
DAC128S085EVM Booster Pack User’s Guide User's Guide Literature Number: SNAU164 July 2014 Contents 1 DAC128S085 BoosterPack Components ................................................................................. 4 2 Software Installation ............................................................................................................. 5 2.1 2.2 3 Graphical User Interface (GUI)............................................................................................. Launchpad Firmware Upgrade ............................................................................................. 2.2.1 MSP430 Firmware Upgrade Application Installation ........................................................... 2.2.2 Firmware upgrade .................................................................................................. 5 6 6 6 DAC128S085 BoosterPack Setup and Operation .................................................................... 11 3.1 3.2 Connections ................................................................................................................. 11 Launching the Software ................................................................................................... 11 4 Board Layout ..................................................................................................................... 14 5 Schematic 6 ......................................................................................................................... 19 Bill Of Materials .................................................................................................................. 20 2 Contents SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com List of Figures 1-1. DAC128S085EVM Evaluation Board...................................................................................... 4 2-1. DAC12xSxxx Installation Directory ........................................................................................ 5 2-2. USB Firmware Upgrade Window .......................................................................................... 6 2-3. Driver Not Installed .......................................................................................................... 8 2-4. Driver Authentication Warning 2-5. 3-1. 3-2. 3-3. 4-1. 4-2. 4-3. 4-4. 4-5. 5-1. ............................................................................................. 9 Driver Installed .............................................................................................................. 10 DAC128S085EVM Attached to MSP430 ................................................................................ 11 Part Select................................................................................................................... 12 Selectable Fields in GUI ................................................................................................... 13 Top Assembly Layer ....................................................................................................... 14 Top Layer Routing ......................................................................................................... 15 Power Layer Routing ...................................................................................................... 16 Ground Layer Routing ..................................................................................................... 17 Bottom Layer Routing...................................................................................................... 18 DAC128S085EVM Schematic ............................................................................................ 19 List of Tables 1-1. Device and Package Configurations ...................................................................................... 4 6-1. DAC128S085 Bill of Materials ............................................................................................ 20 SNAU164 – July 2014 Submit Documentation Feedback List of Figures Copyright © 2014, Texas Instruments Incorporated 3 Chapter 1 SNAU164 – July 2014 DAC128S085 BoosterPack Components Figure 1-1. DAC128S085EVM Evaluation Board Table 1-1. Device and Package Configurations 4 DEVICE IC Package U1 LM4120IM5-4.1 SOT-23 U2 DAC128S085CIMT TSSOP-16 DAC128S085 BoosterPack Components Copyright © 2014, Texas Instruments Incorporated SNAU164 – July 2014 Submit Documentation Feedback Chapter 2 SNAU164 – July 2014 Software Installation 2.1 Graphical User Interface (GUI) To use the DAC128S085EVM install the DAC12xSxxx Software: 1. If you are receiving the DAC128S085EVM from a FAE the software GUI will be in a .zip file. Otherwise, click this link http://www.ti.com/product/dac128s085, scroll down to the “software” section, and download the latest evaluation software. 