DRV3201QPAPQ1

Product Folder Order Now Support & Community Tools & Software Technical Documents DRV3201-Q1 SLVSE98 – JULY 2017 DRV3201-Q1 3 Phase Motor Driver-IC for Automotive Safety Applications 1 Features 2 Applications • • • • • • • • • • • • • • • • • • • • • 3 Description The bridge driver is dedicated to automotive 3 phase brushless DC motor control including safety relevant applications. It provides six dedicated drivers for normal level N-Channel MOSFET transistors. The driver capability is designed to handle gate charges of 250 nC, and the driver source/sink currents are programmable for easy output slope adjustment. The device also incorporates sophisticated diagnosis, protection and monitoring features through an SPI interface. A boost converter with integrated FET provides the overdrive voltage, allowing full control on the power-stages even for low battery voltage down to 4.75 V. Device Information(1) PART NUMBER DRV3201-Q1 PACKAGE HTQFP (64) BODY SIZE (NOM) 10.00 mm × 10.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Diagram Battery Voltage BOOST • Automotive Safety Critical Motor-Control Applications – Electrical Power Steering (EPS, EHPS) – Electrical Brake/Brake Assist – Transmission – Oil-Pump Industrial Safety Critical Motor-Control Applications SW • • Qualified for Automotive Applications AEC-Q100 Test Guidance With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C3 3 Phase Bridge Driver for Motor Control Drives 6 Separate N-Channel Power MOSFETs up to 250-nC Gate Charge Programmable 140-mA to 1-A Gate Current Drive (Source/Sink) for Easy Output Slope Adjustment –7-V to 40-V Compliance on All FET Driver Pins to Handle Inductive Undershooting and Overshooting Separate Control Input for Each Power MOSFET PWM Frequency up to 30 kHz Supports 100% Duty Cycle Operation Operating Voltage: 4.75 to 30 V Proper Low Supply Voltage Operation Due to Integrated Boost Converter for Gate-Driver Voltage Generation Logic Functional Down to 3 V Short Circuit Protection With VDS-Monitoring and Adjustable Detection Level Two Integrated High Accuracy Current Sense Amplifiers With Two Gain-Programmable Second Stage for Higher Resolution at Low Load Current Operation Overvoltage and Undervoltage Protection Shoot-Through Protection With Programmable Dead Time Three Real Time Phase Comparators Overtemperature Warning and Shut Down Sophisticated Failure Detection and Handling Through SPI Interface Sleep Mode Function Reset and Enable Function Package: 64-pin HTQFP PowerPAD™ VS 1 Boost Converter B_EN Controller 3 × Phase Comp GNDLS_B PHxC ERR SPI RSTN EN Control Logic and Safety / Diagnostic 3 Phase Gate Driver 3 × PowerStage GHSx SHSx IHSx, ILSx DRVOFF VCC5 ADREF BLDC Motor GLSx VCC3 Internal Supply RI Shift Buffer SLSx x = 1..3 2 × 2nd Current Sense Amp RO 2 × 1st Current Sense Amp IPy O3,4 2 × Current Shunt O1,2 INy y = 1..2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DRV3201-Q1 SLVSE98 – JULY 2017 www.ti.com 4 Device and Documentation Support 4.1 Documentation Support 4.1.1 Related Documentation For related documentation see the following: • DRV3201 Boost Converter • DRV3201 Current Sense Amplifier • DRV3201EVM • PowerPAD™ Thermally Enhanced Package 4.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.4 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 4.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV3201-Q1 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DRV3201QPAPQ1 ACTIVE HTQFP PAP 64 160 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 DRV3201 DRV3201QPAPRQ1 ACTIVE HTQFP PAP 64 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 DRV3201 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of