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DAC53401, DAC43401
SLASES7A – JULY 2019 – REVISED DECEMBER 2019
DACx3401 10-Bit and 8-Bit, Voltage-Output Digital-to-Analog Converters With Nonvolatile
Memory and PMBus™ Compatible I2C Interface in Tiny 2 × 2 WSON
1 Features
3 Description
•
•
The 10-bit DAC53401 and 8-bit DAC43401
(DACx3401) are a pin-compatible family of buffered
voltage-output digital-to-analog converters (DACs).
These devices consume very low power, and are
available in a tiny 8-pin WSON package. The feature
set combined with the tiny package and low power
make the DACx3401 an excellent choice for
applications such as LED and general-purpose bias
point generation, power supply control, digitizers,
PWM signal generation, and medical alarm tone
generation.
1
•
•
•
•
•
•
•
•
1 LSB INL and DNL (10-bit and 8-bit)
Wide operating range
– Power supply: 1.8 V to 5.5 V
– Temperature range: –40˚C to +125˚C
PMBus™ compatible I2C interface
– Standard, Fast, and Fast+ modes
– Digital slew rate control
– 1.62-V VIH with VDD = 5.5 V
User-programmable nonvolatile memory
(NVM/EEPROM)
– Save and recall all register settings
Programmable waveform generation: Square,
ramp, and sawtooth
Preprogrammed medical-alarm tone-generation
mode: low, medium, and high priority alarms
Internal reference
Very low power: 0.2 mA at 1.8 V
Flexible startup: High impedance or 10K-GND
Tiny package: 8-pin WSON (2 mm × 2 mm)
These devices have nonvolatile memory (NVM), an
internal reference, and a PMBus-compatible I2C
interface. The DACx3401 operates with either an
internal reference or the power supply as a reference,
and provides full-scale output of 1.8 V to 5.5 V. The
devices communicate through the I2C interface.
These devices support I2C standard mode, fast
mode, and fast+ mode.
The DACx3401 are feature rich, and include PMBus
voltage margin commands, user-programmable
power up to high impedance, standalone waveform
generator, medical alarm tone generator, dedicated
feedback pin, and more.
2 Applications
•
•
•
•
•
•
The DACx3401 operate within the temperature range
of –40°C to +125°C.
Rack server
Exit and emergency lighting
Automotive USB charge
Barcode scanner
Active antenna system mMIMO (AAS)
CPU (PLC controller)
Device Information(1)
PART NUMBER
DAC53401
BODY SIZE (NOM)
WSON (8)
DAC43401
2.00 mm × 2.00 mm
(1) For all available packages, refer to the package option
addendum at the end of the data sheet.
Functional Block Diagram
CAP
PACKAGE
Power-Supply Control With the DACx3401
L
VDD
VIN
IN
PH
VOUT
LDO
BOOT
CL
SMPS
SDA
A0
I2C Interface
PMBus Compatible
CB
SCL
Internal
Reference
Non Volatile
Memory
SENSE
GND
VDD
R1
R3
DACx3401
VFB
R2
DAC
Buffer
DAC
Register
DAC
+
BUF
-
OUT
R1
FB
R2
Power On Reset
Power Down Logic
AGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC53401, DAC43401
SLASES7A – JULY 2019 – REVISED DECEMBER 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics........................................... 5
Timing Requirements: I2CTM Standard mode ........... 7
Timing Requirements: I2CTM Fast mode................... 7
Timing Requirements: I2CTM Fast+ mode................. 8
Typical Characteristics: VDD = 1.8 V (Reference =
VDD) or VDD = 2 V (Internal Reference) .................... 9
7.10 Typical Characteristics: VDD = 5.5 V (Reference =
VDD) or VDD = 5 V (Internal Reference) ................... 11
7.11 Typical Characteristics .......................................... 13
8
Detailed Description ............................................ 18
8.1 Overview ................................................................. 18
8.2
8.3
8.4
8.5
8.6
9
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Register Map...........................................................
18
19
25
28
32
Application and Implementation ........................ 40
9.1 Application Information............................................ 40
9.2 Typical Applications ................................................ 40
10 Power Supply Recommendations ..................... 46
11 Layout................................................................... 46
11.1 Layout Guidelines ................................................. 46
11.2 Layout Example .................................................... 46
12 Device and Documentation Support ................. 47
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Support Resources ...............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
47
47
47
47
47
47
47
13 Mechanical, Packaging, and Orderable
Information ........................................................... 47
4 Revision History
Changes from Original (July 2019) to Revision A
•
2
Page
Changed DAC53401 and DAC43401 devices from advanced information (preview) to production data (active) ................ 1
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SLASES7A – JULY 2019 – REVISED DECEMBER 2019
5 Device Comparison Table
DEVICE
RESOLUTION
DAC53401
10-bit
DAC43401
8-bit
6 Pin Configuration and Functions
DSG Package
8-Pin WSON
Top View
A0
1
8
OUT
SCL
2
7
FB
SDA
3
6
VDD
CAP
4
5
AGND
Not to scale
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
A0
1
Input
Four-state address input
AGND
5
Ground
CAP
4
Input
External capacitor for the internal LDO. Connect a capacitor (0.5 µF to 15 µF) between CAP and
AGND.
FB
7
Input
Voltage feedback pin
OUT
8
Output
SCL
2
Input
SDA
3
Input/output
VDD
6
Power
Ground reference point for all circuitry on the device
Analog output voltage from DAC
Serial interface clock. This pin must be connected to the supply voltage with an external pullup
resistor.
Data are clocked into or out of the input register. This pin is a bidirectional, and must be connected to
the supply voltage with an external pullup resistor.
Analog supply voltage: 1.8 V to 5.5 V
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SLASES7A – JULY 2019 – REVISED DECEMBER 2019
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
Supply voltage, VDD to AGND
–0.3
6
V
Digital input(s) to AGND
–0.3
VDD + 0.3
V
CAP to AGND
–0.3
1.65
VFB to AGND
–0.3
VDD + 0.3
VOUT to AGND
–0.3
VDD + 0.3
Current into any pin
–10
10
TJ
Junction temperature
–40
150
Tstg
Storage temperature
–65
150
VDD
(1)
UNIT
V
mA
°C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
Electrostatic
discharge
V(ESD)
(1)
(2)
(1)
UNIT
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101,
pins 1, 4, 5, 8 (2)
±750
Charged device model (CDM), per JEDEC specification JESD22-C101,
pins 2, 3, 6, 7 (2)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VDD
Positive supply voltage to ground (AGND)
1.71
VIH
Digital input high voltage, 1.7 V < VDD ≤ 5.5 V
1.62
VIL
Digital input low voltage
TA
Ambient temperature
NOM
MAX UNIT
5.5
V
V
–40
0.4
V
125
°C
7.4 Thermal Information
DACx3401
THERMAL METRIC (1)
DSG (WSON)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
49
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
50
°C/W
RθJB
Junction-to-board thermal resistance
24.1
°C/W
ΨJT
Junction-to-top characterization parameter
1.1
°C/W
ΨJB
Junction-to-board characterization parameter
24.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.7
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SLASES7A – JULY 2019 – REVISED DECEMBER 2019
7.5 Electrical Characteristics
all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.8 V ≤ VDD ≤ 5.5 V,
DAC reference tied to VDD, gain = 1x, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive
load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STATIC PERFORMANCE
Resolution
DAC53401
10
DAC43401
8
Bits
INL
Relative accuracy (1)
–1
1
LSB
DNL
Differential nonlinearity (1)
–1
1
LSB
Zero code error
Code 0d into DAC
6
12
Internal VREF, gain = 4x, VDD = 5.5 V
6
15
Zero code error temperature
coefficient
±10
Offset error (1)
–0.5
Offset error temperature
coefficient (1)
µV/°C
0.5
±0.0003
Gain error (1)
–0.5
Gain error temperature
coefficient (1)
Full scale error
0.25
0.25
mV
%FSR
%FSR/°C
0.5
±0.0008
%FSR
%FSR/°C
1.8 V ≤ VDD ≺ 2.7 V, code 1023d into DAC,
no headroom
–1
0.5
1
2.7 V ≤ VDD ≤ 5.5 V, code 1023d into DAC,
no headroom
–0.5
0.25
0.5
%FSR
Full scale error temperature
coefficient
±0.0008
%FSR/°C
OUTPUT CHARACTERISTICS
Output voltage
CL
Capacitive load (2)
Load regulation
Short circuit current
Output voltage headroom (1)
Reference tied to VDD
(1)
(2)
5.5
1
RL = 5 kΩ, phase margin = 30°
2
DAC at midscale, –10 mA ≤ IOUT ≤ 10 mA,
VDD = 5.5 V
0.4
VDD = 1.8 V, full-scale output shorted to AGND or
zero-scale output shorted to VDD
10
VDD = 2.7 V, full-scale output shorted to AGND or
zero-scale output shorted to VDD
25
VDD = 5.5 V, full-scale output shorted to AGND or
zero-scale output shorted to VDD
50
To VDD (DAC output unloaded, internal reference =
1.21 V), VDD ≥ 1.21 ☓ gain + 0.2 V
0.2
To VDD
(DAC output unloaded, reference tied to VDD)
0.8
To VDD (ILOAD = 10 mA at VDD = 5.5 V, ILOAD = 3 mA
at VDD = 2.7 V, ILOAD = 1 mA at VDD = 1.8 V), DAC
code = full scale
VOUT dc output impedance
0
RL = Infinite, phase margin = 30°
V
nF
mV/mA
mA
V
%FSR
10
DAC output enabled and DAC code = midscale
0.25
DAC output enabled and DAC code = 4d
0.25
DAC output enabled and DAC code = 1016d
0.26
Ω
Measured with DAC output unloaded. For external reference between end-point codes: 8d to 1016d for 10-bit resolution, 2d to 254d for
8-bit resolution. For internal reference VDD ≥ 1.21 x gain + 0.2 V, between end-point codes: 8d to 1016d for 10-bit resolution, 2d to 254d
for 8-bit resolution.
Specified by design and characterization, not production tested.
