0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
DAC7760EMC-EVM

DAC7760EMC-EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    EVAL MODULE FOR DAC7760

  • 数据手册
  • 价格&库存
DAC7760EMC-EVM 数据手册
User's Guide SBAU229 – April 2014 DACx760EMC-EVM This user's guide describes the characteristics, operation, and use of the DAC7760 and DAC8760 (DACx760) evaluation boards (EMC-EVMs). This user's guide also discusses how to set up and configure the software and hardware, and reviews various aspects of the program operation. Throughout this document, the terms DAC8760EMC-EVM, evaluation board, evaluation module, and EVM are synonymous with the DACx760EMC-EVM. This user's guide also includes information regarding operating procedures and input/output connections, an electrical schematic, printed circuit board (PCB) layout drawings, and a parts list for the EVM. 1 2 3 4 5 6 Contents Overview ...................................................................................................................... 3 1.1 EVM Kit Contents ................................................................................................... 3 1.2 Related Documentation from Texas Instruments ............................................................... 3 EVM Hardware Setup ....................................................................................................... 4 2.1 Theory of Operation for EVM Hardware ......................................................................... 4 2.2 Signal Definitions of J1 (10-Pin Male Connector Socket) ..................................................... 5 2.3 Theory of Operation for SM-USB-DIG Platform ................................................................ 5 EVM Hardware Overview ................................................................................................... 6 3.1 Electrostatic Discharge Warning .................................................................................. 6 3.2 Jumper Summary ................................................................................................... 6 3.3 Connecting the Hardware.......................................................................................... 6 3.4 Connecting the USB Cable to the SM-USB-DIG Platform .................................................... 7 3.5 Powering the EVM .................................................................................................. 7 3.6 EVM Features ....................................................................................................... 8 EVM Software Setup ........................................................................................................ 9 4.1 Operating Systems for EVM Software ........................................................................... 9 4.2 EVM Software Installation ......................................................................................... 9 EVM Software Overview .................................................................................................. 11 5.1 Starting the EVM Software ....................................................................................... 11 5.2 EVM Software Features .......................................................................................... 12 PCB Assembly Drawings, Bill of Materials, and Schematics ......................................................... 16 6.1 DACx760EMC-EVM Assembly Drawing ....................................................................... 16 6.2 DACx760EMC-EVM Bill of Materials ........................................................................... 17 6.3 DACx760EMC-EVM Board Schematic ......................................................................... 17 List of Figures ........................................................................................... 1 DAC8760EVM Hardware Setup 2 DAC8760EVM Block Diagram ............................................................................................. 4 3 USB-DIG Platform Block Diagram ......................................................................................... 5 4 SM-USB-DIG Connection to the DAC8760EVM ......................................................................... 6 5 Confirmation of SM-USB-DIG Platform Driver Installation 6 Hardware Features .......................................................................................................... 8 7 DAC8760EVM Installer 8 9 ............................................................. 