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DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
DP83848x PHYTER Mini / LS Single Port 10/100 MB/s Ethernet Transceiver
1 Device Overview
1.1
Features
1
•
•
•
•
•
•
•
•
Low-Power 3.3-V, 0.18-µm CMOS Technology
Auto-MDIX for 10/100 Mb/s
Energy Detection Mode
3.3-V MAC Interface
RMII Rev. 1.2 Interface (configurable)
MII Interface
MII Serial Management Interface (MDC and MDIO)
IEEE 802.3 Auto-Negotiation and Parallel
Detection
• IEEE 802.3 ENDEC, 10BASE-T Transceivers and
Filters
• IEEE 802.3 PCS, 100BASE-TX Transceivers and
Filters
1.2
•
•
Applications
Peripheral Devices
Mobile Devices
1.3
• Integrated ANSI X3.263 Compliant TP-PMD
Physical Sub-Layer with Adaptive Equalization and
Baseline Wander Compensation
• Error-Free Operation Beyond 137 Meters
• ESD Protection – Greater than 4 kV Human Body
Model
• Configurable LED for Link and Activity
(DP83848J/K)
• 25-MHz Clock Output (DP83848H/M/T)
• Single Register Access for Complete PHY Status
• 10/100 Mb/s Packet BIST (Built-in Self Test)
•
•
Factory and Building Automation
Base Stations
Description
The DP83848x device addresses the quality, reliability and small form factor required for space sensitive
applications in embedded systems.
The DP83848x offers performance far exceeding the IEEE specifications, with superior interoperability and
industry leading performance beyond 137 meters of Cat-V cable. The DP83848x also offers Auto-MDIX to
remove cabling complications. DP83848x has superior ESD protection, greater than 4 kV Human Body
Model, providing extremely high reliability and robust operation, ensuring a high-level performance in all
applications.
DP83848J/K offers two flexible LED indicators one for Link and the other for Speed. In addition, both MII
and RMII are supported ensuring ease and flexibility of design.
The DP83848H/M/T incorporates a 25-MHz clock out that eliminates the need and hence the space and
cost, of an additional clock source component.
The DP83848x is offered in small 6-mm × 6-mm WQFN 40-pin package and is ideal for industrial controls,
building/factory automation, transportation, test equipment and wire-less base stations.
Device Information (1)
PART NUMBER
DP83848x
(1)
PACKAGE
WQFN (40)
BODY SIZE (NOM)
6.00 mm × 6.00 mm
For more information, see Section 9, Mechanical Packaging and Orderable Information.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
1.4
www.ti.com
Functional Block Diagram
RX_CLK
RXD[3:0]
RX_DV
RX_ER
COL
MDC
MDIO
TX_EN
TXD[3:0]
TX_CLK
SERIAL
MANAGEMENT
CRS/CRS_DV
MII/RMII
MII/RMII INTERFACE
TX_DATA
RX_CLK
TX_CLK
RX_DATA
MII
Registers
10BASE-T and
100BASE-TX
10BASE-T and
100BASE-TX
Auto-Negotiation
State Machine
Transmit
Block
Receive
Block
Clock
Generation
ADC
DAC
Auto-MDIX
TD±
2
Device Overview
RD±
LED
Driver
REFERENCE CLOCK
LED/s
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SNLS250E – MAY 2008 – REVISED APRIL 2015
Table of Contents
1
2
3
4
Device Overview ......................................... 1
5.4
Thermal Information ................................. 10
1.1
Features .............................................. 1
5.5
DC Specifications ................................... 11
1.2
Applications ........................................... 1
5.6
AC Timing Requirements
1.3
Description ............................................ 1
1.4
Functional Block Diagram ............................ 2
6.1
Overview
Revision History ......................................... 3
Device Comparison ..................................... 4
Pin Configuration and Functions ..................... 4
6.2
Functional Block Diagram ........................... 26
.......................................... 5
4.2
Package Pin Assignments............................ 6
4.3
Serial Management Interface ......................... 6
4.4
Mac Data Interface ................................... 6
4.5
Clock Interface ....................................... 7
4.6
LED Interface ......................................... 7
4.7
Reset ................................................. 8
4.8
Strap Options ......................................... 8
4.9
10 Mb/s and 100 Mb/s PMD Interface ............... 9
4.10 Special Connections .................................. 9
4.11 Power Supply Pins ................................... 9
Specifications ........................................... 10
5.1
Absolute Maximum Ratings ......................... 10
5.2
ESD Ratings ........................................ 10
5.3
Recommended Operating Conditions ............... 10
4.1
5
6
Pin Diagram
7
8
9
...........................
11
Detailed Description ................................... 25
............................................
.................................
...........................
6.5
Programming ........................................
6.6
Memory ..............................................
Application, Implementation, and Layout .........
7.1
Application Information ..............................
7.2
Typical Application ..................................
7.3
Layout ...............................................
7.4
Power Supply Recommendations ...................
Device and Documentation Support ...............
8.1
Documentation Support .............................
8.2
Related Links ........................................
8.3
Trademarks..........................................
8.4
Electrostatic Discharge Caution .....................
8.5
Glossary .............................................
25
6.3
Feature Description
27
6.4
Device Functional Modes
31
37
48
64
64
64
71
75
76
76
76
76
76
76
Mechanical Packaging and Orderable
Information .............................................. 76
2 Revision History
Changes from Revision D (May 2008) to Revision E
•
•
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section .......................................... 1
Added devices DP83848H, DP83848K, DP83848M and DP83848T. ......................................................... 1
Copyright © 2008–2015, Texas Instruments Incorporated
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Revision History
3
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
www.ti.com
3 Device Comparison
Table 3-1. Device Features (1)
TEMPERATURE RANGE
DEVICE
(1)
TEMPERATURE GRADE
MIN
MAX
DP83848J/M
0°C
70°C
Commercial
DP83848K/T
-40°C
85°C
Industrial
DP83848H
-40°C
125°C
Extreme
Pin 21 is the CLK_OUT pin for the DP83848H/M/T.
4 Pin Configuration and Functions
The DP83848x pins are classified into the following interface categories (each interface is described in the
sections that follow):
• Serial Management Interface
• MAC Data Interface
• Clock Interface
• LED Interface
• Reset
• Strap Options
• 10/100 Mb/s PMD Interface
• Special Connections
• Power Supply Pins
NOTE
Strapping pin option. See Section 4.8 for strap definitions.
All DP83848x signal pins are I/O cells regardless of the particular use. The definitions below define the
functionality of the I/O cells for each pin.
Type: I
Input
Type: O
Output
Type: I/O
Input/Output
Type: OD
Open Drain
Type: PD,PU Internal Pulldown/Pullup
Type: S
4
Strapping Pin (All strap pins have weak internal pullups or pulldowns. If the default strap
value is to be changed then an external 2.2-kΩ resistor should be used. See Section 4.8 for
details.)
Pin Configuration and Functions
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4.1
SNLS250E – MAY 2008 – REVISED APRIL 2015
Pin Diagram
RTA Package
40-Pin WQFN
Top View
35
RX_CLK 31
COL/PHYAD0
36
RX_DV/MII_MODE 32
RXD_0/PHYAD1
37
CRS/CRS_DV/LED_CFG 33
RXD_1/PHYAD2
38
RX_ER/MDIX_EN 34
RXD_2/PHYAD3
RXD_3/PHYAD4 39
IOGND 40
IOVDD33
1
30 PFBIN2
TX_CLK
2
29 DGND
TX_EN
3
28 X1
TXD_0
4
27 X2
TXD_1
5
26 IOVDD33
TXD_2
6
TXD_3
7
24 MDIO
RESERVED
8
23 RESET_N
RESERVED
9
RESERVED
10
DP83848J/K
25 MDC
22 LED_LINK/AN0
DAP
21 LED_SPEED/AN1
20 RBIAS
19 PFBOUT
18 AVDD33
17 AGND
16 PFBIN1
15 TD +
14 TD -
13 AGND
12 RD +
11 RD -
Pin 21 is the CLK_OUT pin for the DP83848H/M/T.
Pin Configuration and Functions
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5
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
4.2
Package Pin Assignments
NSQAU040
PIN #
(1)
www.ti.com
PIN NAME
(DP83848J)
NSQAU040
PIN #
PIN NAME
(DP83848J)
1
IO_VDD
21 (1)
2
TX_CLK
22
LED_LINK/AN0
3
TX_EN
23
RESET_N
4
TXD_0
24
MDIO
5
TXD_1
25
MDC
6
TXD_2
26
IOVDD33
7
TXD_3
27
X2
8
RESERVED
28
X1
LED_SPEED/AN1
9
RESERVED
29
DGND
10
RESERVED
30
PFBIN2
11
RD–
31
RX_CLK
12
RD+
32
RX_DV/MII_MODE
13
AGND
33
CRS/CRS_DV/LED_CFG
14
TD –
34
RX_ER/MDIX_EN
15
TD +
35
COL/PHYAD0
16
PFBIN1
36
RXD_0/PHYAD1
17
AGND
37
RXD_1/PHYAD2
18
AVDD33
38
RXD_2/PHYAD3
19
PFBOUT
39
RXD_3/PHYAD4
20
RBIAS
40
IOGND
Pin 21 is the CLK_OUT pin for the DP83848H/M/T.
4.3
Serial Management Interface
SIGNAL
NAME
TYPE
PIN #
DESCRIPTION
MDC
I
25
MANAGEMENT DATA CLOCK: Synchronous clock to the MDIO management data input/output
serial interface which may be asynchronous to transmit and receive clocks. The maximum clock
rate is 25 MHz with no minimum clock rate.
MDIO
I/O
24
MANAGEMENT DATA I/O: Bi-directional management instruction/data signal that may be
sourced by the station management entity or the PHY. This pin requires a 1.5-kΩ pullup resistor.
4.4
Mac Data Interface
SIGNAL
NAME
TYPE
PIN #
DESCRIPTION
MII COLLISION DETECT: Asserted high to indicate detection of a collision condition
(simultaneous transmit and receive activity) in 10 Mb/s and 100 Mb/s Half-Duplex Modes.
While in 10BASE-T Half-Duplex mode with heartbeat enabled this pin is also asserted for a
duration of approximately 1 µs at the end of transmission to indicate heartbeat (SQE test).
COL
S, O, PU
35
In Full Duplex Mode, for 10 Mb/s or 100 Mb/s operation, this signal is always logic 0. There is no
heartbeat function during 10Mb/s full duplex operation.
RMII COLLISION DETECT: Per the RMII Specification, no COL signal is required. The MAC will
recover CRS from the CRS_DV signal and use that along with its TX_EN signal to determine
collision.
MII CARRIER SENSE: Asserted high to indicate the receive medium is non-idle.
CRS/CRS_D
V
S, O, PU
33
RMII CARRIER SENSE/RECEIVE DATA VALID: This signal combines the RMII Carrier and
Receive Data Valid indications. For a detailed description of this signal, see the RMII
Specification.
MII RECEIVE CLOCK: Provides the 25 MHz recovered receive clocks for 100 Mb/s mode and
2.5 MHz for 10 Mb/s mode.
RX_CLK
O
31
Unused in RMII mode. The device uses the X1 reference clock input as the 50 MHz reference for
both transmit and receive.
6
Pin Configuration and Functions
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SNLS250E – MAY 2008 – REVISED APRIL 2015
SIGNAL
NAME
TYPE
PIN #
DESCRIPTION
MII RECEIVE DATA VALID: Asserted high to indicate that valid data is present on the
corresponding RXD[3:0].
RX_DV
O, PD
32
RMII Synchronous Receive Data Valid: This signal provides the RMII Receive Data Valid
indication independent of Carrier Sense.
MII RECEIVE ERROR: Asserted high synchronously to RX_CLK to indicate that an invalid
symbol has been detected within a received packet in 100 Mb/s mode.
RX_ER
S, O, PU
RMII RECEIVE ERROR: Assert high synchronously to X1 whenever it detects a media error and
RX_DV is asserted in 100 Mb/s mode.
34
This pin is not required to be used by a MAC, in either MII or RMII mode, because the Phy is
required to corrupt data on a receive error.
RXD_0
RXD_1
RXD_2
RXD_3
S, O, PD
MII RECEIVE DATA: Nibble wide receive data signals driven synchronously to the RX_CLK, 25
MHz for 100 Mb/s mode, 2.5 MHz for 10 Mb/s mode). RXD[3:0] signals contain valid data when
RX_DV is asserted.
36
37
38
39
RMII RECEIVE DATA: 2-bits receive data signals, RXD[1:0], driven synchronously to the X1
clock, 50 MHz.
MII TRANSMIT CLOCK: 25 MHz Transmit clock output in 100Mb/s mode or 2.5 MHz in 10 Mb/s
mode derived from the 25-MHz reference clock.
TX_CLK
O
2
Unused in RMII mode. The device uses the X1 reference clock input as the 50-MHz reference for
both transmit and receive.
TX_EN
I, PD
MII TRANSMIT ENABLE: Active high input indicates the presence of valid data inputs on
TXD[3:0].
3
RMII TRANSMIT ENABLE: Active high input indicates the presence of valid data on TXD[1:0].
TXD_0
TXD_1
TXD_2
TXD_3
4.5
I
I
I
I, PD
MII TRANSMIT DATA: Transmit data MII input pins, TXD[3:0], that accept data synchronous to
the TX_CLK (2.5 MHz in 10 Mb/s mode or 25 MHz in 100 Mb/s mode).
4
5
6
7
RMII TRANSMIT DATA: Transmit data RMII input pins, TXD[1:0], that accept data synchronous
to the 50-MHz reference clock.
Clock Interface
SIGNAL
NAME
X1
TYPE
I
PIN #
DESCRIPTION
CRYSTAL/OSCILLATOR INPUT: This pin is the primary clock reference input for the DP83848x
and must be connected to a 25-MHz 0.005% (+50 ppm) clock source. The DP83848x supports
either an external crystal resonator connected across pins X1 and X2, or an external CMOS-level
oscillator source connected to pin X1 only.
28
RMII REFERENCE CLOCK: This pin is the primary clock reference input for the RMII mode and
must be connected to a 50-MHz 0.005% (+50 ppm) CMOS-level oscillator source.
X2
4.6
O
CRYSTAL OUTPUT: This pin is the primary clock reference output to connect to an external 25MHz crystal resonator device. This pin must be left unconnected if an external CMOS oscillator
clock source is used.
27
LED Interface
SIGNAL
NAME
TYPE
PIN #
DESCRIPTION
LINK LED: In Mode 1, this pin indicates the status of the LINK. The LED will be ON when Link is
good.
LED_LINK
S, O, PU
22
LED_SPEED S, O, PU
21
(1)
LINK/ACT LED: In Mode 2, this pin indicates transmit and receive activity in addition to the status
of the Link. The LED will be ON when Link is good. It will blink when the transmitter or receiver is
active.
