User's Guide
SBAU205A – March 2013 – Revised November 2013
DACx760EVM and DACx750EVM
This user's guide describes the characteristics, operation, and use of the DAC7750 and DAC8750
(DACx750), and the DAC7760, and DAC8760 (DACx760) evaluation boards (EVMs). This user's guide
also discusses how to set up and configure the software and hardware, and reviews various aspects of
the program operation. Throughout this document, the terms DAC8760EVM, evaluation board, evaluation
module, and EVM are synonymous with the DACx760EVM and DACx760EVM. This user's guide also
includes information regarding operating procedures and input/output connections, an electrical schematic,
printed circuit board (PCB) layout drawings, and a parts list for the EVM.
1
2
3
4
5
6
Contents
Overview ..................................................................................................................... 3
1.1
EVM Kit Contents .................................................................................................. 3
1.2
Related Documentation from Texas Instruments .............................................................. 3
EVM Hardware Setup ...................................................................................................... 4
2.1
Theory of Operation for EVM Hardware ........................................................................ 4
2.2
Signal Definitions of J1 (10-Pin Male Connector Socket) .................................................... 5
2.3
Theory of Operation for SM-USB-DIG Platform ................................................................ 5
EVM Hardware Overview .................................................................................................. 6
3.1
Electrostatic Discharge Warning ................................................................................. 6
3.2
Jumper Summary .................................................................................................. 6
3.3
Connecting the Hardware ......................................................................................... 7
3.4
Connecting the USB Cable to the SM-USB-DIG Platform .................................................... 8
3.5
Powering the EVM ................................................................................................. 8
3.6
EVM Features ...................................................................................................... 9
EVM Software Setup ...................................................................................................... 11
4.1
Operating Systems for EVM Software ......................................................................... 11
4.2
EVM Software Installation ....................................................................................... 11
EVM Software Overview .................................................................................................. 13
5.1
Starting the EVM Software ...................................................................................... 13
5.2
EVM Software Features ......................................................................................... 14
Schematics, PCB Assembly Drawings, and Bills of Materials ....................................................... 18
6.1
DACx760EVM Board Schematic ............................................................................... 18
6.2
DACx760EVM Assembly Drawing ............................................................................. 19
6.3
DACx760EVM Bill of Materials ................................................................................. 20
6.4
DACx750EVM Board Schematic ............................................................................... 21
6.5
DACx750EVM Assembly Drawing ............................................................................. 22
6.6
DACx750EVM Bill of Materials ................................................................................. 23
List of Figures
1
DAC8760EVM Hardware Setup...........................................................................................
4
2
DAC8760EVM Block Diagram.............................................................................................
4
3
USB-DIG Platform Block Diagram ........................................................................................
5
4
SM-USB-DIG Connection to the DAC8760EVM ........................................................................
7
5
Confirmation of SM-USB-DIG Platform Driver Installation.............................................................
8
6
Hardware Features .........................................................................................................
9
Windows, Windows XP, Windows 7 are registered trademarks of Microsoft Corporation.
SPI is a trademark of Motorola Inc.
All other trademarks are the property of their respective owners.
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1
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7
DAC8760EVM Installer ...................................................................................................
11
8
DAC8760EVM Install Path
..............................................................................................
........................................................................
DAC8760EVM Software Interface .......................................................................................
Communication Error with SM-USB-DIG Platform ...................................................................
Registers Tab ..............................................................................................................
Read, Write, and Auto-Write Buttons ...................................................................................
Resetting DAC8760 .......................................................................................................
Mode Selection ............................................................................................................
Dual Output Enable .......................................................................................................
Enabling Over-Range Operation ........................................................................................
Calibration Registers ......................................................................................................
Setting Slew Rates ........................................................................................................
CRC Enable and Dialog ..................................................................................................
CLRSEL Drop-Down Menu and Clear Button .........................................................................
DACx760EVM Schematic ...............................................................................................
DACx760EVM Assembly Drawing ......................................................................................
DACx750EVM Schematic ................................................................................................
DACx750EVM Assembly Drawing ......................................................................................
12
9
DAC8760EVM Software License Agreements
12
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
13
13
14
14
15
15
16
16
16
17
17
17
18
19
21
22
List of Tables
1
Contents of DACx760EVM and DACx750EVM Kit .....................................................................
3
2
Related Documentation ....................................................................................................
3
3
SM-USB-DIG Connector ...................................................................................................
5
4
EVM Jumper Summary
5
6
7
2
....................................................................................................
R6 and C23 Ideal Values for Each Current Range ...................................................................
DACx760EVM Bill of Materials ..........................................................................................
DACx750EVM Bill of Materials ..........................................................................................
DACx760EVM and DACx750EVM
6
10
20
23
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Overview
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1
Overview
The DAC7760 (12-bit) and DAC8760 (16-bit) are precision digital-to-analog converters (DACs). The output
can be configured to produce a current in output ranges of 0 mA to 20 mA, 4 mA to 20 mA, and 4 mA to
24 mA. Both devices can also be configured to have voltage output ranges of 0 V to 5 V, 0 V to 10 V, ±5
V, and ±10 V. The DAC7750 (12-bit) and DAC8750 (16-bit) feature current outputs only. All of these
devices feature configurable slew rates, power-on reset functions, a highway addressable remote
transducer (HART) signal interface, a watchdog timer, error checking, external and internal voltage
references, and a common hardware fault output.