4 7 ..................................................................................................... 9 DAC8760EVM Install Path ............................................................................................... 10 DAC8760EVM Software License Agreements ........................................................................ 10 Microsoft, Windows are registered trademarks of Microsoft Corporation. SPI is a trademark of Motorola Inc. SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 1 www.ti.com 10 11 12 13 14 15 16 17 18 19 20 21 22 ....................................................................................... Communication Error with SM-USB-DIG Platform .................................................................... Registers Tab ............................................................................................................... Read, Write, and Auto-Write Buttons .................................................................................... Resetting DAC8760 ........................................................................................................ Mode Selection ............................................................................................................. Dual Output Enable ........................................................................................................ Enabling Over-Range Operation ......................................................................................... Calibration Registers ....................................................................................................... Setting Slew Rates ......................................................................................................... CRC Enable and Dialog ................................................................................................... CLRSEL Drop-Down Menu and Clear Button .......................................................................... DACx760EMC-EVM Assembly Drawing ................................................................................ DAC8760EVM Software Interface 11 11 12 12 13 13 14 14 14 15 15 15 16 List of Tables 2 1 Contents of DACx760EMC-EVM and DACx750EMC-EVM Kit ........................................................ 3 2 Related Documentation ..................................................................................................... 3 3 SM-USB-DIG Connector .................................................................................................... 5 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Overview www.ti.com 1 Overview The DAC7760 (12-bit) and DAC8760 (16-bit) are precision digital-to-analog converters (DACs). The output can be configured to produce a current in output ranges of 0 mA to 20 mA, 4 mA to 20 mA, and 4 mA to 24 mA. Both devices can also be configured to have voltage output ranges of 0 V to 5 V, 0 V to 10 V, ±5 V, and ±10 V. The DAC7750 (12-bit) and DAC8750 (16-bit) feature current outputs only. All of these devices feature configurable slew rates, power-on reset functions, a highway addressable remote transducer (HART) signal interface, a watchdog timer, error checking, external and internal voltage references, and a common hardware fault output. This EVM is designed to demonstrate capability of the DAC8760 family of products to survive harsh industrial environments when paired with the appropriate protection circuitry on the analog front-end. 1.1 EVM Kit Contents Table 1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center nearest you if any component is missing. It is highly recommended that you check the TI web site at http://www.ti.com to verify that you have the latest versions of the related software. Table 1. Contents of DACx760EMC-EVM and DACx750EMC-EVM Kit Item 1.2 Quantity DACx760EMC-EVM or DACx750EMC-EVM PCB 1 SM-USB-DIG platform PCB 1 USB extender cable 1 SM-USB-DIG connector ribbon cable 1 Related Documentation from Texas Instruments The following documents provide information regarding Texas Instruments integrated circuits used in the assembly of the DACx760EMC-EVM and DACx750EMC-EVM. This user's guide is available from the TI web site under literature number SBAU205. Any letter appended to the literature number corresponds to the document revision that is current at the time of the writing of this document. Newer revisions may be available from the TI web site at http://www.ti.com/, or call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the document by both