2. Unzip the downloaded file into a known directory, and run the “setup.exe” file located in [Unzip location]\ DAC12xSxxx \EVM_GUI\ DAC12xSxxx _Installer_v1.zip\ DAC12xSxxx _Installer\Installer\Volume. Follow the pop-screen instructions by clicking the “Next” button to install the software. Figure 2-1. DAC12xSxxx Installation Directory 3. When the installation is finished, please click “Finish” button. SNAU164 – July 2014 Submit Documentation Feedback Software Installation Copyright © 2014, Texas Instruments Incorporated 5 Launchpad Firmware Upgrade 2.2 www.ti.com Launchpad Firmware Upgrade Note: This section is only needed with a brand new Launchpad. If a Launchpad is shipped with an DAC128S085 EVM then skip section 2.2. 2.2.1 MSP430 Firmware Upgrade Application Installation 1. 1. Navigate to http://www.ti.com/tool/msp430usbdevpack and click on Get Software. 2. 2. Scroll-down to the end of the page to find the USB Collateral Installers section. 3. 3. Click on MSP430_USB_Firmware_Upgrade_Example-x-x-x-Setup.exe to download the tool; the page will redirect to a submission form. 4. 4. Complete the information requested and submit the form; if approved, a download button will appear. 5. 5. Run the installation file and follow the on-screen instructions until completion. When asked about the setup type, select Application Only. Click Finish when done. 2.2.2 Firmware upgrade 1. If you are receiving the DAC128S085EVM from a FAE the firmware is a text file “DAC128S085EVM_Firmware-v0.87.txt” 2. Open the MSP430 USB Firmware Upgrade application. By default, the application can be launched from Start >> Programs >> Texas Instruments >> MSP430 USB Firmware Upgrade Example. 3. Click Next to proceed on the first prompt; read and accept the license agreement and click Next to continue. Figure 2-2. USB Firmware Upgrade Window 4. Enable the Select Firmware button and browse to open the downloaded firmware “DAC128S085EVM_Firmware-v0.87.txt”. 5. Press the BSL button on the MSP430 LaunchPad and connect to the PC with a USB cable; if detected, the text on the Firmware Upgrade tool will change from No device connected to Found 1 device. 6 Software Installation SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Launchpad Firmware Upgrade www.ti.com 6. Click on the Upgrade Firmware button to program the LaunchPad. Close the application when done. Update USB Driver 1. Before launching the DAC12xSxxx software, connect the DAC128S085EVM board to a USB port of your PC. Go to Device Manager and find “MSP43-USB Example”. Right click and select Update Driver Software. SNAU164 – July 2014 Submit Documentation Feedback Software Installation Copyright © 2014, Texas Instruments Incorporated 7 Launchpad Firmware Upgrade www.ti.com Figure 2-3. Driver Not Installed 8 Software Installation SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Launchpad Firmware Upgrade www.ti.com 2. On the next screen, select the “Browse my computer for driver software” option and go to the directory of your install files and select the “TI_ADC_DAC_EVMs_Driver.inf” file. 3. 3. If prompted with a warning window select “Install this Driver Anyway”. Close the installation window when it is done. The device manager should now display a “TI_ADC_DAC_EVMs” item followed by a COM port number. Figure 2-4. Driver Authentication Warning SNAU164 – July 2014 Submit Documentation Feedback Software Installation Copyright © 2014, Texas Instruments Incorporated 9 Launchpad Firmware Upgrade www.ti.com Figure 2-5. Driver Installed 10 Software Installation SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 3 SNAU164 – July 2014 DAC128S085 BoosterPack Setup and Operation 3.1 Connections 1. Attach the DAC128S085EVM BoosterPack onto the MSP430 LaunchPad using connectors JA, JB, JC, JD. The proper orientation of the Launchpad and DAC128S085EVM is when the text “LaunchPad” and “2013 TI” are in the same direction. Figure 3-1. DAC128S085EVM Attached to MSP430 2. Connect the USB cable from the LaunchPad to the PC 3.2 Launching the Software 1. The DAC12xSxxx