DAC3484IZAY

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents Reference Design DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 DAC3484 Quad-Channel, 16-Bit, 1.25 GSPS Digital-to-Analog Converter (DAC) 1 Features 3 Description • The DAC3484 is a very low power, high dynamic range, quad-channel, 16-bit digital-to-analog converter (DAC) with a sample rate as high as 1.25 GSPS. 1 • • • • • • • • • • Very Low Power: 1.27 W at 1.25 GSPS, Full Operating Conditions Multi-DAC Synchronization Selectable 2x, 4x, 8x, 16x Interpolation Filter – Stop-Band Attenuation > 90 dBc Flexible On-chip Complex Mixing – Two Independent Fine Mixers with 32-Bit NCOs – Power Saving Coarse Mixers: ± n×Fs/8 High Performance, Low Jitter Clock Multiplying PLL Digital I and Q Correction – Gain, Phase, Offset, and Group Delay Correction Digital Inverse Sinc Filter Flexible 16-Bit LVDS Input Data Bus – 8 Sample Input FIFO – Data Pattern Checker – Parity Check – GC5330 Compatible Temperature Sensor Differential Scalable Output: 10 mA to 30 mA Multiple Package Options: 88-Pin 9x9mm WQFN and 196-Ball 12mmx12mm NFBGA (GREEN / PbFree) The device includes features that simplify the design of complex transmit architectures: 2x to 16x digital interpolation filters with over 90dB of stop-band attenuation simplify the data interface and reconstruction filters. Independent complex mixers allow flexible carrier placement. A high-performance low jitter clock multiplier simplifies clocking of the device without significant impact on the dynamic range. The digital Quadrature Modulator Correction (QMC) enables complete IQ compensation for gain, offset, phase and group delay between channels in direct up-conversion applications. Digital data is input to the device through a 16-bit LVDS data bus with on-chip termination. The device includes a FIFO, data pattern checker and parity test to ease the input interface. The interface also allows full synchronization of multiple devices. The device is characterized for operation over the entire industrial temperature range of –40°C to 85°C and is available in a very-small 88-pin 9x9mm WQFN package or 196-ball 12x12mm NFBGA package. Very low power, small size, superior crosstalk, high dynamic range and features of the DAC3484 are an ideal fit for systems with multiple transmit channels. Device Information(1) 2 Applications • • • Cellular Base Stations Diversity Transmit Wideband Communications PART NUMBER DAC3484 PACKAGE BODY SIZE (NOM) WQFN (88) 9.00 mm x 9.00 mm NFBGA (196) 12.00 mm x 12.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic 16-bit DAC RF 16-bit DAC xN xN Complex Mixer (32-bit NCO) LVDS Interface 16-Bit LVDS Input Data Bus xN Complex Mixer (32-bit NCO) DAC3484 16-bit DAC RF 16-bit DAC xN 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. 1 Applications ........................................................... 1 Description ............................................................. 1 Revision History..................................................... 2 Pin Configuration and Functions ......................... 5 Specifications....................................................... 11 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 7 Absolute Maximum Ratings .................................... ESD Ratings .......................................................... Recommended Operating Conditions..................... Thermal Information ................................................ Electrical Characteristics – DC Specifications ........ Electrical Characteristics – Digital Specifications ... Electrical Characteristics – AC Specifications ........ Timing Requirements – Digital Specifications......... Switching Characteristics – AC Specifications........ Typical Characteristics .......................................... 11 11 11 12 12 14 15 15 17 18 Detailed Description ............................................ 27 7.1 Overview ................................................................. 27 7.2 Functional Block Diagram ....................................... 28 7.3 7.4 7.5 7.6 8 Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Map........................................................... 29 58 62 66 Application and Implementation ........................ 83 8.1 Application Information............................................ 83 8.2 Typical Applications ............................................... 84 9 Power Supply Recommendations...................... 90 10 Layout................................................................... 91 10.1 Layout Guidelines ................................................. 91 10.2 Layout Examples................................................... 92 11 Device and Documentation Support ................. 95 11.1 11.2 11.3 11.4 11.5 11.6 Device Support...................................................... Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 95 96 96 96 96 96 12 Mechanical, Packaging, and Orderable Information ........................................................... 96 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (September 2015) to Revision E • Page Changed I(CLKVDD) Clock supply current Mode 1 max value from 95mA to 100mA .............................................................. 13 Changes from Revision C (August 2012) to Revision D Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1 • Added 196-ball 12x12mm BGA package to Description ........................................................................................................ 1 • Added additional operation requirement for SLEEP pin if SLEEP pin is set to logic HIGH before and during device power up and initialization. ..................................................................................................................................................... 7 • Added additional circuit configuration for unused terminals - IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N ..................... 9 • Added additional operation requirement for SLEEP pin if SLEEP pin is set to logic HIGH before and during device power up and initialization. ................................................................................................................................................... 10 • Changed DACCLKP/N Differential voltage TYP value from 1.0 V to 0.8 V ........................................................................ 14 • Changed the parameter name Single-Ended Swing Level to Single-Ended Input Level to better reflect the specification for minimum recommended single-ended voltage level. ................................................................................ 14 • Changed OSTRP/N Differential voltage TYP value from 1.0 V to 0.8 V ............................................................................. 14 • Changed the parameter name Single-Ended Swing Level to Single-Ended Input Level to better reflect the specification for minimum recommended single-ended voltage level. ................................................................................ 14 • Changed Standard high swing note for Electrical Characteristics – Digital Specifications .................................................. 14 • Added Minimum voltage note for Electrical Characteristics – Digital Specifications ........................................................... 14 • Added LMK0480x family to note for Timing Requirements – Digital Specifications ........................................................... 16 • Added text to Input FIFO section ......................................................................................................................................... 32 • Changed syncsel_fifoout(3:0) description in Input FIFO section to clarify the FIFO read pointer reset capture method and limitation......................................................................................................................................................................... 33 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 • Added Note to Input FIFO section ....................................................................................................................................... 33 • Added LMK0480x family to Input FIFO section ................................................................................................................... 33 • Changed text in Single Sync Source Mode to clarify the latency limitation of Single Sync Source Mode........................... 35 • Added the effect of bypassing the FIFO in the Bypass Mode section to clarify the operation of the FIFO, LVDS FRAME, and LVDS SYNC in FIFO Bypass Mode. ............................................................................................................. 35 • Added package information for LPF pin in PLL Mode section ............................................................................................. 37 • Changed table reference in FIR Filters section ................................................................................................................... 38 • Added text to Data Pattern Checker section with additional operating recommendations. ................................................ 49 • Added reference to application report in DAC3484 Alarm Monitoring section ..................................................................... 53 • Added note to Figure 80 ...................................................................................................................................................... 54 • Added Unused LVDS Port Termination section ................................................................................................................... 55 • Changed information to Multi-Device Operation: Single Sync Source mode section to clarify the latency limitation of Single Sync Source Mode. ................................................................................................................................................... 61 • Changed Figure 90 to clarify the latency limitation of Single Sync Source Mode. .............................................................. 62 • Changed the NCO setting description in the Example Start-up Sequence Section to reflect the example register writes. 64 • Added A32 to A32 for DAC3484IRKD and N9 for DAC3484IZAY in register config3 bit 0 description ............................... 70 • Changed alarm_lparity to alarm_fparity in register config7 ................................................................................................. 72 • Changed QMC offset registers to QMC correction registers in register config16 ................................................................ 74 • Added SLEEP pin information to register config27 bit 11 ................................................................................................... 77 • Changed 1.2VDIG to DIGVDD in register config27 bits 5:0................................................................................................. 77 • Changed 1.2VCLK to CLKVDD in register config27 bits 5:0................................................................................................ 77 • Added pin description for both packages in register config35 ............................................................................................. 80 • Added reference to Digital Input Timing Specifications Table in register config36 .............................................................. 80 • Added text to register config45 bit 0 description .................................................................................................................. 81 Changes from Revision B (February) to Revision C Page • Deleted TJ row from top of thermal table................................................................................................................................ 2 • Added thermal information to the Absolute Maximum Ratings table ................................................................................... 11 • Added Recommended Operating Conditions table .............................................................................................................. 11 • Deleted TJ row from top of thermal table.............................................................................................................................. 12 • Deleted OPERATING RANGE section from bottom of Electrical Characteristics – DC Specifications table ...................... 13 Changes from Revision A (July 2011) to Revision B Page • Changed the revision from A, July 2011 to B, June 2012...................................................................................................... 1 • Changed Package options in FEATURES ............................................................................................................................. 1 • Added ZAY package information to Thermal Information ...................................................................................................... 2 • Added ZAY package............................................................................................................................................................... 8 • Added ZAY pin functions ........................................................................................................................................................ 9 • Added ZAY package information to Thermal Information .................................................................................................... 12 • Added Input Common Mode max value of 1.6V .................................................................................................................. 14 • Added information to CLOCK INPUT (DACCLKP/N) in Electrical Characteristics – Digital Specifications ......................... 14 • Added information to OUTPUT STROBE (OSTRP/N) in Electrical Characteristics – Digital Specifications ....................... 14 • Changed Electrical Characteristics – AC Specifications AC Performance information........................................................ 15 • Changed Figure 21............................................................................................................................................................... 20 • Changed Figure 22............................................................................................................................................................... 20 • Changed Figure 23............................................................................................................................................................... 20 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 3 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com • Added Figure 48 ................................................................................................................................................................... 24 • Added Figure 49 ................................................................................................................................................................... 25 • Changed config 3 to config9 in Input FIFO section .............................................................................................................. 32 • Added information for double-charge-pump current to PLL MODE section......................................................................... 37 • Changed Figure 71............................................................................................................................................................... 43 • Changed +3.75 to –3.75 degrees in 1024 steps to +26.5 to –26.5 degrees in 4096 steps in GAIN AND PHASE CORRECTION section ......................................................................................................................................................... 45 • Added dual channel mode enable information to POWER-UP SEQUENCE step 6. ........................................................... 62 • Changed config1, bit 8 in Table 11....................................................................................................................................... 66 • Changed config16, bits 13:12 in Table 11............................................................................................................................ 66 • Changed register config1, bit8 from Reserved to quad_ena................................................................................................ 69 • Changed register config16, bits 13:12 from reserved to dual_ena (1:0) .............................................................................. 74 Changes from Original (March 2011) to Revision A • 4 Page Changed from PRODUCT PREVIEW to PRODUCTION DATA ............................................................................................ 1 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 5 Pin Configuration and Functions LPF PLLAVDD OSTRP OSTRN DACCLKP DACCLKN CLKVDD VFUSE SYNCP SYNCN DIGVDD IOVDD D15P D15N D14P D14N DIGVDD D13P D13N D12P D12N A44 B40 A43 B39 A42 B38 A41 B37 A40 B36 A39 B35 A38 B34 A37 C1 A1 IOUTDN AVDD IOUTDP DACVDD AVDD EXTIO C4 B33 A36 B32 A35 B31 A34 TESTMODE SLEEP DACVDD IOUTAP AVDD IOUTAN AVDD IOUTBN AVDD IOUTBP DACVDD IOUTCP AVDD IOUTCN AVDD RKD Package 88-Pin WQFN Top View B1 A2 B2 A3 B3 A4 B4 A5 B5 DAC3484 B6 88-WQFN 9mm x 9mm A6 A7 B7 A8 B8 A9 A12 B11 A13 B12 A14 B13 A15 B14 A16 B15 A17 B16 A18 B17 A19 B18 A20 B19 A21 B20 A22 B9 A10 B10 A11 A33 B30 A32 B29 A31 B28 A30 B27 A29 B26 A28 B25 A27 B24 A26 B23 A25 B22 A24 B21 A23 BIASJ RESETB TXENABLE ALARM SCLK SDENB SDIO SDO PARITYN PARITYP DIGVDD IOVDD D0N D0P D1N D1P DIGVDD D2N D2P D3N D3P C3 D11P D11N D10P D10N D9P D9N D8P D8N DATACLKP DATACLKN IOVDD FRAMEP FRAMEN D7P D7N D6P D6N D5P D5N D4P D4N C2 P0133-02 Pin Functions - WQFN PIN I/O DESCRIPTION NAME NO. AVDD A36, A37, A38, A40, A41, A42, B31 I Analog supply voltage. (3.3 V) ALARM B29 O CMOS output for ALARM condition. The ALARM output functionality is defined through the config7 register. Default polarity is active high, but can be changed to active low via config0 alarm_out_pol control bit. BIASJ A33 O Full-scale output current bias. For 30-mA full-scale output current, connect 1.28 kΩ to ground. Change the full-scale output current through coarse_dac(3:0) in config3, bit CLKVDD A4 I Internal clock buffer supply voltage. (1.2 V) It is recommended to isolate this supply from DIGVDD and DACVDD. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 5 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Pin Functions - WQFN (continued) PIN NAME NO. I/O DESCRIPTION A7, A8, B9, B10, A12, A13, A14, A15, B17, B18, B19, B20, A23, A24, B23, B24 I D[15..0]N B7, B8, A10, A11, B11, B12, B13, B14, A19, A20, A21, A22, B21, B22, A26, A27 I LVDS negative input data bits 0 through 15. (See D[15:0]P description above) DACCLKP A3 I Positive external LVPECL clock input for DAC core with a self-bias. DACCLKN B3 I Complementary external LVPECL clock input for DAC core. (see the DACCLKP description) DACVDD A35, A39, A43 I DAC core supply voltage. (1.2 V). It is recommended to isolate this supply from CLKVDD and DIGVDD. A16 I LVDS positive input data clock. Internal 100 Ω termination resistor. Input data D[15:0]P/N is latched on both edges of DATACLKP/N (Double Data Rate). D[15..0]P DATACLKP DATACLKN DIGVDD EXTIO LVDS positive input data bits 0 through 15. Internal 100-Ω termination resistor. Data format relative to DATACLKP/N clock is Double Data Rate (DDR). D15P is most significant data bit (MSB) D0P is least significant data bit (LSB) The order of the bus can be reversed via config2 revbus bit. B15 I LVDS negative input data clock. (See DATACLKP description) A6, A9, A25, A28 I Digital supply voltage. (1.2 V). It is recommended to isolate this supply from CLKVDD and DACVDD. A34 I/O Used as external reference input when internal reference is disabled through config27 extref_ena = 1b. Used as internal reference output when config27 extref_ena = 0b (default). Requires a 0.1-µF decoupling capacitor to AGND when used as reference output. FRAMEP B16 I LVDS frame indicator positive input. Internal 100-Ω termination resistor. The main functions of this input are to reset the FIFO pointer or to be used as a syncing source. These two functions are captured with the rising edge of DATACLKP/N. The signal captured by the falling edge of DATACLKP/N can be used as a block parity bit. The FRAMEP/N signal should be edge-aligned with D[15:0]P/N. Additionally it is used to indicate the beginning of the frame. FRAMEN A18 I LVDS frame indicator negative input. (See the FRAMEP description) C1, C2, C3, C4, Thermal Pad I These pins are ground for all supplies. IOUTAP B39 O A-Channel DAC current output. Connect directly to ground if unused. IOUTAN B38 O A-Channel DAC complementary current output. Connect directly to ground if unused. IOUTBP B36 O B-Channel DAC current output. Connect directly to ground if unused. IOUTBN B37 O B-Channel DAC complementary current output. Connect directly to ground if unused. IOUTCP B35 O C-Channel DAC current output. Connect directly to ground if unused. IOUTCN B34 O C-Channel DAC complementary current output. Connect directly to ground if unused. IOUTDP B32 O D-Channel DAC current output. Connect directly to ground if unused. GND IOUTDN B33 O D-Channel DAC complementary current output. Connect directly to ground if unused. B6, A17, B25 I Supply voltage for all digital I/O. (3.3 V) LPF A1 I/O OSTRP A2 I LVPECL output strobe positive input. This positive/negative pair is captured with the rising edge of DACCLKP/N. It is used for multiple DAC synchronization. If unused it can be left unconnected. OSTRN B2 I LVPECL output strobe negative input. (See the OSTRP description) PARITYP B26 I Optional LVDS positive input parity bit. The PARITYP/N LVDS pair has an internal 100 Ω termination resistor. If unused it can be left unconnected. PARITYN A29 I Optional LVDS negative input parity bit. PLLAVDD B1 I PLL analog supply voltage. (3.3 V) IOVDD 6 PLL loop filter connection. If not using the clock multiplying PLL, the LPF pin can be left unconnected. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Pin Functions - WQFN (continued) PIN I/O DESCRIPTION NAME NO. SCLK A31 I Serial interface clock. Internal pull-down. SDENB B28 I Active low serial data enable, always an input to the DAC3484. Internal pull-up. SDIO A30 I/O Serial interface data. Bi-directional in 3-pin mode (default) and uni-directional 4-pin mode. Internal pull-down. SDO B27 O Uni-directional serial interface data in 4-pin mode. The SDO pin is tri-stated in 3-pin interface mode (default). SLEEP B40 I Active high asynchronous hardware power-down input. Internal pull-down. If SLEEP pin is set to logic HIGH before and during device power-up and initialization, the fuse_sleep bit in register 0x1B, bit 11 must be written after register 0x23 during device initialization register setup. SYNCP A5 I Optional LVDS SYNC positive input. The SYNCP/N LVDS pair has an internal 100-Ω termination resistor. If unused it can be left unconnected. SYNCN B5 I Optional LVDS SYNC negative input. RESETB B30 I Active low input for chip RESET, which resets all the programming registers to their default state. Internal pull-up. TXENABLE A32 I Transmit enable active high input. Internal pull-down. To enable analog output data transmission, set sif_txenable in register config3 to 1b or pull CMOS TXENABLE pin to high. To disable analog output, set sif_txenable to 0b and pull CMOS TXENABLE pin to low. The DAC output is forced to midscale. TESTMODE A44 I This pin is used for factory testing. Internal pull-down. Leave unconnected for normal operation. VFUSE B4 I Digital supply voltage. This supply pin is also used for factory fuse programming. Connect to DACVDD for normal operation. