DM368ZCEZ

PCN Number: 20150915001 PCN Date: Qualification of 100% Cu wire bonding on select nfBGA Devices Title: Customer Contact: PCN Manager Proposed 1st Ship Date: Dept: 12/21/2015 Change Type: Assembly Site Assembly Process Assembly Materials Mechanical Specification Packing/Shipping/Labeling Quality Services Estimated Sample Availability: Design Data Sheet Part number change Test Site Test Process Wafer Wafer Wafer Wafer Wafer Wafer 09/21/2015 Date provided at sample request Bump Site Bump Material Bump Process Fab Site Fab Materials Fab Process PCN Details Description of Change: Texas Instruments is pleased to announce the qualification of 100% Cu bonding for the nfBGA devices listed below. What Current Bonding New Bonding 55um Bond Pads Cu, 0.8 mil Cu, 0.70 mil 45um Bond Pads Au, 0.8 mil Cu, 0.70 mil Reason for Change: Continuity of supply. 1) To align with world technology trends and use wiring with enhanced mechanical and electrical properties 2) Maximize flexibility within our Assembly/Test production sites. 3) Cu is easier to obtain and stock Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative): None Anticipated impact on Material Declaration No Impact to the Material Declarations or Product Content reports are driven from Material Declaration production data and will be available following the production release. Upon production release the revised reports can be obtained from the TI ECO website. Changes to product identification resulting from this PCN: None Texas Instruments, Inc. PCN#20150915001 Product Affected: DM365ZCES TMS320DM361ZCE TMS320DM367ZCE30 TMS320DM368ZCEG DM365ZCEW TMS320DM362ZCE TMS320DM367ZCED TMS320DM369ZCE DM365ZCEZ TMS320DM362ZCE30 TMS320DM367ZCED30 TMS320DM369ZCED DM368ZCEDZ TMS320DM365ZCE TMS320DM367ZCEF TMS320DM369ZCEDF DM368ZCEZ TMS320DM365ZCE21 TMS320DM368GZCEF TMS320DM369ZCEF DMVA1ZCE TMS320DM365ZCE27 TMS320DM368ZCE VCBU65WMCE30 DMVA1ZCED TMS320DM365ZCE30 TMS320DM368ZCE48 VCBU68WMCE30 DMVA25ZCE TMS320DM365ZCED30 TMS320DM368ZCED VS3673UNION DMVA2ZCE TMS320DM365ZCEF TMS320DM368ZCED48F VS3674PITTA DMVA2ZCED TMS320DM365ZCEZ TMS320DM368ZCEDF VS3674UNION DMVA2ZCEDR TMS320DM367ZCE TMS320DM368ZCEF VVLOG365ZCE DMVA2ZCER TI Information Selective Disclosure Qualification Report 0.70mil Cu Qual - Freon 361ZWT nfBGA driver Approve Date 08-Jun-2015 Product Attributes Attributes Assembly Site Package Family Wafer Fab Supplier Wafer Fab Process Qual Device: TMS320C6748BZWTA3E PHI (TIPI) NFBGA UMC FAB12I 1218C021.M6 QBS Product Reference: 771570ZCE365 PHI (TIPI) NFBGA UMCI 1218C021.M7 QBS Package Reference: TNETV1061ZWC PHI (TIPI) NFBGA DMOS6 1533C035.15C2 - QBS: Qual By Similarity - Qual Device TMS320C6748BZWTA3E is qualified at LEVEL3-260CG Texas Instruments, Inc. PCN#20150915001 Qualification Results Data Displayed as: Number of lots / Total sample size / Total failed Test Name / Condition Type PC PC HTOL THB UHAST TC HTSL PreCon Level 3 PreCon Level 4 Life Test, 125C Biased Temperature and Humidity, 85C/85%RH Unbiased HAST 110C/85%RH Temperature Cycle, -55/125C High Temp Storage Bake 150C WBP Bond Strength MQ Manufacturability (Assembly) PD Physical Dimensions YLD FTY and Bin Summary 3/960/0 - QBS Product Reference: 771570ZCE365 3/870/0 3/240/0 QBS Package Reference: TNETV1061ZWC 3/1080/0 3/240/0 1000hrs/85C/85%RH 3/78/0 - - 264hrs/110C/85%RH 3/240/0 3/240/0 3/300/0 1000cyc/-55C/125C 3/240/0 3/240/0 3/240/0 1000hrs/150C 3/240/0 3/300/0 3/179/0 3/Pass - 3/228/0 3/Pass 3/Pass 3/Pass - - 1/10/0 3/Pass - 3/Pass Duration Qual Device: TMS320C6748BZWTA3E 3XIR/260C 3XIR/260C 1000hrs/125C 76 ball bonds, min. 3 units (per mfg. Site specification) (per mechanical drawing) - - Preconditioning was performed for Autoclave, Unbiased HAST, THB/Biased HAST, Temperature Cycle, Thermal Shock, and HTSL, as applicable - The following are equivalent HTOL options based on an activation energy of 0.7eV : 125C/1k Hours, 140C/480 Hours, 150C/300 Hours, and 155C/240 Hours - The following are equivalent HTSL options based on an activation energy of 0.7eV : 150C/1k Hours, and 170C/420 Hours - The following are equivalent Temp Cycle options per JESD47 : -55C/125C/700 Cycles and -65C/150C/500 Cycles Quality and Environmental data is available at TI's external Web site: http://www.ti.com/ Green/Pb-free Status: Qualified Pb-Free(SMT) and Green For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments, Inc. E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN#20150915001