DLPC900
DLPS037F – OCTOBER 2014 – REVISED JUNE 2021
DLPC900 Digital Controller for Advanced Light Control
1 Features
2 Applications
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Scalable controller supporting DLP6500,
DLP9000, DLP500YX, and DLP670S digital
micromirror devices (DMDs) for high-resolution
industrial and display applications
Supports multiple high-speed pattern rates
– Up to 16129-Hz (1-bit pre-stored pattern mode)
– Up to 2016-Hz (8-bit pre-stored pattern mode
with illum modulation)
– Up to 1008-Hz (16-bit pre-stored pattern mode
with illum modulation)
128-megabyte internal DRAM
128-megabyte external flash capability stores up to
1066 1-bit binary or 133 8-bit grayscale patterns
(depending on pattern compression)
1-to-1 input mapping to micromirrors
Easy synchronization with cameras and sensors
– Two configurable input and output triggers
Fully programmable GPIO and PWM signals
Multiple control interfaces
– One USB 1.1 slave port and three I2C ports
– LED enable and PWM generators
Video mode
– Dual 24-bit RGB inputs up to 120 Hz
– YUV, YCrCb, or RGB data format
– Standard video from SVGA to WQXGA
– DLP9000 (WQXGA), DLP500YX (2048 ☓ 1200)
and DLP670S (2716 ☓ 1600) require two
DLPC900 controllers
3D machine vision and optical inspection
3D printing and additive manufacturing
Ophthalmology
3D scanners for limb and skin measurement
Intelligent and adaptive lighting
3D imaging microscopes
3 Description
The DLPC900 is a scalable DMD controller that
supports reliable operation of DLP6500, DLP9000,
DLP500YX, and DLP670S DMDs. This highperformance DMD controller enables programmable,
high-speed pattern rates for advanced light control,
especially in industrial applications. DLPC900 pattern
rates enable fast and accurate 3D scanning and
3D printing, as well as support high resolution
and intelligent imaging applications. DLPC900 offers
128-megabytes of embedded DRAM for convenient
buffering of up to 400 1-bit patterns. Input and output
triggers offer easy connection and synchronization
with a variety of cameras, sensors, and other
peripherals.
Get started with TI DLP® light-control technology
page to learn how to get started with the DLPC900.
The DLP advanced light control resources on
ti.com accelerate time to market, which include
evaluation modules, reference designs, optical
modules manufacturers, and DLP design network
partners.
Device Information (1)
PART NUMBER
DLPC900
(1)
PACKAGE
BGA (516)
BODY SIZE (NOM)
27.00 mm × 27.00 mm
For all available packages, refer to the orderable addendum
at the end of the data sheet.
Simplified Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DLPC900
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DLPS037F – OCTOBER 2014 – REVISED JUNE 2021
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................5
6 Specifications................................................................ 21
6.1 Absolute Maximum Ratings...................................... 21
6.2 ESD Ratings............................................................. 22
6.3 Recommended Operating Conditions.......................22
6.4 Thermal Information..................................................23
6.5 Electrical Characteristics...........................................23
6.6 System Oscillators Timing Requirements (1) ............26
6.7 Power-Up and Power-Down Timing Requirements.. 27
6.8 JTAG Interface: I/O Boundary Scan Application
Timing Requirements.................................................. 30
6.9 JTAG Interface: I/O Boundary Scan Application
Switching Characteristics............................................ 30
6.10 Programmable Output Clocks Switching
Characteristics.............................................................31
6.11 Port 1 and 2 Input Pixel Interface Timing
Requirements.............................................................. 31
6.12 Two Pixels Per Clock (48-Bit Bus) Timing
Requirements.............................................................. 32
6.13 SSP Switching Characteristics................................33
6.14 DMD Interface Switching Characteristics (1) .......... 35
6.15 DMD LVDS Interface Switching Characteristics..... 36
6.16 Source Input Blanking Requirements..................... 37
7 Detailed Description......................................................38
7.1 Overview................................................................... 38
7.2 Functional Block Diagram......................................... 38
7.3 Feature Description...................................................39
7.4 Device Functional Modes..........................................49
8 Application and Implementation.................................. 52
8.1 Application Information............................................. 52
8.2 Typical Applications.................................................. 52
9 Power Supply Recommendations................................61
9.1 System Power Regulation.........................................61
9.2 System Environment and Defaults............................62
9.3 System Power-Up Sequence....................................62
9.4 System Reset Operation...........................................64
10 Layout...........................................................................65
10.1 Layout Guidelines................................................... 65
10.2 Layout Example...................................................... 76
10.3 Thermal Considerations..........................................77
11 Device and Documentation Support..........................79
11.1 Device Support........................................................79
11.2 Documentation Support.......................................... 80
11.3 Receiving Notification of Documentation Updates.. 80
11.4 Support Resources................................................. 81
11.5 Trademarks............................................................. 81
11.6 Electrostatic Discharge Caution.............................. 81
11.7 Glossary.................................................................. 81
12 Mechanical, Packaging, and Orderable
Information.................................................................... 81
4 Revision History
Changes from Revision E (March 2020) to Revision F ( June 2021)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Updated terminology to primary and secondary................................................................................................. 5
• Updated "DLP LightCrafter 9000 EVM" to "DLP LightCrafter Dual DLPC900 Evaluation Module (EVM)"......... 5
• Added 10 kΩ pulldown resistor requirement to the FAULT-STATUS pin description.......................................... 5
• Updated H22, T22, and U23 to be Flash Address line extensions..................................................................... 5
• Updated terminology to primary and secondary............................................................................................... 21
• DLPC900A ESD Human body model (HBM) and Charged device model (CDM) information added.............. 22
• Updated terminology to primary and secondary............................................................................................... 23
• Updated section to include DLP500YX and DLP670S DMDs.......................................................................... 38
• Updated terminology to primary and secondary............................................................................................... 41
• Included DLP500YX and DLP670S DMDs in section.......................................................................................41
• Modified section to update DLPC900 Memory Space diagram and add new information about design and
layout for larger flash devices up to 128-Megabytes........................................................................................ 42
• Updated Section 7.3.5.5.2.2 to "Combining Three Chip Selects with One 128-Megabyte Flash" ...................46
• Changed "LightCrafter 6500 and the LightCrafter 9000" to "Single DLPC900 Evaluation Module" and "Dual
DLPC900 Evaluation Module".......................................................................................................................... 48
• Added 2-Gigabit Flash Memory device to Micron and Spansion devices list................................................... 48
• Updated link to DLP® LightCrafter™ Single DLPC900 Evaluation Module (EVM) User's Guide (DLPU101) or
DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) User's Guide (DLPU102)............................. 49
• Updated Minimum Exposure in Any Pattern Mode table to include DLP500YX and DLP670S DMDs............ 49
• Updated Minimum Exposures for Number of Active DMD Blocks table to include DLP500YX and DLP670S
DMDs................................................................................................................................................................49
• Updated Section to include DLP500YX and DLP670S DMDs..........................................................................52
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DLPS037F – OCTOBER 2014 – REVISED JUNE 2021
Updated terminology to primary and secondary. ............................................................................................. 52
Updated section to include DLP500YX and DLP670S DMDs. ........................................................................ 52
Updated Boot Flash Memory Layout to reflect updated flash design............................................................... 54
Updated terminology to primary and secondary............................................................................................... 64
Updated Related Documents Table.................................................................................................................. 80
Changes from Revision D (March 2019) to Revision E (March 2020)
Page
• Changed DMD references to general device numbers to remove revision dependencies ................................1
• Generalized device number to remove revision dependencies ......................................................................... 1
• Updated Section 11.1.1 section to show additional identification for revisions.................................................79
• Updated Section 11.1.2 section ....................................................................................................................... 79
Changes from Revision C (October 2016) to Revision D (March 2019)
Page
• Changed "Pre-loaded" to "using Pre-stored Pattern Mode"................................................................................1
• Deleted Stores up to 400 1-Bit Binary or 50 8-Bit Grayscale Patterns from 128 Mbit Internal DRAM................1
• Changed "MB" to "Mbit" for DRAM and External Flash throughout the document............................................. 1
• Changed Quality Control to Automatic Optical Inspection in Applications .........................................................1
• Added Additive Manufacturing ...........................................................................................................................1
• Added Heads Up Display in Applications .......................................................................................................... 1
• Updated RθJC description from 'Junction-to-air thermal resistance' to 'Junction-to-case thermal resistance'.. 23
• Changed Firmware compatibility information to version 4 for all DMDs........................................................... 27
• Deleted Power-Down Method "A" to have one Method.................................................................................... 28
• Changed the DMD Full-Bus Connections reference link from the DLPC900 Programmer's Guide to the DLP
LightCrafter 6500 & 9000 EVM User's Guide................................................................................................... 40
• Added note clarifying number of patterns storable in External Flash memory. ................................................49
• Changed Section 11.1.2 Lines 3 - 5 to TI proprietary information.................................................................... 79
Changes from Revision B (September 2016) to Revision C (October 2016)
Page
• Updated description of POSENSE and PWRGOOD.......................................................................................... 5
• Changed Reset Timing Requirements to Power-Up and Power-Down Timing Requirements......................... 27
• Added power-up and power-down requirements for revision "B" DMDs.......................................................... 27
• Updated the description of Power-On Sense (POSENSE) Support and added cross-reference to Power-Up
and Power-Down Timing Requirements........................................................................................................... 63
• Updated the description of Power Good (PWRGOOD) Support and added cross-reference to Power-Up and
Power-Down Timing Requirements.................................................................................................................. 63
Changes from Revision A (August 2015) to Revision B (September 2016)
Page
• Changed "DLP9500" to "DLP9000".................................................................................................................... 1
• Changed number of patterns for 48Mbit External Flash..................................................................................... 1
• Added "or 50 8-Bit Grayscale Patterns"..............................................................................................................1
• Added Memory Design Considerations section ...............................................................................................42
• Added "(pre-stored pattern mode, pattern on-the-fly mode, or video pattern mode),"......................................49
• Added "pattern on-the-fly mode."......................................................................................................................49
• Changed to "In video pattern mode, pre-stored pattern mode, and pattern on-the-fly mode,"......................... 49
• Added "For faster 8-bit pattern speeds, . . .".....................................................................................................49
• Added link to "DLP6500 & 9000 EVM User's Guide"........................................................................................49
Changes from Revision * (October 2014) to Revision A (August 2015)
Page
• Corrected the width of the input pixel ports to 24-bits.........................................................................................1
• Added I/O Type and Subscript Definition table................................................................................................... 5
• Corrected maximum port width of Ports 1 and 2 in table note............................................................................5
• Updated ESD Ratings table title and value column.......................................................................................... 22
• ESD sensitivity machine model was removed.................................................................................................. 22
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DLPS037F – OCTOBER 2014 – REVISED JUNE 2021
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4
Added note to clarify that Ports 1 and 2 are used as 24-bit buses................................................................... 31
Changed section title to correct bus size to 48-bits.......................................................................................... 32
Removed references to 30-bit RGB video........................................................................................................ 39
Corrected minor typos...................................................................................................................................... 49
Corrected video pattern mode timing diagram and description........................................................................ 49
Corrected pre-stored pattern mode timing diagram and description................................................................ 49
Corrected pre-stored pattern mode 3 pattern example diagram and description............................................. 49
Updated Boot Flash Memory Layout image to reflect firmware version 2.0..................................................... 54
Added note about firmware components.......................................................................................................... 54
Corrected video data interface size to 24-bits.................................................................................................. 55
Corrected video mode port maximum size to 24 bits........................................................................................56
Corrected P1 and P2 signal description regarding 24-bit bus width................................................................. 56
Corrected spacing and formatting.....................................................................................................................64
Corrected minor typo........................................................................................................................................ 73
Changed the number of P1 and P2 lines to reflect 24 bit-width........................................................................73
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DLPS037F – OCTOBER 2014 – REVISED JUNE 2021
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AF
AF
AE
AE
AD
AD
AC
AC
AB
AB
AA
AA
Y
Y
W
W
V
V
U
U
T
T
R
R
P
P
N
N
M
M
L
L
K
K
J
J
H
H
G
G
F
F
E
E
D
D
C
C
B
B
A
A
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1
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5 Pin Configuration and Functions
Figure 5-1. ZPC Package 516-Pin BGA Bottom View
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Table 5-1. Initialization Pin Functions
PIN
NAME
NUMBER
POSENSE
P22
PWRGOOD
T26
EXT_ARSTZ
T24
CTRL_ARSTZ
(1)
(2)
T25
I/O
POWER
I/O
TYPE(1)
VDD33
I4
H
VDD33
I4
H
VDD33
VDD33
O2
O2
CLK SYSTEM
DESCRIPTION(2)
Async
Power-On Sense is an active high signal with hysteresis,
generated from an external voltage monitor circuit. This signal
is driven active high when all the controller supply voltages
have reached 90% of their specified minimum voltage.
This signal is driven inactive low after the falling edge of
PWRGOOD as shown in Figure 6-4 and Figure 6-5. Refer
to Section 6.7 for more details.
Async
Power Good is an active high signal with hysteresis that is
provided from an external voltage monitor circuit. A high value
indicates all power is within operating voltage specifications
and the system is safe to exit its RESET state. Refer to
Section 6.7 for more details.
Async
General purpose active low reset output signal. This output
is driven low immediately after POSENSE is externally
driven low, placing the system in RESET and remains low
while POSENSE remains low. EXT_ARSTZ will continue to
be held low after POSENSE is driven high and released
by the controller firmware. EXT_ARSTZ is also driven low
approximately 5 µs after the detection of a PWRGOOD or any
internally generated reset. In all cases, it will remain active for
a minimum of 2 ms.
Async
Controller active low reset output signal. This output is driven
low immediately after POSENSE is externally driven low and
remains low while POSENSE remains low. CTRL_ARSTZ will
continue to be held low after POSENSE is driven high and
released by the controller firmware. CTRL_ARSTZ is also
optionally asserted low approximately 5 µs after the detection
of a PWRGOOD or any internally generated reset. In all
cases it will remain active for a minimum of 2 ms.
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
Table 5-2. DMD Control Pin Functions
PIN
NAME
I/O
POWER
DADOEZ
AE7
DADADDR_3
DADADDR_2
DADADDR_1
DADADDR_0
AD6
AE5
AF4
AB8
VDD33
DADMODE_1
DADMODE_0
AD7
AE6
VDD33
DADSEL_1
DADSEL_0
AE4
AC7
VDD33
VDD33
I/O TYPE(1) CLK SYSTEM
DESCRIPTION(2)
Async
DMD output-enable (active low). This signal does not
apply to the secondary controller in a two-controller system
configuration. On the secondary controller, this pin is reserved
and must be left unconnected.
O5
Async
DMD address. This signal does not apply to the secondary
controller in a two-controller system configuration. On the
secondary controller, this pin is reserved and must be left
unconnected.
O5
Async
DMD mode. This signal does not apply to the secondary
controller in a two-controller system configuration. On the
secondary controller, this pin is reserved and must be left
unconnected.
Async
DMD select. This signal does not apply to the secondary
controller in a two-controller system configuration. On the
secondary controller, this pin is reserved and must be left
unconnected.
O5
O5
DADSTRB
AF5
VDD33
O5
Async
DMD strobe. This signal does not apply to the secondary
controller in a two-controller system configuration. On the
secondary controller, this pin is reserved and must be left
unconnected.
DAD_INTZ
AC8
VDD33
I4
H
Async
DMD interrupt (active low). Requires an external 1-kΩ pullup
resistor.
(1)
6
NUMBER
Refer to I/O Type and Subscript Definition (Table 5-15).
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DLPS037F – OCTOBER 2014 – REVISED JUNE 2021
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
Table 5-3. DMD LVDS Interface Pin Functions
PIN(3) (4)
NAME
NUMBER
I/O POWER
I/O TYPE(1)
CLK
SYSTEM
DESCRIPTION(2)
DCKA_P
DCKA_N
V4
V3
VDD18
O7
DCKA_P
DCKA_N
DMD, LVDS interface channel A, differential clock.
SCA_P
SCA_N
V2
V1
VDD18
O7
DCKA_P
DCKA_N
DMD, LVDS interface channel A, differential serial
control.
DDA_P_15
DDA_N_15
DDA_P_14
DDA_N_14
DDA_P_13
DDA_N_13
DDA_P_12
DDA_N_12
DDA_P_11
DDA_N_11
DDA_P_10
DDA_N_10
DDA_P_9
DDA_N_9
DDA_P_8
DDA_N_8
P4
P3
P2
P1
R4
R3
R2
R1
T4
T3
T2
T1
U4
U3
U2
U1
DDA_P_7
DDA_N_7
DDA_P_6
DDA_N_6
DDA_P_5
DDA_N_5
DDA_P_4
DDA_N_4
DDA_P_3
DDA_N_3
DDA_P_2
DDA_N_2
DDA_P_1
DDA_N_1
DDA_P_0
DDA_N_0
W4
W3
W2
W1
Y2
Y1
Y4
Y3
AA2
AA1
AA4
AA3
AB2
AB1
AC2
AC1
VDD18
O7
DCKA_P
DCKA_N
DMD, LVDS interface channel A, differential serial data.
DCKB_P
DCKB_N
J3
J4
VDD18
O7
DCKB_P
DCKB_N
DMD, LVDS interface channel B, differential clock.
SCB_P
SCB_N
J1
J2
VDD18
O7
DCKB_P
DCKB_N
DMD, LVDS interface channel B, differential serial
control.
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Table 5-3. DMD LVDS Interface Pin Functions (continued)
PIN(3) (4)
NAME
NUMBER
DDB_P_15
DDB_N_15
DDB_P_14
DDB_N_14
DDB_P_13
DDB_N_13
DDB_P_12
DDB_N_12
DDB_P_11
DDB_N_11
DDB_P_10
DDB_N_10
DDB_P_9
DDB_N_9
DDB_P_8
DDB_N_8
N1
N2
N3
N4
M2
M1
M3
M4
L1
L2
L3
L4
K1
K2
K3
K4
DDB_P_7
DDB_N_7
DDB_P_6
DDB_N_6
DDB_P_5
DDB_N_5
DDB_P_4
DDB_N_4
DDB_P_3
DDB_N_3
DDB_P_2
DDB_N_2
DDB_P_1
DDB_N_1
DDB_P_0
DDB_N_0
H1
H2
H3
H4
G1
G2
G3
G4
F1
F2
F3
F4
E1
E2
D1
D2
(1)
(2)
(3)
(4)
I/O POWER
I/O TYPE(1)
CLK
SYSTEM
DESCRIPTION(2)
VDD18
O7
DCKB_P
DCKB_N
DMD, LVDS interface channel B, differential serial data.
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
Several options allow reconfiguration of the DMD interface in order to better optimize board layout. The DLPC900 can swap channel A
with channel B. The DLPC900 can also swap the data bit order within each channel independent of swapping the A and B channels.
The DLPC900 is a full-bus DMD signaling interface. Figure 7-4 shows the controller connections for this configuration.
