DAC716U-TI

® DAC716 16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface FEATURES: DESCRIPTION ● SERIAL DIGITAL INTERFACE The DAC716 is a complete monolithic D/A converter including a +10V temperature compensated voltage reference, current-to-voltage amplifier, a high-speed synchronous serial interface, a serial output which allows cascading multiple converters, and an asynchronous clear function which immediately sets the output voltage to zero. The output voltage range is 0 to +10V while operating from ±12V to ±15V supplies, and the gain and bipolar offset adjustments are designed so that they can be set via external potentiometers or external D/A converters. The output amplifier is protected against shortcircuiting to ground. ● VOLTAGE OUTPUT: 0 to +10V ● ±2 LSB INTEGRAL LINEARITY ● PRECISION INTERNAL REFERENCE ● LOW NOISE: 120nV/√Hz Including Reference ● 16-LEAD PLASTIC SKINNY DIP AND PLASTIC SOIC PACKAGES The 16-pin DAC716 is available in a plastic 0.3" DIP and a wide-body plastic SOIC package. The DAC716P, U, PB, and UB are specified over the –40°C to +85°C range while the DAC716UK and PK are specified over the 0°C to +70°C range. A0 Input Shift Register A1 SDO 16 SDI CLK D/A Latch CLR 16 16-Bit D/A Converter Reference Circuit VOUT Offset Adjust Gain Adjust VREF OUT +10V International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 © 1996 Burr-Brown Corporation SBAS049 PDS-1324B Printed in U.S.A. March, 1998 SPECIFICATIONS At TA = +25°C, +VCC = +15V, –VCC = –15V, unless otherwise noted. DAC716P, U PARAMETER MIN TYP DAC716PB, UB MAX MIN TYP DAC716PK, UK MAX MIN TYP MAX UNITS ±2 ±2 ±2 ±2 LSB LSB LSB LSB Bits Bits % % % of FSR(2) % of FSR %FSR/%VCC ppm FSR/%VCC TRANSFER CHARACTERISTICS ACCURACY Linearity Error TMIN to TMAX Differential Linearity Error TMIN to TMAX Monotonicity Monotonicity Over Spec Temp Range Gain Error(3) TMIN to TMAX Unipolar Zero Error (3) TMIN to TMAX Power Supply Sensitivity of Gain ±4 ±8 ±4 ±8 14 13 REFERENCE VOLTAGE Voltage TMIN to TMAX Output Resistance Source Current Short Circuit to ACOM Duration 15 14 15 15 ±0.1 ±0.25 ±0.1 ±0.2 ±0.003 ±30 DYNAMIC PERFORMANCE Settling Time (to ±0.003%FSR, 5kW || 500pF Load)(4) 20V Output Step 1LSB Output Step(5) Output Slew Rate Total Harmonic Distortion 0dB, 1001Hz, fS = 100kHz –20dB, 1001Hz, fS = 100kHz –60dB, 1001Hz, fS = 100kHz SINAD: 1001Hz, f S = 100kHz Digital Feedthrough(5) Digital-to-Analog Glitch Impulse(5) Output Noise Voltage (includes reference) ANALOG OUTPUT Output Voltage Range +VCC, –VCC = ±11.4V Output Current Output Impedance Short Circuit to ACOM Duration ±2 ±4 ±2 ±4 6 4 10 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ 10 ✻ ✻ ✻ +10.025 +10.040 ✻ ✻ ✻ ✻ 1 ✻ ✻ ✻ ✻ ✻ 2 V mA W ✻ ✻ ✻ ✻ ✻ Indefinite ✻ ✻ 16 ✻ ✻ µs µs V/µs % % % dB nV–s nV–s nV/√Hz ✻ ✻ ✻ ✻ 0.1 Indefinite ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ +10 ±5 +10.000 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ 0.005 0.03 3.0 87 2 15 120 +9.975 +9.960 ✻ ✻ ✻ ✻ ✻ ✻ V V W mA INTERFACE RESOLUTION DIGITAL INPUTS Serial Data Input Code Logic Levels(1) VIH Bits StraightBinary VIL +2.0 (VCC –1.4) ✻ ✻ ✻ ✻ 0 +0.8 ✻ ✻ ✻ ✻ V V IIH (VI = +2.7V) ±10 ✻ ✻ µA IIL (VI = +0.4V) ±10 ✻ ✻ µA ✻ ✻ V V ✻ ✻ ✻ ✻ V V ✻ ✻ ✻ ✻ ✻ mA mA mW +70 ✻ °C °C °C/W DIGITAL OUTPUT Serial Data VOL (ISINK = 1.6mA) VOH (ISOURCE = 500µA),TMIN to TMAX POWER SUPPLY REQUIREMENTS Voltage +VCC –VCC Current (No Load, ±15V Supplies)(6) +VCC –VCC Power Dissipation(7) TEMPERATURE RANGES Specification All Grades Storage Thermal Coefficient, θJA +0.4 +5 ✻ ✻ +15 –15 +16.5 –16.5 ✻ ✻ 13 22 16 26 625 0 +2.4 +11.4 –11.4 –40 –60 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ +85 +150 ✻ ✻ ✻ 75 0 ✻ ✻ ✻ Specifications are the same as the grade to the left. NOTES: (1) Digital inputs are TTL and +5V CMOS compatible over the specification temperature range. (2) FSR means Full Scale Range. For example, for 0 to +10V output, FSR = 10V. (3) Errors externally adjustable to zero. (4) Maximum represents the 3σ limit. Not 100% tested for this parameter. (5) For the worst-case Straight Binary code changes: 7FFF to 8000 and 8000 to 7FFF. (6) During power supply turn on, the transient supply current may approach 3x the maximum quiescent specification. (7) Typical (i.e. rated) supply voltages times maximum currents. ® DAC716 2 PIN CONFIGURATION PIN DESCRIPTIONS Top View SOIC/DIP CLK 1 16 CLR A0 2 15 –VCC A1 3 14 Gain Adjust SDI 4 SDO 5 13 Offset Adjust 12 VREF OUT DCOM 6 11 NC +VCC 7 10 NC ACOM 8 9 DAC716 VOUT ELECTROSTATIC DISCHARGE SENSITIVITY PIN LABEL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK A0 A1 SDI SDO DCOM +VCC ACOM VOUT NC NC VREF OUT Offset Adjust Gain Adjust –VCC CLR DESCRIPTION Serial Data Clock Enable for Input Register (Active Low) Enable for D/A Latch (Active Low) Serial Data Input Serial Data Output Digital Supply Ground Positive Power Supply Analog Supply Ground D/A Output No Connection No Connection Voltage Reference Output Offset Adjust Gain Adjust Negative Power Supply Clear ORDERING INFORMATION Electrostatic discharge can cause damage ranging from performance degradation to complete device failure. BurrBrown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications. PRODUCT PACKAGE DAC716P DAC716U DAC716PB DAC716UB DAC716PK DAC716UK Plastic DIP Plastic SOIC Plastic DIP Plastic SOIC Plastic DIP Plastic SOIC DIFFERENTIAL LINEARITY ERROR TMIN to TMAX ±8 ±8 ±4 ±4 ±2 ±2 LSB LSB LSB LSB LSB LSB TEMPERATURE RANGE –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 0°C to +70°C 0°C to +70°C PACKAGE INFORMATION ABSOLUTE MAXIMUM RATINGS(1) PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) DAC716P DAC716U Plastic DIP Plastic SOIC 180 211 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. +VCC to Common .................................................................... 0V to +17V –VCC to Common .................................................................... 0V to –17V +VCC to –VCC ....................................................................................... 34V ACOM to DCOM ............................................................................... ±0.5V Digital Inputs to Common ............................................. –1V to (VCC –0.7V) External Voltage Applied to BPO and Range Resistors ..................... ±VCC VREF OUT ......................................................... Indefinite Short to Common VOUT ............................................................... Indefinite Short to Common SDO ............................................................... Indefinite Short to Common Power Dissipation .......................................................................... 750mW Storage Temperature ...................................................... –60°C to +150°C Lead Temperature (soldering, 10s) ................................................ +300°C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® 3 DAC716 TIMING SPECIFICATIONS TRUTH TABLE TA = –40°C to +85°C, +VCC = +15V, –VCC = –15V. SYMBOL PARAMETER MIN tCLK tCL tCH tA0S tA1S tAOH tA1H tDS tDH tDSOP tCP Data Clock Period Clock LOW Clock HIGH Setup Time for A0 Setup Time for A1 Hold Time for A0 Hold Time for A1 Setup Time for DATA Hold Time for DATA Output Propagation Delay Clear Pulsewidth 100 50 50 50 50 10 10 50 10 140 200 MAX UNITS ns ns ns ns ns ns ns ns ns ns ns A0 A1 CLK CLR DESCRIPTION 0 1 1→0→1 1 Shift Serial Data into SDI Load D/A Latch 1 0 1→0→1 1 1 1 1→0→1 1 No Change 0 0 1→0→1 1 Two Wire Operation(1) X X 1 1 No Change X X X 0 Reset D/A Latch NOTES: X = Don’t Care. (1) All digital input changes will appear at the D/A output. TIMING DIAGRAMS Serial Data In tCLK tCH tCL CLK tA 0H tA 0S A0 tDS Serial Data Input MSB First tDH D15 SDI D14 D0 tA tA 1S Latch Data In D/A Latch 1H A1 tCP CLR Serial Data Out tCLK tCH tCL CLK tA 0S tA