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Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.8 V ≤ VDD ≤ 5.5 V,
DAC reference tied to VDD, gain = 1x, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive
load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER
ZO
VFB dc output impedance (3)
MIN
TYP
MAX
DAC output enabled, DAC reference tied to VDD
(gain = 1x) or internal reference (gain = 1.5x or 2x)
TEST CONDITIONS
160
200
240
DAC output enabled, internal VREF, gain = 3x or 4x
192
240
288
VOUT + VFB dc output
leakage (2)
At startup, measured when DAC output is disabled
and held at VDD / 2 for VDD = 5.5 V
Power supply rejection ratio
(dc)
Internal VREF, gain = 2x, DAC at midscale;
VDD = 5 V ±10%
5
0.25
UNIT
kΩ
nA
mV/V
DYNAMIC PERFORMANCE
tsett
Output voltage settling time
8
1/4 to 3/4 scale and 3/4 to 1/4 scale settling to
10%FSR, VDD = 5.5 V, internal VREF, gain = 4x
12
Slew rate
VDD = 5.5 V
Power on glitch magnitude
At startup (DAC output disabled), RL = 5 kΩ, CL = 200
pF
Output enable glitch
magnitude
Vn
1/4 to 3/4 scale and 3/4 to 1/4 scale settling to
10%FSR, VDD = 5.5 V
µs
1
V/µs
75
At startup (DAC output disabled), RL = 100 kΩ
200
DAC output disabled to enabled (DAC registers at
zero scale, RL = 100 kΩ
250
mV
mV
0.1 Hz to 10 Hz, DAC at midscale, VDD = 5.5 V
34
Internal VREF, gain = 4x, 0.1 Hz to 10 Hz, DAC at
midscale, VDD = 5.5 V
70
Measured at 1 kHz, DAC at midscale, VDD = 5.5 V
0.2
Internal VREF, gain = 4x,, measured at 1 kHz, DAC at
midscale, VDD = 5.5 V
0.7
Power supply rejection ratio
(ac) (3)
Internal VREF, gain = 4x, 200-mV 50 or 60 Hz sine
wave superimposed on power supply voltage, DAC at
midscale
–71
dB
Code change glitch impulse
±1 LSB change around mid code (including
feedthrough)
10
nV-s
Code change glitch impulse
magnitude
±1 LSB change around mid code (including
feedthrough)
15
mV
Output noise voltage (peak to
peak)
Output noise density
µVPP
µV/√Hz
EEPROM
Endurance
Data retention (2)
–40°C ≤ TA ≤ 85°C
20000
Cycles
1000
TA = 25°C
50
EEPROM programming write
cycle time (2)
5
10
Years
15
ms
DIGITAL INPUTS
Digital feedthrough
DAC output static at midscale, fast+ mode, SCL
toggling
20
nV-s
Pin capacitance
Per pin
10
pF
POWER
Load capacitor - CAP pin (2)
IDD
(3)
6
Current flowing into VDD
0.5
Normal mode, DACs at full scale, digital pins static
0.5
DAC power-down, internal reference power down
80
15
µF
0.8
mA
µA
Specified with 200-mV headroom with respect to reference value when internal reference is used.
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SLASES7A – JULY 2019 – REVISED DECEMBER 2019
7.6 Timing Requirements: I2CTM Standard mode
all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, 1.8 V ≤ Vpull-up ≤ VDD V
MIN
fSCLK
SCL frequency
tBUF
Bus free time between stop and start conditions
tHDSTA
Hold time after repeated start
tSUSTA
NOM
MAX
UNIT
0.1
MHz
4.7
µs
4
µs
Repeated start setup time
4.7
µs
tSUSTO
Stop condition setup time
4
µs
tHDDAT
Data hold time
0
ns
tSUDAT
Data setup time
250
ns
tLOW
SCL clock low period
4700
ns
tHIGH
SCL clock high period
4000
tF
Clock and data fall time
300
ns
tR
Clock and data rise time
1000
ns
ns
7.7 Timing Requirements: I2CTM Fast mode
all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, 1.8 V ≤ Vpull-up ≤ VDD V
MIN
NOM
MAX
UNIT
0.4
MHz
fSCLK
SCL frequency
tBUF
Bus free time between stop and start conditions
1.3
µs
tHDSTA
Hold time after repeated start
0.6
µs
tSUSTA
Repeated start setup time
0.6
µs
tSUSTO
Stop condition setup time
0.6
µs
tHDDAT
Data hold time
0
ns
tSUDAT
Data setup time
100
ns
tLOW
SCL clock low period
1300
ns
tHIGH
SCL clock high period
600
tF
Clock and data fall time
300
ns
tR
Clock and data rise time
300
ns
ns
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7.8 Timing Requirements: I2CTM Fast+ mode
all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, 1.8 V ≤ Vpull-up ≤ VDD V
MIN
fSCLK
SCL frequency
tBUF
Bus free time between stop and start conditions
tHDSTA
NOM
MAX
UNIT
1
MHz
0.5
µs
Hold time after repeated start
0.26
µs
tSUSTA
Repeated start setup time
0.26
µs
tSUSTO
Stop condition setup time
0.26
µs
tHDDAT
Data hold time
0
ns
tSUDAT
Data setup time
50
ns
tLOW
SCL clock low period
0.5
µs
tHIGH
SCL clock high period
0.26
tF
Clock and data fall time
120
ns
tR
Clock and data rise time
120
ns
µs
Low byte ACK cycle
tLOW
tR
tF
SCL
tHDSTA
tHIGH
tHDDAT
tSUSTA
tSUSTO
tSUDAT
tHDSTA
SDA
tBUF
P
S
S
P
Figure 1. Timing Diagram
8
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7.9 Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
1
1
0.8
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
-0.8
Differential Linearity Error (LSB)
Integral Linearity Error (LSB)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0.4
0.2
0
-0.2
-0.4
-0.6
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
-0.8
-1
-1
0
128
256
384
512
Code
640
768
896
1023
0
Figure 2. Integral Linearity Error vs Digital Input Code
1
0.2
0.8
0.15
0.1
0.05
0
-0.05
-0.1
-0.15
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
-0.2
128
256
384
512
Code
640
768
896
512
Code
640
768
896
1023
0.4
0.2
0
-0.2
-0.4
-0.6
-1
-40 -25 -10
1023
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 5. Integral Linearity Error vs Temperature
1
1
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
0.8
Total Unadjusted Error (%FSR)
DNL max, reference = VDD, gain = 1x
DNL min, reference = VDD, gain = 1x
DNL max, internal reference, gain = 1.5x
DNL min, internal reference, gain = 1.5x
0.8
Differential Linearity Error (LSB)
384
INL max, reference = VDD, gain = 1x
INL min, reference = VDD, gain = 1x
INL max, internal reference, gain = 1.5x
INL min, internal reference, gain = 1.5x
0.6
Figure 4. Total Unadjusted Error vs Digital Input Code
-1
-40 -25 -10
256
-0.8
-0.25
0
128
Figure 3. Differential Linearity Error vs Digital Input Code
0.25
Integral Linearity Error (LSB)
Total Unadjusted Error (%FSR)
0.6
0.6
0.4
0.2
0
-0.2
-0.4
TUE max, reference = VDD, gain = 1x
TUE min, reference = VDD, gain = 1x
TUE max, internal reference, gain = 1.5x
TUE min, internal reference, gain = 1.5x
-0.6
-0.8
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 6. Differential Linearity Error vs Temperature
-1
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 7. Total Unadjusted Error vs Temperature
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Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
(continued)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0.5
8
7
Offset Error (%FSR)
Zero Code Error (mV)
0.3
6
5
4
3
2
0.1
-0.1
-0.3
1
0
-40
-25
-10
5
20 35 50 65
Temperature (°C)
80
95
-0.5
-40 -25 -10
110 125
Reference = VDD
Figure 8. Zero Code Error vs Temperature
80
95
110 125
Figure 9. Offset Error vs Temperature
0.5
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
0.4
Full Scale Error (%FSR)
0.3
0.1
-0.1
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
-0.4
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
Figure 10. Gain Error vs Temperature
10
20 35 50 65
Temperature (qC)
Reference = VDD
0.5
Gain Error (%FSR)
5
110 125
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
110 125
Figure 11. Full-Scale Error vs Temperature
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7.10 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
1
1
0.8
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
Reference = VDD, gain = 1x
Internal reference, gain = 4x
-0.8
Differential Linearity Error (LSB)
Integral Linearity Error (LSB)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0.4
0.2
0
-0.2
-0.4
-0.6
Reference = VDD, gain = 1x
Internal reference, gain = 4x
-0.8
-1
-1
0
128
256
384
512
Code
640
768
896
1023
0
Figure 12. Integral Linearity Error vs Digital Input Code
256
384
512
Code
640
768
896
1023
1
Reference = VDD, gain = 1x
Internal reference, gain = 4x
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
INL min, reference = VDD, gain = 1x
INL max, reference = VDD, gain = 1x
INL min, internal reference, gain = 4x
INL max, internal reference, gain = 4x
0.8
Integral Linearity Error (LSB)
0.4
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-0.4
-1
-40 -25 -10
-0.5
0
128
256
384
512
Code
640
768
896
1023
Figure 14. Total Unadjusted Error vs Digital Input Code
20 35 50 65
Temperature (°C)
80
95
110 125
0.5
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
TUE max, reference = VDD, gain = 1x
TUE min, reference = VDD, gain = 1x
TUE max, internal reference, gain = 4x
TUE min, internal reference, gain = 4x
0.4
Total Unadjusted Error (%FSR)
DNL max, reference = VDD, gain = 1x
DNL min, reference = VDD, gain = 1x
DNL max, internal reference, gain = 4x
DNL min, internal reference, gain = 4x
0.8
-1
-40 -25 -10
5
Figure 15. Integral Linearity Error vs Temperature
1
Differential Linearity Error (LSB)
128
Figure 13. Differential Linearity Error vs Digital Input Code
0.5
Total Unadjusted Error (%FSR)
0.6
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 16. Differential Linearity Error vs Temperature
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 17. Total Unadjusted Error vs Temperature
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Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal
Reference) (continued)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0.5
2
1.5
Offset Error (%FSR)
Zero Code Error (mV)
0.3
1
0.5
0
-0.5
-1
0.1
-0.1
-0.3
-1.5
-2
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
-0.5
-40 -25 -10
110 125
Reference = VDD
5
Figure 18. Zero Code Error vs Temperature
95
110 125
Figure 19. Offset Error vs Temperature
0.5
Reference = VDD, gain = 1x
Internal reference, gain = 4x
Reference = VDD, gain 1x
Internal reference, gain 4x
Full Scale Error (%FSR)
0.3
Gain Error (%FSR)
80
Reference = VDD
0.5
0.1
-0.1
-0.3
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
Figure 20. Gain Error vs Temperature
12
20 35 50 65
Temperature (qC)
110 125
0.3
0.1
-0.1
-0.3
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
110 125
Figure 21. Full-Scale Error vs Temperature
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7.11 Typical Characteristics
1
1
0.8
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
INL min
INL max
-0.8
-1
1.8
2.725
3.65
4.575
Supply Voltage, VDD (V)
Differential Linearity Error (LSB)
Integral Linearity Error (LSB)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0
-0.2
-0.4
-0.6
Zero Code Error (mV)
0.15
0.1
0.05
0
-0.05
-0.1
-0.15
TUE max
TUE min
-0.2
2.725
3.65
4.575
Supply Voltage, VDD (V)
5.5
Reference = VDD
12
11
10
9
8
7
6
5
4
3
2
1
0
-1
1.8
3.65
4.575
Supply Voltage, VDD (V)
5.5
2.3
2.8
3.3
3.8
4.3
Supply Voltage, VDD (V)
4.8
5.3
Reference = VDD