GUI software can be run by clicking on Start >> All Program >> DAC12xSxxx. After running the GUI select DAC128S085. SNAU164 – July 2014 Submit Documentation Feedback DAC128S085 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated 11 Launching the Software www.ti.com Figure 3-2. Part Select 2. GUI Descriptions • • DB[15:12]: These 4 bits control different write modes, channel selects, and special operation modes. See the DAC128S085 datasheet for more details. • • DB[11:0]: These 12 bits are for setting the DAC output codes. • • DB[11:0] Output Type: This field changes DB[11:0] to either binary, decimal, or hexadecimal type. 12 DAC128S085 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated SNAU164 – July 2014 Submit Documentation Feedback Launching the Software www.ti.com Figure 3-3. Selectable Fields in GUI 3. 3. Quick start: • a. Write “1001” to DB[15:12] to switch into WTM mode • b. Write “0000” to DB[15:12] and “800” to DB[11:0] to select channel A and set channel A output to Vref/2 of 2.048V. SNAU164 – July 2014 Submit Documentation Feedback DAC128S085 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated 13 Chapter 4 SNAU164 – July 2014 Board Layout Figure 4-1. Top Assembly Layer 14 Board Layout SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Figure 4-2. Top Layer Routing SNAU164 – July 2014 Submit Documentation Feedback Board Layout Copyright © 2014, Texas Instruments Incorporated 15 www.ti.com Figure 4-3. Power Layer Routing 16 Board Layout SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Figure 4-4. Ground Layer Routing SNAU164 – July 2014 Submit Documentation Feedback Board Layout Copyright © 2014, Texas Instruments Incorporated 17 www.ti.com Figure 4-5. Bottom Layer Routing 18 Board Layout SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 5 SNAU164 – July 2014 Schematic U1 LM4120IM5-4.1/NOPB 5V 4 3 OUT EN REF VA DNP DNP JVA VREF VA 1 2 3 5 1 C1 0.047µF C9 4.7µF GND SH-JVA_2-3 5V 2 C2 0.1µF IN GND J1 3.3V JA-2 JA-7 U2 DAC128S085CIMT/NOPB 5V JA 1 2 3 4 5 6 7 8 9 10 JC 1 2 3 4 5 6 7 8 9 10 JB-6 1 JA-2 15 JA-7 16 DIN SYNC SCLK VOUTA VOUTB VOUTC VOUTD VOUTE VOUTF VOUTG VOUTH DOUT R3 R4 R5 R6 R14 R13 R12 R11 3 4 5 6 14 13 12 11 2 1 3 5 7 200 200 200 200 200 200 200 200 JB-7 VA VREF C3 0.01µF C4 0.01µF C5 0.01µF C6 0.01µF C14 0.01µF C13 0.01µF C12 0.01µF C11 0.01µF 2 4 6 8 7 5 3 1 8 6 4 2 JD 1 2 3 4 5 6 7 8 9 10 JB 1 2 3 4 5 6 7 8 9 10 JB-6 JB-7 J2 VA VREF1 VREF2 GND 7 8 9 10 C8 0.1µF C7 0.1µF C15 0.1µF C16 4.7µF Figure 5-1. DAC128S085EVM Schematic SNAU164 – July 2014 Submit Documentation Feedback Schematic Copyright © 2014, Texas Instruments Incorporated 19 Chapter 6 SNAU164 – July 2014 Bill Of Materials Table 6-1. DAC128S085 Bill of Materials 20 Designator Quantit y Value Description PartNumber Manufacturer !PCB 1 C1 1 0.047uF Printed Circuit Board SV601044 Any CAP, CERM, 0.047uF, 6.3V, +/-10%, X7R, 0603 GRM188R70J473K A01D MuRata C2, C7, C8, C15 4 0.1uF CAP, CERM, 0.1uF, 10V, +/-10%, X7R, 0603 C0603C104K8RAC TU Kemet C3, C4, C5, C6, 8 C11, C12, C13, C14 0.01uF CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0603 GRM188R71E103K A01D MuRata C9, C16 2 4.7uF CAP, TA, 4.7uF, 10V, +/-10%, 1.4 ohm, SMD TPSA475K010R140 AVX 0 J1, J2 2 Header, TH, 100mil, 4x2, Gold plated, 230 mil above insulator TSW-104-07-G-D Samtec JA, JB, JC, JD 4 Connector, Receptacle, 100mil, 10x1, Gold plated, TH SSW-110-23-F-S Samtec JVA 1 Header, 100mil, 3x1, Tin plated, TH PEC03SAAN Sullins Connector Solutions LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll THT-14-423-10 Brady R3, R4, R5, R6, 8 R11, R12, R13, R14 200 RES, 200 ohm, 1%, 0.1W, 0603 CRCW0603200RFK Vishay-Dale EA SH-JVA_2-3 1 1x2 Shunt, 100mil, Gold plated, Black 382811-6 AMP U1 1 Precision Micropower Low Dropout Voltage Reference, 5-pin SOT-23, PbFree LM4120IM54.1/NOPB Texas Instruments U2 1 12-Bit Micro Power OCTAL Digital-toAnalog Converter with Rail-to-Rail Outputs, 16-pin TSSOP, Pb-Free DAC128S085CIMT/ NOPB Texas Instruments FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or N/A mount. N/A GND 0 Black Test Point, TH, Multipurpose, Black 5011 Keystone Electronics VA 0 Red Test Point, TH, Multipurpose, Red 5010 Keystone Electronics Bill Of Materials SNAU164 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated
DAC128S085EVM 价格&库存

很抱歉,暂时无法提供与“DAC128S085EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货
DAC128S085EVM
    •  国内价格
    • 1+533.54400

    库存:10