A0 0H tDS Serial Data Out SDO D15 D14 tDSOP tDSOP ® DAC716 D0 4 TYPICAL PERFORMANCE CURVES POWER SUPPLY REJECTION vs POWER SUPPLY RIPPLE FREQUENCY LOGIC vs V LEVEL 1k 2.0 –VCC 100 1.0 I Digital Input (µA) [Change in FSR]/[Change in Supply Voltage] (ppm of FSR/ %) At TA = +25°C, VCC = ±15V, unless otherwise noted. +VCC 10 CLR 0 SDI –1.0 1 –2.0 –0.85 0.1 10 100 1k 10k 100k A0, A1 1M 0 0.85 1.7 2.55 3.4 4.25 5.1 5.95 6.8 V Digital Input Frequency (Hz) FULL SCALE OUTPUT SWING SETTLING TIME, +10V TO 0V ∆ Around 0 (µV) VOUT (V) 10 FPO 2000 +5V 1500 0V A1 2500 1000 500 0 –500 –1000 –1500 0 –2000 –2500 Time (10µs/div) Time (1µs/div) SETTLING TIME, 0V TO +10V +5V 1500 –0V A1 2000 1000 100 500 nV/√Hz ∆ Around +10V (µV) VOUT SPECTRAL NOISE DENSITY 1000 2500 0 –500 10 –1000 –1500 –2000 1 –2500 1 Time (1µs/div) 10 100 1k 10k 100k 1M 10M Frequency (Hz) ® 5 DAC716 DISCUSSION OF SPECIFICATIONS DIGITAL FEEDTHROUGH When the A/D is not selected, high frequency logic activity on the digital inputs is coupled through the device and shows up as output noise. This noise is digital feedthrough. LINEARITY ERROR Linearity error is defined as the deviation of the analog output from a straight line drawn between the end points of the transfer characteristic. OPERATION The DAC716 is a monolithic integrated-circuit 16-bit D/A converter complete with 16-bit D/A switches and ladder network, voltage reference, output amplifier and a serial interface. DIFFERENTIAL LINEARITY ERROR Differential linearity error (DLE) is the deviation from 1LSB of an output change from one adjacent state to the next. A DLE specification of ±1/2LSB means that the output step size can range from 1/2LSB to 3/2LSB when the digital input code changes from one code word to the adjacent code word. If the DLE is more positive than –1LSB, the D/A is said to be monotonic. INTERFACE LOGIC The DAC716 has double-buffered data latches. The input data latch holds a 16-bit data word before loading it into the second latch, the D/A latch. This double-buffered organization permits simultaneous update of several D/A converters. All digital control inputs are active low. Refer to block diagram of Figure 1. MONOTONICITY A D/A converter is monotonic if the output either increases or remains the same for increasing digital input values. Monotonicity of the K grade is guaranteed over the specification temperature range to 15 bits. All latches are level-triggered. Data present when the enable inputs are logic “0” will enter the latch. When the enable inputs return to logic “1”, the data is latched. The CLR input resets both the input latch and the D/A latch to give an output voltage of 0V (code 0000). SETTLING TIME Settling time is the total time (including slew time) for the D/A output to settle to within an error band around its final value after a change in input. Settling times are specified to within ±0.003% of Full Scale Range (FSR) for an output step change of 10V and 1LSB. The 1LSB change is measured at the Major Carry (7FFF to 8000, and 8000 to 7FFF: Straight Binary codes), the input transition at which worstcase settling time occurs. LOGIC INPUT COMPATIBILITY DAC716 digital inputs are TTL compatible (1.4V switching level) with low leakage, high impedance inputs. Thus the inputs are suitable for being driven by any type of 5V logic such as 5V CMOS logic. An equivalent circuit of a digital input is shown in Figure 2. Data inputs will float to logic “0” and control inputs will float to logic “0” if left unconnected. It is recommended that any unused inputs be connected to DCOM to improve noise immunity. TOTAL HARMONIC DISTORTION + NOISE Total harmonic distortion + noise is defined as the ratio of the square root of the sum of the squares of the values of the harmonics and noise to the value of the fundamental frequency. It is expressed in % of the fundamental frequency amplitude at sampling rate fS. Digital inputs