1.1
EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center
nearest you if any component is missing. It is highly recommended that you check the TI web site at
http://www.ti.com to verify that you have the latest versions of the related software.
Table 1. Contents of DACx760EVM and DACx750EVM
Kit
Item
1.2
Quantity
DACx760EVM or DACx750EVM PCB
1
SM-USB-DIG platform PCB
1
USB extender cable
1
SM-USB-DIG connector ribbon cable
1
User’s guide CD-ROM
1
Related Documentation from Texas Instruments
The following documents provide information regarding Texas Instruments integrated circuits used in the
assembly of the DACx760EVM and DACx750EVM. This user's guide is available from the TI web site
under literature number SBAU205. Any letter appended to the literature number corresponds to the
document revision that is current at the time of the writing of this document. Newer revisions may be
available from the TI web site at http://www.ti.com/, or call the Texas Instruments Literature Response
Center at (800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify
the document by both title and literature number.
Table 2. Related Documentation
Document
Literature Number
DAC7760 and DAC8760 product data sheet
SBAS528
DAC7750 and DAC8750 product data sheet
SBAS538
REF02 product data sheet
SBVS003
SM-USB-DIG Platform User’s Guide
SBOU98
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EVM Hardware Setup
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EVM Hardware Setup
This section discusses the overall system setup for the EVM. A personal computer (PC) runs the software
that communicates with the SM-USB-DIG Platform, which provides the power and digital signals used to
communicate with the EVM board. Connectors on the EVM board allow the user to connect the required
external power supply.
External Power
USB
Computer
SM-USB-DIG
Platform
10-Pin
DAC8760EVM
Figure 1. DAC8760EVM Hardware Setup
2.1
Theory of Operation for EVM Hardware
A block diagram of the EVM hardware setup is shown in Figure 2. This board provides test points for the
SPI™ inputs, power, reference, ground connections, ALARM, CLR, BOOST, and the analog outputs of the
DAC. Note that DACx750 only features current outputs (IOUT), but also includes a test point for R3SENSE.
External Power
Power
VOUT
J1
(to SM-USB-DIG)
SPI
DAC8760
IOUT
Reference
Selection
HART Input
Figure 2. DAC8760EVM Block Diagram
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2.2
Signal Definitions of J1 (10-Pin Male Connector Socket)
Table 3 shows the pinout for the 10-pin connector socket used to communicate between the EVM and the
SM-USB-DIG. Note that the I2C communications lines (I2C_SCL and I2C_SDA1) are not used.
Table 3. SM-USB-DIG Connector
2.3
Pin On U1
Signal
1
I2C_SCL
2
CTRL/MEAS4
3
I2C_SDA1
4
CTRL/MEAS5
5
SPI_DOUT1
6
VDUT
7
SPI_CLK
Description
I2C Clock Signal (SCL)
GPIO – Control Output or Measure Input
I2C Data Signal (SDA)
GPIO – Control Output or Measure Input
SPI Data Output (MOSI)
Switchable DUT Power Supply: +3.3V, +5V, Hi-Z (Disconnected).
Note: When VDUT is Hi-Z all Digital I/O are Hi-Z as well.
SPI Clock Signal (SCLK)
8
GND
9
SPI_CS1
Power Return (GND)
SPI Chip Select Signal (CS)
10
SPI_DIN1
SPI Data Input (MISO)
Theory of Operation for SM-USB-DIG Platform
Figure 3 shows the block diagram for the SM-USB-DIG Platform. This platform is a general-purpose dataacquisition system that is used on several different Texas Instruments evaluation modules. The details of
operation are included in SBOU098, SM-USB-DIG Platform User's Guide. The block diagram shown in
Figure 3 is given as a brief overview of the platform.
The primary component of the SM-USB-DIG Platform is the TUSB3210, an 8052 microcontroller that has
a built-in USB interface. The microcontroller receives information from the host computer that is
interpreted into power, I2C, SPI, and other digital I/O patterns. During the digital I/O transaction, the
microcontroller reads the response of any device connected to the I/O interface. The response from the
device is then sent back to the computer where it is interpreted by the host computer.
SM-USB-DIG Platform
+3.3 V
USB
+5 V
TUSB3210
8052 mC
with USB Interface
and UART
USB Bus
from
Computer
Power-On Reset
2
Buffers and
Level Translators
I C and SPI
Control and
Measure Bits
To Test Board
To Computer and Power Supplies
+3.3-V
Regulator
8K × 8-byte
EEPROM
+5.0 V
USB Power
+3.0 V
Power
Switching
VDUT
(Hi-Z, 3.3 V, or 5 V)
Switched
Power
Figure 3. USB-DIG Platform Block Diagram
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EVM Hardware Overview
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EVM Hardware Overview
To use the EVM hardware, set the jumpers, connect the SM-USB-DIG and the EVM together, apply
external power, and connect the USB cable from the SM-USB-DIG to the computer. This section presents
the details of these procedures.
3.1
Electrostatic Discharge Warning
Many of the components on the EVM are susceptible to damage by electrostatic discharge (ESD).
Customers are advised to observe proper ESD handling precautions when unpacking and handling the
EVM, including the use of a grounded wrist strap at an approved ESD workstation.