Table 5-4. Program Memory Flash Interface Pin Functions
PIN(3)
NUMBER
PM_CSZ_0 (4)
D13
VDD33
O5
Async
Chip select
(active low)
N/A
N/A
PM_CSZ_1 (4)
E12
VDD33
O5
Async
N/A
Boot flash chip
select
(active low)
N/A
PM_CSZ_2 (4)
A13
VDD33
O5
Async
N/A
N/A
Chip select
(active low)
PM_ADDR_22 (5)
A12
VDD33
B5
Async
Address bit (MSB)
Address bit
(MSB)
Address bit (MSB)
PM_ADDR_21 (5)
E11
VDD33
B5
Async
Address bit
Address bit
Address bit
PM_ADDR_20
D12
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_19
C12
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_18
B11
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_17
A11
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_16
D11
VDD33
O5
Async
Address bit
Address bit
Address bit
NAME
8
DESCRIPTION
I/O
POWER
I/O
TYPE(1)
CLK SYSTEM
CHIP SELECT 0
(ADDITIONAL
FLASH)
CHIP SELECT 1
(BOOT FLASH
ONLY) (2) (3)
CHIP SELECT 2
(ADDITIONAL
FLASH)
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Table 5-4. Program Memory Flash Interface Pin Functions (continued)
PIN(3)
DESCRIPTION
NUMBER
I/O
POWER
PM_ADDR_15
C11
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_14
E10
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_13
D10
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_12
C10
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_11
B9
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_10
A9
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_9
E9
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_8
D9
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_7
C9
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_6
B8
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_5
A8
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_4
D8
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_3
C8
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_2
B7
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_1
A7
VDD33
O5
Async
Address bit
Address bit
Address bit
PM_ADDR_0
C7
VDD33
O5
Async
Address bit (LSB)
Address bit (LSB)
Address bit (LSB)
Write-enable
(active low)
Write-enable
(active low)
NAME
I/O
TYPE(1)
CLK SYSTEM
CHIP SELECT 0
(ADDITIONAL
FLASH)
CHIP SELECT 1
(BOOT FLASH
ONLY) (2) (3)
CHIP SELECT 2
(ADDITIONAL
FLASH)
PM_WEZ
B12
VDD33
O5
Async
Write-enable
(active low)
PM_OEZ
C13
VDD33
O5
Async
Output-enable
(active low)
Output-enable
(active low)
Output-enable
(active low)
PM_BLSZ_1
B6
VDD33
O5
Async
UpperByte(15:8)
enable
(active low)
N/A
UpperByte(15:8)
Enable
(active low)
PM_BLSZ_0
A6
VDD33
O5
Async
LowerByte(7:0)
enable
(active low)
N/A
LowerByte(7:0)
Enable
(active low)
PM_DATA_15
C17
VDD33
B5
Async
Data bit (15)
Data bit (15)
Data bit (15)
PM_DATA_14
B16
VDD33
B5
Async
Data bit (14)
Data bit (14)
Data bit (14)
PM_DATA_13
A16
VDD33
B5
Async
Data bit (13)
Data bit (13)
Data bit (13)
PM_DATA_12
A15
VDD33
B5
Async
Data bit (12)
Data bit (12)
Data bit (12)
PM_DATA_11
B15
VDD33
B5
Async
Data bit (11)
Data bit (11)
Data bit (11)
PM_DATA_10
D16
VDD33
B5
Async
Data bit (10)
Data bit (10)
Data bit (10)
PM_DATA_9
C16
VDD33
B5
Async
Data bit (9)
Data bit (9)
Data bit (9)
PM_DATA_8
E14
VDD33
B5
Async
Data bit (8)
Data bit (8)
Data bit (8)
PM_DATA_7
D15
VDD33
B5
Async
Data bit (7)
Data bit (7)
Data bit (7)
PM_DATA_6
C15
VDD33
B5
Async
Data bit (6)
Data bit (6)
Data bit (6)
PM_DATA_5
B14
VDD33
B5
Async
Data bit (5)
Data bit (5)
Data bit (5)
PM_DATA_4
A14
VDD33
B5
Async
Data bit (4)
Data bit (4)
Data bit (4)
PM_DATA_3
E13
VDD33
B5
Async
Data bit (3)
Data bit (3)
Data bit (3)
PM_DATA_2
D14
VDD33
B5
Async
Data bit (2)
Data bit (2)
Data bit (2)
PM_DATA_1
C14
VDD33
B5
Async
Data bit (1)
Data bit (1)
Data bit (1)
PM_DATA_0
B13
VDD33
B5
Async
Data bit (0)
Data bit (0)
Data bit (0)
(1)
(2)
(3)
Refer to I/O Type and Subscript Definition (Table 5-15).
The default wait-state is set for a flash device of 120 ns access time. Therefore, the slowest flash access time supported is 120 ns.
Refer to the Section 8.2.1.2.1.4.2 on how to program new wait-state values.
Refer to the Figure 8-2 for the memory layout of the boot flash.
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(4)
(5)
Requires an external 10-kΩ pullup resistor.
Requires an external 10-kΩ pulldown resistor.
Table 5-5. Port 1 and Port 2 Channel Data and Control Pin Functions
PIN
(3) (4) (5)
NUMBER
I/O
POWER
I/O
TYPE(1)
CLK SYSTEM
P_CLK1
AE22
VDD33
I4
D
N/A
Input port data pixel write clock (selectable as rising or falling
edge triggered, and with which port it is associated (Port 1 or
Port 2 or (Port 1 and Port 2))).
P_CLK2
W25
VDD33
I4
D
N/A
Input port data pixel write clock (selectable as rising or falling
edge triggered, and with which port it is associated (Port 1 or
Port 2 or (Port 1 and Port 2))).
P_CLK3
AF23
VDD33
I4
D
N/A
Input port data pixel write clock (selectable as rising or falling
edge triggered, and with which port it is associated (Port 1 or
Port 2 or (Port 1 and Port 2))).
P_DATEN1
AF22
VDD33
I4
D
P_CLK1,
P_CLK2, or
P_CLK3
Active high data enable. Selectable as to which port it is
associated with (Port 1 or Port 2 or (Port 1 and Port 2)).
P_DATEN2
W24
VDD33
I4
D
P_CLK1,
P_CLK2, or
P_CLK3
Active high data enable. Selectable as to which port it is
associated with (Port 1 or Port 2 or (Port 1 and Port 2)).
P1_A9
P1_A8
P1_A7
P1_A6
P1_A5
P1_A4
P1_A3
P1_A2
P1_A1 (3)
P1_A0 (3)
AD15
AE15
AE14
AE13
AD13
AC13
AF14
AF13
AF12
AE12
P_CLK1,
P_CLK2, or
P_CLK3
Port 1 A channel input pixel data (bit weight 128)
Port 1 A channel input pixel data (bit weight 64)
Port 1 A channel input pixel data (bit weight 32)
Port 1 A channel input pixel data (bit weight 16)
Port 1 A channel input pixel data (bit weight 8)
Port 1 A channel input pixel data (bit weight 4)
Port 1 A channel input pixel data (bit weight 2)
Port 1 A channel input pixel data (bit weight 1)
Unused, tie to 0
Unused, tie to 0
P1_B9
P1_B8
P1_B7
P1_B6
P1_B5
P1_B4
P1_B3
P1_B2
P1_B1 (3)
P1_B0 (3)
AF18
AB18
AC15
AC16
AD16
AE16
AF16
AF15
AC14
AD14
P_CLK1,
P_CLK2, or
P_CLK3
Port 1 B channel input pixel data (bit weight 128)
Port 1 B channel input pixel data (bit weight 64)
Port 1 B channel input pixel data (bit weight 32)
Port 1 B channel input pixel data (bit weight 16)
Port 1 B channel input pixel data (bit weight 8)
Port 1 B channel input pixel data (bit weight 4)
Port 1 B channel input pixel data (bit weight 2)
Port 1 B channel input pixel data (bit weight 1)
Unused, tie to 0
Unused, tie to 0
P1_C9
P1_C8
P1_C7
P1_C6
P1_C5
P1_C4
P1_C3
P1_C2
P1_C1 (3)
P1_C0 (3)
AD20
AE20
AE21
AF21
AD19
AE19
AF19
AF20
AC19
AE18
VDD33
I4
D
P_CLK1,
P_CLK2, or
P_CLK3
Port 1 C channel input pixel data (bit weight 128)
Port 1 C channel input pixel data (bit weight 64)
Port 1 C channel input pixel data (bit weight 32)
Port 1 C channel input pixel data (bit weight 16)
Port 1 C channel input pixel data (bit weight 8)
Port 1 C channel input pixel data (bit weight 4)
Port 1 C channel input pixel data (bit weight 2)
Port 1 C channel input pixel data (bit weight 1)
Unused, tie to 0
Unused, tie to 0
P1_VSYNC
AC20
VDD33
B2
D
P_CLK1,
P_CLK2, or
P_CLK3
Port 1 vertical sync. While intended to be associated with port
1, it can be programmed for use with port 2.
P1_HSYNC
AD21
VDD33
B2
D
P_CLK1,
P_CLK2, or
P_CLK3
Port 1 horizontal sync. While intended to be associated with
port 1, it can be programmed for use with port 2.
NAME
10
VDD33
VDD33
I4
D
I4
D
DESCRIPTION(2)
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Table 5-5. Port 1 and Port 2 Channel Data and Control Pin Functions (continued)
PIN (3) (4) (5)
NAME
NUMBER
I/O
POWER
P2_A9
P2_A8
P2_A7
P2_A6
P2_A5
P2_A4
P2_A3
P2_A2
P2_A1 (3)
P2_A0 (3)
AD26
AD25
AB21
AC22
AD23
AB20
AC21
AD22
AE23
AB19
P2_B9
P2_B8
P2_B7
P2_B6
P2_B5
P2_B4
P2_B3
P2_B2
P2_B1 (3)
P2_B0 (3)
Y22
AB26
AA23
AB25
AA22
AB24
AC26
AB23
AC25
AC24
P2_C9
P2_C8
P2_C7
P2_C6
P2_C5
P2_C4
P2_C3
P2_C2
P2_C1 (3)
P2_C0 (3)
W23
V22
Y26
Y25
Y24
Y23
W22
AA26
AA25
AA24
VDD33
P2_VSYNC
U22
P2_HSYNC
W26
(1)
(2)
(3)
(4)
(5)
I/O
TYPE(1)
DESCRIPTION(2)
CLK SYSTEM
P_CLK1,
P_CLK2, or
P_CLK3
Port 2 A channel input pixel data (bit weight 128)
Port 2 A channel input pixel data (bit weight 64)
Port 2 A channel input pixel data (bit weight 32)
Port 2 A channel input pixel data (bit weight 16)
Port 2 A channel input pixel data (bit weight 8)
Port 2 A channel input pixel data (bit weight 4)
Port 2 A channel input pixel data (bit weight 2)
Port 2 A channel input pixel data (bit weight 1)
Unused, tie to 0
Unused, tie to 0
P_CLK1,
P_CLK2, or
P_CLK3
Port 2 B channel input pixel data (bit weight 128)
Port 2 B channel input pixel data (bit weight 64)
Port 2 B channel input pixel data (bit weight 32)
Port 2 B channel input pixel data (bit weight 16)
Port 2 B channel input pixel data (bit weight 8)
Port 2 B channel input pixel data (bit weight 4)
Port 2 B channel input pixel data (bit weight 2)
Port 2 B channel input pixel data (bit weight 1)
Unused, tie to 0
Unused, tie to 0
I4
D
P_CLK1,
P_CLK2, or
P_CLK3
Port 2 C channel input pixel data (bit weight 128)
Port 2 C channel input pixel data (bit weight 64)
Port 2 C channel input pixel data (bit weight 32)
Port 2 C channel input pixel data (bit weight 16)
Port 2 C channel input pixel data (bit weight 8)
Port 2 C channel input pixel data (bit weight 4)
Port 2 C channel input pixel data (bit weight 2)
Port 2 C channel input pixel data (bit weight 1)
Unused, tie to 0
Unused, tie to 0
VDD33
B2
D
P_CLK1,
P_CLK2, or
P_CLK3
Port 2 vertical sync. While intended to be associated with port
2, it can be programmed for use with port 1.
VDD33
B2
D
P_CLK1,
P_CLK2, or
P_CLK3
Port 2 horizontal sync. While intended to be associated with
port 2, it can be programmed for use with port 1.
VDD33
VDD33
I4
D
I4
D
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
Port 1 and Port 2 are capable of 24-bits each. A maximum of 8-bits is available in each of the A, B, and C channels. The 8-bit color
inputs are connected to bits [9:2] of the corresponding A, B, C input channels. Sources feeding 8-bits or less per color component
channel are MSB justified when connected to the DLPC900, and the LSBs tied to ground along with the data lines 0 and 1 from every
channel. Three port clocks options (1, 2, and 3) are provided to improve the signal integrity.
Ports 1 and 2 can be used separately as two 24-bit ports, or can be combined into one 48-bit port (typically, for high data rate sources)
for transmission of two pixels per clock.
The A, B, C input data channels of ports 1 and 2 can be internally reconfigured or remapped for optimum board layout. Specifically
each channel can individually remapped to the internal GBR/ YCbCr channels. For example, G data can be connected to channel A, B,
or C and remapped to be appropriate channel internally. Port configuration and channel multiplexing is handled in the API software.
Table 5-6. Clock and PLL Support Pin Functions
PIN
NAME
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
DESCRIPTION(2)
MOSC
M26
VDD33
I10
N/A
System clock oscillator input (3.3-V LVTTL). MOSC must be
stable a maximum of 25 ms after POSENSE transitions from
low to high.
MOSCN
N26
VDD33
O10
N/A
MOSC crystal return.
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Table 5-6. Clock and PLL Support Pin Functions (continued)
PIN
NAME
OCLKA (3)
(1)
(2)
(3)
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
DESCRIPTION(2)
AF6
VDD33
O5
Async
General-purpose output clock A. The frequency is software
programmable. Power-up default is 787 kHz and the output
frequency is maintained through all operations, except
power loss and reset.
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
This signal does not apply to the secondary controller in a two controller system configuration. On the secondary controller, this pin is
reserved and must be left unconnected. Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and
a two controller configuration.
Table 5-7. Board-Level Test and Debug Pin Functions
PIN (3)
NUMBER
I/O
POWER
I/O
TYPE(1)
CLK
SYSTEM
TDI
N25
VDD33
I4
U
TCK
JTAG serial data in. Used in both Boundary Scan and ICE
modes.
TCK
N24
VDD33
I4
D
N/A
JTAG serial data clock. Used in both Boundary Scan and ICE
modes.
TMS1
P25
VDD33
I4
U
TCK
JTAG test mode select. Used in Boundary Scan mode.
TMS2
P26
VDD33
I4
U
TCK
JTAG-ICE test mode select. Used in ICE mode.
TDO1
N23
VDD33
O5
TCK
JTAG serial data out. Used in Boundary Scan mode.
TDO2
N22
VDD33
O5
TCK
JTAG-ICE serial data out. Used in ICE mode.
Async
NAME
TRSTZ
M23
VDD33
I4
H
U
RTCK
E4
VDD33
O2
N/A
VDD33
I4
H
D
Async
ICTSEN
(1)
(2)
(3)
M24
DESCRIPTION(2)
JTAG Reset. Used in both Boundary Scan and ICE modes.
This pin is pulled high (or left unconnected) when the JTAG
interface is in use for boundary scan or debug. Connect this
to ground otherwise. Failure to tie this pin low during normal
operation will cause startup and initialization problems.
JTAG return clock. Used in ICE mode.
IC tri-state enable (active high). Asserting high will tri-state all
outputs except the JTAG interface. Requires an external
4.7 kΩ pulldown resistor.
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
All JTAG signals are LVTTL compatible.
Table 5-8. Device Test Pin Functions
PIN
NAME
HW_TEST_EN
(1)
(2)
NUMBER
I/O
POWER
I/O
TYPE(1)
CLK
SYSTEM
M25
VDD33
I4
H
D
N/A
DESCRIPTION(2)
Device manufacturing test enable. This signal must be
connected to an external ground for normal operation.
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
Table 5-9. Peripheral Interface Pin Functions
PIN
NAME
I2C0_SCL
12
NUMBER
A10
I/O
POWER
VDD33
I/O TYPE(1)
B8
CLK SYSTEM
DESCRIPTION(2)
N/A
I2C bus 0, clock. This bus supports 400 kHz, fast mode
operation. This input is not 5 V tolerant. This pin requires an
external pullup resistor to 3.3 V. The minimum acceptable
pullup value is 1 kΩ resistor.
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Table 5-9. Peripheral Interface Pin Functions (continued)
PIN
NAME
NUMBER
I2C0_SDA
B10
I2C1_SDA
(3)
I2C1_SCL
(3)
E19
D20
I2C2_SDA (3)
C21
I/O
POWER
VDD33
VDD33
VDD33
VDD33
I/O TYPE(1)
B8
B2
B2
B2
CLK SYSTEM
DESCRIPTION(2)
I2C0_SCL
I2C bus 0, data. This bus supports 400 kHz, fast mode
operation. This input is not 5 V tolerant. This pin requires an
external pullup resistor to 3.3 V. The minimum acceptable
pullup value is 1 kΩ resistor.
I2C1_SCL
I2C bus 1, data. This bus supports 400 kHz, fast mode
operation. This input is not 5 V tolerant. This pin requires an
external pullup resistor to 3.3 V. The minimum acceptable
pullup value is 1 kΩ resistor.
N/A
I2C bus 1, clock. This bus supports 400 kHz, fast mode
operation. This input is not 5 V tolerant. This pin requires an
external pullup resistor to 3.3 V. The minimum acceptable
pullup value is 1 kΩ resistor.
I2C2_SCL
I2C bus 2, data. This bus supports 400 kHz, fast mode
operation. This input is not 5 V tolerant. This pin requires an
external pullup resistor to 3.3 V. The minimum acceptable
pullup value is 1 kΩ resistor.
I2C2_SCL (3)
B22
VDD33
B2
N/A
I2C bus 2, clock. This bus supports 400 kHz, fast mode
operation. This input is not 5 V tolerant. This pin requires an
external pullup resistor to 3.3 V. The minimum acceptable
pullup value is 1 kΩ resistor.
SSP0_CLK
AD4
VDD33
B5
N/A
Synchronous serial port 0, clock
SSP0_RXD
AD5
VDD33
I4
SSP0_CLK
Synchronous serial port 0, receive data in
SSP0_TXD
AB7
VDD33
O5
SSP0_CLK
Synchronous serial port 0, transmit data out
(3)
AC5
VDD33
B5
SSP0_CLK
Synchronous serial port 0, chip select 0 (active low)
SSP0_CSZ_1 (3)
AB6
VDD33
B5
SSP0_CLK
Synchronous serial port 0, chip select 1 (active low)
This signal connects to the DMD SCP_ENZ input
SSP0_CSZ_2 (3)
AC3
VDD33
B5
SSP0_CLK
Synchronous serial port 0, chip select 2 (active low)
UART0_TXD
AB3
VDD33
O5
Async
UART0, UART transmit data output. The firmware only
outputs debug messages on this port.
UART0_RXD
AD1
VDD33
I4
Async
UART0, UART receive data input. The firmware does not
support receiving data on this port.
UART0_RTSZ
AD2
VDD33
O5
Async
UART0, UART ready to send hardware flow control output
(active low)
UART0_CTSZ
AE2
VDD33
I4
Async
UART0, UART clear to send hardware flow control input
(active low). This pin requires an external 10 kΩ pulldown
resistor.
USB_DAT_N (3)
USB_DAT_P
C5
D6
VDD33
B9
Async
USB D– I/O
USB D+ I/O
SSP0_CSZ_0
HOLD_BOOTZ
F24
VDD33
B2
Async
Boot mode. When this pin is held low, the firmware bootsup in bootload mode. When pin is held high, the firmware
boots-up in normal operating mode. This pin requires an
external 1 kΩ pullup resistor.