SPEED LED: This LED is ON when DP83848x is in 100 Mb/s and OFF when DP83848x is in 10
Mb/s. Functionality of this LED is independent of the mode selected. (1)
LED_SPEED only exists in the DP83848J/K. DP83848M/T/H has CLK_OUT on pin 21.
Pin Configuration and Functions
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DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
4.7
Reset
SIGNAL
NAME
RESET_N
4.8
www.ti.com
TYPE
PIN #
I, PU
DESCRIPTION
RESET: Active Low input that initializes or re-initializes the DP83848x. Asserting this pin low for
at least 1 µs will force a reset process to occur. All internal registers will re-initialize to their
default states as specified for each bit in the Register Block section. All strap options are reinitialized as well.
23
Strap Options
DP83848x uses many functional pins as strap options. The values of these pins are sampled during reset
and used to strap the device into specific modes of operation. The strap option pin assignments are
defined below. The functional pin name is indicated in parentheses.
A 2.2-kΩ resistor should be used for pulldown or pullup to change the default strap option. If the default
option is required, then there is no need for external pullup or pulldown resistors. Because these pins may
have alternate functions after reset is deasserted, they should not be connected directly to VCC or GND.
SIGNAL NAME
TYPE
PIN #
DESCRIPTION
PHY ADDRESS [4:0]: The DP83848x provides five PHY address pins, the state of which
are latched into the PHYCTRL register at system Hardware-Reset.
PHYAD0 (COL)
PHYAD1 (RXD_0)
PHYAD2 (RXD_1)
PHYAD3 (RXD_2)
PHYAD4 (RXD_3)
S, O, PU
S, O, PD
35
36
37
38
39
The DP83848x supports PHY Address strapping values 0 () through 31 ().
A PHY Address of 0 puts the part into the MII Isolate Mode. The MII isolate mode must
be selected by strapping Phy Address 0; changing to Address 0 by register write will not put
the Phy in the MII isolate mode. Refer to Section 6.4.4 for additional information.
PHYAD0 pin has weak internal pullup resistor.
PHYAD[4:1] pins have weak internal pulldown resistors.
These input pins control the advertised operating mode of the device according to the
following table. The value on these pins are set by connecting them to GND (0) or VCC (1)
through 2.2-kΩ resistors. These pins should NEVER be connected directly to GND or VCC.
The value set at this input is latched into the DP83848x at Hardware-Reset.
The float/pulldown status of these pins are latched into the Basic Mode Control Register
and the Auto_Negotiation Advertisement Register during Hardware-Reset.
AN0 (LED_LINK)
AN1
(LED_SPEED) (1)
S, O, PU
S, O, PU
22
21
The default for DP83848x is 11 because these pins have an internal pullup.
AN1 (1)
AN0
0
0
10BASE-T, Half/full-Duplex
0
1
100BASE-TX, Half/full-Duplex
1
0
10BASE-T, Half-Duplex
100BASE-TX, Half-Duplex
1
1
10BASE-T, Half/Full-Duplex
100BASE-TX, Hal/Full-Duplex
Advertised Mode
MII MODE SELECT: This strapping option determines the operating mode of the MAC
Data Interface. Default operation (No pullup) will enable normal MII Mode of operation.
Strapping MII_MODE high will cause the device to be in RMII mode of operation. Because
the pin includes an internal pulldown, the default value is 0.
MII_MODE (RX_DV)
S, O, PD
32
The following table details the configuration:
MIL_MODE
LED_CFG
(CRS/CRS_DV)
S, O, PU
33
MAC Interface Mode
0
MII Mode
1
RMII Mode
LED CONFIGURATION: This strapping option determines the mode of operation of the
LED pins. Default is Mode 1. Mode 1 and Mode 2 can be controlled through the strap
option. All modes are configurable through register access.
See Table 6-2 for LED Mode Selection.
MDIX_EN (RX_ER)
(1)
8
S, O, PU
34
MDIX ENABLE: Default is to enable MDIX. This strapping option disables Auto-MDIX. An
external pulldown will disable Auto-MDIX mode.
AN1 (LED_SPEED) is only available on the DP83848J/K.
Pin Configuration and Functions
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4.9
SNLS250E – MAY 2008 – REVISED APRIL 2015
10 Mb/s and 100 Mb/s PMD Interface
SIGNAL
NAME
TYPE
PIN #
DESCRIPTION
Differential common driver transmit output (PMD Output Pair). These differential outputs are
automatically configured to either 10BASE-T or 100BASE-TX signaling.
TD-, TD+
I/O
14, 15
In Auto-MDIX mode of operation, this pair can be used as the Receive Input pair.
These pins require 3.3-V bias for operation.
Differential receive input (PMD Input Pair). These differential inputs are automatically configured to
accept either 100BASE-TX or 10BASE-T signaling.
RD-, RD+
I/O
11, 12
In Auto-MDIX mode of operation, this pair can be used as the Transmit Output pair.
These pins require 3.3-V bias for operation.
4.10 Special Connections
SIGNAL
NAME
TYPE
PIN #
DESCRIPTION
RBIAS
I
20
Bias Resistor Connection. A 4.87-kΩ 1% resistor should be connected from RBIAS to GND.
PFBOUT
O
19
Power Feedback Output. Parallel caps, 10 µF (Tantalum preferred) and 0.1 µF, should be placed
close to the PFBOUT. Connect this pin to PFBIN1 (pin 16) and PFBIN2 (pin 30). See
Section 7.2.1.3 for proper placement pin.
PFBIN1
PFBIN2
I
16
30
Power Feedback Input. These pins are fed with power from PFBOUT pin. A small capacitor of 0.1
µF should be connected close to each pin.
Note: Do not supply power to these pins other than from PFBOUT.
RESERVED I/O
8,9,10
RESERVED: These pins must be left unconnected.
4.11 Power Supply Pins
SIGNAL NAME
PIN #
DESCRIPTION
IOVDD33
1, 26
I/O 3.3-V Supply
IOGND
40
I/O Ground
DGND
29
Digital Ground
AVDD33
18
Analog 3.3-V Supply
AGND
13, 17
Analog Ground
Pin Configuration and Functions
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DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
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5 Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
4.2
V
VIN
DC input voltage
–0.5
VCC + 0.5
V
VOUT
DC output voltage
–0.5
VCC + 0.5
V
147.7
°C
150
°C
150
°C
Max case temperature
TJ
Max die temperature
Tstg
(1)
(2)
Storage temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All parameters are specified by test, statistical analysis or design.
5.2
ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
±4000
Charged device model (CDM), per JEDEC specification JESD22C101 (3)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
RZAP = 1.5 kΩ, CZAP = 120 pF
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VCC
Supply voltage
TA
PD
UNIT
±0.3
V
0
70
°C
Industrial - DP83848K/T
–40
85
Extreme - DP83848H
–40
125
Power dissipation
5.4
MAX
3.3
Commerical - DP83848J/M
Ambient temperature
NOM
264
mW
Thermal Information
DP83848x
THERMAL METRIC (1)
RTA [WQFN]
UNIT
40 PINS
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
8.8
RθJB
Junction-to-board thermal resistance
40.5
ψJT
Junction-to-top characterization parameter
0.4
ψJB
Junction-to-board characterization parameter
10.5
RθJC(bot)
Junction-to-case (bottom) thermal resistance
5.5
(1)
10
31.7
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Specifications
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5.5
SNLS250E – MAY 2008 – REVISED APRIL 2015
DC Specifications
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIH
Input high voltage
VIL
Input low voltage
IIH
Input high current
IIL
TEST CONDITIONS
Nominal VCC
PIN TYPES
MIN
I I/O
TYP
MAX
UNIT
2
V
I I/O
0.8
V
VIN = VCC
I I/O
10
µA
Input low current
VIN = GND
I I/O
10
µA
VOL
Output low voltage
IOL = 4 mA
O, I/O
0.4
V
VOH
Output high voltage
IOH = –4 mA
O, I/O
VledOL
Output low voltage
IOL = 2.5 mA
LED
VledOH
Output high voltage
IOH = –2.5 mA
LED
IOZ
Tri-state leakage
VOUT = VCC
I/O, O
VTPTD_100
100M Transmit voltage
PMD Output
VTPTDsym
100M Transmit voltage symmetry
PMD Output Pair
VTPTD_10
10M Transmit voltage
PMD Output Pair
CIN1
CMOS Input capacitance
I
5
pF
COUT1
CMOS Output capacitance
O
5
pF
SDTHon
100BASE-TX Signal detect turnon
threshold
PMD Input Pair
SDTHoff
100BASE-TX Signal detect turnoff
threshold
PMD Input Pair
VTH1
10BASE-T Receive Threshold
PMD Input Pair
Idd100
100BASE-TX (Full Duplex)
PMD Input Pair
81
Idd10
10BASE-T (Full Duplex)
Supply
92
(1)
IOUT = 0 mA (1)
Vcc – 0.5
V
0.4
V
±10
µA
1.05
V
Vcc – 0.5
V
0.95
1
2.2
2.5
±2%
2.8
1000
200
V
mV diff pkpk
mV diff pkpk
585
mV
mA
Refer to application note SNLA089, “Power Measurement of Ethernet Physical Layer Products”
5.6
AC Timing Requirements
MIN
POWER UP TIMING (REFER TO Figure 5-1)
NOM
MAX
UNIT
(1)
T2.1.1
Post Power Up Stabilization time prior to MDC
preamble for register accesses
MDIO is pulled high for 32-bit serial management
initialization.
X1 Clock must be stable for a minimum of 167 ms at
power up.
167
ms
T2.1.2
Hardware Configuration Latch-in Time from power
up
Hardware Configuration Pins are described in Section 4.
X1 Clock must be stable for a minimum of 167 ms at
power up.
167
ms
T2.1.3
Hardware Configuration pins transition to output
drivers
RESET TIMING (REFER TO Figure 5-2)
50
ns
(2)
T2.2.1
Post RESET Stabilization time prior to MDC
preamble for register accesses
MDIO is pulled high for 32-bit serial management
initialization.
3
µs
T2.2.2
Hardware Configuration Latch-in Time from the
Deassertion of RESET (either soft or hard)
Hardware Configuration Pins are described in Section 4.
3
µs
T2.2.3
Hardware Configuration pins transition to output
drivers
50
ns
T2.2.4
RESET pulse width
X1 Clock must be stable for at minimum of 1 µs during
RESET pulse low time.
1
µs
MII SERIAL MANAGEMENT TIMING (REFER TO Figure 5-3)
T2.3.1
MDC to MDIO (Output) Delay Time
T2.3.2
MDIO (Input) to MDC Setup Time
10
T2.3.3
MDIO (Input) to MDC Hold Time
10
T2.3.4
MDC Frequency
(1)
(2)
0
30
ns
ns
ns
2.5
25
MHz
In RMII Mode, the minimum Post Power up Stabilization and Hardware Configuration Latch-in times are 84 ms.
It is important to choose pullup and/or pulldown resistors for each of the hardware configuration pins that provide fast RC time constants
in order to latch-in the proper value prior to the pin transitioning to an output driver.
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AC Timing Requirements (continued)
MIN
NOM
MAX
20
24
UNIT
100 Mb/s MII TRANSMIT TIMING (REFER TO Figure 5-4)
T2.4.1
TX_CLK High/Low Time
100 Mb/s Normal mode
16
T2.4.2
TXD[3:0], TX_EN Data Setup to TX_CLK
100 Mb/s Normal mode
10
ns
ns
T2.4.3
TXD[3:0], TX_EN Data Hold from TX_CLK
100 Mb/s Normal mode
0
ns
100 Mb/s MII RECEIVE TIMING (REFER TO Figure 5-5) (3)
T2.5.1
RX_CLK High/Low Time
100 Mb/s Normal mode
16
T2.5.2
RX_CLK to RXD[3:0], RX_DV, RX_ER Delay
100 Mb/s Normal mode
10
20
24
ns
30
ns
100BASE-TX TRANSMIT PACKET LATENCY TIMING (REFER TO Figure 5-6) (4)
T2.6.1
TX_CLK to PMD Output Pair Latency
100 Mb/s Normal mode
6
bits
6
bits
100BASE-TX TRANSMIT PACKET DEASSERTION TIMING (REFER TO Figure 5-7) (5)
T2.7.1
TX_CLK to PMD Output Pair Deassertion
100 Mb/s Normal mode
100BASE-TX TRANSMIT TIMING (tR/F) AND JITTER) (REFER TO Figure 5-8) (6) (7)
T2.8.1
T2.8.2
100 Mb/s PMD Output Pair tR and tF
5
ns
100 Mb/s tR and tF Mismatch
3
4
500
ps
100 Mb/s PMD Output Pair Transmit Jitter
1.4
ns
100BASE-TX RECEIVE PACKET LATENCY TIMING (REFER TO Figure 5-9) (8) (9) (10)
T2.9.1
Carrier Sense ON Delay
100 Mb/s Normal mode
20
bits
T2.9.2
Receive Data Latency
100 Mb/s Normal mode
24
bits
24
bits
100BASE-TX RECEIVE PACKET DEASSERTION TIMING (REFER TO Figure 5-10) (9) (11)
T2.10.1
Carrier Sense OFF Delay
100 Mb/s Normal mode
10 Mb/s MII TRANSMIT TIMING (REFER TO Figure 5-11) (12)
T2.11.1
TX_CLK High/Low Time
10 Mb/s MII mode
190
T2.11.2
TXD[3:0], TX_EN Data Setup to TX_CLK fall
10 Mb/s MII mode
25
200
210
ns
ns
T2.11.3
TXD[3:0], TX_EN Data Hold from TX_CLK rise
10 Mb/s MII mode
0
ns
10 Mb/s MII RECEIVE TIMING (REFER TOFigure 5-12) (13)
T2.12.1
RX_CLK High/Low Time
T2.12.2
RX_CLK to RXD[3:0], RX_DV Delay
10 Mb/s MII mode
160
100
200
240
ns
ns
T2.12.3
RX_CLK rising edge delay from RXD[3:0], RX_DV
Valid
10 Mb/s MII mode
100
ns
10BASE-T TRANSMIT TIMING (START OF PACKET) (REFER TO Figure 5-13) (14)
T2.13.1
Transmit Output Delay from the Falling Edge of
TX_CLK
10 Mb/s MII mode
3.5
bits
10BASE-T TRANSMIT TIMING (END OF PACKET) (REFER TO Figure 5-14)
T2.14.1
End of Packet High Time (with 0 ending bit)
250
300
ns
T2.14.2
End of Packet High Time (with 1 ending bit)
250
300
ns
10BASE-T RECEIVE TIMING (START OF PACKET) (REFER TO Figure 5-15) (14) (15)
T2.15.1
Carrier Sense Turnon Delay (PMD Input Pair to
CRS)
T2.15.2
RX_DV Latency
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
12
630
10
1000
ns
bits
RX_CLK may be held low or high for a longer period of time during transition between reference and recovered clocks. Minimum high
and low times will not be violated.