3.2
Jumper Summary
Table 4 summarizes all of the EVM jumper functionality.
Table 4. EVM Jumper Summary
Pin On U1
6
Signal
JP1
When JP1 is installed, AVSS is shorted to ground.
JP2
When JP2 is in the 1-2 (right) position, RSET is used for the HART input path.
When JP2 is in the 2-3 (left) position, HART-IN is used for the HART input path.
JP3
When JP3 is uninstalled, the DACx760 or DACx750 provide DVDD.
JP4
When JP4 is in the 1-2 position (bottom), the DACx760 or DACx750 reference voltage is supplied
through J3.
When JP4 is in the 3-4 position (middle), the onboard reference (REF02) is used to provide the
reference voltage.
When JP4 is in the 5-6 position (top), the internal reference is used.
JP5
When JP5 is installed, the boost circuit is bypassed.
JP6
When JP6 is installed, shunt resistor R4 is used to measure the DACx760 or DACx750 current output.
JP7
When JP7 in the 1-2 position (right), a clear condition sets the DAC output midscale, or negative fullscale when using bipolar supplies.
When JP7 is in the 2-3 position (left), a clear condition sets the output to 0 V.
JP8
When JP8 is installed, +VSENSE is shorted to VOUT on the EVM board.
If JP8 is uninstalled, the +VSENSE to Vout connection must be provided off board, near the point of
load.
JP9
When JP9 is installed, the SM-USB-DIG provides DVDD.
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3.3
Connecting the Hardware
To connect the EVM board and the SM-USB-DIG Platform together, firmly slide the male and female ends
of the 10-pin connectors together as shown in Figure 4. Make sure that the two connectors are completely
pushed together; loose connections may cause intermittent operation.
Figure 4. SM-USB-DIG Connection to the DAC8760EVM
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3.4
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Connecting the USB Cable to the SM-USB-DIG Platform
Figure 5 shows the typical response to connecting the SM-USB-DIG Platform board to a USB port for the
first time. Typically, the PC responds with a Found New Hardware, USB Device pop-up dialog window.
The pop-up window then changes to Found New Hardware, USB Human Interface Device. This pop-up
indicates that the device is ready to be used. The SM-USB-DIG Platform uses the human interface device
drivers that are included in the Windows® operating system (OS).
In some cases, the Add Hardware Wizard appears. If this prompt occurs, allow the system device
manager to install the human interface drivers by clicking Yes when requested to install drivers.
Figure 5. Confirmation of SM-USB-DIG Platform Driver Installation
3.5
Powering the EVM
This section describes the various power configurations that can be used by the EVM.
3.5.1
AVDD and AVSS Power Configurations
Terminal block J2 allows for external voltage sources to be connected to the AVDD and AVSS supply rails
of the DACx760. Note that the DACx750 devices feature only AVDD supplies. The DACx760EVM only
requires an AVSS supply if the DACx760 is used in ±5 V or ±10 V mode. If bipolar output is not required,
jumper JP1 can be shunted to connect AVSS to GND, or GND may be connected at J2. AVDD and AVSS
are protected to the datasheet absolute maximum potentials by transient-voltage-suppression (TVS)
diodes D2, D3, and D5.
3.5.2
DVDD Power Configurations
Terminal block J1 allows for an external voltage source to be connected to the DVDD pin of the DACx760
or DACx750. The EVM receives power from the SM-USB-DIG Platform when JP9 is installed. An external
power source can be used when JP9 is removed and JP3 is installed. Note that if an external DVDD is
used, it must be set to the same voltage as the SM-USB-DIG Platform for successful SPI communication
alongside the SM-USB-DIG. The DVDD input is protected to the datasheet absolute maximum input by
D1.
The DACx760 and DACx750 feature internal regulators that can be used to provide DVDD supplies. By
removing JP3, the DACx760 or DACx750 provide the DVDD supply. In this configuration, JP9 must be
removed and no external supply can be connected.
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3.6
EVM Features
This section describes some of the hardware features present on the EVM board.
3.6.1
Communication Test Points
The EVM board features test points (MISO, MOSI, SCLK, CS, ALARM, and CLEAR) for monitoring the
communication between the SM-USB-DIG and the DACx760/DACx750, as shown in Figure 6.
Figure 6. Hardware Features
The EVM design also allows external signals to be connected through the communication test points if the
EVM is integrated into a custom application or prototype. Note that if the SM-USB-DIG Platform is not
used, DVDD must be configured to use the EVM onboard regulators or external supplies, as described in
Section 3.5.2
3.6.2
Power Test Points
Test points AVSS (DACx760 only), AVDD, and DVDD are used to measure the voltage being applied
directly to the EVM.
3.6.3
REFOUT and REFIN
The DACx760 and DACx750 have both input and output reference voltage pins. For normal operation, a
5-V reference is required. If a specific application requires a different voltage reference, the EVM allows
for a voltage reference component to be installed in the U2 SO-8 footprint (REF02 installed by default), or
an external reference can be connected to J3. The external reference input is protected to the datasheet
absolute maximum inputs by D4. JP4 connects the different references to the REFIN pin on the DACx760
or DACx750. Position 5-6 (top) connects the REFOUT pin. Position 3-4 (middle) connects to the output of
U2. Position 1-2 (bottom) connects to J3.