title and literature number. Table 2. Related Documentation Document Literature Number DAC7760 and DAC8760 product data sheet SBAS528 DAC7750 and DAC8750 product data sheet SBAS538 Single-Channel Industrial Voltage and Current Output Driver, Isolated, EMC/EMI Tested TIPD153 SM-USB-DIG Platform User’s Guide SBOU98 SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 3 EVM Hardware Setup 2 www.ti.com EVM Hardware Setup This section discusses the overall system setup for the EVM. A personal computer (PC) runs the software that communicates with the SM-USB-DIG Platform, which provides the power and digital signals used to communicate with the EVM board. Connectors on the EVM board allow the user to connect the required external power supply. External Power USB Computer SM-USB-DIG Platform 10-Pin DAC8760EVM Figure 1. DAC8760EVM Hardware Setup 2.1 Theory of Operation for EVM Hardware A block diagram of the EVM hardware setup is shown in Figure 2. This board provides test points for the SPI™ inputs, power, reference, ground connections, ALARM, CLR, BOOST, and the analog outputs of the DAC. Note that DACx750 only features current outputs (IOUT), but also includes a test point for R3SENSE. External Power Power SPI J1 (to SM-USB-DIG) Isolation VOUT Protection Circuit IOUT Protection Circuit DAC8760 Figure 2. DAC8760EVM Block Diagram 4 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Hardware Setup www.ti.com 2.2 Signal Definitions of J1 (10-Pin Male Connector Socket) Table 3 shows the pinout for the 10-pin connector socket used to communicate between the EVM and the SM-USB-DIG. Note that the I2C communications lines (I2C_SCL and I2C_SDA1) are not used. Table 3. SM-USB-DIG Connector 2.3 Pin On U1 Signal 1 I2C_SCL 2 CTRL/MEAS4 3 I2C_SDA1 4 CTRL/MEAS5 5 SPI_DOUT1 6 VDUT 7 SPI_CLK 8 GND Description I2C Clock Signal (SCL) GPIO – Control Output or Measure Input I2C Data Signal (SDA) GPIO – Control Output or Measure Input SPI Data Output (MOSI) Switchable DUT Power Supply: +3.3V, +5V, Hi-Z (Disconnected). Note: When VDUT is Hi-Z all Digital I/O are Hi-Z as well. SPI Clock Signal (SCLK) Power Return (GND) 9 SPI_CS1 SPI Chip Select Signal (CS) 10 SPI_DIN1 SPI Data Input (MISO) Theory of Operation for SM-USB-DIG Platform Figure 3 shows the block diagram for the SM-USB-DIG Platform. This platform is a general-purpose dataacquisition system that is used on several different Texas Instruments evaluation modules. The details of operation are included in SBOU098, SM-USB-DIG Platform User's Guide. The block diagram shown in Figure 3 is given as a brief overview of the platform. The primary component of the SM-USB-DIG Platform is the TUSB3210, an 8052 microcontroller that has a built-in USB interface. The microcontroller receives information from the host computer that is interpreted into power, I2C, SPI, and other digital I/O patterns. During the digital I/O transaction, the microcontroller reads the response of any device connected to the I/O interface. The response from the device is then sent back to the computer where it is interpreted by the host computer. SM-USB-DIG Platform +3.3 V USB +5 V TUSB3210 8052 mC with USB Interface and UART USB Bus from Computer Power-On Reset 2 I C and SPI Control and Measure Bits Buffers and Level Translators To Test Board To Computer and Power Supplies +3.3-V Regulator 8K × 8-byte EEPROM +5.0 V USB Power +3.0 V Power Switching VDUT (Hi-Z, 3.3 V, or 5 V) Switched Power Figure 3. USB-DIG Platform Block Diagram SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 5 EVM Hardware Overview 3 www.ti.com EVM Hardware Overview To use the EVM hardware, set the jumpers, connect the SM-USB-DIG and the EVM together, apply external power, and connect the USB cable from the SM-USB-DIG to the computer. This section presents the details of these procedures. 3.1 Electrostatic Discharge Warning While the input and circuitry is protected against electrostatic discharge, there are sensitive paths that can be damaged by electrostatic discharge (ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling the EVM, including the use of a grounded wrist strap at an approved ESD workstation. 