For Normal mode, latency is determined by measuring the time from the first rising edge of TX_CLK occurring after the assertion of
TX_EN to the first bit of the “J” code group as output from the PMD Output Pair. 1 bit time = 10 ns in 100 Mb/s mode.
Deassertion is determined by measuring the time from the first rising edge of TX_CLK occurring after the deassertion of TX_EN to the
first bit of the “T” code group as output from the PMD Output Pair. 1 bit time = 10 ns in 100 Mb/s mode.
Normal Mismatch is the difference between the maximum and minimum of all rise and fall times.
Rise and fall times taken at 10% and 90% of the +1 or –1 amplitude.
Carrier Sense On Delay is determined by measuring the time from the first bit of the “J” code group to the assertion of Carrier Sense.
1 bit time = 10 ns in 100 Mb/s mode.
PMD Input Pair voltage amplitude is greater than the Signal Detect Turnon Threshold Value.
Carrier Sense Off Delay is determined by measuring the time from the first bit of the “T” code group to the deassertion of Carrier Sense.
An attached Mac should drive the transmit signals using the positive edge of TX_CLK. As shown above, the MII signals are sampled on
the falling edge of TX_CLK.
RX_CLK may be held low for a longer period of time during transition between reference and recovered clocks. Minimum high and low
times will not be violated.
1 bit time = 100 ns in 10 Mb/s mode.
10BASE-T RX_DV Latency is measured from first bit of preamble on the wire to the assertion of RX_DV
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
AC Timing Requirements (continued)
MIN
T2.15.3
Receive Data Latency
Measurement shown from SFD
NOM
MAX
8
UNIT
bits
10BASE-T RECEIVE TIMING (END OF PACKET) (REFER TO Figure 5-16)
T2.16.1
Carrier Sense Turn Off Delay
1
µs
10Mb/s HEARTBEAT TIMING (REFER TO Figure 5-17)
T2.17.1
CD Heartbeat Delay
All 10 Mb/s modes
1200
ns
T2.17.2
CD Heartbeat Duration
All 10 Mb/s modes
1000
ns
85
ms
500
ms
10 Mb/s JABBER TIMING (REFER TO Figure 5-18)
T2.18.1
Jabber Activation Time
T2.18.2
Jabber Deactivation Time
10BASE-T NORMAL LINK PULSE TIMING (REFER TO Figure 5-19) (16)
T2.19.1
Pulse Width
100
ns
T2.19.2
Pulse Period
16
ms
AUTO-NEGOTIATION FAST LINK PULSE (FLP) TIMING (REFER TO Figure 5-20) (16)
T2.20.1
Clock, Data Pulse Width
100
ns
T2.20.2
Clock Pulse to Clock Pulse Period
125
µs
T2.20.3
Clock Pulse to Data Pulse Period
T2.20.4
Burst Width
T2.20.5
FLP Burst to FLP Burst Period
Data = 1
62
µs
2
ms
16
ms
100BASE-TX SIGNAL DETECT TIMING (REFER TO Figure 5-22) (17)
T2.21.1
SD Internal Turnon Time
1
ms
T2.21.2
SD Internal Turnoff Time
350
µs
240
ns
2
µs
100 Mb/s INTERNAL LOOPBACK TIMING (REFER TO Figure 5-22) (18) (19)
T2.22.1
TX_EN to RX_DV Loopback
100 Mb/s internal loopback mode
10 Mb/s INTERNAL LOOPBACK TIMING (REFER TO Figure 5-23) (19)
T2.23.1
TX_EN to RX_DV Loopback
10 Mb/s internal loopback mode
RMII TRANSMIT TIMING (REFER TO Figure 5-24)
T2.24.1
X1 Clock Period
T2.24.2
TXD[1:0], TX_EN, Data Setup to X1 rising
50-MHz Reference Clock
4
20
T2.24.3
TXD[1:0], TX_EN, Data Hold from X1 rising
2
T2.24.4
X1 Clock to PMD Output Pair Latency
From X1 Rising edge to first bit of symbol
ns
ns
ns
17
bits
20
ns
RMII RECEIVE TIMING (REFER TO Figure 5-25) (20) (21) (22) (23) (24) (25)
T2.25.1
X1 Clock Period
50-MHz Reference Clock
T2.25.2
RXD[1:0], CRS_DV, RX_DV, and RX_ER output
delay from X1 rising
T2.25.3
CRS ON delay
From JK symbol on PMD Receive Pair to initial assertion
of CRS_DV
T2.25.4
CRS OFF delay
T2.25.5
RXD[1:0] and RX_ER latency
2
14
ns
18.5
bits
From TR symbol on PMD Receive Pair to initial
deassertion of CRS_DV
27
bits
From symbol on Receive Pair. Elasticity buffer set to
default value (01)
38
bits
(16) These specifications represent transmit timings.
(17) The signal amplitude on PMD Input Pair must be TP-PMD compliant.
(18) Due to the nature of the descrambler function, all 100BASE-TX Loopback modes will cause an initial “dead-time” of up to 550 µs during
which time no data will be present at the receive MII outputs. The 100BASE-TX timing specified is based on device delays after the
initial 550 µs “dead-time”.
(19) Measurement is made from the first rising edge of TX_CLK after assertion of TX_EN.
(20) Per the RMII Specification, output delays assume a 25-pF load.
(21) CRS_DV is asserted asynchronously in order to minimize latency of control signals through the Phy. CRS_DV may toggle
synchronously at the end of the packet to indicate CRS deassertion.
(22) RX_DV is synchronous to X1. While not part of the RMII specification, this signal is provided to simplify recovery of receive data.
(23) CRS ON delay is measured from the first bit of the JK symbol on the PMD Input Pair to initial assertion of CRS_DV.
(24) CRS OFF delay is measured from the first bit of the TR symbol on the PMD Input Pair to initial deassertion of CRS_DV.
(25) Receive Latency is measured from the first bit of the symbol pair on the PMD Input Pair. Typical values are with the Elasticity Buffer set
to the default value (01).
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AC Timing Requirements (continued)
MIN
NOM
MAX
UNIT
ISOLATION TIMING (REFER TO Figure 5-26)
T2.26.1
From software clear of bit 10 in the BMCR register
to the transition from Isolate to Normal Mode
100
µs
T2.26.2
From Deassertion of S/W or H/W Reset to
transition from Isolate to Normal mode
500
µs
5
ns
100 Mb/s X1 TO TX_CLK TIMING (REFER TO Figure 5-27)
T2.27.1
X1 to TX_CLK delay
(26)
100 Mb/s Normal mode
0
(26) X1 to TX_CLK timing is provided to support devices that use X1 instead of TX_CLK as the reference for transmit Mll data.
Vcc
X1 clock
T2.1.1
Hardware
RESET_N
32 clocks
MDC
T2.1.2
Latch-In of Hardware
Configuration Pins
T2.1.3
input
output
Dual Function Pins
Become Enabled As Outputs
Figure 5-1. Power Up Timing
14
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
Vcc
X1 clock
T2.2.1
T2.2.4
Hardware
RESET_N
32 clocks
MDC
T2.2.2
Latch-In of Hardware
Configuration Pins
T2.2.3
input
output
Dual Function Pins
Become Enabled As Outputs
Figure 5-2. Reset Timing
MDC
T2.3.4
T2.3.1
MDIO (output)
MDC
T2.3.2
T2.3.3
Valid Data
MDIO (input)
Figure 5-3. MII Serial Management Timing
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T2.4.1
T2.4.1
TX_CLK
T2.4.2
TXD[3:0]
TX_EN
T2.4.3
Valid Data
Figure 5-4. 100 Mb/s MII Transmit Timing
T2.5.1
T2.5.1
RX_CLK
T2.5.2
RXD[3:0]
RX_DV
RX_ER
Valid Data
Figure 5-5. 100 Mb/s MII Receive Timing
TX_CLK
TX_EN
TXD
PMD Output Pair
T2.6.1
IDLE
(J/K)
DATA
Figure 5-6. 100BASE-TX Transmit Packet Latency Timing
16
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
TX_CLK
TX_EN
TXD
T2.7.1
PMD Output Pair
DATA
DATA
(T/R)
(T/R)
IDLE
IDLE
Figure 5-7. 100BASE-TX Transmit Packet Deassertion Timing
T2.8.1
+1 rise
90%
10%
PMD Output Pair
10%
+1 fall
90%
T2.8.1
-1 fall
-1 rise
T2.8.1
T2.8.1
T2.8.2
PMD Output Pair
eye pattern
T2.8.2
Figure 5-8. 100BASE-TX Transmit Timing (tR/F and Jitter)
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PMD Input Pair
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IDLE
Data
(J/K)
T2.9.1
CRS
T2.9.2
RXD[3:0]
RX_DV
RX_ER
Figure 5-9. 100BASE-TX Receive Packet Latency Timing
PMD Input Pair
DATA
IDLE
(T/R)
T2.10.1
CRS
Figure 5-10. 100BASE-TX Receive Packet Deassertion Timing
T2.11.1
T2.11.1
TX_CLK
T2.11.2
TXD[3:0]
TX_EN
T2.11.3
Valid Data
Figure 5-11. 10 Mb/s MII Transmit Timing
T2.12.1
T2.12.1
RX_CLK
T2.12.2
RXD[3:0]
RX_DV
T2.12.3
Valid Data
Figure 5-12. 10 Mb/s MII Receive Timing
18
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
TX_CLK
TX_EN
TXD
PMD Output Pair
T2.13.1
Figure 5-13. 10BASE-T Transmit Timing (Start of Packet)
TX_CLK
TX_EN
0
PMD Output Pair
T2.14.1
0
T2.14.2
PMD Output Pair
1
1
Figure 5-14. 10BASE-T Transmit Timing (End of Packet)
1st SFD bit decoded
1
0
1
0
1
0
101011
TPRD±
T2.15.1
CRS
RX_CLK
T2.15.2
RX_DV
RXD[3:0]
T2.15.3
0000
Preamble
SFD
Data
Figure 5-15. 10BASE-T Receive Timing (Start of Packet)
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1
0
IDLE
1
PMD Input Pair
RX_CLK
T2.16.1
CRS
Figure 5-16. 10BASE-T Receive Timing (End of Packet)
TX_EN
TX_CLK
T2.17.1
T2.17.2
COL
Figure 5-17. 10 Mb/s Heartbeat Timing
TXE
T2.18.1
T2.18.2
PMD Output Pair
COL
Figure 5-18. 10 Mb/s Jabber Timing
T2.19.2
T2.19.1
Normal Link Pulse(s)
Figure 5-19. 10BASE-T Normal Link Pulse Timing
20
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
T2.20.2
T2.20.3
T2.20.1
T2.20.1
Fast Link Pulse(s)
clock
pulse
data
pulse
clock
pulse
T2.20.5
T2.20.4
FLP Burst
FLP Burst
Figure 5-20. Auto-Negotiation Fast Link Pulse (FLP) Timing
PMD Input Pair
T2.21.1
T2.21.2
SD+ internal
Figure 5-21. 100BASE-TX Signal Detect Timing
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TX_CLK
TX_EN
TXD[3:0]
CRS
T2.22.1
RX_CLK
RX_DV
RXD[3:0]
Figure 5-22. 100 Mb/s Internal Loopback Timing
TX_CLK
TX_EN
TXD[3:0]
CRS
T2.23.1
RX_CLK
RX_DV
RXD[3:0]
Figure 5-23. 10 Mb/s Internal Loopback Timing
22
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
T2.24.1
X1
T2.24.2
TXD[1:0]
TX_EN
T2.24.3
Valid Data
T2.24.4
PMD Output Pair
Symbol
Figure 5-24. RMII Transmit Timing
PMD Input Pair
IDLE
Data
(J/K)
Data
(TR)
T2.25.4
T2.25.5
X1
T2.25.2
T2.25.1
T2.25.2
T2.25.2
ISOLATE
NORMAL
T2.25.3
RX_DV
CRS_DV
T2.25.2
RXD[1:0]
RX_ER
Figure 5-25. RMII Receive Timing
Clear bit 10 of BMCR
(return to normal operation
from Isolate mode)
T2.26.1
H/W or S/W Reset
(with PHYAD = 00000)
T2.26.2
MODE
Figure 5-26. Isolation Timing
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X1
T2.27.1
TX_CLK
Figure 5-27. 100 Mb/s X1 to TX_CLK Timing
24
Specifications
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SNLS250E – MAY 2008 – REVISED APRIL 2015
6 Detailed Description
6.1
Overview
The device is 10/100 Mbps Ethernet transceiver with an extended temperature range of -40°C to 105°C.
The ability to perform over extreme temperatures makes this device ideal for demanding environments like
automotive, transportation and industrial applications.
The device is AEC-Q100 Grade 2 certified. Its 3.3-V operating voltage and less than 270-mW typical
power consumption makes this device suitable for low-power applications.
The device has Auto MDIX capability to select MDI or MDIX automatically. It supports Auto-Negotiation for
selecting the highest performance mode of operation. This functionality can be turned off if a particular
mode is to be forced.
The device supports both MII and RMII interface, thus being more flexible and increasing the number of
compatible MPU. MII and RMII options can be selected using strap options or register control. The device
operates with 25-MHz clock when in MII mode and requires a 50-MHz clock when in RMII mode.
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6.2
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Functional Block Diagram
RX_CLK
RXD[3:0]
RX_DV
RX_ER
COL
MDC
MDIO
TX_EN
TXD[3:0]
TX_CLK
SERIAL
MANAGEMENT
CRS/CRS_DV
MII/RMII
MII/RMII INTERFACE
TX_DATA
RX_CLK
TX_CLK
RX_DATA
MII
Registers
10BASE-T and
100BASE-TX
10BASE-T and
100BASE-TX
Auto-Negotiation
State Machine
Transmit
Block
Receive
Block
Clock
Generation
ADC
DAC
Auto-MDIX
TD±
26
Detailed Description
RD±
LED
Driver
REFERENCE CLOCK
LED/s
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6.3
SNLS250E – MAY 2008 – REVISED APRIL 2015
Feature Description
This section includes information on the various configurable features available with the DP83848x. The
configurations features described below include:
• Auto-Negotiation
• Auto-MDIX
• LED Interface
• Internal Loopback
• BIST
• Energy Detect Mode
6.3.1
Auto-Negotiation
The Auto-Negotiation function provides a mechanism for exchanging configuration information between
two ends of a link segment and automatically selecting the highest performance mode of operation
supported by both devices. Fast Link Pulse (FLP) Bursts provide the signaling used to communicate AutoNegotiation abilities between two devices at each end of a link segment. For further detail regarding AutoNegotiation, refer to Clause 28 of the IEEE 802.3 specification. The DP83848x supports four different
Ethernet protocols (10 Mb/s Half Duplex, 10 Mb/s Full Duplex, 100 Mb/s Half Duplex, and 100 Mb/s Full
Duplex), so the inclusion of Auto-Negotiation ensures that the highest performance protocol will be
selected based on the advertised ability of the Link Partner. In DP83848x, the Auto-Negotiation function
can be controlled either by internal register access or by the use of AN0 and AN1 pins.