USB_ENZ (3)
E25
VDD33
B2
Async
The firmware will use this pin to enable an external buffer on
the USB data lines after it has completed initialization.
FAULT_STATUS
AC11
VDD33
O2
Async
This signal toggles or held high to indicate status faults. This
pin requires an external 10 kΩ pulldown resistor.
HEARTBEAT
AB12
VDD33
O2
Async
This signal toggles to indicate the system is operational.
Period is approximately 1 second.
SEQ_INT2
H26
VDD33
I2
Async
This signal serves as an interrupt for pattern sequencing
and must be connected to SEQ_AUX6.
SEQ_INT1
G26
VDD33
I2
Async
This signal serves as an interrupt for pattern sequencing
and must be connected to SEQ_AUX7.
SEQ_AUX7
F26
VDD33
O2
Async
This signal serves as an interrupt for pattern sequencing
and must be connected to SEQ_INT1.
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Table 5-9. Peripheral Interface Pin Functions (continued)
PIN
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
SEQ_AUX6
E26
VDD33
O2
Async
This signal serves as an interrupt for pattern sequencing
and must be connected to SEQ_INT2.
TEST_FUNC_5 (3)
K22
VDD33
B2
Async
In a dual DLPC900 configuration, this pin connects to the
FPGA and could serve as a configuration pin. Otherwise
can be left unconnected.
TEST_FUNC_4 (3)
J26
VDD33
B2
Async
In a dual DLPC900 configuration, this pin connects to the
FPGA and could serve as a configuration pin. Otherwise
can be left unconnected.
NAME
DESCRIPTION(2)
TEST_FUNC_3 (3)
J25
VDD33
B2
Async
In a dual DLPC900 configuration, this pin connects to the
FPGA and serves as a configuration pin. This function
configures the 24-bit parallel data output of the FPGA to
be split between the primary and the secondary controllers.
The firmware will set this pin high by default.
TEST_FUNC_2 (3)
J24
VDD33
B2
Async
In a dual DLPC900 configuration, this pin connects to the
FPGA and could serve as a configuration pin. Otherwise
can be left unconnected.
TEST_FUNC_1 (3)
J23
VDD33
B2
Async
In a dual DLPC900 configuration, this pin connects to the
FPGA and could serve as a configuration pin. Otherwise
can be left unconnected.
GPIO_08 (3)
E21
VDD33
B2
Async
This pin can be configured as GPIO 8. An external pullup
resistor is required when this pin is configured as opendrain. (4)
GPIO_07 (3)
V23
VDD33
B2
Async
This pin can be configured as GPIO 7. An external pullup
resistor is required when this pin is configured as opendrain. (4)
GPIO_06 (3)
V24
VDD33
B2
Async
This pin can be configured as GPIO 6. An external pullup
resistor is required when this pin is configured as opendrain. (4)
GPIO_05 (3)
U24
VDD33
B2
Async
This pin can be configured as GPIO 5. An external pullup
resistor is required when this pin is configured as opendrain. (4)
GPIO_04 (3)
U25
VDD33
B2
Async
This pin can be configured as GPIO 4. An external pullup
resistor is required when this pin is configured as opendrain. (4)
GPIO_PWM_03 (3)
A23
VDD33
B2
Async
This pin can be configured as GPIO 3 or PWM 3.
An external pullup resistor is required when this pin is
configured as open-drain. (4)
GPIO_PWM_02 (3)
A22
VDD33
B2
Async
This pin can be configured as GPIO 2 or PWM 2.
An external pullup resistor is required when this pin is
configured as open-drain. (4)
GPIO_PWM_01 (3)
B21
VDD33
B2
Async
This pin can be configured as GPIO 1 or PWM 1.
An external pullup resistor is required when this pin is
configured as open-drain. (4)
GPIO_PWM_00 (3)
A21
VDD33
B2
Async
This pin can be configured as GPIO 0 or PWM 0.
An external pullup resistor is required when this pin is
configured as open-drain. (4)
(1)
(2)
(3)
(4)
14
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
This signal does not apply to the secondary controller in a two controller system configuration. On the secondary controller, this pin is
reserved and must be left unconnected. Refer to Section 8.2.2 and Section 8.2.1 for a description between a one controller and a two
controller configuration.
GPIO signals must be configured through software for input, output, bidirectional, or open-drain. Some GPIO have one or more
alternative use modes, which are also software-configurable. The reset default for all GPIO signals is as an input signal. Refer to the
DLPC900 Programmer's Guide (DLPU018).
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Table 5-10. Trigger Control Pin Functions
PIN (3)
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
TRIG_IN_1
AF7
VDD33
I4
Async
In video pattern mode, this signal is used for advancing the
pattern display.
TRIG_IN_2
H25
VDD33
I2
Async
In video pattern mode, the rising edge of this signal is used
for starting the pattern display and the falling edge is used
for stopping the pattern display. It works along with the
software start stop command.
TRIG_OUT_1
E20
VDD33
O2
Async
Active high trigger output signal during pattern exposure.
TRIG_OUT_2
D22
VDD33
O2
Async
Active high trigger output to indicate first pattern display.
NAME
(1)
(2)
(3)
DESCRIPTION(2)
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
These signals do not apply to the secondary controller in a two controller system configuration. On the secondary controller, these pins
are reserved and must be left unconnected. Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller
and a two controller configuration.
Table 5-11. LED Control Pin Functions
PIN (3)
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
BLU_LED_PWM
C20
VDD33
O2
Async
Blue LED PWM current control signal.
GRN_LED_PWM
B20
VDD33
O2
Async
Green LED PWM current control signal.
RED_LED_PWM
B19
VDD33
O2
Async
Red LED PWM current control signal.
BLU_LED_EN
D24
VDD33
O2
Async
Blue LED enable signal.
GRN_LED_EN
C25
VDD33
O2
Async
Green LED enable signal.
RED_LED_EN
B26
VDD33
O2
Async
Red LED enable signal.
NAME
(1)
(2)
(3)
DESCRIPTION(2)
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
These signals do not apply to the secondary controller in a two controller system configuration. On the secondary controller, these pins
are reserved and must be left unconnected. Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller
and a two controller configuration.
Table 5-12. Two Controller Support Pin Functions
PIN
NUMBER
I/O
POWER
SEQ_SYNC
AB9
VDD33
B3
Async
SSP0_CSZ4_SLV
U26
VDD33
B2
SSP0_CLK
FSD12_OUTPUT
T23
VDD33
B2
Async
This pin must be connected to DA_SYNC_INPUT (3)
DA_SYNC_INPUT
R22
VDD33
B2
Async
This pin must be connected to FSD12_OUTPUT (4)
Async
This signal must be connected between the primary and
secondary controller in a two controller configuration. The
secondary controller will pull this signal high to inform the
primary controller that it is present and ready. This pin
requires an external 10-kΩ pulldown resistor. Do not leave
unconnected.
Async
When this pin is high, the controller operates as the primary
controller. When this pin is low the controller operates as
the secondary controller. Use an external 4.7-kΩ pullup or
pulldown resistor to identify the controller. Do not leave
unconnected.
NAME
SLV_CTRL_PRST
CTRL_MODE_CFG
(1)
V25
V26
VDD33
VDD33
I/O TYPE(1) CLK SYSTEM
B2
B2
DESCRIPTION(2)
Sequence sync. This signal must be connected between
the primary and secondary controller in a two controller
configuration. Do not leave unconnected. This pin requires
an external 10-kΩ pullup resistor.
This signal is used by the primary controller to communicate
with the secondary controller over the SSP interface. This
pin requires an external 4.7-kΩ pullup resistor.
Refer to I/O Type and Subscript Definition (Table 5-15).
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(2)
(3)
(4)
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
The FSD12_OUTPUT of the secondary controller must be left unconnected.
The DA_SYNC_INPUT of the secondary controller must be connected to the FSD12_OUTPUT of the primary controller.
Table 5-13. Reserved Pin Functions
PIN
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
AFE_ARSTZ
AC12
VDD33
O2
Async
RESERVED_AD12
AD12
VDD33
O6
N/A
Reserved. Must be left unconnected.
AFE_IRQ
AB13
VDD33
I4
Async
Reserved. Must be left unconnected.
RESERVED_AF11
AF11
VDD33
I4
N/A
Reserved. Must be left unconnected.
RESERVED_AD11
AD11
VDD33
I4
N/A
Reserved. Must be left unconnected.
RESERVED_AE11
AE11
VDD33
I4
N/A
Reserved. Must be left unconnected.
RESERVED_AE8
AE8
VDD33
I4
N/A
Reserved. This pin requires an external 10-kΩ pullup
resistor.
RESERVED_AD8
AD8
VDD33
O5
N/A
Reserved. Must be left unconnected.
RESERVED_AC9
AC9
VDD33
O5
N/A
Reserved. Must be left unconnected.
RESERVED_AF8
AF8
VDD33
I4
N/A
Reserved. This pin Requires an external 10-kΩ pulldown
resistor.
NAME
RESERVED_E3
DESCRIPTION(2)
Reserved. This pin requires an external 4.7-kΩ pullup
resistor.
E3
VDD33
B5
N/A
Reserved. Must be left unconnected.
RESERVED_AB10
AB10
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AD9
AD9
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AE9
AE9
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AF9
AF9
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AB11
AB11
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AC10
AC10
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AD10
AD10
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AE10
AE10
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AF10
AF10
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_K24
K24
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_K23
K23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_J22
J22
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_H24
H24
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_H23
H23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_H22
H22
VDD33
B2
N/A
Used for Flash memory address extension. Pull down to
GND with 10-kΩ resistor.
RESERVED_G25
G25
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_F25
F25
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_G24
G24
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_G23
G23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_T22
T22
VDD33
B2
N/A
Used for Flash memory address extension. Pull down to
GND with 10-kΩ resistor.
RESERVED_U23
U23
VDD33
B2
N/A
Used for Flash memory address extension. Pull down to
GND with 10-kΩ resistor.
RESERVED_G22
G22
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_F23
F23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_D26
D26
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_E24
E24
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_F22
F22
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_D25
D25
VDD33
B2
N/A
Reserved. Must be left unconnected.
16
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Table 5-13. Reserved Pin Functions (continued)
PIN
NUMBER
I/O
POWER
I/O TYPE(1)
CLK SYSTEM
RESERVED_E23
E23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_C26
C26
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_AB4
AB4
VDD33
B5
N/A
Reserved. Must be left unconnected.
RESERVED_C23
C23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_D21
D21
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_B24
B24
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_C22
C22
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_B23
B23
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_A20
A20
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_A19
A19
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_E18
E18
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_D19
D19
VDD33
B2
N/A
Reserved. Must be left unconnected.
RESERVED_C19
C19
VDD33
B2
N/A
Reserved. Must be left unconnected.
N/A
Reserved. Must be left unconnected.
NAME
DESCRIPTION(2)
RESERVED_E8
E8
VDD33
B2
D
RESERVED_B4
B4
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_C4
C4
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_E7
E7
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_D5
D5
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_E6
E6
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_D3
D3
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_C2
C2
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_A4
A4
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_B5
B5
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_C6
C6
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_A5
A5
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
RESERVED_D7
D7
VDD33
B2
D
N/A
Reserved. Must be left unconnected.
(1)
(2)
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a two controller configuration.
Table 5-14. Power and Ground Pin Functions
PIN(3)
NAME
VDD33
I/O TYPE(1)
NUMBER
F20, F17, F11, F8, L21, R21, Y21,
AA19, AA16, AA10, AA7
PWR
DESCRIPTION(2)
3.3-V I/O power
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Table 5-14. Power and Ground Pin Functions (continued)
PIN(3)
NAME
I/O TYPE(1)
NUMBER
C1, F5, G6, K6, M5, P5, T5,
VDD18
W6, AA5, AE1, H5, N6, T6,
DESCRIPTION(2)
PWR
1.8-V internal DRAMVDD and LVDSAVD I/O power
(To shut this power down in a system low-power mode, see
the Section 9.3.)
PWR
1.15-V core power
AA13, U21, P21, H21, F14
F19, F16, F13, F10, F7, H6, L6,
VDDC
P6, U6, Y6, AA8, AA11, AA14, AA17,
AA20, W21, T21, N21, K21, G21, L11,
T11, T16, L16
PLLD_VDD
L22
PWR
1.15-V DMD clock generator PLL
Digital power
PLLD_VSS
L23
GND
1.15-V DMD clock generator PLL
Digital GND
PLLD_VAD
K25
PWR
1.8-V DMD clock generator PLL
Analog power
PLLD_VAS
K26
GND
1.8-V DMD clock generator PLL
Analog GND
PLLM1_VDD
L26
PWR
1.15-V primary-LS clock generator PLL
Digital power
PLLM1_VSS
M22
GND
1.15-V primary-LS clock generator PLL
Digital GND
PLLM1_VAD
L24
PWR
1.8-V primary-LS clock generator PLL
Analog power
PLLM1_VAS
L25
GND
1.8-V primary-LS clock generator PLL
Analog GND
PLLM2_VDD
P23
PWR
1.15-V primary-HS clock generator PLL
Digital power
PLLM2_VSS
P24
GND
1.15-V primary-HS clock generator PLL
Digital GND
PLLM2_VAD
R25
PWR
1.8-V primary-HS clock generator PLL
Analog power
PLLM2_VAS
R26
GND
1.8-V primary-HS clock generator PLL
Analog GND
PLLS_VAD
R23
PWR
1.15-V video-2X clock generator PLL
Analog power
PLLS_VAS
R24
GND
1.15-V video-2X clock generator PLL
Analog GND
RES
DRAM direct test pins (for manufacturing use only). These
pins must be tied directly to ground for normal operation.
AE26
RES
DRAM direct test control pin (for manufacturing use only).
This pin must be tied directly to 3.3 I/O power (VDD33) for
normal operation.
AB14, AB15, E15, E16
RES
DRAM direct test control pins (for manufacturing use
only). These pins must be tied directly to ground for normal
operation.
V5, K5
PWR
Dedicated ground for LVDS bandgap reference. These pins
must be tied directly to ground for normal operation.
AC6
PWR
Fuse programming pin (for manufacturing use only). This pin
must be tied directly to ground for normal operation.
B18, D18, B17, E17, A18, C18, A17,
L_VDQPAD_[7:0],
R_VDQPAD_[7:0]
D17, AE17, AC17, AF17, AC18, AB16,
AD17,
AB17, AD18
CFO_VDD33
VTEST1, VTEST2,
VTEST3, VTEST4
LVDS_AVS1,
LVDS_AVS2
VPGM
18
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Table 5-14. Power and Ground Pin Functions (continued)
PIN(3)
NAME
I/O TYPE(1)
NUMBER
DESCRIPTION(2)
A26, A25, A24, B25, C24, D23,
E22, F21, F18, F15, F12, F9, F6,
E5, D4, C3, B3, A3, B2, A2,
B1, A1, G5, J5, J6, L5, M6,
N5, R5, R6, U5, V6, W5, Y5,
AA6, AB5, AC4, AD3, AE3, AF3, AF2,
GND
AF1, AA9, AA12, AA15, AA18, AA21,
AB22,
GND
Common ground
AC23, AD24, AE24, AF24, AE25,
AF25, AF26,
V21, M21, J21, L15, L14, L13, L12,
M16, M15, M14, M13, M12, M11, N16,
N15, N14, N13, N12, N11, P16, P15,
P14, P13, P12, P11, R16, R15, R14,
R13, R12, R11, T15, T14, T13, T12
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Table 5-15. I/O Type and Subscript Definition
I/O
(SUBSCRIPT)
DESCRIPTION
(3)
1
N/A
2
3.3 LVTTL I/O buffer, with 8-mA drive
3
3.3 LVTTL I/O buffer, with 12-mA drive
4
3.3 LVTTL receiver
5
3.3 LVTTL I/O buffer, with 8-mA drive, with slew rate control
6
3.3 LVTTL I/O buffer, with programmable 4-, 8-, or 12-mA
drive
7
1.8-V LVDS (DMD interface)
8
3.3-V I2C with 3-mA sink
9
USB-compatible (3.3 V)
10
OSC 3.3-V I/O compatible LVTTL
ESD STRUCTURE
N/A
ESD diode to VDD33 and
GND
(TYPE)
(1)
(2)
(3)
20
I
Input
O
Output
N/A
B
Bidirectional
H
Hysteresis
U
Includes an internal termination pullup resistor
D
Includes an internal termination pulldown resistor
Refer to I/O Type and Subscript Definition (Table 5-15).
Refer to the Section 8.2.2 and the Section 8.2.1 for a description between a one controller and a
two controller configuration.
Refer to the Section 10.1.7 for instructions on handling unused pins.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) (see(1) )
Supply voltage (2) (3)
VI
MIN
MAX
VDDC (core)
–0.3
1.6
VDD18 (LVDSAVD I/O and internal DRAMVDD)
–0.3
2.5
VDD33 (I/O)
–0.3
3.9
PLLD_VDD (1.15 V DMD clock generator – digital)
–0.3
1.6
PLLM1_VDD (1.15 V primary-LS clock generator – digital)
–0.3
1.6
PLLM2_VDD (1.15 V primary-HS clock generator – digital)
–0.3
1.6
PLLD_VAD (1.8 V DMD clock generator – analog)
–0.3
2.5
PLLM1_VAD (1.8 V primary-LS clock generator – analog)
–0.3
2.5
PLLM2_VAD (1.8 V primary-HS clock generator – analog)
–0.3
2.5
PLLS_VAD (1.15 V video-2X – analog)
–0.5
1.4
–1
5.25
OSC
–0.3
VDD33 +
0.3 V
3.3 LVTTL
–0.3
3.6
3.3 I2C
–0.5
3.8
–1
5.25
1.8 LVDS
–0.3
2.2
3.3 LVTTL
–0.3
3.6
3.3 I2C
–0.5
3.8
0
111
°C
–40
125
°C
Input voltage (4)
Output voltage
TJ
Operating junction
temperature
Tstg
Storage temperature
(1)
(2)
(3)
(4)
V
USB
USB
VO
UNIT
V
V
Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3.
Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
All voltage values are with respect to GND.
All of the 3.3-V, 1.8-V, and 1.15-V power must be applied and removed per the procedure defined in Section 9.3. Overlap currents,
if allowed to continue flowing unchecked not only increase total power dissipation in a circuit, but degrade the circuit reliability, thus
shortening its usual operating life.
Applies to external input and bidirectional buffers.
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6.2 ESD Ratings
VALUE
V(ESD)
Electrostatic
discharge
DLPC900
DLPC900A
(1)
(2)
(3)
(4)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
±2000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
±300
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1) (4)
±1000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2) (3)
+500 /
-300
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
CDM passes to -500-V on all digital pins, however the PLL pins pass only to -300V, failing at -350-V.
HBM includes power supply combinations only. Non-supply pin to non-supply pin combinations not performed in accordance with
qualification plan.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in this
data sheet is achieved when operating the device by the Recommended Operating Conditions. No level of performance is
implied when operating the device above or below the Recommended Operating Conditions limits.