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Applying HART Signals
The J4 terminal block allows external HART communication signals to be modulated onto the output
current. When the DAC8760EVM is in the 4-mA to 20-mA mode JP2 can be used to route the HART
signal to the current output via the HART-IN pin (position 2-3 , left) or via the RSET pin (position 1-2 ,
right) when external RSET is used. For all other current output ranges, the external RSET path must be
used to inject HART on the current output. When using the RSET path to inject HART, the values of R6
and C23 must be selected based on the current output range to avoid attenuating/amplifying the HART
signal. Table 5 shows the appropriate values to use for each output range.
Table 5. R6 and C23 Ideal Values for Each Current Range
Current Output Range
3.6.5
Appropriate R6 and C23 Values
4 mA to 20 mA
30 kΩ and 10.6 nF
0 mA to 20 mA
37.5 kΩ and 8.5 nF
0 mA to 24 mA
45 kΩ and 7 nF
Populating Optional Capacitors
The EVM provides footprints for optional capacitors to be added to the EVM. Unpopulated footprints C21
(DACx760 only), C22, and C24 allow for a 0603-sized surface-mount capacitor to be used. The C21
capacitor is connected the CMP pin on the DACx760. C22 and C24 are connected to CAP1 and CAP2,
respectively, for both DACx760 and DACx750 devices.
3.6.6
External Boost Transistor
The EVM features an external transistor (Q1) that reduces heating within the DACx760 and DACx750 by
redirecting current flow externally. The NPN transistor can be bypassed by shunting jumper JP5.
3.6.7
IOUT and R4
The IOUT current on the EVM can be measured on the J5 terminal block or on the IOUT test point. R4 is
a 300-Ω resistor that acts as a load that creates a voltage drop in order to measure IOUT as a voltage.
The load can be disconnected by removing JP6, allowing for a series current meter. In addition, the 300-Ω
resistor can be removed and replaced by an application-specific resistor. The footprint is intended for
surface-mount resistors sized 0603. Capacitor C20 is installed by default to ensure stability of the boost
circuit. It is important to note that C20 impacts the settling time and slew rate of the current output, even if
the BOOST configuration is not used. For accurate evaluation of slew rate and settling time for the current
output, remove C20.
3.6.8
VOUT and VSENSE (DACx760 Only)
The VOUT pin can be accessed on the J6 terminal block and VOUT test point. The +VSENSE pin is
connected to VOUT by JP8. This configuration makes sure that VOUT is accurately measured across J6,
or the VOUT test point and GND. When attaching the DACx760EVM VOUT to a specific external load,
remove the JP8 shunt and connect +VSENSE to the load through J6.
3.6.9
CLR-SEL Jumper (DACx760 Only)
The CLR-SEL pin on the DACx760 is set by JP7 on the EVM. When the DACx760 enters a clear state,
position 2-3 (left) sets VOUT to 0 V, and position 1-2 (right) sets VOUT to midscale (or negative full-scale if
the DACx760 is in a bipolar voltage mode). Note that the CLR-SEL function can also be controlled through
software. To enable this feature, JP7 must be in position 2-3 (left).
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4
EVM Software Setup
This section discusses how to install the EVM software.
4.1
Operating Systems for EVM Software
The EVM software has been tested on the Windows XP® and Windows 7® operating systems with United
States and European regional settings. The software should also function on other Windows operating
systems.
4.2
EVM Software Installation
The EVM software is included on the CD that is shipped with the EVM kit. It is also available through the
EVM product folder on the TI website. To install the software, insert the included CD into an available CDROM drive. Navigate to the drive contents and open the DAC8760EVM software folder. Locate the
compressed file named DACx760EVM.zip or DACx750EVM.zip and open it. Extract the EVM files into a
specific folder (for example, C:\DAC8760EVM) on your hard drive.
After the files are extracted, navigate to the folder you created on your hard drive. Locate and execute the
setup.exe file to start the installation, as shown in Figure 7. The DAC8760 software installer file then
opens to begin the installation process.
Figure 7. DAC8760EVM Installer
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After the installation process initializes, the user is given a choice of selecting the installation directory,
usually defaulting to C:\Program Files\DAC8760EVM\ and C:\Program Files\National Instruments\ as
shown in Figure 8.
Figure 8. DAC8760EVM Install Path
After selecting the installation directory, two license agreements are presented that must be accepted, as
shown in Figure 9.
Figure 9. DAC8760EVM Software License Agreements
After accepting the Texas Instruments and National Instruments license agreements, the progress bar
opens and shows the installation of the software. Once the installation process is completed, click Finish.
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5
EVM Software Overview
This section describes the use of the EVM software.
5.1
Starting the EVM Software
The EVM software can be operated through the Windows start menu. From the start menu, select All
Programs, and then select DAC8760EVM. Figure 10 illustrates how the software should appear at launch
if the EVM is functioning properly.
Figure 10. DAC8760EVM Software Interface
Figure 11 shows an error window that appears if the PC cannot communicate with the EVM. In the event
you receive this error, first ensure that the USB cable is properly connected on both ends. This error can
also occur if you connect the USB cable before the SM-USB-DIG Platform power source. Another possible
source for this error is a problem with the USB human interface device driver on your PC. Make sure that
the device is recognized when the USB cable is plugged in, indicated by a Windows-generated
confirmation sound.