6.3.1.1
Auto-Negotiation Pin Control
The state of AN0 and AN1 pins determine the specific mode advertised by the device as given in Table 61. The state of AN0 and AN1 pins, upon power up/reset, determines the state of bits [8:5] of the ANAR
register.
The Auto-Negotiation function selected at power up or reset can be changed at any time by writing to the
Basic Mode Control Register (BMCR) at address 0x00h.
Table 6-1. Auto-Negotiation Modes in DP83848x
6.3.1.2
AN1
AN0
0
0
ADVERTISED MODE
10BASE-T, Half/Full-Duplex
0
1
100BASE-TX, Half/Full-Duplex
1
0
10BASE-T, Half-Duplex
100BASE-TX, Half-Duplex
1
1
10BASE-T, Half/Full-Duplex
100BASE-TX, Half/Full-Duplex
Auto-Negotiation Register Control
When Auto-Negotiation is enabled, the DP83848x transmits the abilities programmed into the AutoNegotiation Advertisement register (ANAR) at address 04h through FLP Bursts. Any combination of 10
Mb/s, 100 Mb/s, Half-Duplex, and Full Duplex modes may be selected.
Auto-Negotiation Priority Resolution:
1. 100BASE-TX Full Duplex (Highest Priority)
2. 100BASE-TX Half Duplex
3. 10BASE-T Full Duplex
4. 10BASE-T Half Duplex (Lowest Priority)
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The Basic Mode Control Register (BMCR) at address 00h provides control for enabling, disabling, and
restarting the Auto-Negotiation process. When Auto-Negotiation is disabled, the Speed Selection bit in the
BMCR controls switching between 10 Mb/s or 100 Mb/s operation, and the Duplex Mode bit controls
switching between full duplex operation and half duplex operation. The Speed Selection and Duplex Mode
bits have no effect on the mode of operation when the Auto-Negotiation Enable bit is set.
The Link Speed can be examined through the PHY Status Register (PHYSTS) at address 10h after a Link
is achieved.
The Basic Mode Status Register (BMSR) indicates the set of available abilities for technology types, AutoNegotiation ability, and Extended Register Capability. These bits are permanently set to indicate the full
functionality of the DP83848x (only the 100BASE-T4 bit is not set because the DP83848x does not
support that function).
The BMSR also provides status on:
• Completion of Auto-Negotiation
• Occurrence of a remote fault as advertised by the Link Partner
• Establishment of a valid link
• Support for Management Frame Preamble suppression
The Auto-Negotiation Advertisement Register (ANAR) indicates the Auto-Negotiation abilities to be
advertised by the DP83848x. All available abilities are transmitted by default, but any ability can be
suppressed by writing to the ANAR. Updating the ANAR to suppress an ability is one way for a
management agent to change (restrict) the technology that is used.
The Auto-Negotiation Link Partner Ability Register (ANLPAR) at address 05h is used to receive the base
link code word as well as all next page code words during the negotiation. Furthermore, the ANLPAR will
be updated to either 0081h or 0021h for parallel detection to either 100 Mb/s or 10 Mb/s respectively.
The Auto-Negotiation Expansion Register (ANER) indicates additional Auto-Negotiation status. The ANER
provides status on:
• Occurrence of a Parallel Detect Fault
• Next Page function support by the Link Partner
• Next page support function by DP83848x
• Reception of the current page that is exchanged by AutoNegotiation
• Auto-Negotiation support by the Link Partner
6.3.1.3
Auto-Negotiation Parallel Detection
The DP83848x supports the Parallel Detection function as defined in the IEEE 802.3 specification. Parallel
Detection requires both the 10 Mb/s and 100 Mb/s receivers to monitor the receive signal and report link
status to the Auto-Negotiation function. Auto-Negotiation uses this information to configure the correct
technology in the event that the Link Partner does not support Auto-Negotiation but is transmitting link
signals that the 100BASE-TX or 10BASE-T PMAs recognize as valid link signals.
If the DP83848x completes Auto-Negotiation as a result of Parallel Detection, bit 5 or bit 7 within the
ANLPAR register will be set to reflect the mode of operation present in the Link Partner. Note that bits 4:0
of the ANLPAR will also be set to 00001 based on a successful parallel detection to indicate a valid 802.3
selector field. Software may determine that negotiation completed through Parallel Detection by reading a
zero in the Link Partner Auto-Negotiation Able bit once the Auto-Negotiation Complete bit is set. If
configured for parallel detect mode and any condition other than a single good link occurs then the parallel
detect fault bit will be set.
28
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6.3.1.4
SNLS250E – MAY 2008 – REVISED APRIL 2015
Auto-Negotiaion Restart
Once Auto-Negotiation has completed, it may be restarted at any time by setting bit 9 (Restart AutoNegotiation) of the BMCR to one. If the mode configured by a successful Auto-Negotiation loses a valid
link, then the Auto-Negotiation process will resume and attempt to determine the configuration for the link.
This function ensures that a valid configuration is maintained if the cable becomes disconnected.
A renegotiation request from any entity, such as a management agent, will cause the DP83848x to halt
any transmit data and link pulse activity until the break_link_timer expires (approximately 1500 ms).
Consequently, the Link Partner will go into link fail and normal Auto-Negotiation resumes. The DP83848x
will resume Auto-Negotiation after the break_link_timer has expired by issuing FLP (Fast Link Pulse)
bursts.
6.3.1.5
Auto-Negotiation Complete Time
Parallel detection and Auto-Negotiation take approximately 2-3 seconds to complete. In addition, AutoNegotiation with next page should take approximately 2-3 seconds to complete, depending on the number
of next pages sent.
Refer to Clause 28 of the IEEE 802.3 standard for a full description of the individual timers related to AutoNegotiation.
6.3.2
Auto-MDIX
When enabled, this function uses Auto-Negotiation to determine the proper configuration for transmission
and reception of data and subsequently selects the appropriate MDI pair for MDI/MDIX operation. The
function uses a random seed to control switching of the crossover circuitry. This implementation complies
with the corresponding IEEE 802.3 Auto-Negotiation and Crossover Specifications.
Auto-MDIX is enabled by default and can be configured through strap or through PHYCR (0x19h) register,
bits [15:14]. Neither Auto-Negotiation nor Auto-MDIX is required to be enabled in forcing crossover of the
MDI pairs. Forced crossover can be achieved through the FORCE_MDIX bit, bit 14 of PHYCR (0x19h)
register.
NOTE
Auto-MDIX will not work in a forced mode of operation.
6.3.3
LED Interface
The DP83848J/K supports configurable Light Emitting Diode (LED) pins for configuring the link and speed.
The DP83848H/M/T supports a configurable Light Emitting Diode (LED) pin for configuring the link.
Additional configuration of LED_LINK can be achieved using bit [5] of the PHY Control Register (PHYCR)
at register address 19h.
See Table 6-2 for LED Mode selection of DP83848x.
Table 6-2. LED Mode Select for DP83848x
(1)
MODE
LED_CFG[0]
(bit 5) or (pin 33)
1
1
ON for Good Link
OFF for No Link
ON in 100Mb/s
OFF in 10Mb/s
2
0
ON for Good Link
BLINK for Activity
ON in 100Mb/s
OFF in 10Mb/s
LED_SPEED (1)
LED_LINK
LED_SPEED only supported for DP83848J/K.
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The LED_LINK pin in Mode 1 indicates the link status of the port. In 100BASE-T mode, link is established
as a result of input receive amplitude compliant with the TPPMD specifications which will result in internal
generation of signal detect. A 10 Mb/s Link is established as a result of the reception of at least seven
consecutive normal Link Pulses or the reception of a valid 10BASE-T packet. This will cause the assertion
of LED_LINK. LED_LINK will deassert in accordance with the Link Loss Timer as specified in the IEEE
802.3 specification.
The LED_LINK pin in Mode 1 will be OFF when no LINK is present.
The LED_LINK pin in Mode 2 will be ON to indicate Link is good and BLINK to indicate activity is present
on either transmit or receive activity.
The LED_SPEED pin in DP83848J/K indicates 10 or 100 Mb/s data rate of the port. The standard CMOS
driver goes high when operating in 100Mb/s operation. The functionality of this LED is independent of the
mode selected.
Because these LED pins are also used as strap options, the polarity of the LED is dependent on whether
the pin is pulled up or down.
6.3.3.1
LED
Because the Auto-Negotiation strap options share the LED output pins, the external components required
for strapping and LED usage must be considered in order to avoid contention.
Specifically, when the LED output is used to drive the LED directly, the active state of the output driver is
dependent on the logic level sampled by the AN input upon power up/reset. For example, if the AN input is
resistively pulled low then the corresponding output will be configured as an active high driver.
Conversely, if the AN input is resistively pulled high, then the corresponding output will be configured as
an active low driver.
Refer to Figure 6-1 for an example of AN connection to external components. In this example, the AN
strapping results in Auto-Negotiation with 10BASE-T Half-Duplex , 100BASE-TX, Half-Duplex advertised.
VCC
275Ω
2.2kΩ
275Ω
AN0 = 0
AN1 = 1
LED_LINK
LED_SPEED
The adaptive nature of the LED output helps to simplify potential implementation issues of this dualpurpose pin.
Note: LED_SPEED only supported for DP83848J/K.
Figure 6-1. AN Strapping and LED Loading Example
30
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6.3.3.2
SNLS250E – MAY 2008 – REVISED APRIL 2015
LED Direct Control
The DP83848x provides another option to directly control the LED outputs through the LED Direct Control
Register (LEDCR), address 18h. The register does not provide read access to the LED.
6.3.4
Internal Loopback
The DP83848x includes a Loopback Test mode for facilitating system diagnostics. The Loopback mode is
selected through bit 14 (Loopback) of the Basic Mode Control Register (BMCR). Writing 1 to this bit
enables MII transmit data to be routed to the MII receive outputs. Loopback status may be checked in bit 3
of the PHY Status Register (PHYSTS). While in Loopback mode the data will not be transmitted onto the
media. To ensure that the desired operating mode is maintained, Auto-Negotiation should be disabled
before selecting the Loopback mode.
6.3.5
BIST
The DP83848x incorporates an internal Built-in Self Test (BIST) circuit to accommodate in-circuit testing or
diagnostics. The BIST circuit can be used to test the integrity of the transmit and receive data paths. BIST
testing can be performed with the part in the internal loopback mode or externally looped back using a
loopback cable fixture.
The BIST is implemented with independent transmit and receive paths, with the transmit block generating
a continuous stream of a pseudo random sequence. The user can select a 9 bit or 15 bit pseudo random
sequence from the PSR_15 bit in the PHY Control Register (PHYCR). The received data is compared to
the generated pseudo-random data by the BIST Linear Feedback Shift Register (LFSR) to determine the
BIST pass/fail status.
The pass/fail status of the BIST is stored in the BIST status bit in the PHYCR register. The status bit
defaults to 0 (BIST fail) and will transition on a successful comparison. If an error (mis-compare) occurs,
the status bit is latched and is cleared upon a subsequent write to the Start/Stop bit.
For transmit VOD testing, the Packet BIST Continuous Mode can be used to allow continuous data
transmission, setting BIST_CONT_MODE, bit 5, of CDCTRL1 (0x1Bh).
The number of BIST errors can be monitored through the BIST Error Count in the CDCTRL1 (0x1Bh), bits
[15:8].
6.3.6
Energy Detect Mode
When Energy Detect is enabled and there is no activity on the cable, the DP83848x will remain in a low
power mode while monitoring the transmission line. Activity on the line will cause the DP83848x to go
through a normal power-up sequence. Regardless of cable activity, the DP83848x will occasionally wake
up the transmitter to put ED pulses on the line, but will otherwise draw as little power as possible. Energy
detect functionality is controlled through register Energy Detect Control (EDCR), address 0x1Dh.
6.4
Device Functional Modes
The DP83848x supports two modes of operation using the MII interface pins. The options are defined in
the following sections and include:
• MII Mode
• RMII Mode
The modes of operation can be selected by strap options or register control. For RMII mode, it is required
to use the strap option, because it requires a 50-MHz clock instead of the normal 25 MHz.
In the each of these modes, the IEEE 802.3 serial management interface is operational for device
configuration and status. The serial management interface of the MII allows for the configuration and
control of multiple PHY devices, gathering of status, error information, and the determination of the type
and capabilities of the attached PHY(s).
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MII Interface
The DP83848x incorporates the Media Independent Interface (MII) as specified in Clause 22 of the IEEE
802.3 standard. This interface may be used to connect PHY devices to a MAC in 10/100 Mb/s systems.
This section describes the nibble wide MII data interface.
The nibble wide MII data interface consists of a receive bus and a transmit bus each with control signals
to facilitate data transfer between the PHY and the upper layer (MAC).
6.4.1.1
Nibble-wide MII Data Interface
Clause 22 of the IEEE 802.3 specification defines the Media Independent Interface. This interface includes
a dedicated receive bus and a dedicated transmit bus. These two data buses, along with various control
and status signals, allow for the simultaneous exchange of data between the DP83848x and the upper
layer agent (MAC).
The receive interface consists of a nibble wide data bus RXD[3:0], a receive error signal RX_ER, a receive
data valid flag RX_DV, and a receive clock RX_CLK for synchronous transfer of the data. The receive
clock operates at either 2.5 MHz to support 10 Mb/s operation modes or at 25 MHz to support 100 Mb/s
operational modes.
The transmit interface consists of a nibble wide data bus TXD[3:0], a transmit enable control signal
TX_EN, and a transmit clock TX_CLK which runs at either 2.5 MHz or 25 MHz.
Additionally, the MII includes the carrier sense signal CRS, as well as a collision detect signal COL. The
CRS signal asserts to indicate the reception of data from the network or as a function of transmit data in
Half Duplex mode. The COL signal asserts as an indication of a collision which can occur during halfduplex operation when both a transmit and receive operation occur simultaneously.
6.4.1.2
Collision Detect
For Half Duplex, a 10BASE-T or 100BASE-TX collision is detected when the receive and transmit
channels are active simultaneously. Collisions are reported by the COL signal on the MII.
If the DP83848x is transmitting in 10 Mb/s mode when a collision is detected, the collision is not reported
until seven bits have been received while in the collision state. This prevents a collision being reported
incorrectly due to noise on the network. The COL signal remains set for the duration of the collision.
If a collision occurs during a receive operation, it is immediately reported by the COL signal.