3.2 Jumper Summary To facilitate strong EMC/EMI performance, there are no jumper options present with this EVM. 3.3 Connecting the Hardware To connect the EVM board and the SM-USB-DIG Platform together, firmly slide the male and female ends of the 10-pin connectors together as shown in Figure 4. Make sure that the two connectors are completely pushed together; loose connections may cause intermittent operation. Figure 4. SM-USB-DIG Connection to the DAC8760EVM 6 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Hardware Overview www.ti.com 3.4 Connecting the USB Cable to the SM-USB-DIG Platform Figure 5 shows the typical response to connecting the SM-USB-DIG Platform board to a USB port for the first time. Typically, the PC responds with a Found New Hardware, USB Device pop-up dialog window. The pop-up window then changes to Found New Hardware, USB Human Interface Device. This pop-up indicates that the device is ready to be used. The SM-USB-DIG Platform uses the human interface device drivers that are included in the Microsoft® Windows® operating system (OS). In some cases, the Add Hardware Wizard appears. If this prompt occurs, allow the system device manager to install the human interface drivers by clicking Yes when requested to install drivers. Figure 5. Confirmation of SM-USB-DIG Platform Driver Installation 3.5 Powering the EVM This section describes the various power configurations that can be used by the EVM. 3.5.1 AVDD and AVSS Power Configurations Terminal block J2 allows for external voltage sources to be connected to the AVDD and AVSS supply rails of the DACx760. Note that the DACx750 devices feature only AVDD supplies. The DACx760EMC-EVM only requires an AVSS supply if the DACx760 is used in ±5 V or ±10 V mode. If bipolar output is not required, jumper JP1 can be shunted to connect AVSS to GND, or GND may be connected at J2. AVDD and AVSS are protected to the datasheet absolute maximum potentials by transient-voltage-suppression (TVS) diodes D2, D3, and D5. 3.5.2 DVDD Power Configurations Terminal block J1 allows for an external voltage source to be connected to the DVDD pin of the DACx760 or DACx750. The EVM receives power from the SM-USB-DIG Platform when JP9 is installed. An external power source can be used when JP9 is removed and JP3 is installed. Note that if an external DVDD is used, it must be set to the same voltage as the SM-USB-DIG Platform for successful SPI communication alongside the SM-USB-DIG. The DVDD input is protected to the datasheet absolute maximum input by D1. The DACx760 and DACx750 feature internal regulators that can be used to provide DVDD supplies. By removing JP3, the DACx760 or DACx750 provide the DVDD supply. In this configuration, JP9 must be removed and no external supply can be connected. SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 7 EVM Hardware Overview 3.6 www.ti.com EVM Features This evaluation platform has an output protection circuit designed to withstand the electrostatic discharge (ESD), electrically fast transient (EFT), conducted immunity (CI), and radiated immunity (RI) immunity tests as described by the IEC61000-4 test suite. For full details concerning the design of these circuits and the design considerations for the layout of this PCB, please refer to TIPD153. Figure 6. Hardware Features 8 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Software Setup www.ti.com 4 EVM Software Setup This section discusses how to install the EVM software. 4.1 Operating Systems for EVM Software The EVM software has been tested on the Windows XP and Windows 7 operating systems with United States and European regional settings. The software should also function on other Windows operating systems. 4.2 EVM Software Installation The EVM software is included on the CD that is shipped with the EVM kit. It is also available through the EVM product folder on the TI website. To install the software, insert the included CD into an available CDROM drive. Navigate to the drive contents and open the DAC8760EVM software folder. Locate the compressed file named DACx760EMC-EVM.zip or DACx750EMC-EVM.zip and open it. Extract the EVM files into a specific folder (for example, C:\DAC8760EVM) on your hard drive. After the files are extracted, navigate to the folder you created on your hard drive. Locate and execute the setup.exe file to start the installation, as shown in Figure 7. The DAC8760 software installer file then opens to begin the installation process. Figure 7. DAC8760EVM Installer SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 9 EVM Software Setup www.ti.com After the installation process initializes, the user is given a choice of selecting the installation directory, usually defaulting to C:\Program Files\DAC8760EVM\ and C:\Program Files\National Instruments\ as shown in Figure 8. Figure 8. DAC8760EVM Install Path After selecting the installation directory, two license agreements are presented that must be accepted, as shown in Figure 9. Figure 9. DAC8760EVM Software License Agreements After accepting the Texas Instruments and National Instruments license agreements, the progress bar opens and shows the installation of the software. Once the installation process is completed, click Finish. 