Figure 11. Communication Error with SM-USB-DIG Platform
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EVM Software Overview
5.2
5.2.1
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EVM Software Features
Registers Tab
The EVM software features a tab devoted to reading and writing directly to the registers found on the
DACx760 and DACx750, as shown in Figure 12. By selecting a register in the register table, the individual
bits can be set in the Register Value section of the tab. The function of each bit can be found in the
DACx760 and DACx750 data sheets, or by clicking the Help w/ Reg button. Note that read-only registers
cannot have their values changed in this tab.
Figure 12. Registers Tab
5.2.2
Reading From and Writing to Registers
The EVM software only reads from and writes to the DACx760 and DACx750 registers at the user’s
command. These actions are accomplished with the Read All Reg and Write All Reg buttons. When any
change is made to the configuration register in the Registers tab or the Block Diagram tab, the green light
is on to show that changes are pending, as shown in Figure 13.
Figure 13. Read, Write, and Auto-Write Buttons
Pressing the Write All Reg button writes the pending changes to the DACx760 or DACx750. In addition, by
enabling the Auto-Write button, changes are written to the configuration register automatically.
The registers in the DACx760 and DACx750 are read when the Read All Reg button is pressed. Perform a
read after writing to the device configuration register to verify that the DACx760 or DACx750 successfully
stored the data.
More information about the individual registers can be found by pressing the Help w/ Reg button.
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5.2.3
Software Reset
Figure 14 shows the Reset DAC8760 button. This button resets the DAC8760 back to the default poweron state after the change is written to the DAC.
Figure 14. Resetting DAC8760
5.2.4
Setting the Output
The Mode section of the Block Diagram tab allows for the configuration of the output range, output enable,
and output value to be set, as shown in Figure 15.
Figure 15. Mode Selection
The DAC Value field must be rewritten to the DACx760 or DACx750 when the range is changed because
the DAC value is reset. The Output Enable toggle button sets the OUTEN bit in the control register to
high, which enables either the IOUT or VOUT functions.
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Dual Output Enable (DACx760 devices only)
The DACx760 devices that feature both current and voltage outputs also feature a dual output enable
option. This feature is not included on the DACx750 current output only devices. To enable dual outputs
toggle the Dual Output Enable button shown in Figure 16 and select a voltage and current output range.
The Output Enable and DAC Value shown in Figure 15 are used in dual output mode to enable the pair of
outputs and to set the output code.
Figure 16. Dual Output Enable
5.2.6
Enabling Voltage Overrange (DACx760 devices only)
Figure 17 shows the Over Range toggle button. This button enables the DACx760 overrange function,
which increases the voltage output range by 10% (not included in DACx750 devices).
Figure 17. Enabling Over-Range Operation
5.2.7
Accessing Calibration Registers
The DACx760 and DACx750 feature programmable gain and offset functions. Set the gain and offset with
the Gain Calibration Code and Zero Offset Calibration Code fields. As shown in Figure 18, the fields on
the left allow a 16-bit hex value to be entered directly, and the fields on the right allow decimal values to
be used. The Cal. Enable toggle button applies the gain and offset to the data register. After reading all
registers, the DAC Value field shows the changes.
Figure 18. Calibration Registers
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EVM Software Overview
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5.2.8
Slew Rate Configuration
Use the Slew Rate section of the Block Diagram tab, as shown in Figure 19, to set the various slew-rate
controls. The Slew Rate drop-down menu sets the slewing frequency. The Slew Rate Step Size dropdown menu sets the step size, which is listed in LSB increments with the 12-bit step sizes in parentheses.
The Slew Enable toggle button enables the programmed slew rates and step size on the DAC.
Figure 19. Setting Slew Rates
5.2.9
Cyclic Redundancy Check
The CRC Enable toggle button enables the DACx760 or DACx750 cyclic redundancy check function.
When the button is pressed, the EVM software informs the user that the configuration register will be
written to immediately, as shown in Figure 20. It is written immediately to make sure that any other
pending changes are written to the DACx760 or DACx750 with the correct CRC value.
Figure 20. CRC Enable and Dialog
5.2.10
Clear Functionality
The CLRSEL drop-down menu, as shown in Figure 21, sets the value of VOUT after a power-on and reset
occur. The CLEAR button sets the CLR pin high, resulting in a clear state. Note that the DACx760 and
DACx750 set the voltage out to midscale (negative full-scale when in bipolar mode for DACx760 devices)
if either the CLR-SEL pin is high or the register is set to midrange.
Figure 21. CLRSEL Drop-Down Menu and Clear Button
SBAU205A – March 2013 – Revised November 2013
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Schematics, PCB Assembly Drawings, and Bills of Materials
6
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Schematics, PCB Assembly Drawings, and Bills of Materials
This section contains the schematics, PCB layouts, and bills of materials for the DACx760EVM and DACx750EVM. Documentation information for
the SM-USB-DIG Platform can be found in SBOU098, SM-USB-DIG Platform User’s Guide, available at the TI web site at http://www.ti.com.
6.1
DACx760EVM Board Schematic
Figure 22 shows the schematic for the DACx760EVM board.