I/O (1)
MIN
NOM
MAX
3.135
3.3
3.465
1.71
1.8
1.89
VDD33
3.3 V supply voltage, I/O
VDD18
1.8 V supply voltage, LVDSAVD and
DRAMVDD
VDDC
1.15 V supply voltage, Core logic
1.100
1.15
1.200
PLLD_VDD
1.8 V supply voltage, PLL analog
1.71
1.8
1.89
PLLM1_VDD
1.8 V supply voltage, PLL analog
1.71
1.8
1.89
PLLM2_VDD
1.8 V supply voltage, PLL analog
1.71
1.8
1.89
PLLS_VDD
1.15 V supply voltage, PLL analog
1.090
1.15
1.200
PLLD_VDD
1.15 V supply voltage, PLL digital
1.090
1.15
1.200
PLLM1_VDD
1.15 V supply voltage, PLL digital
1.090
1.15
1.200
PLLM2_VDD
1.15 V supply voltage, PLL digital
1.090
1.15
1.200
VI
VO
Input voltage
Output voltage
USB (9)
0
VDD33
OSC (10)
0
VDD33
3.3 V LVTTL (1, 2, 3, 4)
0
VDD33
3.3 V I2C (8)
0
VDD33
USB (8)
0
VDD33
3.3 V LVTTL (1, 2, 3, 4)
0
VDD33
0
VDD33
0
VDD18
3.3 V
I2C
(8)
1.8 V LVDS (7)
(2)
V
V
0
55
°C
0
109.16
°C
0
111
°C
Operating ambient temperature range
See
TC
Operating top-center case temperature
See (3) and (4)
TJ
Operating junction temperature
22
V
(3)
TA
(1)
(2)
(3)
(4)
and
UNIT
The number inside the parentheses for the I/O refers to the I/O type defined in Table 5-15.
Assumes minimum 1 m/s airflow.
Maximum thermal values assume max power of 4.76 W (total for controller).
Assume φJT equals 0.4°C/W.
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6.4 Thermal Information
DLPC900
THERMAL METRIC
ZPC (BGA)
UNIT
516 PINS
RθJC (1)
Junction-to-case thermal resistance
4.4
°C/W
RθJA at 0 m/s of forced airflow (2)
Junction-to-air thermal resistance
14.4
°C/W
(2)
Junction-to-air thermal resistance
9.5
°C/W
RθJA at 2 m/s of forced airflow (2)
Junction-to-air thermal resistance
9.0
°C/W
Temperature variance from junction to package top center
temperature, per unit power dissipation
0.4
°C/W
RθJA at 1 m/s of forced airflow
φJT
(3)
(1)
(2)
(3)
RθJC analysis assumptions: The heat generated in the chip flows into overmold (top side) and also into the package laminate (bottom
side) and then into PCB via package solder balls. Used for heat sink analysis only.
Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined
standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC900 PCB and thus the reported thermal
resistance can be inaccurate in the actual product application. Although the actual thermal resistance can be different, it is the best
information available during the design phase to estimate thermal performance.
Example: (3.2 W) × (0.4 C/W) ≈ 1.28°C temperature rise.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER (1)
VIH
High-level input
threshold voltage
TEST CONDITIONS (4)
2
OSC (10)
2
3.3-V LVTTL (1, 2, 3, 4)
2
3.3-V I2C (8)
VIL
Low-level input
threshold voltage
MIN
USB (9)
2.4
0.8
3.3-V LVTTL (1, 2, 3, 4)
0.8
VDIS
USB (9)
200
VICM
Input common mode
range
(Differential cross
point voltage)
USB (9)
0.8
VOH
High-level output
voltage
USB (9)
1
mV
2.5
1.52
IOH = Max rated
USB (9)
Output differential
voltage
V
V
2.8
1.8-V LVDS (7)
3.3-V LVTTL (1, 2, 3)
VOD
VDD33 + 0.5
OSC (10)
–0.5
UNIT
V
0.8
Differential input
sensitivity
(Differential input
voltage)
Low-level output
voltage
MAX
USB (9)
3.3-V I2C (8)
VOL
TYP
V
2.7
0
1.8-V LVDS (7)
0.3
0.88
3.3-V LVTTL (1, 2, 3)
IOL = Max rated
0.4
3.3-V I2C (8)
IOL = 3-mA sink
0.4
1.8-V LVDS (7)
0.065
0.44
V
V
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6.5 Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER (1)
TEST CONDITIONS (4)
MIN
USB (9)
IIH
IIL
High-level input
current
OSC (10)
–10
10
3.3-V LVTTL (1 to 4)
VIH = VDD33
(without internal pulldown)
–10
10
10
200
3.3-V LVTTL (1 to 4) (with
internal pulldown)
VIH = VDD33
3.3-V I2C (8)
VIH = VDD33
–10
10
OSC (10)
–10
10
–10
10
–10
–200
3.3-V LVTTL (1-4) (with
internal pullup)
VOH = VDD33
3.3-V I2C (8)
VOH = VDD33
Low-level output
current (3)
–6.5
3.3-V LVTTL (1)
VO = 2.4 V
–4
3.3-V LVTTL (2)
VO = 2.4 V
–8
3.3-V LVTTL (3)
VO = 2.4 V
–12
IOZ
High-impedance
leakage current
VO = 1 V
3.3-V LVTTL (1)
VO = 0.4 V
4
3.3-V LVTTL (2)
VO = 0.4 V
8
3.3-V LVTTL (3)
VO = 0.4 V
12
(8)
CI
24
6.5
mA
3
USB (9)
–10
10
LVDS (7)
–10
10
3.3-V LVTTL (1, 2, 3)
–10
10
3.3-V I2C (8)
–10
10
USB (9)
Input capacitance
(including package)
mA
19.1
1.8-V LVDS (7)
(VOD = 300 mV)
3.3-V
µA
–18.4
VO = 1.4 V
I2C
µA
–10
1.8-V LVDS (7)
(VOD = 300 mV)
USB (9)
IOL
UNIT
10
USB (9)
3.3-V LVTTL (1-4) (without
VOH = VDD33
Low-level input current internal pullup)
High-level output
current (2)
MAX
200
USB (9)
IOH
TYP
11.84
17.07
3.3-V LVTTL (1)
3.75
5.52
3.3-V LVTTL (2)
3.75
5.52
3.3-V LVTTL (4)
3.75
5.52
3.3-V I2C (8)
5.26
6.54
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pF
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6.5 Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER (1)
TEST CONDITIONS (4)
MAX
UNIT
ICC11
Supply voltage, 1.15-V core power
Normal mode
2368
mA
ICC18
Supply voltage, 1.8-V power (LVDS I/O and
internal DRAM)
Normal mode
1005
mA
ICC33
Supply voltage, 3.3-V I/O power
Normal mode
33
mA
ICC11_PLLD
Supply voltage, DMD PLL digital power (1.15 V)
Normal mode
4.4
6.2
mA
ICC11_PLLM1
Supply voltage, primary-LS clock generator PLL
digital power (1.15 V)
Normal mode
4.4
6.2
mA
ICC11_PLLM2
Supply voltage, primary-HS clock generator PLL
digital power (1.15 V)
Normal mode
4.4
6.2
mA
ICC18_PLLD
Supply voltage, DMD PLL analog power (1.8 V)
Normal mode
8
10.2
mA
ICC18_PLLM1
Supply voltage, primary-LS clock generator PLL
analog power (1.8 V)
Normal mode
8
10.2
mA
ICC18_PLLM2
Supply voltage, primary-HS clock generator PLL
analog power (1.8 V)
Normal mode
8
10.2
mA
ICC11_PLLS
Supply voltage, video-2X PLL analog power
(1.15 V)
Normal mode
2.9
mA
4.76
W
Total Power in Normal Mode
(1)
(2)
(3)
(4)
MIN
TYP
The number inside the parentheses for the I/O refers to the I/O type defined in Table 5-15.
VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT – VDDQ) / IOH must be < 21 Ω for values of VOUT between VDDQ and VDDQ – 280 mV.
VDDQ = 1.7 V; VOUT = 280 mV. VOUT / IOL must be < 21 Ω for values of VOUT between 0 V and 280 mV.
Normal mode refers to DLPC900 operation during full functionality. Typical values correspond to power dissipated on nominal process
devices operating at nominal voltage and 70°C junction temperature (approximately 25°C ambient) displaying typical video-graphics
content from a high-frequency source. Max values correspond to power dissipated on fast-process devices operating at high voltage
and 105°C junction temperature (approximately 55°C ambient) displaying typical video-graphics content from a high-frequency source.
The increased power dissipation observed on fast-process devices operated at max recommended temperature is primarily a result of
increased leakage current.
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6.6 System Oscillators Timing Requirements (1)
ƒclock
Clock frequency, MOSC1
Stability and Tolerance. Crystal frequency 20 MHz. (2)
tc
Cycle time, MOSC1
MIN
MAX
UNIT
19.998
100
20.002
100
MHz
ppm
49.995
50.005
ns
tw(H)
Pulse duration2, MOSC, high
50% to 50% reference points
(signal)
tw(L)
Pulse duration2, MOSC, low
50% to 50% reference points
(signal)
tt
Transition time2, MOSC, tt = tƒ / tr
20% to 80% reference points
(signal)
12
ns
tjp
Period jitter2, MOSC
(The deviation in period from ideal period due solely to high-frequency jitter – not spread
spectrum clocking)
18
ps
(1)
(2)
20
ns
20
ns
Applies only when driven through an external digital oscillator. The MOSC input cannot support spread spectrum clock spreading.
Including impact to accuracy due to aging, temperature, and trim sensitivity.
tC
tW(H)
tT
tT
tW(L)
80%
50%
20%
MOSC
Figure 6-1. System Oscillators
26
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6.7 Power-Up and Power-Down Timing Requirements
All DMDs supported by the DLPC900 controller require Firmware Version 4.0.0 or later.
Table 6-1. Power-Up and Power-Down Timing Requirements
MIN
tw1(L)
Pulse duration, inactive low, PWRGOOD 50% to 50% reference points (signal)
Pulse duration with 1.8 V on, inactive
low, PWRGOOD
tw1(L)
Pulse duration with 1.8 V off, inactive
low, PWRGOOD
50% to 50% reference points (signal)
tt1
Transition time, PWRGOOD, tt1 = tƒ /tr
20% to 80% reference points (signal)
tw2(L)
Pulse duration, inactive low, POSENSE
50% to 50% reference points (signal)
Pulse duration with 1.8 V on, inactive
low, POSENSE
tw2(L)
Pulse duration with 1.8 V off, inactive
low, POSENSE
50% to 50% reference points (signal)
Transition time, POSENSE, tt2 = tƒ /tr
20% to 80% reference points (signal)
tPH
Power hold time, POSENSE remains
active after PWGOOD is deasserted.
20% to 80% reference points (signal)
tePH
Extended power hold time for revision "B" and later DMDs.
tEW
Early warning time, PWRGOOD goes inactive low before any power supply voltage
goes below its specification
(1)
UNIT
µs
1000
ms
indefinite
ms
625
µs
500
tt2
tw1(L) + tw2(L)
MAX
4
µs
1000
ms
indefinite
ms
25 (1)
µs
500
µs
20
ms
500
µs
The sum of PWRGOOD and POSENSE inactive time with 1.8 V on
1050
ms
The sum of PWRGOOD and POSENSE inactive time with 1.8 V off
indefinite
ms
As long as noise on this signal is below the hysteresis threshold.
6.7.1 Power-Up
POSENSE and PWRGOOD are active high signals that are generated by an external voltage monitor circuit.
POSENSE must only be driven active high when all the controller and DMD supply voltages have reached 90%
of their specified minimum voltage. The DLPC900 is safe to exit its RESET state once PWRGOOD is driven
high. PWRGOOD has no impact on operation for 60 ms after rising edge of POSENSE.
tt1
80%
50%
20%
PWRGOOD
80%
50%
20%
tt1
80%
50%
20%
tw1(L)
80%
50%
20%
POSENSE
tt2
DC Power Supplies
Figure 6-2. Power Up Timing Diagram
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6.7.2 Power-Down
PWRGOOD cannot be used as an early warning signal. DMDs require an enhanced power down where the
DLPC900 performs a sequence of memory loads to the DMD followed by the mirror park instruction so that the
mirrors end up in an un-landed state.
There are two scenarios to consider when powering down DMDs supported by the DLPC900. Figure 6-3 shows
a power distribution layout for a typical system, which provides the mechanisms for both scenarios.
The first scenario is an anticipated power down, which is during a typical power down of the system. Anticipated
Power Down Timing Diagram shows a timing diagram where an external host sends a power down command
to the microprocessor (µP). The µP must send a Power Standby command to the DLPC900. The DLPC900
then performs the necessary power down sequence on the DMD. The power can be safely removed once the
minimum tePH is met.
The second scenario is an unanticipated power loss. In this case a power loss detection circuit must provide
a means of triggering a power loss. Figure 6-5 shows a timing diagram where the power loss detection circuit
detects a power loss and asserts PWRLOSS to the µP. The µP must send a Power Standby command to the
DLPC900. The DLPC900 then performs the necessary power down sequence on the DMD. The power supplies
can be allowed to drop below their specifications once the minimum tePH is met.
Refer to the DLPC900 Programmer's Guide for a description of the Power Standby command.
Figure 6-3. Power Distribution Layout Example
28
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Figure 6-4. Anticipated Power Down Timing Diagram
Figure 6-5. Unanticipated Power Loss Timing Diagram
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6.8 JTAG Interface: I/O Boundary Scan Application Timing Requirements
MIN
MAX
UNIT
10
MHz
ƒclock
Clock frequency, TCK
tc
Cycle time, TCK
tw(H)
Pulse duration, high
tw(L)
Pulse duration, low
tt
Transition time, tt = tf / tr
20% to 80% reference points (signal)
tsu
Setup time, TDI valid before TCK↑
8
ns
th
Hold time, TDI valid after TCK↑
2
ns
tsu
Setup time, TMS1 valid before TCK↑
8
ns
th
Hold time, TMS1 valid after TCK↑
2
ns
100
ns
50% to 50% reference points (signal)
40
ns
50% to 50% reference points (signal)
40
ns
5
ns
6.9 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
Switching characteristics over recommended operating conditions, CL (min timing) = 5 pF, CL (max timing) = 85 pF (unless
otherwise noted)
PARAMETER
tpd
FROM (INPUT)
TO (OUTPUT)
TCK↑
TDO1
Output propagation, clock to Q
tw(H)
50%
TDO1
(outputs)
3
12
UNIT
ns
tw(L)
50%
50%
tsu
TDI
TMS1
(inputs)
MAX
tt
tc
TCK
(input)
MIN
80%
20%
th
Valid
tpd(max)
Valid
Figure 6-6. I/O Boundary Scan
30
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6.10 Programmable Output Clocks Switching Characteristics
Switching characteristics over recommended operating conditions, CL (min timing) = 5 pF, CL (max timing) = 50 pF (unless
otherwise noted)
FROM (INPUT)
TO (OUTPUT)
MIN
MAX
UNIT
ƒclock
Clock frequency, OCLKA (1)
PARAMETER
N/A
OCLKA
0.787
50.00
MHz
tc
Cycle time, OCLKA
N/A
OCLKA
20.00
1270.6
ns
tw(H)
Pulse duration, high (2)
50% to 50% reference points (signal)
N/A
OCLKA
(tc / 2) – 2
ns
tw(L)
Pulse duration, low (2)
50% to 50% reference points (signal)
N/A
OCLKA
(tc / 2) – 2
ns
Jitter
N/A
OCLKA
(1)
(2)
350
ps
The frequency of OCLKA is programmable.
The duty cycle of OCLKA will be within ±2 ns of 50%.
tC
tt
tw(H)
tt
tw(L)
80%
50%
20%
OCLKA
Figure 6-7. Programmable Output Clocks
6.11 Port 1 and 2 Input Pixel Interface Timing Requirements
MIN
MAX
UNIT
ƒclock
Clock frequency, P_CLK1, P_CLK2, P_CLK3 (24-bit bus Section 7.3.5.6)
12
175
MHz
ƒclock
Clock frequency, P_CLK1, P_CLK2, P_CLK3 (48-bit bus Section 7.3.5.6)
See Section 6.12.
12
141
MHz
tc
Cycle time, P_CLK1, P_CLK2, P_CLK3
5.714
83.33
tw(H)
Pulse duration, high
50% to 50% reference points (signal)
2.3
ns
tw(L)
Pulse duration, low
50% to 50% reference points (signal)
2.3
ns
tjp
Clock period jitter P_CLK1, P_CLK2, P_CLK3
(that is, the deviation in period from ideal
period)
Max fclock
tt
Transition time, tt = tf / tr , P_CLK1, P_CLK2,
P_CLK3
20% to 80% reference points (signal)
tt
ns
See (1)
ps
0.6
2.0
ns
Transition time, tt = tf / tr,
P1_A(9:0), P1_B(9:0) , P1_C(9:0), P1_HSYNC, 20% to 80% reference points (signal)
P1_VSYNC, P1_DATEN
0.6
3.0
ns
tt
Transition time, tt = tf / tr
0.6
3.0
ns
tsu
Setup time, P1_A(9:0), valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P1_A(9:0), valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P1_B(9:0), valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P1_B(9:0), valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P1_C(9:0), valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P1_C(9:0), valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P1_VSYNC, valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P1_VSYNC, valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P1_HSYNC, valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P1_HSYNC, valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
20% to 80% reference points (signal)
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MIN
MAX
UNIT
tsu
Setup time, P2_A(9:0), valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P2_A(9:0), valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P2_B(9:0), valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P2_B(9:0), valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P2_C(9:0), valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P2_C(9:0), valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P2_VSYNC, valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P2_VSYNC, valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P2_HSYNC, valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P2_HSYNC, valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P_DATEN1, valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P_DATEN1, valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
tsu
Setup time, P_DATEN2, valid before P_CLK1, P_CLK2, or P_CLK3.
0.8
ns
th
Hold time, P_DATEN2, valid after P_CLK1, P_CLK2, or P_CLK3.
0.8
tw(A)
VSYNC active pulse duration
1
Video line
tw(A)
HSYNC active pulse duration
16
Pixel
clocks
(1)
ns
For frequencies (ƒclock) less than 175 MHz, use the following formula to obtain the jitter: Max clock jitter = ± [(1 / ƒclock) – 5414 ps].
tt
tc
tw(H)
P_CLKx or
Px_CLK
(input)
50%
tw(L)
50%
tsu
Px_Data and
Px_Control
(inputs)
80%
20%
50%
th
Valid
Figure 6-8. Input Port 1 and 2 Interface
6.12 Two Pixels Per Clock (48-Bit Bus) Timing Requirements
When operating in two pixels per clock mode, the pixel clock must be maintained below 141 MHz. A typical video source
requiring two pixels per clock is shown in the following table and must have reduced blanking to stay below the maximum
pixel clock.
(1)
32
SOURCE
RATE (Hz)
TOTAL PIXELS PER LINE (1)
TOTAL LINES PER FRAME (1)
PIXEL CLOCK ACHIEVED
(MHz)
1080p
120
2060
1120
138.4
Values chosen for front and back porches must meet the timing requirements in Section 6.16.
