DDC316CGXGR

DDC316 www.ti.com......................................................................................................................................................... SBAS370A – MARCH 2008 – REVISED APRIL 2009 16-Channel, Current-Input Analog-to-Digital Converter FEATURES DESCRIPTION 1 • SINGLE-CHIP SOLUTION TO MEASURE 16 LOW-LEVEL CURRENTS • INTEGRATING I-TO-V CONVERSION FRONT-END • PROGRAMMABLE FULL-SCALE : 3pC to 12pC • ADJUSTABLE SPEED: – Data Rate Up To 100kSPS – Integration Time Down To 10µs • ANALOG SUPPLY: +5V • DIGITAL SUPPLY: +3.3V 2 For each of the 16 inputs, the DDC316 provides a dual-switched integrator front-end. This configuration allows for continuous current integration: while one integrator is being digitized by the on-chip ADC, the other is integrating the input current. Adjustable integration times range from 10µs to 1ms. The DDC316 provides a serial interface of the output data, either multiplexed onto a single data output pin or parallel on four output pins. The output mode can be selected based on the available integration time. APPLICATIONS • • • The DDC316 is a 16-bit, 16-channel, current-input analog-to-digital converter (ADC). It combines both current-to-voltage and analog-to-digital (A/D) conversion so that 16 separate low-level current output devices (such as photodiodes) can be directly connected to its inputs and digitized. CT SCANNER DAS PHOTODIODE SENSORS X-RAY DETECTION SYSTEMS The DDC316 uses a +5V analog supply and a +3.3V digital supply. Operating over the temperature range of 0°C to +70°C, the DDC316 is offered in a BGA-64 package. Protected by US Patent #5841310 AVDD IN1 VREF DVDD DDC316 I to V CLK IN2 Control I to V CONV DIN_CFG RESET IN3 I to V DVALID ADCs DIN IN4 DCLK I to V Serial Interface DOUT1 DOUT2 IN16 DOUT3 DOUT4 I to V AGND DGND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2009, Texas Instruments Incorporated DDC316 SBAS370A – MARCH 2008 – REVISED APRIL 2009......................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) AVDD to AGND –0.3V to +6V DVDD to DGND –0.3V to +3.6V AGND to DGND ±0.2V VREF Input to AGND 2.0V to AVDD + 0.3V Analog Input to AGND –0.3V to +0.7V Digital Input Voltage to DGND –0.3V to DVDD + 0.3V Digital Output Voltage to DGND –0.3V to AVDD + 0.3V Operating Temperature 0°C to +70°C Storage Temperature –60°C to +150°C Junction Temperature (TJ) (1) 2 +150°C Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): DDC316 DDC316 www.ti.com......................................................................................................................................................... SBAS370A – MARCH 2008 – REVISED APRIL 2009 ELECTRICAL CHARACTERISTICS At TA = +25°C, AVDD = +5V, DVDD = +3.3V, VREF = +4.096V, tINT = 20µs, Range = 12pC, Format = 16 bits, CLK = 40MHz, and HI_SPEED Bit = 1, unless otherwise noted. DDC316 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Range 1 2.4 3 3.6 pC Range 2 4.8 6 7.2 pC Range 3 9.6 12 14.4 pC Negative Full-Scale Range –1.786% of Positive Full-Scale Range ANALOG INPUT RANGE pC DYNAMIC CHARACTERISTICS Data Rate Integration Time, tINT 100 kSPS HI_SPEED Bit = 1 20 1,000 µs HI_SPEED Bit = 0 10 20 µs 1 40 MHz 40 MHz 20 MHz System Clock Input Data Clock (DCLK) Daisy-Chain Readback ACCURACY Resolution 12 Noise, Low-Level Input (1) CSENSOR (2) = 10pF Integral Linearity Error (4) Input Bias Current TA = +25°C Range Error Match (5) Range Sensitivity to VREF VREF = 4.096 ± 0.1V 16 Bits 3.5 6.0 LSB (3) 8 16 LSB (3) ±2 ±10 pA 0.2 1 % of FSR (6) 1:1 Offset Error ±50 ±200 LSB (3) Offset Error Match (5) ±75 ±400 LSB (3) Low-Level Input (< 1% FSR) ±2 ±10 mV at DC 40 LSB (3)/V ±1 LSB/°C Continuous Readings Over 1-Minute Intervals After a 10-Minute Warm-Up