10 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Software Overview www.ti.com 5 EVM Software Overview This section describes the use of the EVM software. 5.1 Starting the EVM Software The EVM software can be operated through the Windows start menu. From the start menu, select All Programs, and then select DAC8760EVM. Figure 10 illustrates how the software should appear at launch if the EVM is functioning properly. Figure 10. DAC8760EVM Software Interface Figure 11 shows an error window that appears if the PC cannot communicate with the EVM. In the event you receive this error, first ensure that the USB cable is properly connected on both ends. This error can also occur if you connect the USB cable before the SM-USB-DIG Platform power source. Another possible source for this error is a problem with the USB human interface device driver on your PC. Make sure that the device is recognized when the USB cable is plugged in, indicated by a Windows-generated confirmation sound. Figure 11. Communication Error with SM-USB-DIG Platform SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 11 EVM Software Overview 5.2 5.2.1 www.ti.com EVM Software Features Registers Tab The EVM software features a tab devoted to reading and writing directly to the registers found on the DACx760 and DACx750, as shown in Figure 12. By selecting a register in the register table, the individual bits can be set in the Register Value section of the tab. The function of each bit can be found in the DACx760 and DACx750 data sheets, or by clicking the Help w/ Reg button. Note that read-only registers cannot have their values changed in this tab. Figure 12. Registers Tab 5.2.2 Reading From and Writing to Registers The EVM software only reads from and writes to the DACx760 and DACx750 registers at the user’s command. These actions are accomplished with the Read All Reg and Write All Reg buttons. When any change is made to the configuration register in the Registers tab or the Block Diagram tab, the green light is on to show that changes are pending, as shown in Figure 13. Figure 13. Read, Write, and Auto-Write Buttons Pressing the Write All Reg button writes the pending changes to the DACx760 or DACx750. In addition, by enabling the Auto-Write button, changes are written to the configuration register automatically. The registers in the DACx760 and DACx750 are read when the Read All Reg button is pressed. Perform a read after writing to the device configuration register to verify that the DACx760 or DACx750 successfully stored the data. More information about the individual registers can be found by pressing the Help w/ Reg button. 12 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Software Overview www.ti.com 5.2.3 Software Reset Figure 14 shows the Reset DAC8760 button. This button resets the DAC8760 back to the default poweron state after the change is written to the DAC. Figure 14. Resetting DAC8760 5.2.4 Setting the Output The Mode section of the Block Diagram tab allows for the configuration of the output range, output enable, and output value to be set, as shown in Figure 15. Figure 15. Mode Selection The DAC Value field must be rewritten to the DACx760 or DACx750 when the range is changed because the DAC value is reset. The Output Enable toggle button sets the OUTEN bit in the control register to high, which enables either the IOUT or VOUT functions. SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 13 EVM Software Overview 5.2.5 www.ti.com Dual Output Enable (DACx760 devices only) The DACx760 devices that feature both current and voltage outputs also feature a dual output enable option. This feature is not included on the DACx750 current output only devices. To enable dual outputs toggle the Dual Output Enable button shown in Figure 16 and select a voltage and current output range. The Output Enable and DAC Value shown in Figure 15 are used in dual output mode to enable the pair of outputs and to set the output code. Figure 16. Dual Output Enable 5.2.6 Enabling Voltage Overrange (DACx760 devices only) Figure 17 shows the Over Range toggle button. This button enables the DACx760 overrange function, which increases the voltage output range by 10% (not included in DACx750 