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6.13 SSP Switching Characteristics
Switching characteristics over recommended operating conditions, CL (min timing) = 5 pF, CL (max timing) = 50 pF (unless
otherwise noted)
MIN
MAX
UNIT
ƒclock
Clock frequency, SSPx_CLK
PARAMETER
N/A
FROM (INPUT)
SSPx_CLK
TO (OUTPUT)
73.00
25000
kHz
tc
Cycle time, SSPx_CLK
N/A
SSPx_CLK
0.040
13.6
µs
tw(H)
Pulse duration, high
50% to 50% reference points (signal)
N/A
SSPx_CLK
40%
tw(L)
Pulse duration, low
50% to 50% reference points (signal)
N/A
SSPx_CLK
40%
SSP MASTER
tpd
Output propagation, clock to Q,
SSPx_DO
SSPx_CLK↓ (1) (2)
SSPx_DO (1) (2)
–5
5
ns
(1) (3)
SSPx_DO (1) (3)
–5
5
ns
Output propagation, clock to Q,
SSPx_DO
SSPx_CLK↓ (1) (2)
SSPx_DO (1) (2)
0
34
ns
SSPx_CLK↑ (1) (3)
SSPx_DO (1) (3)
0
34
ns
SSPx_CLK↑
SSP SLAVE
tpd
(1)
(2)
(3)
The SSP is configured into four different modes of operation by the controller firmware. These modes are shown in Table 6-2, Figure
6-10, and Figure 6-11.
Modes 0 and 3
Modes 1 and 2
Table 6-2. SSP Clock Operational Modes
SPI CLOCKING
MODE
SPI CLOCK
POLARITY (CPOL)
SPI CLOCK PHASE
(CPHA)
0
0
0
1
0
1
2
1
0
3
1
1
CSZ
(CPOL = 0)
CLK
(CPOL = 1)
(CPHA = 0)
MSB
LSB
DI/DO
(CPHA = 1)
MSB
LSB
Figure 6-9. SSP Clock Mode Timing Diagram
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tt
tc
tw(H)
SSPx_CLK
(ASIC output)
tw(L)
50%
50%
tpd(min)
SSPx_DO
(ASIC output)
tpd(max)
Valid
Valid
Valid
tsu
SSPx_DI
(ASIC input)
80%
20%
50%
50%
th
Valid
Valid
SSPx_CSZ
Figure 6-10. Synchronous Serial Port Interface – Master (Modes 0/3)
tt
tc
tw(H)
SSPx_CLK
(ASIC output)
50%
tw(L)
50%
tpd(min)
SSPx_DO
(ASIC output)
Valid
tpd(max)
Valid
Valid
tsu
SSPx_DI
(ASIC input)
Valid
80%
20%
50%
50%
th
Valid
SSPx_CSZ
Figure 6-11. Synchronous Serial Port Interface – Slave (Modes 0/3)
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6.14 DMD Interface Switching Characteristics (1)
over recommended operating conditions, CL (min timing) = 5 pF, CL (max timing) = 50 pF (unless otherwise noted)
PARAMETER
DMD TIMING MODE 0
FROM
TO
MIN
MAX
UNIT
(2)
tw(H)
DMD strobe high pulse duration
N/A
DADSTRB
29
ns
tw(L)
DMD strobe low pulse duration
N/A
DADSTRB
29
ns
Todv-min
Output data valid window,
DADADDR_(3:0), DADMODE_(1:0), DADSEL_(1:0)
with respect to DADSTRB
DADADDR_(3:0)
DADMODE_(1:0)
DADSEL_(1:0)
DADSTRB↑(1)
–27
ns
Todv-max
Output data valid window,
DADADDR_(3:0), DADMODE_(1:0), DADSEL_(1:0)
with respect to DADSTRB
DADADDR_(3:0)
DADMODE_(1:0)
DADSEL_(1:0)
DADSTRB↑(1)
27
ns
DMD TIMING MODE 1 (2)
tw(H)
DMD strobe pulse duration
N/A
DADSTRB
14
ns
tw(L)
DMD strobe low pulse duration
N/A
DADSTRB
14
ns
Todv-min
Output data valid window,
DADADDR_(3:0), DADMODE_(1:0), DADSEL_(1:0)
with respect to DADSTRB
DADADDR_(3:0)
DADMODE_(1:0)
DADSEL_(1:0)
DADSTRB↑(1)
–12
ns
Todv-max
Output data valid window,
DADADDR_(3:0), DADMODE_(1:0), DADSEL_(1:0)
with respect to DADSTRB
DADADDR_(3:0)
DADMODE_(1:0)
DADSEL_(1:0)
DADSTRB↑(1)
12
ns
(1)
(2)
DMD control signals are captured on the rising edge of DADSTRB within the DMD.
The DMD timing mode is controlled by the controller firmware.
DADADDR_(3:0)
DADMODE_(1:0)
DADSEL_(1:0)
todv-min
DADSTRB
todv-max
50%
50%
tw(H)
Figure 6-12. DMD Interface Timing
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6.15 DMD LVDS Interface Switching Characteristics
Switching characteristics over recommended operating conditions (1) (2) (3) (4) (5) (6)
PARAMETER
FROM (INPUT)
TO (OUTPUT)
MIN
MAX
UNIT
400
MHz
ƒclock
Clock frequency, DCK_A
N/A
DCK_A
100
tc
Cycle time, DCK_A1
N/A
DCK_A
2475.3
ps
tw(H)
Pulse duration, high 5 (50% to 50% reference
points)
N/A
DCK_A
1093
ps
tw(L)
Pulse duration, low 5 (50% to 50% reference
points)
N/A
DCK_A
1093
ps
tt
Transition time, tt = tƒ / tr (20% to 80% reference
points)
N/A
DCK_A
100
tosu
Output setup time at max clock rate3
DCK_A↑↓
SCA, DDA(15:0)
438
toh
Output hold time at max clock rate3
DCK_A↑↓
SCA, DDA(15:0)
438
ƒclock
Clock frequency, DCK_B
N/A
DCK_B
100
tc
Cycle time, DCK_B1
N/A
DCK_B
2475.3
ps
tw(H)
Pulse duration, high 5 (50% to 50% reference
points)
N/A
DCK_B
1093
ps
tw(L)
Pulse duration, low 5 (50% to 50% reference
points)
N/A
DCK_B
1093
ps
tt
Transition time, tt = tƒ / tr (20% to 80% reference
points)
N/A
DCK_B
100
tosu
Output setup time at max clock rate3
DCK_B↑↓
SCB, DDB(15:0)
438
ps
toh
Output hold time at max clock rate3
DCK_B↑↓
SCB, DDB(15:0)
438
ps
tsk
Output skew, channel A to channel B
DCK_A↑
DCK_B↑
(1)
(2)
(3)
(4)
(5)
ps
ps
ps
400
400
250
MHz
ps
ps
The minimum cycle time (tc) for DCK_A and DCK_B includes 1.0% spread spectrum modulation.
The DMD LVDS interface uses a double data rate (DDR) clock, thus both rising and falling edges of DCK_A and DCK_B are used to
clock data into the DMD. As a result, the minimum tw(H) and tw(L) parameters determine the worse-case DDR clock cycle time.
Output setup and hold times for DMD clock frequencies below the maximum can be calculated as follows:
tosu(ƒclock) = tosu(ƒmax) + 250000 × (1 / ƒclock – 1 / 400) and toh(ƒclock) = toh(ƒmax) + 250000 × (1 / ƒclock – 1 / 400) where ƒclock is in MHz.
The DLPC900 is a Full-Bus DMD signaling interface. Figure 7-4 shows the controller connections for this configuration.
The pulse duration minimum for any clock rate can be calculated using the following formulas.
a.
Pulse duration minimum when using spread spectrum
i.
ii.
b.
Duty cycle % = 49.06 – [0.01335 × clock frequency (MHz)]
Minimum pulse duration = 1 / clock frequency × DC%
1. Example: At 400 MHz: DC% = 49.06 – [0.01335 × 400] = 43.72%
2. MPW = 1 / 400 MHz × 0.4372 = 1093.0 ps
Pulse duration minimum when not using spread spectrum
i.
ii.
(6)
400
Duty cycle % = 49.00 – [0.01055 × clock frequency (MHz)]
Minimum pulse duration = 1 / clock frequency × DC%
1. Example: At 400 MHz: DC% = 49.00 – [0.01055 × 400] = 44.78%
2. MPW = 1 / 400 MHz × 0.448 = 1119.5 ps
A duty cycle specification is not provided because the key limiting factor to clock frequency is the minimum pulse duration (that is, if the
other half of the clock period is larger than the minimum, it is not limiting the clock frequency).
tt
tc
tw(H)
DCKA
DCKB
(output)
SCA, DDA(15:0)
SCB, DDB(15:0)
(outputs)
tw(L)
50%
50%
tsu
th
Valid
80%
20%
50%
tsu
th
Valid
Valid
Figure 6-13. DMD LVDS Interface
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6.16 Source Input Blanking Requirements
PORT
PARAMETER (1)
MINIMUM BLANKING
VBP
370 µs
VFP
1 Line
Total vertical blanking
370 µs + 2 lines
VBP
370 µs
Port 1 Vertical Blanking
VFP
1 line
Total vertical blanking
370 µs + 2 lines
HBP
10 pixels
HFP
0 pixels
Total horizontal blanking
80 pixels
Port 2 Vertical Blanking
Port 1 and 2 Horizontal Blanking
(1)
Refer to Section 11.1.3.
TPPL
Vertical Back Porch (VBP)
APPL
Horizontal
Back
Porch
(HBP)
ALPF
Horizontal
Front
Porch
(HFP)
TLPF
Vertical Front Porch (VFP)
Figure 6-14. Video Timing Parameters
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7 Detailed Description
7.1 Overview
The DLPC900 controller processes the digital input image and converts the data into the digital format needed
by the DLP500YX, DLP670S, DLP9000, or the DLP6500. The DLP500YX, DLP670S, DLP9000, and the
DLP6500 reflect light by using binary pulse-width-modulation (PWM) for each micromirror. For further details,
refer to the DLP500YX, DLP670S, DLP9000, or the DLP6500 data sheets.
The DLPC900 combined with a DLP6500 supports a wide variety of resolutions from SVGA to 1080p. When
accurate pattern display is needed, a native 1080p resolution source is used for a one-to-one association with
the corresponding micromirror on the DLP6500.
Two DLPC900 controllers combined with a DLP500YX, DLP670S, or DLP9000 supports only native resolution
for a one-to-one association with the corresponding micromirror on the DMD. All combinations are well-suited for
structured light, additive manufacturing, or digital exposure applications.
7.2 Functional Block Diagram
Figure 7-1. Functional Block Diagram
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7.3 Feature Description
The DLPC900 controller takes as input 16-, 20-, or 24-bit RGB data at up to 120-Hz frame rate. For example,
a 120-Hz 24-bit frame is composed of three colors (red, green, and blue) with each color equally divided in the
120-Hz frame rate. Thus, each color has a 2.78-ms time slot allocated. Because each color has an 8-bit depth,
each color time slot is further divided into bit-planes. A bit-plane is the 2-dimensional arrangement of one-bit
extracted from all the pixels in the full color 2D image to implement dynamic depth (see Figure 7-2).
Figure 7-2. Bit Slices
The length of each bit-plane in the time slot is weighted by the corresponding power of two of its binary
representation. This provides a binary pulse-width modulation of the image. For example, a 24-bit RGB input has
three colors (R, G, & B) with 8-bit depth each. Each color time slot is then divided into eight bit-planes, with the
sum of the weight of all bit planes in the time slot equal to 256. Figure 7-3 illustrates the time partition of the bits
in one 8-bit color time slot within a 24-bit RGB frame.
Figure 7-3. 24-Bit RGB Frame Bit Partition
Therefore, a single video frame is composed of a series of bit-planes. Because the DMD mirrors can be either
on or off, an image is created by turning on the mirrors corresponding to the bit set in a bit-plane. With binary
pulse-width modulation, the intensity level of the color is reproduced by controlling the amount of time the mirror
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is on. For a 24-bit RGB frame image inputted to the DLPC900 controller, the DLPC900 controller creates 24
bit-planes, stores them in internal embedded DRAM, and sends them to the DMD, one bit-plane at a time.
The bit weight controls the amount of time the mirror is on. To improve image quality in video frames, these
bit-planes, time slots, and color frames are shuffled and interleaved within the pixel processing functions of the
DLPC900 controller.
7.3.1 DMD Configurations
Figure 7-4 shows the controller connections for full-bus normal or swapped. Refer to the Firmware section
of the DLP® LightCrafter™ Single DLPC900 Evaluation Module (EVM) User's Guide (DLPU101) or DLP®
LightCrafter™ Dual DLPC900 Evaluation Module (EVM) User's Guide (DLPU102) for details on how to select
the bus swap settings to match the board layout connections.
DLPC900
Full-Bus
A Port Normal
DLPC900
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Full-Bus
A Port Swapped
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Figure 7-4. Controller to DMD Full-Bus Connections
7.3.2 Video Timing Input Blanking Specification
The DLPC900 controller requires a minimum horizontal and vertical blanking for both Port 1 and Port 2 as shown
in Section 6.16. These parameters indicate the time allocated to retrace the signal at the end of each line and
field of a display. Refer to Section 11.1.3.
7.3.3 Board-Level Test Support
The In-Circuit Tri-State Enable signal (ICTSEN) is a board-level test control signal. By driving ICTSEN to a logic
high state, all controller outputs (except TDO1 and TDO2) will be configured as tri-state outputs.
The DLPC900 also provides JTAG boundary scan support on all I/O except non-digital I/O and a few special
signals. Table 7-1 lists these exceptions.
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Table 7-1. DLPC900 –
Signals Not Covered by
JTAG (1)
SIGNAL NAME
PACKAGE
BALL
HW_TEST_EN
M25
MOSC
M26
MOSCN
N26
USB_DAT_N
C5
USB_DAT_P
D6
TCK
N24
TDI
N25
TRSTZ
M23
TDO1
N23
TDO2
N22
TMS1
P25
TMS2
P26
(1)
There is no JTAG connection
to power or no-connect pins.
7.3.4 Two Controller Considerations
When two DLPC900 controllers drive a single DLP500YX, DLP670S, or DLP9000 DMD, each controller is used
to drive half of the DMD, as shown in Two Controllers Connected to DLP9000 DMD. Each controller must
operate in two pixels per clock, and the pixel clock must be maintained below the maximum two pixel per clock
frequency. Only native resolution is supported when two DLPC900 controllers are matched with a DLP500YX,
DLP670S, or DLP9000 DMD.
Figure 7-5. Two Controllers Connected to DLP9000 DMD
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7.3.5 Memory Design Considerations
7.3.5.1 Flash Memory Optimization
The DLPC900 memory configuration can be optimized for different applications. The operating mode chosen
and the application implementation will determine how much optimization can be performed.
7.3.5.2 Operating Modes
The DLPC900 firmware offers four operating modes which can be selected when designing a product for a
particular application.
1.
2.
3.
4.
Video Mode: streamed over parallel RGB interface.
Video Pattern Mode: streamed over parallel RGB interface.
Pre-Stored Pattern Mode: patterns loaded from stored memory.
Pattern On-The-Fly Mode: patterns loaded over USB or I2C interface.
Depending on the application design requirements, the memory required for each operating mode can be
optimized for both performance and cost. This includes reducing the number of flash memory components,
which reduces PCB size and lowers overall product cost. In addition, having fewer components reduces the
power supply requirements hence lowering total power consumption.
7.3.5.3 DLPC900 Memory Space
The memory space of the DLPC900 consists of three chip-selects:
1. CS0
2. CS1 - Power-up boot chip select
3. CS2
The DLPC900 is capable of accessing up to 16-megabytes of memory on each chip-select for a total of
48-megabytes. CS1 contains the firmware, and it is the power-up boot chip-select.
The memory space shown in Figure 7-6 displays how the DLPC900 accesses the memory when memory is
present on all three chip selects. Although the chip-selects are numbered 0, 1, and 2, the way the DLPC900
accesses the memory is not in this order. Notice that the boot flash is located on chip select CS1.
0xF9FFFFFF
0xFAFFFFFF
0xF8FFFFFF
RESERVED
0xF8F00000
Image
storage
Image
storage
Image
storage
Main Application
Bootloader
0xF9000000
0xFA000000
Boot Flash
CS1
0xF8000000
CS2
CS0
Figure 7-6. DLPC900 Memory Space
During the power-up initialization, the DLPC900 firmware performs a query on each chip-select to determine
whether there is memory present. If there is no memory present on CS1, then the DLPC900 will not boot up.
Therefore, flash memory and the firmware must exist on CS1.
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Notice carefully that the addresses from CS2 to CS0 are not ascending linearly in Figure 7-6. Therefore, an
image cannot span across CS2 and CS0. If an image cannot entirely fit in CS2, then the entire image must be
moved and stored in CS0.
If more memory space is required, the DLPC900 memory space can also be organized into a single flash
memory device larger than 48-megabytes. By using the architecture shown in Figure 7-7, a flash memory device
up to 128-megabytes can be attached to the DLPC900. Table 7-2 describes the memory space layout of a
128-megabyte flash device. Similar to memories attached directly to chip selects, an image also cannot span
across memory blocks when using a single large flash memory with the DLPC900.
Figure 7-7. One 128-Megabyte Flash Device
Table 7-2. Flash Device Layout
Memory Block
0
Address Space (Start and End)
Single Flash Memory Addressed
Megabytes
Contents
0xF9000000 - 0xF901FFFF
0x00000000 - 0x0001FFFF
0 - 0.128
0xF9020000 - 0xF913FFFF
0x00020000 - 0x0013FFFF
0.128 - 1.15
Bootloader
Application binary,
Sequences / Patterns
0xF9140000 - 0xF923FFFF
0x00140000 - 0x0023FFFF
1.15 - 2.15
Reserved space
0xF9240000 - 0xF9FFFFFF
0x00240000 - 0x00FFFFFF
2.15 - 15
Patterns only
1
0xFA000000 - 0xFAFFFFFF
0x01000000 - 0x01FFFFFF
16 - 31
Patterns only
2
0xF8000000 - 0xF8FFFFFF
0x02000000 - 0x02FFFFFF
32 - 47
Patterns only
3
0x03000000 - 0x03FFFFFF
0x03000000 - 0x03FFFFFF
48 - 63
Patterns only
4
0x04000000 - 0x04FFFFFF
0x04000000 - 0x04FFFFFF
64 - 79
Patterns only
5
0x05000000 - 0x05FFFFFF
0x05000000 - 0x05FFFFFF
80 - 95
Patterns only
6
0x06000000 - 0x06FFFFFF
0x06000000 - 0x06FFFFFF
96 - 111
Patterns only
7
0x07000000 - 0x07FFFFFF
0x07000000 - 0x07FFFFFF
112 - 127
Patterns only
The design for a single 128-megabyte flash device for storing the firmware consists of the bootloader, the main
application, sequences/images stored in flash (optional), and 1-megabyte of reserved space. The bootloader is
located at the beginning of the flash memory block 0. The size of the bootloader is 128-kilobytes, beginning at
address 0xF9000000. The bootloader is necessary for operation. If the bootloader becomes corrupted in some
way it can render the device inoperable. The bootloader is followed by the main application and then sequence/
image data. As mentioned above, patterns must not span memory block boundaries. If a pattern does not fit
in a given block, the entire 24-bit image (or composite image) must be moved in the next block. Additionally, the
1-megabyte of reserved space in memory block 0 from 0xF9140000 to 0xF923FFFF is necessary for operation
and must not be overwritten.
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7.3.5.4 Minimizing Memory Space
Depending on the application design requirements of the product, the amount of memory can be reduced.
This can include reducing the number of flash memory components or the memory size of the flash memory
component.
As depicted in Figure 7-8, the firmware resides in CS1, and the amount of memory the firmware occupies is
usually less than 128-kilobytes. With this in mind, the design engineer can conclude that memory is only required
to be present on CS1 if no images are needed for the design.