Figure 24. Total Unadjusted Error vs Supply Voltage
Figure 25. Zero-Code Error vs Supply Voltage
0.5
0.5
0.3
0.3
Gain Error (%FSR)
Offset Error (%SFR)
2.725
Figure 23. Differential Linearity Error vs Supply Voltage
0.2
0.1
-0.1
-0.3
-0.5
1.8
DNL min
DNL max
Reference = VDD
Figure 22. Integral Linearity Error vs Supply Voltage
Total Unadjusted Error (%FSR)
0.2
-1
1.8
0.25
-0.25
1.8
0.4
-0.8
5.5
Reference = VDD
0.6
0.1
-0.1
-0.3
2.3
2.8
3.3
3.8
4.3
Supply Voltage, VDD (V)
4.8
Reference = VDD
5.3
-0.5
1.8
2.3
2.8
3.3
3.8
4.3
Supply Voltage, VDD (V)
4.8
5.3
Reference = VDD
Figure 26. Offset Error vs Supply Voltage
Figure 27. Gain Error vs Supply Voltage
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Typical Characteristics (continued)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0.2
0.4
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
0.35
0.12
Supply Current (mA)
Full Scale Error (%FSR)
0.16
0.08
0.04
0
-0.04
-0.08
0.3
0.25
0.2
0.15
0.1
-0.12
0.05
-0.16
-0.2
1.8
0
2.725
3.65
4.575
Supply Voltage, VDD (V)
5.5
0
256
384
512
Code
640
768
896
1023
VDD = 1.8 V
Reference = VDD
Figure 29. Supply Current vs Digital Input Code
Figure 28. Full-Scale Error vs Supply Voltage
0.4
0.4
Reference = VDD, gain = 1x
Internal reference, gain = 4x
0.35
0.3
0.25
0.2
0.15
0.1
IDD, VDD = 1.8 V
IDD, VDD = 3.3 V
IDD, VDD = 5.5 V
0.35
Supply Current (mA)
Supply Current (mA)
128
0.3
0.25
0.2
0.15
0.1
0.05
0.05
0
-40 -25 -10
0
0
128
256
384
512
Code
640
768
896
1023
VDD = 5.5 V
5
20 35 50 65
Temperature (°C)
80
95
110 125
Reference = VDD, DAC at midscale
Figure 30. Supply Current vs Digital Input Code
Figure 31. Supply Current vs Temperature
0.5
0.4
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
IDD, VDD = 3.3 V
IDD, VDD = 5.5 V
0.35
Supply Current (mA)
Supply Current (mA)
0.4
0.3
0.25
0.2
0.15
0.1
0.3
0.2
0.1
0.05
0
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Internal reference (gain = 4x), DAC at midscale
Figure 32. Supply Current vs Temperature
14
0
1.8
2.3
2.8
3.3
3.8
4.3
Supply Voltage, VDD (V)
4.8
5.3
DAC at midscale
Figure 33. Supply Current vs Supply Voltage
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Typical Characteristics (continued)
0.1
6
0.0875
5
0.075
4
Output Voltage (V)
Supply Current (mA)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
0.0625
0.05
0.0375
3
2
1
0.025
0
IDD, VDD = 1.8 V
IDD, VDD = 3.3 V
IDD, VDD = 5.5 V
0.0125
0
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
110 125
-1
Reference = VDD = 1.8 V
Reference = VDD = 5.5 V
-2
-20
-15
-10
-5
0
5
Load Current (mA)
10
15
20
Reference = VDD, DAC powered down
Figure 34. Power-Down Current vs Temperature
Figure 35. Source and Sink Capability
VOUT (1 LSB / div)
Trigger (3 V / div)
0
0.5
1
1.5
2
2.5
3
Time (Ps)
3.5
4
4.5
VOUT (1 LSB / div)
Trigger (3 V / div)
5
0
0.5
1
1.5
2
2.5
3
Time (Ps)
3.5
4
4.5
5
Reference = VDD = 5.5 V, DAC code transition from midscale to
midscale + 1 LSB, DAC load = 5kΩ || 200pF
Reference = VDD = 5.5 V, DAC code transition from midscale to
midscale – 1 LSB, DAC load = 5kΩ || 200pF
Figure 36. Glitch Impulse, Rising Edge, 1-LSB Step
Figure 37. Glitch Impulse, Falling Edge, 1-LSB Step
Trigger (2 V / div)
VOUT (2 V / div)
VOUT (Zoomed) (1 LSB / div)
Trigger (2 V / div)
VOUT (2 V / div)
VOUT (Zoomed) (1 LSB / div)
0
2
4
6
8
10
12
Time (Ps)
14
16
18
20
Reference = VDD = 5.5 V, DAC load = 5kΩ || 200pF
Figure 38. Full-Scale Settling Time, Rising Edge
0
2
4
6
8
10
12
Time (Ps)
14
16
18
20
Reference = VDD = 5.5 V, DAC load = 5kΩ || 200pF
Figure 39. Full-Scale Settling Time, Falling Edge
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Typical Characteristics (continued)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
VDD (1 V / div)
VOUT unloaded (500 mV / div)
VOUT 10K-GND (15 mV / div)
0
5
10
15
20
25
30
Time (ms)
35
40
45
VDD (1 V / div)
VOUT unloaded (500 mV / div)
VOUT 10K-GND (15 mV / div)
50
Reference = VDD = 5.5 V
0
5
10
15
20
25
30
Time (ms)
35
40
45
50
Reference = VDD = 5.5 V
Figure 40. Power-on Glitch
Figure 41. Power-off Glitch
-40
VOUT (6 mV / div)
SCL (4 V / div)
-50
PSRR (dB)
-60
-70
-80
-90
0
1
2
3
4
-100
10
5
Time (Ps)
Reference = VDD = 5.5 V, Fast+ mode, DAC at midscale, DAC
load = 5kΩ || 200pF
20 30 50 70100
200
500 1000 2000
Frequency (Hz)
5000 10000
Internal reference (gain = 4x), VDD = 5.25 V + 0.25 VPP, DAC at
midscale, DAC load = 5kΩ || 200pF
Figure 42. Clock Feedthrough
Figure 43. DAC Output AC PSRR vs Frequency
4000
3000
DAC code = 0x008
DAC code = 0x200
DAC code = 0x3F8
3500
DAC code = 0x008
DAC code = 0x200
DAC code = 0x3F8
2500
Noise (nV / —Hz)
Noise (nV / —Hz)
3000
2500
2000
1500
2000
1500
1000
1000
500
500
0
100
200
500 1000 2000 5000 10000
Frequency (Hz)
100000
Reference = VDD = 5.5 V
200
500 1000 2000 5000 10000
Frequency (Hz)
100000
Internal reference (gain = 4x), VDD = 5.5 V
Figure 44. DAC Output Noise Spectral Density
16
0
100
Figure 45. DAC Output Noise Spectral Density
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Typical Characteristics (continued)
at TA = 25°C, 10-bit DAC, and DAC outputs unloaded (unless otherwise noted)
30
20
25
15
20
15
10
5
Noise (PV)
Noise (PV)
10
0
-5
5
0
-5
-10
-10
-15
-20
-15
-25
-20
-30
0
1
2
3
4
5
6
Time (s)
7
8
9
Reference = VDD = 5.5 V, DAC at midscale
10
0
1
2
3
4
5
6
Time (s)
7
8
9
10
Internal reference (gain = 4x), VDD = 5.5 V, DAC at midscale
Figure 46. DAC Output Noise: 0.1 Hz to 10 Hz
Figure 47. DAC Output Noise: 0.1 Hz to 10 Hz
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8 Detailed Description
8.1 Overview
The 10-bit DAC53401 and 8-bit DAC43401 (DACx3401) are a pin-compatible family of buffered voltage-output,
digital-to-analog converters (DACs). These DACs contain nonvolatile memory (NVM), an internal reference, and
a PMBus-compatible I2C interface. The DACx3401 operate with either an internal reference or with a power
supply as the reference, and provide a full-scale output of 1.8 V to 5.5 V.
The devices communicate through an I2C interface. These devices support I2C standard mode (100 kbps), fast
mode (400 kbps), and fast+ mode (1 Mbps). These devices also support specific PMBus commands such as turn
on/off, margin high/low, and more. The DACx3401 also include digital slew rate control, and support basic signal
generation such as square, ramp, and sawtooth waveforms.
The DACx3401 devices have a power-on-reset (POR) circuit that makes sure all the registers start with default or
user-programmed settings using NVM. The DAC output powers on in high-impedance mode (default); this setting
can be programmed to 10kΩ-GND using NVM.
8.2 Functional Block Diagram
CAP
VDD
SCL
SDA
A0
I2C Interface
PMBus Compatible
LDO
Internal
Reference
Non Volatile
Memory
DAC
Buffer
DAC
Register
DAC
+
BUF
-
OUT
R1
FB
R2
Power On Reset
Power Down Logic
AGND
18
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8.3 Feature Description
8.3.1 Digital-to-Analog Converter (DAC) Architecture
The DACx3401 family of devices consists of string architecture with an output buffer amplifier. The Functional
Block Diagram section shows the DAC architecture within the block diagram. This DAC architecture operates
from a 1.8-V to 5.5-V power supply. These devices consume only 0.2 mA of current when using a 1.8-V power
supply. The DAC output pin starts up in high impedance mode making it an excellent choice for power-supply
control applications. To change the power-up mode to 10kΩ-GND, program the DAC_PDN bit (address: D1h),
and load these bits in the device NVM.
8.3.1.1 Reference Selection and DAC Transfer Function
The device writes the input data to the DAC data registers in straight-binary format. After a power-on or a reset
event, the device sets all DAC registers to the values set in the NVM.
8.3.1.1.1 Power Supply as Reference
By default, the DACx3401 operate with the power-supply pin (VDD) as a reference. Equation 1 shows DAC
transfer function when the power-supply pin is used as reference.
VOUT
DAC _ DATA
2N
u VDD
where:
•
•
•
•
N is the resolution in bits, either 8 (DAC43401) or 10 (DAC53401).
DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC register.
DAC_DATA ranges from 0 to 2N – 1.
VDD is used as the DAC reference voltage.
(1)
8.3.1.1.2 Internal Reference
The DACx3401 also contain an internal reference that is disabled by default. Enable the internal reference by
writing 1 to REF_EN (address D1h). The internal reference generates a fixed 1.21-V voltage (typical). Using
DAC_SPAN (address D1h) bits, gain of 1.5X, 2X, 3X, 4X can be achieved for the DAC output voltage (VOUT)
Equation 2 shows DAC transfer function when the internal reference is used.
VOUT
DAC _ DATA
2N
u VREF u GAIN
where:
•
•
•
•
•
N is the resolution in bits, either 8 (DAC43401) or 10 (DAC53401).
DAC_DATA is the decimal equivalent of the binary code that is loaded to the DAC register
DAC_DATA ranges from 0 to 2N – 1.
VREF is the internal reference voltage = 1.21 V.
GAIN = 1.5x, 2x, 3x, 4x based on DAC_SPAN (address D1h) bits.
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Feature Description (continued)
8.3.2 DAC Update
The DAC output pin (OUT) is updated at the end of I2C DAC write frame.
8.3.2.1 DAC Update Busy
The DAC_UPDATE_BUSY bit (address D0h) is set to 1 by the device when certain DAC update operations, such
as function generation, transition to margin high or low, or any of the medical alarms are in progress. When the
DAC_UPDATE_BUSY bit is set to 1, do not write to any of the DAC registers. After the DAC update operation is
completed (DAC_UPDATE_BUSY = 0), any of the DAC registers can be written.
8.3.3 Nonvolatile Memory (EEPROM or NVM)
The DACx3401 contain nonvolatile memory (NVM) bits. These memory bits are user programmable and
erasable, and retain the set values in the absence of a power supply. All the register bits, as shown in Table 1,
can be stored in the device NVM by setting NVM_PROG = 1 (address D3h). The NVM_BUSY bit (address D0h)
is set to 1 by device when a NVM write or reload operation is ongoing. During this time, the device blocks all
write operations to the device. The NVM_BUSY bit is set to 0 after the write or reload operation is complete; at
this point, all write operations to the device are allowed. The default value for all the registers in the DACx3401 is
loaded from NVM as soon as a POR event is issued. Do not perform a read operation from the DAC register
while NVM_BUSY = 1.
The DACx3401 also implement NVM_RELOAD bit (address D3h). Set this bit to 1 for the device to start an NVM
reload operation. After the operation is complete, the device autoresets this bit to 0. During the NVM_RELOAD
operation, the NVM_BUSY bit is set to 1.