remain high impedance when power is off. INPUT CODING The DAC716 is designed to accept Straight Binary (SB) input codes. The serial input format is MSB first. SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD) INTERNAL REFERENCE DAC716 contains a +10V reference. SINAD includes all the harmonic and outstanding spurious components in the definition of output noise power in addition to quantizing and internal random noise power. SINAD is expressed in dB at a specified input frequency and sampling rate, fS. The reference output may be used to drive external loads, sourcing up to 2mA. The load current should be constant, otherwise the gain and unipolar offset of the converter will vary. DIGITAL-TO-ANALOG GLITCH IMPULSE The amount of charge injected into the analog output from the digital inputs when the inputs change state. It is measured at half scale at the input codes where as many as possible switches change state—from 8000 to 7FFF. OUTPUT VOLTAGE SWING The output amplifier of DAC716 is designed to achieve a +10V output range. DAC716 will provide a +10V output swing while operating on ±11.4V or higher voltage supplies. ® DAC716 6 Gain Adjust VREF OUT +VCC – VCC 14 12 7 15 180Ω 15kΩ +10V Reference 10 NC 11 NC 13 Offset Adjust 9 VOUT 9.75kΩ +2.5V 5kΩ –VCC D/A Switches CLK 1 A1 3 CLR 16 A0 2 SDI 4 SDO 5 DAC Latch 16 Shift Register 8 6 ACOM DCOM FIGURE 1. DAC716 Block Diagram. +VCC ESD Protection Circuit Range of Gain Adjust ≈ ±0.3% + Full Scale R = 1kΩ: A0, A1, CLK, CLR, SDI 1LSB R 6.8V Full Scale Range Analog Output Digital Input 5pF –VCC Gain Adjust Rotates the Line FIGURE 2. Equivalent Circuit of Digital Inputs. Range of Offset Adjust GAIN AND OFFSET ADJUSTMENTS Figure 3 illustrates the relationship of offset and gain adjustments for a unipolar connected D/A converter. Offset should be adjusted first to avoid interaction of adjustments. See Table I for calibration values and codes. These adjustments have a minimum range of ±0.3%. Offset Adj. Translates the Line ≈ ±0.3% 0000H Zero 8000H FFFFH Digital Input FIGURE 3. Relationship of Offset and Gain Adjustments. Offset Adjustment Apply the digital input code, 0000, that produces 0V and adjust the offset potentiometer or the offset adjust D/A converter for 0V. Gain Adjustment Apply the digital input that gives the maximum positive voltage output. Adjust the gain potentiometer or the gain adjust D/A converter for this positive full scale voltage. ® 7 DAC716 DAC716 CALIBRATION VALUES 1 LEAST SIGNIFICANT BIT = 152µV 1 16 2 –VCC 15 3 14 –12V to –15V DIGITAL INPUT CODE ANALOG OUTPUT (V) STRAIGHT BINARY UNIPOLAR 10V RANGE DESCRIPTION FFFFH | 8000H +9.999695 + Full Scale –1LSB 4 +5.000000 13 DAC716 Half Scale 5 0000H 0.000000 12 + 1µF Unipolar Zero 6 DCOM 11 7 +VCC 10 8 ACOM 9 +12V to +15V TABLE I. Digital Input and Analog Output Voltage Calibration Values. 1µF + INSTALLATION GENERAL CONSIDERATIONS Due to the high precision of these D/A converters, system design problems such as grounding and contact resistance become very important. A 16-bit converter with a 10V fullscale range has a 1LSB value of 152µV. With a load current of 5mA, series wiring and connector resistance of only 60mΩ will cause a voltage drop of 300µV. To understand what this means in terms of a system layout, the resistivity of a typical 1 ounce copper-clad printed circuit board is 1/2 mΩ per square. For a 5mA load, a 0.1 inch wide printed circuit conductor 0.6 inches long will result in a voltage drop of 150µV. FIGURE 4. Power Supply Connections. The analog output of DAC716 has an LSB size of 152µV (–96dB). The rms noise floor of the D/A should remain below this level in the frequency range of interest. The DAC716’s output noise spectral density (which includes the noise contributed by the internal reference) is shown in the Typical Performance Curves section. If several DAC716s are used or if the DAC716 shares supplies with other