When heartbeat is enabled (only applicable to 10 Mb/s operation), approximately 1 µs after the
transmission of each packet, a Signal Quality Error (SQE) signal of approximately 10 bit times is
generated (internally) to indicate successful transmission. SQE is reported as a pulse on the COL signal of
the MII.
6.4.1.3
Carrier Sense
Carrier Sense (CRS) is asserted due to receive activity, once valid data is detected through the squelch
function during 10 Mb/s operation. During 100 Mb/s operation, CRS is asserted when a valid link (SD) and
two non-contiguous zeros are detected on the line.
For 10 or 100 Mb/s Half Duplex operation, CRS is asserted during either packet transmission or reception.
For 10 or 100 Mb/s Full Duplex operation, CRS is asserted only due to receive activity.
CRS is deasserted following an end of packet.
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6.4.2
SNLS250E – MAY 2008 – REVISED APRIL 2015
Reduced MII Interface
The DP83848x incorporates the Reduced Media Independent Interface (RMII) as specified in the RMII
specification (revision 1.2) from the RMII Consortium. This interface may be used to connect PHY devices
to a MAC in 10/100 Mb/s systems using a reduced number of pins. In this mode, data is transferred 2-bits
at a time using the 50-MHz RMII_REF clock for both transmit and receive. The following pins are used in
RMII mode:
• TX_EN
• TXD[1:0]
• RX_ER (optional for Mac)
• CRS_DV
• RXD[1:0]
• X1 (RMII Reference clock is 50 MHz)
In addition, the RMII mode supplies an RX_DV signal which allows for a simpler method of recovering
receive data without having to separate RX_DV from the CRS_DV indication. This is especially useful for
systems which do not require CRS, such as systems that only support full duplex operation. This signal is
also useful for diagnostic testing where it may be desirable to loop Receive RMII data directly to the
transmitter.
Because the reference clock operates at 10 times the data rate for 10 Mb/s operation, transmit data is
sampled every 10 clocks. Likewise, receive data will be generated every 10th clock so that an attached
device can sample the data every 10 clocks.
RMII mode requires a 50-MHz oscillator be connected to the device X1 pin. A 50-MHz crystal is not
supported.
To tolerate potential frequency differences between the 50-MHz reference clock and the recovered receive
clock, the receive RMII function includes a programmable elasticity buffer. The elasticity buffer is
programmable to minimize propagation delay based on expected packet size and clock accuracy. This
allows for supporting a range of packet sizes including jumbo frames.
The elasticity buffer will force Frame Check Sequence errors for packets which overrun or underrun the
FIFO. Underrun and Overrun conditions can be reported in the RMII and Bypass Register (RBR). The
following table indicates how to program the elasticity buffer FIFO (in 4-bit increments) based on expected
max packet size and clock accuracy. It assumes both clocks (RMII Reference clock and far-end
Transmitter clock) have the same accuracy.
Table 6-3. Supported Packet Sizes at ±50 ppm and ±100 ppm for Each Clock
START THRESHOLD
RBR[1:0]
LATENCY TOLERANCE
RECOMMENDED PACKET SIZE
at ±50 ppm
RECOMMENDED PACKET SIZE
at ±100 ppm
1 (4-bits)
2 bits
2400 bytes
1200 bytes
6.4.3
2 (8-bits)
6 bits
7200 bytes
3600 bytes
3 (12-bits)
10 bits
12000 bytes
6000 bytes
0 (16-bits)
14 bits
16800 bytes
8400 bytes
802.3 MII Serial Management Interface
6.4.3.1
Serial Management Register Access
The serial management MII specification defines a set of thirty-two 16-bit status and control registers that
are accessible through the management interface pins MDC and MDIO. The DP83848x implements all the
required MII registers as well as several optional registers. These registers are fully described in
Section 6.6. A description of the serial management access protocol follows.
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Serial Management Access Protocol
The serial control interface consists of two pins, Management Data Clock (MDC) and Management Data
Input/Output (MDIO). MDC has a maximum clock rate of 25 MHz and no minimum rate. The MDIO line is
bi-directional and may be shared by up to 32 devices. The MDIO frame format is shown below in Table 64.
The MDIO pin requires a pullup resistor (1.5 kΩ) which, during IDLE and turnaround, will pull MDIO high.
In order to initialize the MDIO interface, the station management entity sends a sequence of 32 contiguous
logic ones on MDIO to provide the DP83848x with a sequence that can be used to establish
synchronization. This preamble may be generated either by driving MDIO high for 32 consecutive MDC
clock cycles, or by simply allowing the MDIO pullup resistor to pull the MDIO pin high during which time 32
MDC clock cycles are provided. In addition, 32 MDC clock cycles should be used to re-sync the device if
an invalid start, opcode, or turnaround bit is detected.
The DP83848x waits until it has received this preamble sequence before responding to any other
transaction. Once the DP83848x serial management port has been initialized no further preamble
sequencing is required until after a power on/reset, invalid Start, invalid Opcode, or invalid turnaround bit
has occurred.
The Start code is indicated by a pattern. This assures the MDIO line transitions from the default idle
line state.
Turnaround is defined as an idle bit time inserted between the Register Address field and the Data field.
To avoid contention during a read transaction, no device shall actively drive the MDIO signal during the
first bit of Turnaround. The addressed DP83848x drives the MDIO with a zero for the second bit of
turnaround and follows this with the required data. Figure 6-2 shows the timing relationship between MDC
and the MDIO as driven/received by the Station (STA) and the DP83848x (PHY) for a typical register read
access.
For write transactions, the station management entity writes data to the addressed DP83848x thus
eliminating the requirement for MDIO Turnaround. The Turnaround time is filled by the management entity
by inserting . Figure 6-3 shows the timing relationship for a typical MII register write access.
Table 6-4. Typical MDIO Frame Format
MII MANAGEMENT SERIAL PROTOCOL
Read Operation
Write Operation
MDC
MDIO
Z
Z
(STA)
Z
MDIO
Z
(PHY)
Z
Idle
0 1 1 0 0 1 1 0 0 0 0 0 0 0
Start
Opcode
(Read)
PHY Address
(PHYAD = 0Ch)
Register Address
(00h = BMCR)
Z
0 0 0 1 1 0 0 0 1 0 0 0 0 0 0 0 0
TA
Register Data
Z
Idle
Figure 6-2. Typical MDC/MDIO Read Operation
34
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MDC
MDIO
Z
Z
(STA)
Z
Idle
0 1 0 1 0 1 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Start
Opcode
(Write)
PHY Address
(PHYAD = 0Ch)
Register Address
(00h = BMCR)
TA
Z
Idle
Register Data
Figure 6-3. Typical MDC/MDIO Write Operation
6.4.3.3
Serial Management Preamble Suppression
The DP83848x supports a Preamble Suppression mode as indicated by a one in bit 6 of the Basic Mode
Status Register (BMSR, address 01h.) If the station management entity (that is, MAC or other
management controller) determines that all PHYs in the system support Preamble Suppression by
returning a one in this bit, then the station management entity need not generate preamble for each
management transaction.
The DP83848x requires a single initialization sequence of 32 bits of preamble following hardware/software
reset. This requirement is generally met by the mandatory pullup resistor on MDIO in conjunction with a
continuous MDC, or the management access made to determine whether Preamble Suppression is
supported.
While the DP83848x requires an initial preamble sequence of 32 bits for management initialization, it does
not require a full 32-bit sequence between each subsequent transaction. A minimum of one idle bit
between management transactions is required as specified in the IEEE 802.3 specification.
6.4.4
PHY Address
The 5 PHY address inputs pins are shared with the RXD[3:0] pins and COL pin as shown in Table 6-5.
Table 6-5. PHY Address Mapping
PIN #
PHYAD FUNCTION
35
PHYAD0
RXD FUNCTION
COL
36
PHYAD1
RXD_0
37
PHYAD2
RXD_1
38
PHYAD3
RXD_2
39
PHYAD4
RXD_3
The DP83848x can be set to respond to any of 32 possible PHY addresses through strap pins. The
information is latched into the PHYCR register (address 19h, bits [4:0]) at device power up and hardware
reset. The PHY Address pins are shared with the RXD and COL pins. Each DP83848x or port sharing an
MDIO bus in a system must have a unique physical address.
The DP83848x supports PHY Address strapping values 0 () through 31 (). Strapping
PHY Address 0 puts the part into Isolate Mode. It should also be noted that selecting PHY Address 0
through an MDIO write to PHYCR will not put the device in Isolate Mode. See Section 6.4.4.1 for more
information.
For further detail relating to the latch-in timing requirements of the PHY Address pins, as well as the other
hardware configuration pins, refer to the Reset summary in Section 6.4.6.
Because the PHYAD[0] pin has weak internal pullup resistor and PHYAD[4:1] pins have weak internal
pulldown resistors, the default setting for the PHY address is 00001 (01h).
Refer to Figure 6-4 for an example of a PHYAD connection to external components. In this example, the
PHYAD strapping results in address 00011 (03h).
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MII Isolate Mode
The DP83848x can be put into MII Isolate mode by writing to bit 10 of the BMCR register or by strapping
in Physical Address 0. It should be noted that selecting Physical Address 0 through an MDIO write to
PHYCR will not put the device in the MII isolate mode.
When in the MII isolate mode, the DP83848x does not respond to packet data present at TXD[3:0],
TX_EN inputs and presents a high impedance on the TX_CLK, RX_CLK, RX_DV, RX_ER, RXD[3:0],
COL, and CRS outputs. When in Isolate mode, the DP83848x will continue to respond to all management
transactions.
While in Isolate mode, the PMD output pair will not transmit packet data but will continue to source
100BASE-TX scrambled idles or 10BASE-T normal link pulses.
COL
RXD_0
2.2kΩ
PHYAD0 = 1
PHYAD1 = 1
RXD_1
PHYAD2 = 0
PHYAD4= 0
PHYAD3 = 0
RXD_2
RXD_3
The DP83848x can Auto-Negotiate or parallel detect to a specific technology depending on the receive
signal at the PMD input pair. A valid link can be established for the receiver even when the DP83848x is
in Isolate mode.
VCC
Figure 6-4. PHYAD Strapping Example
6.4.5
Half Duplex vs Full Duplex
The DP83848x supports both half and full duplex operation at both 10 Mb/s and 100 Mb/s speeds.
Half-duplex relies on the CSMA/CD protocol to handle collisions and network access. In Half-Duplex
mode, CRS responds to both transmit and receive activity in order to maintain compliance with the IEEE
802.3 specification.
Because the DP83848x is designed to support simultaneous transmit and receive activity, it is capable of
supporting full-duplex switched applications with a throughput of up to 200 Mb/s per port when operating
in 100BASE-TX mode. Because the CSMA/CD protocol does not apply to full duplex operation, the
DP83848x disables its own internal collision sensing and reporting functions and modifies the behavior of
Carrier Sense (CRS) such that it indicates only receive activity. This allows a full-duplex capable MAC to
operate properly.
All modes of operation (100BASE-TX and 10BASE-T) can run either half-duplex or full-duplex.
Additionally, other than CRS and Collision reporting, all remaining MII signaling remains the same
regardless of the selected duplex mode.
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It is important to understand that while Auto-Negotiation with the use of Fast Link Pulse code words can
interpret and configure to full-duplex operation, parallel detection can not recognize the difference between
full and half-duplex from a fixed 10 Mb/s or 100 Mb/s link partner over twisted pair. As specified in the
802.3 specification, if a far-end link partner is configured to a forced full duplex 100BASE-TX ability, the
parallel detection state machine in the partner would be unable to detect the full duplex capability of the
far-end link partner. This link segment would negotiate to a half duplex 100BASE-TX configuration (same
scenario for 10 Mb/s).
6.4.6
Reset Operation
The DP83848x includes an internal power-on reset (POR) function and does not need to be explicitly reset
for normal operation after power up. If required during normal operation, the device can be reset by a
hardware or software reset.
6.4.6.1
Hardware Reset
A hardware reset is accomplished by applying a low pulse (TTL level), with a duration of at least 1 µs, to
the RESET_N. This will reset the device such that all registers will be reinitialized to default values and the
hardware configuration values will be re-latched into the device (similar to the power-up/reset operation).
6.4.6.2
Software Reset
A software reset is accomplished by setting the reset bit (bit 15) of the Basic Mode Control Register
(BMCR). The period from the point in time when the reset bit is set to the point in time when software
reset has concluded is approximately 1 µs.
The software reset will reset the device such that all registers will be reinitialized to default values and the
hardware configuration values will be re-latched into the device. Software driver code must wait 3 μs
following a software reset before allowing further serial MII operations.
6.4.7
Power Down
The device can be put in a Power Down mode by setting bit 11 (Power Down) in the Basic Mode Control
Register, BMCR (0x00h).
6.5
Programming
6.5.1
Architecture
This section describes the operations within each transceiver module, 100BASE-TX and 10BASE-T. Each
operation consists of several functional blocks and described in the following:
• 100BASE-TX Transmitter
• 100BASE-TX Receiver
• 10BASE-T Transceiver Module
6.5.1.1
100BASE-TX Transmitter
The 100BASE-TX transmitter consists of several functional blocks which convert synchronous 4-bit nibble
data, as provided by the MII, to a scrambled MLT-3 125 Mb/s serial data stream. Because the 100BASETX TP-PMD is integrated, the differential output pins, PMD Output Pair, can be directly routed to the
magnetics.
The Transmitter section consists of the following functional blocks:
• Code-group Encoder and Injection block
• Scrambler block (bypass option)
• NRZ to NRZI encoder block
• Binary to MLT-3 converter / Common Driver
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The bypass option for the functional blocks within the 100BASE-TX transmitter provides flexibility for
applications where data conversion is not always required. The DP83848x implements the 100BASE-TX
transmit state machine diagram as specified in the IEEE 802.3 Standard, Clause 24.
TX_CLK
DIVIDE
BY 5
TXD[3:0] /
TX_EN
4B5B CODE-GROUP
ENCODER &
INJECTOR
5B PARALLEL
TO SERIAL
125MHZ CLOCK
SCRAMBLER
MUX
BP_SCR
100BASE-TX
LOOPBACK
MLT[1:0]
NRZ TO NRZI
ENCODER
BINARY
TO MLT-3 /
COMMON
DRIVER
PMD OUTPUT PAIR
Figure 6-5. 100BASE-TX Transmit Block Diagram
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Table 6-6. 4B5B Code-Group Encoding/Decoding
DATA CODES
0
11110
1
1001
0
1
2
10100
10
3
10101
11
4
1010
100
5
1011
101
6
1110
110
7
1111
111
8
10010
1000
9
10011
1001
A
10110
1010
B
10111
1011
C
11010
1100
D
11011
1101
E
11100
1110
F
11101
1111
IDLE AND CONTROL CODES
H
100
I
11111
HALT code-group - Error code
Inter-Packet IDLE - 0000 (1)
J
11000
First Start of Packet - 0101
K
10001
Second Start of Packet - 0101
(1)
(1)
(1)
T
1101
First End of Packet - 0000
R
111
Second End of Packet - 0000 (1)
INVALID CODES
(1)
V
0
V
1
V
10
V
11
V
101
V
110
V
1000
V
1100
Control code-groups I, J, K, T and R in data fields will be mapped as invalid codes, together with RX_ER asserted.