Table 1. NVM Programmable Registers
REGISTER ADDRESS
D1h
D2h
20
REGISTER NAME
GENERAL_CONFIG
MED_ALARM_CONFIG
BIT ADDRESS
BIT NAME
15:14
FUNC_CONFIG
13
DEVICE_LOCK
11:9
CODE_STEP
8:5
SLEW_RATE
4:3
DAC_PDN
2
REF_EN
1:0
DAC_SPAN
10
MED_ALARM_HP
9
MED_ALARM_MP
8
MED_ALARM_LP
5:4
INTERBURST_TIME
3:2
PULSE_OFF_TIME
1:0
PULSE_ON_TIME
D3h
TRIGGER
8
START_FUNC_GEN
10h
DAC_DATA
11:2
DAC_DATA
25h
DAC_MARGIN_HIGH
11:4
MARGIN_HIGH (8 most significant bits)
26h
DAC_MARGIN_LOW
11:4
MARGIN_LOW (8 most significant bits)
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8.3.3.1 NVM Cyclic Redundancy Check
The DACx3401 implement a cyclic redundancy check (CRC) feature for the device NVM to make sure that the
data stored in the device NVM is uncorrupted. There are two types of CRC alarm bits implemented in
DACx3401: NVM_CRC_ALARM_USER and NVM_CRC_ALARM_INTERNAL. The NVM_CRC_ALARM_USER
bit indicates the status of user-programmable NVM bits, and the NVM_CRC_ALARM_INTERNAL bit indicates
the status of internal NVM bits The CRC feature is implemented by storing a 10-Bit CRC (CRC-10-ATM) along
with the NVM data each time NVM program operation (write or reload) is performed and during the device start
up. The device reads the NVM data and validates the data with the stored CRC. The CRC alarm bits
(NVM_CRC_ALARM_USER and NVM_CRC_ALARM_INTERNAL address D0h) report any errors after the data
are read from the device NVM.
8.3.3.2 NVM_CRC_ALARM_USER Bit
A logic 1 on NVM_CRC_ALARM_USER bit indicates that the user-programmable NVM data is corrupt. During
this condition, all registers in the DAC are initialized with factory reset values, and any DAC registers can be
written to or read from. To reset the alarm bits to 0, issue a software reset (see the Software Reset section)
command, or cycle power to the DAC. Alternatively, cycle the power to reload the user-programmable NVM bits.
8.3.3.3 NVM_CRC_ALARM_INTERNAL Bit
A logic 1 on NVM_CRC_ALARM_INTERNAL bit indicates that the internal NVM data is corrupt. During this
condition, all registers in the DAC are initialized with factory reset values, and any DAC registers can be written
to or read from. To reset the alarm bits to 0, issue a software reset (see the Software Reset section) command or
cycle power to the DAC.
8.3.4 Programmable Slew Rate
When the DAC data registers are written, the voltage on DAC output (VOUT) immediately transitions to the new
code following the slew rate and settling time specified in the Electrical Characteristics table. The slew rate
control feature allows the user to control the rate at which the output voltage (VOUT) changes. When this feature
is enabled (using SLEW_RATE[3:0] bits), the DAC output changes from the current code to the code in
MARGIN_HIGH (address 25h) or MARGIN_LOW (address 26h) registers (when margin high or low commands
are issued to the DAC) using the step and rate set in CODE_STEP and SLEW_RATE bits. With the default slew
rate control setting (CODE_STEP and SLEW_RATE bits, address D1h), the output changes smoothly at a rate
limited by the output drive circuitry and the attached load. Using this feature, the output steps digitally at a rate
defined by bits CODE_STEP and SLEW_RATE on address D1h. SLEW_RATE defines the rate at which the
digital slew updates; CODE_STEP defines the amount by which the output value changes at each update.
Table 2 and Table 3 show different settings for CODE_STEP and SLEW_RATE.
When the slew rate control feature is used, the output changes happen at the programmed slew rate. This
configuration results in a staircase formation at the output. Do not write to CODE_STEP, SLEW_RATE, or
DAC_DATA during the output slew.
Table 2. Code Step
REGISTER ADDRESS
AND NAME
D1h, GENERAL_CONFIG
CODE_STEP[2]
CODE_STEP[1]
CODE_STEP[0]
COMMENT
0
0
0
Code step size = 1 LSB
(default)
0
0
1
Code step size = 2 LSB
0
1
0
Code step size = 3 LSB
0
1
1
Code step size = 4 LSB
1
0
0
Code step size = 6 LSB
1
0
1
Code step size = 8 LSB
1
1
0
Code step size = 16 LSB
1
1
1
Code step size = 32 LSB
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Table 3. Slew Rate
REGISTER
ADDRESS AND
NAME
D1h,
GENERAL_CONFIG
22
SLEW_RATE[3]
SLEW_RATE[2]
SLEW_RATE[1]
SLEW_RATE[0]
COMMENT
0
0
0
0
25.6 µs
(per step)
0
0
0
1
25.6 µs × 1.25
(per step)
0
0
1
0
25.6 µs × 1.50
(per step)
0
0
1
1
25.6 µs × 1.75
(per step)
0
1
0
0
204.8 µs
(per step)
0
1
0
1
204.8 µs × 1.25
(per step)
0
1
1
0
204.8 µs × 1.50
(per step)
0
1
1
1
204.8 µs × 1.75
(per step)
1
0
0
0
1.6384 ms (per step)
1
0
0
1
1.6384 ms × 1.25
(per step)
1
0
1
0
1.6384 ms × 1.50
(per step)
1
0
1
1
1.6384 ms × 1.75
(per step)
1
1
0
0
12 µs (per step)
1
1
0
1
8 µs (per step)
1
1
1
0
4 µs (per step)
1
1
1
1
No slew (default)
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8.3.5 Power-on-Reset (POR)
The DACx3401 family of devices includes a power-on reset (POR) function that controls the output voltage at
power up. After the VDD supply has been established, a POR event is issued. The POR causes all registers to
initialize to default values, and communication with the device is valid only after a 30-ms, POR delay. The default
value for all the registers in the DACx3401 is loaded from NVM as soon as the POR event is issued.
When the device powers up, a POR circuit sets the device to the default mode. The POR circuit requires specific
VDD levels, as indicated in Figure 48, in order to make sure that the internal capacitors discharge and reset the
device on power up. To make sure that a POR occurs, VDD must be less than 0.7 V for at least 1 ms. When VDD
drops to less than 1.65 V, but remains greater than 0.7 V (shown as the undefined region), the device may or
may not reset under all specified temperature and power-supply conditions. In this case, initiate a POR. When
VDD remains greater than 1.65 V, a POR does not occur.
VDD (V)
5.5 V
No power-on reset
Spe cified supply
voltage range
1.71 V
1.65 V
Undefined
0.7 V
Power-on reset
0V
Figure 48. Threshold Levels for VDD POR Circuit
8.3.6 Software Reset
To initiate a device software reset event, write the reserved code 1010 to the SW_RESET (address D3h). A
software reset initiates a POR event.
8.3.7 Device Lock Feature
The DACx3401 implement a device lock feature that prevents an accidental or unintended write to the DAC
registers. The device locks all the registers when the DEVICE_LOCK bit (address D1h) is set to 1. To bypass the
DEVICE_LOCK setting, write 0101 to the DEVICE_UNLOCK_CODE bits (address D3h).
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8.3.8 PMBus Compatibility
PMBus is an I2C-based communication standard for power-supply management. PMBus contains standard
command codes tailored to power supply applications. The DACx3401 implement some PMBus commands such
as Turn Off, Turn On, Margin Low, Margin High, Communication Failure Alert Bit (CML), as well as PMBUS
revision. Figure 49 shows typical PMBus connections. The EN_PMBus bit (Bit 12, address D1h) must be set to 1
to enable the PMBus protocol.
Similar to I2C, PMBus is a variable length packet of 8-bit data bytes, each with a receiver acknowledge, wrapped
between a start and stop bit. The first byte is always a 7-bit slave address followed by a write bit, sometimes
called the even address that identifies the intended receiver of the packet. The second byte is an 8-bit command
byte, identifying the PMBus command being transmitted using the respective command code. After the command
byte, the transmitter either sends data associated with the command to write to the receiver command register
(from most significant byte to least significant byte), or sends a new start bit indicating the desire to read the data
associated with the command register from the receiver. After, the receiver transmits the data following the same
most significant byte first format (see Table 10).
ALERT
PMBus-compatible device #1
DATA
ALERT
PMBus-compatible device #2
Control signal
DATA
Clock
CLOCK
ADDRESS
CONTROL
Data
WP
System Host
²
Bus Master
Alert signal
WP
CLOCK
ADDRESS
CONTROL
Optional
Required
ALERT
PMBus-compatible device #3
CLOCK
WP
DATA
ADDRESS
CONTROL
Figure 49. PMBus Connections
24
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8.4 Device Functional Modes
8.4.1 Power Down Mode
The DACx3401 output amplifier and internal reference can be independently powered down through the
DAC_PDN bits (address D1h). At power up, the DAC output and the internal reference are disabled by default. In
power-down mode, the DAC output (OUT pin) is in a high-impedance state. To change this state to 10kΩ-AGND
(at power up), use the DAC_PDN bits (address D1h).
The DAC power-up state can be programmed to any state (power-down or normal mode) using the NVM.
Table 4 shows the DAC power-down bits.
Table 4. DAC Power-Down Bits
REGISTER ADDRESS AND NAME
DAC_PDN[1]
DAC_PDN[0]
0
0
Power up
0
1
Power down to 10 kΩ
1
0
Power down to high impedance (HiZ)
(default)
1
1
Power down to 10 kΩ
D1h, GENERAL_CONFIG
DESCRIPTION
8.4.2 Continuous Waveform Generation (CWG) Mode
The DACx3401 implement a continuous waveform generation feature. To set the device to this mode, set the
START_FUNC_GEN (address D3h) to 1. In this mode, the DAC output pin (OUT) generates a continuous
waveform based on the FUNC_CONFIG bits (address D1h). Table 5 shows the continuous waveforms that can
be generated in this mode. The frequency of the waveform depends on the resistive and capacitive load on the
OUT pin, high and low codes, and slew rate settings as shown in the following equations.
fSQUARE
WAVE
1
2 u SLEW _ RATE
where:
•
SLEW_RATE is the programmable DAC slew rate specified in Table 3.
fTRIANGLE
WAVE
(3)
1
§ MARGIN _ HIGH MARGIN _ LOW 1 ·
2 u SLEW _ RATE u ¨
¸
CODE _ STEP
©
¹
where:
•
•
•
SLEW_RATE is the programmable DAC slew rate specified in Table 3.
MARGIN_HIGH and MARGIN_LOW are the programmable DAC codes.
CODE_STEP is the programmable DAC step code in Table 2.
fSAWTOOTH
WAVE
(4)
1
§ MARGIN _HIGH MARGIN _LOW 1 ·
SLEW _RATE u ¨
¸
CODE _ STEP
©
¹
where:
•
•
•
SLEW_RATE is the programmable DAC slew rate specified in Table 3.
MARGIN_HIGH and MARGIN_LOW are the programmable DAC codes.
CODE_STEP is the programmable DAC step code in Table 2.