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 7 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com ZAY Package 196-Pin NFBGA Top View A B C D E F G H J K L M N P 14 GND IOUT AP IOUT AN GND IOUT BN IOUT BP GND GND IOUT CP IOUT CN GND IOUT DN IOUT DP GND 13 GND GND GND GND GND GND GND GND GND GND GND GND GND GND 12 DAC CLKP GND CLK VDD LPF GND GND EXTIO BIASJ GND N/C N/C GND ALARM SDO 11 DAC CLKN GND PLL AVDD PLL AVDD AVDD AVDD AVDD AVDD AVDD AVDD N/C GND N/C SDIO 10 GND GND GND AVDD DAC VDD DAC VDD DAC VDD DAC VDD DAC VDD DAC VDD AVDD GND RESET SDENB B 9 OS TRP OS TRN GND DAC VDD DAC VDD GND GND GND GND DAC VDD DAC VDD GND TX SCLK ENABLE GND GND GND GND GND GND GND GND GND GND N/C N/C 8 TEST SLEEP MODE 7 N/C N/C GND VFUSE DIG VDD GND GND GND GND DIG VDD N/C GND N/C N/C 6 N/C N/C GND IO VDD DIG VDD GND GND GND GND DIG VDD IO VDD GND N/C N/C GND IO VDD DIG VDD DIG VDD IO VDD IO VDD DIG VDD DIG VDD IO VDD GND 5 SYNCP SYNCN PARITY PARITY P N 4 D15P D15N N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C D0P D0N 3 D14P D14N N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C D1P D1N 2 D13P D13N D11P D10P D9P D8P DATA FRAME CLKP P D7P D6P D5P D4P D2P D2N 1 D12P D12N D11N D10N D9N D8N DATA FRAME CLKN N D7N D6N D5N D4N D3P D3N DAC Output Data Input 3.3V Supply Clock Input CMOS Pins 1.2V Supply (except for IOVDD2) Sync/Parity Input N/C Ground P0134-02 8 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Pin Functions - NFBGA PIN I/O DESCRIPTION NAME NO. AVDD D10, E11, F11, G11, H11, J11, K11, L10 I Analog supply voltage. (3.3 V) ALARM N12 O CMOS output for ALARM condition. The ALARM output functionality is defined through the config7 register. Default polarity is active low, but can be changed to active high via config0 alarm_out_pol control bit. BIASJ H12 O Full-scale output current bias. For 30-mA full-scale output current, connect 1.28 kΩ to ground. Change the full-scale output current through coarse_dac(3:0) in config3, bit CLKVDD C12 I Internal clock buffer supply voltage. (1.2 V) It is recommended to isolate this supply from DIGVDD and DACVDD. D[15..0]P N4, N3, N2, N1, M2, L2, K2, J2, F2, E2, D2, C2, A1, A2, A3, A4 LVDS positive input data bits 0 through 15. Internal 100-Ω termination resistor. Data format relative to DATACLKP/N clock is Double Data Rate (DDR). I D15P is most significant data bit (MSB) D0P is least significant data bit (LSB) The order of the bus can be reversed via config2 revbus bit. D[15..0]N P4, P3, P2, P1, M1, L1, K1, J1, F1, E1, D1, C1, B1, B2, B3, B4 I LVDS negative input data bits 0 through 15. (See D[15:0]P description above) DACCLKP A12 I Positive external LVPECL clock input for DAC core with a self-bias. DACCLKN A11 I Complementary external LVPECL clock input for DAC core. (see the DACCLKP description) DACVDD D9, E9, E10, F10, G10, H10, J10, K9, K10, L9 I DAC core supply voltage. (1.2 V). It is recommended to isolate this supply from CLKVDD and DIGVDD. DATACLKP G2 I LVDS positive input data clock. Internal 100-Ω termination resistor. Input data D[15:0]P/N is latched on both edges of DATACLKP/N (Double Data Rate). DATACLKN G1 I LVDS negative input data clock. (See DATACLKP description) E5, E6, E7, F5, J5, K5, K6, K7 I Digital supply voltage. (1.2 V). It is recommended to isolate this supply from CLKVDD and DACVDD. DIGVDD EXTIO G12 I/O Used as external reference input when internal reference is disabled through config27 extref_ena = 1b. Used as internal reference output when config27 extref_ena = 0b (default). Requires a 0.1-µF decoupling capacitor to AGND when used as reference output. FRAMEP H2 I LVDS frame indicator positive input. Internal 100-Ω termination resistor. The main functions of this input are to reset the FIFO pointer or to be used as a syncing source. These two functions are captured with the rising edge of DATACLKP/N. The signal captured by the falling edge of DATACLKP/N can be used as a block parity bit. The FRAMEP/N signal should be edge-aligned with D[15:0]P/N. Additionally it is used to indicate the beginning of the frame. FRAMEN H1 I LVDS frame indicator negative input. (See the FRAMEP description) A10, A13, A14, B10, B11, B12, B13, C5, C6, C7, C8, C9, C10, C13, D8, D13, D14, E8, E12, E13, F6, F7, F8, F9, F12, F13, G6, G7, G8, G9, G13, G14, H6, H7, H8, H9, H13, H14, J6, J7, J8, J9, J12, J13, K8, K13, L8, L13, L14, M5, M6, M7, M8, M9, M10, M11, M12, M13, N13, P13, P14 I These pins are ground for all supplies. IOUTAP B14 O A-Channel DAC current output. Connect directly to ground if unused. IOUTAN C14 O A-Channel DAC complementary current output. Connect directly to ground if unused. IOUTBP F14 O B-Channel DAC current output. Connect directly to ground if unused. IOUTBN E14 O B-Channel DAC complementary current output. Connect directly to ground if unused. IOUTCP J14 O C-Channel DAC current output. Connect directly to ground if unused. GND Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 9 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Pin Functions - NFBGA (continued) PIN NAME NO. I/O DESCRIPTION IOUTCN K14 O C-Channel DAC complementary current output. Connect directly to ground if unused. IOUTDP N14 O D-Channel DAC current output. Connect directly to ground if unused. IOUTDN M14 O D-Channel DAC complementary current output. Connect directly to ground if unused. D5, D6, G5, H5, L5, L6 I Supply voltage for all digital I/O. (3.3 V) D12 I PLL loop filter connection. If not using the clock multiplying PLL, the LPF pin can be left unconnected. OSTRP A9 I LVPECL output strobe positive input. This positive/negative pair is captured with the rising edge of DACCLKP/N. It is used for multiple DAC synchronization. If unused it can be left unconnected. OSTRN B9 I LVPECL output strobe negative input. (See the OSTRP description) PARITYP N5 I Optional LVDS positive input parity bit. The PARITYP/N LVDS pair has an internal 100-Ω termination resistor. If unused it can be left unconnected. PARITYN P5 I Optional LVDS negative input parity bit. PLLAVDD C11, D11 I PLL analog supply voltage. (3.3 V) SCLK P9 I Serial interface clock. Internal pull-down. SDENB P10 I Active low serial data enable, always an input to the DAC3484. Internal pull-up. SDIO P11 I/O Serial interface data. Bi-directional in 3-pin mode (default) and 4-pin mode. Internal pulldown. SDO P12 O Uni-directional serial interface data in 4-pin mode. The SDO pin is three-stated in 3-pin interface mode (default). IOVDD LPF SLEEP B8 I Active high asynchronous hardware power-down input. Internal pull-down. If SLEEP pin is set to logic HIGH before and during device power-up and initialization, the fuse_sleep bit in register 0x1B, bit 11 must be written after register 0x23 during device initialization register setup. SYNCP A5 I Optional LVDS SYNC positive input. The SYNCP/N LVDS pair has an internal 100-Ω termination resistor. If unused it can be left unconnected. SYNCN B5 I LVDS SYNC negative input. RESETB N10 I Active low input for chip RESET, which resets all the programming registers to their default state. Internal pull-up. TXENABLE N9 I Transmit enable active high input. Internal pull-down. To enable analog output data transmission, set sif_txenable in register config3 to 1b or pull CMOS TXENABLE pin to high. To disable analog output, set sif_txenable to 0b and pull CMOS TXENABLE pin to low. The DAC output is forced to midscale. TESTMODE A8 O This pin is used for factory testing. Internal pull-down. Leave unconnected for normal operation. VFUSE D7 I Digital supply voltage. This supply pin is also used for factory fuse programming. Connect to DACVDD for normal operation. 10 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT DACVDD, DIGVDD, CLKVDD –0.5 1.5 V VFUSE –0.5 1.5 V IOVDD –0.5 4 V AVDD, PLLAVDD –0.5 4 V D[15..0]P/N, DATACLKP/N, FRAMEP/N, PARITYP/N, SYNCP/N –0.5 IOVDD + 0.5 V DACCLKP/N, OSTRP/N –0.5 CLKVDD + 0.5 V ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TESTMODE, TXENABLE –0.5 IOVDD + 0.5 V IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N –1.0 AVDD + 0.5 V EXTIO, BIASJ –0.5 AVDD + 0.5 V LPF 0.5 PLLAVDD+0.5V V Peak input current (any input) 20 mA Peak total input current (all inputs) –30 mA 85 °C 150 °C 150 °C Supply voltage range (2) Pin voltage range (2) Operating free-air temperature range, TA: DAC3484 –40 Absolute maximum junction temperature, TJ Storage temperature range (1) (2) –65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Measured with respect to GND. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN TJ TA (1) NOM Recommended operating junction temperature MAX 105 Maximum rated operating junction temperature (1) 125 Recommended free-air temperature –40 25 85 UNIT °C °C Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 11 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 6.4 Thermal Information DAC3484 THERMAL METRIC (1) RKD (WQFN-MR) ZAY (NFBGA) 88 PINS 196 BALLS UNIT RθJA Junction-to-ambient thermal resistance 22.1 37.6 °C/W RθJCtop Junction-to-case (top) thermal resistance 7.1 6.8 °C/W RθJCbot Junction-to-case (bottom) thermal resistance 0.6 N/A °C/W θJB Junction-to-board thermal resistance 4.7 16.8 °C/W ψJT Junction-to-top characterization parameter 0.1 0.2 °C/W ψJB Junction-to-board characterization parameter 4.6 16.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). 6.5 Electrical Characteristics – DC Specifications (1) over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted) PARAMETER TEST CONDITIONS Resolution MIN TYP MAX 16 UNIT Bits DC ACCURACY DNL Differential nonlinearity INL Integral nonlinearity 1 LSB = IOUTFS/216 ±2 LSB ±4 LSB ANALOG OUTPUT Coarse gain linearity Offset error Gain error Gain mismatch ±0.04 LSB ±0.001 %FSR With external reference ±2 %FSR With internal reference ±2 %FSR With internal reference ±2 %FSR Mid code offset Full scale output current 10 Output compliance range 20 –0.5 Output resistance Output capacitance 30 0.6 mA V 300 kΩ 5 pF REFERENCE OUTPUT VREF Reference output voltage 1.2 V Reference output current (2) 100 nA REFERENCE INPUT VEXTIO Input voltage range Input resistance External Reference Mode 0.6 1.2 1.25 V 1 MΩ Small signal bandwidth 472 kHz Input capacitance 100 pF ±1 ppm/°C with external reference ±15 ppm/°C with internal reference ±30 ppm/°C ±8 ppm/°C TEMPERATURE COEFFICIENTS Offset drift Gain drift Reference voltage drift (1) (2) 12 Measured differentially across IOUTP/N with 25 Ω each to GND. Use an external buffer amplifier with high impedance input to drive any external load. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Electrical Characteristics – DC Specifications(1) (continued) over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted) PARAMETER POWER SUPPLY PSRR TEST CONDITIONS MIN TYP MAX UNIT (3) AVDD, IOVDD, PLLAVDD All Conditions 3.14 3.3 3.46 V DIGVDD All Conditions 1.14 1.2 1.32 V CLKVDD, DACVDD FDAC Sampling Rate ≤ 1.25 GSPS, PLL OFF FDAC Sampling Rate ≤ 1 GSPS, PLL ON 1.14 1.2 1.32 FDAC Sampling Rate > 1 GSPS, PLL ON 1.25 1.29 1.32 Power Supply Rejection Ratio DC tested ±0.2 V %FSR/V POWER CONSUMPTION I(AVDD) Analog supply current (4) I(DIGVDD) Digital supply current I(DACVDD) DAC supply current I(CLKVDD) Clock supply current P Power dissipation I(AVDD) Analog supply current (4) I(DIGVDD) Digital supply current I(DACVDD) DAC supply current I(CLKVDD) Clock supply current P Power dissipation I(AVDD) Analog supply current (4) I(DIGVDD) Digital supply current I(DACVDD) DAC supply current I(CLKVDD) Clock supply current P Power dissipation I(AVDD) Analog supply current (4) I(DIGVDD) Digital supply current I(DACVDD) DAC supply current I(CLKVDD) Clock supply current P Power dissipation I(AVDD) Analog supply current (4) I(DIGVDD) Digital supply current I(DACVDD) DAC supply current I(CLKVDD) Clock supply current P Power Dissipation I(AVDD) Analog supply current(4) MODE 1 fDAC = 1.25 GSPS, 4x interpolation, Mixer on, QMC on, invsinc on, PLL enabled, 20-mA FS output, IF = 200 MHz MODE 2 fDAC = 1.25 GSPS, 4x interpolation, Mixer on, QMC on, invsinc on, PLL disabled, 20-mA FS output, IF = 200 MHz MODE 3 fDAC = 625 MSPS, 2x interpolation, Mixer on, QMC on, invsinc off, PLL disabled, 20-mA FS output, IF = 200 MHz MODE 4 fDAC = 1.25 GSPS, 4x interpolation, Mixer on, QMC on, invsinc on, PLL enabled, Channels A/B/C/D output sleep, IF = 200 MHz, Mode 5 Power-Down mode: No clock, DAC on sleep mode (clock receiver sleep), Channels A/B/C/D output sleep, static data pattern Mode 6 fDAC = 1 GSPS, 8x interpolation, Mixer off, QMC on, invsinc off, PLL enabled, 20-mA FS output, IF = 200 MHz 123 135 mA 595 650 mA 35 50 mA 90 100 mA 1270 1320 mW 107 mA 595 mA 38 mA 71 mA 1198 mW 107 mA 282 mA 20 mA 41 mA 765 mW 35 mA 595 mA 38 mA 90 mA 984 mW 20 mA 10 mA 4 mA 10 mA 95 mW 107 mA 333 mA 35 mA 60 mA I(DIGVDD) Digital supply current I(DACVDD) DAC supply current I(CLKVDD) Clock supply current P Power dissipation 867 mW I(AVDD) Analog supply current(4) 123 mA I(DIGVDD) Digital supply current 323 mA I(DACVDD) DAC supply current 23 mA I(CLKVDD) Clock supply current P Power dissipation (3) (4) Mode 7 fDAC = 737.28 MSPS, 4x interpolation, Mixer on, QMC on, invsinc off, PLL enabled, 20-mA FS output, IF = 150 MHz 69 mA 904 mW To ensure power supply accuracy and to account for power supply filter network loss at operating conditions, the use of the ATEST function in register config27 to check the internal power supply nodes is recommended. Includes AVDD, PLLAVDD, and IOVDD Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 13 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 6.6 Electrical Characteristics – Digital Specifications over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LVDS INPUTS: D[15:0]P/N, DATACLKP/N, FRAMEP/N, SYNCP/N, PARITYP/N (1) VA,B+ Logic high differential input voltage threshold VA,B– Logic low differential input voltage threshold VCOM Input Common Mode 1.0 1.2 1.6 V ZT Internal termination 85 110 135 Ω CL LVDS Input capacitance fINTERL Interleaved LVDS data transfer rate 1250 MSPS fDATA Input data rate 312.5 MSPS 200 mV –200 2 mV pF CLOCK INPUT (DACCLKP/N) Differential voltage (2) |DACCLKP - DACCLKN| 0.4 Internally biased commonmode voltage Single-ended input level (3) 0.8 V 0.2 V –0.4 V OUTPUT STROBE (OSTRP/N) Differential voltage |OSTRP – OSTRN| 0.4 Internally biased commonmode voltage Single-ended input level (3) 0.8 V 0.2 V –0.4 V CMOS INTERFACE: ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TXENABLE VIH High-level input voltage VIL Low-level input voltage IIH High-level input current -40 IIL Low-level input current -40 CI CMOS Input capacitance VOH ALARM, SDO, SDIO 2 (1) (2) (3) 14 ALARM, SDO, SDIO V 40 µA 40 µA 2 pF IOVDD – 0.2 Iload = –100 μA Iload = –2 mA VOL V 0.8 V 0.8 x IOVDD V Iload = 100 μA 0.2 V Iload = 2 mA 0.5 V See LVDS Inputs section for terminology. Standard high swing LVPECL clock signal should be applied for best performance. Indicates the minimum voltage that can be applied to the DACCLK and OSTR differential pins in single-ended fashion. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 6.7 Electrical Characteristics – AC Specifications over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG OUTPUT (1) fDAC Maximum DAC rate 1250 MSPS AC PERFORMANCE (2) Spurious free dynamic range (0 to fDAC/2) Tone at 0 dBFS SFDR Third-order two-tone intermodulation distortion Each tone at –12 dBFS IMD3 Noise Spectral Density Tone at 0dBFS NSD Adjacent channel leakage ratio, single carrier ACLR (3) Alternate channel leakage ratio, single carrier Channel Isolation (1) (2) (3) fDAC = 1.25 GSPS, fOUT = 20 MHz 82 fDAC = 1.25 GSPS, fOUT = 50 MHz 77 fDAC = 1.25 GSPS, fOUT = 70 MHz 72 fDAC = 1.25 MSPS, fOUT = 30 ± 0.5 MHz 81 fDAC = 1.25 GSPS, fOUT = 50 ± 0.5 MHz dBc 79 fDAC = 1.25 GSPS, fOUT = 100 ± 0.5 MHz 77.5 fDAC = 1.25 GSPS, fOUT = 10 MHz 160 fDAC = 1.25 GSPS, fOUT = 80 MHz 155 fDAC = 1.2288 GSPS, fOUT = 30.72 MHz 77 fDAC = 1.2288 GSPS, fOUT = 153.6 MHz 74 fDAC = 1.2288 GSPS, fOUT = 30.72 MHz 82 fDAC = 1.2288 GSPS, fOUT = 153.6 MHz 80 fDAC = 1.25 GSPS, fOUT = 10 MHz 84 dBc dBc/Hz dBc dBc Measured single ended into 50-Ω load. 4:1 transformer output termination, 50 Ω doubly terminated load. Single carrier, W-CDMA with 3.84-MHz BW, 5-MHz spacing, centered at IF, PAR = 12dB. TESTMODEL 1, 10 ms 6.8 Timing Requirements – Digital Specifications MIN NOM MAX UNIT CLOCK INPUT (DACCLKP/N) Duty cycle 40% 60% DACCLKP/N input frequency 1250 MHz fDACCLK / (8 x interp) MHz OUTPUT STROBE (OSTRP/N) fOSTR Frequency fOSTR = fDACCLK / (n x 8 x Interp) where n is any positive integer, fDACCLK is DACCLK frequency in MHz Duty cycle 50% DIGITAL INPUT TIMING SPECIFICATIONS Timing LVDS inputs: D[15:0]P/N, FRAMEP/N, SYNCP/N, PARITYP/N, double edge latching Config36 Setting ts(DATA) Setup time, D[15:0]P/N, FRAMEP/N, SYNCP/N and PARITYP/N, valid to either edge of DATACLKP/N FRAMEP/N reset and frame indicator latched on rising edge of DATACLKP/N. FRAMEP/N parity bit latched on falling edge of DATACLKP/N. datadly clkdly 0 0 150 0 1 100 0 2 50 0 3 0 0 4 -50 0 5 -100 0 6 -150 0 7 -200 1 0 200 2 0 250 3 0 300 4 0 350 5 0 400 6 0 450 7 0 500 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 ps 15 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Timing Requirements – Digital Specifications (continued) MIN NOM MAX UNIT Config36 Setting Hold time, D[15:0]P/N, FRAMEP/N, SYNCP/N and PARITYP/N, valid after either edge of DATACLKP/N th(DATA) t(FRAME_SYNC) FRAMEP/N and SYNCP/N pulse width FRAMEP/N reset and frame indicator latched on rising edge of DATACLKP/N. FRAMEP/N parity bit latched on falling edge of DATACLKP/N. datadly clkdly 0 0 350 0 1 400 0 2 450 0 3 500 0 4 550 0 5 600 0 6 650 0 7 700 1 0 300 2 0 250 3 0 200 4 0 150 5 0 100 6 0 50 7 0 fDATACLK is DATACLK frequency in MHz ps 0 1/2fDATACLK ns 0 ps 300 ps TIMING OUTPUT STROBE INPUT: DACCLKP/N rising edge LATCHING (1) ts(OSTR) Setup time, OSTRP/N valid to rising edge of DACCLKP/N th(OSTR) Hold time, OSTRP/N valid after rising edge of DACCLKP/N TIMING SYNC INPUT: DACCLKP/N rising edge LATCHING (2) ts(SYNC_PLL) Setup time, SYNCP/N valid to rising edge of DACCLKP/N 200 ps th(SYNC_PLL) Hold time, SYNCP/N valid after rising edge of DACCLKP/N 300 ps TIMING SERIAL PORT ts(SDENB) Setup time, SDENB to rising edge of SCLK 20 ns ts(SDIO) Setup time, SDIO valid to rising edge of SCLK 10 ns th(SDIO) Hold time, SDIO valid to rising edge of SCLK 5 ns 1 µs Register config6 read (temperature sensor read) t(SCLK) Period of SCLK td(Data) Data output delay after falling edge of SCLK 10 ns tRESET Minimum RESETB pulse width 25 ns (1) (2) 16 All other registers 100 ns OSTR is required in Dual Sync Sources mode. In order to minimize the skew it is recommended to use the same clock distribution device such as Texas Instruments CDCE62005 or LMK0480x family to provide the DACCLK and OSTR signals to all the DAC3484 devices in the system. Swap the polarity of the DACCLK outputs with respect to the OSTR ones to establish proper phase relationship. SYNC is required to synchronize the PLL circuit in multiple devices. The SYNC signal must meet the timing relationship with respect to the reference clock (DACCLKP/N) of the on-chip PLL circuit. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 6.9 Switching Characteristics – AC Specifications over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted) PARAMETER ANALOG OUTPUT ts(DAC) TEST CONDITIONS MIN TYP MAX UNIT (1) Output settling time to 0.1% Transition: Code 0x0000 to 0xFFFF DAC outputs are updated on the falling edge of DAC clock. Does not include Digital Latency (see below). 10 ns 2 ns tpd Output propagation delay tr(IOUT) Output rise time 10% to 90% 220 ps tf(IOUT) Output fall time 90% to 10% 220 ps Digital latency Power-up Time (1) No interpolation, FIFO on, Mixer off, QMC off, Inverse sinc off 128 2x Interpolation 216 4x Interpolation 376 8x Interpolation 726 16x Interpolation 1427 Fine mixer 24 QMC 32 Inverse sinc 36 DAC wake-up time IOUT current settling to 1% of IOUTFS from output sleep 2 DAC sleep time IOUT current settling to less than 1% of IOUTFS in output sleep 2 DAC clock cycles µs Measured single ended into 50-Ω load. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 17 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 6.10 Typical Characteristics All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 5 Differential Nonlinearity Error (LSB) Integral Nonlinearity Error (LSB) 5 4 3 2 1 0 −1 −2 −3 −4 −5 0 10k 20k 30k Code 40k 50k 4 3 2 1 0 −1 −2 −3 −4 −5 60k 0 Figure 1. Integral Nonlinearity Second Harmonic Distortion (dBc) SFDR (dBc) 80 70 60 50 40 0 100 200 300 400 Output Frequency (MHz) 500 50k 60k G002 0 dBFS −6 dBFS −12 dBFS 80 70 60 50 40 0 100 G003 200 300 400 Output Frequency (MHz) 500 600 G004 Figure 4. Second Harmonic Distortion vs Output Frequency Over Input Scale 100 100 0 dBFS −6 dBFS −12 dBFS 90 fDATA = 312.5 MSPS, 1x Interpolation fDATA = 312.5 MSPS, 2x Interpolation fDATA = 312.5 MSPS, 4x Interpolation fDATA = 156.25MSPS, 8x Interpolation fDATA = 78.125MSPS, 16x Interpolation 90 80 80 SFDR (dBc) Third Harmonic Distortion (dBc) 40k 90 30 600 Figure 3. SFDR vs Output Frequency Over Input Scale 70 60 70 60 50 50 40 40 0 100 200 300 400 Output Frequency (MHz) 500 600 30 0 G005 Figure 5. Third Harmonic Distortion vs Output Frequency Over Input Scale 18 30k Code 100 0 dBFS −6 dBFS −12 dBFS 90 30 20k Figure 2. Differential Nonlinearity 100 30 10k G001 100 200 300 400 Output Frequency (MHz) 500 600 G006 Figure 6. SFDR vs Output Frequency Over Interpolation Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 100 100 fDAC = 600 MSPS fDAC = 800 MSPS fDAC = 1000 MSPS fDAC = 1250 MSPS 90 80 SFDR (dBc) SFDR (dBc) 80 70 60 60 50 40 40 0 100 200 300 400 Output Frequency (MHz) 500 30 600 −10 150 200 250 300 Output Frequency (MHz) 350 400 G008 −10 −20 −30 −40 −50 −30 −40 −50 −60 −60 −70 −70 −80 −80 0 100 200 300 400 Frequency (MHz) 500 NCO Bypassed QMC Bypassed fDAC = 1250 MSPS fOUT = 70 MHz 0 Power (dBm) −20 −90 600 0 100 G009 Figure 9. Single Tone Spectral Plot 200 300 400 Frequency (MHz) 500 600 G010 Figure 10. Single Tone Spectral Plot 10 10 fDAC = 1250 MSPS fOUT = 150 MHz 0 −10 −10 −20 −20 −30 −40 −50 −30 −40 −50 −60 −60 −70 −70 −80 −80 0 100 200 300 400 Frequency (MHz) 500 fDAC = 1250 MSPS fOUT = 200 MHz 0 Power (dBm) Power (dBm) 100 10 NCO Bypassed QMC Bypassed fDAC = 1250 MSPS fOUT = 20 MHz 0 −90 50 Figure 8. SFDR vs Output Frequency Over IOUTFS 10 −90 0 G007 Figure 7. SFDR vs Output Frequency Over fDAC Power (dBm) 70 50 30 IOUTFS = 10 mA w/ 4:1 Transformer IOUTFS = 20 mA w/ 4:1 Transformer IOUTFS = 30 mA w/ 2:1 Transformer 90 −90 600 10 G011 Figure 11. Single Tone Spectral Plot 110 210 310 410 Frequency (MHz) 510 610 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 G012 Figure 12. Single Tone Spectral Plot 19 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 100 10 PLL Enabled w/ PFD of 78.125 MHz fDAC = 1250 MSPS fOUT = 200 MHz 0 −10 80 IMD3 (dBc) −20 Power (dBm) 0 dBFS −6 dBFS −12 dBFS 90 −30 −40 −50 −60 70 60 50 −70 40 −80 −90 10 110 210 310 410 Frequency (MHz) 510 30 610 100 100 90 90 80 80 70 60 fDATA = 312.5 MSPS, 1x Interpolation fDATA = 312.5 MSPS, 2x Interpolation fDATA = 312.5 MSPS, 4x Interpolation fDATA = 156.25 MSPS, 8x Interpolation fDATA = 78.125 MSPS, 16x Interpolation 40 30 0 100 200 300 400 Output Frequency (MHz) 100 200 300 400 Output Frequency (MHz) fDAC = 600 MSPS fDAC = 800 MSPS fDAC = 1000 MSPS fDAC = 1250 MSPS 60 40 500 30 600 0 100 G015 200 300 400 Output Frequency (MHz) 500 600 G016 Figure 16. IMD3 vs Output Frequency Over fDAC 0 NCO Bypassed QMC Bypassed fDAC = 1250 MSPS fOUT = 70 MHz Tone Spacing = 1 MHz −10 90 −20 80 −30 Power (dBm) IMD3 (dBc) G014 50 100 70 60 −40 −50 −60 −70 50 IOUTFS = 10 mA w/ 4:1 Transformer IOUTFS = 20 mA w/ 4:1 Transformer IOUTFS = 30 mA w/ 2:1 Transformer 40 0 50 100 150 200 250 300 Output Frequency (MHz) −80 −90 350 400 −100 65 G017 Figure 17. IMD3 vs Output Frequency Over IOUTFS 20 600 70 Figure 15. IMD3 vs Output Frequency Over Interpolation 30 500 Figure 14. IMD3 vs Output Frequency Over Input Scale IMD3 (dBc) IMD3 (dBc) Figure 13. Single Tone Spectral Plot 50 0 G013 Submit Documentation Feedback 66 67 68 69 70 71 72 Frequency (MHz) 73 74 75 G018 Figure 18. Two Tone Spectral Plot Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 170 0 fDAC = 1250 MSPS fOUT = 200 MHz Tone Spacing = 1 MHz −10 −20 160 NSD (dBc/Hz) Power (dBm) −30 −40 −50 −60 −70 150 145 135 −90 −100 195 196 197 198 199 200 201 202 203 204 205 Frequency (MHz) G019 130 Figure 19. Two Tone Spectral Plot 170 170 165 165 160 160 155 150 145 fDATA = 312.5 MSPS, 1x interpolation fDATA = 312.5 MSPS, 2x interpolation fDATA = 312.5 MSPS, 4x interpolation fDATA = 156.25 MSPS, 8x interpolation fDATA = 78.125 MSPS, 16x interpolation 140 135 0 100 200 300 400 Output Frequency (MHz) 200 300 400 Output Frequency (dB) 500 600 G020 fDAC = 600 MSPS fDAC = 800 MSPS fDAC = 1000 MSPS fDAC = 1250 MSPS 150 145 140 135 500 130 600 0 100 G021 200 300 Output Frequency (MHz) 400 500 G022 Figure 22. NSD vs Output Frequency Over fDAC 170 170 Iout FS = 10 mA, 4:1 transformer Iout FS = 20 mA, 4:1 transformer Iout FS = 30 mA, 2:1 transformer 165 160 155 150 145 155 150 145 140 140 135 135 0 100 200 300 Output Frequency (MHz) 400 PLL Bypassed PLL Enabled w/ PFD of 78.125 MHz 165 NSD (dBc/Hz) 160 NSD (dBc/Hz) 100 155 Figure 21. NSD vs Output Frequency Over Interpolation 130 0 Figure 20. NSD vs Output Frequency Over Input Scale NSD (dBc/Hz) NSD (dBc/Hz) 155 140 −80 130 0dBFS −6dBFS −12dBFS 165 500 130 0 G023 Figure 23. NSD vs Output Frequency Over IOUTFS 100 200 300 400 Output Frequency (MHz) 500 600 G024 Figure 24. NSD vs Output Frequency Over Clocking Options Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 21 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 85 85 PLL Disabled PLL Enabled 75 70 65 60 55 PLL Disabled PLL Enabled 80 ACLR (dBc) ACLR (dBc) 80 75 70 65 60 0 100 200 300 400 Output Frequency (MHz) 500 600 55 0 100 G025 Figure 25. Single Carrier WCDMA ACLR (Adjacent) vs Output Frequency Over Clocking Options 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 70 MHz 200 300 400 Output Frequency (MHz) 500 600 G026 Figure 26. Single Carrier WCDMA ACLR (Alternate) vs Output Frequency Over Clocking Options 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 120 MHz G027 Figure 27. Single Carrier W-CDMA Test Model 1 G028 Figure 28. Single Carrier W-CDMA Test Model 1 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 70 MHz 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 200 MHz G029 G030 Figure 29. Single Carrier W-CDMA Test Model 1 22 Figure 30. Four Carrier W-CDMA Test Model 1 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 120 MHz 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 200 MHz G031 Figure 31. Four Carrier W-CDMA Test Model 1 G032 Figure 32. Four Carrier W-CDMA Test Model 1 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 140 MHz 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 240 MHz G033 G034 Figure 33. 