components, connecting the ACOM and DCOM lines together at the power supplies only rather than at each chip, may give better results. pins are located adjacent to each other to help isolate analog from digital signals. Analog signals should be routed as far as possible from digital signals and should cross them at right angles. A solid analog ground plane around the D/A package, as well as under it in the vicinity of the analog and power supply pins, will isolate the D/A from switching currents. It is recommended that DCOM and ACOM be connected directly to the ground planes under the package. LOAD CONNECTIONS Since the reference point for VOUT and VREF OUT is the ACOM pin, it is important to connect the D/A converter load directly to the ACOM pin. Refer to Figure 5. Wiring to high-resolution D/A converters should be routed to provide optimum isolation from sources of RFI and EMI. The key to elimination of RF radiation or pickup is small loop area. Signal leads and their return conductors should be kept close together such that they present a small capture cross-section for any external field. Wire-wrap construction is not recommended. Lead and contact resistances are represented by R1 through R3. As long as the load resistance RL is constant, R1 simply introduces a gain error and can be removed by gain adjustment of the D/A or system-wide gain calibration. R2 is part of RL if the output voltage is sensed at ACOM. POWER SUPPLY AND REFERENCE CONNECTIONS Power supply decoupling capacitors should be added as shown in Figure 4. Best performance occurs using a 1 to 10µF tantalum capacitor at –VCC. Applications with less critical settling time may be able to use 0.01µF at –VCC as well as at +V CC. The capacitors should be located close to the package. The DAC716 has separate ANALOG COMMON and DIGITAL COMMON pins. The current through DCOM is mostly switching transients and are up to 1mA peak in amplitude. The current through ACOM is typically 5µA for all codes. In some applications it is impractical to return the load to the ACOM pin of the D/A converter. Sensing the output voltage at the SYSTEM GROUND point is reasonable, because there is no change in DAC716 ACOM current, provided that R3 is a low-resistance ground plane or conductor. In this case you may wish to connect DCOM to SYSTEM GROUND as well. GAIN AND OFFSET ADJUST Connections Using Potentiometers GAIN and OFFSET adjust pins provide for trim using external potentiometers. 15-turn potentiometers provide sufficient resolution. Range of adjustment of these trims is at least ±0.3% of Full Scale Range. Refer to Figure 6. Use separate analog and digital ground planes with a single interconnection point to minimize ground loops. The analog ® DAC716 8 DIGITAL INTERFACE Using D/A Converters The GAIN ADJUST and OFFSET ADJUST circuits of DAC716 have been arranged so that these points may be easily driven by external D/A converters. Refer to Figure 7. 12-bit D/A converters provide a nominal OFFSET adjust and GAIN adjust resolution of 25µV and 15µV per LSB step, respectively. SERIAL INTERFACE The DAC716 has a serial interface with two data buffers which can be used for either synchronous or asynchronous updating of multiple D/A converters. A0 is the enable control for the Data Input Latch. A1 is the enable for the D/A Latch. CLK is used to strobe data into the latches enabled by A0 and A1. A CLR function is also provided and when enabled it sets both the Data Latch and the D/A Latch to all zeros . Nominal values of GAIN and OFFSET occur when the D/A converters outputs are at approximately half scale, 0V. Multiple DAC716s can be connected to the same CLK and data lines in two ways. The output of the serial loaded data latch is available as SDO so that any number of DAC716s can be cascaded on the same input bit stream as shown in Figure 8 and 9. This configuration allows all D/A converters to be updated