(5)
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Table 5. FUNC_CONFIG bits
REGISTER ADDRESS AND NAME
FUNC_CONFIG[1]
0
0
FUNC_CONFIG[0]
DESCRIPTION
0
Generates a triangle wave between
MARGIN_HIGH (address 25h) code to
MARGIN_LOW (address 26h) code with
slope defined by SLEW_RATE (address
D1h) bits
1
Generates Saw-Tooth wave between
MARGIN_HIGH (address 25h) code to
MARGIN_LOW (address 26h) code, with
rising slope defined by SLEW_RATE
(address D1h) bits and immediate falling
edge
0
Generates Saw-Tooth wave between
MARGIN_HIGH (address 25h) code to
MARGIN_LOW (address 26h) code, with
falling slope defined by SLEW_RATE
(address D1h) bits and immediate rising
edge
1
Generates a square wave between
MARGIN_HIGH (address 25h) code to
MARGIN_LOW (address 26h) code with
pulse high and low period defined by
SLEW_RATE (address D1h) bits
D1h, GENERAL_CONFIG
1
1
8.4.3 PMBus Compatibility Mode
The DACx3401 I2C interface implements some of the PMBus commands. Table 6 shows the supported PMBus
commands that are implemented in DACx3401.The DAC uses MARGIN_LOW (address 26h), MARGIN_HIGH
(address 25h) bits, SLEW_RATE, and CODE_STEP bits (address D1h) for PMBUS_OPERATION_CMD. The
EN_PMBus bit (Bit 12, address D1h) must be set to 1 to enable the PMBus protocol.
Table 6. PMBus Operation Commands
REGISTER ADDRESS AND NAME
01h, PMBUS_OPERATION
PMBUS_OPERATION_CMD[15:8]
DESCRIPTION
00h
Turn off
80h
Turn on
94h
Margin low
A4h
Margin high
The DACx3401 also implement PMBus features such as group command protocol and communication time-out
failure. The CML bit (address 78h) indicates a communication fault in the PMBus. This bit is reset by writing 1. In
case of timeout, if the SDA line is held low, the SDA line stays low during the time-out event until next SCL pulse
is received.
To get the PMBus version, read the PMBUS_VERSION bits (address 98h).
8.4.4 Medical Alarm Generation Mode
The DACx3401 are also used to generate continuous alarm tones for medical devices. Use a suitable analog
mixer, audio amplifier, and a speaker to generate low, medium, or high priority alarm tones. See the Application
and Implementation section for more details. The DACx3401 allow tunability and configurability to support
different alarm generation. Using this approach, configurable medical alarm tones can be generated with a
simple circuit, and with no need for runtime software.
8.4.4.1 Low-Priority Alarm
The MED_ALARM_LP bit (address D2h) is used to trigger a medical low-priority alarm generation. The DAC
generates a continuous-alarm signal until this bit is set back to 0. After the bit is set to 0, the device does not
abruptly end the alarm generation; the device stops only after completing the ongoing burst.
26
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8.4.4.2 Medium-Priority Alarm
The MED_ALARM_MP bit (address D2h) is used to trigger a medical medium-priority alarm generation. The DAC
generates a continuous-alarm signal until this bit is set back to 0. After the bit is set to 0, the device does not
abruptly end the alarm generation; the device stops only after completing the ongoing burst.
8.4.4.3 High-Priority Alarm
The MED_ALARM_HP bit (address D2h) is used to trigger a medical high-priority alarm generation. The DAC
generates a continuous-alarm signal until this bit is set back to 0. After the bit is set to 0, the device does not
abruptly end the alarm generation; the device stops only after completing the ongoing burst.
8.4.4.4 Interburst Time
The INTERBURST_TIME bit (address D2h) is used set the time between two adjacent bursts. Table 7 lists the
INTERBURST_TIME settings.
Table 7. Interburst Time
REGISTER ADDRESS
AND NAME
INTERBURST_TIME[1:0]
HIGH PRIORITY ALARM
INTERBURST TIME
MEDIUM PRIORITY
ALARM INTERBURST
TIME
00
2.55 s
2.60 s
01
2.96 s
3.06 s
10
3.38 s
3.52 s
11
3.80 s
4.00 s
D2h,
MED_ALARM_CONFIG
LOW PRIORITY ALARM
INTERBURST TIME
16 s
8.4.4.5 Pulse Off Time
The PULSE_OFF_TIME bit (address D2h) is used to control the low period of trapezoid in a medical alarm
waveform. Table 8 lists the PULSE_OFF_TIME settings.
Table 8. Pulse Off Time
REGISTER ADDRESS
AND NAME
PULSE_OFF_TIME[1:0]
HIGH PRIORITY ALARM
PULSE OFF TIME
MEDIUM PRIORITY
ALARM PULSE OFF
TIME
LOW PRIORITY ALARM
PULSE OFF TIME
00
15 ms
40 ms
40 ms
01
36 ms
60 ms
60 ms
10
58 ms
80 ms
80 ms
11
80 ms
100 ms
100 ms
D2h,
MED_ALARM_CONFIG
8.4.4.6 Pulse On Time
The PULSE_ON_TIME bit (address D2h) controls the high period of trapezoid in a medical alarm waveform.
Table 9 lists the PULSE_ON_TIME settings.
Table 9. Pulse On Time
REGISTER ADDRESS
AND NAME
D2h,
MED_ALARM_CONFIG
HIGH PRIORITY ALARM
PULSE ON TIME
MEDIUM PRIORITY
ALARM PULSE ON TIME
LOW PRIORITY ALARM
PULSE ON TIME
00
80 ms
130 ms
130 ms
01
103 ms
153 ms
153 ms
10
126 ms
176 ms
176 ms
11
150 ms
200 ms
200 ms
PULSE_ON_TIME[1:0]
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8.5 Programming
The DACx3401 devices have a 2-wire serial interface (SCL and SDA), and one address pin (A0), as shown in
the Pin Configuration and Functions section. The I2C bus consists of a data line (SDA) and a clock line (SCL)
with pullup structures. When the bus is idle, both SDA and SCL lines are pulled high. All the I2C-compatible
devices connect to the I2C bus through the open drain I/O pins, SDA and SCL.
The I2C specification states that the device that controls communication is called a master, and the devices that
are controlled by the master are called slaves. The master device generates the SCL signal. The master device
also generates special timing conditions (start condition, repeated start condition, and stop condition) on the bus
to indicate the start or stop of a data transfer. Device addressing is completed by the master. The master device
on an I2C bus is typically a microcontroller or digital signal processor (DSP). The DACx3401 family operates as a
slave device on the I2C bus. A slave device acknowledges master commands, and upon master control, receives
or transmits data.
Typically, the DACx3401 family operates as a slave receiver. A master device writes to the DACx3401, a slave
receiver. However, if a master device requires the DACx3401 internal register data, the DACx3401 operate as a
slave transmitter. In this case, the master device reads from the DACx3401. According to I2C terminology, read
and write refer to the master device.
The DACx3401 family is a slave and supports the following data transfer modes:
• Standard mode (100 kbps)
• Fast mode (400 kbps)
• Fast+ mode (1.0 Mbps)
The data transfer protocol for standard and fast modes is exactly the same; therefore, both modes are referred to
as F/S-mode in this document. The fast+ mode protocol is supported in terms of data transfer speed, but not
output current. The low-level output current would be 3 mA; similar to the case of standard and fast modes. The
DACx3401 family supports 7-bit addressing. The 10-bit addressing mode is not supported. The device supports
the general call reset function. Sending the following sequence initiates a software reset within the device: start
or repeated start, 0x00, 0x06, stop. The reset is asserted within the device on the rising edge of the ACK bit,
following the second byte.
Other than specific timing signals, the I2C interface works with serial bytes. At the end of each byte, a ninth clock
cycle generates and detects an acknowledge signal. Acknowledge is when the SDA line is pulled low during the
high period of the ninth clock cycle. A not-acknowledge is when the SDA line is left high during the high period of
the ninth clock cycle as shown in Figure 50.
Data output
by transmitter
Not acknowledge
Data output
by receiver
Acknowledge
1
SCL from
master
2
9
8
S
Clock pulse for
acknowledgement
Start
condition
Figure 50. Acknowledge and Not Acknowledge on the I2C Bus
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Programming (continued)
8.5.1 F/S Mode Protocol
The following steps explain a complete transaction in F/S mode.
1. The master initiates data transfer by generating a start condition. The start condition is when a high-to-low
transition occurs on the SDA line while SCL is high, as shown in Figure 51. All I2C-compatible devices
recognize a start condition.
2. The master then generates the SCL pulses, and transmits the 7-bit address and the read/write direction bit
(R/W) on the SDA line. During all transmissions, the master makes sure that data are valid. A valid data
condition requires the SDA line to be stable during the entire high period of the clock pulse, as shown in
Figure 52. All devices recognize the address sent by the master and compare the address to the respective
internal fixed address. Only the slave device with a matching address generates an acknowledge by pulling
the SDA line low during the entire high period of the 9th SCL cycle, as shown in Figure 50. When the master
detects this acknowledge, the communication link with a slave has been established.
3. The master generates further SCL cycles to transmit (R/W bit 0) or receive (R/W bit 1) data to the slave. In
either case, the receiver must acknowledge the data sent by the transmitter. The acknowledge signal can be
generated by the master or by the slave, depending on which is the receiver. The 9-bit valid data sequences
consists of 8-data bits and 1 acknowledge-bit, and can continue as long as necessary.
4. To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line from
low-to-high while the SCL line is high (see Figure 51). This action releases the bus and stops the
communication link with the addressed slave. All I2C-compatible devices recognize the stop condition. Upon
receipt of a stop condition, the bus is released, and all slave devices then wait for a start condition followed
by a matching address.
SDA
SDA
SCL
SCL
S
Start
condition
P
Stop
condition
Figure 51. Start and Stop Conditions
Data line stable
Data valid
Change of data
allowed
Figure 52. Bit Transfer on the I2C Bus
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8.5.2 DACx3401 I2C Update Sequence
For a single update, the DACx3401 require a start condition, a valid I2C address byte, a command byte, and two
data bytes, as listed in Table 10.
Table 10. Update Sequence
MSB
....
LSB
ACK
MSB
...
LSB
ACK
MSB
...
LSB
ACK
MSB
...
LSB
Address (A) byte
Address Byte
Command byte
Command Byte
Data byte - MSDB
Application Curves
Data byte - LSDB
Application Curves
DB [31:24]
DB [23:16]
DB [15:8]
DB [7:0]
ACK
After each byte is received, the DACx3401 family acknowledges the byte by pulling the SDA line low during the
high period of a single clock pulse, as shown in Figure 53. These four bytes and acknowledge cycles make up
the 36 clock cycles required for a single update to occur. A valid I2C address byte selects the DACx3401
devices.
Recognize
START or
REPEATED
START
condition
Recognize
STOP or
REPEATED
START
condition
Generate ACKNOWLEDGE
signal
P
SDA
MSB
Address
SCL
Sr
Acknowledgement
signal from Slave
1
R/W
7
8
9
1
2-8
9
Sr
or
P
S
or
Sr
ACK
START or
REPEATED
START
condition
Clock line held low while
interrupts are serviced
ACK
REPEATED
START or
STOP
condition
Figure 53. I2C Bus Protocol
The command byte sets the operating mode of the selected DACx3401 device. For a data update to occur when
the operating mode is selected by this byte, the DACx3401 device must receive two data bytes: the most
significant data byte (MSDB) and least significant data byte (LSDB). The DACx3401 device performs an update
on the falling edge of the acknowledge signal that follows the LSDB.
When using fast mode (clock = 400 kHz), the maximum DAC update rate is limited to 10 kSPS. Using the fast+
mode (clock = 1 MHz), the maximum DAC update rate is limited to 25 kSPS. When a stop condition is received,
the DACx3401 device releases the I2C bus and awaits a new start condition.