10-MHz Single Carrier LTE Test Model 3.1 Figure 34. 10-MHz Single Carrier LTE Test Model 3.1 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 140 MHz 4x Interpolation, 0 dBFS fDAC = 1228.8 MSPS fOUT = 240 MHz G035 Figure 35. 20-MHz Single Carrier LTE Test Model 3.1 G036 Figure 36. 20-MHz Single Carrier LTE Test Model 3.1 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 23 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 1400 1400 Power Consumption (mW) 1200 1000 800 600 400 Bandbase Input = 5 MHz NCO Disabled QMC Disabled CMIX Disabled 200 0 0 200 400 600 800 fDAC (MSPS) 1000 1000 800 600 400 0 1200 600 800 fDAC (MSPS) 1x Interpolation 2x Interpolation 4x Interpolation 8x Interpolation 16x Interpolation 500 DIGVDD Current (mA) Power Consumption (mW) 400 1000 1200 G038 600 120 100 80 60 40 400 Bandbase Input = 5 MHz NCO Disabled QMC Disabled CMIX Disabled 300 200 100 20 0 200 400 600 800 fDAC (MSPS) 1000 0 1200 0 200 400 G039 Figure 39. Power Consumption vs fDAC Over Digital Processing Functions 600 800 fDAC (MSPS) 1000 1200 G040 Figure 40. DIGVDD Current vs fDAC Over Interpolation 600 160 1x Interpolation 2x Interpolation 4x Interpolation 8x Interpolation 16x Interpolation 400 300 200 Bandbase Input = 0 MHz NCO Enabled w/ 5 MHz Mixing QMC Enabled 100 0 200 400 NCO Enabled QMC Enabled 140 DIGVDD Current (mA) 500 DIGVDD Current (mA) 200 Figure 38. Power Consumption vs fDAC Over Interpolation NCO Enabled QMC Enabled 140 600 800 fDAC (MSPS) 1000 120 100 80 60 40 20 0 1200 0 G041 Figure 41. DIGVDD Current vs fDAC Over Interpolation 24 0 G037 160 0 Bandbase Input = 0 MHz NCO Enabled w/ 5 MHz Mixing QMC Enabled 200 Figure 37. Power Consumption vs fDAC Over Interpolation 0 1x Interpolation 2x Interpolation 4x Interpolation 8x Interpolation 16x Interpolation 1200 Power Consumption (mW) 1x Interpolation 2x Interpolation 4x Interpolation 8x Interpolation 16x Interpolation 200 400 600 800 fDAC (MSPS) 1000 1200 G042 Figure 42. DIGVDD Current vs fDAC Over Digital Processing Functions Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Typical Characteristics (continued) 40 100 35 90 CLKVDD Current (mA) DACVDD Current (mA) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 30 25 20 15 10 5 0 80 70 60 50 40 30 20 10 0 200 400 600 800 fDAC (MSPS) 1000 0 1200 0 200 140 110 120 100 100 80 60 40 20 200 400 600 800 fDAC (MSPS) 1000 G044 80 70 60 50 Channel A/B Off Channel C/D Active 0 100 G045 200 300 400 Output Frequency (MHz) 500 600 G046 Figure 46. Channel Isolation vs Output Frequency 110 100 Channel C Channel D 100 BGA MrQFN 90 90 80 SFDR (dBc) Interference Level (dBc) 1200 90 30 1200 Figure 45. AVDD Current vs fDAC 80 70 60 70 60 50 50 40 Channel C/D Off Channel A/B Active 40 30 1000 Channel A Channel B 40 0 600 800 fDAC (MSPS) Figure 44. CLKVDD Current vs fDAC Interference Level (dBc) AVDD Current (mA) Figure 43. DACVDD Current vs fDAC 0 400 G043 0 100 200 300 400 Output Frequency (MHz) 500 600 30 0 G047 Figure 47. Channel Isolation vs Output Frequency 100 200 300 400 Output Frequency (dB) 500 Product Folder Links: DAC3484 G048 Figure 48. SFDR vs Output Frequency Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated 600 25 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) All plots are at 25°C, nominal supply voltage, fDAC = 1250 MSPS, 4x interpolation, NCO enabled, Mixer Gain disabled, QMC enabled with gain set at 1446 for both I/Q channels, 0 dBFS digital input, 20-mA full-scale output current with 4:1 transformer (unless otherwise noted) 100 BGA MrQFN 90 IMD3 (dBc) 80 70 60 50 40 30 0 100 200 300 400 Output Frequency (dB) 500 600 G049 Figure 49. IMD3 vs Output Frequency 26 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 7 Detailed Description 7.1 Overview The DAC3484 includes a quad-channel, 16-bit digital-to-analog converter (DAC) with up to 1.25 GSPS sample rate, a 16-bit LVDS data bus with on-chip termination, FIFO, data pattern checker, and parity test. The device includes 2x to 16x digital interpolation filters with over 90dB of stop-band attenuation, reconstruction filters, independent complex mixers, a low jitter clock multiplier, and digital Quadrature Modulator Correction (QMC). Full synchronization of multiple devices is possible with the DAC3484. It is an ideal device for next generation communication systems. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 27 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com FRAMEN De-interleave 8 Sample FIFO 100 16 11 taps x2 x2 x2 x2 LVDS AVDD DACVDD AB-QMC Gain and Phase 11 taps BIASJ 16-b DACA IOUTAP IOUTAN A-Group Delay 9 taps B-Group Delay x sin(x) 16-b DACB IOUTBP IOUTBN QMC B-offset CMIX Control (±n*Fs/8) 2x–16x Interpolation FIR0 FIR1 FIR2 DAC Gain FIR3 16 x2 x2 x2 QMC C-offset FIR4 x2 CD-Channel 59 taps 23 taps 11 taps 11 taps x2 x2 x2 x2 16 Frame Strobe and Optional Parity cos x sin(x) 16-b DACC IOUTCP IOUTCN C-Group Delay 9 taps D-Group Delay x sin(x) 16-b DACD IOUTDP IOUTDN QMC D-offset sin CD 32-Bit NCO OSTRP Temp Sensor Control Interface LVPECL TESTMODE ALARM SLEEP RESETB TXENABLE SCLK SDIO SDENB SDO OSTRN AVDD IOVDD FRAMEP • • • 23 taps x sin(x) GND SYNCN x2 59 taps LVDS 100 SYNCP LVDS 100 D0N FIR4 CD-QMC Gain and Phase 100 • • • • • • D0P x2 EXTIO QMC A-offset sin FIR3 AB-Channel LVDS Programmable Delay D15N x2 16 Pattern Test D15P FIR2 FIR1 LVDS 100 PARITYN VFUSE cos FIR0 x2 PARITYP 1.2-V Reference AB 32-Bit NCO Programmable Delay Complex Mixer (FMIX or CMIX) DATACLKN Clock Distribution LVDS 100 DATACLKP DIGVDD Low Jitter PLL LVPECL DACCLKN Complex Mixer (FMIX or CMIX) DACCLKP LPF CLKVDD PLLAVDD 7.2 Functional Block Diagram B0464-01 28 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 7.3 Feature Description 7.3.1 Serial Interface The serial port of the DAC3484 is a flexible serial interface which communicates with industry standard microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the operating modes of DAC3484. It is compatible with most synchronous transfer formats and can be configured as a 3 or 4 pin interface by sif4_ena in register config2. In both configurations, SCLK is the serial interface input clock and SDENB is serial interface enable. For 3 pin configuration, SDIO is a bidirectional pin for both data in and data out. For 4 pin configuration, SDIO is data in only and SDO is data out only. Data is input into the device with the rising edge of SCLK. Data is output from the device on the falling edge of SCLK. Each read/write operation is framed by signal SDENB (Serial Data Enable Bar) asserted low. The first frame byte is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit address to be accessed. Table 1 indicates the function of each bit in the instruction cycle and is followed by a detailed description of each bit. The data transfer cycle consists of two bytes. Table 1. Instruction Byte of the Serial Interface BIT 7 (MSB) 6 5 4 3 2 1 0 (LSB) Description R/W A6 A5 A4 A3 A2 A1 A0 R/W Identifies the following data transfer cycle as a read or write operation. A high indicates a read operation from DAC3484 and a low indicates a write operation to DAC3484. [A6 : A0] Identifies the address of the register to be accessed during the read or write operation. Figure 50 shows the serial interface timing diagram for a DAC3484 write operation. SCLK is the serial interface clock input to DAC3484. Serial data enable SDENB is an active low input to DAC3484. SDIO is serial data in. Input data to DAC3484 is clocked on the rising edges of SCLK. Instruction Cycle Data Transfer Cycle SDENB SCLK SDIO rwb A6 A5 A4 tS(SDENB) A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 t(SCLK) SDENB SCLK SDIO tH(SDIO) tS(SDIO) T0521-01 Figure 50. Serial Interface Write Timing Diagram Figure 51 shows the serial interface timing diagram for a DAC3484 read operation. SCLK is the serial interface clock input to DAC3484. Serial data enable SDENB is an active low input to DAC3484. SDIO is serial data in during the instruction cycle. In 3 pin configuration, SDIO is data out from the DAC3484 during the data transfer cycle, while SDO is in a high-impedance state. In 4 pin configuration, SDO is data out from the DAC3484 during the data transfer cycle. At the end of the data transfer, SDIO and SDO will output low on the final falling edge of SCLK until the rising edge of SDENB when they will 3-state. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 29 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Instruction Cycle Data Transfer Cycle SDENB SCLK SDIO rwb A6 A5 A4 A3 A2 A1 SDO A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 SDENB SCLK SDIO SDO Data n Data n – 1 td(Data) T0522-01 Figure 51. Serial Interface Read Timing Diagram 7.3.2 Data Interface The DAC3484 has a 16-bit LVDS bus that accepts quad, 16-bit data either in word-wide or dual byte-wide formats. The quad, 16-bit data can be input to the device using either a single-bus, 16-bit interface or a dual-bus, 8-bit interface. The selection between the two modes is done through 16bit_in in the config2 register. The LVDS bus inputs in each mode are shown in Table 2. Table 2. LVDS Bus Input Assignment INPUT MODE PINS Word-wide D[15..0] → Data for paths A, B, C and D Byte-wide D[15..8] → Data for paths A and B D[7..0] → Data for paths C and D Data is sampled by the LVDS double data rate (DDR) clock DATACLK. Setup and hold requirements must be met for proper sampling. For both input bus modes, a sync signal, either FRAME or SYNC, can sync the FIFO read and/or write pointers. In byte-wide mode the sync source is needed to establish the correct sample boundaries. The sync signal, either FRAME or SYNC, can be either a pulse or a periodic signal where the sync period corresponds to multiples of 8 samples. FRAME or SYNC is sampled by a rising edge in DATACLK. The pulsewidth t(FRAME_SYNC) needs to be at least equal to 1/2 of the DATACLK period. For both input bus mode, the value in FRAME sampled by the next falling edge in DATACLK can be used as a block parity value. This feature is enabled by setting frame_parity_ena in register config1 to 1b. Refer to Parity Check Test section for more detail 7.3.2.1 Word-Wide Format The single-bus, 16-bit interface is selected by setting 16bit_in to 1b in the config2 register. In this mode the 16-bit data for channels A, B, C and D is input word-wide interleaved in the form A0, B0, C0, D0, A1… into the D[15:0]P/N LVDS bus. Data into the DAC3484 is formatted according to the diagram shown in Figure 52 where index 0 is the data LSB and index 15 is the data MSB. 30 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 SAMPLE 0 D[15:0]P/N A0 [15:0] B0 [15:0] C0 [15:0] SAMPLE 1 D0 [15:0] A1 [15:0] B1 [15:0] C1 [15:0] D1 [15:0] DATACLKP/N (DDR) t(FRAME_SYNC) Sync Option #1 Optional Parity Bit FRAMEP/N t(FRAME_SYNC) Sync Option #2 SYNCP/N T0533-01 Figure 52. Word-wide Data Transmission Format 7.3.2.2 Byte-Wide Format The dual-bus, 8-bit interface is selected by setting 16bit_in to 0b in the config2 register. In this mode the 16-bit data for channels A and B is interleaved in the form A0[15:8], A0[7:0], B0[15:8], B0[7:0], A1[15:8]… into the D[15:8]P/N LVDS inputs. Similarly data for channels C and D is interleaved into the D[7:0]P/N LVDS inputs. Data into the DAC3484 is formatted according to the diagram shown in Figure 53 where index 0 is the data LSB and index 15 is the data MSB. SAMPLE 0 SAMPLE 1 D[15:8]P/N A0 [15:8] A0 [7:0] B0 [15:8] B0 [7:0] A1 [15:8] A1 [7:0] B1 [15:8] B1 [7:0] D[7:0]P/N C0 [15:8] C0 [7:0] D0 [15:8] D0 [7:0] C1 [15:8] C1 [7:0] D1 [15:8] D1 [7:0] DATACLKP/N (DDR) t(FRAME_SYNC) Sync Option #1 FRAMEP/N Optional Parity Bit t(FRAME_SYNC) Sync Option #2 SYNCP/N T0534-01 Figure 53. Byte-wide Data Transmission Format 7.3.3 Input FIFO The DAC3484 includes a 4-channel, 16-bits wide, and 8-samples deep input FIFO which acts as an elastic buffer. The purpose of the FIFO is to absorb any timing variations between the input data and the internal DAC data rate clock such as the ones resulting from clock-to-data variations from the data source. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 31 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Figure 54 shows a simplified block diagram of the FIFO. The following sections provide brief overviews of the FIFO, device synchronization, and device clocking. For more details of the topics, please refer to application note SLAA584. Clock Handoff Initial Position D[15:0] B-Data, 16-Bit Frame Align C-Data, 16-Bit D-Data, 16-Bit 0 ... 7 Write Pointer A-Data, 16-Bit 16-Bit Output Side Clocked by FIFO Out Clock (DACCLK/Interpolation Factor) FIFO: 4 x 16-Bits Wide 8-Samples deep 0 Sample 0 A0[15:0], B0[15:0], C0[15:0], D0[15:0] 0 1 Sample 0 A1[15:0], B1[15:0], C1[15:0], D1[15:0] 1 2 Sample 0 A2[15:0], B2[15:0], C2[15:0], D2[15:0] 2 3 Sample 0 A3[15:0], B3[15:0], C3[15:0], D3[15:0] 3 4 Sample 0 A4[15:0], B4[15:0], C4[15:0], D4[15:0] 4 5 Sample 0 A5[15:0], B5[15:0], C5[15:0], D5[15:0] 5 6 Sample 0 A6[15:0], B6[15:0], C6[15:0], D6[15:0] 6 7 Sample 0 A7[15:0], B7[15:0], C7[15:0], D7[15:0] 7 64-Bit 16-Bit FRAME/ SYNC Write Pointer Reset FIFO Reset 16-Bit 64-Bit Initial Position 0 ... 7 Read Pointer Input Side Clocked by DATACLK x2 Two Cycles to Capture 64 Bits (16 for Each Channel) 16-Bit 16-Bit 16-Bit FIFO A Output FIFO B Output FIFO C Output FIFO D Output Read Pointer Reset fifo_offset(2:0) S M syncsel_fifoout OSTR syncsel_fifoin S (Single Sync Source Mode): Reset handoff from input side to output side M (Dual Sync Sources Mode): OSTR resets read pointer. Allows Multi-DAC synchronization B0465-01 Figure 54. DAC3484 FIFO Block Diagram Data is written to the device 16-bits at a time on the rising and falling edges of DATACLK. In order to form a complete 64-bit wide sample (16-bit A-data, 16-bit B-data, 16-bit C-data, and 16-bit D-data) two DATACLK periods are required. Each 64-bit wide sample is written into the FIFO at the address indicated by the write pointer. Similarly, data from the FIFO is read by the FIFO Out Clock 64-bits at a time from the address indicated by the read pointer. The FIFO Out Clock is generated internally from the DACCLK signal and its rate is equal to DACCLK/Interpolation. Each time a FIFO write or FIFO read is done the corresponding pointer moves to the next address. The reset position for the FIFO read and write pointers is set by default to addresses 0 and 4 as shown in Figure 54. This offset gives optimal margin within the FIFO. The default read pointer location can be set to another value using fifo_offset(2:0) in register config9 (address 4 by default). Under normal conditions data is written-to and read-from the FIFO at the same rate and consequently the write and read pointer gap remains constant. If the FIFO write and read rates are different, the corresponding pointers will be cycling at different speeds which could result in pointer collision. Under this condition the FIFO attempts to read and write data from the same address at the same time which will result in errors and thus must be avoided. The write pointer sync source is selected by syncsel_fifoin(3:0) in register config32. In most applications either FRAME or SYNC are used to reset the write pointer. Unlike DATA, the sync signal is latched only on the rising edges of DATACLK. A rising edge on the sync signal source causes the pointer to return to its original position. 32 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Similarly, the read pointer sync source is selected by syncsel_fifoout(3:0). The write pointer sync source can be set to reset the read pointer as well. In this case, FIFO Out clock will recapture the write pointer sync signal to reset the read pointer. This clock domain transfer (DATACLK to FIFO Out Clock) results in phase ambiguity of the reset signal, and will create latency variation based on the capture edge of the FIFO Out Clock. Since the reset signal also synchronizes the clock divider circuit for the FIFO Out Clock generation, the latency variation also includes the capture edge of the DACCLK cycle in the clock divider stage. Ultimately, the variation in capture edge of both the FIFO Out Clock and the DACCLK limits the precise control of the output timing latency. The full latency control of the DAC will be difficult and is not recommended in this setup. NOTE For full latency control of the DAC, refer to the Dual Sync Source mode section of the data sheet. To alleviate this, the device offers the alternative of resetting the FIFO read pointer independently of the write pointer by using the OSTR signal. The OSTR signal is sampled by DACCLK and must satisfy the timing requirements in the specifications table. In order to minimize the skew it is recommended to use the same clock distribution device such as Texas Instruments CDCE62005 or LMK0480x family to provide the DACCLK and OSTR signals to all the DAC3484 devices in the system. Swapping the polarity of the DACCLK outputs with respect to the OSTR ones establishes proper phase relationship. The FIFO pointers reset procedure can be done periodically or only once during initialization as the pointers automatically return to the initial position when the FIFO has been filled. To reset the FIFO periodically, it is necessary to have the FRAME, SYNC, and OSTR signals to repeat at multiples of 8 FIFO samples. To disable FIFO reset, set syncsel_fifoin(3:0) and syncsel_fifoout(3:0) to 0000b. The frequency limitation for FRAME and SYNC signals are the following: fsync = fDATACLK/(n x 16) where n = 1, 2, … for Word-Wide and Byte-Wide Mode The frequency limitation for the OSTR signal is the following: fOSTR = fDAC/(n x interpolation x 8) where n = 1, 2, … The frequencies above are at maximum when n = 1. This is when the FRAME, SYNC, or OSTR have a rising edge transition every 8 FIFO samples. The occurrence can be made less frequent by setting n > 1, for example, every n × 8 FIFO samples. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 33 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com LVDS Pairs (Data Source) D[15:0]P/N tS(DATA) tH(DATA) DATACLKP/N (DDR) tH(DATA) tS(DATA) FRAMEP/N SYNCP/N LVPECL Pairs (Clock Source) tS(DATA) tH(DATA) Resets Write Pointer to Position 0 DACCLKP/N 2x Interpolation tS(OSTR) tH(OSTR) OSTRP/N (optionally internal sync from Write Reset) Resets Read Pointer to Position Set by fifo_offset (4 by Default) T0535-01 Figure 55. FIFO Write and Read Descriptions 7.3.4 FIFO Modes of Operation The DAC3484 input FIFO can be completely bypassed through registers config0 and config32. The register configuration for each mode is described in Table 3. Register Control Bits config0 fifo_ena config32 syncsel_fifoout(3:0) Table 3. FIFO Operation Modes config0 and config32 FIFO Bits FIFO MODE fifo_ena syncsel_fifoout BIT 3: sif_sync BIT 2: OSTR BIT 1: FRAME BIT 0: SYNC Dual Sync Sources 1 0 1 0 0 Single Sync Source 1 0 0 1 or 0 Depends on the sync source 1 or 0 Depends on the sync source Bypass 0 X X X X 7.3.4.1 Dual Sync Sources Mode This is the recommended mode of operation for those applications that require precise control of the output timing. In Dual Sync Sources mode, the FIFO write and read pointers are reset independently. The FIFO write pointer is reset using the LVDS FRAME or SYNC signal, and the FIFO read pointer is reset using the LVPECL OSTR signal. This allows LVPECL OSTR signal to control the phase of the output for either a single chip or multiple chips. Multiple devices can be fully synchronized in this mode. 34 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 7.3.4.2 Single Sync Source Mode In Single Sync Source mode, the FIFO write and read pointers are reset from the same source, either LVDS FRAME or LVDS SYNC signal. As described in the Input FIFO section, this mode has latency variations in both the FIFO Out Clock and DAC Clock between the multiple DAC devices. Applications requiring exact output timing control will need Dual Sync Sources mode instead of Single Sync Source Mode. A rising edge for FIFO and clock divider sync is recommended. Periodic sync signal is not recommended due to non-deterministic latency of the sync signal through the clock domain transfer. 7.3.4.3 Bypass Mode In FIFO bypass mode, the FIFO block is not used. As a result the input data is handed off from the DATACLK to the DACCLK domain without any compensation. In this mode the relationship between DATACLK and DACCLK is critical and used as a synchronizing mechanism for the internal logic. Due to the this constraint this mode is not recommended. The effects of bypassing the FIFO are the following: • The FIFO pointers have no effect on the data path or handoff. • The FIFO will not be able to pass the controls signals from the LVDS FRAME and LVDS SYNC to digital circuits after the FIFO. These digital circuits mainly are quadrature modulation corrections circuits, complex mixer circuits, and numerical controlled oscillator circuits. 7.3.5 Clocking Modes The DAC3484 has a dual clock setup in which a DAC clock signal is used to clock the DAC cores and internal digital logic and a separate DATA clock is used to clock the input LVDS receivers and FIFO input. The DAC3484 DAC clock signal can be sourced directly or generated through an on-chip low-jitter phase-locked loop (PLL). In those applications requiring extremely low noise it is recommended to bypass the PLL and source the DAC clock directly from a high-quality external clock to the DACCLK input. In most applications system clocking can be simplified by using the on-chip PLL to generate the DAC core clock while still satisfying performance requirements. In this case the DACCLK pins are used as the reference frequency input to the PLL. 16-Bit DACI DACCLK PLL Clock Distribution to Digital VCO/ Dividers 16-Bit DACQ pll_ena B0452-01 Figure 56. Top Level Clock Diagram 7.3.5.1 PLL Bypass Mode In PLL bypass mode a very high quality clock is sourced to the DACCLK inputs. This clock is used to directly clock the DAC3484 DAC sample rate clock. This mode gives the device best performance and is recommended for extremely demanding applications. The bypass mode is selected by setting the following: 1. pll_ena bit in register config24 to 0b to bypass the PLL circuitry. 2. pll_sleep bit in register config26 to 1b to put the PLL and VCO into sleep mode. 7.3.5.2 PLL Mode In this mode the clock at the DACCLK input functions as a reference clock source to the on-chip PLL. The onchip PLL will then multiply this reference clock to supply a higher frequency DAC sample rate clock. Figure 57 shows the block diagram of the PLL circuit. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 35 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com OSTR (Internally Generated) External Loop Filter DACCLKP REFCLK DACCLKN PFD and CP N Divider SYNCP Prescaler SYNC_PLL Internal Loop Filter SYNCN Note: The PLL generates internal OSTR signal. In this mode external LVPECL OSTR signal is not required. DACCLK VCO M Divider If the DAC is configured with PLL enabled with Dual Sync Sources mode, then the PFD frequency has to be the predefined OSTR frequency. B0453-01 Figure 57. PLL Block Diagram The DAC3484 PLL mode is selected by setting the following: 1. pll_ena bit in register config24 to 1b to route to the PLL clock path. 2. pll_sleep bit in register config26 to 0b to enable the PLL and VCO. The output frequency of the VCO is designed to be the in the range from 3.3GHz to 4.0GHz. The prescaler value, pll_p(2:0) in register config24, should be chosen such that the product of the prescaler value and DAC sample rate clock is within the VCO range. To maintain optimal PLL loop, the coarse tune bits, pll_vco(5:0) in register config26, can adjust the center frequency of the VCO towards the product of the prescaler value and DAC sample rate clock. Figure 58 shows a typical relationship between coarse tune bits and VCO center frequency. 