6.5.1.1.1 Code-Group Encoding and Injection
The code-group encoder converts 4-bit (4B) nibble data generated by the MAC into 5-bit (5B) code-groups
for transmission. This conversion is required to allow control data to be combined with packet data codegroups. Refer to for 4B to 5B code-group mapping details. The code-group encoder substitutes the first 8bits of the MAC preamble with a J/K code-group pair (11000 10001) upon transmission.
The code-group encoder continues to replace subsequent 4B preamble and data nibbles with
corresponding 5B code-groups. At the end of the transmit packet, upon the deassertion of Transmit
Enable signal from the MAC, the code-group encoder injects the T/R code-group pair (01101 00111)
indicating the end of the frame.
After the T/R code-group pair, the code-group encoder continuously injects IDLEs into the transmit data
stream until the next transmit packet is detected (reassertion of Transmit Enable).
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6.5.1.1.2 Scrambler
The scrambler is required to control the radiated emissions at the media connector and on the twisted pair
cable (for 100BASE-TX applications). By scrambling the data, the total energy launched onto the cable is
randomly distributed over a wide frequency range. Without the scrambler, energy levels at the PMD and
on the cable could peak beyond FCC limitations at frequencies related to repeating 5B sequences (that is,
continuous transmission of IDLEs).
The scrambler is configured as a closed loop linear feed-back shift register (LFSR) with an 11-bit
polynomial. The output of the closed loop LFSR is X-ORd with the serial NRZ data from the code-group
encoder. The result is a scrambled data stream with sufficient randomization to decrease radiated
emissions at certain frequencies by as much as 20 dB. The DP83848x uses the PHY_ID (pins PHYAD
[4:0]) to set a unique seed value.
6.5.1.1.3 NRZ to NRZI Encoder
After the transmit data stream has been serialized and scrambled, the data must be NRZI encoded in
order to comply with the TP-PMD standard for 100BASE-TX transmission over Category-5 Unshielded
twisted pair cable.
6.5.1.1.4 Binary to MLT-3 Convertor
The Binary to MLT-3 conversion is accomplished by converting the serial binary data stream output from
the NRZI encoder into two binary data streams with alternately phased logic one events. These two binary
streams are then fed to the twisted pair output driver which converts the voltage to current and alternately
drives either side of the transmit transformer primary winding, resulting in a MLT-3 signal.
The 100BASE-TX MLT-3 signal sourced by the PMD Out- put Pair common driver is slew rate controlled.
This should be considered when selecting AC coupling magnetics to ensure TP-PMD Standard compliant
transition times (3 ns < Tr < 5 ns).
The 100BASE-TX transmit TP-PMD function within the DP83848x is capable of sourcing only MLT-3
encoded data. Binary output from the PMD Output Pair is not possible in 100 Mb/s mode.
6.5.1.2
100BASE-TX Receiver
The 100BASE-TX receiver consists of several functional blocks which convert the scrambled MLT-3 125
Mb/s serial data stream to synchronous 4-bit nibble data that is pro- vided to the MII. Because the
100BASE-TX TP-PMD is integrated, the differential input pins, RD±, can be directly routed from the AC
coupling magnetics.
See Figure 6-6 for a block diagram of the 100BASE-TX receive function. This provides an overview of
each functional block within the 100BASE-TX receive section.
The Receive section consists of the following functional blocks:
• Analog Front End
• Digital Signal Processor
• Signal Detect
• MLT-3 to Binary Decoder
• NRZI to NRZ Decoder
• Serial to Parallel
• Descrambler
• Code Group Alignment
• 4B/5B Decoder
• Link Integrity Monitor
• Bad SSD Detection
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6.5.1.2.1 Analog Front End
In addition to the Digital Equalization and Gain Control, the DP83848x includes Analog Equalization and
Gain Control in the Analog Front End. The Analog Equalization reduces the amount of Digital Equalization
required in the DSP.
6.5.1.2.2 Digital Signal Processor
The Digital Signal Processor includes Adaptive Equalization with Gain Control and Base Line Wander
Compensation.
RX_DV/CRS
RX_CLK
RXD[3:0] / RX_ER
4B/5B DECODER
SERIAL TO
PARALLEL
CODE GROUP
ALIGNMENT
RX_DATA VALID
SSD DETECT
LINK
INTEGRITY
MONITOR
DESCRAMBLER
NRZI TO NRZ
DECODER
MLT-3 TO BINARY
DECODER
SIGNAL
DETECT
DIGITAL
SIGNAL
PROCESSOR
ANALOG
FRONT
END
RD +/−
Figure 6-6. 100BASE-TX Receive Block Diagram
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6.5.1.2.3 Digital Adaptive Equalization and Gain Control
When transmitting data at high speeds over copper twisted pair cable, frequency dependent attenuation
becomes a concern. In high-speed twisted pair signaling, the frequency content of the transmitted signal
can vary greatly during normal operation based primarily on the randomness of the scrambled data
stream. This variation in signal attenuation caused by frequency variations must be compensated to
ensure the integrity of the transmission.
In order to ensure quality transmission when employing MLT-3 encoding, the compensation must be able
to adapt to various cable lengths and cable types depending on the installed environment. The selection of
long cable lengths for a given implementation, requires significant compensation which will overcompensate for shorter, less attenuating lengths. Conversely, the selection of short or intermediate cable
lengths requiring less compensation will cause serious under-compensation for longer length cables. The
compensation or equalization must be adaptive to ensure proper conditioning of the received signal
independent of the cable length.
The DP83848x uses an extremely robust equalization scheme referred as ‘Digital Adaptive Equalization.’
The Digital Equalizer removes ISI (inter-symbol interference) from the receive data stream by continuously
adapting to provide a filter with the inverse frequency response of the channel. Equalization is combined
with an adaptive gain control stage. This enables the receive 'eye pattern' to be opened sufficiently to
allow very reliable data recovery.
The curves given in Figure 6-7 illustrate attenuation at certain frequencies for given cable lengths. This is
derived from the worst case frequency vs attenuation figures as specified in the EIA/TIA Bulletin TSB-36.
These curves indicate the significant variations in signal attenuation that must be compensated for by the
receive adaptive equalization circuit.
Figure 6-7. EIA/TIA Attenuation vs Frequency for 0, 50, 100, 130 and 150 Meters of CAT 5 Cable
6.5.1.2.4 Base Line Wander Compensation
The DP83848x is completely ANSI TP-PMD compliant and includes Base Line Wander (BLW)
compensation. The BLW compensation block can successfully recover the TP-PMD defined “killer”
pattern.
BLW can generally be defined as the change in the average DC content, relatively short period over time,
of an AC coupled digital transmission over a given transmission medium (that is, copper wire).
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BLW results from the interaction between the low-frequency components of a transmitted bit stream and
the frequency response of the AC coupling components within the transmission system. If the lowfrequency content of the digital bit stream goes below the low-frequency pole of the AC coupling
transformers then the droop characteristics of the transformers will dominate resulting in potentially
serious BLW.
The digital oscilloscope plot provided in Figure 6-8 illustrates the severity of the BLW event that can
theoretically be generated during 100BASE-TX packet transmission. This event consists of approximately
800 mV of DC offset for a period of 120 µs. Left uncompensated, events such as this can cause packet
loss.
Figure 6-8. 100BASE-TX BLW Event
6.5.1.2.5 Signal Detect
The signal detect function of the DP83848x is incorporated to meet the specifications mandated by the
ANSI FDDI TP-PMD Standard as well as the IEEE 802.3 100BASE-TX Standard for both voltage
thresholds and timing parameters.
Note that the reception of normal 10BASE-T link pulses and fast link pulses per IEEE 802.3 AutoNegotiation by the 100BASE-TX receiver do not cause the DP83848x to assert signal detect.
6.5.1.2.6 MLT-3 to NRZI Decoder
The DP83848x decodes the MLT-3 information from the Digital Adaptive Equalizer block to binary NRZI
data.
6.5.1.2.7 NRZI to NRZ
In a typical application, the NRZI to NRZ decoder is required in order to present NRZ formatted data to the
descrambler.
6.5.1.2.8 Serial to Parallel
The 100BASE-TX receiver includes a Serial to Parallel converter which supplies 5-bit wide data symbols
to the PCS Rx state machine.
6.5.1.2.9 Descrambler
A serial descrambler is used to de-scramble the received NRZ data. The descrambler has to generate an
identical data scrambling sequence (N) in order to recover the original unscrambled data (UD) from the
scrambled data (SD) as represented in the equations:
SD = (UD ⊕ N)
UD = (SD ⊕ N)
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Synchronization of the descrambler to the original scrambling sequence (N) is achieved based on the
knowledge that the incoming scrambled data stream consists of scrambled IDLE data. After the
descrambler has recognized 12 consecutive IDLE code-groups, where an unscrambled IDLE code-group
in 5B NRZ is equal to five consecutive ones (11111), it will synchronize to the receive data stream and
generate unscrambled data in the form of unaligned 5B code-groups.
In order to maintain synchronization, the descrambler must continuously monitor the validity of the
unscrambled data that it generates. To ensure this, a line state monitor and a hold timer are used to
constantly monitor the synchronization status. Upon synchronization of the descrambler the hold timer
starts a 722-µs countdown. Upon detection of sufficient IDLE code-groups (58 bit times) within the 722-µs
period, the hold timer will reset and begin a new countdown. This monitoring operation will continue
indefinitely given a properly operating network connection with good signal integrity. If the line state
monitor does not recognize sufficient unscrambled IDLE code-groups within the 722-µs period, the entire
descrambler will be forced out of the current state of synchronization and reset in order to re-acquire
synchronization.
6.5.1.2.10 Code-Group Alignment
The code-group alignment module operates on unaligned 5-bit data from the descrambler (or, if the
descrambler is bypassed, directly from the NRZI/NRZ decoder) and converts it into 5B code-group data (5
bits). Code-group alig ment occurs after the J/K code-group pair is detected. Once the J/K code-group pair
(11000 10001) is detected, subsequent data is aligned on a fixed boundary.
6.5.1.2.11 4B/5B Decoder
The code-group decoder functions as a look up table that translates incoming 5B code-groups into 4B
nibbles. The code-group decoder first detects the J/K code-group pair preceded by IDLE code-groups and
replaces the J/K with MAC preamble. Specifically, the J/K 10-bit code-group pair is replaced by the nibble
pair (0101 0101). All subsequent 5B code-groups are converted to the corresponding 4B nibbles for the
duration of the entire packet. This conversion ceases upon the detection of the T/R code-group pair
denoting the End of Stream Delimiter (ESD) or with the reception of a minimum of two IDLE code-groups.
6.5.1.2.12 100BASE-TX Link Integrity Monitor
The 100 Base TX Link monitor ensures that a valid and stable link is established before enabling both the
Transmit and Receive PCS layer.
Signal detect must be valid for 395 µs to allow the link monitor to enter the 'Link Up' state, and enable the
transmit and receive functions.
6.5.1.2.13 Bad SSD Detection
A Bad Start of Stream Delimiter (Bad SSD) is any transition from consecutive idle code-groups to non-idle
code-groups which is not prefixed by the code-group pair /J/K.
If this condition is detected, the DP83848x will assert RX_ER and present RXD[3:0] = 1110 to the MII for
the cycles that correspond to received 5B code-groups until at least two IDLE code groups are detected.
In addition, the False Carrier Sense Counter register (FCSCR) will be incremented by one.
Once at least two IDLE code groups are detected, RX_ER and CRS become deasserted.
6.5.1.3
10BASE-T Transceiver Module
The 10BASE-T Transceiver Module is IEEE 802.3 compliant. It includes the receiver, transmitter, collision,
heart-beat, loopback, jabber, and link integrity functions, as defined in the standard. An external filter is not
required on the 10BASE-T interface because this is integrated inside the DP83848x. This section focuses
on the general 10BASE-T system level operation.
6.5.1.3.1 Operational Modes
The DP83848x has two basic 10BASE-T operational modes:
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•
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Half Duplex mode
Full Duplex mode
Half Duplex Mode— In Half Duplex mode the DP83848x functions as a standard IEEE 802.3 10BASE-T
transceiver supporting the CSMA/CD protocol.
Full Duplex Mode — In Full Duplex mode the DP83848x is capable of simultaneously transmitting and
receiving without asserting the collision signal. The DP83848x's 10 Mb/s ENDEC is designed to encode
and decode simultaneously.
6.5.1.3.2 Smart Squelch
The smart squelch is responsible for determining when valid data is present on the differential receive
inputs. The DP83848x implements an intelligent receive squelch to ensure that impulse noise on the
receive inputs will not be mistaken for a valid signal. Smart-squelch operation is independent of the
10BASE-T operational mode.
The squelch circuitry employs a combination of amplitude and timing measurements (as specified in the
IEEE 802.3 10BSE-T standard) to determine the validity of data on the twisted-pair inputs (refer to
Figure 6-9).
The signal at the start of a packet is checked by the smart squelch and any pulses not exceeding the
squelch level (either positive or negative, depending upon polarity) will be rejected. Once this first squelch
level is overcome correctly, the opposite squelch level must then be exceeded within 150 ns. Finally, the
signal must again exceed the original squelch level within a 150 ns to ensure that the input waveform will
not be rejected. This checking procedure results in the loss of typically three preamble bits at the
beginning of each packet.
Only after all these conditions have been satisfied will a control signal be generated to indicate to the
remainder of the circuitry that valid data is present. At this time, the smart squelch circuitry is reset.
Valid data is considered to be present until the squelch level has not been generated for a time longer
than 150 ns, indicating the End of Packet. Once good data has been detected, the squelch levels are
reduced to minimize the effect of noise causing premature End of Packet detection.
9k bytes) without loss of synchronization.
1 = 2ms
0 = 722us (per ANSI X3.263: 1995 (TP-PMD) 7.2.3.3e)
6
RESERVED
0
RESERVED: Must be zero.
5
FORCE_100_OK
0, RW
Force 100Mb/s Good Link:
1 = Forces 100Mb/s Good Link.
0 = Normal 100Mb/s operation.
4
RESERVED
0
RESERVED: Must be zero.
3
RESERVED
0
RESERVED: Must be zero.
2
NRZI_BYPASS
0, RW
NRZI Bypass Enable:
1 = NRZI Bypass Enabled.
0 = NRZI Bypass Disabled.
1
RESERVED
0
RESERVED: Must be zero.