8.5.3 Address Byte
The address byte, as shown in Table 11, is the first byte received following the start condition from the master
device. The first four bits (MSBs) of the address are factory preset to 1001. The next three bits of the address
are controlled by the A0 pin. The A0 pin input can be connected to VDD, AGND, SCL, or SDA. The A0 pin is
sampled during the first byte of each data frame to determine the address. The device latches the value of the
address pin, and consequently responds to that particular address according to Table 12.
The DACx3401 family supports broadcast addressing, which can be used for synchronously updating or
powering down multiple DACx3401 devices. The DACx3401 family is designed to work with other members of
the family to support multichip synchronous updates. Using the broadcast address, the DACx3401 devices
respond regardless of the states of the address pins. Broadcast is supported only in write mode.
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Table 11. Address Byte
COMMENT
MSB
—
AD6
AD5
AD4
AD3
General address
1
0
0
1
Broadcast address
1
0
0
0
LSB
AD2
AD1
AD0
R/W
See Table 12 (slave address
column)
1
1
0 or 1
1
0
Table 12. Address Format
SLAVE ADDRESS
A0 PIN
000
AGND
001
VDD
010
SDA
011
SCL
8.5.4 Command Byte
Table 16 lists the command byte.
Table 13. Command Byte (Register Names)
8.5.5
ADDRESS
REGISTER NAME
D0h
STATUS
D1h
GENERAL_CONFIG
D2h
MED_ALARM_CONFIG
D3h
TRIGGER
21h
DAC_DATA
25h
DAC_MARGIN_HIGH
26h
DAC_MARGIN_LOW
01h
PMBUS_OP
78h
PMBUS_STATUS_BYTE
98h
PMBUS_VERSION
I2C Read Sequence
To read any register the following command sequence must be used:
1. Send a start or repeated start command with a slave address and the R/W bit set to 0 for writing. The device
acknowledges this event.
2. Send a command byte for the register to be read. The device acknowledges this event again.
3. Send a repeated start with the slave address and the R/W bit set to 1 for reading. The device acknowledges
this event.
4. The device writes the MSDB byte of the addressed register. The master must acknowledge this byte.
5. Finally, the device writes out the LSDB of the register.
An alternative reading method allows for reading back the value of the last register written. The sequence is a
start or repeated start with the slave address and the R/W bit set to 1, and the two bytes of the last register are
read out.
Note that it is not possible to use the broadcast address for reading.
Table 14. Read Sequence
S MSB …
R/W
(0)
ACK
ADDRESS
BYTE Address
Byte
From Master
MSB … LSB
ACK
COMMAND
BYTE
Command Byte
Slave
From Master
Sr MSB …
Sr
Slave
R/W
(1)
ACK
ADDRESS
BYTE Address
Byte
From Master
MSB … LSB
ACK
MSDB
Slave
MSB … LSB
LSDB
From Slave
Master
From Slave
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Master
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8.6 Register Map
Table 15. Register Map
MOST SIGNIFICANT DATA BYTE (MSDB)
LEAST SIGNIFICANT DATA BYTE (LSDB)
ADDRESS
D0h
D1h
BIT15
BIT14
NVM_CRC_
ALARM_
USER
NVM_CRC_
ALARM_
INTERNAL
FUNC_CONFIG
D2h
BIT13
BIT12
NVM_BUSY
DAC_
UPDATE_
BUSY
DEVICE_
LOCK
EN_PMBUS
BIT9
BIT8
BIT7
BIT6
BIT5
X (1)
X
BIT3
BIT2
BIT1
DEVICE_ID
CODE_STEP
MED_
ALARM_HP
BIT4
SLEW_RATE
MED_
ALARM_MP
MED_
ALARM_LP
DEVICE_
CONFIG_
RESET
START_
FUNC_
GEN
RESERVED
PMBUS_
MARGIN_
HIGH
PMBUS_
MARGIN_
LOW
DAC_PDN
INTERBURST_TIME
NVM_
RELOAD
VERSION_ID
REF_EN
PULSE_OFF_TIME
NVM_
PROG
BIT0
DAC_SPAN
PULSE_ON_TIME
D3h
DEVICE_UNLOCK_CODE
21h
X
DAC_DATA[9:0] (10-Bit) or DAC_DATA[7:0] (8-Bit)
X
25h
X
MARGIN_HIGH[9:0] (10-Bit) or MARGIN_HIGH[7:0] (8-Bit)
X
26h
X
MARGIN_LOW[9:0] (10-Bit) or MARGIN_LOW[7:0] (8-Bit)
X
98h
SW_RESET
X
PMBUS_OPERATION_CMD
78h
32
BIT10
X
01h
(1)
BIT11
N/A
CML
PMBUS_VERSION
N/A
N/A
X = Don't care.
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Table 16. Register Names
ADDRESS
REGISTER NAME
SECTION
D0h
STATUS
STATUS Register (address = D0h) (reset = 000Ch or 0014h)
D1h
GENERAL_CONFIG
GENERAL_CONFIG Register (address = D1h) (reset = 01F0h)
D2h
MED_ALARM_CONFIG
MED_ALARM_CONFIG Register (address = D2h) (reset = 0000h)
D3h
TRIGGER
TRIGGER Register (address = D3h) (reset = 0008h)
21h
DAC_DATA
DAC_DATA Register (address = 21h) (reset = 0000h)
25h
DAC_MARGIN_HIGH
DAC_MARGIN_HIGH Register (address = 25h) (reset = 0000h)
26h
DAC_MARGIN_LOW
DAC_MARGIN_LOW Register (address = 26h) (reset = 0000h)
01h
PMBUS_OPERATION
PMBUS_OPERATION Register (address = 01h) (reset = 0000h)
78h
PMBUS_STATUS_BYTE
PMBUS_STATUS_BYTE Register (address = 78h) (reset = 0000h)
98h
PMBUS_VERSION
PMBUS_VERSION Register (address = 98h) (reset = 2200h)
Table 17. Access Type Codes
Access Type
Code
Description
X
X
Don't care
R
Read
W
Write
Read Type
R
Write Type
W
Reset or Default Value
-n
Value after reset or the default
value
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8.6.1 STATUS Register (address = D0h) (reset = 000Ch or 0014h)
Figure 54. STATUS Register
15
NVM_CRC_
ALARM_
USER
R-0h
14
NVM_CRC_
ALARM_
INTERNAL
R-0h
13
NVM_
BUSY
12
DAC_
UPDATE_
BUSY
R-0h
R-0h
11
10
9
8
7
6
5
4
3
DEVICE_ID
X
X-00h
2
1
0
VERSION_ID
10-bit: R-0Ch
8-bit: R-14h
Table 18. STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
15
NVM_CRC_ALARM_USER
R
0
0 : No CRC error in user NVM bits
1: CRC error in user NVM bits
14
NVM_CRC_ALARM_INTERNAL
R
0
0 : No CRC error in internal NVM
1: CRC error in internal NVM bits
13
NVM_BUSY
R
0
0 : NVM write or load completed, Write to DAC registers
allowed
1 : NVM write or load in progress, Write to DAC registers
not allowed
12
DAC_UPDATE_BUSY
R
0
0 : DAC outputs updated, Write to DAC registers allowed
1 : DAC outputs update in progress, Write to DAC
registers not allowed
11 - 6
X
X
00h
Don't care
5-2
DEVICE_ID
R
1-0
VERSION_ID
DAC53401: 0Ch
DAC43401: 14h
DAC53401: 0Ch
DAC43401: 14h
8.6.2 GENERAL_CONFIG Register (address = D1h) (reset = 01F0h)
Figure 55. GENERAL_CONFIG Register
15
14
FUNC_
CONFIG
R/W-0h
13
DEVICE_
LOCK
W-0h
12
EN_
PMBUS
R/W-0h
11
10
9
CODE_STEP
8
R/W-0h
7
6
SLEW_RATE
5
R/W-Fh
4
3
DAC_PDN
2
REF_EN
1
0
DAC_SPAN
R/W-2h
R/W-0h
R/W-0h
Table 19. GENERAL_CONFIG Register Field Descriptions
Bit
34
Field
Type
Reset
Description
15 - 14
FUNC_CONFIG
R/W
00
00 : Generates a triangle wave between MARGIN_HIGH
(address 25h) code to MARGIN_LOW (address 26h) code with
slope defined by SLEW_RATE (address D1h) bits.
01: Generates Saw-Tooth wave between MARGIN_HIGH
(address 25h) code to MARGIN_LOW (address 26h) code, with
rising slope defined by SLEW_RATE (address D1h) bits and
immediate falling edge.
10: Generates Saw-Tooth wave between MARGIN_HIGH
(address 25h) code to MARGIN_LOW (address 26h) code, with
falling slope defined by SLEW_RATE (address D1h) bits and
immediate rising edge.
11: Generates a square wave between MARGIN_HIGH (address
25h) code to MARGIN_LOW (address 26h) code with pulse high
and low period defined by SLEW_RATE (address D1h) bits.
13
DEVICE_LOCK
W
0
0 : Device not locked
1: Device locked, the device locks all the registers. This bit can
be reset (unlock device) by writing 0101 to the
DEVICE_UNLOCK_CODE bits (address D3h)
12
EN_PMBUS
R/W
0
0: PMBus mode disabled
1: PMBus mode enabled
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Table 19. GENERAL_CONFIG Register Field Descriptions (continued)
Field
Type
Reset
Description
11 - 9
Bit
CODE_STEP
R/W
000
Code step for programmable slew rate control.
000: Code step size = 1 LSB (default)
001: Code step size = 2 LSB
010: Code step size = 3 LSB
011: Code step size = 4 LSB
100: Code step size = 6 LSB
101: Code step size = 8 LSB
110: Code step size = 16 LSB
111: Code step size = 32 LSB
8-5
SLEW_RATE
R/W
1111
Slew rate for programmable slew rate control.
0000: 25.6 µs (per step)
0001: 25.6 µs × 1.25 (per step)
0010: 25.6 µs × 1.50 (per step)
0011: 25.6 µs × 1.75 (per step)
0100: 204.8 µs (per step)
0101: 204.8 µs × 1.25 (per step)
0110: 204.8 µs × 1.50 (per step)
0111: 204.8 µs × 1.75 (per step)
1000: 1.6384 ms (per step)
1001: 1.6384 ms × 1.25 (per step)
1010: 1.6384 ms × 1.50 (per step)
1011: 1.6384 ms × 1.75 (per step)
1100: 12 µs (per step)
1101: 8 µs (per step)
1110: 4 µs (per step)
1111: No slew (default)
4-3
DAC_PDN
R/W
10
00: Power up
01: Power down to 10K
10: Power down to high impedance (default)
11: Power down to 10K
REF_EN
R/W
0
0: Internal reference disabled, VDD is DAC reference voltage,
DAC output range from 0 to VDD.
1: Internal reference enabled, DAC reference = 1.21 V
DAC_SPAN
R/W
00
Only applicable when internal reference is enabled.