devices). Figure 17. Enabling Over-Range Operation 5.2.7 Accessing Calibration Registers The DACx760 and DACx750 feature programmable gain and offset functions. Set the gain and offset with the Gain Calibration Code and Zero Offset Calibration Code fields. As shown in Figure 18, the fields on the left allow a 16-bit hex value to be entered directly, and the fields on the right allow decimal values to be used. The Cal. Enable toggle button applies the gain and offset to the data register. After reading all registers, the DAC Value field shows the changes. Figure 18. Calibration Registers 14 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated EVM Software Overview www.ti.com 5.2.8 Slew Rate Configuration Use the Slew Rate section of the Block Diagram tab, as shown in Figure 19, to set the various slew-rate controls. The Slew Rate drop-down menu sets the slewing frequency. The Slew Rate Step Size dropdown menu sets the step size, which is listed in LSB increments with the 12-bit step sizes in parentheses. The Slew Enable toggle button enables the programmed slew rates and step size on the DAC. Figure 19. Setting Slew Rates 5.2.9 Cyclic Redundancy Check The CRC Enable toggle button enables the DACx760 or DACx750 cyclic redundancy check function. When the button is pressed, the EVM software informs the user that the configuration register will be written to immediately, as shown in Figure 20. It is written immediately to make sure that any other pending changes are written to the DACx760 or DACx750 with the correct CRC value. Figure 20. CRC Enable and Dialog 5.2.10 Clear Functionality The CLRSEL drop-down menu, as shown in Figure 21, sets the value of VOUT after a power-on and reset occur. The CLEAR button sets the CLR pin high, resulting in a clear state. Note that the DACx760 and DACx750 set the voltage out to midscale (negative full-scale when in bipolar mode for DACx760 devices) if either the CLR-SEL pin is high or the register is set to midrange. Figure 21. CLRSEL Drop-Down Menu and Clear Button SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 15 PCB Assembly Drawings, Bill of Materials, and Schematics 6 www.ti.com PCB Assembly Drawings, Bill of Materials, and Schematics This section contains the schematics, PCB layouts, and bills of materials for the DACx760EMC-EVM and DACx750EMC-EVM. Documentation information for the SM-USB-DIG Platform can be found in SBOU098, SM-USB-DIG Platform User’s Guide, available at the TI web site at http://www.ti.com. 6.1 DACx760EMC-EVM Assembly Drawing Figure 22 shows the assembly drawing of the components for the DACx760EMC-EVM board. Figure 22. DACx760EMC-EVM Assembly Drawing 16 DACx760EMC-EVM SBAU229 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated PCB Assembly Drawings, Bill of Materials, and Schematics www.ti.com 6.2 DACx760EMC-EVM Bill of Materials DACx760EMC-EVM Bill of Materials lists the bill of materials for the DACx760EMC-EVM. DACx760EMC-EVM Bill of Materials Qty Item DAC8760 DAC7760 1 1 1 2 11 11 3 5 4 2 5 Description Manufacturer Part Number Printed Circuit Board Any 6579211 C1, C5, C9, C10, C12, C15, C16, C17, C18, C19, C21 CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603 MuRata GRM188R71H104KA93D 5 C2, C6, C7, C8, C11 CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0603 AVX 06035A101JAT2A 2 C3, C4 CAP, TANT, 10uF, 50V, +/-10%, 0.8 ohm, 7343-43 SMD Vishay-Sprague 293D106X9050E2TE3 3 3 C13, C14, C23 CAP, CERM, 1000pF, 100V, +/-10%, X7R, 0603 MuRata GRM188R72A102KA01D 6 1 1 C20 CAP, CERM, 2200pF, 50V, +/-5%, C0G/NP0, 0603 MuRata GRM1885C1H222JA01D 7 2 2 C22, C26 CAP CER 0.1UF 100V 10% X7R 0603 MuRata GRM188R72A104KA35J 8 1 1 C24 CAP, CERM, 0.1uF, 50V, +/-5%, X7R, 0805 AVX 08055C104JAT2A 9 1 1 C25 CAP, CERM, 0.022uF, 50V, +/-10%, X7R, 0603 TDK C1608X7R1H223K 10 2 2 D1, D2 Diode, TVS, Uni, 15V, 600W, SMB Diodes Inc. SMBJ15A-13-F 11 1 1 D3 IC TVS ARRAY 2-LINE 70V SOT-143 Bourns CD143A-SR70 12 2 2 D4, D5 DIODE TVS ARRAY 15V SOD323 Bourns CDSOD323-T15SC 13 1 1 FB1 FERRITE CHIP 600 OHM 200MA 0603 MuRata BLM18HG601SN1D 14 1 1 FB2 3A Ferrite Bead, 600 ohm @ 100MHz, SMD Taiyo Yuden FBMH3225HM601NT 15 1 1 J1 Receptacle, 50mil 10x1, R/A, TH Mill-Max 851-43-010-20-001000 16 2 2 J2, J3 Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH On-Shore Technology ED555/2DS 17 1 1 J4 Terminal Block, 6A, 3.5mm Pitch, 3-Pos, TH On-Shore Technology ED555/3DS 18 1 1 R1 RES, 15.0k ohm, 0.1%, 0.1W, 0603 Yageo America RT0603BRD0715KL 19 2 2 R2, R3 RES, 15 ohm, 5%, 0.1W, 0603 Vishay-Dale CRCW060315R0JNEA 20 