For example, if the application design only requires the DLPC900 to operate in Video Mode, then the flash
memory components on CS0 and CS2 are not required and can be left out. Moreover, since the firmware only
occupies about 128-kilobytes of memory, then a smaller density flash memory component can be used such as
a 4-megabyte rather than a 16-megabyte component. One 4-Megabyte Flash Memory shows the memory space
for this example.
Figure 7-8. One 4-Megabyte Flash Memory
The same memory space shown in One 4-Megabyte Flash Memory also applies to Video Pattern Mode. In
this mode, the images are streamed from an external video source directly in to the internal memory of the
DLPC900. Another operating mode that can use this same memory configuration is Pattern On-The-Fly Mode
because the images are streamed over the USB or I2C interfaces directly into the internal memory of the
DLPC900. These three operating modes are excellent opportunities for minimizing the flash memory because
they don't require images to be stored in flash memory.
However, there exists one mode that can require additional memory because this mode requires images to be
stored in flash memory. When the DLPC900 is operating in Pre-Stored Pattern Mode, the DLPC900 reads all the
required images from flash memory into its internal memory when the pattern sequence is started. The amount
of flash memory depends on the needs of the application.
For example, if the application design requires only a few images, and the images and firmware can fit in one
4-megabyte flash component, then the memory space in One 4-Megabyte Flash Memory can be used. However,
if more memory is needed, then one 8-megabyte or one 16-megabyte flash component can be used as shown in
One 8-Megabyte Flash Memory and One 16-Megabyte Flash Memory.
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Figure 7-9. One 8-Megabyte Flash Memory
Figure 7-10. One 16-Megabyte Flash Memory
When the memory requirement is greater than 16-megabytes but less than 32-megabytes, then two 16megabyte flash components can be used as shown in Two 16-Megabyte Flash Memory Components. Use
CS1 and CS2 when using only two flash components.
Figure 7-11. Two 16-Megabyte Flash Memory Components
When memory requirement exceeds 32-megabytes, use the flash memory space shown in Figure 7-11 or use
a single large flash device as described in Section 7.3.5.5.2. Notice that in all examples, there is a 1-megabyte
space reserved at the end of the Firmware space. The default and maximum size of this reserved space
is 1-megabyte; however, depending on the operating mode, the reserved space is customizable and can be
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reduced by the design engineer when configuring the firmware. Whatever size is chosen, this reserved area
must be taken into consideration when calculating the required amount of memory.
7.3.5.5 Minimizing Board Size
Reducing the number of flash components saves valuable board area and reduces the cost of the PCB. There
are two additional ways to reduce cost: package selection and using larger density flash.
7.3.5.5.1 Package Selection
The first way is to use a smaller package type for the flash memory. Most of the flash memory components that
can be used with the DLPC900 also come in alternate packages. For example, selecting a BGA package can be
more than 50% smaller compared to a TSOP package.
7.3.5.5.2 Large Density Flash
The second way is to use a larger density flash memory component to combine two or all three flash memory
components into one flash component. However, using this method requires some additional low cost external
logic gates to combine the chip-selects and create and invert signals for the extra address lines. The other
requirement is the flash memory component must contain uniform sectors where each sector is 128kilobytes in size.
7.3.5.5.2.1 Combining Two Chip-Selects with One 32-Megabyte Flash
One use case is when the memory requirement for a design is greater than 16-megabytes but less than
32-megabytes. In this case, rather than using two 16-megabyte flash components, use only one 32-megabyte
component. One 32-Megabyte Flash Component shows a block diagram describing how to combine CS1 and
CS2 with external logic gates, as well as the connections between the DLPC900 and the flash component.
Figure 7-12. One 32-Megabyte Flash Component
7.3.5.5.2.1.1 Combining Three Chip-Selects with One 64-Megabyte Flash
Another use case is when the memory requirement exceeds 32-megabytes but is less than 64-megabytes. In
this case, a single flash device up to 64-megabytes can be used. Figure 7-13 shows a block diagram describing
how to combine CS0, CS1, CS2, and GPIO45 with external logic gates, as well as the connections between the
DLPC900 and the flash component.
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Figure 7-13. One 64-Megabyte Flash Component
7.3.5.5.2.2 Combining Three Chip-Selects with One 128-Megabyte Flash
The other use case is when the memory requirement exceeds 64-megabytes. In this case, a single flash device
up to 128-megabytes can be used. Figure 7-14 shows a block diagram describing how to combine CS0, CS1,
CS2, GPIO45, and GPIO46 with the required external logic gates and the connections between the DLPC900
and the flash component.
Figure 7-14. One 128-Megabyte Flash Component
Note
Flash devices that are larger than 128-megabytes can also be used with the DLPC900, but the
DLPC900 is only capable of accessing 128-megabytes. The other sectors within the flash device will
go unused.
Note
GPIO45, GPIO46, and GPIO60 are exclusively used by the DLPC900 as extended flash address
lines. These GPIO are not to be utilized for any other purpose.
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7.3.5.6 Minimizing Board Space
Figure 7-15 shows how to minimize board space by selecting the next larger density of flash memory. For
example, if two 4-megabyte flash components are needed, then selecting one 8-megabyte flash component can
be considered. This will save board space because only one component takes up space on the board rather
than two components.
Figure 7-15. Selecting Next Larger Density for Board Space Savings
When calculating the appropriate amount of memory to use, do not mix densities to come up with the exact
amount of memory that is calculated. Always use the same densities of flash memory even if it exceeds the
amount of memory that is calculated.
7.3.5.7 Flash Memory
Flash changes will require a change to the flash parameters file. This file must be changed to match the flash
device info for the selected device including the sector mapping of the device.
The following is a list of flash memory that was used and tested on the DLP® LightCrafter™ Single DLPC900
Evaluation Module and DLP® LightCrafter™ Dual DLPC900 Evaluation Module. The reader can consult the
datasheet for alternate package types that exist for each of the components listed. There are other flash
memories that can be substituted, and the reader must consult the datasheets to ensure compatibility.
Micron
MT28EW256ABA1LJS1
MT28EW512ABA1LJS1
MT28FW02GBBA1HPC1
Cypress
S29GL032N90TFI010
S29GL064N90TFI010
S70GL02GS12FHIV101
1
48
These flash components must have uniform sectors, where each sector is 128-kilobytes in size
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7.4 Device Functional Modes
7.4.1 Structured Light Application
For structured light applications, the DLPC900 can be commanded to enter the following high speed sequential
pattern modes.
1. Video Pattern Mode
2. Pre-Stored Pattern Mode
3. Pattern On-The-Fly Mode
In each mode a specific set of patterns are selected with a maximum of 24 bits per pixel. The bit-depth of
the patterns are then allocated into the corresponding time slots. Furthermore, an output trigger signal is also
synchronized with these time slots to indicate when the image is displayed.
These pattern modes provide the capability to display a set of patterns and signal a camera to capture these
patterns overlaid on an object. The DLPC900 controller is capable of pre-loading up to 400 1-bit binary patterns
into internal memory from the external flash memory or from the USB or I2C interfaces. These pre-loaded binary
patterns are then streamed to the DMD at high speed.
Note
The DLPC900 internal DRAM is capable of holding 400 1-bit images. However, when using PreStored Pattern Mode the number of patterns that can be stored in External Flash depends on the size
of the external flash and level of compression achievable.
The DLPC900 controller is capable of synchronizing a camera to the displayed patterns. In video pattern mode,
the vertical sync is used as trigger input. In pre-stored pattern mode and pattern on-the-fly mode, an internal
user configurable trigger or a TRIG_IN_1 pulse indicates to the DLPC900 controller to advance to the next
pattern, while TRIG_IN_2 starts and stops the pattern sequence. In all pattern modes, TRIG_OUT_1 frames the
exposure time of the pattern, while TRIG_OUT_2 indicates the start of the pattern sequence.
Figure 7-16 shows an example timing diagram of video pattern mode. The VSYNC starts the pattern sequence
display. The pattern sequence consists of a series of four patterns followed by a series of three patterns and
then repeats. The first pattern sequence consists of P1, P2, P3, and P4. The second pattern sequence consists
of P5, P6, and P7. TRIG_OUT_1 frames each pattern exposed, while TRIG_OUT_2 indicates the start of each
pattern in the sequence. If the pattern sequence is configured without dark time between patterns, then the
TRIG_OUT_1 output would be high for the entire pattern sequence.
Figure 7-16. Video Pattern Mode Timing Diagram
Figure 7-17 shows an example of a pre-stored pattern mode timing diagram. Pattern sequences of four are
displayed. TRIG_OUT_1 frames each pattern exposed, while TRIG_OUT_2 indicates the start of each pattern in
the sequence. If the pattern sequence is configured without dark time between patterns, then the TRIG_OUT_1
output would be high for the entire pattern sequence.
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Figure 7-17. Pre-Stored Pattern Mode Timing Diagram
Another example of a pre-stored pattern mode timing diagram is shown in Figure 7-18, where pattern sequences
of three are displayed. TRIG_OUT_1 frames each pattern displayed, while TRIG_OUT_2 indicates the start of
each pattern. TRIG_IN_2 serves as a start and stop signal. When high, the pattern sequence starts or continues.
Note, in the middle of displaying the P4 pattern, TRIG_IN_2 is low, so the sequence stops displaying P4. When
TRIG_IN_2 is raised, the pattern sequence continues where it stopped by re-displaying P4.
Figure 7-18. Pre-Stored Pattern Mode Timing Diagram for 3-Patterns
Table 7-3 shows the allowed pattern combinations in relation to the bit depth of the pattern. If the pattern
sequence is configured without dark time between patterns, then the TRIG_OUT_1 output would be high for
the entire pattern sequence. For faster 8-bit pattern speeds, the illumination source can be modulated to
shorten the smallest bits, and thus the larger bits. This method will introduce dark time into the pattern and
affect the brightness, but it is capable of 8-bit pattern speeds up to four times faster than patterns without
illumination modulation. More information on illumination modulation can be found in the DLP® LightCrafter™
Single DLPC900 Evaluation Module (EVM) User's Guide (DLPU101) or DLP® LightCrafter™ Dual DLPC900
Evaluation Module (EVM) User's Guide (DLPU102).
Table 7-3. Minimum Exposure in Any Pattern Mode
BIT DEPTH
DLP6500
(µs)
DLP9000
(µs)
1
105
2
304
3
4
(1)
DLP500YX
(µs)
DLP670S
(µs)
105
62
105
304
184
343
394
380
269
438
823
733
458
768
5
1215
1215
682
1299
6
1487
1487
807
1488
7
1998
1998
1083
2000
8
4046
4046
2263
4046
8(1)
969
969
496
969
Minimum achievable exposure using illumination modulated
light source.
Table 7-4 shows the minimum pattern exposure time for a 1-bit pattern in relation to the number of active DMD
blocks.
50
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Table 7-4. Minimum Exposures for Number of Active
DMD Blocks
ACTIVE
BLOCKS
DLP6500
(µs)
DLP9000
(µs)
DLP500YX
(µs)
DLP670S
(µs)
1
24
24
30
27
2
45
42
30
27
3
45
42
30
27
4
45
42
30
33
5
48
45
34
38
6
54
51
38
38
7
60
56
42
49
8
66
61
46
55
9
72
67
50
61
10
78
72
54
66
11
84
77
58
72
12
90
83
62
77
13
96
88
N/A
83
14
101
93
N/A
89
15
105
99
N/A
94
16
N/A
105
N/A
100
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The DLPC900 controller is required to be coupled with the DLP6500, DLP9000, DLP500YX, or DLP670S DMDs
to provide a reliable display solution for video display and structure light applications. The DLPC900 converts
the digital input data into the digital format needed by the DLP6500, DLP9000, DLP500YX, or DLP670S DMDs.
The DMDs consist of an array of micromirrors which reflect incoming light to one of two directions by using
binary pulse-width-modulation (PWM) for each micromirror, where the primary direction being into a projection or
collection optics. Applications of interest include 3D machine vision, 3D printing, direct imaging lithography, and
intelligent lighting.
8.2 Typical Applications
8.2.1 Typical Two Controller Chipset
A typical embedded system application using the DLPC900 controller and DLP9000, DLP500YX, or DLP670S
DMD is shown in Figure 8-1. This configuration requires two DLPC900 controllers to drive a DLP9000,
DLP500YX, or DLP670S DMD and supports a 24-bit parallel RGB input, typical of LCD interfaces, from an
external source or processor. In this configuration, the 24-bit parallel RGB input data is split between the primary
and the secondary controller as described in Section 7.3.4 using an FPGA or some other mechanism.
This system supports both still and motion video sources with the input resolution native to the DLP9000,
DLP500YX, or DLP670S DMD. However, the controller supports only sources with periodic synchronization
pulses. This support is ideal for motion video sources, but can also be used for still images by maintaining
periodic syncs and sending a new frame of data only when needed. The still image must be fully contained
within a single video frame and meet the frame timing constraints. The DLPC900 controller refreshes the
displayed image at the source frame rate and repeats the last active frame for intervals in which no new frame
has been received.
This configuration also supports the high-speed sequential pattern modes mentioned in the Section 7.4.1. The
patterns can be from the video source, from the USB or I2C interface, or pre-stored in external flash, and have a
maximum of 24 bits per pixel. The patterns are pre-loaded into the internal embedded DRAM and then streamed
to the DLP9000, DLP500YX, or DLP670S DMD at high speeds.
52
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Figure 8-1. Typical Application Schematic for DLP9000, DLP500YX, or DLP670S
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8.2.1.1 Design Requirements
All applications require both the controller and DMD components for reliable operation. The system uses
an external parallel flash memory device loaded with the DLPC900 configuration and support firmware. The
external boot flash must contain a minimum of 2 sectors, where the first sector starts at address 0xF9000000
which is the power-up reset start address. The first 128-kilobytes is reserved for the bootloader image and must
be in its own sector and can be made up of several smaller contiguous sectors that add up to 128-kilobytes as
shown in Figure 8-2. The remaining sectors contains the rest of the firmware. The default wait-states is set for a
flash device of 120-ns access time. For a faster flash access time, refer to the Section 8.2.1.2.1.4.2 on how to
program new wait-state values.
Figure 8-2. Boot Flash Memory Layout
Note
The bootloader, the main application, and any images stored in flash (if present) are considered the
firmware.
The chipset has the following interfaces and support circuitry:
•
•
•
54
DLPC900 System Interfaces
– Control Interfaces
– Trigger Interface
– Input Data Interfaces
– Illumination Interface
DLPC900 Support Circuitry and Interfaces
– Reference Clock
– PLL
– Program Memory Flash Interface
DMD Interface
– DLPC900 to DLP6500/DLP9000/DLP500YX/DLP670S Digital Data
– DLPC900 to DLP6500/DLP9000/DLP500YX/DLP670S Control and Clock Interface
– DLPC900 to DLP6500/DLP9000/DLP500YX/DLP670S Serial Communication Interface
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8.2.1.2 Detailed Design Procedure
8.2.1.2.1 DLPC900 System Interfaces
The DLPC900 chipset supports a 24-bit parallel RGB interface for image data transfers from another device and
a 24-bit interface for video data transfers. The system input requires proper generation of the PWRGOOD and
POSENSE inputs to ensure reliable operation. There are two primary output interfaces: illumination driver control
interface and sync outputs.
8.2.1.2.1.1 Control Interface
The DLPC900 chipset supports I2C or USB commands through the control interface. The control interface allows
another primary processor to send commands to the DLPC900 controller to query system status or perform
real-time operations, such as, LED driver current settings. The DLPC900 allows the user to set a different I2C
slave address for the host port. Refer to the DLPC900 Programmer's Guide to set a different I2C master and
slave addresses.
Table 8-1. Active Signals – I2C Interfaces
SIGNAL NAME
DESCRIPTION
I2C2_SCL
I2C clock. Bidirectional open-drain signal. I2C master clock to external devices.
I2C2_SDA
I2C data. Bidirectional open-drain signal. I2C master to transfer data to external devices.
I2C1_SCL
I2C clock. Bidirectional open-drain signal. I2C master clock to external devices.
I2C1_SDA
I2C data. Bidirectional open-drain signal. I2C master to transfer data to external devices.
I2C0_SCL (1)
I2C clock. Bidirectional open-drain signal. I2C slave clock input from the external processor.
I2C0_SDA (1)
I2C data. Bidirectional open-drain signal. I2C slave to accept commands or transfer data to and from the external
processor.
(1)
This interface is the host port.
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8.2.1.2.1.2 Input Data Interfaces
The data interface has a Parallel RGB input port and has a nominal I/O voltage of 3.3 V. Maximum and minimum
input timing specifications for both components are provided in the Interface Timing Requirements. Each parallel
RGB port can support up to 24 bits in Video Mode.
Table 8-2. Active Signals – Data Interface
SIGNAL NAME
DESCRIPTION
RGB Parallel Interface Port 1
P1_(A, B, C)_[2:9] (1)
24-bit data inputs, 8 bits for each of the red, green, and blue channels. When interfacing to a system with 8-bits per
color or less, connect the bus of the red, green, and blue channels to the upper bits of the DLPC900 10-bit bus.
P_CLK1
Pixel clock; all input signals on data interface are synchronized with this clock.
P1_VSYNC
Vertical sync
P1_HSYNC
Horizontal sync
P_DATAEN1
Input data valid
RGB Parallel Interface Port 2
P2_(A, B, C)_[0:9] (1)
24-bit data inputs, 8 bits for each of the red, green, and blue channels. When interfacing to a system with 8-bits per
color or less, connect the bus of the red, green, and blue channels to the upper bits of the DLPC900 10-bit bus.
P_CLK2
Pixel clock; all input signals on data interface are synchronized with this clock.
P2_VSYNC
Vertical sync
P2_HSYNC
Horizontal sync
P_DATAEN2
Input data valid
Optional Pixel Clock 3
P_CLK3
(1)
56
Pixel clock; all input signals on data interface are synchronized with this clock.
The A, B, and C input data channels of Port 1 and 2 can be internally swapped for optimum board layout. Refer to the DLPC900
Programmers Guide for details on how to configuring the port settings to match the board layout connections.
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8.2.1.2.1.3 DLPC900 System Output Interfaces
DLPC900 system output interfaces include the illumination interface as well as the trigger and sync interface.
8.2.1.2.1.3.1 Illumination Interface
An illumination interface is provided that supports up to a three (3) channel LED driver. The illumination interface
provides signals that support: LED driver enable, LED enable, LED enable select, and PWM signals to control
the LED current.
Table 8-3. Active Signals - Illumination Interface
SIGNAL NAME
DESCRIPTION
HEARTBEAT
Signal toggles continuously to indicate system is running fine.
FAULT_STATUS
Signal toggles or held high indicating system faults
RED_LED_EN
Red LED enable
GRN_LED_EN
Green LED enable
BLU_LED_EN
Blue LED enable
RED_LED_PWM
Red LED PWM signal used to control the LED current
GRN_LED_PWM
Green LED PWM signal used to control the LED current
BLU_LED_PWM
Blue LED PWM signal used to control the LED current
8.2.1.2.1.3.2 Trigger and Sync Interface
The DLPC900 outputs a trigger signal for synchronizing displayed patterns with a camera, sensor, or other
peripherals. The sync output supporting signals are: horizontal sync, vertical sync, two input triggers, and two
output triggers. Depending on the application, these signals control how the pattern is displayed.
Table 8-4. Active Signals - Trigger and Sync Interface
SIGNAL NAME
DESCRIPTION
P1_HSYNC
Horizontal Sync
P1_VSYNC
Vertical Sync
TRIG_IN_1
Depending on the mode, advances the pattern display.