U2
AVDD
2
J1
External DVDD Input
VIN
6
VOUT
C2
0.1µF
AVSS
1
2
3
TRIM
1
7
8
GND
NC
NC
NC
TEMP
ON_BOARD_REF
5
C3
3
10µF
4
GND
GND
REF02BU
2
C9
0.1µF
C6
10µF
GND
JP1
Uni/Bi Select
D3
SMBJ20A-13-F
20V
J3
External Reference Input
1
2
OFF_BOARD_REF
2
1
C8
0.1µF
2
D2
SMBJ40A-13-F
40V
C5
10µF
1
D1
SMBJ6.0A-13-F
6V
C7
0.1µF
2
C4
10µF
1
1
1
1
2
DVDD
J2
External AVDD/AVSS Input
AVDD
C10
D4
SMBJ6.0A-13-F
6V
10µF
2
GND
GND
GND
AVDD
GND
AVSS
GND
D5
HART_IN Input
3
GND
GND
GND
AVDD
DVDD
AVDD
AVSS
SMBJ40CA-13-F
40V
AVSS
C11
C14
C15
100pF
0.1µF
GND
GND
GND
GND
DVDD
AVDD
C12
0.1µF
C17
GND
AVSS
C13
100pF
C16
JP2
HART_IN Select
J4
HART_IN Input
1
2
0.022µF
2
HART Input
1
GND
RSET HART Input
100pF
GND
BOOST
0.1µF
GND
U1
DVDD-EN
AVSS
AVSS
PAD
C18
0.1µF
1
3
5
2
4
6
GND
17
OFF_BOARD_REF
ON_BOARD_REF
1
JP3
DAC8760 Supplies DVDD
GND
SCLK
MOSI
DVDD
MISO
1
HART-IN
REFOUT
BOOST
CS
JP4
C19
0.1µF
REFIN
GND
SPI_CS
SPI_SCLK
SPI_MOSI
SPI_MISO
6
7
8
9
LATCH
IOUT
SCLK
ALARM
DIN
ISET-R
4
CLR
CLR
5
CLR-SEL
CLR
VOUT
-VSENSE
3
JP7
Clear Select
3
12
13
15
GND
GND
1
10
11
19
20
21
NC
NC
NC
NC
NC
NC
R1
20.0
27
R2
26
ALARM
2
R3
DVDD
1.00k
10k
ALARM
16
CAP1
CAP2
NC
NC
NC
NC
NC
NC
JP6
Measure Current w/R4
GND
1
32
C20
0.022µF
34
C21
24
C22
28
AVDD
GND
DNI
C24
GND
DNI
29
GND
22
30
31
35
38
40
R4
300
R5
15.0k
C23
R6
GND
RSET HART Input
37.4k
8200pF
DNI
JP8
+VSENSE On-Board
R7
1.00k
J6
VOUT
1
1
2
3
4
5
6
7
8
9
10
SPI_MISO
SPI_CS
SPI_SCLK
GND
JP9
SD-DIG Supplies DVDD
1
SPI_MOSI
ALARM
1
2
JP5
Bypass BOOST
33
J5
Current Output
IOUT
DAC8760RHA
J7
SPI_DIN
SPI_CS
GND
SPI_CLK
VDUT
SPI_DOUT
CTRL/MEAS5
I2C_SDA
CTRL/MEAS4
I2C_SCK
CMP
GND
GND
GND
GND
25
2
SDO
+VSENSE
2
Q1
FZT651TA
1
2
18
37
14
2
VREF
36
1
AVDD
2
23
DVDD
2,4
39
3
DVDD
GND
3
2
1
Voltage Output
DVDD
2
C25
0.1µF
CLR
GND
SUPER MINI DIG FEMALE
Figure 22. DACx760EVM Schematic
18
DACx760EVM and DACx750EVM
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6.2
DACx760EVM Assembly Drawing
Figure 23 shows the assembly drawing of the components for the DACx760EVM board.
Figure 23. DACx760EVM Assembly Drawing
SBAU205A – March 2013 – Revised November 2013
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Schematics, PCB Assembly Drawings, and Bills of Materials
6.3
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DACx760EVM Bill of Materials
Table 6 lists the bill of materials for the DACx760EVM.
Table 6. DACx760EVM Bill of Materials
Count
20
Description
Manufacturer
Model
10
Ref.