1 1 R4 RES 15 OHM 1/2W 1% 1210 SMD Panasonic ERJ-14NF15R0U 21 1 0 U1 Single-Channel, 16-Bit Programmable Current Output and Voltage Output DIGITAL-TO-ANALOG CONVERTER for 4-mA to 20-mA Current Loop Applications, RHA0040C Texas Instruments DAC8760IRHA 0 1 Single-Channel, 12-Bit Programmable Current Output and Voltage Output DIGITAL-TO-ANALOG CONVERTER for 4-mA to 20-mA Current Loop Applications, RHA0040C Texas Instruments DAC7760IRHA 1 1 ISOLATOR DGTL 25MBPS 4CH 16SOIC Texas Instruments ISO7641FCDW 22 6.3 Designator U2 DACx760EMC-EVM Board Schematic The EVM schematic is appended to the end of this user's guide. SBAU229 – April 2014 Submit Documentation Feedback DACx760EMC-EVM Copyright © 2014, Texas Instruments Incorporated 17 1 2 3 4 5 6 A A +15V 1 PIJ101 2 PIJ102 3 4 PIJ103 PIJ104 5 PIJ105 6 PIJ106 7 PIJ107 1 PID10 NLMISO0DIG MISO_DIG NL\C\S0DIG CS_DIG BLM18HG601SN1D NLSCLK0DIG SCLK_DIG NLMOSI0DIG MOSI_DIG 9 PIJ109 10 PIJ1010 PIC210 PIC2102 NLGPIO4 GPIO4 PIC301 COC3 C3 PIC102 C1 COC1 PIC201 C2 COC2 PIC302 PIC101 PIC202 10µF 0.1µF PID102 100pF 1 PIJ401 2 PIJ402 3 PIJ403 PIFB102 8 PIJ108 COJ4 J4 VDUT COFB1 FB1 PIFB101 COC21 C21 0.1µF COD1 D1 SMBJ15A-13-F 15V 2 SPI_DIN SPI_CS GND SPI_CLK VDUT SPI_DOUT CTRL/MEAS5 I2C_SDA CTRL/MEAS4 I2C_SCK PIC401 PIC402 ED555/3DS PIC502 PIC501 COC4 C4 10µF COC5 C5 0.1µF PIC601 PIC602 PID201 1 COJ1 J1 COC6 C6 100pF PID20 COD2 D2 GND SMBJ15A-13-F 15V -15V 2 SUPER MINI DIG FEMALE DGND +15V B -15V COC7 C7PIC702 PIC701 100pF COC8 C8 100pF PIC802 PIC801 COC9 C9PIC902 COC10 C10 0.1µF PIC1002 PIC1001 23 PIU1023 DVDD-EN 18 PIC1701 0.1µF PIC1702 COC17 C17 COC24 C24 PIC2402 PIC1801 PIC1802 COU2 U2 DGND CS_DIG SCLK_DIG MOSI_DIG MISO_DIG PIU201 Vcc1 PIU207 PIU203 EN1 INa PIU204 INb PIU205 INc PIU206 OUTd PIU202 GND1 PIU208 GND1 C Vcc2 PIU2016 COC18 C18 0.1µF PIC1901 PIC1902 PIU1018 0.1µF PIC2401 COC19 C19 0.1µF 6 7 EN2 PIU2010 OUTa PIU2014 OUTb PIU2013 OUTc PIU2012 INd PIU2011 GND PIU107 NL\C\S0AO CS_AO GND NLSCLK0AO SCLK_AO NLMOSI0AO MOSI_AO 27 BOOST PIU1027 CLR GND 3 PIU103 GND 12 13 15 -VSENSE 34 PIU1034 CMP 24 PIU1024 29 CAP2 PIU1029 1 PIU101 NC 10 11 19 21 PIU1021 COC23 C23 1000pF COD5 D5 CDSOD323-T15SC NC PID501 PID502 1 PIC2601 PIC2602 COC26 C26 PIJ301 2 PIJ302 ED555/2DS 1000pF GND +15V CD143A-SR70 -15V COD3A D3A 15.0k 4 PID304 COC20 2200pF C20 PIC2002 PIC2001 GND COC14 C14 1000pF PIC1402 PIC1401 COC13 C13 PIC1302 PIC1501 PIC1502 GND +15V COR2 R2 PIR201 COC15 C15 0.1µF C 1 PID301 PIC1601 PIC1602 COC16 C16 0.1µF 15 1000pF PIC1301 R3 COR3 PIR301 GND PID302 PIR202 GND 22 NC PIU1022 30 NC PIU1030 31 NC PIU1031 35 NC PIU1035 38 NC PIU1038 40 PIU1040 NC NC NC PIU1019 NC 20 PIU1020 NC 15R PIR402 GND PIR101 32 VOUT PIU1032 PIU1013 PIU1011 PIC2301 PIC2302 28 CAP1 PIU1028 GND GND PIU1015 GND PIU1012 PIU1010 COJ3 J3 COR4 R4 PIR401 33 +VSENSE PIU1033 4 GND PID30 1 PID301 GND R1 PIR102 COR1 PIU104 CLR-SEL 5 PIU105 -15V CD143A-SR70 COD3B D3B 4 PID304 16 ISET-R PIU1016 9 PIU109 SDO GND2 PIU2015 GND2 PIU209 +15V COC25 0.022µF C25 PIC2501 PIC2502 2 ALARM PIU102 SCLK 8 PIU108 DIN NLMISO0AO MISO_AO HART-IN 25 PIU1025 26 IOUT PIU1026 PIU106 LATCH ISO7641FCDW DGND 17 PIU1017 REFOUT GND 37 AVSS PIU1037 14 AVSS PIU1014 PAD PIU1041 REFIN GND 0.1µF PIC1201 3 VDUT COC12 C12 PIC1202 36 AVDD PIU1036 DVDD 2 39 PIU1039 COC11 C11 100pF PIC1102 PIC1101 GND COU1 U1 B 0.1µF PIC901 COJ2 J2 COFB2 FB2 GND PIFB201 PIFB202 600 ohm 15 PIR302 COD4 D4 CDSOD323-T15SC PID401 PID402 1 PIC2 01 PIC2 02 C22 COC22 PIJ201 2 PIJ202 ED555/2DS 1000pF GND GND DAC8760IRHA D D Number: 6579211 Rev: A Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not SVN Rev: Not in version control warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its Drawn By: licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application. Engineer: Enter name of project lead 1 2 3 4 5 Designed for: Public Release Mod. Date: 3/12/2014 Project Title: Change in menu Project|Project Options|Parameters Sheet Title: Assembly Variant: Variant name not interpreted Sheet: 1 of 1 File: DAC8760EMC-EVM_A.SchDoc Size: B http://www.ti.com Contact: http://www.ti.com/support © Texas Instruments 2014 6 ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR EVALUATION MODULES Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following: 1. User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a hobbyist environment. All EVMs made available to hobbyist users are FCC certified, as applicable. Hobbyist users acknowledge, agree, and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and indemnity provisions included in this document. 