TRIG_IN_2
Depending on the mode, starts or stops the pattern display.
TRIG_OUT_1
Active high during pattern exposure
TRIG_OUT_2
Active high pulse to indicate first pattern display
8.2.1.2.1.4 DLPC900 System Support Interfaces
8.2.1.2.1.4.1 Reference Clock and PLL
The DLPC900 controller requires a 20-MHz 3.3-V external input from an oscillator. This signal serves as the
DLPC900 chipset reference clock from which the majority of the interfaces derive their timing. This includes
DMD interfaces and serial interfaces.
Refer to Section 10.1.2 on PLL guidelines.
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8.2.1.2.1.4.2 Program Memory Flash Interface
The DLPC900 provides three external program memory chip selects for standard NOR-type flash:
•
•
•
PM_CSZ_0 – flash device (≤ 16-megabytes )
PM_CSZ_1 – dedicated CS for boot flash device (≤ 16-megabytes ). Refer to the Figure 8-2 for the memory
layout of the boot flash.
PM_CSZ_2 – flash device (≤ 16-megabytes )
Flash access timing is programmable up to 19 wait-states. Table 8-5 contains the formulas to calculate the
required wait-states for each of the parameters shown in Figure 8-3 for a typical flash device. Refer to the
DLPC900 Programmers Guide for details on how to set new wait-state values.
Table 8-5. Flash Wait-States
FORMULA (1)
PARAMETER
DEFAULT
TCS (CSZ low to WEZ low )
= Roundup((TCS+ 5 ns) / 6.7 ns)
2
TWP (WEZ low to WEZ high)
= Roundup((TWP+ 5 ns) / 6.7 ns)
11
TCH (WEZ high to CSZ high )
= Roundup((TCH+ 5 ns) / 6.7 ns)
2
TACC (CSZ low to Output Valid ) (2)
= Roundup((TACC+ 5 ns) / 6.7 ns)
19
19 (120ns) (3)
Maximum supported wait-states
(1)
(2)
(3)
Assumes a maximum single direction trace length of 75 mm.
In some flash device data sheets, the read access time can also be represented as TOE, TE, TRC, or TCE. Use the largest of these
values to calculate the wait-states for the read access time.
For each parameter.
READ
WRITE
CSZ
TCS
TWP
TCH
WEZ
TACC
OEZ
DATA
WD15:0
WD31:16
RD15:0
RD31:16
Figure 8-3. Flash Interface Timing Diagram
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8.2.1.2.1.4.3 DMD Interface
The DLPC900 controller provides the pattern data to the DMD over a double data rate (DDR) interface. Table 8-6
describes the signals used for this interface.
Table 8-6. Active Signals - DLPC900 to DMD Digital Data Interface
SIGNAL NAME
DESCRIPTION
DDA(15:0)
DMD, LVDS interface channel A, differential serial data
DDB(15:0)
DMD, LVDS interface channel B, differential serial data
DCKA
DMD, LVDS interface channel A, differential clock
DCKB
DMD, LVDS interface channel B, differential clock
SCA
DMD, LVDS interface channel A, differential serial control
SCB
DMD, LVDS interface channel B, differential serial control
The DLPC900 controls the micromirror clock pulses in a manner to ensure proper and reliable operation of the
DMD.
Table 8-7. Active Signals - DLPC900 to DMD Control Interface
SIGNAL NAME
DADOEZ
DESCRIPTION
DMD output-enable (active low)
DADADDR(3:0) DMD address
DADMODE(1:0) DMD mode
DADSEL(1:0)
DMD select
DADSTRB
DMD strobe
DAD_INTZ
DMD interrupt (active low). This signal requires an external 1-KΩ pullup and uses hysteresis.
The DLPC900 controls the micromirror control interface signals in a manner to ensure proper and reliable
operation of the DMD.
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8.2.2 Typical Single Controller Chipset
A typical embedded system application using the DLPC900 controller and DLP6500 is shown in Figure 8-4. This
configuration uses one DLPC900 controller to operate with a DLP6500 and supports a 24-bit parallel RGB input,
typical of LCD interfaces, from an external source or processor.
This system supports both still and motion video sources. However, the controller only supports sources with
periodic synchronization pulses. This is ideal for motion video sources, but can also be used for still images by
maintaining periodic syncs and only sending a new frame of data when needed. The still image must be fully
contained within a single video frame and meet the frame timing constraints. The DLPC900 controller refreshes
the displayed image at the source frame rate and repeats the last active frame for intervals in which no new
frame has been received.
This configuration also supports the high speed sequential pattern modes mentioned in the Section 7.4.1. The
patterns can be from the video source, from the USB or I2C interface, or pre-stored in external flash, and have a
maximum of 24 bits per pixel. The patterns are pre-loaded into the internal embedded DRAM and then streamed
to the DLP6500 at high speeds.
Figure 8-4. Typical Application Schematic for DLP6500
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9 Power Supply Recommendations
9.1 System Power Regulation
The PLLD_VAD, PLLM1_VAD, and PLLM2_VAD power feeding internal PLLs must be derived from an isolated
linear regulator with filter as recommended in Section 10.1.2 to minimize the AC noise component.
It is acceptable to derive PLLD_VDD, PLLM1_VDD, PLLM2_VDD, and PLLS_VAD from the same regulator as
the core VDDC, but they must be filtered as recommended in the Section 10.1.2.
DLPC900
Regulator 1.15V
Vout
1.15V Core & eDRAM I/O
Regulator 1.8V
Vout
Filter
1.15V PLLs
Filter
1.8V PLLs
Regulator 1.8V
Vout
1.8V DMD I/O & eDRAM
Regulator
Vout
3.3V
3.3V
DC
GND
Voltage
Monitors
PWRGOOD
PWRGOOD
POSENSE
POSENSE
Figure 9-1. Power Regulation
9.1.1 Power Distribution System
9.1.1.1 1.15-V System Power
The DLPC900 can support a low-cost power delivery system with a single 1.15-V power source derived from a
switching regulator. The main core can receive 1.15 V power directly from the regulator output, and the internal
DLPC900 PLLs (PLLD_VDD, PLLM1_VDD, PLLM2_VDD, and PLLS_VAD) must receive individually filtered
versions of this 1.15 V power. For specific filter recommendations, refer to the Section 10.1.2.
9.1.1.2 1.8-V System Power
The DLPC900 power delivery system provides two independent 1.8-V power sources. One of the 1.8-V power
sources is used to supply 1.8-V power to the DLPC900 LVDS I/O and internal DRAM. Power for these functions
must always be fed from a common source, which is recommended as a linear regulator. The second 1.8-V
power source is used (along with appropriate filtering as discussed in the Section 10.1.2) to supply all of the
DLPC900 internal PLLs (PLLD_VAD, PLLM1_VAD, and PLLM2_VAD). To keep this power as clean as possible,
a dedicated linear regulator is highly recommended for the 1.8-V power to the PLLs.
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9.1.1.3 3.3-V System Power
The DLPC900 can support a low-cost power delivery system with a single 3.3-V power source derived from a
switching regulator. This 3.3-V power will supply all LVTTL I/O and the crystal oscillator cell. The 3.3-V power
must remain active in all power modes for which 1.15-V core power is applied.
9.2 System Environment and Defaults
9.2.1 DLPC900 System Power-Up and Reset Default Conditions
Following system power-up, the DLPC900 will perform a power-up initialization routine that will default the
controller to its normal power mode in which all blocks are powered, all processor clocks will be enabled at their
full rate and associated resets will be released. Most other clocks will default disabled with associated resets
asserted until released by the processor. These same defaults will also be applied as part of all system reset
events that occur without removing or cycling power. The 1.8-V power must be applied prior to releasing the
reset so that the LVDS I/O and the internal embedded DRAM are enabled before the DLPC900 begins executing
its system initialization routines.
9.3 System Power-Up Sequence
Although the DLPC900 requires an array of power supply voltages, for example, 1.15 V, 1.8 V, and 3.3 V, there
are no restrictions regarding the relative order of power supply sequencing to avoid damaging the DLPC900,
as long as the system is held in reset during power supply sequencing. This is true for both power-up (reset
controlled by POSENSE) and power-down (reset controlled by PWRGOOD) scenarios. Similarly, there is no
minimum time between powering-up or powering-down the different supplies feeding the DLPC900. However,
power-sequencing requirements are common for the devices that share the supplies with the DLPC900.
Power-sequencing recommendations to ensure proper operation are:
•
•
1.15-V core power must be applied whenever any I/O power is applied. This ensures the state of the
associated I/O that are powered are set to a known state. Thus, applying core power first is recommended.
All DLPC900 power must be applied before POSENSE is asserted to ensure proper power-up initialization is
performed.
It is assumed that all DLPC900 power-up sequencing is handled by external hardware. It is also assumed that
an external power monitor will hold the DLPC900 in system reset during power-up (that is, POSENSE = 0).
During this time all controller I/O's will be tri-stated. The primary PLL (PLLM1) will be released from reset upon
the low-to-high transition of POSENSE, but the DLPC900 will be kept in reset for an additional 60 ms to allow
the PLL to lock and stabilize its outputs. After this delay the DLPC900 internal resets will be deasserted, thus
causing the processor to begin its boot-up routine.
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Figure 9-2 shows the recommended DLPC900 system power-up sequence of the regulators:
Figure 9-2. Power Sequencing
9.3.1 Power-On Sense (POSENSE) Support
It is difficult to set up a power monitor to trip exactly on the controller minimum supply voltage specification. Thus
for practical reasons, the external power monitor generating POSENSE must target its threshold to 90% of the
minimum supply voltage specifications and ensure that POSENSE remains low a sufficient amount of time for all
supply voltages to reach minimum DLPC900 and DMD requirements and stabilize. The trip voltage for detecting
the loss of power, as well as the reaction time to respond to a low voltage condition is critical for powering down
the DMD. Refer to Section 6.7 for details on powering up and powering down the DLPC900 and the DMD.
9.3.2 Power Good (PWRGOOD) Support
The PWRGOOD signal is defined as an early warning signal that alerts the DLPC900 of the DC supply voltages
will drop below specifications. This warning lets the DLPC900 park the DMD mirrors and place the system into
reset. For revision "B" DMDs and later, PWRGOOD can no longer be used as an early warning signal, and must
follow the power-down requirements in Section 6.7.
9.3.3 5-V Tolerant Support
With the exception of USB_DAT, the DLPC900 does not support any other 5-V tolerant I/O. However, I2C
typically have 5V requirements and special measures must be taken to support them. It is recommended that a
5-V to 3.3-V level shifter be used.
It is strongly recommended that a 0.5-W external series resistance (of 22 Ω) to limit the potential impact of a
continuous short circuit between either USB D+ or USB D– to either Vbus, GND, the other data line, or the
cable. For additional protection, also add an optional 200-mA Schottky diode from USB_DAT to VDD33.
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9.4 System Reset Operation
9.4.1 Power-Up Reset Operation
Immediately after a power-up event, DLPC900 hardware will automatically bring up the primary PLL and place
the controller in normal power mode. It will then follow the standard system reset procedure (see Section 9.4.2).
9.4.2 System Reset Operation
Immediately after any type of system reset (power-up reset, PWRGOOD reset, watchdog timer time-out, and so
forth), the DLPC900 automatically returns to normal power mode and returns to the following state:
•
•
•
•
•
•
•
All GPIO will tri-state.
The primary PLL will remain active (it is only reset on a power-up reset) and most of the derived clocks will
be active. However, only those resets associated with the DLPC900 processor and its peripherals will be
released. (The DLPC900 firmware is responsible for releasing all other resets).
The DLPC900 associated clocks will default to their full clock rates (boot-up is at full speed).
The PLL feeding the LVDS DMD interface (PLLD) will default to its power-down mode and all derived clocks
will be inactive with corresponding resets asserted. (The DLPC900 firmware is responsible for enabling these
clocks and releasing associated resets).
LVDS I/O will default to its power-down mode with tri-stated outputs.
All resets output by the DLPC900 will remain asserted until released by the firmware (after boot-up).
The DLPC900 processor will boot-up from external flash.
Once the DLPC900 processor boots-up, the DLPC900 firmware will:
•
•
•
•
•
Configure the programmable DDR clock generator (DCG) clock rates (that is, the DMD LVDS interface rate)
Enable the DCG PLL (PLLD) while holding divider logic in reset
After the DCG PLL locks, the processor software will set DMD clock rates
API software will then release DCG divider logic resets, which in turn, will enable all derived DCG clocks
Release external resets
The LVDS I/O is reset by a system reset event and remains in reset until released by the DLPC900 firmware.
Thus, the software is responsible for waiting until power is restored to these components before releasing reset.
64
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10 Layout
10.1 Layout Guidelines
10.1.1 General PCB Recommendations
Two-ounce copper planes are recommended in the PCB design in order to achieve needed thermal connectivity.
10.1.2 PCB Layout Guidelines for Internal Controller PLL Power
The following are guidelines to achieve desired controller performance relative to internal PLLs:
The DLPC900 contains four PLLs (PLLM1, PLLM2, PLLD, and PLLS), each of which have a dedicated 1.15
V digital supply; three of these PLLs (PLLM1, PLLM2, and PLLD) have a dedicated 1.8 V analog supply. It is
important to have filtering on the supply pins that covers a broad frequency range. Each 1.15 V PLL supply
pin must have individual high frequency filtering in the form of a ferrite bead and a 0.1 µF ceramic capacitor.
These components must be located very close to the individual PLL supply balls. The impedance of the ferrite
bead should far exceed that of the capacitor at frequencies above 10 MHz. The 1.15 V to the PLL supply pins
must also have low frequency filtering in the form of an RC filter. This filter can be common to all the PLLs. The
voltage drop across the resistor is limited by the 1.15 V regulator tolerance and the DLPC900 voltage tolerance.
A resistance of 0.36 Ω and a 100 µF ceramic are recommended. Figure 10-1 shows the recommended filter
topology.
Regulator
Vout
DLPC900
1.15V
1.15V Core
DC
R=0.36
F
GND
100 F
GND
0.1 F
1.15V PLL1
0.1 F
GND
GND
1.15V PLL2
F
0.1 F
GND
F
1.15V PLL3
0.1 F
GND
VPLL
F
0.1 F
GND
Figure 10-1. Recommended Filter Topology for PLL 1.15-V Supplies
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The analog 1.8-V PLL power pins must have a similar filter topology as the 1.15-V. In addition, it is
recommended that a dedicated linear regulator generates the 1.8-V. Figure 10-2 shows the recommended
filtering topology.
DLPC900
Regulator
Vout
1.8V
R=1
F
1.8V PLL1
DC
100 F
GND
GND
0.1 F
0.1 F
GND
GND
1.8V PLL2
F
0.1 F
GND
1.8V PLL3
F
0.1 F
GND
Figure 10-2. Recommended Filter Topology for PLL 1.8-V Supplies
When designing the overall supply filter network, care must be taken to ensure no resonance occurs. Specific
care is required around the 1- to 2-MHz band, as this coincides with the PLL natural loop frequency.
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Signal VIA
PCB Pad
VIA to Common Analog /
Digital Board Power Plane
ASIC Pad
22
VIA to Common Analog /
Digital Board Ground Plane
23
24
25
26
Local
Decoupling for
PLL Supplies
(view from top
of board)
A
PLLD_
VAS
K
0.1uF
FB
PLLD_
VAD
PLLD_
VDD
PLLD_
VSS
PLLM1_
VAD
PLLM1_
VAS
PLLM1_
VDD
L
0.1uF
0.1uF
FB
FB
0.1uF
PLLM2_
VDD
PLLM2_
VSS
PLLS_
VAD
PLLS_
VAS
MOSC
M
MOSCN
N
0.1uF
FB
PLLM1_
VSS
MOSC Crystal
Oscillator
P
PLLM2_
VAD
PLLM2_
VAS
R
0.1uF
0.1uF
FB
FB
FB
Figure 10-3. High Frequency Decoupling
High-frequency decoupling is required for 1.15-V and 1.8-V PLL supplies and must be provided as close as
possible to each of the PLL supply package pins as shown in Figure 10-3. Placing decoupling capacitors
under the package on the opposite side of the board is recommended. High-quality, low-ESR, monolithic,
surface-mount capacitors are recommended for use. Typically, 0.1 µF for each PLL supply should be sufficient.
The length of a connecting trace increases the parasitic inductance of the mounting, and thus, where possible,
there can be no trace, allowing the via to butt up against the land. Additionally, the connecting trace must be
made as wide as possible. Further improvement can be made by placing vias to the side of the capacitor lands
or doubling the number of vias.
The location of bulk decoupling depends on the system design.
10.1.3 PCB Layout Guidelines for Quality Video Performance
One of the most important factors to gain good performance is designing the PCB with the highest quality signal
integrity possible. Here are a few recommendations:
1.
2.
3.
4.
Minimize the trace lengths between the video digital receiver and the DLPC900 port inputs.
Analog power must not be shared with the digital power directly.
Try to keep the trace lengths of the RGB as equal as possible.
Impedance matching between the digital receiver and the DLPC900 is important.
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10.1.4 Recommended MOSC Crystal Oscillator Configuration
A recommended crystal oscillator configuration is shown in Figure 10-4.
It is assumed that the external crystal oscillator will stabilize within 50 ms after stable power is applied.
Table 10-1. Crystal Port Characteristics
PARAMETER
NOMINAL
UNIT
MOSC-to-GND capacitance
1.5
pF
MOSCZ-to-GND capacitance
1.5
pF
Table 10-2. Recommended Crystal Configuration (1)
PARAMETER
Crystal circuit configuration
Crystal type
RECOMMENDED
UNIT
Parallel resonant
Fundamental (first harmonic)
Crystal nominal frequency
20
MHz
Crystal temperature stability
± 30
PPM
Crystal frequency tolerance (including accuracy,
temperature, aging, and trim sensitivity)
± 100
PPM
50 max
Ω
20
pF
7 max
pF
Crystal equivalent series resistance (ESR)
Crystal load
Crystal shunt load
RS drive resistor (nominal)
100
Ω
1
MΩ
CL1 external crystal load capacitor (MOSC)
See Equation 1
pF
CL2 external crystal load capacitor (MOSCN)
See Equation 2
pF
RFB feedback resistor (nominal)
PCB layout
(1)
A ground isolation ring around the crystal is recommended
Typical drive level with the XSA020000FK1H-OCX crystal (ESRmax = 40 Ω) = 50 µW
CL1 = 2 × (CL – CStray-MOSC)
(1)
CL2 = 2 × (CL – CStray-MOSCN
(2)
(3)
where
•
•
•
68
CL = Crystal load capacitance (Farads)
CStray-MOSC = Sum of package and PCB capacitance at the crystal pin associated with controller signal
MOSC.
CStray-MOSCN = Sum of package and PCB capacitance at the crystal pin associated with controller signal
MOSCN.
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MOSC
MOSCN
RFB
(Crystal)
RS
CL1
CL2
Figure 10-4. Crystal Oscillator Configuration
10.1.5 Spread Spectrum Clock Generator Support
DLPC900 supports limited, internally controlled, spread spectrum clock spreading on the DMD interface. The
purpose is to frequency-spread all signals on this high-speed external interface to reduce EMI emissions. Clock
spreading is limited to triangular waveforms. The DLPC900 provides modulation options of 0%, ±0.5%, and
±1.0% (center-spread modulation).