00: Reference to VOUT gain 1.5X
01: Reference to VOUT gain 2X
10: Reference to VOUT gain 3X
11: Reference to VOUT gain 4X
2
1-0
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8.6.3 MED_ALARM_CONFIG Register (address = D2h) (reset = 0000h)
Figure 56. MED_ALARM_CONFIG Register
15 14 13 12 11
X
X-0h
10
MED_
ALARM_
HP
W-0h
9
MED_
ALARM_
MP
W-0h
8
MED_
ALARM_
LP
W-0h
7
6
RESERVED
5
4
MED_ALARM_
DEAD_TIME
RESERVED
W-0h
3
2
PULSE_
OFF_TIME
1
0
PULSE_
ON_TIME
W-0h
W-0h
Table 20. MED_ALARM_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
X
X
00h
Don't care
10
MED_ALARM_HP
W
0
0: No medical alarm waveform generated
1: High priority medical alarm waveform generated
9
MED_ALARM_MP
W
0
0: No medical alarm waveform generated
1: Medium priority medical alarm waveform generated
8
MED_ALARM_LP
W
0
0: No medical alarm waveform generated
1: Low priority medical alarm waveform generated
7-6
RESERVED
Reserved 0
RESERVED
5-4
INTERBURST_TIME
W
00
High priority alarm
00: 2.55 sec
01: 2.96 sec
10: 3.38 sec
11: 3.80 sec
Medium priority
alarm
00: 2.60 sec
01: 3.06 sec
10: 3.52 sec
11: 4.00 sec
Low priority alarm
00: 16 sec
01: 16 sec
10: 16 sec
11: 16 sec
3-2
PULSE_OFF_TIME
W
00
High priority alarm
00: 15 msec
01: 36 msec
10: 58 msec
11: 80 msec
Medium priority
alarm
00: 40 msec
01: 60 msec
10: 80 msec
11: 100 msec
Low priority alarm
00: 40 msec
01: 60 msec
10: 80 msec
11: 100 msec
1-0
PULSE_ON_TIME
W
00
High priority alarm
00: 80 msec
01: 103 msec
10: 126 msec
11: 150 msec
Medium priority
alarm
00: 130 msec
01: 153 msec
10: 176 msec
11: 200 msec
Low priority alarm
00: 130 msec
01: 153 msec
10: 176 msec
11: 200 msec
15 - 11
36
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8.6.4 TRIGGER Register (address = D3h) (reset = 0008h)
Figure 57. TRIGGER Register
15
14
13
12
DEVICE_UNLOCK_CODE
11
W-0h
10
X
X
9
DEVICE_
CONFIG_
RESET
W-0h
8
START_
FUNC_
GEN
W-0h
7
PMBUS_
MARGIN_
HIGH
R/W-0h
6
PMBUS_
MARGIN_
LOW
R/W-0h
5
NVM_
RELOAD
4
NVM_
PROG
W-0h
W-0h
3
2
1
0
SW_RESET
W-8h
Table 21. TRIGGER Register Field Descriptions
Field
Type
Reset
Description
15 - 12
Bit
DEVICE_UNLOCK_CODE
W
0000
Write 0101 to unlock the device to bypass DEVICE_LOCK bit.
11 - 10
X
X
0h
Don't care
9
DEVICE_CONFIG_RESET
W
0
0: Device configuration reset not initiated
1: Device configuration reset initiated. All registers loaded with
factory reset values.
8
START_FUNC_GEN
W
0
0: Continuous waveform generation mode disabled
1: Continuous waveform generation mode enabled, device
generates continuous waveform based on FUNC_CONFIG
(D1h), MARGIN_LOW (address 18h), and SLEW_RATE
(address D1h) bits.
7
PMBUS_MARGIN_HIGH
R/W
0
0: PMBus margin high command not initiated
1: PMBus margin high command initiated, DAC output margins
high to MARGIN_HIGH code (address 25h). This bit
automatically resets to 0 after the DAC code reaches
MARGIN_HIGH value.
6
PMBUS_MARGIN_LOW
R/W
0
0: PMBus margin low command not initiated
1: PMBus margin low command initiated, DAC output margins
low to MARGIN_LOW code (address 26h). This bit automatically
resets to 0 after the DAC code reaches MARGIN_LOW value.
5
NVM_RELOAD
W
0
0: NVM reload not initiated
1: NVM reload initiated, applicable DAC registers loaded with
corresponding NVM. NVM_BUSY bit set to 1 which this operation
is in progress.. This is a self-resetting bit.
4
NVM_PROG
W
0
0: NVM write not initiated
1: NVM write initiated, NVM corresponding to applicable DAC
registers loaded with existing register settings. NVM_BUSY bit
set to 1 which this operation is in progress. This is a self-resetting
bit.
3-0
SW_RESET
W
1000
1000: Software reset not initiated
1010: Software reset initiated, DAC registers loaded with
corresponding NVMs, all other registers loaded with default
settings.
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8.6.5 DAC_DATA Register (address = 21h) (reset = 0000h)
Figure 58. DAC_DATA Register
15
14
13
12
11
10
X
X-0h
9
8
7
6
5
4
DAC_DATA[9:0] / DAC_DATA[7:0] – MSB Left aligned
W-000h
3
2
1
0
X
X-0h
Table 22. DAC_DATA Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
X
X
0h
Don't care
11-2
DAC_DATA[9:0] / DAC_DATA[7:0]
W
000h
Writing to the DAC_DATA register forces the respective DAC
channel to update the active register data to the DAC_DATA.
Data are in straight binary format and use the following format:
DAC53401: { DATA[9:0] }
DAC43401: { DATA[7:0], X, X }
X = Don’t care bits
1-0
X
X
0h
Don't care
8.6.6 DAC_MARGIN_HIGH Register (address = 25h) (reset = 0000h)
Figure 59. DAC_MARGIN_HIGH Register
15
14
13
12
11
10
9
8
7
6
5
4
3
MARGIN_HIGH[9:0] / MARGIN_HIGH[7:0] – MSB Left aligned
W-000h
X
X-0h
2
1
0
X
X-0h
Table 23. DAC_MARGIN_HIGH Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
X
X
0h
Don't care
11-2
MARGIN_HIGH[9:0] /
MARGIN_HIGH[7:0] – MSB Left
aligned
W
000h
Margin high code for DAC output.
Data are in straight binary format and use the following format:
DAC53401: { MARGIN_HIGH[[9:0] }
DAC43401: { MARGIN_HIGH[[7:0], X, X }
X = Don’t care bits
1-0
X
X
0h
Don't care
8.6.7 DAC_MARGIN_LOW Register (address = 26h) (reset = 0000h)
Figure 60. DAC_MARGIN_LOW Register
15
14
13
12
11
X
X-0h
10
9
8
7
6
5
4
3
MARGIN_LOW[9:0] / MARGIN_LOW[7:0] – MSB Left aligned
W-000h
2
1
0
X
X-0h
Table 24. DAC_MARGIN_LOW Register Field Descriptions
Field
Type
Reset
Description
15-12
Bit
X
X
0h
Don't care
11-2
MARGIN_LOW[9:0] /
MARGIN_LOW[7:0] – MSB Left
aligned
W
000h
Margin low code for DAC output.
Data is in straight binary format and follows the format below:
DAC53401: { MARGIN_LOW[[9:0] }
DAC43401: { MARGIN_LOW[[7:0], X, X }
X = Don’t care bits
1-0
38
X
X
0h
Don't care
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8.6.8 PMBUS_OPERATION Register (address = 01h) (reset = 0000h)
Figure 61. PMBUS_OPERATION Register
15
14
13
12
11
10
PMBUS_OPERATION_CMD
R/W-00h
9
8
7
6
5
4
3
2
1
0
X
X-00h
Table 25. PMBUS_OPERATION Register Field Descriptions
Bit
Field
Type
Reset
Description
15 - 8
PMBUS_OPERATION_CMD
R/W
00h
PMBus operation commands
00h: Turn off
80h: Turn on
A4h: Margin high, DAC output margins high to MARGIN_HIGH
code (address 25h)
94h: Margin low, DAC output margins low to MARGIN_LOW
code (address 26h)
7-0
X
X
00h
Not applicable
8.6.9 PMBUS_STATUS_BYTE Register (address = 78h) (reset = 0000h)
Figure 62. PMBUS_STATUS_BYTE Register
15
14
13
12
11
10
9
CML
R/W0h
X
X-00h
8
7
6
5
4
X
X-000h
3
2
1
0
Table 26. PMBUS_STATUS_BYTE Register Field Descriptions
Bit
15 - 10
9
8-0
Field
Type
Reset
Description
X
X
00h
Don't care
CML
R/W
0
0: No communication Fault
1: PMBus communication fault for timeout, write with incorrect
number of clocks, read before write command, and so more;
reset this bit by writing 1.
X
X
000h
Not applicable
8.6.10 PMBUS_VERSION Register (address = 98h) (reset = 2200h)
Figure 63. PMBUS_VERSION Register
15
14
13
12
11
PMBUS_VERSION
R-22h
10
9
8
7
6
5
4
3
2
1
0
X
X-00h
Table 27. PMBUS_VERSION Register Field Descriptions
Field
Type
Reset
Description
15 - 8
Bit
PMBUS_VERSION
R
22h
PMBus version
7-0
X
X
00h
Not applicable
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DACx3401 are buffered, force-sense output, single-channel, DACs that include an NVM and internal
reference and are available in a tiny 3 × 3 package . These DACs are designed for general-purpose applications
in a wide range of end equipment. Some of the most common applications for these devices are power-supply
margining and control, adaptive voltage scaling (AVS), set-and-forget LED biasing in mobile projectors, generalpurpose function generation, medical alarm generation, and programmable comparator applications (such as
smoke detectors, standalone PWM control loops, and offset and gain trimming in precision circuits).
9.2 Typical Applications
This section explains the design details of three primary applications of DACx3401: programmable LED biasing,
power-supply margining. and medical alarm generation.
9.2.1 Programmable LED Biasing
LED and laser biasing or driving circuits often require accuracy and stability of the luminosity with respect to
variation in temperature, electrical conditions, and physical characteristics. This accuracy and stability are most
effectively achieved using a precision DAC, such as the DACx3401. The DACx3401 have additional features,
such as the VFB pin that compensates for the gate-to-source voltage of the transistor (VGS) drop and the drift of
the MOSFET. The NVM allows the microprocessor to set-and-forget the LED biasing value, even during a power
cycle. Figure 64 shows the circuit diagram for LED biasing.
VCC
LED
VDD
ILED = ISET
DACx340 1
VFB
VOUT
+
VGS
Q1
VDAC
RSET
ISET
Figure 64. LED Biasing
9.2.1.1 Design Requirements
•
•
40
DAC output range: 0 V to 2.4 V
LED current range: 0 mA to 20 mA
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Typical Applications (continued)
9.2.1.2 Detailed Design Procedure
The DAC sets the source current of a MOSFET using the integrated buffer, as shown in Figure 64. Connect the
LED between the power supply and the drain of the MOSFET. This configuration allows the DAC to control or set
the amount of current through the LED. The integrated buffer controls the gate-source voltage of the MOSFET
inside the feedback loop, thus compensating this drop and corresponding drift due to temperature, current, and
ageing of the MOSFET. Calculate the value of the LED current set by the DAC using Equation 6. In order to
generate 0 mA to 20 mA from a 0-V to 2.4-V DAC output range, the value of RSET resistor is 120-Ω. Select the
internal reference with a span of 2x. Given a VGS of 1.2 V, the VDD of the DAC must be at least 3.6 V. Select a
VDD of 5 V to allow variation of VGS across temperature. When the VDD headroom is a constraint, use a bipolar
junction transistor (BJT) in place of the MOSFET. BJTs have much less VBE drop as compared to a VGS of a
MOSFET. A MOSFET provides a much better match between the current through the set register and the LED
current, as compared to a BJT.