2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. 3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product. 4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI. 5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example, temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. 6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs. 7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM may be returned to TI within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY TI TO USER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. TI SHALL NOT BE LIABLE TO USER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RELATED TO THE HANDLING OR USE OF ANY EVM. 8. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which EVMs might be or are used. TI currently deals with a variety of customers, and therefore TI’s arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services with respect to the handling or use of EVMs. 9. User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling and use of EVMs and, if applicable, compliance in all respects with such laws and regulations. 10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. 11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death, even if EVMs should fail to perform as described or expected. 12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local requirements. Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use EVMs. Agreement to Defend, Indemnify and Hold Harmless. User agrees to defend, indemnify, and hold TI, its directors, officers, employees, agents, representatives, affiliates, licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of, or in connection with, any handling and/or use of EVMs. User’s indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if EVMs fail to perform as described or expected. Safety-Critical or Life-Critical Applications. If user intends to use EVMs in evaluations of safety critical applications (such as life support), and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold, or loaned to users may or may not be subject to radio frequency regulations in specific countries. General Statement for EVMs Not Including a Radio For EVMs not including a radio and not subject to the U.S. Federal Communications Commission (FCC) or Industry Canada (IC) regulations, TI intends EVMs to be used only for engineering development, demonstration, or evaluation purposes. EVMs are not finished products typically fit for general consumer use. EVMs may nonetheless generate, use, or radiate radio frequency energy, but have not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or the ICES-003 rules. Operation of such EVMs may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: For EVMs including a radio, the radio included in such EVMs is intended for development and/or professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability in such EVMs and their development application(s) must comply with local laws governing radio spectrum allocation and power limits for such EVMs. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by TI unless user has obtained appropriate experimental and/or development licenses from local regulatory authorities, which is the sole responsibility of the user, including its acceptable authorization. U.S. Federal Communications Commission Compliance For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at its own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Industry Canada Compliance (English) For EVMs Annotated as IC – INDUSTRY CANADA Compliant: This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs Including Radio Transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs Including Detachable Antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Canada Industry Canada Compliance (French) Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated spacer Important Notice for Users of EVMs Considered “Radio Frequency Products” in Japan EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan. If user uses EVMs in Japan, user is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. Please note that if user does not follow the instructions above, user will be subject to penalties of Radio Law of Japan. http://www.tij.co.jp 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品の ご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル http://www.tij.co.jp Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated
DAC7760EMC-EVM 价格&库存

很抱歉,暂时无法提供与“DAC7760EMC-EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货