simultaneously and requires a minimum number of control signal inputs. These configurations do require 16N CLK cycles to load any given D/A converter, where N is the number of D/A converters. OUTPUT VOLTAGE RANGE CONNECTIONS The DAC716 output amplifier is connected internally for 10V output range. The DAC716 can also be connected in parallel as shown in Figure 10. This configuration allows any D/A converter in the system to be updated in a maximum of 16 CLK cycles. VREF OUT Offset Adjust DAC716 SDI A0 A1 VREF 9.75kΩ 5kΩ CLR VOUT R1 Bus Interface RL DCOM Sense Output ACOM R2 R3 Alternate Ground Sense Connection To +VCC 0.01µF(1) 0.01µF System Ground Analog Power Supply To –VCC NOTE: (1) Locate close to DAC716 package. FIGURE 5. System Ground Considerations for High-Resolution D/A Converters. ® 9 DAC716 Internal +10V Reference VREF OUT 12 P1 1kΩ 180Ω R1 100Ω Gain Adjust Offset Adjust 15kΩ 14 R2 1MΩ 13 R3 27kΩ 9.75kΩ +VCC P2 10kΩ to 100kΩ –VCC 5kΩ 9 IDAC 0-2mA 8 10V VOUT For no external adjustments, pins 13 and 14 are not connected. External resistors R1 - R3 are standard ±1% values. Range of adjustment at least ±0.3% FSR. ACOM FIGURE 6. Manual Offset and Gain Adjust Circuits. Internal +10V Reference VREF OUT 12 R1 392Ω 180Ω Gain Adjust 14 Offset Adjust 13 15kΩ 9.75kΩ R2 33kΩ 5kΩ IDAC 0-2mA –10 to +10V 9 +10V VOUT DAC716 For no external adjustments, pins 13 and 14 are not connected. External resistors R1 - R3 tolerance: ±1%. Range of adjustment at least ±0.3% FSR. FIGURE 7. Gain and Offset Adjustment Using D/A Converters. ® DAC716 10 R3 1MΩ –10 to +10V DAC ±10V DAC ±10V 4 Data 2 Data Latch 3 Up Date 1 CLK +5V 16 4 2 3 1 +5V 16 4 2 3 1 +5V 16 SDI A0 DAC716 A1 DAC 1 CLK CLR SDO 5 SDI A0 DAC716 A1 DAC 2 CLK CLR SDO 5 SDI A0 DAC716 A1 DAC 3 CLK CLR SDO 5 To other DACs FIGURE 8a. Cascaded Serial Bus Connection with Synchronous Update. DAC 3 DAC 2 DAC 1 Clock Data F E D C B A 9 8 7 6 5 4 3 2 1 0 F E D C B A 9 8 7 6 5 4 3 2 1 0 F E D C B A 9 8 7 6 5 4 3 2 1 0 Data Latch Update FIGURE 8b. Timing Diagram For Figure 8a. ® 11 DAC716 4 Data 2 Data Latch 3 Up Date 1 16 SDI A0 DAC716 A1 DAC 1 CLK CLR SDO 5 +5V 4 2 3 1 16 SDI A0 DAC716 A1 DAC 2 CLK CLR SDO 5 +5V 4 2 3 1 16 SDI A0 DAC716 A1 DAC 3 CLK CLR SDO 5 To other DACs +5V FIGURE 9a. Cascaded Serial Bus Connection with Asynchronous Update. DAC 3 DAC 2 DAC 1 Data Latch Data F E D C B A 9 8 7 6 5 4 3 2 1 0 F E D C B A 9 8 7 6 5 4 3 Update FIGURE 9b. Timing Diagram For Figure 9a. ® DAC716 12 2 1 0 F E D C B A 9 8 7 6 5 4 3 2 1 0 Data Data Latch 1 Up Date 4 SDI 2 A0 DAC716 3 A1 DAC 1 1 CLK CLK 16 CLR 4 Data Latch 2 SDO 5 SDI 2 A0 DAC716 3 A1 DAC 2 1 CLK 16 4 Data Latch 3 CLR CLR SDO 5 SDI 2 A0 DAC716 3 A1 DAC 3 1 CLK 16 CLR SDO 5 FIGURE 10a. Parallel Bus Connection. DAC 1 DAC 2 DAC 3 Clock Data F E D C B A 9 8 7 6 5 4 3 2 1 0 F E D C B A 9 8 7 6 5 4 3 2 1 0 F E D C B A 9 8 7 6 5 4 3 2 1 0 Data Latch 1 Data Latch 2 Data Latch 3 Update FIGURE 10b. Timing Diagram For Figure 10a. ® 13 DAC716 PACKAGE OPTION ADDENDUM www.ti.com 19-Aug-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DAC716P NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC716PB NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC716PBG4 NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC716PG4 NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC716PK NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC716PKG4 NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC716U ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC716UB ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC716UBG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC716UG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC716UK ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC716UKG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 19-Aug-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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