C2, C7, C8, C9, C14,
0.1uF
C15, C17, C18, C19, C25
Value
CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603
MuRata Electronics
GRM188R71H104KA93D
2
C3, C10
10uF
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK Corporation
C1608X5R0J106M
3
C4, C5, C6
10uF
CAP, TA, 10uF, 50V, +/-10%, 0.4 ohm, SMD
AVX Corporation
TPSE106K050R0400
3
C11, C12, C16
100pF
CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0603
MuRata Electronics
GRM1885C1H101JA01D
2
C13, C20
0.022uF
CAP, CERM, 0.022uF, 50V, +/-10%, X7R, 0603
TDK Corporation
C1608X7R1H223K
0
C21, C22, C24
N/A
Not Installed
N/A
N/A
1
C23
8200pF
CAP, CERM, 8200pF, 50V, +/-10%, X7R, 0603
MuRata
GRM188R71H822KA01D
2
D1, D4
N/A
Diode, TVS, Uni, 6V, 600W, SMB
Diodes Inc
SMBJ6.0A-13-F
1
D2
N/A
Diode, TVS, Uni, 40V, 600W, SMB
Diodes Inc
SMBJ40A-13-F
1
D3
N/A
Diode, TVS, Uni, 20V, 200W, SMB
Diodes Inc
SMBJ20A-13-F
1
D5
N/A
Diode, TVS, Bi, 40V, 600W, SMB
Diodes Inc
SMBJ40CA-13-F
4
J1, J3, J4, J5
N/A
Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH
On-Shore Technology
ED555/2DS
2
J2, J6
N/A
Terminal Block, 6A, 3.5mm Pitch, 3-Pos, TH
On-Shore Technology
ED555/3DS
1
J7
N/A
Receptacle, 50mil 10x1, R/A, TH
Mill-Max Corporation
851-43-010-20-001000
3
JP1, JP3, JP8
N/A
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec Inc
TSW-103-07-G-S
5
JP2, JP4, JP6, JP7, JP9
N/A
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec Inc
TSW-102-07-G-S
1
JP5
N/A
Header, TH, 100mil, 3x2, Gold plated, 230 mil above insulator
Samtec Inc
TSW-103-07-G-D
1
Q1
N/A
Transistor, NPN, 60V, 3A, SOT-223
Zetex
FZT651TA
1
R1
20.0Ω
RES, 20.0 ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060320R0FKEA
2
R2, R7
1.00kΩ
RES, 1.00k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW06031K00FKEA
1
R3
10.0kΩ
RES, 10k ohm, 5%, 0.1W, 0603
Vishay-Dale
CRCW060310K0JNEA
1
R4
300Ω
RES, 300 ohm, 0.1%, 0.25W, 1206
Susumu Co Ltd
RG3216P-3000-B-T1
1
R5
15.0kΩ
RES, 15.0k ohm, 0.1%, 0.1W, 0603
Susumu Co Ltd
RG1609P-153-B-T5
1
R6
37.4kΩ
RES, 37.4k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060337K4FKEA
17
TP1-TP17
N/A
Test Point, Compact, Yellow, TH
Keystone Electronics
5009
1
U1
N/A
Single-Channel, 16-Bit Programmable Current Output and
Voltage Output DIGITAL-TO-ANALOG CONVERTER for 4mA to
20mA Current Loop Applications, RHA0040C
Texas Instruments
DAC8760RHA
1
U2
N/A
5V PRECISION VOLTAG REFERENCE, D0008A
Texas Instruments
REF02BU
10
SH-JP1-SH-JP9
N/A
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
4
H1, H2, H3, H4
N/A
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
DACx760EVM and DACx750EVM
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6.4
DACx750EVM Board Schematic
Figure 24 shows the schematic for the DACx750EVM board
U2
AVDD
2
J1
External DVDD Input
6
VOUT
1
7
8
GND
NC
NC
NC
ON_BOARD_REF
C3
5
TRIM
10µF
3
TEMP
4
GND
GND
REF02BU
1
C5
10µF
GND
C8
0.1µF
J3
External Reference Input
1
2
2
D2
SMBJ40A-13-F
40V
OFF_BOARD_REF
1
1
D1
SMBJ6.0A-13-F
6V
C7
0.1µF
2
C4
10µF
VIN
C2
0.1µF
1
2
AVDD
1
2
DVDD
J2
External AVDD Input
C10
D4
SMBJ6.0A-13-F
6V
10µF
2
GND
GND
GND
GND
GND
3
HART_IN Input
GND
GND
GND
GND
AVDD
DVDD
C11
C13
AVDD
C14
100pF
JP2
HART_IN Select
J4
HART_IN Input
1
2
0.022µF
0.1µF
2
1
HART Input
GND
GND
GND
GND
DVDD
RSET HART Input
GND
AVDD
GND
BOOST
U1
39
DVDD
AVDD
36
DVDD-EN
Q1
FZT651TA
1
2
23
2,4
DVDD
GND
17
OFF_BOARD_REF
ON_BOARD_REF
GND
SCLK
MOSI
MISO
GND
CLR
SPI_CS
SPI_SCLK
SPI_MOSI
SPI_MISO
CLR
6
7
8
9
5
1
10
11
19
20
21
22
30
31
32
33
34
35
38
40
LATCH
IOUT
SCLK
ALARM
DIN
ISET-R
24
R2
ALARM
2
R3
DVDD
1.00k
10k
ALARM
16
R3-SENSE
1
2
JP6
Measure Current w/R4
GND
1
25
J5
Current Output
IOUT
JP5
Bypass BOOST
R3-SENSE
2
SDO
R1
20.0
27
26
CLR
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
C20
0.022µF
C22
CAP1
CAP2
GND
GND
GND
GND
GND
GND
GND
PAD
C24
3
4
12
13
14
15
37
R5
15.0k
GND
DNI
29
R4
300
AVDD
28
DNI
GND
R6
37.4k
C23
GND
RSET HART Input
8200pF
DAC7750IRHA
J7
SPI_DIN
SPI_CS
GND
SPI_CLK
VDUT
SPI_DOUT
CTRL/MEAS5
I2C_SDA
CTRL/MEAS4
I2C_SCK
REFOUT
BOOST
CS
JP4
C19
0.1µF
HART-IN
1
2
4
6
1
1
3
5
REFIN
2
18
JP3
DAC7750 Supplies DVDD
3
VREF
C18
0.1µF
1
2
3
4
5
6
7
8
9
10
GND
SPI_MISO
SPI_CS
SPI_SCLK
GND
JP9
SD-DIG Supplies DVDD
1
SPI_MOSI
ALARM
DVDD
2
C25
0.1µF
CLR
GND
SUPER MINI DIG FEMALE
Figure 24. DACx750EVM Schematic
SBAU205A – March 2013 – Revised November 2013
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Schematics, PCB Assembly Drawings, and Bills of Materials
6.5
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DACx750EVM Assembly Drawing
Figure 25 shows the assembly drawing for the DACx750EVM board
Figure 25. DACx750EVM Assembly Drawing
22
DACx760EVM and DACx750EVM
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6.6
DACx750EVM Bill of Materials
Table 7 lists the bill of materials for the DACx750EVM.