10.1.6 GPIO Interface
The DLPC900 provides 9 software-programmable, general-purpose I/O pins. Each GPIO pin is individually
configurable as either input or output. In addition, each GPIO output can be either configured as push-pull or
open-drain. Some GPIO have one or more alternative use modes, which are also software configurable. The
reset default for all GPIO is as an input signal. However, any alternative function connected to these GPIO
pins, with the exception of general-purpose clocks and PWM generation, will be reset. When configured as
open-drain, the outputs must be externally pulled-up (to the 3.3-V supply). External pullup or pulldown resistors
can be required to ensure stable operation before software can configure these ports.
10.1.7 General Handling Guidelines for Unused CMOS-Type Pins
To avoid potentially damaging current caused by floating CMOS input-only pins, it is recommended tying
unused controller input pins through a pullup resistor to its associated power supply or through a pulldown
to ground unless noted in the Pin Functions. For controller inputs with an internal pullup or pulldown resistor,
it is unnecessary to add an external pullup or pulldown unless specifically recommended. Internal pullup and
pulldown resistors are weak and must not be expected to drive the external line.
Unused output-only pins can be left open.
When possible, it is recommended to configure unused bidirectional I/O pins to their output state such that the
pin can be left open. If this control is not available and the pins become an input, then they must be pulled-up (or
pulled-down) using an appropriate resistor unless noted in the Pin Functions.
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10.1.8 DMD Interface Considerations
High-speed interface waveform quality and timing on the DLPC900 controller (that is, the LVDS DMD interface)
is dependent on the following factors:
•
•
•
•
•
Total length of the interconnect system
Spacing between traces
Characteristic impedance
Etch losses
How well matched the lengths are across the interface
Thus, ensuring positive timing margin requires attention to many factors.
As an example, DMD interface system timing margin can be calculated as follows:
Setup Margin = (controller output setup) – (DMD input setup) – (PCB routing mismatch) – (PCB SI degradation)
Hold-time Margin = (controller output hold) – (DMD input hold) – (PCB routing mismatch) – (PCB SI degradation)
(4)
(5)
The PCB SI degradation is the signal integrity degradation due to PCB affects which includes such things as
simultaneously switching output (SSO) noise, crosstalk, and intersymbol interference (ISI) noise.
DLPC900 I/O timing parameters, as well as DMD I/O timing parameters, can be easily found in their
corresponding data sheets. Similarly, PCB routing mismatch can be easily budgeted and met via controlled
PCB routing. However, PCB SI degradation is not as easy-to-determine.
In an attempt to minimize the signal integrity analysis that would otherwise be required, the following PCB
design guidelines provide a reference of an interconnect system that satisfies both waveform quality and
timing requirements (accounting for both PCB routing mismatch and PCB SI degradation). Deviation from these
recommendations can work, but must be confirmed with PCB signal integrity analysis or lab measurements.
PCB design: Refer to the Figure 10-5.
Configuration:
Etch thickness (T):
Flex etch thickness (T):
Single-ended signal impedance:
Differential signal impedance:
Asymmetric dual stripline
1.0-oz copper (1.2 mil)
0.5-oz copper (0.6 mil)
50 Ω (±10%)
100 Ω (±10%)
PCB stackup: Refer to the Figure 10-5.
Reference plane 1 is assumed to be a ground plane for proper return path.
Reference plane 2 is assumed to be the I/O power plane or ground.
70
Dielectric FR4, (Er):
4.2 (nominal)
Signal trace distance to reference plane 1 (H1):
5.0 mil (nominal)
Signal trace distance to reference plane 2 (H2):
34.2 mil (nominal)
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Reference Plane 1
H1
W
T
W
Trace
S
Trace
H2
Dielectric Er
H2
T
Trace
Trace
H1
Reference Plane 2
Figure 10-5. PCB Stackup Geometries
Table 10-3. General PCB Routing (Applies to All Corresponding PCB Signals, Refer to Figure 10-5)
PARAMETER
Line width (W)
SINGLE-ENDED
SIGNALS
DIFFERENTIAL PAIRS
UNIT
Escape routing in ball field
4
(0.1)
4
(0.1)
mil
(mm)
PCB etch data or control
7
(0.18)
4.25
(0.11)
mil
(mm)
PCB etch clocks
7
(0.18)
4.25
(0.11)
mil
(mm)
PCB etch data or control
N/A
5.75 (1)
(0.15)
mil
(mm)
PCB etch clocks
N/A
5.75 (1)
(0.15)
mil
(mm)
PCB etch data or control
N/A
20
(0.51)
mil
(mm)
PCB etch clocks
N/A
20
(0.51)
mil
(mm)
Escape routing in ball field
4
(0.1)
4
(0.1)
mil
(mm)
PCB etch data or control
10
(0.25)
20
(0.51)
mil
(mm)
PCB etch clocks
20
(0.51)
20
(0.51)
mil
(mm)
Total data
N/A
12
(0.3)
mil
(mm)
Total clock
N/A
12
(0.3)
mil
(mm)
APPLICATION
Differential signal pair spacing (S)
Minimum differential pair-to-pair spacing (S)
Minimum line spacing to other signals (S)
Maximum differential pair P-to-N length
mismatch
(1)
Spacing can vary to maintain differential impedance requirements.
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Table 10-4. DMD Interface Specific PCB Routing
SIGNAL GROUP LENGTH MATCHING
INTERFACE
SIGNAL GROUP
REFERENCE SIGNAL
MAX MISMATCH
UNIT
DMD
(LVDS)
SCA_P/ SCA_N
DDA_P_(15:0)/ DDA_N_(15:0)
DCKA_P/ DCKA_N
± 150
(± 3.81)
mil
(mm)
DMD
(LVDS)
SCB_P/ SCB_N
DDB_P_(15:0)/ DDB_N_(15:0)
DCKB_P/ DCKB_N
± 150
(± 3.81)
mil
(mm)
When routing the DMD Interface signals it is recommended to:
•
•
Minimize the number of layer changes for Single-ended signals.
Individual differential pairs can be routed on different layers but the signals of a given pair must not change
layers.
Table 10-5. DMD Signal Routing Length(1)
BUS
DMD
(LVDS)
(1)
MIN
MAX
UNIT
50
375
mm
Max signal routing length includes escape routing.
Stubs: Stubs are to be avoided.
Termination Requirements: DMD interface: None – The DMD receiver is differentially terminated to 100 Ω
internally.
Connector (DMD-LVDS interface bus only):
High-speed connectors that meet the following requirements can be used:
•
•
Differential crosstalk: < 5%
Differential impedance: 75 to 125-Ω
Routing requirements for right-angle connectors: When using right-angle connectors, P-N pairs must be routed
in the same row to minimize delay mismatch. When using right-angle connectors, propagation delay difference
for each row must be accounted for on associated PCB etch lengths.
These guidelines will produce a maximum PCB routing mismatch of 4.41 mm (0.174 inch) or approximately
30.4-ps, assuming 175 ps/inch FR4 propagation delay.
These PCB routing guidelines will result in approximately 25-ps system setup margin and 25-ps system hold
margin for the DMD interface after accounting for signal integrity degradation as well as routing mismatch.
Both the DLPC900 output timing parameters and the DMD input timing parameters include timing budget to
account for their respective internal package routing skew.
10.1.8.1 Flex Connector Plating
Plate all the pad area on top layer of flex connection with a minimum of 35 and maximum 50 micro-inches of
electrolytic hard gold over a minimum of 100 micro-inches of electrolytic nickel.
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10.1.9 PCB Design Standards
PCB designed and built in accordance with the following industry specifications:
Table 10-6. Industry Design Specification
INDUSTRY SPECIFICATION
APPLICABLE TO
IPC-2221 and IPC2222, Type 3, Class X, at Level B producibility
Board Design
IPC-6011 and IPC-6012, Class 2
PWB Fabrication
IPC-SM-840, Class 3, Color Green
Finished PWB Solder mask
UL94V-0 Flammability Rating and Marking
Finished PWB
UL796 Rating and Marking
Finished PWB
10.1.10 Signal Layers
The PCB signal layers must follow typical good practice guidelines including:
• Layer changes must be minimized for single-ended signals.
• Individual differential pairs can be routed on different layers, but the signals of a given pair must not change
layers.
• Stubs are to be avoided.
• Only voltage or low-frequency signals can be routed on the outer layers, except as noted previously in this
document.
• Double data rate signals must be routed first.
• Pin swapping on components is not allowed.
The PCB must have a solder mask on the top and bottom layers. The mask must not cover the vias.
• Except for fine pitch devices (pitch ≤ 0.032 inches), the copper pads and the solder mask cutout are to be of
the same size.
• Solder mask between pads of fine pitch devices must be removed.
• In the BGA package, the copper pads and the solder mask cutout must be of the same size.
10.1.11 Trace Widths and Minimum Spacing
BGA escape routing can be routed with 4-mils width and 4-mils spacing, as long as the escape nets are less
than 1 inch long, to allow 2 traces fit between vias. After signals escape the BGA field, trace widths can be
widened to achieve the desired impedance and spacing.
All single-ended 50-Ω signal must have a minimum spacing of 10mils relative to other signals. Other special
trace spacing requirements are listed in Table 10-7.
Table 10-7. Traces Widths and Minimum Spacing
SIGNAL ON PIN
MINIMUM WIDTH
MINIMUM SPACE
VDDC, VDD18, VDD33
0.020
0.015
GND
0.015 (1)
0.005
PLLS_VAD, PLLM2_VDD, PLLD_VDD,
PLLM1_VDD, PLLM1_VAD, PLLM2_VAD,
PLLD_VAD
0.012 (keep length less than 260 mils)
0.015
MOSCP, OCLKA
0.020 (2)
SCA_(P,N), DDA_(P,N)_(15:00), SCB_(P,N),
DDB_(P,N)_(15:00), DCKA_(P,N),
DCKB_(P,N)
0.030 (2)
USB_DAT_(P,N)
0.030 (2)
(1)
(2)
Make width of GND trace as wide as the pin it is connected to, when possible.
Trace spacing of these signals/signal-pairs relative to other signals.
10.1.12 Trace Impedance and Routing Priority
For best performance, it is recommended that the trace impedance for differential signals as in Table 10-8.
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All signals must be 50-Ω controlled impedance unless otherwise noted in Table 10-8.
Table 10-8. Trace Impedance
SIGNAL ON PIN
DIFFERENTIAL IMPEDANCE
DCKA_(P,N)
100 Ω ±10%
SCA_(P,N)
DDA_(P,N)_(15:00)
DCKB_(P,N)
100 Ω ±10%
SCB_(P,N)
DDB_(P,N)_(15:00)
USB_DAT_(P,N)
90 Ω ±10%
USB_(P,N)
All other Differential Signals
100 Ω ±10%
Table 10-9 lists the signals’ routing priority assignment.
Table 10-9. Routing Priority
SIGNAL ON PIN
PRIORITY
DCKA_(P,N) SCA_(P,N) DDA_(P,N)_(15:00) DCKB_(P,N) SCB_(P,N) 1 (1) (2) (3)
DDB_(P,N)_(15:00)
USB_(P,N) USB_DAT_(P,N)
2 (1)
P1(A,B,C)(9:2),P2(A,B,C)(9:2), P_CLK1, P_CLK2, P_CLK3,
P_DATEN1, P_DATEN2, P1_VSYNC, P2_VSYNC, P1_HSYNC,
P2_HSYNC
3 (1) (2) (3)
OCLKA, MOSCP
4 (4)
(1)
(2)
(3)
(4)
Refer to Table 8 for length matching requirement
Switching layers must not be done except at the beginning and end of the trace
Maximum routing length of 2 inches for each signal/pair, includes escape routing
Keep routing length under 0.35 inches
10.1.13 Power and Ground Planes
For best performance, the following are recommendations:
• Solid ground planes between each signal routing layer
• Two solid power planes for voltages
• Power and ground pins must be connected to these planes through a via for each pin
• All device pin and via connections to these planes must use a thermal relief with a minimum of four spokes
• Trace lengths for the component power and ground pins must be minimized to 0.03 inches or less
• Vias should be spaced out to avoid forming slots on the power planes
• High speed signals must not cross over a slot in the adjacent power planes
• Vias connecting all the digital layers are recommended for placement around the edge of the rigid PCB
regions 0.03 inches from the board edges with 0.1 inch spacing prior to routing
• Placing extra vias is not required if there are sufficient ground vias due to normal ground connections of
devices
• All signal routing and signal vias must be inside the perimeter ring of ground vias
10.1.14 Power Vias
Power and Ground pins of each component must be connected to the power and ground planes with a via for
each pin. Avoid sharing vias to the power plane among multiple power pins, where possible. Trace lengths for
component power and ground pins must be minimized (ideally, less than 0.100”). Unused or spare device pins
that are connected to power or ground can be connected together with a single via to power or ground. The
minimum spacing between vias shall be 0.050” to prevent slots from being developed on the ground plane.
74
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10.1.15 Decoupling
Decoupling capacitors must be located as near as possible to the DLPC900 voltage supply pins. Capacitors
must not share vias. The DLPC900 power pins can be connected directly to the decoupling capacitor (no via)
if the trace is less than 0.03”. Otherwise the component must be tied to the voltage or ground plane through a
separate via. All capacitors must be connected to the power planes with trace lengths less than 0.05”. Mount
decoupling capacitors connecting to power rail VDDC (1.15-V) using “via on sides” geometry as shown below
in Figure 10-6. If “via on the side” is not possible, 1.15-V decoupling capacitors can be mounted using “via at
ends” method, providing traces between the vias and decoupling capacitors’ pads be as short and wide (at least
15-mils wide) as possible.
Figure 10-6. Decoupling Via Placement
10.1.16 Fiducials
Fiducials for automatic component insertion are placed on the board according to the following guidelines or on
recommendation from manufacturer:
• Fiducials for optical auto insertion alignment shall be placed on three corners of both sides of the PCB
• Fiducials shall be 0.050” copper with 0.100” cutout (antipad).
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10.2 Layout Example
The DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) PCB is targeted at 14 layers with layer stack
up shown in Figure 10-7. The PCB layer stack can vary depending on system design. However, careful attention
is required to meet design considerations. Layers 1 and 14 consist of the component layers. Layers 2, 4, 6, 9,
11, and 13 consist of solid ground planes. Layers 7 and 8 consist of solid power planes. Layers 1, 3, 5, 10, 12,
and 14 are used as the primary routing layers. Routing on external layers must be less than 0.25 inches for
priority one and two signals. Refer to the Table 10-9 for signal priority groups. Board material must be FR-370HR
or similar. PCB must be designed for lead-free assembly with the stackup geometry shown in Figure 10-7 and
Figure 10-8.
Figure 10-7. Board Layer Stack
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Figure 10-8. Board Trace Geometry
Refer to Section 10.2 for a complete set of documentation for the DLP® LightCrafter™ Dual DLPC900
Evaluation Module (EVM) reference design.
10.3 Thermal Considerations
The thermal limitation for the DLPC900 is that the maximum operating junction temperature (TJ) must not be
exceeded (this is defined in Section 6.3). This temperature is dependent on operating ambient temperature,
airflow, PCB design (including the component layout density and the amount of copper used), power dissipation
of the DLPC900, and power dissipation of surrounding components. The DLPC900 device package is designed
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primarily to extract heat through the power and ground planes of the PCB, thus copper content and airflow over
the PCB are important factors.
The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and is
based on maximum DLPC900 power dissipation and RθJA at 1 m/s of forced airflow, where RθJA is the thermal
resistance of the package as measured using a JEDEC-defined standard test PCB. This JEDEC test PCB is not
necessarily representative of the DLPC900 PCB, and thus the reported thermal resistance can be inaccurate in
the actual product application. Although the actual thermal resistance can be different, it is the best information
available during the design phase to estimate thermal performance. However after the PCB is designed and the
product is built, it is highly recommended thermal performance be measured and validated.
To do this, the top-center case temperature must be measured under the worst case product scenario (max
power dissipation, max voltage, max ambient temp) and validated not to exceed the maximum recommended
case temperature (TC). This specification is based on the measured φJT for the DLPC900 package and
provides a relatively accurate correlation to junction temperature. Care must be taken when measuring this
case temperature to prevent accidental cooling of the package surface. It is recommended to use a small
(approximately 40 gauge) thermocouple. The bead and the thermocouple wire must be covered with a minimal
amount of thermally conductive epoxy and contact the top of the package. The wires are routed closely along the
package and the board surface to avoid cooling the bead through the wires.
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
DLPC900
ZPC
Package
Revision
Device Descriptor
Figure 11-1. Device Number Description
11.1.2 Device Markings
R
DLP
TEXAS INSTRUMENTS
Part Number
TI Proprietary data
DLPC900_ZPC
PPPPPPPP-000R
SSSSSSYYWWQQ
LLLLLLL
G1
Location A1
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11.1.3 DEFINITIONS - Video Timing Parameters
Active Lines Per Frame Defines the number of lines in a frame containing displayable data: ALPF is a subset
(ALPF)
of the TLPF.
Active Pixels Per Line
(APPL)
Defines the number of pixel clocks in a line containing displayable data: APPL is a
subset of the TPPL.
Horizontal Back Porch
(HBP) Blanking
Number of blank pixel clocks after horizontal sync but before the first active pixel.
Note: HBP times are reference to the leading (active) edge of the respective sync
signal.
Horizontal Front Porch Number of blank pixel clocks after the last active pixel but before Horizontal Sync.
(HFP) Blanking
Horizontal Sync (HS)
Timing reference point that defines the start of each horizontal interval (line). The
absolute reference point is defined by the active edge of the HS signal. The active
edge (either rising or falling edge as defined by the source) is the reference from
which all horizontal blanking parameters are measured.
Total Lines Per Frame
(TLPF)
Defines the vertical period (or frame time) in lines: TLPF = Total number of lines per
frame (active and inactive).
Total Pixel Per Line
(TPPL)
Defines the horizontal line period in pixel clocks: TPPL = Total number of pixel clocks
per line (active and inactive).
Vertical Back Porch
(VBP) Blanking
Number of blank lines after vertical sync but before the first active line.
Vertical Front Porch
(VFP) Blanking
Number of blank lines after the last active line but before vertical sync.
Vertical Sync (VS)
Timing reference point that defines the start of the vertical interval (frame). The
absolute reference point is defined by the active edge of the VS signal. The active
edge (either rising or falling edge as defined by the source) is the reference from
which all vertical blanking parameters are measured.
11.2 Documentation Support
11.2.1 Related Documentation
The following documents contain additional information related to the use of the DLPC900 device.
Table 11-1. Related Documents
DOCUMENT
DOCUMENT LINK
DLP6500FLQ DMD Data Sheet
DLPS040
DLP6500FYE DMD Data Sheet
DLPS053
DLP9000 DMD Data Sheet
DLPS036
DLP500YX DMD Data Sheet
DLPS193
DLP670S DMD Data Sheet
DLPS194
DLPC900 Programmer's Guide
DLPU018
DLP® LightCrafter™ Single DLPC900 Evaluation Module (EVM) User's
Guide
DLPU101
DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) User's
Guide
DLPU102
Reference Design Documentation
DLPLCR900EVM DLPLCR900DEVM DLPLCR65EVM
DLPLCR50XEVM DLPLCR67EVM DLPLCR90EVM
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
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11.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.5 Trademarks
LightCrafter™ are trademarks of Texas Instruments.
TI E2E™ is a trademark of Texas Instruments.
DLP® are registered trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.7 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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18-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
DLPC900AZPC
ACTIVE
BGA
ZPC
516
1
TBD
Call TI
Call TI
0 to 55
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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