4000 Coarse-Tuning Bits @ VCO Frequency (MHz) 3900 VCO Frequency (MHz ) - 3253 11.6 3800 3700 3600 3500 3400 3300 0 8 16 24 32 40 48 56 64 Coarse-Tuning Bits Figure 58. Typical PLL/VCO Lock Range vs Coarse Tuning Bits 36 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Common wireless infrastructure frequencies (614.4 MHz, 737.28 MHz, 1.2288 GHz, ...) are generated from this VCO frequency in conjunction with the pre-scaler setting as shown in Table 4. Table 4. VCO Operation VCO FREQUENCY (MHz) PRE-SCALE DIVIDER DESIRED DACCLK (MHz) pll_p(2:0) 3440.64 7 491.52 111 3686.4 6 614.4 110 3686.4 5 737.28 101 3686.4 3 1228.8 011 The M divider is used to determine the phase-frequency-detector (PFD) and charge-pump (CP) frequency. Table 5. PFD and CP Operation DACCLK FREQUENCY (MHz) M DIVIDER PDF UPDATE RATE (MHz) pll_m(7:0) 491.52 4 122.88 00000100 491.52 8 61.44 00001000 491.52 16 30.72 00010000 491.52 32 15.36 00100000 The N divider in the loop allows the PFD to operate at a lower frequency than the reference clock. Both M and N dividers can keep the PFD frequency below 155 MHz for peak operation. The overall divide ratio inside the loop is the product of the Pre-Scale and M dividers (P * M) and the following guidelines should be followed: • The overall divide ratio range is from 24 to 480 • When the overall divide ratio is less than 120, the internal loop filter can guarantee a stable loop • When the overall divide ratio is greater than 120, an external loop filter or double charge pump is required to ensure loop stability The single- and double-charge-pump current option are selected by setting pll_cp in register config24 to 01b and 11b, respectively. When using the double-charge-pump setting, an external loop filter is not required. If an external filter is required, the following filter should be connected to the LPF pin (A1 for RKD package and D12 for ZAY package): LPF R = 1 kΩ C2 = 1 nF C1 = 100 nF S0514-01 Figure 59. Recommended External Loop Filter The PLL generates an internal OSTR signal and does not require the external LVPECL OSTR signal. The OSTR signal is buffered from the N-divider output in the PLL block, and the frequency of the signal is the same as the PFD frequency. Therefore, using PLL with Dual Sync Sources mode would require the PFD frequency to be the pre-defined OSTR frequency. This will allow the FIFO to be synced correctly by the internal OSTR. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 37 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 7.3.6 FIR Filters Figure 60 through Figure 63 show the magnitude spectrum response for the FIR0, FIR1, FIR2 and FIR3 interpolating filters where fIN is the input data rate to the FIR filter. Figure 64 to Figure 67 show the composite filter response for 2x, 4x, 8x and 16x interpolation. The transition band for all interpolation settings is from 0.4 to 0.6 x fDATA (the input data rate to the device) with 90dB stop-band attenuation. The DAC3484 also has a 9-tap inverse sinc filter (FIR4) that runs at the DAC update rate (fDAC) that can be used to flatten the frequency response of the sample-and-hold output. The DAC sample-and-hold output sets the output current and holds it constant for one DAC clock cycle until the next sample, resulting in the well-known sin(x)/x or sinc(x) frequency response (Figure 68, red line). The inverse sinc filter response (Figure 68, blue line) has the opposite frequency response from 0 to 0.4 x Fdac, resulting in the combined response (Figure 68, green line). Between 0 to 0.4 x fDAC, the inverse sinc filter compensates the sample-and-hold roll-off with less than 0.03dB error. The inverse sinc filter has a gain >1 at all frequencies. Therefore, the signal input to FIR4 must be reduced from full scale to prevent saturation in the filter. The amount of back-off required depends on the signal frequency, and is set such that at the signal frequencies the combination of the input signal and filter response is less than 1 (0dB). For example, if the signal input to FIR4 is at 0.25 x fDAC, the response of FIR4 is 0.9dB, and the signal must be backed off from full scale by 0.9dB to avoid saturation. The gain function in the QMC blocks can be used to reduce the amplitude of the input signal. The advantage of FIR4 having a positive gain at all frequencies is that the user is then able to optimize the back-off of the signal based on its frequency. The filter taps for all digital filters are listed in Table 6. Note that the loss of signal amplitude may result in lower SNR due to decrease in signal amplitude. 20 20 0 0 –20 –20 –40 –40 Magnitude (dB) Magnitude (dB) SPACER –60 –80 –100 –60 –80 –100 –120 –120 –140 –140 –160 –160 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 f/fIN 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 f/fIN G048 Figure 60. Magnitude Spectrum for FIR0 SPACER 38 1 Submit Documentation Feedback G049 Figure 61. Magnitude Spectrum for FIR1 SPACER Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 20 20 0 0 –20 –20 –40 –40 Magnitude (dB) Magnitude (dB) www.ti.com –60 –80 –100 –60 –80 –100 –120 –120 –140 –140 –160 –160 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.1 0.2 0.3 0.4 f/fIN 0.5 0.6 0.7 0.8 0.9 f/fIN G050 G051 Figure 63. Magnitude Spectrum for FIR3 SPACER 20 20 0 0 –20 –20 –40 –40 Magnitude (dB) Magnitude (dB) Figure 62. Magnitude Spectrum for FIR2 SPACER –60 –80 –100 –60 –80 –100 –120 –120 –140 –140 –160 –160 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 f/fDATA f/fDATA G053 G052 Figure 64. 2x Interpolation Composite Response SPACER Figure 65. 4x Interpolation Composite Response SPACER 20 20 0 0 –20 –20 –40 –40 Magnitude (dB) Magnitude (dB) 1 –60 –80 –100 –60 –80 –100 –120 –120 –140 –140 –160 –160 0 0.5 1 1.5 2 2.5 3 3.5 4 0 f/fDATA 1 2 3 4 5 6 7 8 f/fDATA G054 Figure 66. 8x Interpolation Composite Response SPACER G055 Figure 67. 16x Interpolation Composite Response SPACER Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 39 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 4 3 FIR4 Magnitude (dB) 2 1 Corrected 0 –1 –2 sin(x)/x –3 –4 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 f/fDAC G056 Figure 68. Magnitude Spectrum for Inverse Sinc Filter 40 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 6. FIR Filter Coefficients NON-INTERPOLATING INVERSE-SINC FILTER INTERPOLATING HALF-BAND FILTERS FIR0 FIR1 59 TAPS FIR2 23 TAPS FIR3 11 TAPS FIR4 11 TAPS 9 TAPS 6 6 -12 -12 29 29 3 3 1 1 0 0 0 0 0 0 0 0 -4 -4 -19 -19 84 84 -214 -214 -25 -25 13 13 0 0 0 0 0 0 0 0 -50 -50 47 47 -336 -336 1209 1209 150 150 592 (1) 0 0 0 0 2048 (1) -100 -100 1006 1006 0 0 0 0 192 192 -2691 -2691 0 0 0 0 -342 -342 10141 10141 0 0 16384 (1) 572 572 0 0 -914 -914 0 0 1409 1409 0 0 -2119 -2119 0 0 3152 3152 0 0 -4729 -4729 0 0 7420 7420 0 0 -13334 -13334 0 0 41527 41527 256 (1) 65536 (1) (1) Center taps are highlighted in BOLD Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 41 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 7.3.7 Complex Signal Mixer The DAC3484 has two paths of complex signal mixer blocks that contain two full complex mixer (FMIX) blocks and power saving coarse mixer (CMIX) blocks. The signal path is shown in Figure 69. I Data In (A) Q Data In (B) 16 16 Fs/2 Mixer 16 16 ±Fs/4 Mixer 16 CMIX 16 Complex Signal Multiplier 16 sine 16 CMIX CMIX I Data Out (A) 16 Q Data Out (B) cosine 16 CMIX sine 16 cosine sine 16 16 (AB) Numerically Controlled Oscillator NCO_ENA cosine 16 Fixed Fs/8 Oscillator B0471-02 Figure 69. Path of Complex Signal Mixer 7.3.7.1 Full Complex Mixer The two FMIX blocks operate with independent Numerically Controlled Oscillators (NCOs) and enable flexible frequency placement without imposing additional limitations in the signal bandwidth. The NCOs have 32-bit frequency registers (phaseaddAB(31:0) and phaseaddCD(31:0)) and 16-bit phase registers (phaseoffsetAB(15:0) and phaseoffsetCD(15:0)) that generate the sine and cosine terms for the complex mixing. The NCO block diagram is shown in Figure 70. 32 16 Frequency Register 32 Σ 32 Accumulator CLK 32 16 16 Σ sin Look-Up Table 16 cos RESET 16 fDAC NCO SYNC via syncsel_NCO[3:0] Phase Register B0026-03 Figure 70. NCO Block Diagram Synchronization of the NCOs occurs by resetting the NCO accumulators to zero. The synchronization source is selected by syncsel_NCO(3:0) in config31. The frequency word in the phaseaddAB(31:0) and phaseaddCD(31:0) registers is added to the accumulators every clock cycle, fDAC. The output frequency of the NCO is: freq ´ fNCO _ CLK fNCO = 232 (1) 42 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 With the complex mixer enabled, the two channels in the mixer path are treated as complex vectors of the form IIN(t) + j QIN(t). The complex signal multiplier (shown in Figure 71) will multiply the complex channels with the sine and cosine terms generated by the NCO. The resulting output, IOUT(t) + j QOUT(t), of the complex signal multiplier is: IOUT(t) = (IIN(t)cos(2πfNCOt + δ) – QIN(t)sin(2πfNCOt + δ)) × 2(mixer_gain – 1) QOUT(t) = (IIN(t)sin(2πfNCOt + δ) + QIN(t)cos(2πfNCOt + δ)) × 2(mixer_gain – 1) where t is the time since the last resetting of the NCO accumulator, δ is the phase offset value and mixer_gain is either 0 or 1. δ is given by: δ = 2π × phase_offsetAB/CD(15:0)/216 The mixer_gain option allows the output signals of the multiplier to reduce by half (6dB). See Mixer Gain section for details. IIN(t) 16 QIN(t) 16 IOUT(t) 16 QOUT(t) 16 16 16 cosine sine Figure 71. Complex Signal Multiplier 7.3.7.2 Coarse Complex Mixer In addition to the full complex mixer, the DAC3484 also has a coarse mixer block capable of shifting the input signal spectrum by the fixed mixing frequencies ±n×fS/8. Using the coarse mixer instead of the full mixer lowers power consumption. The output of the fs/2, fs/4, and –fs/4 mixer block is: IOUT(t) = I(t)cos(2πfCMIXt) – Q(t)sin(2πfCMIXt) QOUT(t) = I(t)sin(2πfCMIXt) + Q(t)cos(2πfCMIXt) Since the sine and the cosine terms are a function of fs/2, fs/4, or –fs/4 mixing frequencies, the possible resulting value of the terms will only be 1, -1, or 0. The simplified mathematics allows the complex signal multiplier to be bypassed in any one of the modes, thus mixer gain is not available. The fs/2, fs/4, and –fs/4 mixer blocks performs mixing through negating and swapping of I/Q channel on certain sequence of samples. Table 7 shows the algorithm used for those mixer blocks. Table 7. Fs/2, Fs/4, and –Fs/4 Mixing Sequence MODE Normal (mixer bypassed) fs/2 MIXING SEQUENCE Iout = {+I1, +I2, +I3, +I4…} Qout = {+Q1, +Q2, +Q3, +Q4…} Iout = {+I1, -I2, +I3, -I4…} Qout = {+Q1, -Q2, +Q3, -Q4…} Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 43 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 7. Fs/2, Fs/4, and –Fs/4 Mixing Sequence (continued) MODE MIXING SEQUENCE Iout = {+I1, -Q2, -I3, +Q4…} fs/4 Qout = {+Q1, +I2, -Q3, -I4…} Iout = {+I1, +Q2, -I3, -Q4…} -fs/4 Qout = {+Q1, -I2, -Q3, +I4…} The fs/8 mixer can be enabled along with various combinations of fs/2, fs/4, and –fs/4 mixer. Since the fs/8 mixer uses the complex signal multiplier block with fixed fs/8 sine and cosine term, the output of the multiplier is: IOUT(t) = (IIN(t)cos(2πfNCOt + δ) – QIN(t)sin(2πfNCOt + δ)) × 2(mixer_gain – 1) QOUT(t) = (IIN(t)sin(2πfNCOt + δ) + QIN(t)cos(2πfNCOt + δ)) × 2(mixer_gain – 1) where fCMIX is the fixed mixing frequency selected by cmix(3:0). The mixing combinations are described in Table 8. The mixer_gain option allows the output signals of the multiplier to reduce by half (6dB). See Mixer Gain section for details. Table 8. Coarse Mixer Combinations cmix(3:0) Fs/8 MIXER cmix(3) Fs/4 MIXER cmix(2) Fs/2 MIXER cmix(1) –Fs/4 MIXER cmix(0) MIXING MODE 0000 Disabled Disabled Disabled Disabled No mixing 0001 Disabled Disabled Disabled Enabled –Fs/4 0010 Disabled Disabled Enabled Disabled Fs/2 0100 Disabled Enabled Disabled Disabled +Fs/4 1000 Enabled Disabled Disabled Disabled +Fs/8 1010 Enabled Disabled Enabled Disabled –3Fs/8 1100 Enabled Enabled Disabled Disabled +3Fs/8 1110 Enabled Enabled Enabled Disabled –Fs/8 All others – – – – Not recommended 7.3.7.3 Mixer Gain The maximum output amplitude out of the complex signal multiplier (i.e., FMIX mode or CMIX mode with fs/8 mixer enabled) occurs if IIN(t) and QIN(t) are simultaneously full scale amplitude and the sine and cosine arguments are equal to 2π x fMIXt + δ (2N-1) x π/4, where N = 1, 2, 3, etc.... cosine sine Max output occurs when both sine and cosine are 0.707 M0221-01 Figure 72. Maximum Output of the Complex Signal Multiplier With mixer_gain = 1 and both IIN(t) and QIN(t) are simultaneously full scale amplitude, the maximum output possible out of the complex signal multiplier is 0.707 + 0.707 = 1.414 (or 3dB). This configuration can cause clipping of the signal and should therefore be used with caution. With mixer_gain = 0 in config2, the maximum output possible out of the complex signal multiplier is 0.5 x (0.707 + 0.707) = 0.707 (or -3dB). This loss in signal power is in most cases undesirable, and it is recommended that the gain function of the QMC block be used to increase the signal by 3dB to compensate. 44 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 7.3.7.4 Real Channel Upconversion The mixer in the DAC34H84 treats the A, B, C, and D inputs are complex input data and produces a complex output for most mixing frequencies. The real input data for each channel can be isolated only when the mixing frequency is set to normal mode or fs/2 mode. Refer to Table 7 for details. 7.3.8 Quadrature Modulation Correction (QMC) 7.3.8.1 Gain and Phase Correction The DAC3484 includes a Quadrature Modulator Correction (QMC) block. The QMC blocks provide a mean for changing the gain and phase of the complex signals to compensate for any I and Q imbalances present in an analog quadrature modulator. The block diagram for the QMC block is shown in Figure 73. The QMC block contains 3 programmable parameters. Register qmc_gainA/B(10:0) and qmc_gainC/D(10:0) controls the I and Q path gains and is an 11-bit unsigned value with a range of 0 to 1.9990 and the default gain is 1.0000. The implied decimal point for the multiplication is between bit 9 and bit 10. Register qmc_phaseAB/CD(11:0) control the phase imbalance between I and Q and is a 12-bit values with a range of –0.5 to approximately 0.49975. The QMC phase term is not a direct phase rotation but a constant that is multiplied by each "Q" sample then summed into the "I" sample path. This is an approximation of a true phase rotation in order to keep the implementation simple. The corresponding phase rotation corresponds to approximately +26.5 to –26.5 degrees in 4096 steps. LO feed-through can be minimized by adjusting the DAC offset feature described below. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 45 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com qmc_gainA[10:0] 11 16 Σ I Data In (A) 16 I Data Out (A) 12 qmc_phaseAB[11:0] 16 16 Q Data In (B) Q Data Out (B) 11 qmc_gainB[10:0] qmc_gainC[10:0] 11 16 Σ I Data In (C) 16 I Data Out (C) 12 qmc_phaseCD[11:0] 16 16 Q Data In (D) Q Data Out (D) 11 qmc_gainD[10:0] B0164-03 Figure 73. QMC Block Diagram 7.3.8.2 Offset Correction Registers qmc_offsetA(12:0), qmc_offsetB(12:0), qmc_offsetC(12:0) and qmc_offsetD(12:0) can be used to independently adjust the DC offsets of each channel. The offset values are in represented in 2s-complement format with a range from -4096 to 4095. The offset value adds a digital offset to the digital data before digital-to-analog conversion. Since the offset is added directly to the data it may be necessary to back off the signal to prevent saturation. Both data and offset values are LSB aligned. 46 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 qmc_offsetA {–4096, –4095, ..., 4095} 13 16 A Data In 16 B Data In 16 Σ A Data Out 16 Σ B Data Out 13 qmc_offsetB {–4096, –4095, ..., 4095} qmc_offsetC {–4096, –4095, ..., 4095} 13 16 C Data In 16 D Data In 16 Σ C Data Out 16 Σ D Data Out 13 qmc_offsetD {–4096, –4095, ..., 4095} B0165-03 Figure 74. Digital Offset Block Diagram 7.3.8.3 Group Delay Correction A complex transmitter system typically is consisted of DACs, reconstruction filter network, and I/Q modulator. Besides the gain and phase mismatch contribution, there could also be timing mismatch contribution from each components. For instance, the timing mismatch could come from the PCB trace length variation between the I and Q channels and the group delay variation from the reconstruction filter. This timing mismatch in the complex transmitter system creates phase mismatch that varies linearly with respect to frequency. To compensate for the I/Q imbalances due to this mismatch, the DAC3484 has group delay correction block for each DAC channel. Each DAC channel can adjust its delay through grp_delayA(7:0), grp_delayB(7:0), grp_delayC(7:0), and grp_delayD(7:0) in register config46 and config47. The group delay correction, along with gain/phase correction, can be useful for correcting imbalances in wide-band transmitter system. The maximum delay ranges from 30 ps to 100 ps and is dependent on DAC sample clock. Contact TI for specific application information. 7.3.9 Temperature Sensor The DAC3484 incorporates a temperature sensor block which monitors the temperature by measuring the voltage across 2 transistors. The voltage is converted to an 8-bit digital word using a successive-approximation (SAR) analog to digital conversion process. The result is scaled, limited and formatted as a twos complement value representing the temperature in degrees Celsius. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 47 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com The sampling is controlled by the serial interface signals SDENB and SCLK. If the temperature sensor is enabled (tsense_sleep = 0b in register config26) a conversion takes place each time the serial port is written or read. The data is only read and sent out by the digital block when the temperature sensor is read in tempdata(7:0) in config6. The conversion uses the first eight clocks of the serial clock as the capture and conversion clock, the data is valid on the falling eighth SCLK. The data is then clocked out of the chip on the rising edge of the ninth SCLK. No other clocks to the chip are necessary for the temperature sensor operation. As a result the temperature sensor is enabled even when the device is in sleep mode. In order for the process described above to operate properly, the serial port read from config6 must be done with an SCLK period of at least 1 μs. If this is not satisfied the temperature sensor accuracy is greatly reduced. 7.3.10 Data Pattern Checker The DAC3484 incorporates a simple pattern checker test in order to determine errors in the data interface. The main cause of failures is setup/hold timing issues. The test mode is enabled by asserting iotest_ena in register config1. In test mode the analog outputs are deactivated regardless of the state of TXENABLE or sif_texnable in register config3. The data pattern key used for the test is 8 words long and is specified by the contents of iotest_pattern[0:7] in registers config37 through config44. The data pattern key can be modified by changing the contents of these registers. The first word in the test frame is determined by a rising edge transition in FRAME or SYNC, depending on the syncsel_fifoin(4:0) setting in config32. At this transition, the pattern0 word should be input to the data pins. Patterns 1 through 7 should follow sequentially on each edge of DATACLK (rising and falling). The sequence should be repeated until the pattern checker test is disabled by setting iotest_ena back to 0b. It is not necessary to have a rising FRAME or SYNC edge aligned with every pattern0 word, just the first one to mark the beginning of the series. Start cycle again with optional rising edge of FRAME or SYNC D[15:0]P/N Pattern 0 Pattern 1 Pattern 2 Pattern 3 Pattern 4 Pattern 5 Pattern 6 Pattern 7 [15:0] [15:0] [15:0] [15:0] [15:0] [15:0] [15:0] [15:0] DATACLKP/N (DDR) Sync Option #1 FRAMEP/N Sync Option #2 SYNCP/N T0528-01 Figure 75. IO Pattern Checker Data Transmission Format The test mode determines if the 16-bit LVDS data D[15:0]P/N of all the patterns were received correctly by comparing the received data against the data pattern key. If any of the 16-bit data D[15:0]P/N were received incorrectly, the corresponding bits in iotest_results(15:0) in register config4 will be set to 1b to indicate bit error location. Furthermore, the error condition will trigger the alarm_from_iotest bit in register config5 to indicate a general error in the data interface. When data pattern checker mode is enabled, this alarm in register config5, bit 7 is the only valid alarm. Other alarms in register config5 are not valid and can be disregarded. For instance, pattern0 is programmed to the default of 0x7A7A. If the received Pattern 0 is 0x7A7B, then bit 0 in iotest_results(15:0) will be set to 1b to indicate an error in bit 0 location. The alarm_from_iotest will also be set to 1b to report the data transfer error. The user can then narrow down the error from the bit location information and implement the fix accordingly. 48 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 The alarms can be cleared by writing 0x0000 to iotest_results(15:0) and 0b to alarm_from_iotest through the serial interface. The serial interface will read back 0s if there are no errors or if the errors are cleared. The corresponding alarm bit will remain a 1b if the errors remain. It is recommended to enable the pattern checker and then run the pattern sequence for 100 or more complete cycles before clearing the iotest_results(15:0) and alarm_from_iotest. This will eliminate the possibility of false alarms generated during the setup sequence. Based on the pattern test result, the user can adjust the data source output timing, PCB traces delay, or DAC3484 CONFIG36 LVDS Programmable delay to help optimize the setup and hold time of the transmitter system. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 49 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 16-Bit 0 Pattern 0 Bit-by-Bit Compare 0 1 Pattern 1 Bit-by-Bit Compare 1 FRAME or SYNC 16-Bit LVDS Drivers Only one edge needed Data Format Pattern 0 ... 7 D[15:0] 16-Bit 2 Pattern 2 Bit-by-Bit Compare 3 Pattern 3 Bit-by-Bit Compare 4 Pattern 4 Bit-by-Bit Compare 5 Pattern 5 Bit-by-Bit Compare DATACLK 2 3 iotest_pattern0 iotest_pattern1 iotest_pattern2 iotest_results[15] iotest_pattern3 iotest_pattern4 4 iotest_pattern5 5 iotest_pattern6 6 Pattern 6 Bit-by-Bit Compare 6 7 Pattern 7 Bit-by-Bit Compare 7 8-Bit Input iotest_pattern7 16-Bit Input Bit 15 Results • • • 8-Bit Input • • • • • • iotest_results[0] alarm_from_iotest All Bits Results Bit 0 Results Go back to 0 after cycle or new rising edge on FRAME or SYNC B0457-01 Figure 76. DAC3484 Pattern Check Block Diagram 50 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 7.3.11 Parity Check Test The DAC3484 has a parity check test that enables continuous validity monitoring of the data received by the DAC. Parity check testing in combination with the data pattern checker offer an excellent solution for detecting board assembly issues due to missing pad connections. For the parity check test, an extra parity bit is added to the data bits to ensure that the total number of set bits (bits with value 1) is even or odd. This simple scheme is used to detect single or any other odd number of data transfer errors. Parity testing is implemented in the DAC3484 in two ways: word-by-word parity and block parity. 