ISET
VDAC
RSET
(6)
The pseudocode for getting started with an LED biasing application is as follows:
//SYNTAX: WRITE , ,
//Power-up the device, enable internal reference with 2x output span
WRITE GENERAL_CONFIG(0xD1), 0x11, 0xE5
//Write DAC code (12-bit aligned)
WRITE DAC_DATA(0x21), 0x07, 0xFC
//Write settings to the NVM
WRITE TRIGGER(0xD3), 0x00, 0x10
9.2.1.3 Application Curves
LED breathing effect in triangular pattern
LED breathing effect in sawtooth pattern
Figure 65. Triangular Waveform
Figure 66. Sawtooth Waveform
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Typical Applications (continued)
9.2.2 Power-Supply Margining
A power-supply margining circuit is used to test and trim the output of a power converter. This circuit is used to
test a system by margining the power supplies, for adaptive voltage scaling, or to program a desired value at the
output. Adjustable power supplies, such as LDOs and DC/DC converters provide a feedback or adjust input that
is used to set the desired output. A precision voltage-output DAC is the best choice for controlling the powersupply output linearly. Figure 67 shows a control circuit for a switch-mode power supply (SMPS) using
DACx3401. Typical applications of power-supply margining are communications equipment, enterprise servers,
test and measurement, and general-purpose power-supply modules.
L
VIN
IN
PH
VOUT
BOOT
CL
SMPS
VDD
R1
CB
R3
DACx3401
SENSE
VFB
GND
R2
Figure 67. Power-Supply Margining
9.2.2.1 Design Requirements
•
•
•
•
•
Power supply nominal output: 3.3 V
Reference voltage of the converter (VFB): 0.6 V
Margin: ±10% (that is, 2.97 V to 3.63 V)
DAC output range: 1.8 V
Nominal current through R1 and R2: 100 µA
9.2.2.2 Detailed Design Procedure
The DACx3401 features a Hi-Z power-down mode that is set by default at power-up, unless the device is
programmed otherwise using the NVM. When the DAC output is at Hi-Z, the current through R3 is zero and the
SMPS is set at the nominal output voltage of 3.3 V. To have the same nominal condition when the DAC powers
up, bring up the device at the same output as VFB (that is 0.6 V). This configuration makes sure there is no
current through R3 even at power-up. Calculate R1 as (VOUT – VFB) / 100 µA = 27 kΩ.
To achieve ±10% margin-high and margin-low conditions, the DAC must sink or source additional current through
R1. Calculate the current from the DAC (IMARGIN) using Equation 7 as 12 µA.
IMARGIN
§ VOUT u 1 MARGIN
¨¨
R1
©
VFB ·
¸¸ INOMINAL
¹
where
•
•
•
IMARGIN is the margin current sourced or sinked from the DAC.
MARGIN is the percentage margin value divided by 100.
INOMINAL is the nominal current through R1 and R2.
(7)
In order to calculate the value of R3, first decide the DAC output range, and make sure to avoid the codes near
zero-scale and full-scale for safe operation in the linear region. A DAC output of 20 mV is a safe consideration as
the minimum output, and (1.8 V – 0.6 V – 20 mV = 1.18 V) as the maximum output. When the DAC output is at
20 mV, the power supply goes to margin high, and when the DAC output is at 1.18 V, the power supply goes to
margin low. Calculate the value of R3 usingEquation 8 as 48.3 kΩ. Choose a standard resistor value and adjust
the DAC outputs. Choosing R3 = 47 kΩ makes the DAC margin high code as 1.164 V and the DAC margin low
code as 36 mV.
42
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Typical Applications (continued)
R3
VDAC
VFB
IMARGIN
(8)
The DACx3401 have a slew rate feature that is used to toggle between margin high, margin low, and nominal
outputs with a defined slew rate. See the GENERAL_CONFIG register description for the slew rate setting
details.
NOTE
The MARGIN HIGH register value in DACx3401 results in the MARGIN LOW value at the
power supply output. Similarly, the MARGIN LOW register value in DACx3401 results in
the MARGIN HIGH value at the power-supply output.
The pseudocode for getting started with a power-supply control application is as follows:
//SYNTAX: WRITE , ,
//Write DAC code (12-bit aligned) for nominal output
//For a 1.8-V output range, the 10-bit hex code for 0.6 V is 0x0155. With 12bit alignment, it becomes 0x0554
WRITE DAC_DATA(0x21), 0x05, 0x54
//Write DAC code (12-bit aligned) for margin-low output at the power supply
//For a 1.8-V output range, the 10-bit hex code for 1.164 V is 0x0296. With 12bit alignment, it becomes 0x0A58
WRITE DAC_MARGIN_HIGH(0x25), 0x0A, 0x58
//Write DAC code (12-bit aligned) for margin-high output at the power supply
//For a 1.8-V output range, the 10-bit hex code for 36 mV is 0x14. With 12bit alignment, it becomes 0x50
WRITE DAC_MARGIN_LOW(0x26), 0x00, 0x50
//Powerup the device with enable internal reference with 1.5x output span. This will output the nominal
voltage (0.6 V)
//CODE_STEP: 2 LSB, SLEW_RATE: 25.6 µs
WRITE GENERAL_CONFIG(0xD1), 0x12, 0x14
//Trigger margin-low output at the power supply
WRITE TRIGGER(0xD3), 0x00, 0x80
//Trigger margin-high output at the power supply
WRITE TRIGGER(0xD3), 0x00, 0x40
//Write back DAC code (12-bit aligned) for nominal output
WRITE DAC_DATA(0x21), 0x05, 0x54
9.2.2.3 Application Curves
Figure 68. Power-Supply Margin High
Figure 69. Power Supply Margin Low
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Typical Applications (continued)
9.2.3 Medical Alarm Generation
All medical devices implementing an alarm system shall comply to IEC60601-1-8 standard for medical alarms (as
per IEC60601-1 Ed 3.1). The regulatory tests are done at a system level; therefore, system level acoustics play a
major role in the compliance. A medical alarm is a common functional block in many medical devices. A portable
implementation is needed that can also be customized to fit mechanical and audio or acoustic requirements. The
DACx3401-based design is aimed at providing a programmable, standalone, and robust implementation at a very
low cost.
There are three types of alarms with different timing requirements: low priority, medium priority, and high priority.
Usually, for easy identification, different timings are employed for different equipment. Medical device
manufacturers prefer using their signature melodies within the limits of the standard.
2k
2k
5V
5V
0.1 µF
±
±
+
DACx3401
+
SHDN
TLV342S
1k
20 k
LM158
±5 V
DACx3401
Figure 70. Medical Alarm
9.2.3.1 Design Requirements
•
•
Alarm envelope rise and fall time: 26 ms
Alarm pulse frequency: 610 Hz
9.2.3.2 Detailed Design Procedure
Two DACx3401 devices are required: one device to generate the pulse envelope and the burst, and the second
device to generate the pulse frequency. As shown in Figure 70, mix both these signals together using the
TLV342S amplifier with shutdown. Feed the combined signal to a power amplifier, such as the LM158, to drive
the speaker. This design provides a gain of 2 at the speaker amplifier. The actual gain required in a system
depends on the acoustic output requirements from the speaker. The RC high-pass filter, designed for a cut-off
frequency of approximately 80 Hz at the input of LM158, removes the dc component from the signal so that this
signal can be applied to the speaker directly. As per the medical alarm standard, the pulse frequency must be
above 150 Hz. As a result of the square-wave pulse frequency and the mixing done by TLV342S, the speaker
output has multiple harmonics of the fundamental pulse frequency, thus fulfilling the requirement of the medical
alarm standard. The DACx3401 provide various options to program the pulse frequency and envelope timings.
See the Medical Alarm Generation Mode section for the alarm configuration options. Calculate the frequency of a
square wave or pulse frequency using Equation 3. The square wave function has a limited number of frequencies
because this function is programmed by the SLEW_RATE bit alone. To get a higher number of frequencies,
generate a triangular waveform with comparator mode output. Generate the triangular waveform using
Equation 4. Set the DAC output in the comparator mode by fixing the VFB pin to the midscale of the DAC using a
resistive voltage divider from VDD. Select VDD as the reference in this case using the GENERAL_CONFIG
register.
44
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Typical Applications (continued)
The pseudocode for getting started with a medical alarm application using two DACs is as follows:
//SYNTAX: WRITE , ,
//Power-up the first DAC, enable VDD reference
//SLEW_RATE: 1.6384 ms (Square wave frequency: 610 Hz)
WRITE GENERAL_CONFIG(0xD1), 0xD1, 0x58
//Set MARGIN_HIGH on the first DAC
WRITE DAC_MARGIN_HIGH(0x25), 0x0F, 0xFC
//Set MARGIN_LOW on the first DAC
WRITE DAC_MARGIN_LOW(0x26), 0x00, 0x00
//Trigger square wave generation on the first DAC
WRITE TRIGGER(0xD3), 0x01, 0x00
//Power-up the second DAC, enable VDD reference
//CODE_STEP: 8 LSB, SLEW_RATE: 204.8 µs x 1.75 = 358.4 µs (Envelope rise/fall times for fullscale: ~26 ms)
WRITE GENERAL_CONFIG(0xD1), 0x1A, 0xE8
//OPTION-1: Configure the second DAC for low-priority alarm with minimum time settings and trigger
WRITE MED_ALARM_CONFIG(0xD2), 0x01, 0x00
//OPTION-2: Configure the second DAC for medium-priority alarm with minimum time settings and trigger
WRITE MED_ALARM_CONFIG(0xD2), 0x02, 0x00
//OPTION-3: Configure the second DAC for high-priority alarm with minimum time settings and trigger
WRITE MED_ALARM_CONFIG(0xD2), 0x04, 0x00
//Set MARGIN_HIGH on the second DAC
WRITE DAC_MARGIN_HIGH(0x25), 0x0F, 0xFC
//Set MARGIN_LOW on the second DAC
WRITE DAC_MARGIN_LOW(0x26), 0x00, 0x00
9.2.3.3 Application Curves
Figure 71. Low Priority Alarm
Figure 72. Medium Priority Alarm
Figure 73. High-Priority Alarm
Figure 74. Pulse Frequency
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10 Power Supply Recommendations
The DACx3401 family of devices does not require specific supply sequencing. These devices require a single
power supply, VDD. Use a 0.1-µF decoupling capacitor for the VDD pin. Use a bypass capacitor with a value
greater than 1.5-µF for the CAP pin.
11 Layout
11.1 Layout Guidelines
The DACx3401 pin configuration separates the analog, digital, and power pins for an optimized layout. For signal
integrity, separate the digital and analog traces, and place decoupling capacitors close to the device pins.
11.2 Layout Example
Figure 75 shows an example layout drawing with decoupling capacitors and pullup resistors.
Pull-down
for A0
Pull-up
for S CL
DACx340 1
1
8
SCL
2
7
SDA
3
6
4
5
Pull-up
for S DA
VOUT
VFB
VDD
Decouplin g
Capacitor
GND
GND
LDO bypass
capacitor
(Note: Gro und and Power plan es omitted for cla rity)
Figure 75. Layout Example
46
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Texas, Instruments DAC53401EVM user's guide
12.2 Related Links
Table 28 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to order now.
Table 28. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DAC53401
Click here
Click here
Click here
Click here
Click here
DAC43401
Click here
Click here
Click here
Click here
Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
PMBus is a trademark of SMIF, Inc.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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8-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
DAC43401DSGR
ACTIVE
WSON
DSG
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
4341
DAC43401DSGT
ACTIVE
WSON
DSG
8
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
4341
DAC53401DSGR
ACTIVE
WSON
DSG
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
5341
DAC53401DSGT
ACTIVE
WSON
DSG
8
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
5341
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of