0
RESERVED
0
RESERVED: Must be zero.
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6.6.1.2.5 RMII and Bypass Register (RBR)
This register configures the RMII Mode of operation. When RMII mode is disabled, the RMII functionality is
bypassed.
Table 6-22. RMII and Bypass Register (RBR), address 0x17
Bit Name
Default
Description
15:6
Bit
RESERVED
0, RO
RESERVED: Writes ignored, Read as 0.
5
RMII_MODE
Strap, RW
Reduced MII Mode:
0 = Standard MII Mode
1 = Reduced MII Mode
4
RMII_REV1_0
0, RW
Reduce MII Revision 1.0:
0 = (RMII revision 1.2) CRS_DV will toggle at the end of a packet to indicate deassertion of
CRS.
1 = (RMII revision 1.0) CRS_DV will remain asserted until final data is transferred. CRS_DV
will not toggle at the end of a packet.
3
RX_OVF_STS
0, RO
RX FIFO Over Flow Status:
0 = Normal
1 = Overflow detected
2
RX_UNF_STS
0, RO
RX FIFO Under Flow Status:
0 = Normal
1 = Underflow detected
ELAST_BUF[1:0]
1, RW
Receive Elasticity Buffer. This field controls the Receive Elasticity Buffer which allows for
frequency variation tolerance between the 50-MHz RMII clock and the recovered data. The
following value indicate the tolerance in bits for a single packet. The minimum setting allows
for standard Ethernet frame sizes at ±50 ppm accuracy for both RMII and Receive clocks. For
greater frequency tolerance the packet lengths may be scaled (that is, for ±100 ppm, the
packet lengths need to be divided by 2).
00 = 14 bit tolerance (up to 16800 byte packets)
01 = 2 bit tolerance (up to 2400 byte packets)
10 = 6 bit tolerance (up to 7200 byte packets)
11 = 10 bit tolerance (up to 12000 byte packets)
1:0
6.6.1.2.6 LED Direct Control Register (LEDCR)
This register provides the ability to directly control the LED outputs. It does not provide read access to the
LEDs.
Table 6-23. LED Direct Control Register (LEDCR), address 0x18
Bit Name
Default
Description
15:6
Bit
RESERVED
0, RO
RESERVED: Writes ignored, read as 0.
5 (1)
DRV_SPDLED
0, RW
1 = Drive value of SPDLED bit onto LED_SPEED output
0 = Normal operation
4
DRV_LNKLED
0, RW
1 = Drive value of LNKLED bit onto LED_LINK output
0 = Normal operation
3
RESERVED
0
RESERVED: Must be zero.
(1)
SPDLED
0, RW
Value to force on LED_SPEED output
1
LNKLED
0, RW
Value to force on LED_LINK output
0
RESERVED
0
RESERVED: Must be zero.
2
(1)
60
DP83848J/K only.
Detailed Description
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6.6.1.2.7 PHY Control Register (PHYCR)
Table 6-24. PHY Control Register (PHYCR), address 0x19
Bit
Bit Name
Default
Description
15
MDIX_EN
Strap, RW
Auto-MDIX Enable:
1 = Enable Auto-neg Auto-MDIX capability.
0 = Disable Auto-neg Auto-MDIX capability.
The Auto-MDIX algorithm requires that the Auto-Negotiation Enable bit in the BMCR register
to be set. If Auto-Negotiation is not enabled, Auto-MDIX should be disabled as well.
14
FORCE_MDIX
0, RW
Force MDIX:
1 = Force MDI pairs to cross. (Receive on TPTD pair, Transmit on TPRD pair)
0 = Normal operation.
13
PAUSE_RX
0, RO
Pause Receive Negotiated:
Indicates that pause receive should be enabled in the MAC. Based on ANAR[11:10] and
ANLPAR[11:10] settings.
This function shall be enabled according to IEEE 802.3 Annex 28B Table 28B-3, “Pause
Resolution”, only if the Auto-Negotiated Highest Common Denominator is a full duplex
technology.
12
PAUSE_TX
0, RO
Pause Transmit Negotiated:
Indicates that pause transmit should be enabled in the MAC. Based on ANAR[11:10] and
ANLPAR[11:10] settings.
This function shall be enabled according to IEEE 802.3 Annex 28B Table 28B-3, “Pause
Resolution”, only if the Auto-Negotiated Highest Common Denominator is a full duplex
technology.
11
BIST_FE
0, RW/SC
BIST Force Error:
1 = Force BIST Error.
0 = Normal operation.
10
PSR_15
0, RW
BIST Sequence select:
1 = PSR15 selected.
0 = PSR9 selected.
9
BIST_STATUS
0, LL/RO
BIST Test Status:
1 = BIST pass.
0 = BIST fail. Latched, cleared when BIST is stopped.
8
BIST_START
0, RW
BIST Start:
1 = BIST start.
0 = BIST stop.
7
BP_STRETCH
0, RW
Bypass LED Stretching:
This bit forces a single error, and is self clearing.
For a count number of BIST errors, see the BIST Error Count in the CDCTRL1 register.
This will bypass the LED stretching and the LEDs will reflect the internal value.
1 = Bypass LED stretching.
0 = Normal operation.
6
RESERVED
0
RESERVED: Must be zero.
5
LED_CNFG[0]
Strap, RW
LED Configuration
LED_ CNFG[0]
Mode Description
1
Mode 1
0
Mode2
In Mode 1, LEDs are configured as follows: LED_LINK = ON for Good Link, OFF for No Link
LED_SPEED = ON in 100Mb/s, OFF in 10Mb/s
In Mode 2, LEDs are configured as follows: LED_LINK = ON for good Link, BLINK for Activity
LED_SPEED = ON in 100Mb/s, OFF in 10Mb/s
4:0
PHYADDR[4:0]
Strap, RW
PHY Address: PHY address for port.
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6.6.1.2.8 10BASE-T Status/Control Register (10BTSCR)
Table 6-25. 10BASE-T Status/Control Register (10BTSCR), address 0x1A
Bit
Bit Name
Default
Description
15
RESERVED
0, RW
RESERVED: Must be zero.
14:12
RESERVED
0, RW
RESERVED: Must be zero.
11:9
SQUELCH
100, RW
Squelch Configuration:
Used to set the Squelch ‘ON’ threshold for the receiver.
Default Squelch ON is 330-mV peak.
8
LOOPBACK_10_DIS
0, RW
In half-duplex mode, default 10BASE-T operation loops Transmit data to the Receive data
in addition to transmitting the data on the physical medium. This is for consistency with
earlier 10BASE2 and 10BASE5 implementations which used a shared medium. Setting
this bit disables the loopback function.
7
LP_DIS
0, RW
Normal Link Pulse Disable:
1 = Transmission of NLPs is disabled.
0 = Transmission of NLPs is enabled.
6
FORCE_LINK_10
0, RW
Force 10Mb Good Link:
1 = Forced Good 10 Mb Link.
0 = Normal Link Status.
5
RESERVED
0, RW
RESERVED: Must be zero.
4
POLARITY
RO/LH
10Mb Polarity Status:
This bit does not affect loopback due to setting BMCR[14].
This bit is a duplication of bit 12 in the PHYSTS register. Both bits will be cleared upon a
read of 10BTSCR register, but not upon a read of the PHYSTS register.
1 = Inverted Polarity detected.
0 = Correct Polarity detected.
3
RESERVED
0, RW
RESERVED: Must be zero.
2
RESERVED
1, RW
RESERVED: Must be set to one.
1
HEARTBEAT_DIS
0, RW
Heartbeat Disable: This bit only has influence in half-duplex 10Mb mode.
1 = Heartbeat function disabled.
0 = Heartbeat function enabled.
When the device is operating at 100 Mb or configured for full duplex operation, this
bit will be ignored - the heartbeat function is disabled.
0
JABBER_DIS
0, RW
Jabber Disable:
Applicable only in 10BASE-T.
1 = Jabber function disabled.
0 = Jabber function enabled.
6.6.1.2.9 CD Test and BIST Extensions Register (CDCTRL1)
Table 6-26. CD Test and BIST Extensions Register (CDCTRL1), address 0x1B
Bit
62
Bit Name
Default
Description
15:8
BIST_ERROR
_COUNT
0, RO
BIST ERROR Counter:
Counts number of errored data nibbles during Packet BIST. This value will reset when
Packet BIST is restarted. The counter sticks when it reaches its max count.
7:6
RESERVED
0, RW
RESERVED: Must be zero.
5
BIST_CONT
_MODE
0, RW
Packet BIST Continuous Mode:
Allows continuous pseudo random data transmission without any break in transmission. This
can be used for transmit VOD testing. This is used in conjunction with the BIST controls in
the PHYCR Register (0x19h). For 10 Mb operation, jabber function must be disabled, bit 0 of
the 10BTSCR (0x1Ah), JABBER_DIS = 1.
4
CDPATTEN_10
0, RW
CD Pattern Enable for 10Mb:
1 = Enabled.
0 = Disabled.
3
RESERVED
0, RW
RESERVED: Must be zero.
Detailed Description
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Table 6-26. CD Test and BIST Extensions Register (CDCTRL1), address 0x1B (continued)
Bit
2
1:0
Bit Name
Default
Description
10MEG_PATT
_GAP
0, RW
Defines gap between data or NLP test sequences:
1 = 15 µs.
0 = 10 µs.
CDPATTSEL[1:0]
00, RW
CD Pattern Select[1:0]:
If CDPATTEN_10 = 1:
00 = Data, EOP0 sequence
01 = Data, EOP1 sequence
10 = NLPs
11 = Constant Manchester 1 s (10-MHz sine wave) for harmonic distortion testing.
6.6.1.2.10 Energy Detect Control (EDCR)
Table 6-27. Energy Detect Control (EDCR), address 0x1D
Bit
Bit Name
Default
Description
15
ED_EN
0, RW
Energy Detect Enable:
Allow Energy Detect Mode.
When Energy Detect is enabled and Auto-Negotiation is disabled through the BMCR
register, Auto-MDIX should be disabled through the PHYCR register.
14
ED_AUTO_UP
1, RW
Energy Detect Automatic Power Up:
Automatically begin power-up sequence when Energy Detect Data Threshold value
(EDCR[3:0]) is reached. Alternatively, device could be powered up manually using the
ED_MAN bit (ECDR[12]).
13
ED_AUTO_DOWN
1, RW
Energy Detect Automatic Power Down:
Automatically begin power-down sequence when no energy is detected. Alternatively,
device could be powered down using the ED_MAN bit (EDCR[12]).
12
ED_MAN
0, RW/SC
Energy Detect Manual Power Up/Down:
Begin power-up/down sequence when this bit is asserted. When set, the Energy Detect
algorithm will initiate a change of Energy Detect state regardless of threshold (error or
data) and timer values.
11
ED_BURST_DIS
0, RW
Energy Detect Bust Disable:
Disable bursting of energy detect data pulses. By default, Energy Detect (ED) transmits
a burst of 4 ED data pulses each time the CD is powered up. When bursting is
disabled, only a single ED data pulse will be send each time the CD is powered up.
10
ED_PWR_STATE
0, RO
Energy Detect Power State:
Indicates current Energy Detect Power state. When set, Energy Detect is in the
powered up state. When cleared, Energy Detect is in the powered down state. This bit
is invalid when Energy Detect is not enabled.
9
ED_ERR_MET
0, RO/COR
Energy Detect Error Threshold Met:
No action is automatically taken upon receipt of error events. This bit is informational
only and would be cleared on a read.
8
ED_DATA_MET
0, RO/COR
Energy Detect Data Threshold Met:
The number of data events that occurred met or surpassed the Energy Detect Data
Threshold. This bit is cleared on a read.
7:4
ED_ERR_COUNT
0001, RW
Energy Detect Error Threshold:
Threshold to determine the number of energy detect error events that should cause the
device to take action. Intended to allow averaging of noise that may be on the line.
Counter will reset after approximately 2 seconds without any energy detect data
events.
3:0
ED_DATA_COUNT
0001, RW
Energy Detect Data Threshold:
Threshold to determine the number of energy detect events that should cause the
device to take actions. Intended to allow averaging of noise that may be on the line.
Counter will reset after approximately 2 seconds without any energy detect data
events.
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7 Application, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1
Application Information
The device is a physical layer Ethernet transceiver. Typical operating voltage is 3.3 V with power
consumption less than 270 mW. When using the device for Ethernet application, it is necessary to meet
certain requirements for normal operation of device. Following typical application and design requirements
can be used for selecting appropriate component values for DP83848.
7.2
Typical Application
Figure 7-1. Typical Application Schematic
7.2.1
Design Requirements
The design requirements for DP83848 are:
• VIN = 3.3 V
• VOUT = VCC – 0.5 V
• Clock Input = 25 MHz for MII and 50 MHz for RMII
7.2.1.1
TPI Network Circuit
Figure 7-2 shows the recommended circuit for a 10/100 Mb/s twisted pair interface. Below is a partial list
of recommended transformers. It is important that the user realize that variations with PCB and
component characteristics require that the application be tested to ensure that the circuit meets the
requirements of the intended application.
• Pulse H1102
• Pulse H2019
• Pulse J0011D21
• Pulse J0011D21B
64
Application, Implementation, and Layout
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Vdd
TPRDM
Vdd
COMMON MODE CHOKES
MAY BE REQUIRED
49.9 :
0.1 PF
49.9 :
1:1
TDRDP
RD0.1 PF*
RD+
TDTD+
TPTDM
0.1 PF*
Vdd
49.9 :
1:1
0.1 PF
49.9 :
T1
RJ45
NOTE: CENTER TAP IS PULLED TO VDD
*PLACE CAPACITORS CLOSE TO THE
TRANSFORMER CENTER TAPS
TPTDP
All values are typical and are +/- 1%
PLACE RESISTORS AND
CAPACITORS CLOSE TO
THE DEVICE
Figure 7-2. 10/100 Mb/s Twisted Pair Interface
7.2.1.2
Clock IN (X1) Recommendations
The DP83848x supports an external CMOS level oscillator source or a crystal resonator device.
7.2.1.2.1 Oscillator
If an external clock source is used, X1 should be tied to the clock source and X2 should be left floating.
The CMOS oscillator specifications for MII Mode are listed in Table 7-1. For RMII Mode, the CMOS
oscillator specifications are listed in Table 7-2. For RMII mode, it is not recommended that the system
clock out, Pin 21 of DP83848H, DP83848M, or DP83848T devices, be used as the reference clock to the
MAC without first verifying the interface timing. See AN-1405 for more details.
7.2.1.2.2 Crystal
A 25-MHz, parallel, 20-pF load crystal resonator should be used if a crystal source is desired. Figure 7-3
shows a typical connection for a crystal resonator circuit. The load capacitor values will vary with the
crystal vendors; check with the vendor for the recommended loads.