7.3.11.1 Word-by-Word Parity Word-by-word parity is the easiest mode to implement. In this mode the additional parity bit is sourced to the parity input (PARITYP/N) for each data word transfer into the D[15:0]P/N inputs. This mode is enabled by setting the word_parity_ena bit. The input parity value is defined to be the total number of logic 1s on the 17-bit data bus, the D[15:0]P/N inputs and the PARITYP/N input. This value, the total number of logic 1s, must match the parity test selected in the oddeven_parity bit in register config1. For example, if the oddeven_parity bit is set to 1b for odd parity, then the number of 1s on the 17-bit data bus should be odd. The DAC will check the data transfer through the parity input. If the data received has odd number of 1s, then the parity is correct. If the data received has even number of 1s, then the parity is incorrect. The corresponding alarm for parity error will be set accordingly. Figure 77 shows the simple XOR structure used to check word parity. Parity is tested independently for data captured on both rising and falling edges of DATACLK (alarm_rparity and alarm_fparity, respectively). Testing on both edges helps in determining a possible setup/hold issue. Both alarms are captured individually in register config5. alarm_rparity PARITY oddeven_parity D[15:0] Parity Block alarm_fparity DATACLK B0458-01 Figure 77. DAC3484 Word-by-Word Parity Check 7.3.11.2 Block Parity The block parity method uses the FRAME signal to determine the boundaries of the data block to compute parity. This mode is enabled by setting the frame_parity_ena bit in register config1. A low-to-high transition of FRAME captured with the DATACLK rising edge determines the end point of the parity block and the beginning of the next one. In this method the parity bit of the completed block corresponds to the FRAME value captured on the DATACLK falling edge right after the STOP/START point. The input parity value is defined to be the total number of logic 1s in the data block. A logic HIGH captured on the falling edge of DATACLK indicates odd parity or odd number of logic 1s, while a logic LOW indicates even parity or even number of logic 1s. If the expected parity does not match the number of logic 1s in the received data, then alarm_frame_parity in register config5 will be set to 1b. The main advantage of the block parity mode is that there is no need for an additional parity LVDS input. Since the FRAME signal is used for parity testing in addition to FIFO syncing and frame boundary assignment it is mandatory to take some extra steps to avoid device malfunction. If FRAME is used to reset the FIFO pointers continuously, the block size must be a multiple of 8 samples (each sample corresponding to 16-bits A, B, C and D data). In addition since FRAME is used to establish the frame boundary, the parity block must be aligned with the data frame boundaries. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 51 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 A0 [15:0] D[15:0]P/N B0 [15:0] C0 [15:0] www.ti.com D0 [15:0] D[15:0]P/N DATACLKP/N (DDR) ••• ••• High = Odd Parity Low = Even Parity FRAMEP/N Ax [15:0] Bx [15:0] Cx [15:0] Dx [15:0] DATACLKP/N (DDR) High = Odd Parity Low = Even Parity FRAMEP/N Parity Bit for Data Block N – 1 Parity Bit for Data Block N Data Block N Stop Point for Data Block N – 1 Start Point for Data Block N Stop Point for Data Block N Start Point for Data Block N + 1 T0527-02 Notes: Rising edge of FRAMEP/N indicates the beginning of data block. Parity bit for the current data block is latched on falling edge of DATACLK after the start point for next data block. Figure 78. DAC3484 Block Parity Check (Example shown with Word Wide Mode) 7.3.12 DAC3484 Alarm Monitoring The DAC3484 includes a flexible set of alarm monitoring that can be used to alert of a possible malfunction scenario. All the alarm events can be accessed either through the config5 register or through the ALARM pin. Once an alarm is set, the corresponding alarm bit in register config5 must be reset through the serial interface to allow further testing. The set of alarms includes the following conditions: Zero check alarm • Alarm_from_zerochk. Occurs when the FIFO write pointer has an all zeros pattern. Since the write pointer is a shift register, all zeros will cause the input pointer to be stuck until the next sync event. When this happens a sync to the FIFO block is required. FIFO alarms • alarm_from_fifo. Occurs when there is a collision in the FIFO pointers or a collision event is close. – alarm_fifo_2away. Pointers are within two addresses of each other. – alarm_fifo_1away. Pointers are within one address of each other. – alarm_fifo_collision. Pointers are equal to each other. Clock alarms • clock_gone. Occurs when either the DACCLK or DATACLOCK have been stopped. – alarm_dacclk_gone. Occurs when the DACCLK has been stopped. – alarm_dataclk_gone. Occurs when the DATACLK has been stopped. Pattern checker alarm • alarm_from_iotest. Occurs when the input data pattern does not match the pattern key. PLL alarm • alarm_from_pll. Occurs when the PLL is out of lock. Parity alarms • alarm_rparity. Occurs when there is a parity error in the data captured by the rising edge of DATACLKP/N. The PARITYP/N input is the parity bit (word-by-word parity test). • alarm_fparity. Occurs when there is a parity error in the data captured by the falling edge of DATACLKP/N. The PARITYP/N input is the parity bit (word-by-word parity test). • alarm_frame_parity_err. Occurs when there is a frame parity error when using the FRAME as the parity bit (block parity test). 52 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 To prevent unexpected DAC outputs from propagating into the transmit channel chain, the clock and alarm_ fifo_collision alarms can be set in config2 to shut-off the DAC output automatically regardless of the state of TXENABLE or sif_txenable. Alarm monitoring is implemented as follows: • Power up the device using the recommended power-up sequence. • Clear all the alarms in config5 by setting them to 0. • Unmask those alarms that will generate a hardware interrupt through the ALARM pin in config7. • Enable automatic DAC shut-off in register config2 if required. • In the case of an alarm event, the ALARM pin will trigger. If automatic DAC shut-off has been enabled the DAC outputs will be disabled. • Read registers config5 to determine which alarm triggered the ALARM pin. • Correct the error condition and re-synchronize the FIFO. • Clear the alarms in config5. • Re-read config5 to ensure the alarm event has been corrected. • Keep clearing and reading config5 until no error is reported. For details of alarm monitoring function and behavior, refer to SLAA585. 7.3.13 LVPECL Inputs Figure 79 shows an equivalent circuit for the DAC input clock (DACCLKP/N) and the output strobe clock (OSTRP/N). CLKVDD 250 Ω 2 kΩ 2 kΩ DACCLKN OSTRN DACCLKP OSTRP Internal Digital In 250 Ω SLEEP GND S0515-01 NOTE: Input common mode level is internally biased Figure 79. DACCLKP/N and OSTRP/N Equivalent Input Circuit Figure 80 shows the preferred configuration for driving the CLKIN/CLKINC input clock with a differential ECL/PECL source. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 53 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com CAC 0.1 μF Differential ECL or (LV)PECL Source + CLKIN CAC 0.1 μF 100 Ω CLKINC – RT 150 Ω RT 150 Ω S0029-02 NOTE: Actual RT value depends on differential clock driver output termination recommendation. It is driver type dependent. Figure 80. Preferred Clock Input Configuration with a Differential ECL/PECL Clock Source 7.3.14 LVDS Inputs The D[15:0]P/N, DATACLKP/N, SYNCP/N, PARITYP/N, and FRAMEP/N LVDS pairs have the input configuration shown in Figure 81. Figure 82 shows the typical input levels and common-move voltage used to drive these inputs. IOVDD 100 Ω LVDS Receiver Internal Digital In GND S0516-01 Figure 81. D[15:0]P/N, DATACLKP/N, FRAMEP/N, SYNCP/N and PARITYP/N LVDS Input Configuration Example DAC3484 VA, B VCOM = (VA + VB)/2 VA 1.4 V VB 1V LVDS Receiver 100 • 400 mV VA, B VA 0V –400 mV VB GND Logical Bit Equivalent 1 0 B0459-03 Figure 82. LVDS Data Input Levels 54 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 9. Example LVDS Data Input Levels APPLIED VOLTAGES RESULTING DIFFERENTIAL VOLTAGE RESULTING COMMONMODE VOLTAGE VCOM VA VB VA,B 1.4 V 1.0 V 400 mV 1.0 V 1.4 V -400 mV 1.2 V 0.8 V 400 mV 0.8 V 1.2 V -400 mV 1.2 V 1.0 V LOGICAL BIT BINARY EQUIVALENT 1 0 1 0 7.3.15 Unused LVDS Port Termination Depending on the DAC3484 functionality required, additional unused LVDS ports such as FRAMEP/N, SYNCP/N, or PARITYP/N can be left unconnected (floating) or connected to a nominal, differential LVDS active HIGH or active LOW voltage. The usage of these ports depends mainly on the FIFO synchronization settings and parity checking settings. The unused FRAMEP/N, SYNCP/N, or PARITYP/N ports can be connected in parallel with the unused LVDS data port with adjustments to the RSET resistor value. The following example allows the termination of the unused LVDS ports to a known logic HIGH value. As shown in Figure 83, The design involves the connection to the DIGVDD rail and one RSET resistor to bias the positive terminals of unused LVDS ports to be 1.2 V and negative terminals of unused LVDS ports to 1.0 V. The design keeps the minimum common mode input voltage of the LVDS input to be above 1.0 V, and keeps the differential LVDS voltage to be 200 mV. Since the design expects the differential voltage on the unused ports to be static, the differential LVDS voltage can be as low as 100 mV to maintain a logic HIGH. Refer to Electrical Characteristic – Digital Specifications Table for detail of LVDS Input requirements. DIGVDD (1.2V Nominal) LVDS P Terminals (Parallel by M) REQ or ZT/M LVDS N Terminals (Parallel by M) x x x RSET M Unused LVDS Ports Connected in Parallel. Keep Positive Terminals at 1.2V. Keep Static Differential Voltages above 100mV. Figure 83. Unused LVDS Ports Connected to Static Logic High Differential Voltage 1. Connect the positive terminals of unused LVDS ports in parallel to DIGVDD supply at 1.2 V nominal. For instance, connect SYNC and PARITY positive pins together to DIGVDD. 2. Connect the negative terminals of unused LVDS ports in parallel to a RSET resistor to ground. 3. The REQ value is the equivalent, parallel resistance of the on-chip termination for all the unused LVDS ports. With the SYNC and PARITY ports unused, the REQ is two parallel ZT. Worst case ZT value of 135 Ω is used in the design to account for the lowest possible current IEQ and the worst case common mode on the negative LVDS terminals. Another analysis will be performed with ZT value of 85 Ω for worst case differential LVDS voltages. 4. With Ohm’s Law, the following equation describes the relationship between RSET and REQ. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 55 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 RSET RSET REQ RSET www.ti.com 1.0 1.2 4.988REQ (2) 5. With REQ of two parallel, 135 Ω ZT (or 67.5 Ω equivalent), RSET is 332 Ω with standard 1% resistor value. IEQ is approximately 3 mA. The expected voltage at negative terminals of LVDS ports is approximately 1.0 V. The differential LVDS voltage is 200 mV. 6. With same RSET of 332 Ω, if the REQ has dropped to two parallel, 85 Ω ZT (or 42.5 Ω equivalent), IEQ is approximately 3.2 mA. The expected voltage at negative terminals of LVDS port is approximately 1.06 V. The differential LVDS voltage is 136 mV. As long as the static LVDS differential voltage is above 100 mV, the LVDS port will register a logic HIGH value for the data. 7.3.16 CMOS Digital Inputs Figure 84 shows a schematic of the equivalent CMOS digital inputs of the DAC3484. SDIO, SCLK, SLEEP and TXENABLE have pull-down resistors while SDENB and RESETB have pull-up resistors internal to the DAC3484. See the specification table for logic thresholds. The pull-up and pull-down circuitry is approximately equivalent to 100kΩ. IOVDD IOVDD 100 kΩ SDIO SCLK SLEEP TXENABLE 100 kΩ 400 Ω Internal Digital In 400 Ω SDENB RESETB GND Internal Digital In GND S0027-03 Figure 84. CMOS Digital Equivalent Input 7.3.17 Reference Operation The DAC3484 uses a bandgap reference and control amplifier for biasing the full-scale output current. The fullscale output current is set by applying an external resistor RBIAS to pin BIASJ. The bias current IBIAS through resistor RBIAS is defined by the on-chip bandgap reference voltage and control amplifier. The default full-scale output current equals 64 times this bias current and can thus be expressed as: IOUTFS = 64 x IBIAS = 64 x (VEXTIO / RBIAS ) / 2 The DAC3484 has a 4-bit coarse gain control coarse_dac(3:0) in the config3 register. Using gain control, the IOUTFS can be expressed as: IOUTFS = (coarse_dac + 1)/16 x IBIAS x 64 = (coarse_dac + 1)/16 x (VEXTIO / RBIAS) / 2 x 64 where VEXTIO is the voltage at terminal EXTIO. The bandgap reference voltage delivers an accurate voltage of 1.2 V. This reference is active when extref_ena = 0b in config27. An external decoupling capacitor CEXT of 0.1 µF should be connected externally to terminal EXTIO for compensation. The bandgap reference can additionally be used for external reference operation. In that case, an external buffer with high impedance input should be applied in order to limit the bandgap load current to a maximum of 100 nA. The internal reference can be disabled and overridden by an external reference by setting the extref_ena control bit. Capacitor CEXT may hence be omitted. Terminal EXTIO thus serves as either input or output node. The full-scale output current can be adjusted from 30 mA down to 10 mA by varying resistor RBIAS or changing the externally applied reference voltage. 56 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 NOTE With internal reference, the minimum Rbias resistor value is 1.28 kΩ. Resistor value below 1.28 kΩ is not recommended since it will program the full-scale current to go above 30mA and potentially damages the device. 7.3.18 DAC Transfer Function The CMOS DACs consist of a segmented array of PMOS current sources, capable of sourcing a full-scale output current up to 30 mA. Differential current switches direct the current to either one of the complementary output nodes IOUTP or IOUTN. Complementary output currents enable differential operation, thus canceling out common mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, even order distortion components, and increasing signal output power by a factor of two. The full-scale output current is set using external resistor RBIAS in combination with an on-chip bandgap voltage reference source (+1.2 V) and control amplifier. Current IBIAS through resistor RBIAS is mirrored internally to provide a maximum full-scale output current equal to 64 times IBIAS. The relation between IOUTP and IOUTN can be expressed as: IOUTFS = IOUTP + IOUTN We will denote current flowing into a node as – current and current flowing out of a node as + current. Since the output stage is a current source the current flows from the IOUTP and IOUTN pins. The output current flow in each pin driving a resistive load can be expressed as: IOUTP = IOUTFS x CODE / 65536 IOUTN = IOUTFS x (65535 – CODE) / 65536 where CODE is the decimal representation of the DAC data input word For the case where IOUTP and IOUTN drive resistor loads RL directly, this translates into single ended voltages at IOUTP and IOUTN: VOUTP = IOUT1 x RL VOUTN = IOUT2 x RL Assuming that the data is full scale (65535 in offset binary notation) and the RL is 25 Ω, the differential voltage between pins IOUTP and IOUTN can be expressed as: VOUTP = 20mA x 25 Ω = 0.5 V VOUTN = 0mA x 25 Ω = 0 V VDIFF = VOUTP – VOUTN = 0.5V Note that care should be taken not to exceed the compliance voltages at node IOUTP and IOUTN, which would lead to increased signal distortion. 7.3.19 Analog Current Outputs The DAC3484 can be easily configured to drive a doubly terminated 50-Ω cable using a properly selected RF transformer. Figure 85 and Figure 86 show the 50-Ω doubly terminated transformer configuration with 1:1 and 4:1 impedance ratio, respectively. Note that the center tap of the primary input of the transformer has to be grounded to enable a DC current flow. Applying a 20-mA full-scale output current would lead to a 0.5 Vpp for a 1:1 transformer and a 1 Vpp output for a 4:1 transformer. The low dc-impedance between IOUTP or IOUTN and the transformer center tap sets the center of the ac-signal to GND, so the 1 Vpp output for the 4:1 transformer results in an output between –0.5 V and 0.5 V. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 57 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 50 Ω 1:1 IOUTP 100 Ω RLOAD 50 Ω AGND IOUTN 50 Ω S0517-01 Figure 85. Driving a Doubly terminated 50-Ω Cable Using a 1:1 Impedance Ratio Transformer 100 Ω 4:1 IOUTP AGND RLOAD 50 Ω IOUTN 100 Ω S0518-01 Figure 86. Driving a Doubly Terminated 50-Ω Cable Using a 4:1 Impedance Ratio Transformer 7.4 Device Functional Modes 7.4.1 Multi-Device Synchronization In various applications, such as multi antenna systems where the various transmit channels information is correlated, it is required that multiple DAC devices are completely synchronized such that their outputs are phase aligned. The DAC3484 architecture supports this mode of operation. 7.4.1.1 Multi-Device Synchronization: PLL Bypassed with Dual Sync Sources Mode For single or multi-device synchronization it is important that delay differences in the data are absorbed by the device so that latency through the device remains the same. Furthermore, to guarantee that the outputs from each DAC are phase aligned it is necessary that data is read from the FIFO of each device simultaneously. In the DAC3484 this is accomplished by operating the multiple devices in Dual Sync Sources mode. In this mode the additional OSTR signal is required by each DAC3484 to be synchronized. Data into the device is input as LVDS signals from one or multiple baseband ASICs or FPGAs. Data into the multiple DAC devices can experience different delays due to variations in the digital source output paths or board level wiring. These different delays can be effectively absorbed by the DAC3484 FIFO so that all outputs are phase aligned correctly. 58 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Device Functional Modes (continued) DACCLKP/N OSTRP/N D[15:0]P/N FPGA DAC3484 DAC1 FRAMEP/N Clock Generator PLL/ DLL LVDS Interface LVPECL Outputs Delay 1 DATACLKP/N Outputs are Phase Aligned Variable delays due to variations in the FPGA(s) output paths or board level wiring or temperature/voltage deltas D[15:0]P/N LVPECL Outputs FRAMEP/N DATACLKP/N Delay 2 DAC3484 DAC2 OSTRP/N DACCLKP/N B0454-03 Figure 87. SynchronizationSystem in Dual Sync Sources Mode with PLL Bypassed For correct operation both OSTR and DACCLK must be generated from the same clock domain. The OSTR signal is sampled by DACCLK and must satisfy the timing requirements in the specifications table. If the clock generator does not have the ability to delay the DACCLK to meet the OSTR timing requirement, the polarity of the DACCLK outputs can be swapped with respect to the OSTR ones to create 180 degree phase delay of the DACCLK. This may help establish proper setup and hold time requirement of the OSTR signal. Careful board layout planning must be done to ensure that the DACCLK and OSTR signals are distributed from device to device with the lowest skew possible as this will affect the synchronization process. In order to minimize the skew across devices it is recommended to use the same clock distribution device to provide the DACCLK and OSTR signals to all the DAC devices in the system. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 59 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com LVPECL Pairs (DAC3484 1) Device Functional Modes (continued) DACCLKP/N(1) tS(OSTR) tH(OSTR) tSKEW ~ 0 LVPECL Pairs (DAC3484 2) OSTRP/N(1) DACCLKP/N(2) tS(OSTR) tH(OSTR) OSTRP/N(2) • • • • T0526-03 Figure 88. Timing Diagram for LVPECL Synchronization Signals The following steps are required to ensure the devices are fully synchronized. The procedure assumes all the DAC3484 devices have a DACCLK and OSTR signal and must be carried out on each device. 1. Start-up the device as described in the power-up sequence. Set the DAC3484 in Dual Sync Sources mode and select OSTR as the clock divider sync source (clkdiv_sync_sel in register config32). 2. Sync the clock divider and FIFO pointers. 3. Verify there are no FIFO alarms either through register config5 or through the ALARM pin. 4. Disable clock divider sync by setting clkdiv_sync_ena to 0b in register config0. After these steps all the DAC3484 outputs will be synchronized. 7.4.1.2 Multi-Device Synchronization: PLL Enabled with Dual Sync Sources Mode The DAC3484 allows exact phase alignment between multiple devices even when operating with the internal PLL clock multiplier. In PLL clock mode, the PLL generates the DAC clock and an internal OSTR signal from the reference clock applied to the DACCLK inputs so there is no need to supply an additional LVPECL OSTR signal. For this method to operate properly the SYNC signal should be set to reset the PLL N dividers to a known state by setting pll_ndivsync_ena in register config24 to 1b. The SYNC signal resets the PLL N dividers with a rising edge, and the timing relationship ts(SYNC_PLL) and th(SYNC_PLL) are relative to the reference clock presented on the DACCLK pin. Both SYNC and DACCLK can be set as low frequency signals to greatly simplifying trace routing (SYNC can be just a pulse as a single rising edge is required, if using a periodic signal it is recommended to clear the pll_ndivsync_ena bit after resetting the PLL dividers). Besides the ts(SYNC_PLL) and th(SYNC_PLL) requirement between SYNC and DACCLK, there is no additional required timing relationship between the SYNC and FRAME signals or between DACCLK and DATACLK. The only restriction as in the PLL disabled case is that the DACCLK and SYNC signals are distributed from device to device with the lowest skew possible. 60 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Device Functional Modes (continued) DACCLKP/N SYNCP/N D[15:0]P/N FPGA DAC3484 DAC1 FRAMEP/N Clock Generator PLL/ DLL LVDS Interface Outputs Delay 1 DATACLKP/N Outputs are Phase Aligned Variable delays due to variations in the FPGA(s) output paths or board level wiring or temperature/voltage deltas D[15:0]P/N Outputs FRAMEP/N DATACLKP/N Delay 2 DAC3484 DAC2 SYNCP/N DACCLKP/N B0455-03 Figure 89. Synchronization System in Dual Sync Sources Mode with PLL Enabled The following steps are required to ensure the devices are fully synchronized. The procedure assumes all the DAC3484 devices have a DACCLK and SYNC signal and the following steps must be carried out on each device. 1. Start-up the device as described in the power-up sequence. Set the DAC3484 in Dual Sync Sources mode and enable SYNC to reset the PLL dividers (set pll_ndivsync_ena in register config24 to 1b). 2. Reset the PLL dividers with a rising edge on SYNC. 3. Disable PLL dividers resetting. 4. Sync the clock divider and FIFO pointers. 5. Verify there are no FIFO alarms either through register config5 or through the ALARM pin. 6. Disable clock divider sync by setting clkdiv_sync_ena to 0b in register config0. After these steps all the DAC3484 outputs will be synchronized. 7.4.1.3 Multi-Device Operation: Single Sync Source Mode In Single Sync Source mode the FIFO read pointer reset is handoff between the two clock domains (DATACLK and FIFO OUT CLOCK) by simply re-sampling the write pointer reset. Since the two clocks are asynchronous there is a small but distinct possibility of a meta-stability during the pointer handoff. As described in the Input FIFO section, this meta-stable situation can change the latency of the multiple DAC devices by both the FIFO Out clock cycles and DAC clock cycles. When the PLL is enabled with Single Sync Source mode, the FIFO read pointer is not synchronized by the OSTR signal. Therefore, there is no restriction on the PLL PFD frequency as described in the previous section. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 61 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Device Functional Modes (continued) DACCLKP/N D[15:0]P/N FPGA DAC3484 DAC1 FRAMEP/N Clock Generator PLL/ DLL LVDS Interface LVPECL Outputs Delay 1 DATACLKP/N Variable delays due to variations in the FPGA(s) output paths or board level wiring or temperature/voltage deltas D[15:0]P/N Variation in both the FIFO Out clock cycles and DAC clock cycles LVPECL Outputs FRAMEP/N DATACLKP/N Delay 2 DAC3484 DAC2 DACCLKP/N B0456-03 Figure 90. Multi-Device Operation in Single Sync Source Mode 7.5 Programming 7.5.1 Power-Up Sequence The following startup sequence is recommended to power-up the DAC3484: 1. Set TXENABLE low 2. Supply all 1.2-V voltages (DACVDD, DIGVDD, CLKVDD, and VFUSE) and all 3.3-V voltages (AVDD, IOVDD, and PLLAVDD). The 1.2-V and 3.3-V supplies can be powered up simultaneously or in any order. There are no specific requirements on the ramp rate for the supplies. 3. Provide all LVPECL inputs: DACCLKP/N and the optional OSTRP/N. These inputs can also be provided after the SIF register programming. 4. Toggle the RESETB pin for a minimum 25 ns active low pulse width. 5. Program the SIF registers. 6. Program fuse_sleep (config27, bit) to put the internal fuses to sleep. To enable dual channel mode, set Config1, bit to 0b and Config16, bit to 11b. This dual channel mode is functionally equivalent to the dual channel DAC3484 (channels B and C active). See the DAC3484 SLAS748 datasheet for details. 7. FIFO configuration needed for synchronization: (a) Program syncsel_fifoin(3:0) (config32, bits) to select the FIFO input pointer sync source. (b) Program syncsel_fifoout(3:0) (config32, bits) to select the FIFO output pointer sync source. (c) Program syncsel_dataformatter(1:0) (config31, bits) to select the FIFO Data Formatter sync source. 8. Clock divider configuration needed for synchronization: (a) Program clkdiv_sync_sel (config32, bit) to select the clock divider sync source. (b) Program clkdiv_sync_ena (config0, bit) to 1b to enable clock divider sync. (c) For multi-DAC synchronization in PLL mode, program pll_ndivsync_ena (config24, bit) to 1b to synchronize the PLL N-divider. 