Table 7. DACx750EVM Bill of Materials
Count
Ref.
Value
Description
Manufacturer
Model
7
C2, C7, C8, C14, C18,
C19, C25
0.1uF
CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603
MuRata Electronics
GRM188R71H104KA93D
2
C3, C10
10uF
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK Corporation
C1608X5R0J106M
2
C4, C5
10uF
CAP, TA, 10uF, 50V, +/-10%, 0.4 ohm, SMD
AVX Corporation
TPSE106K050R0400
1
C11
100pF
CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0603
MuRata Electronics
GRM1885C1H101JA01D
2
C13, C20
0.022uF
CAP, CERM, 0.022uF, 50V, +/-10%, X7R, 0603
TDK Corporation
C1608X7R1H223K
0
C22, C24
N/A
Not Installed
N/A
N/A
1
C23
8200pF
CAP, CERM, 8200pF, 50V, +/-10%, X7R, 0603
MuRata
GRM188R71H822KA01D
2
D1, D4
N/A
Diode, TVS, Uni, 6V, 600W, SMB
Diodes Inc
SMBJ6.0A-13-F
1
D2
N/A
Diode, TVS, Uni, 40V, 600W, SMB
Diodes Inc
SMBJ40A-13-F
4
J1, J3, J4, J5
N/A
Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH
On-Shore Technology
ED555/2DS
1
J7
N/A
Receptacle, 50mil 10x1, R/A, TH
Mill-Max Corporation
851-43-010-20-001000
2
JP1, JP3
N/A
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec Inc
TSW-103-07-G-S
3
JP4, JP6, JP7,
N/A
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec Inc
TSW-102-07-G-S
1
JP5
N/A
Header, TH, 100mil, 3x2, Gold plated, 230 mil above insulator
Samtec Inc
TSW-103-07-G-D
1
Q1
N/A
Transistor, NPN, 60V, 3A, SOT-223
Zetex
FZT651TA
1
R1
20.0Ω
RES, 20.0 ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060320R0FKEA
2
R2
1.00kΩ
RES, 1.00k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW06031K00FKEA
1
R3
10.0kΩ
RES, 10k ohm, 5%, 0.1W, 0603
Vishay-Dale
CRCW060310K0JNEA
1
R4
300Ω
RES, 300 ohm, 0.1%, 0.25W, 1206
Susumu Co Ltd
RG3216P-3000-B-T1
1
R5
15.0kΩ
RES, 15.0k ohm, 0.1%, 0.1W, 0603
Susumu Co Ltd
RG1609P-153-B-T5
1
R6
37.4kΩ
RES, 37.4k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060337K4FKEA
16
TP1-TP16
N/A
Test Point, Compact, Yellow, TH
Keystone Electronics
5009
1
U1
N/A
Single-Channel, 16-Bit Programmable Current Output DIGITALTO-ANALOG CONVERTER for 4-mA to 20-mA Current Loop
Applications, RHA0040C
Texas Instruments
DAC8750RHA
1
U2
N/A
5V PRECISION VOLTAG REFERENCE, D0008A
Texas Instruments
REF02BU
6
SH-JP1, SH-JP3, SHJP4, SH-JP5, SH-JP6,
SH-JP7
N/A
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
4
H1, H2, H3, H4
N/A
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
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Revision History
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Revision History
Changes from Original (March 2013) to A Revision ....................................................................................................... Page
•
•
•
•
•
•
•
•
Added DAC7750 and DAV8750 devices and updated document to show these additional devices .......................... 1
Changed Figure 2 ........................................................................................................................ 4
Changed Section 3; updated jumpers settings, resistors, and capacitors throughout this section. ........................... 6
Added Section 3.2, Jumper Summary ................................................................................................. 6
Changed Figure 4 ........................................................................................................................ 7
Changed Figure 6 ........................................................................................................................ 9
Added Table 5 ........................................................................................................................... 10
Added Section 5.2.5, Dual Output Enable ........................................................................................... 16
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
24
Revision History
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Copyright © 2013, Texas Instruments Incorporated
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
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The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
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ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
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therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
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General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
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For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
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This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
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Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
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FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
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【Important Notice for Users of EVMs for RF Products in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL,
CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine
and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable
safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to
perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
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www.ti.com/audio
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www.ti.com/automotive
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amplifier.ti.com
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www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
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dsp.ti.com
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www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
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interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
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power.ti.com
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microcontroller.ti.com
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www.ti.com/video
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www.ti-rfid.com
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www.ti.com/omap
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e2e.ti.com
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