The oscillator circuit is designed to drive a parallel resonance AT cut crystal with a minimum drive level of
100 µW and a maximum of 500 µW. If a crystal is specified for a lower drive level, a current limiting
resistor should be placed in series between X2 and the crystal.
As a starting point for evaluating an oscillator circuit, if the requirements for the crystal are not known, CL1
and CL2 should be set at 33 pF, and R1 should be set at 0 Ω.
Specification for 25-MHz crystal are listed in Table 7-3.
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X2
X1
R1
CL1
CL2
Figure 7-3. Crystal Oscillator Circuit
Table 7-1. 25-MHz Oscillator Specification
PARAMETER
CONDITION
MIN
Frequency
TYP
MAX
UNIT
25
MHz
Frequency Tolerance
Operational Temperature
50
ppm
Frequency Stability
1 year aging
50
ppm
Rise / Fall Time
20%–80%
6
nsec
Jitter
Short term
800 (1)
psec
Jitter
Long term
800 (1)
psec
Symmetry
Duty Cycle
(1)
40%
60%
This limit is provided as a guideline for component selection and not guaranteed by production testing. Refer to SNLA076, PHYTER 100
Base-TX Reference Clock Jitter Tolerance, for details on jitter performance.
Table 7-2. 50-MHz Oscillator Specification
PARAMETER
CONDITION
MIN
Frequency
TYP
MAX
50
UNIT
MHz
Frequency Tolerance
Operational Temperature
50
ppm
Frequency Stability
1 year aging
50
ppm
Rise / Fall Time
20%–80%
6
nsec
Jitter
Short term
800 (1)
psec
Jitter
Long term
800 (1)
psec
Symmetry
Duty Cycle
(1)
40%
60%
This limit is provided as a guideline for component selection and not guaranteed by production testing. Refer to SNLA076, PHYTER 100
Base-TX Reference Clock Jitter Tolerance, for details on jitter performance.
Table 7-3. 25-MHz Crystal Specification
PARAMETER
CONDITION
MIN
Frequency
TYP
MAX
25
UNIT
MHz
Frequency Tolerance
Operational Temperature
50
ppm
Frequency Stability
1 year aging
50
ppm
40
pF
Load Capacitance
7.2.1.3
25
Power Feedback Circuit
To ensure correct operation for the DP83848x, parallel caps with values of 10 µF (Tantalum) and 0.1 µF
should be placed close to pin 19 (PFBOUT) of the device.
Pin 16 (PFBIN1) and pin 30 (PFBIN2) must be connected to pin 19 (PFBOUT), each pin requires a small
capacitor (0.1 µF). See Figure 7-4 for proper connections.
66
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Pin 19 (PFBOUT)
10 µF
+
0.1µF
Pin 16 (PFBIN1)
0.1 µF
-
Pin 30 (PFBIN2)
0.1 µF
Figure 7-4. Power Feedback Connection
7.2.1.4
Magnetics
The magnetics have a large impact on the PHY performance as well. While several components are listed
below, others may be compatible following the requirements listed in Table 6-4. It is recommended that
the magnetics include both an isolation transformer and an integrated common mode choke to reduce
EMI. When doing the layout, do not run signals under the magnetics. This could cause unwanted noise
crosstalk. Likewise void the planes under discrete magnetics, this will help prevent common mode noise
coupling. To save board space and reduce component count, an RJ-45 with integrated magnetics may be
used.
Table 7-4. Magnetics Requirements
PARAMETER
TYP
UNITS
Turn Ratio
1:1
—
±2%
Insertion Loss
-1
dB
1-100 MHz
-16
dB
1-30 MHz
-12
dB
30-60 MHz
10
dB
60-80 MHz
-30
dB
1-50MHz
-20
dB
50-150 MHz
-35
dB
30 MHz
-30
dB
60 MHz
1,500
dB
HPOT
Return Loss
Differential to Common Rejection Ratio
Crosstalk
Isolation
7.2.2
CONDITION
Detailed Design Procedure
7.2.2.1
MAC Interface (MII/RMII)
The Media Independent Interface (MII) connects the PHYTER component to the Media Access Controller
(MAC). The MAC may in fact be a discrete device, integrated into a microprocessor, CPU or FPGA. On
the MII signals, the IEEE specification states the bus should be 68-Ω impedance. For space critical
designs, the PHYTER family of products also support Reduced MII (RMII). For additional information on
this mode of operation, refer to the AN-1405 DP83848 Single 10/100 Mb/s Ethernet Transceiver Reduced
Media Independent Interface (RMII) Mode Application Report (SNLA076).
7.2.2.1.1 Termination Requirement
To reduce digital signal energy, 50-Ω series termination resistors are recommended for all MII output
signals (including RXCLK, TXCLK, and RX Data signals.)
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7.2.2.1.2 Recommended Maximum Trace Length
Although RMII and MII are synchronous bus architectures, there are a number of factors limiting signal
trace lengths. With a longer trace, the signal becomes more attenuated at the destination and thus more
susceptible to noise interference. Longer traces also act as antennas, and if run on the surface layer, can
increase EMI radiation. If a long trace is running near and adjacent to a noisy signal, the unwanted signals
could be coupled in as cross talk. It is recommended to keep the signal trace lengths as short as possible.
Ideally, keep the traces under 6 inches. Trace length matching, to within 2 inches on the MII or RMII bus
is also recommended. Significant differences in the trace lengths can cause data timing issues. As with
any high speed data signal, good design practices dictate that impedance should be maintained and stubs
should be avoided throughout the entire data path.
7.2.2.2
Calculating Impedance
The following equations can be used to calculate the differential impedance of the board. For microstrip
traces, a solid ground plane is needed under the signal traces. The ground plane helps keep the EMI
localized and the trace impedance continuous. Because stripline traces are typically sandwiched between
the ground/supply planes, they have the advantage of lower EMI radiation and less noise coupling. The
trade off of using strip line is lower propagation speed.
7.2.2.2.1 Microstrip Impedance – Single-Ended
87
H
p
Zo = F
G ln l5.98
0.8 W + T
¥Er + (1.41)
(3)
Figure 7-5. Microstrip Impedance – Single-Ended
68
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7.2.2.2.2 Stripline Impedance – Single-Ended
60
2 ×H+T
pG
Zo = F
G ln F1.98 × l
0.8 × W + T
¥Er
(4)
Figure 7-6. Stripline Impedance – Single-Ended
7.2.2.2.3 Microstrip Impedance – Differential
S
@F0.96 A
H pG
Zdiff = 2 × Zo × F1 F 0.48 le
(5)
Figure 7-7. Microstrip Impedance – Differential
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7.2.2.2.4 Stripline Impedance – Differential
Zdiff = 2 × Zo F1 F 0.347 le
S
@F2.9 A
H pG
(6)
Figure 7-8. Stripline Impedance – Differential
7.2.3
Application Curves
Figure 7-9. Sample 100 Mb/s Waveform (MLT-3)
70
Application, Implementation, and Layout
Figure 7-10. Sample 10 Mb/s Waveform
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7.3
7.3.1
SNLS250E – MAY 2008 – REVISED APRIL 2015
Layout
Layout Guidelines
Place the 49.9-Ω,1% resistors, and 0.1-μF decoupling capacitor near the PHYTER TD+/- and RD+/- pins
and via directly to the VDD plane.
Stubs should be avoided on all signal traces, especially the differential signal pairs. See Figure 7-11.
Within the pairs (for example, TD+ and TD-) the trace lengths should be run parallel to each other and
matched in length. Matched lengths minimize delay differences, avoiding an increase in common mode
noise and increased EMI. See Figure 7-11.
Does Not Maintain Parallelism
Avoid
Stubs
Ground or Power Plane
Figure 7-11. Differential Signal Pair - Stubs
Ideally, there should be no crossover or via on the signal paths. Vias present impedance discontinuities
and should be minimized. Route an entire trace pair on a single layer if possible. PCB trace lengths
should be kept as short as possible.
Signal traces should not be run such that they cross a plane split. See Figure 7-12. A signal crossing a
plane split may cause unpredictable return path currents and would likely impact signal quality as well,
potentially creating EMI problems.
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Figure 7-12. Differential Signal Pair-Plane Crossing
MDI signal traces should have 50 Ω to ground or 100-Ω differential controlled impedance. Many tools are
available online to calculate this.
72
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7.3.1.1
SNLS250E – MAY 2008 – REVISED APRIL 2015
PCB Layer Stacking
To meet signal integrity and performance requirements, at minimum a 4-layer PCB is recommended for
implementing PHYTER components in end user systems. The following layer stack-ups are recommended
for four, six, and eight-layer boards, although other options are possible.
Figure 7-13. PCB Stripline Layer Stacking
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Within a PCB it may be desirable to run traces using different methods, microstrip vs. stripline, depending
on the location of the signal on the PCB. For example, it may be desirable to change layer stacking where
an isolated chassis ground plane is used. Figure 7-14 illustrates alternative PCB stacking options.
Figure 7-14. Alternative PCB Stripline Layer Stacking
7.3.2
Layout Example
Plane Coupling
Component
Transformer
(if not
Integrated in
RJ45)
PHY
Component
Termination
Components
Note:Power/
Ground Planes
Voided under
Transformer
System Power/Ground
Planes
RJ45
Connector
Plane Coupling
Component
Chassis Ground
Plane
Figure 7-15. Layout Example
74
Application, Implementation, and Layout
Copyright © 2008–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
www.ti.com
7.4
SNLS250E – MAY 2008 – REVISED APRIL 2015
Power Supply Recommendations
The device VDD supply pins should be bypassed with low-impedance 0.1-μF surface mount capacitors. To
reduce EMI, the capacitors should be places as close as possible to the component VDD supply pins,
preferably between the supply pins and the vias connecting to the power plane. In some systems it may
be desirable to add 0-Ω resistors in series with supply pins, as the resistor pads provide flexibility if adding
EMI beads becomes necessary to meet system level certification testing requirements. (See Figure 7-14)
It is recommended the PCB have at least one solid ground plane and one solid VDD plane to provide a low
impedance power source to the component. This also provides a low impedance return path for nondifferential digital MII and clock signals. A 10.0-μF capacitor should also be placed near the PHY
component for local bulk bypassing between the VDD and ground planes.
PHY
Component
Vdd
Vdd
Pin
Optional 0 :
or Bead
PCB
Via
0.1 PF
Ground Pin
PCB Via
Figure 7-16. VDD Bypass Layout
Application, Implementation, and Layout
Submit Documentation Feedback
Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T
Copyright © 2008–2015, Texas Instruments Incorporated
75
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
www.ti.com
8 Device and Documentation Support
8.1
Documentation Support
8.1.1
Related Documentation
For related documentation see the following:
• AN-1405 DP83848 Single 10/100 Mb/s Ethernet Transceiver Reduced Media Independent Interface
(RMII) Mode Application Report, SNLA076
• AN-1540 Power Measurement of Ethernet Physical Layer Products, SNLA089
• AN-1548 PHYTER 100 Base-TX Reference Clock Jitter Tolerance, SNLA091
8.2
Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 8-1. Related Links
8.3
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DP83848H
Click here
Click here
Click here
Click here
Click here
DP83848J
Click here
Click here
Click here
Click here
Click here
DP83848K
Click here
Click here
Click here
Click here
Click here
DP83848M
Click here
Click here
Click here
Click here
Click here
DP83848T
Click here
Click here
Click here
Click here
Click here
Trademarks
All trademarks are the property of their respective owners.
8.4
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.5
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical Packaging and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
76
Mechanical Packaging and Orderable Information
Copyright © 2008–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
www.ti.com
SNLS250E – MAY 2008 – REVISED APRIL 2015
PACKAGE OUTLINE
RTA0040A
WQFN - 0.8 mm max height
SCALE 2.200
PLASTIC QUAD FLATPACK - NO LEAD
6.1
5.9
A
B
PIN 1 INDEX AREA
6.1
5.9
0.5
0.3
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8 MAX
C
SEATING PLANE
0.08
0.05
0.00
(0.2) TYP
(0.1) TYP
4.6 0.1
EXPOSED
THERMAL PAD
20
11
36X 0.5
10
21
4X
4.5
SEE TERMINAL
DETAIL
1
PIN 1 ID
(OPTIONAL)
30
40
31
40X
0.5
0.3
40X
0.3
0.2
0.1
0.05
C A B
4214989/B 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T
Copyright © 2008–2015, Texas Instruments Incorporated
77
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
SNLS250E – MAY 2008 – REVISED APRIL 2015
www.ti.com
EXAMPLE BOARD LAYOUT
RTA0040A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 4.6)
SYMM
31
40
40X (0.6)
40X (0.25)
1
30
36X (0.5)
SYMM
(5.8)
(0.74)
TYP
( 0.2) TYP
VIA
(1.31)
TYP
10
21
(R0.05) TYP
20
11
(0.74) TYP
(1.31 TYP)
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214989/B 02/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
78
Mechanical Packaging and Orderable Information
Copyright © 2008–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T
DP83848H, DP83848J, DP83848K, DP83848M, DP83848T
www.ti.com
SNLS250E – MAY 2008 – REVISED APRIL 2015
EXAMPLE STENCIL DESIGN
RTA0040A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.48) TYP
9X ( 1.28)
31
40
40X (0.6)
1
30
40X (0.25)
36X (0.5)
(1.48)
TYP
SYMM
(5.8)
METAL
TYP
10
21
(R0.05) TYP
20
11
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
70% PRINTED SOLDER COVERAGE BY AREA
SCALE:15X
4214989/B 02/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T
Copyright © 2008–2015, Texas Instruments Incorporated
79
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DP83848HSQ/NOPB
ACTIVE
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
83848HSQ
DP83848JSQ/NOPB
ACTIVE
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 70
83848JSQ
DP83848KSQ/NOPB
ACTIVE
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
83848KSQ
DP83848MSQ/NOPB
ACTIVE
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 70
83848MSQ
DP83848TSQ/NOPB
ACTIVE
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
83848TSQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DP83848HSQ/NOPB
WQFN
RTA
40
250
178.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
DP83848JSQ/NOPB
WQFN
RTA
40
250
178.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
DP83848KSQ/NOPB
WQFN
RTA
40
250
178.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
DP83848MSQ/NOPB
WQFN
RTA
40
250
178.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
DP83848TSQ/NOPB
WQFN
RTA
40
250
178.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DP83848HSQ/NOPB
WQFN
RTA
40
250
210.0
185.0
35.0
DP83848JSQ/NOPB
WQFN
RTA
40
250
210.0
185.0
35.0
DP83848KSQ/NOPB
WQFN
RTA
40
250
210.0
185.0
35.0
DP83848MSQ/NOPB
WQFN
RTA
40
250
210.0
185.0
35.0
DP83848TSQ/NOPB
WQFN
RTA
40
250
210.0
185.0
35.0
Pack Materials-Page 2
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