9. Provide all LVDS inputs (D[15:0]P/N, DATACLKP/N, FRAMEP/N, SYNCP/N, and PARITYP/N) simultaneously. Synchronize the FIFO and clock divider by providing the pulse or periodic signals needed. (a) For Single Sync Source Mode where either FRAMEP/N or SYNCP/N is used to sync the FIFO, a single rising edge for FIFO, FIFO data formatter, and clock divider sync is recommended. Periodic sync signal 62 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Programming (continued) is not recommended due to the non-deterministic latency of the sync signal through the clock domain transfer. (b) For Dual Sync Sources Mode, both single pulse or periodic sync signals can be used. (c) For multi-DAC synchronization in PLL mode, the LVDS SYNCP/N signal is used to sync the PLL Ndivider and can be sourced from either the FPGA/ASIC pattern generator or clock distribution circuit as long as the t(SYNC_PLL) setup and hold timing requirement is met with respect to the reference clock source at DACCLKP/N pins. The LVDS SYNCP/N signal can be provided at this point. 10. FIFO and clock divider configurations after all the sync signals have provided the initial sync pulses needed for synchronization: (a) For Single Sync Source Mode where the clock divider sync source is either FRAMEP/N or SYNCP/N, clock divider syncing may be disabled after DAC3484 initialization and before the data transmission by setting clkdiv_sync_ena (config0, bit ) to 0b. This is to prevent accidental syncing of the clock divider when sending FRAMEP/N or SYNCP/N pulse to other digital blocks. (b) For Dual Sync Sources Mode, where the clock divider sync source is from the OSTR signal (either from external OSTRP/N or internal PLL N divider output), the clock divider syncing may be enabled at all time. (c) Optionally, to prevent accidental syncing of the FIFO and FIFO data formatter when sending the FRAMEP/N or SYNCP/N pulse to other digital blocks such as NCO, QMC, etc, disable FIFO syncing by setting syncsel_fifoin(3:0) and syncsel_fifoout(3:0) to 0000b after the FIFO input and output pointers are initialized. Also Disable the FIFO data formatter by setting syncsel_dataformatter(1:0) to 10b or 11b. If the FIFO and FIFO data formatter sync remain enabled after initialization, the FRAMEP/N or SYNCP/N pulse must occur in ways to not disturb the FIFO operation. Refer to the INPUT FIFO section for detail. (d) Disable PLL N-divider syncing by setting pll_ndivsync_ena (config24, bit) to 0b. 11. Enable transmit of data by asserting the TXENABLE pin or set sif_txenable to 1b. 12. At any time, if any of the clocks (i.e DATACLK or DACCLK) is lost or a FIFO collision alarm is detected, a complete resynchronization of the DAC is necessary. Set TXENABLE low and repeat steps 7 through 11. Program the FIFO configuration and clock divider configuration per steps 7 and 8 appropriately to accept the new sync pulse or pulses for the synchronization. 7.5.2 Example Start-Up Routine 7.5.2.1 Device Configuration fDATA = 307.2 MSPS Interpolation = 4x Input data = baseband data fOUT = 122.88 MHz PLL = Enabled Full Mixer = Enabled Dual Sync Sources Mode 7.5.2.2 PLL Configuration fREFCLK = 614.4 MHz at the DACCLKP/N LVPECL pins fDACCLK = fDATA x Interpolation = 1228.8 MHz fVCO = 3 x fDACCLK = 3686.4 MHz (keep fVCO between 3.3 GHz to 4 GHz) PFD = fOSTR = 38.4 MHz N = 16, M = 32, P = 3, single charge pump pll_vco(5:0) = 100100b (36) Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 63 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Programming (continued) 7.5.2.3 NCO Configuration fNCO = 122.88 MHz fNCO_CLK = 1228.8 MHz freq = fNCO x 2^32 / 1228.8 = 429496730 = 0x1999999A phaseaddAB(31:0) or phaseaddCD(31:0) = 0x19999999A NCO SYNC = rising edge of SYNC 7.5.2.4 Example Start-Up Sequence Table 10. Example Start-Up Sequence Description 64 STEP READ/WRITE ADDRESS VALUE 1 N/A N/A N/A Set TXENABLE Low DESCRIPTION 2 N/A N/A N/A Power-up the device 3 N/A N/A N/A Apply LVPECL DACCLKP/N for PLL reference clock 4 N/A N/A N/A Toggle RESETB pin 5 Write 0x00 0xF29F QMC offset and correction enabled, 4x int, FIFO enabled, Alarm enabled, clock divider sync enabled, inverse sinc filter enabled. 6 Write 0x01 0x050E Single parity enabled, FIFO alarms enabled (2 away, 1 away, and collision). 7 Write 0x02 0xF052 Output shut-off when DACCLK gone, DATACLK gone, and FIFO collision. Mixer block with NCO enabled, twos complement. Word Wide Interface. 8 Write 0x03 0xA000 Output current set to 20mAFS with internal reference and 1.28-kΩ RBIAS resistor. 9 Write 0x07 0xD8FF Un-mask FIFO collision, DACCLK-gone, and DATACLK-gone alarms to the Alarm output. 10 Write 0x08 N/A Program the desired channel A QMC offset value. (Causes Auto-Sync for QMC AB-Channels Offset Block) 11 Write 0x09 N/A Program the desired FIFO offset value and channel B QMC offset value. 12 Write 0x0A N/A Program the desired channel C QMC offset value. (Causes Auto-Sync for QMC CD-Channels Offset Block) 13 Write 0x0B N/A Program the desired channel D QMC offset value. 14 Write 0x0C N/A Program the desired channel A QMC gain value. 15 Write 0x0D N/A Coarse mixer mode not used. Program the desired channel B QMC gain value. 16 Write 0x0E N/A Program the desired channel C QMC gain value. 17 Write 0x0F N/A Program the desired channel D QMC gain value. 18 Write 0x10 N/A Program the desired channel AB QMC phase value. (Causes Auto-Sync QMC AB-Channels Correction Block) 19 Write 0x11 N/A Program the desired channel CD QMC phase value. (Causes Auto-Sync for the QMC CD-Channels Correction Block) 20 Write 0x12 N/A Program the desired channel AB NCO phase offset value. (Causes AutoSync for Channel AB NCO Mixer) 21 Write 0x13 N/A Program the desired channel CD NCO phase offset value. (Causes AutoSync for Channel CD NCO Mixer) 22 Write 0x14 0x999A Program the desired channel AB NCO frequency value 23 Write 0x15 0x1999 Program the desired channel AB NCO frequency value 24 Write 0x16 0x999A Program the desired channel CD NCO frequency value 25 Write 0x17 0x1999 Program the desired channel CD NCO frequency value 26 Write 0x18 0x2C58 PLL enabled, PLL N-dividers sync enabled, single charge pump, prescaler = 3. 27 Write 0x19 0x20F4 M = 32, N = 16, PLL VCO bias tune = 01b Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Programming (continued) Table 10. Example Start-Up Sequence Description (continued) STEP READ/WRITE ADDRESS VALUE 28 Write 0x1A 0x9000 PLL VCO coarse tune = 36 DESCRIPTION 29 Write 0x1B 0x0800 Internal reference 30 Write 0x1E 0x9999 QMC offset AB, QMC offset CD, QMC correction AB, and QMC correction CD can be synced by sif_sync or auto-sync from register write 31 Write 0x1F 0x4440 Mixer AB and CD values synced by SYNCP/N. NCO accumulator synced by SYNCP/N. 32 Write 0x20 0x2400 FIFO Input Pointer Sync Source = ISTR FIFO Output Pointer Sync Source = OSTR (from PLL N-divider output) Clock Divider Sync Source = OSTR 33 N/A N/A N/A Provide all the LVDS DATA and DATACLK Provide rising edge FRAMEP/N and rising edge SYNCP/N to sync the FIFO input pointer and PLL Ndividers. 34 Read 0x18 N/A Read back pll_lfvolt(2:0). If the value is not optimal, adjust pll_vco(5:0) in 0x1A. 35 Write 0x05 0x0000 36 Read 0x05 N/A 37 Write 0x1F 0x4442 Sync all the QMC blocks using sif_sync. These blocks can also be synced via auto-sync through appropriate register writes. 38 Write 0x00 0xF29B Disable clock divider sync. 39 Write 0x1F 0x4448 Set sif_sync to 0b for the next sif_sync event. 40 Write 0x20 0x0000 Disable FIFO input and output pointer sync. 41 Write 0x18 0x2458 Disable PLL N-dividers sync. 42 N/A N/A N/A Clear all alarms in 0x05. Read back all alarms in 0x05. Check for PLL lock, FIFO collision, DACCLKgone, DATACLK-gone, etc. Fix the error appropriately. Repeat step 34 and 35 as necessary. Set TXENABLE high. Enable data transmission. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 65 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 7.6 Register Map Table 11. Register Map (1) Name Address Default (MSB) Bit 15 Bit 14 Bit 13 Bit 12 config0 0x00 0x049C qmc_ offsetAB_ ena qmc_ offsetCD_ ena qmc_ corrAB_ ena qmc_ corrCD_ ena config1 0x01 0x050E iotest_ena reserved reserved 64cnt_ ena oddeven_ parity word_ parity_ ena frame_ parity_ ena config2 0x02 0x7000 16bit_in dacclk gone_ena dataclk gone_ena collision_ gone_ena reserved reserved reserved config3 0x03 0xF000 config4 0x04 NA config5 0x05 0x0000 config6 0x06 NA config7 0x07 0xFFFF config8 0x08 0x0000 config9 0x09 0x8000 config10 0x0A 0x0000 reserved config11 0x0B 0x0000 config12 0x0C 0x0400 config13 0x0D 0x0400 config14 0x0E 0x0400 config15 0x0F 0x0400 output_delayAB (1:0) config16 0x10 0x0000 reserved reserved config17 0x11 0x0000 reserved reserved config18 0x12 0x0000 phase_offsetAB(15:0) config19 0x13 0x0000 phase_offsetCD(15:0) config20 0x14 0x0000 phase_addAB(15:0) config21 0x15 0x0000 phase_addAB(31:16) config22 0x16 0x0000 phase_addCD(15:0) config23 0x17 0x0000 phase_addCD(31:16) config24 0x18 NA config25 0x19 0x0440 config26 0x1A 0x0020 config27 0x1B 0x0000 (1) 66 Bit 11 Bit 10 Bit 9 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 (LSB) Bit 0 fifo_ena reserved reserved alarm_out_ ena alarm_out pol clkdiv_ sync_ ena invsincAB_ ena invsincCD_ ena quad_ena dacA_ complement dacB_ complement dacC_ complement dacD_ complement alarm_ 2away_ ena alarm_ 1away_ ena alarm_ collision_ ena reserved reserved sif4_ena mixer_ena mixer_gain nco_ena revbus reserved twos reserved Bit 8 interp(3:0) coarse_dac(3:0) reserved reserved sif_txenable iotest_results(15:0) alarm_ from_ zerochk reserved alarms_from_fifo(2:0) alarm_ dacclk_ gone alarm_ dataclk_ gone alarm_ from_ iotest alarm_ output_ gone reserved alarm_ from_pll tempdata(7:0) alarm_ rparity alarm_ fparity alarm_ frame_ parity reserved reserved reserved reserved reserved alarms_mask(15:0) reserved reserved reserved qmc_offsetA(12:0) reserved reserved qmc_offsetC(12:0) reserved reserved reserved reserved reserved reserved fifo_offset(2:0) qmc_offsetB(12:0) qmc_offsetD(12:0) reserved cmix(3:0) reserved reserved reserved qmc_gainA(10:0) reserved qmc_gainB(10:0) reserved reserved qmc_gainC(10:0) output_delayCD (1:0) reserved reserved qmc_gainD(10:0) dual_ena (1:0) reserved reserved qmc_phaseAB(11:0) reserved pll_reset qmc_phaseCD(11:0) pll_ ndivsync_ ena pll_ena reserved pll_cp(1:0) pll_m(7:0) pll_n(3:0) pll_vco(5:0) extref_ ena reserved reserved reserved fuse_ sleep pll_p(2:0) reserved reserved reserved bias_ sleep reserved reserved reserved tsense_ sleep reserved pll_sleep pll_lfvolt(2:0) pll_vcoitune(2:0) clkrecv_ sleep sleepA sleepB reserved sleepC sleepD reserved Unless otherwise noted, all reserved registers should be programmed to default values. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Register Map (continued) Table 11. Register Map(1) (continued) (MSB) Bit 15 Name Address Default Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 config28 0x1C 0x0000 reserved config29 0x1D 0x0000 reserved config30 0x1E 0x1111 syncsel_qmoffsetAB(3:0) syncsel_qmoffsetCD(3:0) syncsel_qmcorrAB(3:0) config31 0x1F 0x1140 syncsel_mixerAB(3:0) syncsel_mixerCD(3:0) syncsel_nco(3:0) config32 0x20 0x2400 syncsel_fifoin(3:0) syncsel_fifoout(3:0) config33 0x21 0x0000 config34 0x22 0x1B1B config35 0x23 0xFFFF config36 0x24 0x0000 config37 0x25 0x7A7A iotest_pattern0 config38 0x26 0xB6B6 iotest_pattern1 config39 0x27 0xEAEA iotest_pattern2 config40 0x28 0x4545 iotest_pattern3 config41 0x29 0x1A1A iotest_pattern4 config42 0x2A 0x1616 iotest_pattern5 config43 0x2B 0xAAAA iotest_pattern6 config44 0x2C 0xC6C6 Bit 3 Bit 2 (LSB) Bit 0 Bit 1 reserved reserved syncsel_qmcorCD(3:0) syncsel_dataformatter sif_sync reserved clkdiv_ sync_sel reserved reserved pathA_in_sel(1:0) pathB_in_sel(1:0) pathC_in_sel(1:0) pathD_in_sel(1:0) DACA_out_sel(1:0) DACB_out_sel(1:0) DACC_out_sel(1:0) DACD_out_sel(1:0) sleep_cntl(15:0) datadly(2:0) clkdly(2:0) reserved iotest_pattern7 reserved ostrtodig_ sel config45 0x2D 0x0004 config46 0x2E 0x0000 ramp_ena grp_delayA(7:0) reserved config47 0x2F 0x0000 grp_delayC(7:0) config48 0x30 0x0000 version 0x7F 0x540C sifdac_ena grp_delayB(7:0) grp_delayD(7:0) sifdac(15:0) reserved reserved reserved reserved deviceid(1:0) versionid(2:0) Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 67 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 7.6.1 Register Descriptions Table 12. Register Name: config0 – Address: 0x00, Default: 0x049C Register Name Address Bit Name Function config0 0x00 15 qmc_offsetAB_ena When set, the digital Quadrature Modulator Correction (QMC) offset correction for the AB data path is enabled. 0 14 qmc_offsetCD_ena When set, the digital Quadrature Modulator Correction (QMC) offset correction for the CD data path is enabled. 0 13 qmc_corrAB_ena When set, the QMC phase and gain correction circuitry for the AB data path is enabled. 0 12 qmc_corrCD_ena When set, the QMC phase and gain correction circuitry for the CD data path is enabled. 0 interp(3:0) These bits define the interpolation factor 11:8 68 Default Value 0100 interp Interpolation Factor 0000 1x 0001 2x 0010 4x 0100 8x 1000 16x 7 fifo_ena When set, the FIFO is enabled. When the FIFO is disabled, DACCCLKP/N and DATACLKP/N must be aligned (not recommended). 1 6 Reserved Reserved for factory use. 0 5 Reserved Reserved for factory use. 0 4 alarm_out_ena When set, the ALARM pin becomes an output. When cleared, the ALARM pin is 3-stated. 1 3 alarm_out_pol This bit changes the polarity of the ALARM signal. MM 0: Negative logic MM 1: Positive logic 1 2 clkdiv_sync_ena When set, enables the syncing of the clock divider using the sync source selected by register config32. The internal divided-down clocks will be phase aligned after syncing. Refer to the Power-Up Sequence section for more detail. 1 1 invsincAB_ena When set, the inverse sinc filter for the AB data is enabled. 0 0 invsincCD_ena When set, the inverse sinc filter for the CD data is enabled. 0 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 13. Register Name: config1 – Address: 0x01, Default: 0x050E Register Name Address Bit config1 0x01 15 iotest_ena When set, enables the data pattern checker test. The outputs are deactivated regardless of the state of TXENABLE and sif_txenable. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. 0 12 64cnt_ena When set, enables resetting of the alarms after 64 good samples with the goal of removing unnecessary errors. For instance, when checking setup/hold through the pattern checker test, there may initially be errors. Setting this bit removes the need for a SIF write to clear the alarm register. 0 11 oddeven_parity Selects between odd and even parity check MM 0: Even parity MM 1: Odd parity 0 10 word_parity_ena When set, enables parity checking of each input word using the PARITYP/N parity input. It should match the oddeven_parity register setting. 1 9 frame_parity_ena When set, enables parity checking using the FRAME signal to source the parity bit. 0 8 quad_ena When set, the device is in quad channel mode. To enable the dual channel mode, set Config1, bit to 0b and Config16, bit to 11b. This dual channel mode is functionally equivalent to the dual channel DAC3484 (channels B and C active). See the DAC3484 SLAS748 datasheet for details. 1 7 dacA_complement When set, the DACA output is complemented. This allows to effectively change the + and – designations of the LVDS data lines. 0 6 dacB_complement When set, the DACB output is complemented. This allows to effectively change the + and – designations of the LVDS data lines. 0 5 dacC_complement When set, the DACC output is complemented. This allows to effectively change the + and – designations of the LVDS data lines. 0 4 dacD_complement When set, the DACD output is complemented. This allows to effectively change the + and – designations of the LVDS data lines. 0 3 alarm_2away_ena When set, the alarm from the FIFO indicating the write and read pointers being 2 away is enabled. 1 2 alarm_1away_ena When set, the alarm from the FIFO indicating the write and read pointers being 1 away is enabled. 1 1 alarm_collision_ena When set, the alarm from the FIFO indicating a collision between the write and read pointers is enabled. 1 0 Reserved Reserved for factory use. 0 Name Default Value Function Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 69 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 14. Register Name: config2 – Address: 0x02, Default: 0x7000 Register Name Address Bit config2 0x02 15 16bit_in When set, the input interface is set to word-wide mode. When cleared, the input interface is set to byte-wide mode. 0 14 dacclkgone_ena When set, the DACCLK-gone signal from the clock monitor circuit can be used to shut off the DAC outputs. The corresponding alarms, alarm_dacclk_gone and alarm_output_gone, must not be masked (i.e.Config7, bit and bit must set to 0b). 1 13 dataclkgone_ena When set, the DATACLK-gone signal from the clock monitor circuit can be used to shut off the DAC outputs. The corresponding alarms, alarm_dataclk_gone and alarm_output_gone, must not be masked (i.e.Config7, bit and bit must set to 0b). 1 12 collisiongone_ena When set, the FIFO collision alarms can be used to shut off the DAC outputs. The corresponding alarms, alarm_fifo_collision and alarm_output_gone, must not be masked (i.e.Config7, bit and bit must set to 0b). 1 11 Reserved Reserved for factory use. 0 10 Reserved Reserved for factory use. 0 9 Reserved Reserved for factory use. 0 8 Reserved Reserved for factory use. 0 7 sif4_ena When set, the serial interface (SIF) is a 4 bit interface, otherwise it is a 3-bit interface. 0 6 mixer_ena When set, the mixer block is enabled. 0 5 mixer_gain When set, a 6dB gain is added to the mixer output. 0 4 nco_ena When set, the NCO is enabled. This is not required for coarse mixing. 0 3 revbus When set, the input bits for the data bus are reversed. MSB becomes LSB. 0 2 Reserved Reserved for factory use. 0 1 twos When set, the input data format is expected to be 2s complement. When cleared, the input is expected to be offset-binary. 0 0 Reserved Reserved for factory use. 0 Name Function Default Value Table 15. Register Name: config3 – Address: 0x03, Default: 0xF000 Register Name Address Bit config3 0x03 15:12 Name coarse_dac(3:0) Function Scales the output current in 16 equal steps. IFS Default Value 1111 V = EXTIO ´ 2 ´ (coarse _ dac + 1) RBIAS 11:8 Reserved Reserved for factory use. 0000 7:1 Reserved Reserved for factory use. 0000000 sif_txenable When set, the internal value of TXENABLE is set to 1b. To enable analog output data transmission, set sif_txenable to 1b or pull CMOS TXENABLE pin (A32 for DAC3484IRKD and N9 for DAC3484IZAY) to high. To disable analog output, set sif_txenable to 0b and pull CMOS TXENABLE pin (A32 for DAC3484IRKD and N9 for DAC3484IZAY) to low. 0 0 Table 16. Register Name: config4 – Address: 0x04, Default: No RESET Value (Write to Clear) Register Name Address Bit config4 0x04 15:0 70 Name iotest_results(15:0) Function This register is used with pattern checker test enabled (iotest_ena in config1, bit set to 1b). It does not have a default RESET value. The values of these bits tell which bit in the word failed during the pattern checker test. iotest_results(15:8) correspond to the data bits on D[15:8] and iotest_results(7:0) correspond to the data bits on D[7:0]. Submit Documentation Feedback Default Value No RESET Value Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 17. Register Name: config5 – Address: 0x05, Default: Setup and Power-Up Conditions Dependent (Write to Clear) Register Name Address config5 0x05 Bit Name Function Default Value 15 alarm_from_zerochk This alarm indicates the 8-bit FIFO write pointer address has an all zeros patterns. Due to pointer address being a shift register, this is not a valid address and will cause the write pointer to be stuck until the next sync. This error is typically caused by timing error or improper power start-up sequence. If this alarm is asserted, resynchronization of FIFO is necessary. See Power-Up Sequence for more detail. NA 14 Reserved Reserved for factory use. NA alarms_from_fifo(2:0) Alarm indicating FIFO pointer collisions and nearness: MM 000: All fine MM 001: Pointers are 2 away MM 01x: Pointers are 1 away MM 1xx: FIFO pointer collision If the FIFO pointer collision alarm is set when collisiongone_ena is enabled, the FIFO must be re-synchronized and the bits must be cleared to resume normal operation. NA 10 alarm_dacclk_gone Alarm indicating the DACCLK has been stopped. If the bit is set when dacclkgone_ena is enabled, the DACCLK must resume and the bit must be cleared to resume normal operation. NA 9 alarm_dataclk_gone Alarm indicating the DATACLK has been stopped. If the bit is set when dataclkgone_ena is enabled, the DATACLK must resume and the bit must be cleared to resume normal operation. NA 8 alarm_output_gone Alarm indicating either alarm_dacclk_gone, alarm_dataclk_gone, or alarm_fifo_collision are asserted. It controls the output. When high it will output 0x8000 for each output connected to the DAC. If the bit is set when dacclkgone_ena, dataclkgone_ena, or collisiongone_ena are enabled, then the corresponding errors must be fixed and the bits must be cleared to resume normal operation. NA 7 alarm_from_iotest Alarm indicating the input data pattern does not match the pattern in the iotest_pattern registers. When data pattern checker mode is enabled, this alarm in register config5, bit7 is the only valid alarm. Other alarms in register config5 are not valid and can be disregarded. NA 6 Reserved Reserved for factory use. NA 5 alarm_from_pll Alarm indicating the PLL has lost lock. For version ID 100b or earlier, alarm_from_PLL may not indicate the correct status of the PLL. Refer to pll_lfvolt(2:0) in register config24 for proper PLL lock indication. NA 4 alarm_rparity Alarm indicating a parity error on data captured on the rising edge of DATACLKP/N. NA 3 alarm_fparity Alarm indicating a parity error on data captured on the falling edge of DATACLKP/N. NA 2 alarm_frame_parity Alarm indicating a parity error when using the FRAME as parity bit. NA 1 Reserved Reserved for factory use. NA 0 Reserved Reserved for factory use. NA 13:11 Table 18. Register Name: config6 – Address: 0x06, Default: No RESET Value (Read Only) Register Name Address Bit config6 0x06 15:8 tempdata(7:0) This is the output from the chip temperature sensor. The value of this register in two’s complement format represents the temperature in degrees Celsius. This register must be read with a minimum SCLK period of 1 μs. No RESET Value 7:2 Reserved Reserved for factory use. 000000 1 Reserved Reserved for factory use. 0 0 Reserved Reserved for factory use. 0 Name Default Value Function Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 71 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 19. Register Name: config7 – Address: 0x07, Default: 0xFFFF Register Name Address Bit config7 0x07 15:0 Name alarms_mask(15:0) Default Value Function These bits control the masking of the alarms. (0 = not masked, 1 = masked) alarm_mask Alarm that is Masked 15 alarm_from_zerochk 14 not used 13 alarm_fifo_collision 12 alarm_fifo_1away 11 alarm_fifo_2away 10 alarm_dacclk_gone 9 alarm_dataclk_gone 8 alarm_output_gone 7 alarm_from_iotest 6 not used 5 alarm_from_pll 4 alarm_rparity 3 alarm_fparity 2 alarm_frame_parity 1 not used 0 not used 0xFFFF Table 20. Register Name: config8 – Address: 0x08, Default: 0x0000 (Causes Auto-Sync) Register Name Address Bit config8 0x08 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. qmc_offsetA(12:0) DACA offset correction. The offset is measured in DAC LSBs. If enabled in config30 writing to this register causes an auto-sync to be generated. This loads the values of the QMC offset registers (config8-config9) into the offset block at the same time. When updating the offset values for AB channel config8 should be written last. Programming config9 will not affect the offset setting. Name 12:0 Function Default Value 0 All zeros Table 21. Register Name: config9 – Address: 0x09, Default: 0x8000 Register Name Address config9 0x09 Bit Name Function 15:13 fifo_offset(2:0) When the sync to the FIFO occurs, this is the value loaded into the FIFO read pointer. With this value the initial difference between write and read pointers can be controlled. This may be helpful in syncing multiple chips or controlling the delay through the device. 12:0 DACB offset correction. The offset is measured in DAC LSBs. qmc_offsetB(12:0) Default Value 100 All zeros Table 22. Register Name: config10 – Address: 0x0A, Default: 0x0000 (Causes Auto-Sync) Register Name Address Bit config10 0x0A 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. qmc_offsetC(12:0) DACC offset correction. The offset is measured in DAC LSBs. If enabled in config30 writing to this register causes an auto-sync to be generated. This loads the values of the CD-channel QMC offset registers (config10-config11) into the offset block at the same time. When updating the offset values for the CD-channel config10 should be written last. Programming config11 will not affect the offset setting. 12:0 72 Name Function Submit Documentation Feedback Default Value 0 All zeros Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 23. Register Name: config11 – Address: 0x0B, Default: 0x0000 Register Name Address Bit config11 0x0B 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. qmc_offsetD(12:0) DACD offset correction. The offset is measured in DAC LSBs. 12:0 Name Default Value Function 0 All zeros Table 24. Register Name: config12 – Address: 0x0C, Default: 0x0400 Register Name Address Bit config12 0x0C 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. 0 12 Reserved Reserved for factory use. 0 11 Reserved Reserved for factory use. qmc_gainA(10:0) QMC gain for DACA. The full 11-bit qmc_gainA(10:0) word is formatted as UNSIGNED with a range of 0 to 1.9990. The implied decimal point for the multiplication is between bit 9 and bit 10. 10:0 Name Default Value Function 0 10000000 000 Table 25. Register Name: config13 – Address: 0x0D, Default: 0x0400 Register Name Address Bit config13 0x0D 15 cmix_mode(3:0) Sets the mixing function of the coarse mixer. MM Bit 15: Fs/8 mixer MM Bit 14: Fs/4 mixer MM Bit 13: Fs/2 mixer MM Bit 12: -Fs/4 mixer The various mixers can be combined together to obtain a ±n×Fs/8 total mixing factor. 11 Reserved Reserved for factory use. qmc_gainB(10:0) QMC gain for DACB. The full 11-bit qmc_gainB(10:0) word is formatted as UNSIGNED with a range of 0 to 1.9990. The implied decimal point for the multiplication is between bit 9 and bit 10. 10:0 Name Default Value Function 0000 0 10000000 000 Table 26. Register Name: config14 – Address: 0x0E, Default: 0x0400 Register Name Address Bit config14 0x0E 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. 0 12 Reserved Reserved for factory use. 0 11 Reserved Reserved for factory use. qmc_gainC(10:0) QMC gain for DACC. The 11-bit qmc_gainC(10:0) word is formatted as UNSIGNED with a range of 0 to 1.9990. The implied decimal point for the multiplication is between bit 9 and bit 10. 10:0 Name Default Value Function 0 10000000 000 Table 27. Register Name: config15 – Address: 0x0F, Default: 0x0400 Register Name Address Bit config15 0x0F 15:14 output_ delayAB(1:0) Delays the AB data path outputs from 0 to 3 DAC clock cycles. 00 13:12 output_ delayCD(1:0) Delays the CD data path outputs from 0 to 3 DAC clock cycles. 00 Reserved Reserved for factory use. qmc_gainD(10:0) QMC gain for DACD. The full 11-bit qmc_gainD(10:0) word is formatted as UNSIGNED with a range of 0 to 1.9990. The implied decimal point for the multiplication is between bit 9 and bit 10. 11 10:0 Name Default Value Function 0 10000000 000 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 73 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 28. Register Name: config16 – Address: 0x10, Default: 0x0000 (Causes Auto-Sync) Register Name Address Bit config16 0x10 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13:12 dual_ena (1:0) To enable the dual channel mode, set Config1, bit to 0b and Config16, bit to 11b. This dual channel mode is functionally equivalent to the dual channel DAC3484 (channels B and C active). See the DAC3482 SLAS748 data sheet for details. 0 11:0 qmc_phaseAB(11:0) QMC correction phase for the AB data path. The 12-bit qmc_phaseAB(11:0) word is formatted as 2s complement and scaled to occupy a range of –0.5 to 0.49975 and a default phase correction of 0.00. To accomplish QMC phase correction, this value is multiplied by the current B sample, then summed into the A sample. If enabled in config30 writing to this register causes an auto-sync to be generated. This loads the values of the QMC correction registers (config12, config13, and config16) into the QMC block at the same time. When updating the QMC values for the AB channel config16 should be written last. Programming config12 and config13 will not affect the QMC settings. Name Function Default Value All zeros Table 29. Register Name: config17 – Address: 0x11, Default: 0x0000 (Causes Auto-Sync) Register Name Address Bit config17 0x11 15 Reserved Reserved for factory use. 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. 0 12 Reserved Reserved for factory use. qmc_phaseCD(11:0) QMC correction phase for the CD data path. The 12-bit qmc_phaseCD(11:0) word is formatted as 2s complement and scaled to occupy a range of –0.5 to 0.49975 and a default phase correction of 0.00. To accomplish QMC phase correction, this value is multiplied by the current D sample, then summed into the C sample. If enabled in config30 writing to this register causes an auto-sync to be generated. This loads the values of the CD-channel QMC block registers (config14, config15, and config17) into the QMC block at the same time. When updating the QMC values for the CD-channel config17 should be written last. Programming config14 and config15 will not affect the QMC settings. 11:0 Name Function Default Value 0 All zeros Table 30. Register Name: config18 – Address: 0x12, Default: 0x0000 (Causes Auto-Sync) Register Name Address Bit Name Function config18 0x12 15:0 phase_offsetAB(15:0) Phase offset added to the AB data path NCO accumulator before the generation of the SIN and COS values. The phase offset is added to the upper 16 bits of the NCO accumulator results and these 16 bits are used in the sin/cos lookup tables. If enabled in config31 writing to this register causes an auto-sync to be generated. This loads the values of the fine mixer block registers (config18, config20, and config21) at the same time. When updating the mixer values the config18 should be written last. Programming config20 and config21 will not affect the mixer settings. Default Value 0x0000 Table 31. Register Name: config19 – Address: 0x13, Default: 0x0000 (Causes Auto-Sync) Register Name Address Bit config19 0x13 15:0 74 Name phase_ offsetCD(15:0) Function Phase offset added to the CD data path NCO accumulator before the generation of the SIN and COS values. The phase offset is added to the upper 16 bits of the NCO accumulator results and these 16 bits are used in the sin/cos lookup tables. If enabled in config31 writing to this register causes an auto-sync to be generated. This loads the values of the CD-channel fine mixer block registers (config19, config22 and config23) at the same time. When updating the mixer values for the CD-channel config19 should be written last. Programming config22 and config23 will not affect the mixer settings. Submit Documentation Feedback Default Value 0x0000 Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 32. Register Name: config20 – Address: 0x14, Default: 0x0000 Register Name Address Bit config20 0x14 15:0 Name phase_ addAB(15:0) Default Value Function The phase_addAB(15:0) value is used to determine the NCO frequency. The 2s complement formatted value can be positive or negative. Each LSB represents Fs/(2^32) frequency step. 0x0000 Table 33. Register Name: config21 – Address: 0x15, Default: 0x0000 Register Name Address Bit config21 0x15 15:0 Name phase_ addAB(31:16) Default Value Function See config20 above. 0x0000 Table 34. Register Name: config22 – Address: 0x16, Default: 0x0000 Register Name Address Bit config22 0x16 15:0 Name phase_ addCD(15:0) Default Value Function The phase_addCD(15:0) value is used to determine the NCO frequency. The 2s complement formatted value can be positive or negative. Each LSB represents Fs/(2^32) frequency step. 0x0000 Table 35. Register Name: config23 – Address: 0x17, Default: 0x0000 Register Name Address Bit config23 0x17 15:0 Name phase_ addCD(31:16) Default Value Function See config22 above. 0x0000 Table 36. Register Name: config24 – Address: 0x18, Default: NA Register Name Address Bit config24 0x18 15:13 Reserved Reserved for factory use. 12 pll_reset When set, the PLL loop filter (LPF) is pulled down to 0 V. Toggle from 1b to 0b to restart the PLL if an over-speed lock-up occurs. Over-speed can happen when the process is fast, the supplies are higher than nominal, etc. resulting in the feedback dividers missing a clock. 0 11 pll_ndivsync_ena When set, the LVDS SYNC input is used to sync the PLL N dividers. 1 10 pll_ena When set, the PLL is enabled. When cleared, the PLL is bypassed. 0 9:8 Reserved Reserved for factory use. 00 7:6 pll_cp(1:0) PLL pump charge select MM 00: No charge pump MM 01: Single pump charge MM 10: Not used MM 11: Dual pump charge 00 5:3 pll_p(2:0) PLL pre-scaler dividing module control. MM 010: 2 MM 011: 3 MM 100: 4 MM 101: 5 MM 110: 6 MM 111: 7 MM 000: 8 001 2:0 pll_lfvolt(2:0) PLL loop filter voltage. This three bit read-only indicator has step size of 0.4125 V. The entire range covers from 0 V to 3.3 V. The optimal lock range of the PLL will be from 010 to 101 (0.825 V to 2.063 V). Adjust pll_vco(5:0) for optimal lock range. NA Name Default Value Function 001 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 75 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 37. Register Name: config25 – Address: 0x19, Default: 0x0440 Register Name Address Bit config25 0x19 15:8 pll_m(7:0) M portion of the M/N divider of the PLL. If pll_m = 0, the M divider value has the range of pll_m, spanning from 4 to 127. (0, 1, 2, and 3 are not valid.) If pll_m = 1, the M divider value has the range of 2 × pll_m, spanning from 8 to 254. (0, 2, 4, and 6 are not valid. M divider has even values only.) 0x04 7:4 pll_n(3:0) N portion of the M/N divider of the PLL. MM 0000: 1 MM 0001: 2 MM 0010: 3 MM 0011: 4 MM 0100: 5 MM 0101: 6 MM 0110: 7 MM 0111: 8 MM 1000: 9 MM 1001: 10 MM 1010: 11 MM 1011: 12 MM 1100: 13 MM 1101: 14 MM 1110: 15 MM 1111: 16 0100 3:2 pll_vcoitune(1:0) PLL VCO bias tuning bits. Set to 01b for normal PLL operation. 00 1:0 Reserved Reserved for factory use. 00 Name Function Default Value Table 38. Register Name: config26 – Address: 0x1A, Default: 0x0020 Register Name Address Bit config26 0x1A 15:10 76 Name Function Default Value pll_vco(5:0) VCO frequency coarse tuning bits. 9 Reserved Reserved for factory use. 0 8 Reserved Reserved for factory use. 0 7 bias_sleep When set, the bias amplifier is put into sleep mode. 0 6 tsense_sleep Turns off the temperature sensor when asserted. 0 5 pll_sleep When set, the PLL is put into sleep mode. 1 4 clkrecv_sleep When asserted the clock input receiver gets put into sleep mode. This affects the OSTR receiver as well. 0 3 sleepA When set, the DACA is put into sleep mode. 0 2 sleepB When set, the DACB is put into sleep mode. 0 1 sleepC When set, the DACC is put into sleep mode. 0 0 sleepD When set, the DACD is put into sleep mode. 0 Submit Documentation Feedback 000000 Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 39. Register Name: config27 – Address: 0x1B, Default: 0x0000 Register Name Address Bit config27 0x1B 15 extref_ena Allows the device to use an external reference or the internal reference. MM 0: Internal reference MM 1: External reference 0 14 Reserved Reserved for factory use. 0 13 Reserved Reserved for factory use. 0 12 Reserved Reserved for factory use. 0 11 fuse_sleep Put the fuses to sleep when set high. If SLEEP pin is set to logic HIGH before and during device power-up and initialization, the fuse_sleep bit in register 0x1B, bit 11 must be written after register 0x23 during device initialization register setup. Note: Default value is ‘0’. Must be set to ‘1’ for proper operation 0 10 Reserved Reserved for factory use. 0 9 Reserved Reserved for factory use. 0 8 Reserved Reserved for factory use. 0 7 Reserved Reserved for factory use. 0 6 Reserved Reserved for factory use. atest ATEST mode allows the user to check for the internal die voltages to ensure the supply voltages are within the range. When ATEST mode is programmed, the internal die voltages can be measured at the TXENABLE pin. The TXENABLE pin (A32) must be floating without any pull-up or pull-down resistors. In ATEST mode, the TXENABLE and sif_txenable logics are bypassed, and output will be active at all time. 5:0 Name Default Value Function Config27, bit 0 Description 000000 Expected Nominal Voltage 001110 DACA AVSS 0V 001111 DACA DVDD 1.2 V 010000 DACA AVDD 3.3 V 010110 DACB AVSS 0V 010111 DACB DVDD 1.2 V 011000 DACB AVDD 3.3 V 011110 DACC AVSS 0V 011111 DACC DVDD 1.2 V 100000 DACC AVDD 3.3 V 100110 DACD AVSS 0V 100111 DACD DVDD 1.2 V 101000 DACD AVDD 3.3 V 110000 DIGVDD 1.2 V 000101 CLKVDD 1.2 V Table 40. Register Name: config28 – Address: 0x1C, Default: 0x0000 Register Name Address Bit config28 0x1C 15:8 Reserved Reserved for factory use. 0x00 7:0 Reserved Reserved for factory use. 0x00 Name Default Value Function Table 41. Register Name: config29 – Address: 0x1D, Default: 0x0000 Register Name Address Bit config29 0x1D 15:8 Reserved Reserved for factory use. 0x00 7:0 Reserved Reserved for factory use. 0x00 Name Function Default Value Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 77 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 42. Register Name: config30 – Address: 0x1E, Default: 0x1111 Register Name Address Bit config30 0x1E 15:12 syncsel_qmoffsetAB(3:0) Selects the syncing source(s) of the AB data path double buffered QMC offset registers. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 15: sif_sync (via config31) MM Bit 14: SYNC MM Bit 13: OSTR MM Bit 12: Auto-sync from register write 0001 11:8 syncsel_ qmoffsetCD(3:0) Selects the syncing source(s) of the CD data path double buffered QMC offset registers. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 11: sif_sync (via config31) MM Bit 10: SYNC MM Bit 9: OSTR MM Bit 8: Auto-sync from register write 0001 7:4 syncsel_ qmccorrAB(3:0) Selects the syncing source(s) of the AB data path double buffered QMC correction registers. A ‘1’ in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 7: sif_sync (via config31) MM Bit 6: SYNC MM Bit 5: OSTR MM Bit 4: Auto-sync from register write 0001 3:0 syncsel_ qmccorrCD(3:0) Selects the syncing source(s) of the CD data path double buffered QMC correction registers. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 3: sif_sync (via config31) MM Bit 2: SYNC MM Bit 1: OSTR MM Bit 0: Auto-sync from register write 0001 Name Function Default Value Table 43. Register Name: config31 – Address: 0x1F, Default: 0x1140 Register Name Address Bit config31 0x1F 15:12 syncsel_mixerAB(3:0) Selects the syncing source(s) of the AB data path double buffered mixer registers. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 15: sif_sync (via config31) MM Bit 14: SYNC MM Bit 13: OSTR MM Bit 12: Auto-sync from register write 0001 11:8 syncsel_ mixerCD(3:0) Selects the syncing source(s) of the CD data path double buffered mixer registers. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 11: sif_sync (via config31) MM Bit 10: SYNC MM Bit 9: OSTR MM Bit 8: Auto-sync from register write 0001 7:4 syncsel_nco(3:0) Selects the syncing source(s) of the two NCO accumulators. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 7: sif_sync (via config31) MM Bit 6: SYNC MM Bit 5: OSTR MM Bit 4: FRAME 0100 3:2 syncsel_dataformatter(1: 0) Selects the syncing source of the data formatter. Unlike the other syncs only one sync source is allowed. MM 00: FRAME MM 01: SYNC MM 10: No sync MM 11: No sync 00 1 sif_sync SIF created sync signal. Set to 1b to cause a sync and then clear to 0b to remove it. 0 0 Reserved Reserved for factory use. 0 78 Name Function Submit Documentation Feedback Default Value Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 44. Register Name: config32 – Address: 0x20, Default: 0x2400 Register Name Address Bit config32 0x20 15:12 syncsel_fifoin(3:0) Selects the syncing source(s) of the FIFO input side. A ‘1’ in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 15: sif_sync (via config31) MM Bit 14: Always zero MM Bit 13: FRAME MM Bit 12: SYNC 0010 11:8 syncsel_fifoout(3:0) Selects the syncing source(s) of the FIFO output side. A 1b in the bit enables the signal as a sync source. More than one sync source is permitted. MM Bit 11: sif_sync (via config31) MM Bit 10: OSTR – Dual Sync Sources Mode MM Bit 9: FRAME – Single Sync Source mode MM Bit 8: SYNC – Single Sync Source mode 0100 7:1 Reserved Reserved for factory use. 0000 clkdiv_sync_sel Selects the signal source for clock divider synchronization. 0 Name Default Value Function clkdiv_sync_sel 0 Sync Source 0 OSTR 1 FRAME or SYNC, based on syncsel_fifoin source selection (config32, bit) Table 45. Register Name: config33 – Address: 0x21, Default: 0x0000 Register Name Address Bit config33 0x21 15:0 Name Reserved Default Value Function Reserved for factory use. 0x0000 Table 46. Register Name: config34 – Address: 0x22, Default: 0x1B1B Register Name Address Bit config34 0x22 15:14 pathA_in_sel(1:0) Selects the word used for the A channel path. 00 13:12 pathB_in_sel(1:0) Selects the word used for the B channel path. 01 11:10 pathC_in_sel(1:0) Selects the word used for the C channel path. 10 9:8 pathD_in_sel(1:0) Selects the word used for the D channel path. 11 7:6 DACA_out_sel(1:0) Selects the word used for the DACA output. 00 5:4 DACB_out_sel(1:0) Selects the word used for the DACB output. 01 3:2 DACC_out_sel(1:0) Selects the word used for the DACC output. 10 1:0 DACD_out_sel(1:0) Selects the word used for the DACD output. 11 Name Function Default Value Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 79 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 47. Register Name: config35 – Address: 0x23, Default: 0xFFFF Register Name Address Bit config35 0x23 15:0 Name sleep_cntl(15:0) Default Value Function Controls the routing of the CMOS SLEEP signal (pin B40 for the DAC3484IRKD and pin B8 for the DAC3484IZAY) to different blocks. When a bit in this register is set, the SLEEP signal will be sent to the corresponding block. The block will only be disabled when the SLEEP is logic HIGH and the correspond bit is set to 1b. 0xFFFF These bits do not override SIF bits in config26 that control the same sleep function. sleep_cntl(bit) Function 15 DACA sleep 14 DACB sleep 13 DACC sleep 12 DACD sleep 11 Clock receiver sleep 10 PLL sleep 9 LVDS data sleep 8 LVDS control sleep 7 Temp sensor sleep 6 reserved 5 Bias amplifier sleep All others not used Table 48. Register Name: config36 – Address: 0x24, Default: 0x0000 Register Name Address Bit config36 0x24 15:13 datadly(2:0) Controls the delay of the data inputs through the LVDS receivers. Each LSB adds approximately 50 ps. Refer to Digital Input Timing Specifications Table for details. MM 0: Minimum 000 12:10 clkdly(2:0) Controls the delay of the data clock through the LVDS receivers. Each LSB adds approximately 50 ps. Refer to Digital Input Timing Specifications Table for details. MM 0: Minimum 000 9:0 Reserved Reserved for factory use. Name Function Default Value 0x000 Table 49. Register Name: config37 – Address: 0x25, Default: 0x7A7A Register Name Address Bit config37 0x25 15:0 Name iotest_pattern0 Function Dataword0 in the IO test pattern. It is used with the seven other words to test the input data. At the start of the IO test pattern, this word should be aligned with rising edge of FRAME or SYNC signal to indicate sample 0. Default Value 0x7A7A Table 50. Register Name: config38 – Address: 0x26, Default: 0xB6B6 Register Name Address Bit config38 0x26 15:0 Name iotest_pattern1 Function Dataword1 in the IO test pattern. It is used with the seven other words to test the input data. Default Value 0xB6B6 Table 51. Register Name: config39 – Address: 0x27, Default: 0xEAEA Register Name Address Bit config39 0x27 15:0 Name iotest_pattern2 Function Dataword2 in the IO test pattern. It is used with the seven other words to test the input data. Default Value 0xEAEA Table 52. Register Name: config40 – Address: 0x28, Default: 0x4545 Register Name Address Bit config40 0x28 15:0 80 Name iotest_pattern3 Function Default Value Dataword3 in the IO test pattern. It is used with the seven other words to test the input data. 0x4545 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 53. Register Name: config41 – Address: 0x29, Default: 0x1A1A Register Name Address Bit Name config41 0x29 15:0 iotest_pattern4 Default Value Function Dataword4 in the IO test pattern. It is used with the seven other words to test the input data. 0x1A1A Table 54. Register Name: config42 – Address: 0x2A, Default: 0x1616 Register Name Address Bit config42 0x2A 15:0 Name iotest_pattern5 Default Value Function Dataword5 in the IO test pattern. It is used with the seven other words to test the input data. 0x1616 Table 55. Register Name: config43 – Address: 0x2B, Default: 0xAAAA Register Name Address Bit config43 0x2B 15:0 Name iotest_pattern6 Default Value Function Dataword6 in the IO test pattern. It is used with the seven other words to test the input data. 0xAAAA Table 56. Register Name: config44 – Address: 0x2C, Default: 0xC6C6 Register Name Address Bit config44 0x2C 15:0 Name iotest_pattern7 Default Value Function Dataword7 in the IO test pattern. It is used with the seven other words to test the input data. 0xC6C6 Table 57. Register Name: config45 – Address: 0x2D, Default: 0x0004 Register Name Address Bit config45 0x2D 15 reserved Reserved for factory use 0 14 ostrtodig_sel When set, the OSTR signal is passed directly to the digital block. This is the signal that is used to clock the dividers. 0 Name Default Value Function 13 ramp_ena When set, a ramp signal is inserted in the input data at the FIFO input. 12:1 Reserved Reserved for factory use. 0 sifdac_ena When set, the DAC output is set to the value in sifdac(15:0) in register config48. In this mode, sif_txena in config3 and TXENABLE inputs are ignored. 0 0000 0000 0010 0 Table 58. Register Name: config46 – Address: 0x2E, Default: 0x0000 Register Name Address Bit config46 0x2E 15:8 grp_delayA(7:0) Sets the group delay function for DACA. The maximum delay ranges from 30 ps to 100 ps and is dependent on DAC sample clock. Contact TI for specific application information. 0x00 7:0 grp_delayB(7:0) Sets the group delay function for DACB. The maximum delay ranges from 30 ps to 100 ps and is dependent on DAC sample clock. Contact TI for specific application information. 0x00 Name Default Value Function Table 59. Register Name: config47 – Address: 0x2F, Default: 0x0000 Register Name Address Bit config47 0x2F 15:8 grp_delayC(7:0) Sets the group delay function for DACC. The maximum delay ranges from 30 ps to 100 ps and is dependent on DAC sample clock. Contact TI for specific application information. 0x00 7:0 grp_delayD(7:0) Sets the group delay function for DACD. The maximum delay ranges from 30 ps to 100 ps and is dependent on DAC sample clock. Contact TI for specific application information. 0x00 Name Default Value Function Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 81 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Table 60. Register Name: config48 – Address: 0x30, Default: 0x0000 Register Name Address Bit config48 0x30 15:0 Name sifdac(15:0) Function Value sent to the DACs when sifdac_ena is asserted. DATACLK must be running to latch this value into the DACs. The format would be based on twos in register config2. Default Value 0x0000 Table 61. Register Name: Version – Address: 0x7F, Default: 0x540C (Read Only) Register Name Address Bit version 0x7F 15:10 Reserved Reserved for factory use. 9 Reserved Reserved for factory use. 0 8:7 Reserved Reserved for factory use. 00 6:5 Reserved Reserved for factory use. 00 4:3 deviceid(1:0) Returns 01b for DAC3484. 01 2:0 versionid(2:0) A hardwired register that contains the version of the chip. 100 82 Name Function Submit Documentation Feedback Default Value 010101 Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The DAC3484 is a quad 16-bit DAC with max input data rate of up to 312.5 MSPS per DAC and max DAC update rate of 1.25 GSPS after the final, selectable interpolation stages. With build-in interpolation filter of 2x, 4x, 8x, and 16x options, the lower input data rate can be interpolated all the way to 1.25 GSPS. This allows the DAC to update the samples at higher rate, and pushes the DAC images further away to relax anti-image filer specification due to the increased Nyquist bandwidth. With integrated coarse and fine mixers, baseband signal can be upconverted to an intermediate frequency (IF) signal between the baseband processor and post-DAC analog signal chains. The DAC can output baseband or IF when connected to post-DAC analog signals chain components such as transformers or IF amplifiers. When used in conjunction with TI RF quadrature modulator such as the TRF3705, the DAC and RF modulator can function as a set of baseband or IF upconverter. With integrated QMC circuits, the LO offset and the sideband artifacts can be properly corrected in the direct up-conversion applications. The DAC3484 provides the bandwidth, performance, small footprint, and lower power consumption needed for multimode 2G/3G/4G cellular base stations to migrate to more advanced technologies, such as LTE-Advanced and carrier aggregation on multiple antennas. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 83 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 8.2 Typical Applications 8.2.1 IF Based LTE Transmitter Figure 91 shows an example block diagram for a direct conversion radio. The design requires a single carrier, 20-MHz LTE signal. The system has digital-predication (DPD) to correct up to 5th order distortion so the total DAC output bandwidth is 100 MHz. Interpolation is used to output the signal at highest sampling rate possible to simplify the analog filter requirements and move high order harmonics out of band (due to wider Nyquist zone). The internal PLL is used to generate the final DAC output clock from a reference clock of 491.52 MHz. DAC3484 Complex Mixer (48-bit NCO) FPGA 16-bit DAC TRF3705 RF TRF3705 RF 16-bit DAC xN Complex Mixer (48-bit NCO) LVDS Interface xN xN 16-bit DAC 16-bit DAC xN Clock Distribution PLL TRF3765 DACCLK SYSREF LMK04828 Figure 91. Dual Low-IF Wideband LTE Transmitter Diagram 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 62 as the input parameters. Table 62. Design Parameters DESIGN PARAMETER 84 EXAMPLE VALUE Signal Bandwidth (BWsignal) 20 MHz Total DAC Output Bandwidth (BWtotal) 100 MHz DAC PLL On DAC PLL Reference Frequency 491.52 MHz Maximum FPGA LVDS Rate 491.52 Mbps Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Data Input Rate Nyquist theory states that the data rate must be at least two times the highest signal frequency. The data will be sent to the DAC as complex baseband data. Due to the quadrature nature of the signal, each in-phase (I component) and quadrature (Q component) need to have 50 MHz of bandwidth to construct 100 MHz of complex bandwidth. Since the interpolation filter design is not the ideal half-band filter design with infinite roll-off at FDATA/2 (refer to FIR Filters section for more detail), the filter limits the useable input bandwidth to about 40 percent of FDATA. Therefore, the minimum data input rate is 125 MSPS. Since the standard telecom data rate is typically multiples of 30.72 MSPS, the DAC input data rate is chosen to be eight times of 30.72 MSPS, which is 245.76 MSPS. 8.2.1.2.2 Interpolation It is desired to use the highest DAC output rate as possible to move the DAC images further from the signal of interest to ease analog filter requirement. The DAC output rate must be greater than two times the highest output frequency of 200 MHz, which is greater than 400 MHz. Table 63 shows the possible DAC output rates based on the data input rate and available interpolation settings. The DAC image frequency is also listed. Table 63. Interpolation FDATA INTERPOLATION FDAC POSSIBLE? LOWEST IMAGE FREQUENCY DISTANCE FROM BAND OF INTEREST 245.76 MSPS 1 245.76 MSPS No N/A N/A 245.76 MSPS 2 491.52 MSPS Yes 318.64 MHz 145.76 MHz 245.76 MSPS 4 983.04 MSPS Yes 810.16 MHz 637.28 MHz 245.76 MSPS 8 1966.08 MSPS No N/A N/A 245.76 MSPS 16 3932.16 MSPS No N/A N/A 8.2.1.2.3 LO Feedthrough and Sideband Correction For typical IF based systems, the IF location is selected such that the image location and the LO feedthrough location is far from the signal location. The minimum distance is based on the bandpass filter roll-off and attenuation level at the LO feedthrough and image location. If sufficient attenuation level of these two artifacts meets the system requirement, then further digital cancellation of these artifacts may not be needed. Although the I/Q modulation process will inherently reduce the level of the RF sideband signal, an IF based transmitter without sufficient RF image rejection capabilities or an zero-IF based system (detail in the next section) will likely need additional sideband suppression to maximize performance. Further, any mixing process will result in some feedthrough of the LO source. The DAC3484 has build-in digital features to cancel both the LO feedthrough and sideband signal. The LO feedthrough is corrected by adding a DC offset to the DAC outputs until the LO feedthrough power is suppressed. The sideband suppression can be improved by correcting the gain and phase differences between the I and Q analog outputs through the digital QMC block. Besides gain and phase differences between the I and Q analog outputs, group delay differences may also be present in the signal path and are typically contributed by group delay variations of post DAC image reject analog filters and PCB trace variations. Since delay in time translates to higher order linear phase variation, the sideband of a wideband system may not be completely suppressed by typical digital QMC block. The DAC3484 has integrated group delay correction feature to provide delay adjustments. (The maximum group delay correction ranges from 30 ps to 100 ps and is dependent on DAC sample clock. Contact TI for specific application information.) Moreover, system designer may implement additional linear group delay compensation in the host processor to the DAC to perform higher order sideband suppression. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 85 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 8.2.1.3 Application Curves The ACPR performance for LTE 20 MHz TM1.1 are shown in Figure 92, Figure 93, Figure 93, and Figure 93. The figures provide comparisons between two major LTE bands such as 2.14 GHz and 2.655 GHz, and also comparisons between two different DAC clocking options such as DAC on-chip PLL mode and external clocking mode. DAC Output IF = 122.88 MHz, LO = 2017.12 MHz, DAC Clock = External Clock Source from LMK04806 Figure 92. 20MHz TM1.1 LTE Carrier at 2.14GHz DAC Output IF = 122.88 MHz, LO = 2532.12 MHz, DAC Clock = External Clock Source from LMK04806 Figure 94. 20MHz TM1.1 LTE Carrier at 2.655GHz 86 DAC Output IF = 122.88 MHz, LO = 2017.12 MHz, DAC Clock = DAC3484 On-Chip PLL Figure 93. 20MHz TM1.1 LTE Carrier at 2.14GHz DAC Output IF = 122.88 MHz, LO = 2532.12 MHz, DAC Clock = DAC3484 On-Chip PLL Figure 95. 20MHz TM1.1 LTE Carrier at 2.655GHz Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 8.2.2 Direct Upconversion (Zero IF) LTE Transmitter Figure 91 shows an example block diagram for a direct conversion radio. The design specification requires that the desired output bandwidth is 40 MHz, which could be, for instance, a typical LTE signal. The system has DPD to correct up to 5th order distortion so the total DAC output bandwidth is 200 MHz. Interpolation is used to output the signal at the highest sampling rate possible to simplify the analog filtering requirements and move high order harmonics out of band (due to wider Nyquist zone). The DAC sampling clock is provided by high quality clock synthesizer such as the LMK0480x family. DAC3484 QMC Gain, Phase, Offset FPGA xN QMC Gain, Phase, Offset LVDS Interface xN xN xN 16-bit DAC TRF3705 RF TRF3705 RF 16-bit DAC 16-bit DAC 16-bit DAC Clock Distribution TRF3765 DACCLK SYSREF LMK04828 Figure 96. Zero LTE Transmitter Diagram 8.2.2.1 Design Requirements For this design example, use the parameters listed in Table 64 as the input parameters. Table 64. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Signal Bandwidth (BWsignal) 40 MHz Total DAC Output Bandwidth (BWtotal) 200 MHz DAC PLL Off Maximum FPGA LVDS Rate 1228.8 Mbps Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 87 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 8.2.2.2 Detailed Design Procedure 8.2.2.2.1 Data Input Rate Nyquist theory states that the data rate must be at least two times the highest signal frequency. The data will be sent to the DAC as complex baseband data. Due to the quadrature nature of the signal, each in-phase (I component) and quadrature (Q component) need to have 100 MHz of bandwidth to construct 200 MHz of complex bandwidth. Since the interpolation filter design is not the ideal half-band filter design with infinite roll-off at FDATA/2 (refer to FIR Filters section for more detail), the filter limits the useable input bandwidth to about 44 percent of FDATA with less than 0.1dB of FIR filter roll-off. Therefore, the minimum data input rate is 228 MSPS. Since the standard telecom data rate is typically multiples of 30.72 MSPS, the DAC input data rate is chosen to be 10 times of 30.72 MSPS, which is 307.2 MSPS. 8.2.2.2.2 Interpolation It is desired to use the highest DAC output rate as possible to move the DAC images further from the signal of interest to ease analog filter requirement. The DAC output rate must be greater than two times the highest output frequency of 100 MHz, which is greater than 200 MHz. The table below shows the possible DAC output rates based on the data input rate and available interpolation settings. The DAC image frequency is also listed. Table 65. Interpolation FDATA INTERPOLATION FDAC POSSIBLE? LOWEST IMAGE FREQUENCY DISTANCE FROM BAND OF INTEREST 307.2 MSPS 1 307.2 MSPS Yes 287.2 MHz 267.2 MHz 307.2 MSPS 2 614.4 MSPS Yes 594.4 MHz 574.4 MHz 307.2 MSPS 4 1228.8 MSPS Yes 1208.8 1188.8 307.2 MSPS 8 2457.6 MSPS No N/A N/A 307.2 MSPS 16 4915.2 MSPS No N/A N/A 8.2.2.2.3 LO Feedthrough and Sideband Correction Refer to LO Feedthrough and Sideband Correction section of IF based LTE Transmitter design. 88 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 8.2.2.3 Application Curves The ACPR performance for LTE 20MHz TM1.1 are shown in Figure 97 and Figure 98. The figures provide comparisons between two major LTE bands such as 2.14 GHz and 2.655 GHz with DAC clocking option set to external clocking mode. DAC Output IF = 0 MHz, LO = 2140 MHz, DAC Clock = External Clock Source from LMK04806 Figure 97. 4x10MHz TM1.1 LTE Carrier at 2.14GHz DAC Output IF = 0 MHz, LO = 2655 MHz, DAC Clock = External Clock Source from LMK04806 Figure 98. 4x10MHz TM1.1 LTE Carrier at 2.655GHz Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 89 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 9 Power Supply Recommendations Powered by CLKVDD IOUTP Sample Clock Switch Drivers Decoder Logic = Digital Input Data DAC IOUTN Analog Output As shown in Figure 99, the DAC3484 device has various power rails and has two primary voltages of 1.2 V and 3.3 V. Some of the DAC power rails such as CLKVDD and AVDD are more noise sensitive than other rails because they are mainly powering the switch drivers for the current switch array and the current bias circuits, respectively. These circuits are the main analog DAC core. Any power supply noises such as switching power supply ripple may be modulated directly onto the signal of interest. These two power rails should be powered by low noise power supplies such as LDO. Powering the rail directly with switching power supplies is not recommended for these two rails. Switch Array Powered by DACVDD Powered by AVDD Bias Circuit Current Source Array Figure 99. Interpolation Filters, NCOs, and QMC Blocks Powered by DIGVDD With the DAC3484 being a mixed signal device, the device contains circuits that bridges the digital section and the analog section. The DACVDD powers these sections. System designer can design this rail in secondary priority. Powering the rail with LDO is recommended. Unless system designer pays special care to supply filtering and power supply routing/placement, powering the rail directly with switching power supplies is not recommended for this rail. Since digital circuits have more inherent noise immunity than analog circuits, the power supply noise requirements for DIGVDD of the digital section of the device may be relaxed and placed at a lower priority. Depending on the spur level requirement, routing and placement of the power supply, power the rail directly with switching power supplies can be possible. With the digital logics running, the DIGVDD rail may draw significant current. If the power supply traces and filtering network have significant DC resistance loss (for example, DCR), then the final supply voltage seen by the DIGVDD rail may not be sufficient to meet the minimum power supply level. For instance, with 450 mA of DIGVDD current and about 0.1 Ω of DCR from the ferrite bead, the final supply voltage at the DIGVDD pins may be 1.2 V – 0.045 V = 1.155 V. This is fairly close to the minimum supply voltage range of 1.14 V. System designer may need to elevate the power supply voltage according to the DCR level or design a feedback network for the power supply to account for associated voltage drop. To ensure power supply accuracy and to account for power supply filter network loss at operating conditions, the use of the ATEST function in register config27 to check the internal power supply nodes is recommended. The table below is a summary of the various power supply nodes of the DAC. Care should be taken to keep clean power supplies routing away from noisy digital supplies. It is recommended to use at least two power layers. Power supplies for digital circuits tend to have more switching activities and are typically noisier, and system designer should avoid sharing the digital power rail (for example, power supplies for FPGA or DIGVDD of DAC3484) with the analog power rail (for example, CLKVDD and AVDD of DAC3484). Avoid placing noisy supplies and clean supplies on adjacent board layers and use a ground layer between these two supplies if possible. All supply pins should be decoupled as close to the pins as possible by using small value capacitors, with larger bulk capacitors placed further away and near the power supply source. 90 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Table 66. Power Rails POWER RAILS TYPICAL VOLTAGE NOISE SENSITIVITY RECOMMENDATIONS POWER SUPPLY DESIGN PRIORITY CLKVDD 1.2 V High Provide clean supply to the rail. Avoid spurious noise or coupling from other supplies High AVDD 3.3 V High Provide clean supply to the rail. Avoid spurious noise or coupling from other supplies High DACVDD 1.2 V Medium Provide clean supply to the rail. Avoid spurious noise or coupling from other supplies Medium DIGVDD 1.2 V Low Keep Away from other noise sensitive nodes in placement and routing. Low 10 Layout 10.1 Layout Guidelines The design of the PCB is critical to achieve the full performance of the DAC3484 device. Defining the PCB stackup should be the first step in the board design. Experience has shown that at least six layers are required to adequately route all required signals to and from the device. Each signal routing layer must have an adjacent solid ground plane to control signal return paths to have minimal loop areas and to achieve controlled impedances for microstrip and stripline routing. Power planes must also have adjacent solid ground planes to control supply return paths. Minimizing the space between supply and ground planes improves performance by increasing the distributed decoupling. Although the DAC3484 device consists of both analog and digital circuitry, TI highly recommends solid ground planes that encompass the device and its input and output signal paths. TI does not recommend split ground planes that divide the analog and digital portions of the device. Split ground planes may improve performance if a nearby, noisy, digital device is corrupting the ground reference of the analog signal path. When split ground planes are employed, one must carefully control the supply return paths and keep the paths on top of their respective ground reference planes. Quality analog output signals and input conversion clock signal path layout is required for full dynamic performance. Symmetry of the differential signal paths and discrete components in the path is mandatory, and symmetrical shunt-oriented components should have a common grounding via. The high frequency requirements of the analog output and clock signal paths necessitate using differential routing with controlled impedances and minimizing signal path stubs (including vias) when possible. Coupling onto or between the clock and output signals paths should be avoided using any isolation techniques available including distance isolation, orientation planning to prevent field coupling of components like inductors and transformers, and providing well coupled reference planes. Via stitching around the clock signal path and the input analog signal path provides a quiet ground reference for the critical signal paths and reduces noise coupling onto these paths. Sensitive signal traces must not cross other signal traces or power routing on adjacent PCB layers, rather a ground plane must separate the traces. If necessary, the traces should cross at 90° angles to minimize crosstalk. The substrate (dielectric) material requirements of the PCB are largely influenced by the speed and length of the high speed serial lanes. Affordable and common FR4 varieties are adequate in most cases. Coupling of ambient signals into the signal path is reduced by providing quiet, close reference planes and by maintaining signal path symmetry to ensure the coupled noise is common-mode. Faraday caging may be used in very noise environment and high dynamic range applications to isolate the signal path. The following layout guidelines correspond to the layout shown in Figure 100. 1. DAC output termination resistors should be placed as close to the output pins as possible to provide a DC path to ground and set the source impedance matching. 2. For DAC on-chip PLL clocking mode, if the external loop filter is not used, leave the loop filter pin floating without any board routing nearby. Signals coupling to this node may cause clock mixing spurs in the DAC output. 3. Route the high speed LVDS lanes as impedance-controlled, tightly-coupled, differential traces. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 91 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Layout Guidelines (continued) 4. Maintain a solid ground plane under the LVDS lanes without any ground plane splits. 5. Simulation of the LVDS channel with DAC3484 IBIS model is recommended to verify good eye opening of the data patterns. 6. Keep the OSTR signal routing away from the DACCLK routing to reduce coupling. 7. Keep routing for RBIAS short, for instance a resistor can be placed on the board directly connecting the RBIAS pin to the ground layer. The following layout guidelines correspond to the layouts shown in Figure 101 and Figure 102. 1. Noise power supplies should be routed away from clean supplies. Use two power plane layers, preferably with a ground layer in between. 2. As shown in Figure 101 and Figure 102, both layers three and four are designated for power supply planes. The DAC analog powers are all in the same layer to avoid coupling with each other, and the planes are copied from layer three to layer four for double the copper coverage area. 3. Decoupling capacitors should be placed as close to the supply pins as possible. For instance, a capacitor can be placed on the bottom of the board directly connecting the supply pin to a ground layer. 10.1.1 Assembly Information regarding the package and assembly of the WQFN-MR package version of the DAC3484 can be found at the end of the data sheet and also on the following application note: SZZA059 Information regarding the package and assembly of the ZAY package version of the DAC3484 can be found at the end of the data sheet and also on the following application note: SPRAA99 10.2 Layout Examples 6 2 3 4 1 5 7 Figure 100. Top Layer of DAC3484 Layout Showing High Speed Signals such as LVDS Bus, DACCLK, OSTR, and DAC Outputs. Layout Example from TSW3085EVM Rev D 92 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 Layout Examples (continued) PLLVDD CLKVDD DACVDD AVDD DIGVDD Figure 101. Third Layer of DAC3484 Layout Showing Power Layers. Layout Example from DAC3484EVM Rev H Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 93 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com Layout Examples (continued) PLLVDD CLKVDD DVDD DACVDD AVDD Figure 102. Fourth Layer of DAC3484 Layout Showing Power Layers. Layout Example from DAC3484EVM Rev H 94 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.1.2 Device Nomenclature 11.1.2.1 Definition of Specifications Adjacent Carrier Leakage Ratio (ACLR): Defined for a 3.84Mcps 3GPP W-CDMA input signal measured in a 3.84-MHz bandwidth at a 5-MHz offset from the carrier with a 12dB peak-to-average ratio. Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current. Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1 LSB change in the digital input code. Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the value at ambient (25°C) to values over the full operating temperature range. Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output current and the ideal full-scale output current. Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero scale to full scale. Intermodulation Distortion (IMD3): The two-tone IMD3 is defined as the ratio (in dBc) of the 3rd-order intermodulation distortion product to either fundamental output tone. Offset Drift: Defined as the maximum change in DC offset, in terms of ppm of full-scale range (FSR) per °C, from the value at ambient (25°C) to values over the full operating temperature range. Offset Error: Defined as the percentage error (in FSR%) for the ratio between the measured mid-scale output current and the ideal mid-scale output current. Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the current-output DAC. Exceeding this limit may result reduced reliability of the device or adversely affecting distortion performance. Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius from value at ambient (25°C) to values over the full operating temperature range. Spurious Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the output signal and the peak spurious signal within the first Nyquist zone. Noise Spectral Density (NSD): Defined as the difference of power (in dBc) between the output tone signal power and the noise floor of 1-Hz bandwidth within the first Nyquist zone. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 95 DAC3484 SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 www.ti.com 11.2 Documentation Support 11.2.1 Related Documentation • Design Summary Multi-row Quad Flat No-lead (MRQFN) Application Report (SZZA059) • nFBGA Packaging Application Report (SPRAA99) • DAC348x Device Configuration and Synchronization Application Report (SLAA584) • Semiconductor and IC Package Thermal Metrics Application Report (SPRA953) • Using DAC348x with Fault Detection and Auto Output Shut-off Feature Application Report (SLAA585) 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 96 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC3484 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DAC3484IRKDR ACTIVE WQFN-MR RKD 88 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC3484I DAC3484IRKDT ACTIVE WQFN-MR RKD 88 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC3484I DAC3484IZAY ACTIVE NFBGA ZAY 196 160 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC3484I DAC3484IZAYR ACTIVE NFBGA ZAY 196 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC3484I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2017 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Oct-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DAC3484IRKDR WQFNMR RKD 88 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 DAC3484IRKDT WQFNMR RKD 88 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Oct-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC3484IRKDR WQFN-MR RKD 88 2000 336.6 336.6 28.6 DAC3484IRKDT WQFN-MR RKD 88 250 336.6 336.6 28.6 Pack Materials-Page 2 PACKAGE OUTLINE ZAY0196A NFBGA - 1.4 mm max height SCALE 1.100 PLASTIC BALL GRID ARRAY 12.1 11.9 A B BALL A1 CORNER 12.1 11.9 1.4 MAX C SEATING PLANE BALL TYP 0.45 TYP 0.35 0.12 C 10.4 TYP (0.8) TYP SYMM P N (0.8) TYP M L K 10.4 TYP J SYMM H G F E 196X D C B 0.55 0.45 0.15 0.05 C A C B A 0.8 TYP BALL A1 CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 0.8 TYP 4219823/A 09/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT ZAY0196A NFBGA - 1.4 mm max height PLASTIC BALL GRID ARRAY (0.8) TYP 196X ( 0.4) 1 2 4 3 5 6 7 8 9 10 11 12 13 14 A B (0.8) TYP C D E F G SYMM H J K L M N P SYMM LAND PATTERN EXAMPLE SCALE:8X 0.05 MAX ( 0.4) METAL METAL UNDER SOLDER MASK 0.05 MIN SOLDER MASK OPENING SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) ( 0.4) SOLDER MASK OPENING SOLDER MASK DETAILS NOT TO SCALE 4219823/A 09/2015 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN ZAY0196A NFBGA - 1.4 mm max height PLASTIC BALL GRID ARRAY ( 0.4) TYP (0.8) TYP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A (0.8) TYP B C D E F G SYMM H J K L M N P SYMM SOLDER PASTE EXAMPLE BASED ON 0.15 mm THICK STENCIL SCALE:8X 4219823/A 09/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. 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